Packaging assembly and camera module thereof

Abstract

According to the packaging assembly and the camera module thereof, in the structure of the packaging assembly, a chip installation area is arranged in the middle of a circuit board, solder balls are arranged on circuit board bonding pads through a steel mesh printing technology, and furthermore, gold balls are correspondingly arranged on the chip bonding pads; the gold balls arranged on the chip and the solder balls arranged on the circuit board are fused with each other, and the circuit board and the chip are bonded and fixed by using a hot pressing bonding process, so that the conduction stability of the circuit board and the chip can be effectively ensured. Furthermore, in order to ensure the stability of conduction between the circuit board and the chip, glue is filled in a fusion area formed by the gold balls and the solder balls, so that the packaging assembly has the advantages of good conductivity, light overall weight, small size and the like, and can be applied to camera module structures such as chip shake prevention and the like; and the anti-shake adjustment precision of the chip can be effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of camera modules, and further to a packaging component and a preparation process thereof, and a camera module assembled from the packaging component. Background Art

[0002] The camera module is one of the indispensable components of smart electronic devices, including but not limited to smart phones, cameras, computer equipment, wearable devices, etc. With the continuous development and popularization of various smart devices, the requirements for camera modules are getting higher and higher.

[0003] In recent years, smart electronic devices have developed rapidly and are becoming increasingly thinner and lighter. To adapt to this development, camera modules are increasingly required to be multifunctional, thinner, and smaller, so that electronic devices can be made thinner and thinner and meet the imaging requirements of the camera modules. Therefore, camera module manufacturers are committed to designing and manufacturing camera modules that meet these requirements.

[0004] Taking smartphones as an example, the body is becoming thinner and lighter, so the camera module is also required to be gradually thinner. The camera module is mainly composed of an optical lens and a chip packaging component. The height of the optical lens is currently difficult to optimize, so the thinness of the camera module mainly depends on the size of the chip packaging component. At present, in order to improve the imaging quality of the camera module, the size of the imaging surface of the chip is increasing rapidly, but at the same time, it is necessary to cater to the trend of thinning and lightening of smart devices. Even if the chip size increases, the height size of the overall camera module is still limited. Furthermore, how to reduce the height and size of the chip packaging component when the chip size increases is an important problem that needs to be solved at present.

[0005] The camera module is an optical electronic device. Its chip packaging assembly not only needs to consider the stability of the chip circuit conduction, but also needs to ensure the stability of its structure. After the chip and the circuit board structure are connected, the stability of the connection between the chip and the circuit board must also be ensured. The chip and circuit board packaging assembly needs to undergo multiple reliability tests during the manufacturing process. If the packaging assembly structure between the chip and the circuit board is unstable, the chip will fall off the circuit board during the reliability test, thereby destroying the stability of its packaging assembly structure. How to structurally ensure the stability of the connection between the chip and the circuit board is also one of the issues that need to be considered at present.

[0006] To sum up, when providing a chip and circuit board packaging structure that can achieve the miniaturization of its packaging component structure, it is also necessary to consider the stability of the packaging component structure and the chip conduction problem, and it is necessary to consider electrical, optics and structure comprehensively, but these factors are obviously not taken into consideration in the prior art. Summary of the invention

[0007] In response to the above problems, the present application provides a packaging component and a camera module thereof, which can effectively solve some and / or most of the above problems while achieving miniaturization of the overall structure of the packaging component.

[0008] One purpose of the present application is to provide a packaging component and a camera module thereof, which have a simple structure, and can ensure the miniaturization of the overall packaging component while assembling it in the camera module, thereby achieving a lightweight and thin camera module structure.

[0009] Another object of the present application is to provide a packaging component and a camera module thereof, wherein a through hole is opened on a circuit board, the chip is arranged on the circuit board and the effective area of ​​the chip corresponds to the through hole of the circuit board, and the surface of the effective area of ​​the chip is lower than the front side of the circuit board, thereby effectively reducing the height of the packaging component.

[0010] Another object of the present application is to provide a packaging component and a camera module thereof, which arranges a circuit board pad on the back of the circuit board, and arranges a solder ball on the circuit board pad using a steel screen printing process, so that the solder ball can be fixed on the circuit board pad to ensure stable conduction with the chip.

[0011] Another object of the present application is to provide a packaging component and a camera module thereof, which can further extend the conductive circuit of the chip to facilitate conductive connection with the circuit board by setting a chip pad on the front side of the chip and setting a gold ball on the chip pad so that the gold ball is conductively connected to the chip pad.

[0012] Another object of the present application is to provide a packaging component and a camera module thereof, which coats glue on the circuit board pad so that the glue covers the solder ball to avoid oxidation of the solder ball and facilitates the melting of the solder ball and the gold ball.

[0013] Another object of the present application is to provide a packaging component and a camera module thereof, which fixes the chip on the circuit board, mainly fixes the chip on the back side of the circuit board, so that the effective area of ​​the chip is completely exposed in the through hole of the circuit board to ensure that the chip can receive most of the external light.

[0014] Another object of the present application is to provide a packaging component and a camera module thereof, which forms a conductive bonding area between the chip and the circuit board by bonding the gold ball fixed on the chip pad to the solder ball on the circuit board pad, thereby connecting the circuit board to the photosensitive chip.

[0015] Another object of the present application is to provide a packaging component and a camera module thereof, which can fill glue in the gap inside the conductive bonding area formed between the circuit board and the circuit board to make the connection between the chip and the circuit board more stable, prevent the chip from falling off the circuit board, and improve the reliability of the packaging component.

[0016] Another object of the present application is to provide a packaging assembly and a camera module thereof, which can effectively prevent the electronic components from falling off by arranging electronic components on the circuit board, fixing the electronic components on the circuit board by a molding process, and molding the electronic components inside the circuit board.

[0017] Another object of the present application is to provide a packaging component and a camera module thereof, which form a molded part on the circuit board using a molding process. While covering the electronic components, the molded part can form a color filter mounting position on its upper surface to ensure the accuracy of color filter installation.

[0018] Another object of the present application is to provide a packaging component and a camera module thereof, which may also include a back molding portion formed on the back side of the circuit board, with a gap between the back molding portion and the chip, and the back molding portion may further strengthen the structural strength of the packaging component.

[0019] Another object of the present application is to provide a packaging component and a camera module thereof, which forms a chip anti-shake structure by setting the packaging component on a driving component, and combines the chip anti-shake structure with an optical lens to obtain a camera module structure with a large-stroke chip anti-shake.

