Photovoltaic module with lead-out pins of embedded diode of BIPV (building integrated photovoltaics)

Abstract

The invention discloses a BIPV (building integrated photovoltaics) embedded diode pin led-out photovoltaic module. A mounting cavity is formed in a main body; the pin pieces are symmetrically arranged on the two sides of the main body; the connecting part is arranged in the mounting cavity and is provided with four connecting ends; and the diode is arranged in the mounting cavity and is connected with the four connecting ends of the connecting part. The hot spot effect is solved by installing the diode in the main body and installing the external pin piece on the circuit board, so that the service life and reliability of each component are improved; a bus bar is replaced by a pin piece, the resistance of the bus bar is reduced, the cost of an assembly end is reduced, a sealing piece is arranged between the pin piece and a circuit mainboard to prevent dust and water from entering and influencing a diode, a space exists between the main body and the circuit mainboard to form an air channel, heat dissipation of the main body and the diode is facilitated, and the service life of the main body is prolonged. The cooling piece is additionally arranged at the bottom of the body, and the heat dissipation efficiency is further improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of photovoltaic power generation devices, and in particular relates to a photovoltaic module with BIPV embedded diode pins. Background Art

[0002] Photovoltaic power generation devices are usually composed of several photovoltaic modules. Photovoltaic modules are composed of photovoltaic power generation units (cells) connected in series according to the required voltage, and photovoltaic power generation units are composed of photovoltaic power generation units (cells) connected in series. Figure 1 As shown, 10 represents a photovoltaic power generation unit group, and 16 represents a photovoltaic power generation unit.

[0003] When photovoltaic panels receive solar energy, if some photovoltaic power generation units are deprived of solar energy or are damaged, they will experience high power consumption ("hot spots"), damaging the photovoltaic units and causing power generation failures. Therefore, photovoltaic panels require photovoltaic bypass diode circuits to protect the panels and maintain normal operation of the photovoltaic power generation system.

[0004] With the development of renewable energy, building-integrated photovoltaics (BIPV) is gaining increasing attention. BIPV integrates photovoltaic power generation systems with buildings, enabling both energy self-sufficiency and reduced reliance on traditional energy sources. However, current BIPV modules have some issues during use, such as improper diode lead-out, which can easily damage the diodes and affect the performance and reliability of the modules.

[0005] Therefore, how to design a photovoltaic diode structure that can prevent the entry of foreign matter such as moisture and dust and has excellent heat dissipation has become the direction of efforts of those skilled in the art. Summary of the Invention

[0006] The present invention aims to provide a photovoltaic module with BIPV embedded diode pins to solve the above-mentioned technical problems.

[0007] In order to solve the above technical problems, the specific technical solutions of the present invention are as follows:

[0008] In some embodiments of the present application, a photovoltaic module with a BIPV embedded diode lead-out is provided, comprising:

[0009] A main body, wherein a mounting cavity is provided inside the main body;

[0010] Pin members, which are symmetrically arranged on both sides of the main body and are fixedly connected to the main body;

[0011] A connecting component is provided in the mounting cavity and has four connecting ends, each of which is electrically connected to the pin components;

[0012] The diode is arranged in the installation cavity and connected to the four connection ends of the connection component.

[0013] In some embodiments of the present application, the end of the pin is arranged at a lead-out hole on the circuit main board, and is fixedly connected to the circuit main board.

[0014] In some embodiments of the present application, a sealing member is provided at the lead hole between the pin member and the circuit main board.

[0015] In some embodiments of the present application, the main body and the circuit main board are arranged in parallel, and there is a distance between them.

[0016] In some embodiments of the present application, a cooling element is provided on the back of the main body.

[0017] Compared with the prior art, the beneficial effects of the present invention are that the hot spot effect is solved by installing the diode inside the main body and installing it on the circuit board with external pins, thereby improving the service life and reliability of each component; and the bus bar is replaced by a pin, which reduces the bus bar resistance and reduces the cost problem on the component end; and a seal is provided between the pin and the circuit board to prevent dust and moisture from entering and affecting the diode; and a distance is provided between the main body and the circuit board to form an air duct, which facilitates heat dissipation of the main body and the diode, and a cooling part is added at the bottom of the main body to further enhance the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0019] Figure 1 A schematic diagram of the overall installation structure provided by an embodiment of the present invention;

[0020] Figure 2 A schematic diagram of the main body installation structure provided by an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the internal structure of the main body provided in an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the side structure of the main body installation provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0024] In order to better understand the purpose, structure and function of the present invention, the present invention is further described in detail below with reference to the accompanying drawings.

