Transparent display and manufacturing method thereof

Abstract

The invention relates to the technical field of display, in particular to a transparent display which comprises a transparent driving plate, a plurality of light-emitting elements and a transparent packaging layer. The plurality of light-emitting elements are arranged on the transparent driving board. The transparent packaging layer covers the plurality of light-emitting elements, and the surface of the transparent packaging layer above the plurality of light-emitting elements is provided with a micro-lens array structure. The micro-lenses of the micro-lens array structure almost do not cover the light-transmitting area of the transparent display, so that the transparent display has high transparency and high brightness.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a transparent display with high transparency and high brightness and a manufacturing method thereof. Background Art

[0002] Figure 1 Showing a conventional transparent display. Figure 1 The transparent display 10 includes a transparent driving plate 11, a plurality of light-emitting elements 12, a plurality of light-emitting elements 13, a plurality of light-emitting elements 14 and a transparent encapsulation layer 15. The plurality of light-emitting elements 12, a plurality of light-emitting elements 13 and a plurality of light-emitting elements 14 are arranged on the transparent driving plate 11, and the transparent encapsulation layer 15 covers the plurality of light-emitting elements 12, a plurality of light-emitting elements 13 and a plurality of light-emitting elements 14. The transparent driving plate 11 has a plurality of metal wires and a plurality of thin-film transistor elements (not shown) for connecting and driving the plurality of light-emitting elements 12, a plurality of light-emitting elements 13 and a plurality of light-emitting elements 14, so that the light-emitting elements 12, the light-emitting elements 13 and the light-emitting elements 14 emit light L1 to the outside of the transparent display 10, thereby forming an image for the viewer to watch. The light-emitting elements 12, the light-emitting elements 13 and the light-emitting elements 14 respectively emit light of different colors, for example, the light-emitting element 12 can emit red light, the light-emitting element 13 can emit green light, and the light-emitting element 14 can emit blue light. The light-emitting elements 12, the light-emitting elements 13 and the light-emitting elements 14 can be but are not limited to micro light-emitting diodes (micro LEDs). In Figure 1 In the embodiment, the light emitting element 12, the light emitting element 13 and the light emitting element 14 are independent micro-LED chips. In other embodiments, the light emitting elements 12, the light emitting elements 13 and the light emitting elements 14 of different colors can also be integrated into the same micro-LED chip. The light emitting elements 12, the light emitting elements 13 and the light emitting elements 14 and the multiple metal wires and the multiple thin film transistor elements of the transparent driving plate 11 form an opaque area Ao, and the rest is a transparent area At.

[0003] The transparent display 10 allows external light La to penetrate, so the viewer 20 can see the scene 21 on the back of the transparent display 10 from the front of the transparent display 10, such as Figure 2As shown. In other words, the transparent display 10 allows the viewer 20 to see the scene 21 behind the transparent display 10 while viewing the screen information. Based on the transparent display 10's see-through characteristics, the automotive industry has come up with the idea of ​​attaching the transparent display 10 to the car's windshield or directly using the transparent display 10 to replace the original windshield, so that driving information (such as navigation instructions, vehicle speed, etc.) is directly displayed on the windshield, so the driver does not need to lower his head to confirm the driving information, which helps to avoid driver distraction. In other words, while the driver confirms the driving information through the transparent display 10 on the windshield, he can also see the road conditions ahead, thereby improving driving safety.

[0004] In addition to being used in automobiles, the transparent display 10 can also be used in many places. For example, replacing transparent windows or transparent glass with the transparent display 10 can make the display space more varied. Specifically, the transparent display 10 can be attached to or replace a store window, so that product information or the latest activities can be displayed on the store window, which can quickly capture the attention of consumers. In exhibition spaces such as museums and art galleries, the transparent display 10 can be attached to or replace the glass outside the exhibit, so that the concept of the work, the author's information, etc. can be presented in a dynamic way, increasing the sense of interactivity of the exhibition.

[0005] The emergence of the transparent display 10 allows users to see the scene behind the transparent display 10 while viewing the screen information. Therefore, the transparent display 10 can also be applied to augmented reality (AR) glasses or devices. In the future, the transparent display 10 may even replace the lenses of glasses, so that the glasses not only have the function of correcting vision, but also can handle various tasks in a multi-tasking manner.