[0020] In order to achieve the above objectives, the technical solution adopted in this application is:

[0021] A packaging component includes a circuit board and a chip, wherein the circuit board has a through hole, and the chip is arranged corresponding to the through hole of the circuit board, characterized in that:

[0022] The circuit board has a plurality of circuit board pads, at least one solder ball is arranged on each of the circuit board pads, the chip has a plurality of chip pads, at least one gold ball is arranged on the chip pad, the chip pad corresponds to the circuit board pad, and at least one gold ball is melted with at least one solder ball to form a conductive bonding area to conduct the circuit board and the chip;

[0023] There are gaps between the conductive bonding areas where the plurality of gold balls are melted with the solder balls, and the gaps are filled with glue.

[0024] In a specific embodiment, the gold ball and the solder ball are fixed by thermal compression bonding.

[0025] In a specific embodiment, the glue contains flux and covers the solder balls to slow down oxidation of the solder balls.

[0026] In a specific embodiment, the glue connects the circuit board and the chip and completely fills the gaps between the conductive bonding areas where the gold balls and the solder balls are melted.

[0027] In a specific embodiment, the glue is arranged around the through hole of the circuit board and covers the solder pad of the circuit board, wherein the glue has a glue width, and the solder ball is arranged on the side of the midline of the glue width close to the through hole of the circuit board, so that the glue can cover the solder ball inside it.

[0028] In a specific embodiment, the glue thickness is greater than the solder ball height, and the glue thickness is greater than or equal to 20 μm.

[0029] In a specific embodiment, an ink structure is provided on the circuit board, and the ink is respectively provided on both sides close to and away from the circuit board through hole, wherein the ink is protrudingly provided on the circuit board pad and forms a groove, and the circuit board pad is at least partially accommodated in the groove.

[0030] In a specific embodiment, the solder ball is disposed on the pad of the circuit board, and the solder ball covers at least 80% of the area of ​​the pad of the circuit board, so that the solder ball is accommodated in the groove formed by the ink structure.

[0031] In a specific embodiment, the gold ball on the chip pad has a protrusion, wherein the protrusion extends into the interior of the solder ball on the circuit board pad to increase the contact area between the solder ball and the gold ball.

[0032] In a specific embodiment, the circuit board pads are arranged corresponding to the chip pads, wherein the center distance between at least some adjacent circuit board pads is less than 150 μm.

[0033] In a specific embodiment, the package body further has a molding portion, which is integrally formed on the circuit board, wherein the molding portion includes a front molding portion and a back molding portion formed on the front and back sides of the circuit board.

[0034] In a specific embodiment, the back molding part is arranged on the back side of the circuit board, and the back molding part can be used to strengthen the strength of the circuit board, wherein the lower surface of the back molding part is lower than the back side of the chip.

[0035] In a specific embodiment, the front molding portion is arranged in a ring shape around the through hole of the circuit board, and the front side of the circuit board provided with the circuit board pad is covered by the front molding portion.

[0036] In a specific embodiment, a camera module is also provided, characterized in that it includes:

[0037] lens motor; and

[0038] In the packaging component described above, the lens motor is arranged on the upper surface of the packaging component so that external light can reach the inside of the packaging component through the lens motor. BRIEF DESCRIPTION OF THE DRAWINGS By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0039] Figure 1 This is a schematic diagram of a common packaging component structure in the prior art of this application;

[0040] Figure 2 A schematic diagram of a specific embodiment of the packaging component structure provided by the present application;

[0041] Figure 3 A schematic diagram of another specific embodiment of the packaging component structure provided by the present application;

[0042] Figure 4 A partial schematic diagram of the connection between the circuit board and the chip in the packaging component structure provided by the present application;

[0043] Figure 5 Another partial schematic diagram of the circuit board and the chip being connected in the packaging assembly structure provided by the present application;

[0044] Figure 6 This is a schematic diagram of the structure of the circuit board using the steel screen printing solder ball process in this application;

[0045] Figure 7 This is a schematic diagram of the back structure of the circuit board in this application;

[0046] Fig. 8A It is a partial schematic diagram of the assembly process of the packaging component in this application;

[0047] Figure 8B This is a partial schematic diagram of the assembly process of the packaging component in this application, wherein: Fig. 8A and Figure 8BThe complete steps of assembling the entire package assembly are shown;

[0048] Fig. 9 A partial schematic diagram of solder balls and glue on the back of the circuit board in this application;

[0049] Fig.10 A partial schematic diagram of the ink structure on the back of the circuit board in this application;

[0050] Fig.11 This is a schematic diagram of the structure of the camera module assembled using this packaging component structure in this application. DETAILED DESCRIPTION

[0051] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0052] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present application.

[0053] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0054] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0055] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, a contact connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0056] As the most important electronic component in the camera module, the photosensitive chip can convert external light signals into electrical signals and is one of the indispensable components in the camera module. Usually, the chip is set on the upper surface of the circuit board, and the chip and the circuit board are connected by the WB (wire bonding) process to ensure the normal operation of the chip. However, with the improvement of the imaging quality requirements of the camera module, the chip size has also increased accordingly, and the size of the corresponding circuit board where the chip is set will also increase. At the same time, the stacking of the chip and the circuit board up and down results in a large height dimension, which does not conform to the current trend of the development of lightweight camera module structures.

[0057] The present application provides a chip packaging assembly 10. In order to improve the imaging quality of the camera module, the size of the chip is increased accordingly, and the size of the circuit board connected to the chip also needs to be increased. In order to reduce the size of the chip and the circuit board after packaging, the structure of the circuit board and the chip is also improved accordingly. Specifically, in the present application, the chip size is greater than / or equal to 1 / 1.7 inches, such as Figures 2 to 3 As shown, the chip 301 includes an active area 321 and an inactive area 322, wherein the active area 321 is located in the middle of the chip 301, and the inactive area 322 is located at the edge of the chip 301. The size of the circuit board 201 is larger than the size of the chip 301. Further, a corresponding through hole 213 is provided in the middle of the circuit board 201, and the size of the circuit board through hole 213 is larger than or equal to the size of the active area 321 of the chip 301, that is, the active area 321 of the chip is exposed in the through hole 213 formed in the circuit board 201, and the inactive area 322 of the chip 301 is connected to the circuit board 201.

[0058] Specifically, the circuit board 201 and the chip 301 need to be connected, and the end surface of the circuit board 201 in contact with the chip 301 is defined as the circuit board back 212, and the end surface of the circuit board 201 away from the chip 301 is defined as the circuit board front 211. In the present application, the circuit board through hole 213 passes through the circuit board front 211 and the circuit board back 212, and the circuit board pad 221 is arranged on the circuit board back 212 around the circuit board through hole 213. Among them, the circuit board pad 221 can be arranged on at least one side of the through hole 213, or according to the need for conduction, the circuit board pad 221 can be arranged on all four sides of the through hole 213, and no specific limitation is made here. Furthermore, an end surface of the chip 301 in contact with the circuit board 201 is defined as a chip front side 311, and an end surface of the chip 301 away from the circuit board 201 is defined as a chip back side 312, wherein the chip solder pad 331 is disposed on the chip front side 311, and the chip solder pad 331 is disposed in the non-effective area 322 of the chip.