[0025] See attached Figure 1-4 As shown, according to some embodiments of the present application, the following are included:

[0026] The main body 1 is a box structure, and its material is selected according to actual needs. There is no restriction here, but the material with strong thermal conductivity should be selected. The main body 1 is provided with an installation cavity;

[0027] The pins 2 are metal strips that replace the busbars. They are symmetrically arranged on both sides of the main body 1 and are fixedly connected to the main body 1. In other words, the pins 2 penetrate the main body 1 and enter the installation cavity. A sealant, such as a sealant or a sealing ring, is provided at the junction of the two to improve the stability of the connection and prevent moisture and dust from entering the installation cavity.

[0028] The connecting component 3 is a connecting circuit, which is arranged in the mounting cavity and has four connecting ends 301, and the connecting ends 301 are respectively electrically connected to the pin components 2;

[0029] The diode 4 is arranged in the installation cavity and is connected to the four connection ends 301 of the connecting component 3. In other words, the diode 4 is arranged in the installation cavity by insertion and achieves the effect of circuit connection through the connecting component 3 and the pin component 2.

[0030] The end of the pin part 2 is provided at the lead-out hole on the circuit main board 5, and is fixedly connected to the circuit main board 5. In other words, a sealing part such as (sealant, sealing ring or welding) is provided at the lead-out hole between the pin part 2 and the circuit main board 5.

[0031] In order to improve the heat dissipation effect, the main body 1 and the circuit main board 5 are arranged in parallel with each other, and there is a distance between them, so that an air duct is formed between the main body 1 and the circuit main board 5, which is convenient for dissipating the heat of the main body 1 through external wind equipment or natural wind, thereby reducing the formation of hot spot effect.

[0032] In some embodiments of the present application, in order to further improve the heat dissipation effect, a cooling element is provided on the back of the main body 1. The cooling element is a mechanical structure and adopts a physical cooling method. For example, rectangular raised strips arranged in a matrix are provided on the back of the main body 1. There is a gap between adjacent raised strips. The raised strips are made of a material with good heat dissipation effect, preferably aluminum, and the heat dissipation effect of the main body 1 is accelerated by the raised strips.

[0033] Through the above technical solution, the technical effects produced in the embodiments of the present application are:

[0034] 1. The diode 4 is embedded in the module board to overcome the hot spot effect and improve the service life and reliability of the module. In addition, the bus bar is replaced by a pin to reduce the bus bar resistance and reduce the cost of the module.

[0035] 2. No need to bin components, greatly improving the efficiency of component factories and reducing labor and space costs; reducing battery gears and reducing machine, packaging and labor costs;

[0036] 3. Solve the impact of current mismatch between components on power generation caused by different battery attenuation;

[0037] 4. Diode 4 is used to protect solar panels from being damaged by reverse current at night or on cloudy days.

[0038] 5. When the solar panel is working normally, diode 4 is in the forward conduction state, and current can flow from the solar panel to the load circuit.

[0039] 6. When the solar panel is in a reverse voltage state, diode 4 will become a reverse blocking state, thereby preventing the flow of reverse current.

[0040] 7. During the service life, the power generation of the modules shall be maximized despite the annual attenuation; the maximum power output of the modules shall be ensured in the presence of shadows, foreign objects, dust, sunlight from different angles, etc. without affecting the power generation efficiency of the entire photovoltaic system;

[0041] 8. As a BIPV structure, it is installed on the facades of the house and other surfaces at different angles to ensure the power generation of the photovoltaic power station.

[0042] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0043] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout this application, unless otherwise specified, "plurality" means two or more.

[0044] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0045] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Reference can be made to the common and similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and the relevant parts can be referred to the method description.

[0046] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A photovoltaic module with BIPV embedded diode pins, characterized in that: include: A main body, wherein a mounting cavity is provided inside the main body; Pin members, which are symmetrically arranged on both sides of the main body and are fixedly connected to the main body; A connecting component is disposed in the mounting cavity and has four connecting ends, and the connecting ends are respectively connected to the pin components for electrical signal connection; The diode is arranged in the mounting cavity and connected to the four connecting ends of the connecting component.

2. A photovoltaic module with BIPV embedded diode pins according to claim 1, characterized in that: The end of the pin is arranged at the lead-out hole on the circuit main board, and is fixedly connected to the circuit main board.

3. A photovoltaic module with BIPV embedded diode pins according to claim 2, characterized in that: A sealing member is provided at the lead-out hole between the pin member and the circuit main board.

4. A photovoltaic module with BIPV embedded diode pins according to claim 1, characterized in that: The main body and the circuit main board are arranged in parallel, and there is a distance between them.

5. A photovoltaic module with BIPV embedded diode pins according to claim 4, characterized in that: A cooling element is arranged on the back of the main body.

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