Wafer transfer finger and transfer system for etching machine

Abstract

The embodiment of the invention provides a wafer transfer finger for an etching machine and a transfer system, the transfer finger comprises a finger body and a pushing mechanism, the pushing mechanism pushes a wafer to move relative to the finger body, and the finger body is provided with at least three groups of rolling elements which are not on the same straight line. A limiting induction mechanism is arranged at the end, away from the pushing mechanism, of the finger body, the pushing mechanism pushes the wafer to move in the direction close to the limiting induction mechanism, and the limiting induction mechanism and the pushing mechanism are matched to clamp and fix the wafer. The finger body is provided with at least three groups of rolling pieces which are not in the same straight line, when the pushing mechanism pushes the wafer to move, the rolling pieces rotate relative to the finger body, sliding friction of the wafer is converted into rolling friction, and the condition that the back of the wafer is scratched is avoided; and the limiting induction mechanism controls the pushing mechanism to stop pushing the wafer to move when the wafer is clamped and fixed, so that the clamping effect on the wafer is ensured.

Description

Technical Field

[0001] The present invention relates to the field of wafer transfer technology, and in particular to a wafer transfer finger and a transfer system for an etcher. Background Art

[0002] In semiconductor manufacturing, the wafer needs to be transferred from the carrier box to the process chamber before the process can be carried out. The atmospheric transfer part usually uses cylinder clamping fingers to correct the wafer position by clamping to improve the transfer accuracy. In the process of clamping the wafer, the wafer will slide on the robot arm. The transfer fingers reduce the contact area by adding gaskets (pick), which cannot completely avoid scratches on the back of the wafer. Summary of the invention

[0003] In view of this, the embodiments of the present specification provide a wafer transfer finger and a transfer system for an etcher, wherein at least three groups of rolling elements that are not on the same straight line are arranged on the finger body, and the rolling elements support the wafer. When the pushing mechanism pushes the wafer to move, the rolling elements rotate relative to the finger body, and the sliding friction of the wafer is converted into rolling friction, thereby avoiding scratches on the back of the wafer. At the same time, a limit sensing mechanism is arranged on the finger body, and the limit sensing mechanism controls the pushing mechanism to stop pushing the wafer to move when the wafer is clamped and fixed, thereby ensuring the clamping effect of the wafer.

[0004] The embodiments of this specification provide the following technical solutions: a wafer transfer finger for an etcher, comprising a finger body and a pushing mechanism, wherein the pushing mechanism pushes the wafer to move relative to the finger body, the finger body is provided with at least three groups of rolling elements that are not on the same straight line, and the rolling elements can rotate relative to the finger body, and a limit sensing mechanism is provided at one end of the finger body away from the pushing mechanism, the pushing mechanism pushes the wafer to move in a direction close to the limit sensing mechanism, the limit sensing mechanism cooperates with the pushing mechanism to clamp and fix the wafer, and the limit sensing mechanism controls the pushing mechanism to stop pushing the wafer to move when the wafer is clamped and fixed.

[0005] Preferably, the limit sensing mechanism includes a shell and a clamping plate, the shell is fixedly mounted on the finger body, a conductive sheet is arranged inside the shell, an insulating rod is fixedly connected to the conductive sheet, the insulating rod passes through the shell and is connected to the clamping plate, a first electrical contact block, a second electrical contact block, a battery and a controller are arranged inside the shell, the first electrical contact block and the second electrical contact block both correspond to the conductive sheet, and the controller controls the connection of the pushing mechanism; The positive electrode of the battery is electrically connected to the first electrical contact block, and the negative electrode of the battery is electrically connected to the controller and the second electrical contact block in sequence.

[0006] Preferably, the limit sensing mechanism also includes an elastic member, a first end of the elastic member is connected to the conductive sheet, and a second end of the elastic member is connected to the inner wall of the outer shell, and when the conductive sheet moves toward the first electrical contact block and the second electrical contact block, the elasticity of the elastic member changes, so that the clamping force applied to the wafer reaches a certain value when the controller is started.

