Laser device

Abstract

A laser device according to various embodiments includes: a housing; an inlet valve disposed in a first direction of the housing and configured to flow cooling water; an outlet valve disposed in a second direction of the housing and configured to discharge cooling water; a laser output unit which is accommodated in the housing and is configured so as to apply a power supply to output a laser beam; and a cooling structure for cooling the laser output unit, the cooling structure may include: a support member for accommodating the laser output unit therein; and a flow path that is formed on the surface of the support member so as to face the inside direction of the support member and that provides a path through which the cooling water flows.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate to a laser device, and more particularly to a laser device including a cooling structure of a microchannel. Background Art

[0002] The cooling of the laser medium is related to the laser quality, and therefore, the cooling efficiency of the laser medium can play an important role in determining the laser quality. Generally speaking, the laser medium is surrounded by a thick shell, and a cooling water channel is arranged on the upper part of the shell.

[0003] In this case, utilizing indirect cooling through the housing not only reduces cooling efficiency, but also causes a concern that the flow of cooling water flowing in the channel may cause vibrations to the device. Summary of the invention

[0004] [Problems to be solved by the invention]

[0005] The problem to be solved in the present disclosure is to improve the cooling efficiency of the laser medium by direct cooling and to suppress the vibration of the laser device.

[0006] [Technical means to solve the problem]

[0007] According to various embodiments, a laser device may be provided, in which a laser device (e.g. Figure 1 The laser device 100 includes: a housing (for example: Figure 2 The second housing 107); an inlet valve (for example: Figure 2 The inlet 103 is arranged in the first direction of the housing and flows into the cooling water; an outlet valve (for example: Figure 2 The outlet 105 is arranged in the second direction of the housing and discharges cooling water; the laser output part (for example: Figure 2 The laser output unit 110 is contained in the housing and is configured to output a laser beam by applying power; and a cooling structure (for example: Figure 2 A cooling structure 200) is used to cool the laser output part, and the cooling structure includes: a supporting member (for example: Figure 2 a support member 201) for accommodating the laser output unit internally; and a flow path formed on the surface of the support member in a manner toward the inner side of the support member and for providing a path for the cooling water to flow.

[0008] According to various embodiments, a laser device may be provided, in which a laser device (e.g. Figure 5 The laser device 300 includes: a housing (for example: Figure 5The second housing 307); inlet valve (for example: Figure 5 The inlet 303 is arranged in the first direction of the housing and flows into the cooling water; the outlet valve (for example: Figure 5 The outlet 305 is arranged in the second direction of the housing and discharges cooling water; the laser output part (for example: Figure 5 The laser output unit 310 is contained in the housing and is configured to output a laser beam when a power source is applied; and a cooling structure (for example: Figure 5 A cooling structure 400) is used to cool the laser output part, and the cooling structure includes: a supporting member (for example: Figure 5 A support member 401) for accommodating the laser output unit inside; and a flow path area (for example: Figure 6 A flow path area 410) is provided in the support component and provides a fluid movement path for the cooling water, and the flow path area includes a first flow path area provided near the inlet valve (for example: Figure 6 The first flow path area 410a) and the second flow path area provided near the outlet valve (for example: Figure 6 of the second flow path region 410b).

[0009] [Effects of the Invention]

[0010] According to the present disclosure, by using a support member having microchannels (supporting the laser active medium), it is possible not only to directly cool the laser active medium using cooling water but also to suppress vibration caused by flow velocity using the microchannels. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is an implementation example of a laser device according to various embodiments.

[0012] Figure 2 is a cross-sectional view of a laser device according to various embodiments.

[0013] Figure 3 are diagrams illustrating a cooling structure according to various embodiments.

[0014] Figure 4 are diagrams showing cooling structures according to various embodiments from other angles.

[0015] Figure 5 is a cross-sectional view of a laser device according to a second embodiment.

[0016] Figure 6 is a diagram showing a cooling structure according to a second embodiment.

[0017] Figure 7 It is a diagram showing the cooling structure according to the second embodiment from another angle.

[0018] Figure 8 is a cross-sectional view of the cooling structure according to the second embodiment with respect to the XZ plane.