[0059] When the chip 301 is arranged in the through hole 213 of the circuit board, the chip effective area 321 is exposed in the circuit board through hole 213. Further, in the part where the back side 212 of the circuit board contacts the chip ineffective area 322, the circuit board pad 221 is adapted to the chip pad 331, that is, the circuit board pad 221 on the back side 212 of the circuit board and the chip pad 331 on the front side 311 of the chip are in a one-to-one correspondence, so that the circuit board 201 and the chip 301 are connected. The direct contact between the circuit board pad 221 and the chip pad 331 cannot guarantee stable conduction between the two. In order to further ensure the stability of conduction between the chip 201 and the circuit board 301, other methods need to be adopted to ensure stable conduction between the chip 201 and the circuit board 301.

[0060] The present application also provides a method for conducting between the chip 201 and the circuit board 301, such as Figure 4 and Figure 5As shown, in a specific embodiment, when the chip 201 is arranged in the through hole 213 of the circuit board 301, the circuit board pad 221 on the back side 212 of the circuit board is in contact with the chip pad 331 on the front side 311 of the chip. In order to ensure the efficiency of the conduction between the chip 301 and the circuit board 201, materials with good conductivity such as copper, gold, etc. are preferably selected. In the present application, the gold ball 332 is preferably used to conduct the chip 301 and the circuit board 201. Specifically, the gold ball 332 is implanted on the chip pad 331, so that one end of the gold ball 332 is in contact with the chip 301, and the other end of the gold ball 332 is in contact with the circuit board pad 221, and the gold ball 332 is used as the intermediate medium for the conduction between the circuit board 201 and the chip 301, so that the chip 301 and the circuit board 201 are in conduction.

[0061] Furthermore, although the gold ball 332 has good electrical conductivity, so that the chip 301 is connected to the circuit board 201, the circuit board pad 221 is generally set to metal copper, and copper and gold are not fusible, so that the chip 301 is easy to fall off the circuit board 201. In order to achieve good conduction between the chip 301 and the circuit board 201, and the connection is stable. In the present application, a method is provided to stably conduct the chip 301 and the circuit board 201. Specifically, a SN-AU (tin-gold) compound is used for conduction, a tin ball 222 is set on the circuit board pad 221, and the gold ball 332 is implanted on the chip pad 331, so that the tin ball 222 on the circuit board 201 is in contact with the gold ball 332 on the chip 301, so as to effectively ensure the circuit conduction between the circuit board 201 and the chip 301.

[0062] Specifically, the gold ball 332 on the chip 301 is melted with the solder ball 222 on the circuit board 201, and the tin-gold compound layer 223 is formed at the position where the gold ball 332 contacts the solder ball 222. The tin-gold compound layer 223 is a compound formed by gold and tin under heating conditions, and can be bonded with the solder ball 222 on the circuit board pad 221 and the gold ball 332 on the chip pad 331 to ensure the stability of the connection between the chip 301 and the circuit board 201. In a specific embodiment, after the solder ball 222 on the circuit board pad 221 and the gold ball 332 on the chip pad 331 are melted, the chip 301 and the circuit board 201 are connected to form a conductive bonding area, and a plurality of tin-gold compound layers 223 can be formed in the conductive bonding area. An intermediate material layer is formed at the connection between the solder ball 222 and the gold ball 332 to assist the solder ball 222 and the gold ball 332 to fuse, thereby preventing the gold ball 332 and the solder ball 222 from being difficult to fuse due to different chemical properties, thereby causing the chip 301 to fall off the circuit board 201 .

[0063] Furthermore, in order to make the connection between the chip 301 and the circuit board 201 more stable, it is necessary to further increase the contact area between the gold ball 332 on the chip 301 and the solder ball 222 on the circuit board 201. The material of the chip pad 331 is generally gold, so when the gold ball 332 is implanted on the chip pad 331, the gold ball 332 and the chip pad 331 are well melted. Specifically, the gold ball 332 has a protrusion, and the direction of the protrusion is toward the direction of the circuit board pad 221, wherein the protrusion of the gold ball 332 on the chip 301 extends into the solder ball 222 of the circuit board pad 221 to increase the contact area between the solder ball 222 and the gold ball 332. In order to fuse the solder ball 222 on the circuit board with the gold ball 332 on the chip, a corresponding soldering flux is provided in the middle position where the two are in contact. Rosin can be selected as the soldering flux. Its main function is to prevent the solder ball from being oxidized when the tin powder is melted into the solder ball, so that the solder ball 222 on the circuit board pad 221 and the gold ball 332 on the chip pad 331 can be better melted, and the stability of the electrical conduction between the circuit board 201 and the chip 301 can be ensured.

[0064] In this application, if Figure 4 and Figure 5 As shown, by implanting the gold ball 332 on the chip pad 331, it is melted with the solder ball 222 set on the circuit board pad 221, but the contact area between the solder ball 222 and the gold ball 332 is limited. In the subsequent reliability process, the chip 301 is easy to fall off from the circuit board 201, which does not meet the reliability requirements. In order to further enhance the stability of the connection between the circuit board 201 and the chip 301, the gap between the solder ball 222 on the circuit board 201 and the gold ball 332 on the chip 301 is filled with glue 232 at the connection between the circuit board 201 and the chip 301. The glue 232 connects the circuit board 201 and the chip 301. In some optional embodiments, the glue 232 completely fills the gap between the conductive bonding areas where the gold ball 332 and the solder ball 222 are melted. The range of the complete filling refers to the filling range of the glue in the gap of the conductive bonding area is more than 80%. The height of the glue 232 is greater than the height of the solder ball 222, so that the solder ball 222 is covered inside the glue 232 to prevent the solder ball 222 from contacting with the outside air and thus preventing the solder ball 222 from being oxidized. The glue 232 contains flux to fully melt the solder ball 222 and the gold ball 332, and the circuit board 201 and the chip 3012 are fully in contact with the glue 232. Due to the viscosity of the glue 232 itself, the stability of the connection between the circuit board 201 and the chip 301 is enhanced.

[0065] In a specific example, if only the solder ball 222 on the circuit board 201 is melted with the gold ball 332 on the chip 301, although the chip 301 can be effectively turned on, the simulation model can measure that the thrust that the bonding area between the chip 301 and the circuit board 201 can withstand is about 0.7kg, which does not meet the reliability requirements. In the present application, by adding glue 232 to the bonding area between the chip 301 and the circuit board 201, the bonding force of the glue 232 is used to enhance the stability of the connection between the circuit board 201 and the chip 301, so that the thrust that the bonding area between the chip 301 and the circuit board 201 can withstand is increased to 2.7kg, meeting the reliability requirements of the camera module packaging component 10 design.

