Wafer transfer device and wafer transfer system

Abstract

The invention provides a wafer transfer device and a wafer transfer system. The wafer transfer device comprises a base; the supporting frame is connected with the base, the supporting frame is constructed to be provided with a plurality of rod parts extending in the horizontal direction, the multiple rod parts comprise the first rod part which is constructed to support a wafer to be transferred, the first rod part is provided with a plurality of air suction holes, and the multiple air suction holes are constructed to adsorb the wafer in the wafer transferring process; the second rod part is arranged above the first rod part and at least partially surrounds the wafer so as to limit the wafer on the first rod part, a plurality of air outlet holes are formed in the second rod part, and the plurality of air outlet holes are configured to isolate the wafer from the external environment by utilizing exhausted gas in the wafer transfer process so as to limit the wafer on the first rod part. Contact pollution in the wafer transfer process is avoided, and indirect pollution of the external environment to the wafer is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer transfer of superconducting quantum chips, and more specifically, to a wafer transfer device and a wafer transfer system. Background Art

[0002] Wafers are circular sheets made of single-crystal silicon (usually other semiconductor materials), which are the basic materials in the chip manufacturing process. Wafers undergo a series of complex process flows, such as photolithography, etching, ion implantation, chemical vapor deposition, physical vapor deposition, metallization, packaging, etc., and finally form multiple chips. Wafers need to be transferred from one process flow to another or between multiple machines. In the current practice of wafer transfer, mechanical clamping and vacuum adsorption technology are mainly relied on to complete this work. However, as the main source of pollution in the clean room, operators cannot avoid dust and particles in the air from polluting the wafer when using existing fixtures to transfer wafers. Therefore, for production lines that have not yet achieved automated production, it is of practical significance to design a wafer transfer device that can implement wafer transfer in the clean room and reduce the contamination of the wafer surface. Summary of the invention

[0003] To solve at least one of the technical problems in the prior art, an embodiment of the present invention provides a wafer transfer device and a wafer transfer system, which avoids contact contamination during wafer transfer and prevents indirect contamination of the wafer by the external environment.

[0004] The present invention provides a wafer transfer device, which includes: a base; a support frame connected to the base, the support frame is constructed to have a plurality of rod portions extending in a horizontal direction, the plurality of rod portions include: a first rod portion, constructed to support a wafer to be transferred, wherein the first rod portion is provided with a plurality of air suction holes, and the plurality of air suction holes are constructed to adsorb the wafer during the process of transferring the wafer; a second rod portion, arranged above the first rod portion and at least partially surrounding the wafer to limit the wafer on the first rod portion, the second rod portion is provided with a plurality of air outlet holes, and the plurality of air outlet holes are constructed to utilize the exhausted gas to isolate the wafer from the external environment during the process of transferring the wafer.

[0005] Optionally, the base includes: a handle, the interior of the handle being constructed to have a first air inlet channel and a first exhaust channel distributed in parallel, one end of the first air inlet channel being connected to an external inert gas supply device, and one end of the first exhaust channel being connected to an external exhaust device; a transition portion connected to the handle, the transition portion being constructed to have a second air inlet channel connected to the first air inlet channel and a second exhaust channel connected to the first exhaust channel, and the second exhaust channel extending in a direction away from the second air inlet channel.

[0006] Optionally, the interior of the first rod portion is configured to have an air suction channel, and the air suction channel is connected to the second exhaust channel to extract the gas on the back side of the wafer and form a vacuum.

[0007] Optionally, an end of the first rod portion away from the base is configured to have a downwardly inclined cross-section, so as to facilitate moving the wafer to the top surface of the first rod portion.

[0008] Optionally, the plurality of suction holes are distributed at intervals on the top surface of the first rod portion to absorb the wafer during the wafer transfer process.

[0009] Optionally, the second rod portion is configured to be arc-shaped, and the interior of the second rod portion is configured to have a purge channel extending in a circumferential direction, and the purge channel is connected to the second air inlet channel so that the inert gas is discharged inwardly in a radial direction from the multiple air outlet holes, thereby isolating the wafer from the external environment.

[0010] Optionally, the wafer transfer device further includes: a laser component, which is disposed on the above-mentioned transition portion and extends in a horizontal direction, and the above-mentioned laser component is suitable for emitting lasers of multiple colors to irradiate the above-mentioned wafer.

[0011] Optionally, the upper surface of the transition portion is configured as a downwardly inclined slope to facilitate the laser emitted by the laser assembly to irradiate the surface of the wafer.