[0019] Fig. 9 is a diagram showing a part of the cooling process of the cooling structure according to the second embodiment.

[0020] Fig.10 is a diagram showing another part of the cooling process of the cooling structure according to the second embodiment.

[0021] Fig.11 2 is a diagram showing still another part of the cooling process of the cooling structure according to the second embodiment.

[0022] [Explanation of Symbols]

[0023] 100, 300: laser device;

[0024] 101, 301: first shell;

[0025] 103, 303: entrance;

[0026] 103a, 303a: first input area;

[0027] 103b: second input area;

[0028] 105, 305: export;

[0029] 105a: first discharge area;

[0030] 105b: second discharge area;

[0031] 107, 307: second housing;

[0032] 108, 308: cavity;

[0033] 108a, 308a: first cavity;

[0034] 108b, 308b: second cavity;

[0035] 110, 310: laser output unit;

[0036] 200, 400: cooling structure;

[0037] 201, 401: supporting parts;

[0038] 202: Flow path part;

[0039] 202a: First flow path department;

[0040] 202b: second flow path portion;

[0041] 211: partition wall portion;

[0042] 211a: first partition wall portion;

[0043] 211b: second partition wall portion;

[0044] 211c: third partition wall portion;

[0045] 212: Channel Department;

[0046] 212a: first channel portion;

[0047] 212b: second channel portion;

[0048] 212c: third channel portion;

[0049] 213, 442: support part;

[0050] 220: connection part;

[0051] 221: first connecting portion;

[0052] 222: second connecting portion;

[0053] 224: injection hole / injection opening;

[0054] 224a: first injection hole;

[0055] 224b: second injection hole;

[0056] 410: Flow path area;

[0057] 410a: first flow path region;

[0058] 410b: second flow path region;

[0059] 410c: third flow path region;

[0060] 411: Opening;

[0061] 411a: first opening / opening;

[0062] 411b: second opening / opening;

[0063] 411c: third opening / opening;

[0064] 412: First containment unit;

[0065] 413: Surface;

[0066] 414: Second storage unit;

[0067] 415a: entrance opening;

[0068] 415b: exit opening;

[0069] 417: discharge opening;

[0070] 431: partition;

[0071] 441: Installation department;

[0072] 441a: Installation area;

[0073] A-A': section;

[0074] X, Y, Z: axis directions;

[0075] w: cooling water. DETAILED DESCRIPTION

[0076] The above-mentioned objects, features and advantages of the present invention will become more apparent through the following detailed description related to the accompanying drawings. However, the present invention can be modified in various ways and can have various embodiments. Specific embodiments will be illustrated in the accompanying drawings and described in detail below.

[0077] In the drawings, for the sake of clarity, the thickness of the layers and regions is exaggerated. In addition, the situation where a constituent element or layer is "on" or "over" another constituent element or layer includes not only being directly above another constituent element or layer, but also including the situation where other layers or other constituent elements are interposed in between. Throughout the entire specification, the same reference numerals represent the same constituent elements in principle. In addition, constituent elements with the same function within the same concept and scope appearing in the drawings of each embodiment are described using the same reference numerals.

[0078] If it is determined that the specific description of the known functions or components related to the present invention may make the gist of the present invention unnecessarily unclear, the detailed description will be omitted. In addition, the numbers (such as first, second, etc.) used in the description of this specification are only identification marks used to distinguish one component from another component.

[0079] In addition, the suffixes "region", "part" and "section" of the components used in the following description are given or used interchangeably for the sake of ease of writing the description, and do not have different meanings or functions from each other.

[0080] The present disclosure relates to a cooling structure according to various embodiments and a laser device using the cooling structure.

[0081] The cooling structure described in the present disclosure may use a water-cooling method using cooling water. In the following various embodiments, the water-cooling cooling structure includes a flow path provided inside the laser device and through which cooling water can flow. The flow path provided in the water-cooling cooling structure may be a micro channel having a fine structure.

[0082] Figure 1 is an implementation example of a laser device according to various embodiments.