[0006] In the case where the plurality of light-emitting elements 12, the plurality of light-emitting elements 13 and the plurality of light-emitting elements 14 are micro-LED chips, mass transfer can be used to configure the plurality of light-emitting elements 12, the plurality of light-emitting elements 13 and the plurality of light-emitting elements 14 onto the transparent driving plate 11. After the mass transfer, the contact area between the micro-LED chip and the transparent driving plate 11 is small, and therefore the adhesion is also extremely small, so it is necessary to directly encapsulate to form a transparent encapsulation layer 15 to cover the micro-LED chip in order to improve the reliability of the micro-LED chip. However, the micro-LED chip is packaged in a bare crystal state, so part of the light L2 emitted by the micro-LED chip will form total reflection and cannot be emitted to the outside of the transparent display 10, thereby reducing the light emission effect and causing the brightness peak of the transparent display 10 to be insufficient. Figure 1 shown.

[0007] In order to improve the problem of insufficient brightness of transparent displays, some manufacturers have added a micro lens array (MLA) on the upper surface of the transparent encapsulation layer. Figure 3 A transparent display with a microlens array in the related art is shown. Figure 3 The transparent display 30 includes a transparent driving plate 31, a plurality of light-emitting elements 32, a plurality of light-emitting elements 33, a plurality of light-emitting elements 34, a transparent encapsulation layer 35 and a microlens array layer 36. The plurality of light-emitting elements 32, a plurality of light-emitting elements 33 and a plurality of light-emitting elements 34 are arranged on the transparent driving plate 31, and the transparent encapsulation layer 35 covers the plurality of light-emitting elements 32, a plurality of light-emitting elements 33 and a plurality of light-emitting elements 34. The microlens array layer 36 is attached to the upper surface of the transparent encapsulation layer 35. There are a plurality of metal wires and a plurality of thin-film transistor elements (not shown) on the transparent driving plate 31 for connecting and driving the plurality of light-emitting elements 32, a plurality of light-emitting elements 33 and a plurality of light-emitting elements 34. The light-emitting elements 32, the light-emitting elements 33 and the light-emitting elements 34 respectively emit light of different colors. For example, the light-emitting element 32 can emit red light, the light-emitting element 33 can emit green light, and the light-emitting element 34 can emit blue light. The light-emitting elements 32, the light-emitting elements 33 and the light-emitting elements 34 can be but are not limited to micro light-emitting diodes. In Figure 1 In the embodiment, the light emitting element 32, the light emitting element 33 and the light emitting element 34 are independent micro-LED chips. In other embodiments, the light emitting elements 12, the light emitting element 13 and the light emitting element 14 of different colors can also be integrated into the same micro-LED chip. The light emitting elements 32, the light emitting elements 33 and the light emitting elements 34 form an opaque area Ao with multiple metal wires and multiple thin film transistor elements of the transparent driving plate 31, and the other parts are the transparent area At. The microlens array layer 36 is used to increase the light L1 and L2 that can be emitted by the light emitting elements 32, the light emitting elements 33 and the light emitting elements 34 to the outside of the transparent display 30, thereby increasing the peak brightness of the transparent display 30. In other words, the microlens array layer 36 can enhance the light emitting effect of the transparent display 30. The microlens array layer 36 has a microlens array structure formed by a plurality of microlenses 361 with a light aperture of micrometer level. The shape profile of the microlens 361 may be a regular shape or an irregular shape, wherein the regular shape includes but is not limited to a spherical shape, an aspherical shape, a cylindrical shape, a hyperbolic shape, a planar convex shape, and a biconcave shape. The optical function of the microlens array layer 36 may be adjusted by adjusting the shape, focal length, and arrangement of the microlens 361. The material of the microlens array layer 36 may be polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), photoresist, or silicon dioxide (SiO2).