[0066] Furthermore, glue 232 is provided in the area where the chip 301 is bonded to the circuit board 201. The specific model of the glue 232 can be selected according to the actual design, and no corresponding restrictions are made here. The setting method of the glue 232 in the present application can adopt a glue drawing process. The glue 232 is provided around the circuit board through hole 213 and covers the circuit board pad 221, wherein the glue 232 has a glue drawing width, and the solder ball 222 is provided on the side of the midline of the glue drawing width close to the circuit board through hole 213, so that the glue 232 can cover the solder ball 222 inside. The specific glue drawing width refers to the width area when the glue 232 is applied to the circuit board 201, generally referring to the glue width in the direction extending from the circuit board through hole 213 to the outer edge of the circuit board. Specifically, due to the limited spatial position of the connection between the circuit board 201 and the chip 301, the needle diameter of the glue selected in the present application is 0.01 mm, and the width of the glue is less than or equal to 20 μm. At the same time, during the process of fixing the glue 232, if the temperature is not controlled accordingly, the glue 232 will trap air during the sudden temperature rise, resulting in insufficient bonding area between the chip 301 and the circuit board 201. Therefore, it is also necessary to control the temperature to meet the step-by-step temperature rise of the bonding, control the temperature of the hot-press bonding of the solder ball and the gold ball, and step-by-step heat rise the bonding process with the first bonding temperature and the second bonding temperature, wherein the first bonding temperature is a relatively low temperature in the temperature range of 100°C-200°C, and the heating time is relatively short, so that the glue 232 reduces bubbles and increases the bonding area between the glue 232 and the circuit board 201 and the chip 301, thereby increasing the bonding force, and the second bonding temperature range is between 200°C-300°C, and the heating time is more than 5 times the heating time of the first bonding temperature, so that the glue can fill the conductive bonding area between the chip and the circuit board, so that the glue 232 can completely cover the bonding area between the chip and the circuit board.

[0067] Specifically, the chip 301 and the circuit board 201 each have pads, especially the chip pad 331, which is relatively small (usually not clearly visible to the naked eye, but can be seen with the help of corresponding instruments). To implant the gold ball 332 on the chip pad 331, some special processes are required, such as laser ball, laser ball, steel screen printing + reflow soldering or steel screen printing, etc. Further, in the present application, the steel screen printing process can be used to implant the gold ball 332 on the chip pad 331, so that the chip 301 and the circuit board 201 are connected to ensure the normal operation of the chip 301.

[0068] Furthermore, the circuit board pad 221 also needs to be provided with a corresponding solder ball 222, and the gold ball 332 on the chip is melted with the solder ball 222 on the circuit board 201, so that the circuit board 201 and the chip 301 are connected. Since the size of the circuit board pad 221 is also small, a special process is also required to implant the solder ball 222 on the circuit board 201. Specifically, in the present application, it is necessary to provide a corresponding solder ball 222 on the circuit board pad 221, and the solder ball 222 is in contact with the circuit board pad 221 as much as possible to ensure the stability of the connection of the solder ball 222 on the circuit board 201. Preferably, in order to make the solder ball 222 have good contact on the circuit board pad 221, the steel mesh printing process is selected in the present application, that is, the printing direction of the steel mesh 90 is consistent with the arrangement direction of the circuit board pad 221, which can reduce the occurrence of tin-linking / tin-short phenomenon.

[0069] Specifically, the circuit board 201 is provided with an ink structure 231, and the ink structure 231 is respectively provided on both sides close to the circuit board through hole 213 and away from the circuit board through hole 213, wherein the ink is protrudingly provided on the circuit board pad 221 and forms a groove, and the circuit board pad 221 is at least partially accommodated in the groove. Further, in this solution, the chip 301 is fixed on the back of the circuit board 201, and in order to accurately identify the center of the circuit board 201, so that the chip 301 is accurately installed on the circuit board 201, in another feasible embodiment, a corresponding ink layer is also provided on the back 212 of the circuit board, so that the center of the circuit board 201 can be identified, so that the center of the chip 301 installed on the circuit board 201 is consistent with the center of the circuit board 201.

[0070] Specifically, in order to match the size of the circuit board 201 in the present application, as Figure 6As shown, the opening of the steel mesh 90 can be designed with a diameter of 70μm and a thickness of 30μm. In other schemes, the corresponding design can be made according to the size of the actual product, as long as it is ensured that there is no phenomenon of bridging tin / insufficient tin, etc. Among them, in order to avoid the adhesion between the solder paste and the surface of the steel mesh 90 to form a resistance effect on the connection between the solder ball 222 and the circuit board 201, affecting the transfer amount of the solder paste, the design of the steel mesh 90 needs to meet certain requirements. For example, in this application, the pores of the steel mesh 90 can be a rectangular parallelepiped structure. The specific size parameters of the steel mesh 90 can be determined according to the actual product structure, and no corresponding description is given here.

[0071] In the present application, the main material of the circuit board pad 221 is gold, and the main material of the solder ball 222 implanted on the circuit board is tin. Since tin and gold are two materials with different characteristics, the two materials will cause their performance to be unstable as the external environment changes. For example, the solder ball 222 is easily oxidized when exposed to the air for a long time. In order to improve this situation, in the present application, a flux is added to the solder paste so that the solder ball 222 and the circuit board pad 221 can be better melted. Among them, the main component of the flux is rosin, which prevents the solder ball 222 from being oxidized when the tin powder is melted into the solder ball. The flux is directly added to the solder paste, and the solder paste is melted into the solder ball 222 using a reflow soldering process. It is worth mentioning that the glue also contains flux, and the glue is applied to the circuit board pad 221 and covers the solder ball 222, so that the solder ball 222 can also be prevented from being oxidized.

[0072] Further, such as Figure 7 As shown, during the conduction between the circuit board pad 221 and the chip 301, the circuit board 201 needs to be heated, and the material of the circuit board 201 itself will deform due to the change in temperature, resulting in inaccurate center positioning of the circuit board 201 during the subsequent assembly of the circuit board 201 and the chip 301, causing deviation in the position where the chip 301 is installed on the circuit board 201, and the circuit board pad 221 and the chip pad 331 cannot be aligned one by one, resulting in unstable conduction between the circuit board 201 and the chip 301. Increasing the amount of copper used in the circuit board 201 can reduce the deformation of the circuit board 201 during the conduction process due to the relatively stable characteristics of metal copper and its small expansion and contraction under the influence of temperature, so as to improve the accuracy of the installation of the chip 301 on the circuit board 201. At the same time, increasing the copper content of the circuit board 201 can also reduce the deformation of the circuit board through hole 213.