[0007] Preferably, the elastic member comprises two groups of springs, the two groups of springs are symmetrically distributed about the insulating rod, and the first end of the spring is connected to a side of the conductive sheet close to the insulating rod.

[0008] Preferably, two groups of the position limit sensing mechanisms are provided, and the two groups of the position limit sensing mechanisms are respectively provided on the two fingertips of the finger body.

[0009] Preferably, the pushing mechanism comprises a cylinder and a pushing block, and the output end of the cylinder is connected to the pushing block.

[0010] Preferably, the rolling element comprises a rolling bearing, and the rolling element is provided in three groups, and the three groups of rolling elements are distributed in an isosceles triangle.

[0011] Preferably, the finger body is provided with three groups of receiving grooves for accommodating three groups of rolling bearings respectively, the rolling bearings are rotatably connected to the inner walls of the receiving grooves, the rolling bearings at least partially protrude from the finger body, and the conveying finger also includes a pipeline, which is connected to the three groups of receiving grooves, and the pipeline blows gas into the three groups of receiving grooves respectively.

[0012] Preferably, the pipeline includes an air inlet pipe, the outer end of the air inlet pipe is outside the finger body, the inner end of the air inlet pipe extends to the inside of the finger body and is connected to an air distribution pipe, the air distribution pipe is connected to three exhaust pipes, and the outlets of the three exhaust pipes are respectively connected to the three groups of the containing grooves.

[0013] A conveying system is used for wafer conveying of an etcher, the conveying system comprising a robot and a conveying finger as described in any one of the above items, the finger body and the pushing mechanism are both installed on the robot, and the robot conveys the wafer to an electrostatic chuck inside the etcher through the finger body.

[0014] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects: At least three groups of rolling elements that are not on the same straight line are arranged on the finger body, and the rolling elements support the wafer. When the pushing mechanism pushes the wafer to move, the rolling elements rotate relative to the finger body, converting the sliding friction of the wafer into rolling friction, thereby avoiding scratches on the back of the wafer. At the same time, a limit sensing mechanism is arranged on the finger body. When the wafer is clamped and fixed, the limit sensing mechanism controls the pushing mechanism to stop pushing the wafer to move, thereby ensuring the clamping effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of the structure of the wafer transfer finger for the etching machine provided in the application; Figure 2 It is a schematic diagram of the structure of the limit sensing mechanism of the wafer transfer finger for the etching machine provided in the application; Figure 3 It is a schematic diagram of the structure of the pipeline for wafer transfer fingers of the etching machine provided in the application.

[0017] In the figure, 1. finger body; 2. pushing mechanism; 21. cylinder; 22. pushing block; 3. rolling element; 31. rolling bearing; 4. limit sensing mechanism; 41. housing; 42. conductive sheet; 43. insulating rod; 44. clamping plate; 45. first electrical contact block; 46. second electrical contact block; 47. battery; 48. controller; 49. elastic element; 5. pipeline; 51. air inlet pipe; 52. air distribution pipe; 53. exhaust pipe; 6. receiving groove. DETAILED DESCRIPTION

[0018] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0019] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0020] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0021] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0022] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0023] Wafer etcher is a device that can perform chemical or physical reactions on the surface of wafers to achieve the purpose of thinning and processing. In the process of semiconductor chip manufacturing, the surface of the wafer needs to be made into various shapes, and the etcher plays the role of accurately engraving these shapes on the wafer. It uses chemical or physical methods to remove unnecessary materials attached to the surface of the wafer, thereby completing the micro-processing of the circuit.