[0008] Generally speaking, compared to Figure 1 The transparent display 10, Figure 3After adding the microlens array layer 36, the peak brightness of the transparent display 30 can be increased by about 45%. However, the microlenses 361 of the microlens array layer 36 of the current transparent display 30 are distributed throughout the entire microlens array layer 36. Figure 4 As shown. That is, the microlens 361 is not only arranged above the opaque area Ao, but also above the light-transmitting area At. Therefore, when the external light La enters the microlens array layer 36 from the back of the transparent display 30 through the light-transmitting area At, the external light La will be scattered or focused and deformed by the microlens 361, thereby causing the scene 21 seen by the viewer to become atomized or blurred. In other words, the microlens array layer 36 causes the transparency of the transparent display 30 to decrease. Summary of the invention

[0009] One of the purposes of the present application is to provide a transparent display with high transparency and high brightness and a manufacturing method thereof.

[0010] According to one aspect of the present application, an embodiment of the present application provides a transparent display, including a transparent driving plate, a plurality of light-emitting elements, and a transparent encapsulation layer. The plurality of light-emitting elements are arranged on the transparent driving plate. The transparent encapsulation layer covers the plurality of light-emitting elements, and the surface of the transparent encapsulation layer above the plurality of light-emitting elements has a microlens array structure.

[0011] In one embodiment, the transparent encapsulation layer and the micro-lens array structure of the transparent display may be formed in the same process.

[0012] In one embodiment, the plurality of light emitting elements of the transparent display include micro light emitting diode chips.

[0013] In one embodiment, the micro-lens array structure of the transparent display is formed only directly above each light emitting element.

[0014] In one embodiment, the microlens array structure of the transparent display is formed by hot embossing, droplet jetting, photoresist thermal reflow or laser.

[0015] According to another aspect of the present application, an embodiment of the present application provides a method for manufacturing a transparent display, including: setting a plurality of light-emitting elements on a transparent driving plate; forming a transparent encapsulation layer to cover the plurality of light-emitting elements; and forming a microlens array structure on the surface of the transparent encapsulation layer above the plurality of light-emitting elements.

[0016] In one embodiment, the steps of forming the transparent encapsulation layer and the microlens array structure in the manufacturing method are performed in the same process.

[0017] In one embodiment, the plurality of light emitting elements provided in the manufacturing method include micro light emitting diode chips.

[0018] In one embodiment, the microlens array structure formed in the manufacturing method is only formed directly above each light emitting element.

[0019] In one embodiment, the microlens array structure is formed by a method of forming the microlens array structure by hot stamping, droplet jetting, photoresist thermal reflow or laser.

[0020] The microlenses of the microlens array structure of the transparent display of the present application hardly cover the light-transmitting area of ​​the transparent display, so the transparent display of the present application can have high transparency and high brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Showing a conventional transparent display.

[0022] Figure 2 Schematic diagram showing what a viewer sees from the back of a transparent display.

[0023] Figure 3 A transparent display with a microlens array in the display related technology.

[0024] Figure 4 show Figure 3 Distribution diagram of microlenses in the microlens array layer.

[0025] Figure 5 An embodiment of the transparent display of the present application is shown.

[0026] Figure 6 show Figure 5 A first embodiment of the distribution diagram of micro lenses in the transparent encapsulation layer.

[0027] Figure 7 show Figure 5 A second embodiment of the distribution diagram of micro lenses in the transparent encapsulation layer.

[0028] Figure 8 show Figure 5 A third embodiment of the distribution diagram of micro lenses in the transparent encapsulation layer.

[0029] Fig. 9 A flow chart showing the method for manufacturing the transparent display of the present application.

[0030] Description of reference numerals:

[0031] 10. Transparent display; 11. Transparent driving board; 12. Light-emitting element; 13. Light-emitting element; 14. Light-emitting element; 15. Transparent encapsulation layer; 20. Viewer; 21. Scene; 30. Transparent display; 31. Transparent driving board; 32. Light-emitting element; 33. Light-emitting element; 34. Light-emitting element; 35. Transparent encapsulation layer; 36. Microlens array layer; 361. Microlens; 40. Transparent display; 41. Transparent driving board; 42. Light-emitting element; 43. Light-emitting element; 44. Light-emitting element; 45. Transparent encapsulation layer; 451. Microlens; Ao, opaque area; At, translucent area; L1, light; L2, light; La, external light; S10, step; S11, step; S12, step. DETAILED DESCRIPTION