[0083] Reference Figure 1 According to various embodiments, the laser device 100 may include all or part of a first housing 101 , an inlet 103 , and an outlet 105 .

[0084] According to various embodiments, the laser device 100 may generate and output a laser beam. In one embodiment, the laser device 100 may refer to a laser device used for a semiconductor process and / or a marking process of a general material. This is not limited thereto, and various types of laser devices 100 may be applicable to the present disclosure.

[0085] In one embodiment, the laser device 100 may include a laser output portion 110 for irradiating a laser beam to the outside of the first housing 101. The laser output portion 110 is arranged in the first housing 101, and a power source may be applied to generate and output a laser beam. The laser output portion 110 may be exposed to the outside of the first housing 101. For example, the laser output portion 110 may include a laser source (e.g., a laser active medium). The laser active medium may use a neodymium doped-Yttrium Aluminum Garnet laser (Nd: YAG laser), an erbium yttrium aluminum garnet laser (Er: YAG laser) and / or an ytterbium yttrium aluminum garnet laser (Yb: YAG laser), etc., but is not limited thereto, and various laser active media may be used. In various embodiments, the laser output portion 110 may be provided in a rod shape.

[0086] According to various embodiments, the laser device 100 may include an inlet 103 and an outlet 105. The inlet 103 and the outlet 105 may be arranged symmetrically with respect to the laser output portion 110 on the outer surface of the first housing 101. In one embodiment, the inlet 103 may be arranged vertically above the ground, and the outlet 105 may be arranged vertically below the ground.

[0087] In one embodiment, the inlet 103 and the outlet 105 may be arranged in opposite manners relative to the horizontal axis (e.g., the Y-axis direction and / or the X-axis direction). For example, the inlet 103 may be arranged in a manner inclined toward a first horizontal direction (e.g., the +Y-axis direction), while the outlet 105 is arranged in a manner inclined toward a second horizontal direction (e.g., the -Y-axis direction). It should be understood that similar descriptions may also be applicable to the X-axis direction.

[0088] In a certain embodiment, the inlet 103 and the outlet 105 may be arranged in a manner that is tilted in the same direction relative to the horizontal axis (e.g., the Y-axis direction and / or the X-axis direction). For example, the inlet 103 and the outlet 105 may be arranged in a manner that is symmetrical with respect to the laser output portion 110, and at the same or substantially corresponding positions relative to the first horizontal direction (e.g., the +Y-axis direction). Specifically, the inlet 103 may be arranged at the upper portion of the first horizontal direction side (+Y and +Z directions), and the outlet 105 may be arranged at the lower portion of the first horizontal direction side (+Y and -Z directions). Similarly, it should be understood that the inlet 103 and the outlet 105 may also be arranged in a manner that is tilted in the second horizontal direction (-Y-axis direction).

[0089] In a certain embodiment, the inlet 103 and the outlet 105 may be arranged at positions corresponding to each other with respect to a horizontal axis (e.g., Y-axis direction and / or X-axis direction). For example, the inlet 103 and the outlet 105 may be arranged symmetrically with respect to a vertical direction (Z-axis direction), and at the same position with respect to a horizontal direction (Y-axis direction and / or X-axis direction). In other words, when the laser device 100 is observed in a direction parallel to the vertical upper direction (+Z-axis direction) and / or the vertical lower direction (-Z-axis direction), all or at least a portion of the inlet 103 and the outlet 105 overlap with each other. As another example, the inlet 103 and the outlet 105 may be arranged in a region near the center of the laser device 100 with respect to a horizontal axis (e.g., Y-axis direction).

[0090] In addition, various modifications may be made to the arrangement positions of the inlet 103 and the outlet 105 .

[0091] According to various embodiments, the inlet 103 and the outlet 105 may be provided as valves. The inlet 103 may be configured to allow cooling water to flow into the inside of the laser device 100, and the outlet 105 may be configured to discharge the cooling water inside the laser device 100 to the outside. The cooling water flowing in through the inlet 103 may cool the laser output unit 110 and be discharged through the outlet 105.