[0073] In this application, if Figure 6 and Figure 7As shown, the tin ball 222 is mainly set on the pad 221 of the circuit board by using the steel mesh printing process. Compared with the conventional solution (there is a solder resist between each pad, and the gap of the solder resist is greater than 150μm), in order to reduce the size occupied by the circuit board 201 part, the gap between the pads 221 of the circuit board in this solution is less than 40μm, so the use of conventional printing technology will cause problems such as bridging. In this solution, the tin ball 222 is set on the pad 221 of the circuit board by the steel mesh printing process. In addition to limiting the size design of the steel mesh 90 (the specific size of the steel mesh 90 can refer to the description above), it is also necessary to set the solder resist between the pads 221 of the circuit board, wherein the width of the solder resist is greater than or equal to the width of the gap between two adjacent pads on the circuit board. Furthermore, the solder resist glue disposed between the pads 221 of the circuit board is incompatible with the solder paste itself, and the solder resist glue between the pads 221 of the circuit board can be eliminated by subsequent heating or other special processes, thereby avoiding the problem of solder joints between the pads 221 of the circuit board. The above solution can effectively reduce the area of ​​the bonding area between the chip and the circuit board, improve the bonding conduction accuracy, and meet the requirements of miniaturization of the package component 10.

[0074] In a specific example, the coverage area of ​​the solder ball 222 accounts for more than 80% of the area of ​​the circuit board pad 221, so as to increase the contact area between the solder ball 222 and the circuit board pad 221, and reduce the possibility of the solder ball 222 falling off the circuit board pad 221. It can be understood that the amount of tin set on the circuit board pad 221 and the transfer rate of the solder paste are limited by the size of the steel mesh 90. Based on this problem, the size of the circuit board pad 221 should also be restricted accordingly. Under the size of the chip 301 provided in this solution, the maximum length of the circuit board pad 221 is 75μm, and the preferred diameter of the solder ball 222 is greater than or equal to 60μm, so as to meet the melting requirements of the solder ball 222 and the circuit board pad 221. Through the above-mentioned steel screen printing process, the solder ball 222 is set on the circuit board pad 221, and the gold ball 332 is set on the chip pad 331. The gold ball 332 on the chip 301 is melted with the solder ball 222 on the circuit board 201, so as to conduct the circuit between the circuit board 201 and the chip 301.

[0075] The present application also provides a packaging component 10 structure after the chip 301 and the circuit board 201 are connected, such as Figure 3 and Figure 4As shown, the package assembly 10 further includes a molding part 501, a color filter 601 and a plurality of electronic components 401. After the circuit board 201 is electrically connected to the chip 301, a corresponding molding part 501 is arranged on the front side 211 of the circuit board and the back side 212 of the circuit board to enhance the strength of the circuit board 201. The electronic components 401 and the like can be arranged on the front side 211 of the circuit board and / or the back side 212 of the circuit board, and the electronic components 401 can be covered inside the molding part 501. The color filter 601 is arranged directly above the chip 301, wherein the color filter 601 covers the chip effective area 321 to filter out stray light. In a specific embodiment, the molding part 501 can form a color filter mounting position 531, and the color filter mounting position 531 is arranged on the upper end surface of the molding part 501, wherein when the color filter 601 is arranged on the color filter mounting position 531, the color filter 601 covers the chip effective area 321.

[0076] Furthermore, the circuit board 201 has a through hole 213 in the middle, the chip 301 is arranged on the circuit board 201 and the effective area 321 of the chip 301 corresponds to the circuit board through hole 213, wherein the circuit board pad 221 is arranged on the back side 212 of the circuit board, and the circuit board pad 221 is arranged around the circuit board through hole 213. The chip pad 331 is arranged on the chip ineffective area 322 and located on the front side 311 of the chip. When the chip 301 is arranged on the back side of the circuit board 201, the chip pad 331 corresponds to the circuit board pad 221 one by one, so that the chip 301 is connected to the circuit board 201, wherein the specific connection method between the chip 301 and the circuit board 201 has been described in detail in the previous text and will not be repeated here. In a specific embodiment, after the chip 301 is connected to the circuit board 201 , in order to ensure the stability of the overall structure, glue 232 is provided in the bonding area between the circuit board 201 and the chip 301 to prevent the chip 301 from falling off the circuit board 201 .

[0077] Specifically, in addition to the chip and the circuit board bonding area on the back side 212 of the circuit board, other areas of the back side 212 of the circuit board can be coated accordingly by using a molding process to enhance the strength of the back side 212 of the circuit board. Among them, the part of the back side 212 of the circuit board formed by the molding process can be called a circuit board back side molding part 512, and the circuit board back side molding part 512 is arranged around the circuit board through hole 213, and the circuit board back side molding part 512 has a certain size limit. Furthermore, the bottom surface of the circuit board back side molding part 512 can be arranged to be flush with the chip back side 312 to form a corresponding protective effect on the chip 301. In a specific example, there is a first mounting area 214 between the inner edge of the circuit board back molding 512 and the edge of the through hole fixed to the back 212 of the circuit board, and there is a first gap 215 between the inner edge of the circuit board back molding 512 and the outer edge of the chip 301 fixed to the back 212 of the circuit board, that is, the distance between the circuit board back molding 512 and the edge of the chip 301. At least part of the first mounting area 214 corresponding to the front 211 of the circuit board is covered by the front molding 511, so as to better provide a flat mounting surface for bonding and conduction. At the same time, the first mounting area 214 is used for applying glue, and the first gap width is ≤0.4mm. The first gap 215 is mainly used for subsequently coating glue 232 on the bonding area between the circuit board 201 and the chip 301. When the chip 301 is fixed on the circuit board 201 by a bonding method, it can better accommodate the overflowed glue 232, and also can reduce the collision or extrusion of the back molding part 512 and / or the circuit board 201 on the chip 301 during the subsequent baking or collision process of the packaging component 10.

[0078] In the present application, the molding part 501 disposed on the front side 211 of the circuit board may be referred to as the circuit board front molding part 511, and the circuit board front molding part 511 is disposed on the circuit board front side 211, wherein the electronic components 401 are arranged on the circuit board front side 211, and in a specific embodiment, the electronic components 401 may be disposed around the periphery of the circuit board through hole 213. Further, the circuit board front molding part 511 may cover the electronic components 401 inside thereof to form a corresponding protective effect on the electronic components 401, and at the same time improve the flatness of the packaging component 10. The circuit board front molding part 511 may form a color filter mounting position 531 around the circuit board through hole 213, and the color filter mounting position 531 is disposed around the circuit board through hole 213, wherein the upper surface of the color filter mounting position 531 is lower than the upper surface of the circuit board front molding part 511, that is, a step portion is formed around the circuit board through hole 213.