[0032] Figure 5 Showing the transparent display of the present application. Figure 5 The transparent display 40 includes a transparent driving plate 41, a plurality of light-emitting elements 42, a plurality of light-emitting elements 43, a plurality of light-emitting elements 44 and a transparent encapsulation layer 45. The plurality of light-emitting elements 42, a plurality of light-emitting elements 43 and a plurality of light-emitting elements 44 are arranged on the transparent driving plate 41, and the transparent encapsulation layer 45 covers the plurality of light-emitting elements 42, a plurality of light-emitting elements 43 and a plurality of light-emitting elements 44. The transparent driving plate 41 has a plurality of metal wires and a plurality of thin-film transistor elements (not shown) for connecting and driving the plurality of light-emitting elements 42, a plurality of light-emitting elements 43 and a plurality of light-emitting elements 44, so that the light-emitting elements 42, the light-emitting elements 43 and the light-emitting elements 44 emit light L1 and L2 to the outside of the transparent display 10, thereby forming an image for the viewer to watch. The light-emitting elements 42, the light-emitting elements 43 and the light-emitting elements 44 respectively emit light of different colors. For example, the light-emitting element 42 can emit red light, the light-emitting element 43 can emit green light, and the light-emitting element 44 can emit blue light. The light-emitting elements 42, the light-emitting elements 43 and the light-emitting elements 44 can be but are not limited to micro light-emitting diodes. In Figure 5 In the embodiment, the light emitting element 42, the light emitting element 43 and the light emitting element 44 are independent micro-LED chips. In other embodiments, the light emitting elements 42, the light emitting element 43 and the light emitting element 44 of different colors can also be integrated into the same micro-LED chip. The light emitting elements 42, the light emitting elements 43 and the light emitting elements 44 and the multiple metal wires and the multiple thin film transistor elements of the transparent driving plate 41 form an opaque area Ao, and the rest is a transparent area At.

[0033] Figure 5The transparent encapsulation layer 45 has a microlens array structure composed of a plurality of microlenses 451. The microlens array structure is used to increase the light L1 and light L2 that can be emitted by the light-emitting element 42, the light-emitting element 43 and the light-emitting element 44 to the outside of the transparent display 40, thereby improving the brightness peak of the transparent display 40. In other words, the microlens array structure composed of a plurality of microlenses 451 can enhance the light emission effect of the transparent display 40. The plurality of microlenses 451 of the transparent encapsulation layer 45 have a light-clearing aperture of the micrometer level. The shape profile of the microlens 451 can be a regular shape or an irregular shape, wherein the regular shape includes but is not limited to a circle, an ellipse, a sphere, a non-spherical shape, a cylinder, a hyperbolic shape, a planar convex shape and a biconcave shape. By adjusting the shape, focal length and arrangement of the microlenses 4511, the optical function of the transparent encapsulation layer 45 can be adjusted.

[0034] In one embodiment, the transparent encapsulation layer 45 and the microlens array structure composed of a plurality of microlenses 451 can be formed in different processes. In one embodiment, the transparent encapsulation layer 45 and the microlens array structure composed of a plurality of microlenses 451 can be formed in the same process, thereby reducing the process steps.

[0035] The present application may form a plurality of microlenses 451 by hot stamping, droplet jetting, photoresist thermal reflow or laser to form a lens array structure, but the present application is not limited to using the aforementioned methods to form a lens array structure.

[0036] Figure 6 show Figure 5 A first embodiment of the distribution diagram of micro lenses of the transparent encapsulation layer. Figure 6 In the embodiment, the microlens 451 is only formed directly above the light-emitting element 42, the light-emitting element 43 and the light-emitting element 44. In other words, the microlens array structure is only formed directly above each light-emitting element 42, the light-emitting element 43 and the light-emitting element 44. Therefore, the light L1 and the light L2 emitted by the light-emitting element 42, the light-emitting element 43 and the light-emitting element 44 can be emitted to the outside of the transparent display 40, thereby increasing the peak brightness of the transparent display 40. Since the microlenses 451 of the microlens array structure of the present application are not arranged above the light-transmitting area At, when the external light La enters the transparent encapsulation layer 45 from the back of the transparent display 40 through the light-transmitting area At, the external light La will not be scattered or focused and deformed by the microlens 451, and the viewer can clearly see the scene on the back of the transparent display 40. In other words, the transparent display 40 of the present application not only has a brightness peak, but also has high transparency.