[0024] When etching the wafer, the wafer needs to be transferred from the carrier box to the etcher chamber before the process can be carried out. The atmospheric transfer part usually uses a cylinder gripping finger to correct the wafer position by gripping to improve the transfer accuracy. In the process of gripping the wafer, the wafer will slide on the robot arm. The transfer finger reduces the contact area by adding a gasket (pick), which cannot completely avoid scratches on the back of the wafer. At the same time, in the process of gripping the wafer, the clamping force of the wafer is difficult to accurately control. When the clamping force is too small, the wafer will be unstable. When the clamping force is too large, it will cause damage to the wafer. At present, many wafer etchers use electrostatic chucks to adsorb the wafer. When the back of the wafer is scratched, it is difficult for the electrostatic chuck to adsorb and fix the wafer, which will have a greater impact on the etching effect of the wafer.

[0025] After extensive and in-depth experiments, the inventor designed a wafer transfer finger and transfer system for an etcher.

[0026] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.

[0027] like Figure 1 As shown, a wafer transfer finger for an etching machine includes a finger body 1 and a pushing mechanism 2, the pushing mechanism 2 pushes the wafer to move relative to the finger body 1, the finger body 1 is provided with at least three groups of rolling elements 3 that are not on the same straight line, the rolling elements 3 can rotate relative to the finger body 1, and a limit sensing mechanism 4 is provided at one end of the finger body 1 away from the pushing mechanism 2, the pushing mechanism 2 pushes the wafer to move in a direction close to the limit sensing mechanism 4, the limit sensing mechanism 4 cooperates with the pushing mechanism 2 to clamp and fix the wafer, and the limit sensing mechanism 4 controls the pushing mechanism 2 to stop pushing the wafer to move when the wafer is clamped and fixed.

[0028] The wafer is pushed to move relative to the finger body 1 by the pushing mechanism 2, and at least three groups of rolling members 3 that are not on the same straight line are arranged on the finger body 1. The back of the wafer contacts the rolling members 3, and the rolling members 3 support the wafer. When the pushing mechanism 2 pushes the wafer to move, the rolling members 3 rotate relative to the finger body 1, and the sliding friction of the wafer is converted into rolling friction, so as to avoid scratches on the back of the wafer and facilitate the adsorption and fixation of the back of the wafer in subsequent processes. At the same time, a limit sensing mechanism 4 is arranged on the end of the finger body 1 away from the pushing mechanism 2. The limit sensing mechanism 4 controls the pushing mechanism 2 to stop pushing the wafer to move when the wafer is clamped and fixed, so as to ensure the clamping effect of the wafer.

[0029] It should be noted that the three groups of rolling elements 3 that are not on the same straight line can determine a plane to ensure the supporting effect for the wafer.

[0030] like Figure 1-Figure 2 As shown, in some embodiments, the limit sensing mechanism 4 includes a shell 41 and a clamping plate 44, the shell 41 is fixedly mounted on the finger body 1, a conductive sheet 42 is arranged in the shell 41, an insulating rod 43 is fixedly connected to the conductive sheet 42, the insulating rod 43 passes through the shell 41 and is connected to the clamping plate 44, a first electrical contact block 45, a second electrical contact block 46, a battery 47 and a controller 48 are arranged in the shell 41, the first electrical contact block 45 and the second electrical contact block 46 both correspond to the conductive sheet 42, and the controller 48 controls the connection with the pushing mechanism 2; wherein the positive pole of the battery 47 is electrically connected to the first electrical contact block 45, the negative pole of the battery 47 is electrically connected to the controller 48 and the second electrical contact block 46 in sequence, and the shell 41 is fixedly mounted on the finger body 1 At one end away from the pushing mechanism 2, the outer end of the insulating rod 43 passes through the shell 41 and is connected to the clamp 44 near the pushing mechanism 2, and the inner end of the insulating rod 43 is connected to the conductive sheet 42. When the pushing mechanism 2 pushes the wafer to move in the direction close to the limit sensing mechanism 4, the wafer contacts the clamp 44. As the pushing mechanism 2 continues to push the wafer to move, the wafer pushes the clamp 44 to move, and the clamp 44 drives the conductive sheet 42 to move through the insulating rod 43. The conductive sheet 42 moves in the direction close to the first electrical contact block 45 and the second electrical contact block 46. When the conductive sheet 42 contacts the first electrical contact block 45 and the second electrical contact block 46, a closed loop is formed among the battery 47, the first electrical contact block 45, the conductive sheet 42, the second electrical contact block 46 and the controller 48. The controller 48 controls the pushing mechanism 2 to stop pushing the wafer to avoid damage to the wafer due to excessive clamping force.

