A semiconductor chip cleaning machine

Abstract

The present invention belongs to the field of semiconductor technology, and discloses a semiconductor chip cleaning machine, which includes two support plates. A rotating disk is rotatably installed inside the two support plates. A rotating motor is fixedly connected to the right side of the right rotating disk. A supply mechanism is fixedly installed at the center inside the rotating disk. One side of the supply mechanism away from the support plate is communicated with a distribution valve assembly. By changing the communication state between the first connecting shell and the supply mechanism through the distribution valve assembly, the support plates move outward or inward through the support plates, so as to adjust the distance between the support plates to match the size of the semiconductor chip to be cleaned. Then, the motor is controlled to work, which drives the double-headed lead screw to rotate, so that the left clamping block and the right clamping block move close to the semiconductor chip, thereby clamping the semiconductor chip, thus solving the problem that the existing fixed mold can only be used for fixing a certain specification of semiconductor chip and cannot fix other specifications of semiconductor chips.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and particularly relates to a semiconductor chip cleaning machine. Background Art

[0002] Semiconductor chips, also often referred to as silicon chips or chips, are crucial basic materials in the modern electronics industry and are used to manufacture various electronic devices, especially integrated circuits (ICs). A semiconductor chip is a thin slice made of semiconductor materials (the most common being silicon, and there are also other compound semiconductors such as gallium arsenide, silicon carbide, etc.), and has electrical conductivity characteristics between those of conductors and insulators. Its purity is extremely high, usually reaching over 99.9999%, to ensure stable and predictable electronic behavior at the microscale.

[0003] During the production and manufacturing process of wafers, it is necessary to conduct sampling inspections on the wafers, which is also a method of randomly selecting samples from the wafers produced in the semiconductor manufacturing process for quality inspection. During the inspection process, it is necessary to fix and clean wafers of different specifications to facilitate subsequent testing. The existing cleaning method fixes multiple semiconductor chips at equal intervals through a specific fixing mold, and then places the mold and the semiconductor chips into a cleaning tank to complete the simultaneous cleaning of multiple semiconductor chips. The existing fixing mold can only be used for fixing semiconductor chips of a certain specification and cannot be used for cleaning semiconductor chips of other specifications. Moreover, the fixing positions of the existing fixing mold and the semiconductor chips cannot be contacted by the cleaning liquid, so they will not be cleaned by the cleaning liquid, and there will still be a small amount of chemical solution or impurities remaining, which will affect subsequent work. During the production and processing of semiconductor products, wafers definitely need to be loaded and unloaded from the mold. The present invention can be considered dedicated to cleaning wafers of different specifications; secondly, there is no adjustable control of the fixing mold in the industry, but the present invention can theoretically perform adjustable control of the mold, and patent applications need to have a certain degree of creativity and novelty under the condition of theoretical feasibility, which can be different from actual production. Summary of the Invention

[0004] The purpose of the present invention is to provide a semiconductor chip cleaning machine to solve the problems raised in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: A semiconductor chip cleaning machine, comprising two support plates. A rotating disk is rotatably installed inside the two support plates. A rotating motor is fixedly connected to the right side of the right rotating disk. A supply mechanism is fixedly installed at the center inside the rotating disk. One side of the supply mechanism away from the support plate communicates with a distribution valve assembly. One side of the distribution valve assembly away from the supply mechanism is rotatably connected to a connecting housing one. A plurality of connecting columns are fixedly connected between the distribution valve assembly and the supply mechanism. One side of the connecting housing one away from the distribution valve assembly is rotatably connected to a connecting housing two. A plurality of adjusting rods are arranged on the curved surfaces of the connecting housing one and the connecting housing two. A plurality of clamping mechanisms are fixedly connected between two adjusting rods at the same horizontal position on the left and right sides. Connecting pipes are fixedly connected to the rear side and the lower side of the distribution valve assembly. The outer ends of the connecting pipes are fixedly connected to arc-shaped pipes. Push rods are movably sleeved at both ends inside the arc-shaped pipes. A driving mechanism is arranged inside the right rotating disk.

[0006] Preferably, the adjusting rod includes a rod body. A sliding block is slidably connected to the middle of the rod body. T-shaped rods are fixedly connected to both sides of the sliding block. Compression springs are fixedly connected between the outer T-shaped rods and the rod body. A semi-circular arc piece is fixedly connected to the inner end of the rod body. A rotating rod is rotatably connected to the middle of the sliding block. One end of the rotating rod away from the support plate is fixedly connected to a sealing movable piece.