[0037] Figure 7 show Figure 5 A second embodiment of the distribution diagram of micro lenses of the transparent encapsulation layer. Figure 7In the embodiment, the microlens 451 is above the light-emitting element 42, the light-emitting element 43, and the light-emitting element 44 and covers a small portion of the light-transmitting area At. Through the microlens 451 above the light-emitting element 42, the light-emitting element 43, and the light-emitting element 44, the light L1 and the light L2 emitted by the light-emitting element 42, the light-emitting element 43, and the light-emitting element 44 can be emitted to the outside of the transparent display 40, thereby increasing the peak brightness of the transparent display 40. When the external light La enters the transparent encapsulation layer 45 from the back of the transparent display 40 through the light-transmitting area At, the external light La is hardly affected by the microlens 451, so the viewer can still clearly see the scene on the back of the transparent display 40. In other words, using Figure 7 The transparent display 40 of the embodiment still has high peak brightness and high transparency.

[0038] Figure 8 show Figure 5 A third embodiment of the distribution diagram of the microlenses of the transparent encapsulation layer. Figure 8 In the embodiment, a microlens 451 covers a group of light-emitting elements and a small portion of the light-transmitting area At, wherein each group of light-emitting elements includes a light-emitting element 42, a light-emitting element 43, and a light-emitting element 44. Light L1 and light L2 emitted by the light-emitting element 42, the light-emitting element 43, and the light-emitting element 44 can be emitted to the outside of the transparent display 40 through the upper microlens 451, thereby increasing the peak brightness of the transparent display 40. When the external light La enters the transparent encapsulation layer 45 from the back of the transparent display 40 through the light-transmitting area At, the external light La is hardly affected by the microlens 451, so the viewer can still clearly see the scene on the back of the transparent display 40. In other words, using Figure 8 The transparent display 40 of the embodiment still has high peak brightness and high transparency.

[0039] Fig. 9 A flowchart showing the method for manufacturing a transparent display of the present application. Figure 5 and Fig. 9 The manufacturing method of the transparent display 40 of the present application includes performing step S10, arranging a plurality of light-emitting elements 42, a plurality of light-emitting elements 43, and a plurality of light-emitting elements 44 on a transparent driving plate 41. Assuming that the plurality of light-emitting elements 42, a plurality of light-emitting elements 43, and a plurality of light-emitting elements 44 are micro-LED chips, in step S10, mass transfer can be used to configure the plurality of light-emitting elements 42, a plurality of light-emitting elements 43, and a plurality of light-emitting elements 44 on the transparent driving plate 41.

[0040] After the plurality of light emitting elements 42, the plurality of light emitting elements 43 and the plurality of light emitting elements 44 are arranged on the transparent driving plate 41, step S11 is performed. In step S11, since the contact area between the micro-LED chip and the transparent driving plate 41 is small, the adhesion is also very small, so after the plurality of light emitting elements 42, 43 and 44 are arranged on the transparent driving plate 41, they must be directly packaged to form a transparent packaging layer 45 to cover the micro-LED chip, so as to improve the reliability of the micro-LED chip.

[0041] After forming a transparent encapsulation layer 45 to cover the multiple light-emitting elements 42, the multiple light-emitting elements 43, and the multiple light-emitting elements 44, step S12 is performed. Since the micro-LED chip is encapsulated in a bare die state, part of the light L2 emitted by the micro-LED chip may be totally reflected and cannot be emitted to the outside of the transparent display 40. In order to improve the light-emitting effect of the transparent display 40, step S12 forms a microlens array structure locally on the surface of the transparent encapsulation layer 45 above the multiple light-emitting elements 42, the multiple light-emitting elements 43, and the multiple light-emitting elements 44. In step S12, multiple microlenses 451 can be formed by hot stamping, droplet jetting, photoresist thermal reflow method or laser to form a lens array structure, but the present application is not limited to using the aforementioned method to form a lens array structure.

[0042] In one embodiment, step S12 may form microlenses 451 only on the surface of the transparent encapsulation layer 45 directly above the plurality of light-emitting elements 42, the plurality of light-emitting elements 43, and the plurality of light-emitting elements 44, that is, the microlens array structure only covers the opaque area Ao. In one embodiment, step S12 may form microlenses 451 above the plurality of light-emitting elements 42, the plurality of light-emitting elements 43, and the plurality of light-emitting elements 44, and the microlenses 451 cover a small portion of the light-transmitting area At.