[0031] like Figure 2 As shown, in some embodiments, the limit sensing mechanism 4 also includes an elastic member 49, a first end of the elastic member 49 is connected to the conductive sheet 42, and a second end of the elastic member 49 is connected to the inner wall of the shell 41. When the conductive sheet 42 moves toward the direction close to the first electrical contact block 45 and the second electrical contact block 46, the elasticity of the elastic member 49 changes, so that when the controller 48 is started, the clamping force on the wafer reaches a certain value. By arranging the elastic member 49 between the conductive sheet 42 and the shell 41, the two ends of the elastic member 49 are respectively fixedly connected to the conductive sheet 42 and the inner wall of the shell 41. When the conductive sheet 42 moves toward the direction close to the first electrical contact block 45 and the second electrical contact block 46, the elasticity of the elastic member 49 changes, and the elastic member 49 has a tendency to drive the conductive sheet 42 to move toward the initial position. By changing the distance between the conductive sheet 42 and the first electrical contact block 45 and the second electrical contact block 46, the force applied to the conductive sheet 42 by the elastic member 49 can be changed, thereby ensuring that the clamping force on the wafer is within an appropriate range.

[0032] It should be noted that, in this embodiment, the elastic member 49 is arranged on the side of the conductive sheet 42 close to the insulating rod 43, and when the conductive sheet 42 moves in the direction close to the first electrical contact block 45 and the second electrical contact block 46, the elastic member 49 is stretched. In other embodiments, the elastic member 49 may also be arranged on the side of the conductive sheet 42 far from the insulating rod 43, and when the conductive sheet 42 moves in the direction close to the first electrical contact block 45 and the second electrical contact block 46, the elastic member 49 is compressed. It can be set according to actual conditions.

[0033] like Figure 2 As shown, in some embodiments, the elastic member 49 includes two groups of springs, and the two groups of springs are symmetrically distributed about the insulating rod 43. The first end of the spring is connected to the side of the conductive sheet 42 close to the insulating rod 43. By setting two groups of springs symmetrically distributed about the insulating rod 43 as the elastic member 49, it is ensured that the conductive sheet 42 is uniformly subjected to the force of the elastic member 49, and the conductive sheet 42 and the clamping plate 44 are in a relatively parallel state, thereby ensuring the clamping effect of the clamping plate 44 on the wafer.

[0034] like Figure 1 As shown, in some embodiments, the limit sensing mechanism 4 is provided with two groups, and the two groups of the limit sensing mechanisms 4 are respectively provided on the two fingertips of the finger body 1. By providing the limit sensing mechanism 4 on the two fingertips of the finger body 1, the two limit sensing mechanisms 4 can both control the pushing mechanism 2 to prevent the clamping force on the wafer from being too large when the wafer is offset, and the safety is higher.

[0035] like Figure 1 As shown, in some embodiments, the pushing mechanism 2 includes a cylinder 21 and a pushing block 22, and the output end of the cylinder 21 is connected to the pushing block 22. The pushing block 22 is driven to move by the extension and retraction of the cylinder 21, and the pushing block 22 pushes the wafer to move in a direction close to the limit sensing mechanism 4. The push block 22 cooperates with the limit sensing mechanism 4 to complete the clamping and fixing operation of the wafer.