[0007] Preferably, the clamping mechanism includes a double-headed lead screw. A left slider and a right slider are threadedly connected to the middle of the double-headed lead screw. A left clamping block is fixedly connected to the right side of the left slider. A right clamping block is fixedly connected to the left side of the right slider. A limiting rod is slidably connected to the curved surfaces of the right slider and the left slider. A plurality of double-headed lead screws are fixedly connected end to end. The rightmost double-headed lead screw and the leftmost double-headed lead screw are both fixedly connected to the rotating rod. A plurality of limiting rods are fixedly connected end to end. The rightmost limiting rod and the leftmost limiting rod are both fixedly connected to the sealing movable piece.

[0008] Preferably, the driving mechanism includes a plurality of control motors. Synchronous wheels are fixedly connected to the output shafts of the control motors. The control motors are slidably connected to the inner wall of the rotating disk. The synchronous wheels are fixedly connected to one end of the rotating rod close to the support plate.

[0009] Preferably, the interiors of the connecting housing one and the connecting housing two communicate with the inner sides of the rod bodies. Two rod bodies on the same line in a group are both fixedly connected to and communicate with the connecting housing one. Two rod bodies on the same line in the other group are both fixedly connected to and communicate with the connecting housing two. The rod bodies are slidably connected to the inner wall of the rotating disk. The push rods are fixedly connected to the curved surfaces of the rod bodies.

[0010] Preferably, the threads on the left and right sides of the double-ended screw have opposite rotation directions, the left slider and the right slider are both adapted to the double-ended screw, and the left clamping block is adapted to the right clamping block.

[0011] The beneficial effects of the present invention are as follows:

[0012] 1. The present invention changes the connection state between the connecting shell 1 and the supply mechanism through the distribution valve assembly, so that the support plate moves outward or inward, thereby adjusting the spacing of the support plates to adapt to the size of the semiconductor chip to be cleaned, and controlling the motor to work, thereby driving the double-headed screw to rotate, so that the left clamping block and the right clamping block move close to the semiconductor chip, thereby clamping the semiconductor chip, thereby solving the problem that the existing fixed mold can only be used to fix semiconductor chips of a certain specification, and cannot fix semiconductor chips of other specifications.

[0013] 2. The present invention makes a part of the clamping mechanism no longer clamp the semiconductor chip during the cleaning process, changes the angle between the clamping mechanism and the clamping mechanism that clamps the semiconductor chip, and then clamps the semiconductor chip, thereby changing the position of the clamping mechanism that clamps the semiconductor chip. Similarly, the clamping position of another clamping mechanism is changed, so that the surface of the semiconductor chip is in contact with the cleaning liquid to complete the cleaning, thereby solving the problem that the fixed position of the existing fixed mold and the semiconductor chip cannot be contacted by the cleaning liquid, and thus will not be cleaned by the cleaning liquid, and a small amount of chemical solution or impurities will still remain.

[0014] 3. After cleaning, the present invention is taken out and located directly above the cleaning tank. The present invention works by rotating the motor to drive the rotating disk to rotate, the rotating disk drives the clamping mechanism to rotate, and the clamping mechanism drives the semiconductor chip to rotate. The centrifugal force generated during rotation will dry the cleaning liquid remaining on the semiconductor chip, and finally the cleaning liquid will fall into the cleaning tank. While the semiconductor chip is dried, the cleaning liquid brought out is recovered, thereby avoiding the waste of the cleaning liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure appearance of the present invention;

[0016] Figure 2 A half-section schematic diagram of a support plate of the present invention;

[0017] Figure 3 A half-section schematic diagram of a rotating disk of the present invention;

[0018] Figure 4 A half-section schematic diagram of the adjusting rod of the present invention;

[0019] Figure 5 It is a schematic diagram of the structure of the adjusting rod of the present invention;

[0020] Figure 6Structural schematic diagram of the first connecting shell of the present invention;

[0021] Figure 7 Structural schematic diagram of the clamping mechanism of the present invention.