[0012] Optionally, the color of the laser emitted by the laser assembly is any one of yellow light, white light and blue light.

[0013] According to the inventive concept of another aspect of the present invention, a wafer transfer system is also provided, and the wafer transfer system includes: the above-mentioned wafer transfer device; an inert gas supply device, connected to the first air inlet channel of the above-mentioned wafer transfer device, and the above-mentioned inert gas supply device is suitable for providing inert gas to the above-mentioned wafer transfer device, so as to isolate the above-mentioned wafer from the external environment during the process of transferring the wafer; an exhaust device, connected to the first exhaust channel of the above-mentioned wafer transfer device, and the above-mentioned exhaust device is suitable for extracting the gas on the back side of the above-mentioned wafer through the above-mentioned wafer transfer device and forming a vacuum during the process of transferring the above-mentioned wafer, so as to adsorb the above-mentioned wafer on the above-mentioned wafer transfer device and transfer it.

[0014] According to an embodiment of the present invention, a wafer transfer device and a wafer transfer system are connected to a base through a support frame, and the support frame is constructed to have a plurality of rod portions extending in a horizontal direction, and the plurality of rod portions include a first rod portion and a second rod portion. The first rod portion is constructed to support a wafer to be transferred, and a plurality of suction holes are provided on the first rod portion. The plurality of suction holes are constructed to adsorb the wafer during the transfer of the wafer, thereby avoiding contact contamination during the transfer of the wafer. The second rod portion is arranged above the first rod portion and at least partially surrounds the wafer to limit the wafer on the first rod portion. The second rod portion is provided with a plurality of air outlet holes, and the plurality of air outlet holes are constructed to utilize the exhaust gas to isolate the wafer from the external environment during the transfer of the wafer, thereby preventing indirect contamination of the wafer by the external environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a three-dimensional diagram of a wafer transfer device according to an embodiment of the present invention;

[0016] Figure 2 is a first-view perspective view of a wafer transfer device according to an embodiment of the present invention;

[0017] Figure 3 is a perspective view from a second perspective of a wafer transfer device according to an embodiment of the present invention;

[0018] Figure 4 4 is a perspective view from a third perspective of a wafer transfer device according to an embodiment of the present invention.

[0019] In the drawings, the meanings of the reference numerals are as follows:

[0020] 1. Grip;

[0021] 11. A first air intake passage;

[0022] 12. A first exhaust passage;

[0023] 2. Transition section;

[0024] 21. Second air intake passage;

[0025] 22. Second exhaust passage;

[0026] 3. The second rod;

[0027] 31. Vent hole;

[0028] 32. Purge channel;

[0029] 4. The first rod;

[0030] 41. Air intake hole;

[0031] 42. Inhalation channel;

[0032] 5. Laser components;

[0033] A. Cross section. DETAILED DESCRIPTION

[0034] Below, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present invention. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of embodiments of the present invention. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of concepts of the present invention.

[0035] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0036] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0037] In the case of using expressions such as "at least one of A, B, and C, etc.", it should generally be interpreted in accordance with the meaning of the expression generally understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.). In the case of using expressions such as "at least one of A, B, or C, etc.", it should generally be interpreted in accordance with the meaning of the expression generally understood by those skilled in the art (for example, "a system having at least one of A, B, or C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0038] In order to solve the problem of wafer contamination during wafer transfer, according to the inventive concept of one aspect of the present invention, the support frame is connected to the base through a support frame, and is constructed to have multiple rod portions extending in a horizontal direction. The multiple rod portions include a first rod portion and a second rod portion. The first rod portion is constructed to support the wafer to be transferred, and the first rod portion is provided with multiple suction holes. The multiple suction holes are constructed to adsorb the wafer during the transfer of the wafer, thereby avoiding contact contamination during the transfer of the wafer. The second rod portion is arranged above the first rod portion and at least partially surrounds the wafer to limit the wafer on the first rod portion. The second rod portion is provided with multiple air outlet holes. The multiple air outlet holes are constructed to utilize the exhaust gas to isolate the wafer from the external environment during the transfer of the wafer, thereby preventing indirect contamination of the wafer by the external environment.

[0039] Figure 1 is a three-dimensional diagram of a wafer transfer device according to an embodiment of the present invention, Figure 2 is a first-view perspective view of a wafer transfer device according to an embodiment of the present invention.