[0043] In one embodiment, step S11 and step S12 are respectively performed in different processes, that is, the transparent encapsulation layer 45 and the microlens array structure composed of a plurality of microlenses 451 are formed in different processes. In one embodiment, step S11 and step S12 are respectively performed in the same process, that is, the transparent encapsulation layer 45 and the microlens array structure composed of a plurality of microlenses 451 can be formed in the same process, thereby reducing the number of process steps.

[0044] Taking a 13.3-inch transparent display as an example, under the same conditions, compared with Figure 1 The transparent display 10 of the present application can increase the peak brightness by up to 243%. In terms of transparency, the transparent display 40 of the present application can only be Figure 1 The transparent display is 10% lower than that of Figure 1Compared with the transparent display 10 of the present application, the transparent display 40 of the present application can indeed have the advantages of high transparency and high brightness at the same time.

[0045] exist Figure 3 In the transparent display 30, whether it is the light L1 and light L2 emitted by the light emitting element 32, the light emitting element 33 and the light emitting element 34 or the external light La, they all need to pass through the transparent encapsulation layer 35 and the microlens array layer 36. Since the transparent encapsulation layer 35 and the microlens array layer 36 are different media, the light L1 and light L2 and the external light La will lose energy during transmission, resulting in a decrease in the peak brightness. On the contrary, in the transparent display 40 of the present application, the light L1 and light L2 emitted by the light emitting element 42, the light emitting element 43 and the light emitting element 44 and the external light La only need to pass through the transparent encapsulation layer 45, so the light loses less energy during transmission, and thus has a higher peak brightness. In addition, in Figure 3 In the transparent display 30 of the present application, the microlenses 361 of the microlens array layer 36 cover most of the light-transmitting area At, causing the external light La to be scattered or focused and deformed by the microlenses 361, thereby reducing the transparency of the transparent display 30. On the contrary, in the transparent display 40 of the present application, the microlenses 451 of the microlens array structure on the surface of the transparent encapsulation layer 45 are almost only arranged on the non-light-transmitting area Ao, so the external light La can almost directly pass through the transparent display 40 without being affected, thereby improving the transparency of the transparent display 40. Therefore, compared with Figure 3 The transparent display 30 of the present application can indeed have the advantages of high transparency and high brightness at the same time.

[0046] The above description is merely an embodiment of the present application and does not constitute any form of limitation to the present application. Although the present application has been disclosed as above by the embodiments, it is not intended to limit the present application. Any ordinary technician in the field can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present application. However, any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A transparent display, characterized in that: include: Transparent driver board; A plurality of light-emitting elements are arranged on the transparent driving board; as well as A transparent encapsulation layer covers the plurality of light emitting elements, and a surface of the transparent encapsulation layer above the plurality of light emitting elements has a microlens array structure.

2. The transparent display according to claim 1, characterized in that: The transparent encapsulation layer and the microlens array structure are formed in the same process.

3. The transparent display according to claim 1, wherein: The plurality of light emitting elements include micro light emitting diode chips.

4. The transparent display according to claim 1, wherein: The microlens array structure is formed only directly above each of the light emitting elements.

5. The transparent display according to claim 1, wherein: The microlens array structure is formed by hot stamping, microdroplet jetting, photoresist thermal reflow or laser.

6. A method for manufacturing a transparent display, characterized in that: The following steps are involved: A plurality of light-emitting elements are arranged on the transparent driving board; forming a transparent encapsulation layer to cover the plurality of light emitting elements; and A microlens array structure is formed on the surface of the transparent encapsulation layer above the plurality of light emitting elements.

7. The method according to claim 6, characterized in that: The steps of forming the transparent encapsulation layer and the microlens array structure are performed in the same process.

8. The method according to claim 6, characterized in that: The plurality of light emitting elements include micro light emitting diode chips.

9. The method according to claim 6, characterized in that: The microlens array structure is formed only directly above each of the light emitting elements.

10. The manufacturing method according to claim 6, characterized in that: The microlens array structure is formed by a method including hot stamping, droplet jetting, photoresist thermal reflow or laser formation.

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