[0022] In the figure: 1, support plate; 2, rotating disc; 3, rotating motor; 4, supply mechanism; 5, distribution valve assembly; 6, first connecting shell; 7, connecting column; 8, second connecting shell; 9, adjusting rod; 91, rod body; 92, sliding block; 93, T-shaped rod; 94, compression spring; 95, semi-circular piece; 96, sealing movable piece; 97, rotating rod; 10, clamping mechanism; 101, double-headed lead screw; 102, left slider; 103, left clamping block; 104, right slider; 105, right clamping block; 106, limiting rod; 11, connecting pipe; 12, arc-shaped pipe; 13, push rod; 14, driving mechanism; 141, control motor; 142, synchronous pulley. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] As Figures 1 to 7As shown, an embodiment of the present invention provides a semiconductor chip cleaning machine, comprising two support plates 1, a rotating disk 2 is rotatably installed on the inner side of the two support plates 1, a rotating motor 3 is fixedly connected to the right side of the right rotating disk 2, a supply mechanism 4 is fixedly installed at the inner center of the rotating disk 2, a distribution valve assembly 5 is connected to the side of the supply mechanism 4 away from the support plate 1, a connecting shell 1 6 is rotatably connected to the side of the distribution valve assembly 5 away from the supply mechanism 4, a plurality of connecting columns 7 are fixedly connected between the distribution valve assembly 5 and the supply mechanism 4, a connecting shell 2 8 is rotatably connected to the side of the connecting shell 1 6 away from the distribution valve assembly 5, a plurality of adjusting rods 9 are arranged on the curved surfaces of the connecting shell 1 6 and the connecting shell 2 8, and a plurality of adjusting rods 9 are fixedly connected between the two adjusting rods 9 at the same horizontal position on the left and right sides. A clamping mechanism 10 is provided, and the rear side and the lower side of the distribution valve assembly 5 are fixedly connected with a connecting pipe 11, the outer end of the connecting pipe 11 is fixedly connected with an arc tube 12, and the inner ends of the arc tube 12 are movably sleeved with push rods 13. A driving mechanism 14 is arranged inside the right rotating disk 2, and its function is that after cleaning, the present invention is taken out and is located directly above the cleaning tank. The present invention works by rotating the motor 3 to drive the rotating disk 2 to rotate, and the rotating disk 2 drives the clamping mechanism 10 to rotate, and the clamping mechanism 10 drives the semiconductor chip to rotate. The centrifugal force generated during rotation will dry the cleaning liquid remaining on the semiconductor chip, and finally the cleaning liquid will fall into the cleaning tank. While the semiconductor chip is dried, the cleaning liquid brought out is recovered, thereby avoiding the waste of the cleaning liquid.

[0025] The adjusting rod 9 includes a rod body 91, a sliding block 92 is slidably connected to the middle of the rod body 91, T-shaped rods 93 are fixedly connected to both sides of the sliding block 92, a compression spring 94 is fixedly connected between the outer T-shaped rod 93 and the rod body 91, a semi-arc piece 95 is fixedly connected to the inner end of the rod body 91, a rotating rod 97 is rotatably connected to the middle of the sliding block 92, and a sealing movable piece 96 is fixedly connected to the end of the rotating rod 97 away from the support plate 1, whose function is that when the distribution valve assembly 5 connects the connecting shell 6 with the oil supply pipe of the supply mechanism 4, the hydraulic oil will enter the connecting shell 6 and the interior of the connecting column 7, and finally enter the inner end of the rod body 91, from The T-rod 93 and the sliding block 92 are pushed to move outward, and the outer T-rod 93 squeezes the compression spring 94, thereby increasing the distance between the clamping mechanisms 10; when the distribution valve assembly 5 connects the connecting shell 6 with the return oil pipe of the supply mechanism 4, the compression spring 94 will extend, thereby pushing the T-rod 93 and the sliding block 92 to move inward, thereby decreasing the distance between the clamping mechanisms 10, and the inner T-rod 93 squeezes the hydraulic oil out, and finally causes the internal hydraulic oil of the connecting shell 6 and the connecting column 7 to flow back into the supply mechanism 4, and the control motor 141 will slide accordingly according to the changes of the clamping mechanism 10.

[0026] Among them, the clamping mechanism 10 includes a double-headed lead screw 101. The middle part of the double-headed lead screw 101 is threadedly connected with a left slider 102 and a right slider 104. The right side of the left slider 102 is fixedly connected with a left clamping block 103, and the left side of the right slider 104 is fixedly connected with a right clamping block 105. A limiting rod 106 is slidably connected to the curved surfaces of the right slider 104 and the left slider 102. A plurality of double-headed lead screws 101 are fixedly connected end to end. The rightmost double-headed lead screw 101 and the leftmost double-headed lead screw 101 are both fixedly connected to a rotating rod 97. A plurality of limiting rods 106 are fixedly connected end to end. The rightmost limiting rod 106 and the leftmost limiting rod 106 are both fixedly connected to a sealing movable piece 96. Its function is that during the cleaning process, part of the clamping mechanism 10 stops clamping the semiconductor chip, and the angle between it and the clamping mechanism 10 clamping the semiconductor chip changes, and then it clamps the semiconductor chip, so as to change the position where the clamping mechanism 10 clamps the semiconductor chip. Similarly, the clamping position of another part of the clamping mechanism 10 is changed, so that the surface of the semiconductor chip is in contact with the cleaning liquid, and the cleaning is completed, thus solving the problem that the fixed position of the existing fixed mold and the semiconductor chip cannot be contacted by the cleaning liquid, so it cannot be cleaned by the cleaning liquid, and there will still be a small amount of chemical solution or impurities.