[0040] According to an embodiment of the present invention, a wafer transfer device is provided, such as Figure 1 and Figure 2 As shown, the wafer transfer device includes a base and a support frame. The support frame is connected to the base, and the support frame is configured to have multiple rods extending in the horizontal direction. The multiple rods include a first rod 4 and a second rod 3. The first rod 4 is configured to support the wafer to be transferred, wherein the first rod 4 is provided with multiple suction holes 41, and the multiple suction holes 41 are configured to adsorb the wafer during the transfer of the wafer. The second rod 3 is arranged above the first rod 4 and at least partially surrounds the wafer to limit the wafer on the first rod 4, and the second rod 3 is provided with multiple air outlet holes 31, and the multiple air outlet holes 31 are configured to use the exhausted gas to isolate the wafer from the external environment during the transfer of the wafer.

[0041] According to an embodiment of the present invention, the number of the first rod parts 4 is at least two to support the wafer to be transferred.

[0042] According to an embodiment of the present invention, an external robot moves the wafer transfer device by grabbing or putting down a base of the wafer transfer device, or an operator directly uses the wafer transfer device to transfer the wafer.

[0043] According to an embodiment of the present invention, the support frame is connected to the base through a support frame, and is constructed to have multiple rod portions extending in a horizontal direction, and the multiple rod portions include a first rod portion 4 and a second rod portion 3. The first rod portion 4 is constructed to support the wafer to be transferred, and a plurality of suction holes 41 are opened on the first rod portion 4. The plurality of suction holes 41 are constructed to adsorb the wafer during the transfer of the wafer, thereby avoiding contact contamination during the transfer of the wafer. The second rod portion 3 is arranged above the first rod portion 4 and at least partially surrounds the wafer to limit the wafer on the first rod portion 4. The second rod portion 3 is opened with a plurality of air outlet holes 31. The plurality of air outlet holes 31 are constructed to use the exhaust gas to isolate the wafer from the external environment during the transfer of the wafer, thereby preventing indirect contamination of the wafer by the external environment during the wafer transfer in the clean room.

[0044] Figure 3 2 is a perspective view of a wafer transfer device according to an embodiment of the present invention from a second viewing angle.

[0045] According to an embodiment of the present invention, Figure 2 and Figure 3 As shown, the base includes a handle 1 and a transition portion 2. The interior of the handle 1 is configured to have a first air inlet channel 11 and a first air exhaust channel 12 distributed in parallel, one end of the first air inlet channel 11 is connected to an external inert gas supply device, and one end of the first air exhaust channel 12 is connected to an external exhaust device. The transition portion 2 is connected to the handle 1, and the transition portion 2 is configured to have a second air inlet channel 21 connected to the first air inlet channel 11 and a second air exhaust channel 22 connected to the first air exhaust channel 12, and the second air exhaust channel 22 extends in a direction away from the second air inlet channel 21.

[0046] According to an embodiment of the present invention, the inert gas supplied by the inert gas supply device may be a mixed gas such as nitrogen and argon.

[0047] According to an embodiment of the present invention, the first rod portion 4 is configured to have an air suction channel 42 inside, and the air suction channel 42 is communicated with the second exhaust channel 22 to extract the gas on the back side of the wafer and form a vacuum.

[0048] According to an embodiment of the present invention, the wafer transfer device fixes the wafer to be transferred on the first rod portion 4 through negative pressure. The surface of the first rod portion 4 does not directly contact the wafer, thereby avoiding damage and contact contamination during the wafer transfer process, thereby reducing the generation of static electricity, preventing frictional electrification, and ensuring high efficiency and safety of wafer transfer.

[0049] According to an embodiment of the present invention, the end of the first rod portion 4 away from the base is configured to have a downwardly inclined cross section A, so as to facilitate moving the wafer to the top surface of the first rod portion 4 .

[0050] According to an embodiment of the present invention, the end of the first rod portion 4 away from the base is configured to have a downwardly inclined cross section A, so as to facilitate scooping up and moving the wafer to the top surface of the first rod portion 4 .

[0051] According to an embodiment of the present invention, a plurality of suction holes 41 are distributed at intervals on the top surface of the first rod portion 4 to absorb the wafers during the wafer transfer process.

[0052] According to the embodiment of the present invention, the plurality of suction holes 41 can extract the gas on the back side of the wafer and form a vacuum, thereby preventing the wafer from falling during the wafer transfer process.

[0053] Figure 4 4 is a perspective view from a third perspective of a wafer transfer device according to an embodiment of the present invention.