[0079] Further, the step portion may include a first step portion 521 and a second step portion 522. The upper surface of the first step portion 521 may be used to support components such as a motor or an optical lens, and the second step portion 522 may be used as a color filter mounting position 531, which is mainly used to mount the color filter 601. Specifically, the surface of the first step portion 521 is higher than the surface of the second step portion 522. The first step portion 521 covers the electronic component 401, and the second step portion 522 may be used as the color filter mounting position 531. The height of the second step portion 531 may be 0.1 mm. The color filter 601 is mounted on the color filter mounting position 531, so that the color filter 601 can be placed directly above the chip 301. The upper surface of the color filter 601 mounted on the color filter mounting position 531 is lower than the upper surface of the first step portion 521. In another embodiment, the upper surface of the color filter 601 mounted on the color filter mounting position 531 is flush with the upper surface of the first step portion 521. Preferably, in a specific embodiment, the upper surface of the color filter 601 can be lower than the upper surface of the first step portion 521. This arrangement can reduce the height of the packaging component 10 and also provide a corresponding protective effect on the color filter.

[0080] The packaging component 10 structure formed in this application is as follows: Figure 2 , Figure 3As shown, by setting a through hole 213 in the middle of the circuit board 201, setting the circuit board pad 221 on the back side 212 of the circuit board, setting the chip 301 on the back side 212 of the circuit board and conducting with the circuit board 201, the normal operation of the chip 301 is ensured. Further, in order to prevent the chip 301 from falling off from the back side 212 of the circuit board, glue 232 is set in the bonding area between the circuit board 201 and the chip 301, so as to increase the stability of the connection between the circuit board 201 and the chip 301. In order to enhance the strength of the overall structure after the circuit board 201 and the chip 301 are conducted, corresponding molding parts 501 are respectively set on the front side 211 of the circuit board and the back side 212 of the circuit board, and the molding part 501 covers the electronic component 401 therein, so as to form a protective effect on the electronic component 401. The electronic component 401 is arranged on the front side 211 of the circuit board, and the front side molding part 511 of the circuit board covers the electronic component 401 inside. The front side molding part 511 of the circuit board forms the color filter mounting position 531 around the through hole 213 of the circuit board, and the color filter 601 can be mounted on the color filter mounting position 531. At this time, the orthographic projection of the color filter 601 coincides with the effective area 321 on the chip 301, so as to play a corresponding filtering role on the light reaching the chip 301. The structure of the package assembly 10 formed by the above method can not only ensure the stability of the line conduction connection between the chip 301 and the circuit board 201, but also realize the miniaturization of the overall package assembly 10 structure.

[0081] The present application also provides an assembly method of the packaging assembly 10, such as Fig. 8A and Figure 8B As shown, the method comprises the following steps: a: providing a circuit board 201, on one side of which a plurality of circuit board pads 221 are provided, and at least one solder ball 222 is implanted into the circuit board pad 221; b: providing a chip 301, on which a plurality of chip pads 331 are provided, and at least one gold ball 332 is implanted into the chip pad 331; c: applying glue 232 onto the solder ball 222 of the circuit board pad 221; d: placing the chip pad 331 in correspondence with the circuit board pad 221, bonding and fixing the solder ball 222 of the circuit board pad 221 and the gold ball 332 of the chip pad 331, so as to conduct the circuit board 201 and the chip 301. Among them, step b and step c are not in order, that is, step b can be performed first and then step c, or step c can be performed first and then step c, or step b and step c can be performed simultaneously.

[0082] It can be understood that, in some embodiments, after a plurality of solder balls 222 are implanted into the circuit board pad 221, glue 232 is first applied to the solder balls 222, and then the gold balls 332 are implanted into the chip pad 331, and then the chip pad 331 is aligned with the circuit board pad 221, and the solder balls 222 and the gold balls 332 are bonded and fixed to conduct the circuit board 201 and the chip 301. In other embodiments, after a plurality of solder balls 222 are implanted into the circuit board pad 221, the gold balls 332 are first implanted into the chip pad 331, and then glue 232 is applied to the solder balls 222, and then the chip pad 331 is aligned with the circuit board pad 221, and the solder balls 222 and the gold balls 332 are bonded and fixed to conduct the circuit board 201 and the chip 301. In other embodiments, the gold ball 332 is implanted into the chip pad 331 and the glue 232 is applied to the solder ball 222 simultaneously, and / or the gold ball 332 is implanted into the chip pad 331 and the solder ball 222 is implanted into the circuit board pad 221 simultaneously, and then the chip pad 331 and the circuit board pad 221 are aligned, and the solder ball 222 and the gold ball 332 are bonded and fixed to connect the circuit board 201 and the chip 301, thereby shortening the working time and improving the assembly efficiency.

[0083] In particular, in the embodiment of the present application, the glue 232 in step c contains flux, the glue 232 is applied to the circuit board pad 221 and covers the solder ball 222, the solder ball 222 is encapsulated in the glue 232, the flux in the glue 232 can prevent the solder ball 222 from being oxidized due to long-term exposure to the air, and is conducive to the melting of the solder ball 222 and the gold ball 332.

[0084] Further, such as Fig. 9 As shown, step c specifically includes the steps of: eccentrically applying the glue 232 to the circuit board pad 221 through a glue painting process, so that the solder ball 222 is located on the side of the center line of the glue painting width close to the center of the circuit board 201, and when the circuit board 201 and the chip 301 are assembled, the glue 232 is squeezed and overflows. Since the glue painting center line of the glue 232 is closer to the outside of the circuit board 201 than the solder ball 222, combined with the ink 231 arranged on the side close to the through hole 213 of the circuit board, the risk of the glue 232 overflowing and contaminating the effective area 321 of the chip 301 is reduced, and the glue 232 is caused to overflow to the outside of the chip 301. It is worth mentioning that the thickness of the glue 232 is greater than the height of the solder ball 222, so that the glue 232 covers the solder ball 222 inside, thereby preventing the solder ball 222 from oxidizing, which is beneficial for the solder ball 222 to bond with the gold ball 332 to form a tin-gold compound 223, thereby conducting the circuit board 201 and the chip 301.