[0027] Among them, the driving mechanism 14 includes a plurality of control motors 141. The output shaft of the control motor 141 is fixedly connected with a synchronous pulley 142. The control motor 141 is slidably connected to the inner wall of the rotating disk 2. The synchronous pulley 142 is fixedly connected to one end of the rotating rod 97 close to the support plate 1. The inside of the connecting shell one 6 and the connecting shell two 8 is communicated with the inside of the rod body 91. Two rod bodies 91 on a group of collinear lines are both fixedly connected and communicated with the connecting shell one 6. The other two rod bodies 91 on a group of collinear lines are both fixedly connected and communicated with the connecting shell two 8. The rod body 91 is slidably connected to the inner wall of the rotating disk 2. There is a push rod 13 fixedly connected to the curved surface of the rod body 91. The thread directions on the left and right sides of the double-headed lead screw 101 are opposite. The left slider 102 and the right slider 104 are both adapted to the double-headed lead screw 101. The left clamping block 103 and the right clamping block 105 are adapted. Its function is that by changing the communication state between the connecting shell one 6 and the supply mechanism 4 through the distribution valve assembly 5, the clamping mechanism 10 moves outward or inward, so as to adjust the distance between the clamping mechanisms 10 to be adapted to the size of the semiconductor chip to be cleaned. The control motor 141 works, driving the double-headed lead screw 101 to rotate, so that the left clamping block 103 and the right clamping block 105 move closer to the semiconductor chip, thereby clamping the semiconductor chip, thus solving the problem that the existing fixed mold can only be used for fixing a certain specification of semiconductor chip and cannot fix other specifications of semiconductor chips.

[0028] Working principle:

[0029] Before the present invention is used, the interiors of the first connecting shell 6, the second connecting shell 8, the inner end of the rod body 91, and the interior of the arc-shaped pipe 12 are all filled with hydraulic oil. The distribution valve assembly 5 makes the two connecting pipes 11 and the supply mechanism 4 in a non-connected state, so that the supply mechanism 4 is not connected to the interior of the first connecting shell 6;

[0030] When the present invention is used, the communication state between the first connecting shell 6 and the supply mechanism 4 is changed through the distribution valve assembly 5, so that the clamping mechanism 10 moves outward or inward, so as to adjust the distance between the clamping mechanisms 10 to match the size of the semiconductor chip to be cleaned. After the adjustment is completed, the distribution valve assembly 5 makes the supply mechanism 4 not communicate with the interior of the first connecting shell 6. Subsequently, the semiconductor chip is placed between the left slider 102 and the right slider 104, and the motor 141 is controlled to work. The synchronous pulley 142 on the output shaft of the motor 141 will rotate. The rotation of the synchronous pulley 142 will cause the rotating rod 97 to rotate, and the rotation of the rotating rod 97 will drive the double-headed lead screw 101 to rotate. Due to the limitation of the limiting rod 106, the left clamping block 103 and the right clamping block 105 move close to the semiconductor chip, so as to clamp the semiconductor chip;

[0031] The present invention is placed in the cleaning pool through the existing device. The support plate 1 contacts the bottom of the cleaning pool, so as to clean the clamped semiconductor chip. During the cleaning process, the control motor 141 on the two adjusting rods 9 fixedly connected to the second connecting shell 8 reverses, so as to drive the corresponding left slider 102 and right slider 104 away from the semiconductor chip. Subsequently, the distribution valve assembly 5 makes one of the connecting pipes 11 communicate with the oil supply pipe of the supply mechanism 4, and the other connecting pipe 11 communicate with the oil return pipe of the supply mechanism 4. The hydraulic oil in the supply mechanism 4 will enter the interior of the connecting pipe 11 connected to it, so as to push the push rod 13 to extend, so that the first connecting shell 6, the second connecting shell 8, the adjusting rod 9, and the clamping mechanism 10 rotate, so that the corresponding left clamping block 103 and right clamping block 105 rotate relative to the semiconductor chip. The control motor 141 on the two adjusting rods 9 fixedly connected to the second connecting shell 8 rotates forward, so that the corresponding left clamping block 103 and right clamping block 105 clamp the semiconductor chip again, but the clamping position is changed from the previous clamping position. Subsequently, the control motor 141 on the two adjusting rods 9 fixedly connected to the first connecting shell 6 reverses. Subsequently, the distribution valve assembly 5 makes one of the connecting pipes 11 communicate with the oil return pipe of the supply mechanism 4, and the other connecting pipe 11 communicate with the oil inlet pipe of the supply mechanism 4, so as to adjust the positions of the left clamping block 103 and the right clamping block 105 on the two adjusting rods 9 fixedly connected to the first connecting shell 6, so that the clamping parts of the semiconductor chip are also cleaned;