[0092] According to various embodiments, the laser device 100 may include a cooling structure for cooling the laser output portion 110. For example, the laser output portion 110 may be heated when generating a laser beam, and the cooling structure may be used to cool the heated laser output portion 110. In various embodiments, the cooling structure may be provided as a combination of all or part of a flow path portion for flowing cooling water, an inlet 103, and an outlet 105.

[0093] Figure 2 is a cross-sectional view of a laser device according to various embodiments.

[0094] Reference Figure 2 , the laser device 100 may include a cooling structure 200. In one embodiment, the cooling structure 200 may include a second housing 107, a supporting member 201 and a flow path portion 202. Figure 2 The laser device 100 may refer to Figure 1 The laser device 100 has all or part of the same configuration.

[0095] According to various embodiments, a second housing 107 may be disposed inside the first housing 101. The second housing 107 may provide a cavity 108 inside. In addition, the second housing 107 may include a second input region 103b fluidically connected to the inlet 103 and a first discharge region 105a fluidically connected to the outlet 105. For example, cooling water flowing in through the first input region 103a of the inlet 103 may flow into the inside of the second housing 107 through the second input region 103b. In addition, the cooling water transferred through the first discharge region 105a may be discharged to the outside of the laser device 100 through the second discharge region 105b.

[0096] According to various embodiments, the support member 201 may be disposed inside the second housing 107. The support member 201 accommodates the laser output unit 110 inside and may stably support the laser output unit 110. According to various embodiments, a flow path portion 202 may be provided on the outer surface of the support member 201. The flow path portion 202 may provide a path for the cooling water flowing into the second housing 107 to flow.

[0097] According to various embodiments, the cavity 108 may include a first cavity 108a and a second cavity 108b. In one embodiment, the first cavity 108a is arranged adjacent to the inlet 103, and may provide a space for maintaining the cooling water flowing in through the inlet 103 for a prescribed time. The cooling water flowing inside the first cavity 108a may cool the support member 201 and the laser output unit 110 inside the support member 201 while flowing through the flow path portion 202. In one embodiment, the cooling water flowing along the flow path portion 202 in the first cavity 108a may flow to the second cavity 108b. For example, the support member 201 may substantially have a cylindrical shape, and the cooling water may flow from the first cavity 108a to the second cavity 108b along the flow path portion 202 formed on the outer surface of the cylindrical support member 201. The cooling water may flow along the flow path portion 202 from the first cavity 108 a to the second cavity 108 b , and cool the support member 201 and the laser output unit 110 installed inside the support member 201 .

[0098] In one embodiment, in the laser device 100, the fluid (cooling water) can flow from the inlet 103 to the outlet 105. For example, the inlet 103 is arranged vertically above (in the +Z-axis direction) with respect to the ground, and the outlet 105 is arranged vertically below (in the -Z-axis direction) with respect to the ground, so that the cooling water can flow from the inlet 103 to the outlet 105 due to the influence of gravity. As another example, the pressure difference between the inlet 103 and the outlet 105 can be used to make the cooling water flow from the inlet 103 to the outlet 105.

[0099] Figure 3 are diagrams illustrating a cooling structure according to various embodiments. Figure 4 are diagrams showing cooling structures according to various embodiments from other angles.

[0100] Reference Figure 3 and Figure 4 , the support member 201 applied to the cooling structure 200 may include a partition wall portion 211 , a channel portion 212 , and a support portion 213 . Figure 3 and Figure 4 The support member 201 may refer to Figure 2 The supporting components 201 are all or partly constructed in the same manner.

[0101] According to various embodiments, a plurality of partition wall portions 211 may be arranged in a manner to surround the outer surface of the support portion 213. In one embodiment, a plurality of partition wall portions 211 may be arranged in a manner to be spaced apart from each other at a prescribed interval. For example, in the case where the support portion 213 is cylindrical, the partition wall portion 211 may have a circular plate shape surrounding the support portion 213. However, this is exemplary, and the shape of the partition wall portion 211 may be determined in a variety of ways. In one embodiment, the space between the plurality of partition wall portions 211 may be provided as a channel portion 212.