[0085] Further, the step d specifically includes the steps of: fixing the solder ball 222 of the circuit board pad 221 and the gold ball 332 of the chip pad 331 by means of thermocompression bonding, so that at least one of the solder balls 222 and at least one of the gold balls 332 are melted to form a conductive bonding area, and at the same time, the glue 232 is filled in the gap of the conductive bonding area, so as to bond the circuit board 201 and the chip 301, increase the ability of the package component 10 to withstand external forces, reduce the risk of the chip 301 falling off, and improve the reliability of the package component 10. It is understandable that the flux in the glue 232 helps the solder ball 222 and the gold ball 332 to melt, and prevents the solder ball 222 from oxidizing, so as to improve the conductivity of the circuit board 201 and the chip 301. It is worth mentioning that during the thermocompression bonding process, the glue 232 can reduce the fluidity of the tin, which helps to avoid the phenomenon of bridging.

[0086] In particular, the temperature of the hot-press bonding of the solder ball 222 and the gold ball 332 is controlled, and the bonding process is stepped up with the first bonding temperature and the second bonding temperature, wherein the first bonding temperature is used for a relatively short time, and the second bonding temperature heating time is more than 5 times the first bonding temperature heating time. Specifically, the first bonding temperature is 100-200°C, and the duration is no more than 1s, so as to reduce the generation of bubbles in the glue 232, increase the bonding area of ​​the glue 232 with the circuit board 201 and the chip 301, so that the glue 232 fills the conductive bonding area between the chip 301 and the circuit board 201 to increase the bonding force, and the second bonding temperature is 200°C-300°C, and the duration is 5s-30s, so as to strengthen the curing of the glue 232, so as to reliably bond the circuit board 201 and the chip 301, and improve the reliability of the package component 10.

[0087] Furthermore, step d specifically includes: forming a protrusion on the gold ball 332 of the chip pad 331, aligning it with the solder ball 222 of the circuit board pad 221, and extending the protrusion of the gold ball 332 into the solder ball 222 of the circuit board pad 221 to increase the contact area between the solder ball 222 and the gold ball 332, improve the reaction rate of the solder ball 222, so that the solder ball 222 and the gold ball 332 are reliably bonded, and the conductivity between the circuit board 201 and the chip 301 is improved.

[0088] In particular, step a specifically includes the steps of: depositing solder paste on the circuit board pad 221 by means of stencil printing, that is, making the printing direction of the stencil 90 consistent with the arrangement direction of the circuit board pad 221, thereby reducing the phenomenon of bridging tin and insufficient tin. Forming the solder paste into the solder ball 222 by means of reflow soldering and implanting it into the circuit board pad 221, thereby preventing the solder ball 222 from being oxidized and reducing the bending and deformation of the circuit board 201.

[0089] Specifically, Fig.10 As shown, the step a specifically includes: protrudingly setting the ink structure 231 on the circuit board 201 and forming a groove, so that the circuit board pad 221 is at least partially accommodated in the groove, and the solder ball 222 covers at least 80% of the area of ​​the circuit board pad, so that the solder ball 222 is accommodated in the groove formed by the ink structure 231 on the circuit board 201. Among them, the ink structure 231 is set on both sides of the circuit board pad 221 close to the circuit board through hole 213 and away from the circuit board through hole 213. It can be understood that the steel mesh 90 is set on the circuit board 201, and the ink structure 231 is located between the steel mesh 90 and the circuit board 201, so that there is a gap between the steel mesh 90 and the circuit board 201. The thickness of the ink structure 231 is less than 15μm, so as to prevent the solder ball 222 from overflowing from the gap between the steel mesh 90 and the circuit board 201 to avoid solder joints.

[0090] Furthermore, the step a also includes step a1: integrally forming a circuit board front molding part 511 on the front of the circuit board 201, the circuit board front molding part 511 covers the electronic components 401 arranged on the front of the circuit board 211, which is conducive to improving the flatness of the package assembly 10, and integrally forming a circuit board back molding part 512 on the back of the circuit board 201, so that the circuit board back molding part 512 is arranged on the outside of the circuit board pad 221, so as to provide the middle position of the back of the circuit board 212 for installing the chip 301. It is worth mentioning that, compared with molding the circuit board front molding part 511 and the circuit board back molding part 512 at the same time, molding the circuit board front molding part 511 and the circuit board back molding part 512 separately is conducive to reducing the difficulty of molding, avoiding defects such as under-injection in the molding flow channel cavity, and improving the flatness of the package assembly 10.

[0091] The step a also includes step a2: a through hole 213 is formed on the circuit board 201, the through hole 213 runs through the central area of ​​the circuit board 201, and the front molding part 511 of the circuit board is arranged in an annular manner around the through hole. It can be understood that the size of the through hole 213 is larger than the size of the effective area 321 of the chip 301, so that the effective area 321 is completely exposed in the through hole 213, and the farther the inner edge of the through hole 213 is from the effective area 321 of the chip 301, the more conducive it is to reduce the risk of stray light and improve the imaging quality. Preferably, the through hole 213 is formed on the circuit board 201 by laser cutting, and ultrasonic cleaning is performed before bonding to reduce the cutting dust remaining in the through hole 213.

[0092] Furthermore, the assembly method of the packaging component 10 further includes step e: installing the color filter 601 on the color filter installation position 531 on the front molding portion 511 of the circuit board to filter out stray light and improve imaging quality.

[0093] The present application also provides an anti-shake camera module 1 assembled using the packaging component 10 structure, such as Fig.11 As shown, specifically, the anti-shake camera module 1 includes a packaging component 10, a chip driver, an optical lens 80, etc. Specifically, the chip driver is arranged on the packaging component 10, and the optical lens 80 is arranged just above the packaging component 10, and the external light reaches the packaging component 10 through the optical lens 80. Further, the packaging component 10 structure in the present application, due to the combination of the front molding part 511 and the back molding part 512, can bond the chip 301 to the circuit board 201 through a molding process, effectively reducing the volume and weight of the packaging component 10. Specifically, the weight of the packaging component 10 in the present application can be controlled at about 0.266g. Compared with the conventional COB (chip of board) packaging method, the weight of the packaging component 10 can be reduced by about 13%. Under the existing camera module size, the driving force provided by the chip driver remains unchanged, so that the camera module 1 using the packaging component 10 structure can significantly improve the adjustable stroke of the chip 301. With the current trend of miniaturization of camera modules, the packaging component 10 structure provided in this solution can not only meet the requirements of large chip movement range, but also has certain advantages in the miniaturization of the overall structure. It is a commonly selected chip anti-shake direction in the industry.