[0054] According to an embodiment of the present invention, Figure 4 As shown, the second rod portion 3 is configured to be arc-shaped, and the interior of the second rod portion 3 is configured to have a purge channel 32 extending in a circumferential direction. The purge channel 32 is connected to the second air inlet channel 21 so that the inert gas is discharged inwardly in a radial direction from a plurality of air outlet holes 31, thereby isolating the wafer from the external environment.

[0055] According to an embodiment of the present invention, a plurality of gas outlet holes 31 are arranged at intervals on the inner side of the second rod portion 3 in the circumferential direction, so that the inert gas is continuously discharged inwardly from the plurality of gas outlet holes 31 along the radial direction to purge the wafer. On the basis of removing contamination on the surface of the wafer, a gas protection layer can be formed around and above the wafer, thereby isolating the wafer from the external environment, maintaining the cleanliness of the wafer, and preventing the wafer from secondary contamination.

[0056] According to an embodiment of the present invention, since inert gas is not conductive, purging the wafer with inert gas can reduce the accumulation of static electricity on the wafer surface. The inert gas can take away the charge generated by friction. In the later stage of the wafer manufacturing process, the wafer surface will be cut into multiple small units, each small unit as a separate chip. Purging the inert gas can protect the special structure on the chip during the transfer process, especially the Josephson junction device and superconducting quantum bit.

[0057] According to the embodiment of the present invention, different inert gas mixture components can be used to purge different wafers to be transferred, and the mixed gas volume and the outlet gas flow rate can be adjusted at the same time, so as to improve the economic efficiency during use.

[0058] According to an embodiment of the present invention, the wafer transfer device further comprises a laser assembly 5. The laser assembly 5 is disposed on the transition portion 2 and extends in a horizontal direction. The laser assembly is suitable for emitting lasers of multiple colors to irradiate the wafer.

[0059] According to an embodiment of the present invention, a laser assembly 5 is arranged on the slope of the transition portion 2, and the laser assembly 5 emits lasers of multiple colors to irradiate the wafer, so that when particles fall on the surface of the wafer and cause contamination, the operator can immediately discover and quickly take corresponding remedial measures. Particles or dust have a three-dimensional structure different from that of the wafer, and there is a fundamental difference in the material of the wafer. With the cooperation of the laser assembly 5, the inert gas is purged to blow up the particles that cause contamination to the wafer. The laser emitted by the laser assembly 5 can clearly see the direction of the particles being purged, preventing the particles from falling back again to cause contamination to the wafer, improving the efficiency of detection, reducing potential losses, enhancing the controllability and safety of the production process, and bringing higher efficiency and quality assurance to semiconductor manufacturing.

[0060] According to an embodiment of the present invention, the color of the laser light emitted by the laser assembly 5 is any one of yellow light, white light and blue light.

[0061] According to an embodiment of the present invention, when the wafer surface is coated with photoresist, the laser assembly 5 emits yellow light, which can protect the photoresist on the wafer surface. When the wafer surface is not coated with photoresist, the laser assembly 5 emits white light. When a transparent film is grown on the wafer surface, the laser assembly 5 emits blue light, which can improve the contrast and contrast, so as to distinguish particles and dust falling on the wafer surface during the wafer transfer process or detect defects (protrusions, depressions) on the wafer surface.

[0062] According to an embodiment of the present invention, the upper surface of the transition portion 2 is configured as a downwardly inclined slope, so that the laser light emitted by the laser assembly 5 can be irradiated onto the surface of the wafer.

[0063] According to an embodiment of the present invention, the upper surface of the transition portion 2 is constructed as a downwardly inclined slope, so that the operator can more smoothly take and place the wafer to be transferred from the sample box, avoid collision between the wafer and the sample box, and protect the photoresist coated on the wafer surface and the device structure on the wafer.

[0064] According to an embodiment of another aspect of the present invention, a wafer transfer system is provided, the wafer transfer system comprising a wafer transfer device, an inert gas supply device and an exhaust device. The inert gas supply device is connected to the first air inlet channel 11 of the wafer transfer device, and the inert gas supply device is suitable for providing inert gas to the wafer transfer device to isolate the wafer from the external environment during the transfer of the wafer. The exhaust device is connected to the first exhaust channel 12 of the wafer transfer device, and the exhaust device is suitable for extracting gas from the back of the wafer and forming a vacuum through the wafer transfer device during the transfer of the wafer, so as to adsorb the wafer on the wafer transfer device and transfer it.