[0102] According to various embodiments, cooling water may flow along the channel portion 212 provided as a space between the plurality of partition wall portions 211, and the cooling water may flow along the surface of the support portion 213. In one embodiment, a heatable laser output portion 110 (laser active medium) is arranged inside the support portion 213, and the cooling water flowing through the surface of the support portion 213 may cool the laser output portion 110. The support portion 213 is arranged as close to the laser output portion 110 as possible, and the cooling efficiency of the laser output portion 110 may be improved. According to one embodiment, the channel portion 212 may be formed by processing the outer surface of the support member 201. For example, the channel portion 212 may be provided by forming a groove on the outer surface of the support member 201. Here, the channel portion 212 may be provided by micro-processing the outer surface of the support member 201, and may be referred to as a micro channel.

[0103] According to various embodiments, the connection portion 220 may be connected to the second housing 107. In one embodiment, the first connection portion 221 may be connected in a first direction (+Y-axis direction) of the second housing 107, and the second connection portion 222 may be connected in a second direction (-Y-axis direction) of the second housing 107. The support member 201 may be combined with the second housing 107 through the connection portion 220.

[0104] According to an embodiment, the first partition wall portion 211a may be disposed adjacent to the first connection portion 221. The second partition wall portion 211b may be disposed in a middle region with respect to the length direction (Y-axis direction) of the support member 201. The third partition wall portion 211c may be disposed adjacent to the second connection portion 222.

[0105] In a certain embodiment, the first partition wall portion 211a may be arranged in close contact with the first connecting portion 221, or formed as a whole with the first connecting portion 221. As another example, the third partition wall portion 211c may be arranged slightly apart from the second connecting portion 222. In one embodiment, the length direction (Y-axis direction) width of the first channel portion 212a and the second channel portion 212b can be formed in the same manner as each other. In another example, the width of the third channel portion 212c between the second connecting portion 222 and the third partition wall portion 211c may be less than the width of the first channel portion 212a and / or the second channel portion 212b. However, this is exemplary, and the third partition wall portion 211c may also be arranged in close contact with the second connecting portion 222 or formed as a whole. In this case, the intervals between the plurality of partition wall portions 211 may all be fixed.

[0106] According to various embodiments, the flow path portion 202 may include a first flow path portion 202a and a second flow path portion 202b. The first flow path portion 202a and the second flow path portion 202b may be distinguished based on the flow direction of the cooling water. For example, the first flow path portion 202a may refer to the flow path portion 202 provided in the upper direction (+Z axis direction) toward the inlet 103, and the second flow path portion 202b may refer to the flow path portion 202 provided in the lower direction (-Z axis direction) toward the outlet 105. That is, the cooling water entering through the first cavity 108a cools the support member 201 and the laser output portion 110 while flowing through the first flow path portion 202a, and the cooling water used for cooling may flow from the first flow path portion 202a to the second flow path portion 202b and be discharged from the outlet 105 through the second cavity 108b.

[0107] According to various embodiments, since the cooling water flows through the plurality of channel parts 212 formed with a fine width, unnecessary vibration caused by the flow rate of the cooling water may be suppressed.

[0108] In one embodiment, the first connection portion 221 and / or the second connection portion 222 may include a mounting area (eg, Figure 5 The first injection hole 224a and / or the second injection hole 224b of the installation area 441a shown in the figure can be injected through the injection hole 224 to fix the laser output unit 110 in the installation area (for example: Figure 5 The curing agent of the installation area 441a) is shown.

[0109] Figure 5 is a cross-sectional view of a laser device according to a second embodiment.

[0110] Reference Figure 5The laser device 300 according to the second embodiment may include all or part of a first housing 301, a second housing 307, an inlet 303, an outlet 305, a support member 401, and a laser output portion 310. Here, a cooling structure 400 for cooling the laser output portion 310 may be provided as a combination of a support member 401, a flow path region 410 provided in the support member 401, and the second housing 307.

[0111] The description of the first housing 301, the second housing 307, the inlet 303, the outlet 305 and the laser output unit 310 of the laser device 300 according to the second embodiment can be referred to in Figures 1 to 4 The description of the first housing 101, the second housing 107, the inlet 103, the outlet 105 and the laser output unit 110 described above are omitted here. Figures 1 to 4 A laser device 100 is provided.