[0032] After the cleaning is completed, the present invention is taken out and located directly above the cleaning pool, and the rotating motor 3 works to drive the rotating disc 2 to rotate, so as to spin-dry the cleaning liquid remaining on the semiconductor chip.

[0033] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0034] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip cleaning machine, comprising two support plates (1), wherein a rotating disk (2) is rotatably mounted on the inner side of the two support plates (1), a rotating motor (3) is fixedly connected to the right side of the right rotating disk (2), a supply mechanism (4) is fixedly mounted at the inner center of the rotating disk (2), and a distribution valve assembly (5) is connected to the side of the supply mechanism (4) away from the support plate (1), characterized in that: The distribution valve assembly (5) is rotatably connected to a connection shell 1 (6) at a side away from the supply mechanism (4), a plurality of connection columns (7) are fixedly connected between the distribution valve assembly (5) and the supply mechanism (4), the connection shell 1 (6) is rotatably connected to a connection shell 2 (8) at a side away from the distribution valve assembly (5), a plurality of adjustment rods (9) are provided on the curved surfaces of the connection shell 1 (6) and the connection shell 2 (8), a plurality of clamping mechanisms (10) are fixedly connected between two of the adjustment rods (9) at the same horizontal position on the left and right sides, the rear side and the lower side of the distribution valve assembly (5) are fixedly connected to a connection pipe (11), the outer end of the connection pipe (11) is fixedly connected to an arc-shaped pipe (12), the inner ends of the arc-shaped pipe (12) are movably sleeved with push rods (13), and a driving mechanism (14) is provided inside the rotating disk (2) on the right side; The adjusting rod (9) comprises a rod body (91), a sliding block (92) is slidably connected to the middle of the rod body (91), T-shaped rods (93) are fixedly connected to both sides of the sliding block (92), a compression spring (94) is fixedly connected between the outer side of the T-shaped rod (93) and the rod body (91), a semi-arc plate (95) is fixedly connected to the inner end of the rod body (91), a rotating rod (97) is rotatably connected to the middle of the sliding block (92), and a sealing movable plate (96) is fixedly connected to one end of the rotating rod (97) away from the support plate (1); The interiors of the connecting shell 1 (6) and the connecting shell 2 (8) are connected to the inner side of the rod body (91); a group of two rod bodies (91) on a same line are fixedly connected to and connected to the connecting shell 1 (6); another group of two rod bodies (91) on a same line are fixedly connected to and connected to the connecting shell 2 (8); the rod bodies (91) are slidably connected to the inner wall of the rotating disk (2); and the pushing rod (13) is fixedly connected to the curved surface of the rod body (91).

2. A semiconductor chip cleaning machine according to claim 1, characterized in that: The clamping mechanism (10) comprises a double-ended screw (101), a left slider (102) and a right slider (104) being threadedly connected at the middle of the double-ended screw (101), a left clamping block (103) being fixedly connected to the right side of the left slider (102), a right clamping block (105) being fixedly connected to the left side of the right slider (104), a limit rod (106) being connected to the curved surface slidingly between the right slider (104) and the left slider (102), a plurality of the double-ended screws (101) being fixedly connected head to tail, the rightmost double-ended screw (101) and the leftmost double-ended screw (101) being fixedly connected to the rotating rod (97), a plurality of the limit rods (106) being fixedly connected head to tail, and the rightmost limit rod (106) and the leftmost limit rod (106) being fixedly connected to the sealing movable sheet (96).

3. A semiconductor chip cleaning machine according to claim 2, characterized in that: The driving mechanism (14) comprises a plurality of control motors (141), the output shafts of the control motors (141) being fixedly connected to a synchronous wheel (142), the control motors (141) being slidably connected to the inner wall of the rotating disk (2), and the synchronous wheel (142) being fixedly connected to one end of the rotating rod (97) close to the support plate (1).

4. A semiconductor chip cleaning machine according to claim 3, characterized in that: The threads on the left and right sides of the double-ended screw (101) have opposite rotation directions, the left slider (102) and the right slider (104) are both adapted to the double-ended screw (101), and the left clamping block (103) and the right clamping block (105) are adapted to each other.

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