[0094] Furthermore, if Fig.11As shown, the camera module 1 may also include a lens motor 70, which is arranged on the optical lens 80, wherein the lens motor 70 is mainly used to drive the optical lens 80 to move, wherein the lens motor 70 can drive the optical lens 80 to move along the direction of the optical axis, that is, the Z-axis direction, to achieve focusing during the shooting process of the camera module 1. In a specific embodiment, the chip driver can drive the chip 301 to move in the plane perpendicular to the optical axis, that is, in the X / Y direction, and the lens motor 70 can drive the optical lens 80 to move along the Z-axis direction (that is, the direction of the optical axis). Through the mutual cooperation of the optical lens 80 and the chip 301, the imaging quality of the camera module 1 can be effectively improved. In another specific embodiment, the lens motor 70 can drive the optical lens 80 to move along the direction of the optical axis, that is, the Z-axis direction, and can also drive the optical lens 80 to move in the plane perpendicular to the optical axis, that is, the X / Y direction, wherein the chip driver can also drive the chip 301 to move along the X / Y direction, and the optical lens 80 and the chip 301 cooperate with each other to achieve anti-shake of a larger stroke of the camera module 1.

[0095] Specifically, the lens motor 70 in the camera module 1 can select a shrapnel structure, and the optical lens 80 is arranged inside the lens motor 70 to drive the optical lens 80 to move. In a specific embodiment, the lens motor 70 may include structures such as a magnet 70374, a coil 703, a shrapnel, a lens carrier 702 and a base 705, wherein the optical lens 80 is fixed on the lens carrier 702, the coil 703 structure is fixed on the lens carrier 702, the magnet 704 is arranged around the coil 703, and the shrapnel is arranged between the base 705 and the lens carrier 702. Further, the lens motor 70 also includes a motor housing 701, and the motor housing 701 covers the other components constituting the lens motor 70 inside, so as to form a corresponding protective effect on the components of the lens motor 70. In order to better utilize the internal space of the lens motor 70 , the magnet 704 can be disposed inside the motor housing 701 and around the coil 703 on the lens carrier 702 , so that the magnet 704 and the coil 703 can be better matched.

[0096] Further, such as Fig.11As shown, the packaging component 10 structure provided in the present application can be arranged on the lower surface of the base 705 of the lens motor 70, wherein the lower surface of the base 705 of the lens motor 70 is fixed to the upper surface of the packaging component 10 in the present application. Specifically, the upper surface of the packaging component 10 is located on the first step portion 521 of the front molding part 511, and the front molding part 511 adopts a molding process so that its upper surface maintains a certain flatness, which is conducive to fixing the first step portion 521 of the front molding part 511 and the base 705 of the lens motor 70 together. For example, glue bonding or other fixing methods can be used to fix the lens motor 70 to the packaging component 10, and the motor housing 701 covers the outside of the packaging component 10 to play a corresponding protective role on the packaging component 10. The packaging component 10 structure adopted in this solution has the advantages of miniaturization and lightness. Setting it at the bottom of the lens motor 70 can significantly reduce the height of the camera module 1 and meet the requirements of miniaturization of the camera module 1.

[0097] like Fig.11 As shown, specifically, the camera module 1 provided in the present application and provided with the packaging component 10 structure has the optical axis of the optical lens 80 provided on the lens motor 70 consistent with the center of the chip 301 on the packaging component 10 structure, so that the chip 301 can receive the light entering the optical lens 80. During the imaging process of the camera module 1, according to a pre-set program, the lens motor 70 can drive the optical lens 80 to perform position correction, so that as much light as possible passing through the optical lens 80 reaches the chip 301 of the packaging component 10. Further, by using the packaging component 10 structure provided in the present solution, the size of the chip 301 can be increased to about 1 / 1.7 inches. By using the packaging method and the conduction method provided above, while improving the imaging quality of the camera module, the miniaturization of its overall structure can be effectively guaranteed, which caters to the trend of miniaturization of camera modules.

[0098] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.

Claims

1. A packaging component, comprising a circuit board and a chip, wherein the circuit board has a through hole, and the chip is arranged corresponding to the through hole of the circuit board, characterized in that: The circuit board has a plurality of circuit board pads, at least one solder ball is arranged on each of the circuit board pads, the chip has a plurality of chip pads, at least one gold ball is arranged on the chip pad, the chip pad corresponds to the circuit board pad, and at least one gold ball is melted with at least one solder ball to form a conductive bonding area to conduct the circuit board and the chip; There are gaps between the conductive bonding areas where the plurality of gold balls are melted with the solder balls, and the gaps are filled with glue.

2. The packaging assembly according to claim 1, characterized in that: The glue contains flux and covers the solder balls.

3. The packaging assembly according to claim 2, characterized in that: The glue connects the circuit board and the chip and completely fills the gaps between the conductive bonding areas where the gold balls are melted with the solder balls.

4. The packaging assembly according to claim 2, characterized in that: The glue is arranged around the through hole of the circuit board and covers the pad of the circuit board, wherein the glue has a glue width, and the solder ball is arranged on the side of the midline of the glue width close to the through hole of the circuit board, so that the glue can cover the solder ball inside.

5. The packaging assembly according to claim 4, characterized in that: The glue thickness is greater than the solder ball height, and the glue thickness is greater than or equal to 20 μm.

6. The packaging assembly according to claim 1, characterized in that: An ink structure is provided on the circuit board, and the ink is respectively provided on both sides close to and away from the circuit board through hole, wherein the ink is protrudingly provided on the circuit board pad and forms a groove, and the circuit board pad is at least partially accommodated in the groove.

7. The packaging assembly according to claim 6, characterized in that: The solder ball is arranged on the pad of the circuit board, and the solder ball covers at least 80% of the area of ​​the pad of the circuit board, so that the solder ball is accommodated in the groove formed by the ink structure.

8. The packaging assembly according to claim 1, characterized in that: The gold ball on the chip pad has a protrusion, wherein the protrusion extends into the interior of the solder ball on the circuit board pad to increase the contact area between the solder ball and the gold ball.

9. The packaging assembly according to claim 8, characterized in that: The circuit board pads are arranged corresponding to the chip pads, wherein the center distance between at least some adjacent circuit board pads is less than 150 μm.

10. The packaging assembly according to claim 1, characterized in that: The package body also has a molding part, which is integrally formed on the circuit board, wherein the molding part includes a front molding part and a back molding part formed on the front and back sides of the circuit board.

11. The packaging assembly according to claim 10, characterized in that: The back molding part is disposed on the back side of the circuit board, and the back molding part can be used to strengthen the strength of the circuit board, wherein the lower surface of the back molding part is lower than the back side of the chip.

12. The packaging assembly according to claim 11, characterized in that: The front molding part is arranged in a ring shape around the through hole of the circuit board, and the front side of the circuit board provided with the circuit board pad is covered by the front molding part.

13. A camera module, characterized in that: include: Lens motor; and According to any one of claims 1-12, the lens motor is arranged on the upper surface of the packaging component so that external light can reach the inside of the packaging component through the lens motor.

Images