[0112] According to various embodiments, a flow path region 410 for cooling the laser output unit 310 may be provided in the support member 401. In one embodiment, the flow path region 410 may include a plurality of openings 411. The cooling water flowing in from the inlet 303 may directly contact the laser output unit 310 through the openings 411 to cool the laser output unit 310. In one embodiment, the cooling water applied to the first input region 303a of the inlet 303 is stored in the first cavity 308a, and when the first cavity 308a is filled with cooling water of a certain capacity or more, the cooling water may cool the laser output unit 310 and flow through the openings 411. This will be further described below.

[0113] According to various embodiments, the support member 401 may include a mounting portion 441 provided therein. The mounting portion 441 may include a mounting area 441a therein. The mounting area 441a may refer to a space extending in the length direction (Y-axis direction) inside the mounting portion 441. The laser output portion 310 may be arranged in the mounting area 441a. The mounting portion 441 may also include a fluid transfer path (e.g., inlet opening 415a) for transferring a fluid (cooling water) to the mounting area 441a. In this regard, Figures 9 to 11 This is explained in detail.

[0114] Figure 6 is a diagram showing a cooling structure according to a second embodiment. Figure 7 It is a diagram showing the cooling structure according to the second embodiment from another angle.

[0115] Reference Figure 6 and Figure 7, the support member 401 may include at least one flow path region 410. For example, the flow path region 410 may include a region (e.g., a first flow path region 410a, a second flow path region 410b, and / or a third flow path region 410c) formed by a plurality of openings (e.g., a plurality of first openings 411a, a plurality of second openings 411b, and / or a plurality of third openings 411c). Figure 6 The support member 401 may refer to Figure 5 The supporting member 401 is wholly or partially constructed in the same manner.

[0116] According to various embodiments, cooling water may flow into the support member 401 through the flow path region 410. In one embodiment, the flow path region 410 may include a plurality of openings (411: 411a, 411b, 411c) spaced apart at prescribed intervals.

[0117] According to various embodiments, the flow path area 410 may be arranged along the circumferential edge of the support member 401. In one embodiment, the first flow path area 410a and the second flow path area 410b may be arranged along the circumferential direction on the surface 413 of the support member 401. Similarly, the second flow path area 410b and the third flow path area 410c may also be arranged along the circumferential direction on the surface 413 of the support member 401. In the illustrated drawings, only the first flow path area 410a, the second flow path area 410b, and the third flow path area 410c are shown, but more or fewer flow path areas 410 may be formed along the circumferential direction of the surface 413 of the support member 401.

[0118] According to various embodiments, a portion of the flow path area 410 may be provided as an inflow path for cooling water, while another portion of the flow path area 410 may be provided as an exhaust path for cooling water. In one embodiment, the first flow path area 410a may be provided as an inflow path for cooling water, while the third flow path area 410c may be provided as an exhaust path for cooling water. For example, the first flow path area 410a adjacent to the inlet 303 is an inflow path for cooling water, while the third flow path area 410c adjacent to the outlet 305 is an exhaust path for cooling water. The second flow path area 410b may be provided as an inflow path or an exhaust path for cooling water according to the arrangement relationship with the inlet 303 or the outlet 305.

[0119] According to various embodiments, the plurality of openings 411 may be arranged along the length direction (e.g., +Z axis direction) of the surface 413 of the support member 401. In one embodiment, the first opening 411a may be arranged along the length direction (+Z axis direction) in the first flow path region 410a. The second opening 411b and the third opening 411c may refer to the description of the first opening 411a.

[0120] According to various embodiments, the size of the opening 411 may be predetermined. For example, as will be described below, the opening 411 may be formed by a first cavity (eg, Fig. 9 The size of the opening 411 is determined in such a way that the cooling water flows in through the opening 411 when the pressure caused by the cooling water accumulated in the first cavity 308a) is higher than a predetermined pressure.

[0121] Figure 8 is a cross-sectional view of the cooling structure according to the second embodiment with respect to the XZ plane.