[0065] According to an embodiment of the present invention, the inert gas supply equipment and the exhaust equipment can be small-volume gas tanks. At the same time, the length of the gas pipe between the inert gas supply equipment and the wafer transfer device and the length of the gas pipe between the exhaust equipment and the wafer transfer device can be adjusted according to the needs of the operator. In the case of long distances, the wafer can be transferred using the wafer transfer device.

[0066] According to an embodiment of the present invention, the wafer transfer device has a multifunctional design of using inert gas to purge the wafer, extracting the gas on the back of the wafer to form a vacuum and adsorb the wafer, and emitting lasers of different colors to irradiate the surface of the wafer. It has the advantages of low cost and high efficiency and can flexibly adapt to various needs of operators.

[0067] The embodiments of the present invention are described above. However, these embodiments are only for the purpose of illustration, and are not intended to limit the scope of the present invention. Although the embodiments are described above, this does not mean that the measures in the various embodiments cannot be used in combination. The scope of the present invention is defined by the appended claims and their equivalents. Without departing from the scope of the present invention, those skilled in the art may make various substitutions and modifications, which should all fall within the scope of the present invention.

Claims

1. A wafer transfer device, characterized in that: The wafer transfer device comprises: Pedestal; A support frame is connected to the base, and the support frame is configured to have a plurality of rods extending in a horizontal direction, and the plurality of rods include: A first rod portion is configured to support a wafer to be transferred, wherein a plurality of suction holes are provided on the first rod portion, and the plurality of suction holes are configured to absorb the wafer during the transfer of the wafer; The second rod portion is arranged above the first rod portion and at least partially surrounds the wafer to limit the wafer on the first rod portion. The second rod portion is provided with a plurality of air outlet holes, and the plurality of air outlet holes are configured to utilize the exhaust gas to isolate the wafer from the external environment during the transfer of the wafer.

2. The wafer transfer device according to claim 1, characterized in that: The base comprises: A handle, wherein the interior of the handle is configured to have a first air inlet channel and a first air exhaust channel that are distributed in parallel, one end of the first air inlet channel is connected to an external inert gas supply device, and one end of the first air exhaust channel is connected to an external exhaust device; A transition portion is connected to the handle, and is configured to have a second air intake passage communicating with the first air intake passage and a second exhaust passage communicating with the first exhaust passage, wherein the second exhaust passage extends in a direction away from the second air intake passage.

3. The wafer transfer device according to claim 2, characterized in that: The first rod portion is configured to have an air suction channel inside, and the air suction channel is communicated with the second exhaust channel to extract gas from the back side of the wafer and form a vacuum.

4. The wafer transfer device according to claim 3, characterized in that: An end of the first rod portion away from the base is configured to have a downwardly inclined cross-section to facilitate moving the wafer to a top surface of the first rod portion.

5. The wafer transfer device according to claim 4, characterized in that: The plurality of suction holes are distributed at intervals on the top surface of the first rod portion to absorb the wafer during the wafer transfer process.

6. The wafer transfer device according to claim 2, characterized in that: The second rod portion is configured to be arc-shaped, and the interior of the second rod portion is configured to have a purge channel extending in a circumferential direction, and the purge channel is connected to the second air inlet channel so that the inert gas is discharged inwardly in a radial direction from the multiple air outlets, thereby isolating the wafer from the external environment.

7. The wafer transfer device according to any one of claims 2 to 6, characterized in that: Also includes: A laser component is arranged on the transition portion and extends in a horizontal direction. The laser component is suitable for emitting lasers of multiple colors to irradiate the wafer.

8. The wafer transfer device according to claim 7, characterized in that: The upper surface of the transition portion is configured as a downwardly inclined slope, so that the laser light emitted by the laser assembly can be irradiated onto the surface of the wafer.

9. The wafer transfer device according to claim 8, characterized in that: The color of the laser emitted by the laser assembly is any one of yellow light, white light and blue light.

10. A wafer transfer system, characterized in that: The wafer transfer system comprises: The wafer transfer device according to any one of claims 1 to 9; an inert gas supply device connected to the first gas inlet channel of the wafer transfer device, the inert gas supply device being adapted to supply inert gas to the wafer transfer device so as to isolate the wafer from the external environment during the wafer transfer process; The exhaust device is connected to the first exhaust channel of the wafer transfer device. The exhaust device is suitable for extracting the gas on the back side of the wafer and forming a vacuum during the transfer of the wafer through the wafer transfer device, so as to adsorb the wafer on the wafer transfer device and transfer it.

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