[0036] like Figure 1 As shown, in some embodiments, the rolling element 3 includes a rolling bearing 31, and the rolling element 3 is provided in three groups, and the three groups of rolling elements 3 are distributed in an isosceles triangle. By adopting the rolling bearing 31 as the rolling element 3, the rolling bearing 31 can only rotate along a specific direction, thereby ensuring that the pushing mechanism 2 pushes the wafer to move along a specific direction to avoid the wafer from being offset.

[0037] It should be noted that, in this embodiment, three groups of rolling bearings 31 distributed in isosceles triangles are provided to ensure the support effect on the wafer. In other embodiments, the number of rolling bearings 31 can also be four groups, five groups, or other numbers, which can be set according to actual conditions.

[0038] like Figure 1 As shown, in some embodiments, three groups of receiving grooves 6 are provided on the finger body 1 for accommodating three groups of rolling bearings 31 respectively, the rolling bearings 31 are rotatably connected to the inner walls of the receiving grooves 6, and the rolling bearings 31 at least partially protrude from the finger body 1, and the conveying finger also includes a pipe 5, which is connected to the three groups of receiving grooves 6, and the pipe 5 blows gas into the three groups of receiving grooves 6 respectively. The rolling bearings 31 are installed by setting the receiving grooves 6, and the top of the rolling bearings 31 protrudes from the top of the finger body 1, so as to ensure that the wafer can contact the rolling bearings 31, and the sliding friction of the wafer is converted into rolling friction, so as to avoid scratches on the back of the wafer. At the same time, gas is blown into the receiving groove 6 through the pipe 5. After entering the receiving groove 6, the gas flows upward and contacts the back of the wafer. The gas can give the wafer an upward lifting force, so that the gravity exerted by the wafer on the rolling bearings 31 is reduced, thereby further reducing the friction between the wafer and the rolling bearings 31.

[0039] It should be noted that the gas blown in may be CDA gas (clean dry air), nitrogen gas or other gases that will not affect the wafer.

[0040] like Figure 1 and Figure 3 As shown, in some embodiments, the pipeline 5 includes an air inlet pipe 51, the outer end of the air inlet pipe 51 is outside the finger body 1, and the inner end of the air inlet pipe 51 extends to the inside of the finger body 1 and is connected to an air distribution pipe 52, and the air distribution pipe 52 is connected to three exhaust pipes 53, and the outlets of the three exhaust pipes 53 are respectively connected to the three groups of the containing grooves 6. The gas enters through the air inlet pipe 51 and then flows into the air distribution pipe 52. The gas in the air distribution pipe 52 flows into the three exhaust pipes 53 respectively, and the gas in the three exhaust pipes 53 finally flows into the corresponding three groups of containing grooves 6.

[0041] It should be noted that the gas distribution pipe 52 and the exhaust pipe 53 are both arranged inside the finger body 1, and the exhaust end of the exhaust pipe 53 extends into the corresponding receiving groove 6 to ensure that the gas can flow into the receiving groove 6.

[0042] See also Figure 1-Figure 2Based on the same inventive concept, an embodiment of this specification provides a conveying system for wafer conveying of an etcher, the conveying system comprising a robot and a conveying finger as described in any one of the above items, the finger body 1 and the pushing mechanism 2 are both installed on the robot, and the robot conveys the wafer to the electrostatic chuck inside the etcher through the finger body 1.

[0043] During implementation, the conveying system is used for wafer conveying of the etcher. The finger body and the pushing mechanism are both installed on the robot. The robot drives the conveying finger to move to the wafer carrier box. The wafer is placed on the conveying finger by other mechanisms. The pushing mechanism pushes the wafer to move close to the limit sensing mechanism. When the pushing mechanism pushes the wafer to move, the rolling part rotates relative to the finger body, converting the sliding friction of the wafer into rolling friction, thereby avoiding scratches on the back of the wafer. The limit sensing mechanism controls the pushing mechanism to stop pushing the wafer when the wafer is clamped and fixed, thereby ensuring the clamping effect of the wafer. When the wafer is clamped and fixed, the robot transfers the wafer to the electrostatic suction cup in the etcher cavity through the conveying finger.

[0044] The same or similar parts between the various embodiments in this specification can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the method embodiment described later, since it corresponds to the system, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.

[0045] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A wafer transfer finger for an etching machine, comprising a finger body and a pushing mechanism, wherein the pushing mechanism pushes the wafer to move relative to the finger body, characterized in that: At least three groups of rolling elements that are not on the same straight line are arranged on the finger body, and the rolling elements can rotate relative to the finger body. A limit sensing mechanism is arranged at one end of the finger body away from the pushing mechanism, and the pushing mechanism pushes the wafer to move in a direction close to the limit sensing mechanism. The limit sensing mechanism cooperates with the pushing mechanism to clamp and fix the wafer, and the limit sensing mechanism controls the pushing mechanism to stop pushing the wafer to move when the wafer is clamped and fixed.

2. The wafer transfer finger for an etcher according to claim 1, characterized in that: The limit sensing mechanism includes a shell and a clamping plate, the shell is fixedly mounted on the finger body, a conductive sheet is arranged inside the shell, an insulating rod is fixedly connected to the conductive sheet, the insulating rod passes through the shell and is connected to the clamping plate, a first electrical contact block, a second electrical contact block, a battery and a controller are arranged inside the shell, the first electrical contact block and the second electrical contact block both correspond to the conductive sheet, and the controller controls the connection with the pushing mechanism; The positive electrode of the battery is electrically connected to the first electrical contact block, and the negative electrode of the battery is electrically connected to the controller and the second electrical contact block in sequence.

3. The wafer transfer finger for an etcher according to claim 2, characterized in that: The limit sensing mechanism also includes an elastic member, a first end of the elastic member is connected to the conductive sheet, and a second end of the elastic member is connected to the inner wall of the outer shell. When the conductive sheet moves toward the direction approaching the first electrical contact block and the second electrical contact block, the elasticity of the elastic member changes, so that the clamping force applied to the wafer reaches a certain value when the controller is started.

4. The wafer transfer finger for an etcher according to claim 3, characterized in that: The elastic member comprises two groups of springs, the two groups of springs are symmetrically distributed about the insulating rod, and the first end of the spring is connected to a side of the conductive sheet close to the insulating rod.

5. The wafer transfer finger for an etcher according to any one of claims 1 to 4, characterized in that: The position limit sensing mechanism is provided in two groups, and the two groups of the position limit sensing mechanism are respectively arranged on the two finger ends of the finger body.

6. The wafer transfer finger for an etcher according to claim 1, characterized in that: The rolling elements include rolling bearings. The rolling elements are arranged in three groups, and the three groups of rolling elements are distributed in an isosceles triangle.

7. The wafer transfer finger for an etcher according to claim 6, characterized in that: The finger body is provided with three groups of receiving grooves for receiving three groups of rolling bearings respectively. The rolling bearings are rotatably connected to the inner walls of the receiving grooves. The rolling bearings at least partially protrude from the finger body. The conveying finger also includes a pipeline, which is connected to the three groups of receiving grooves. The pipeline blows gas into the three groups of receiving grooves respectively.

8. The wafer transfer finger for an etcher according to claim 7, characterized in that: The pipeline includes an air inlet pipe, the outer end of which is located outside the finger body, and the inner end of which extends into the finger body and is connected to an air distribution pipe, and the air distribution pipe is connected to three exhaust pipes, and the outlets of the three exhaust pipes are respectively connected to the three groups of the containing grooves.

9. The wafer transfer finger for an etcher according to claim 1, characterized in that: The pushing mechanism comprises a cylinder and a pushing block, and the output end of the cylinder is connected to the pushing block.

10. A transmission system, characterized in that: Used for wafer transfer in an etcher, the transfer system comprises a robot and a transfer finger as described in any one of claims 1 to 9, the finger body and the pushing mechanism are both installed on the robot, and the robot transfers the wafer to an electrostatic chuck inside the etcher through the finger body.

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