[0122] Figure 8 Show Figure 5 A-A' section.

[0123] Reference Figure 8 , the support member 401 may include a partition 431 disposed between the first cavity 308a and the second cavity 308b. Figure 8 The support component 401 may refer in whole or in part to the description of the support component 401 in the above embodiment.

[0124] According to various embodiments, the partition 431 may divide the first cavity 308a and the second cavity 308b. In one embodiment, the partition 431 may extend from the surface 413 of the support member 401 to the second shell 307. The partition 431 also extends in the length direction of the support member 401, thereby dividing the first cavity 308a and the second cavity 308b in a fluid manner.

[0125] According to various embodiments, cooling water may be filled in the first cavity 308a divided by the partition 431. In one embodiment, when the cooling water overflows in the first cavity 308a to a predetermined amount, the cooling water may be discharged through the opening (e.g., Figure 7 The liquid flows into the interior of the supporting member 401 through the opening 411 .

[0126] According to various embodiments, cooling water passing through the inside of the support member 401 may be transferred to the second cavity 308b. In one embodiment, the partition 431 divides the second cavity 308b from the first cavity 308a and prevents the heated cooling water transferred to the second cavity 308b from flowing back to the first cavity 308a.

[0127] Fig. 9 is a diagram showing a part of the cooling process of the cooling structure according to the second embodiment. Fig.10 is a diagram showing another part of the cooling process of the cooling structure according to the second embodiment. Fig.11 2 is a diagram showing still another part of the cooling process of the cooling structure according to the second embodiment.

[0128] Reference Figures 9 to 11, the cooling process according to various embodiments is described. Figures 9 to 11 When explaining, you can also mention Figures 5 to 8 The reference number of the

[0129] According to various embodiments, cooling water w may be stored in the first cavity 308a. In one embodiment, the cooling water w flowing in through the inlet 303 may be transferred to the space between the support member 401 and the second shell 307, i.e., the first cavity 308a, and filled. When the cooling water w exceeding the prescribed capacity is filled in the first cavity 308a, the cooling water may be transferred to the inside of the support member 401 through the opening 411. Here, it may be preferred that the plurality of openings 411 arranged in the length direction (e.g., Y-axis direction) of the support member 401 flow into the cooling water w uniformly. Therefore, the laser output portion 310 arranged in the length direction (Y-axis direction) inside the support member 401 may be uniformly cooled in the length direction (Y-axis direction). Therefore, the openings 411 arranged along the length direction (Y-axis direction) may have a predetermined size so that the cooling water w may flow out substantially at the same time after sufficient cooling water w is filled in the first cavity 308a.

[0130] According to various embodiments, the cooling water flowing in through the opening 411 may be transferred to the first housing portion 412. In one embodiment, the first housing portion 412 may be provided between the mounting portion 441 for arranging the laser output portion 310 and the support portion 442 of the support member 401 formed with the opening 411. Here, the outer surface of the support portion 442 may be the above-mentioned surface 413. When the cooling water w exceeding a prescribed capacity is filled in the first housing portion 412, the cooling water w may flow into the inside of the mounting portion 441 through the inlet opening 415a formed in the mounting portion 441. The cooling water w flowing into the inside of the mounting portion 441 directly contacts the laser output portion 310, so that the laser output portion 310 may be cooled.

[0131] According to various embodiments, the mounting portion 441 may refer to a component and / or region provided inside the support member 401 and used to install the laser output unit 310. In one embodiment, the mounting portion 441 may include a mounting area 441a inside. The laser output unit 310 may be arranged in the mounting area 441a.

[0132] In various embodiments, the inlet opening 415a may be formed in the mounting portion 441 in a manner facing the inlet 303. The inlet opening 415a may be arranged in a manner corresponding to the opening 411, but this is not necessary. The inlet opening 415a is fluidically connected to the first receiving portion 412 and may provide a fluid movement path for transferring the cooling water w filled in the first receiving portion 412 to the mounting area 441a.

[0133] In various embodiments, the outlet opening 415b may be provided in the mounting portion 441 in a manner that is substantially opposite to the inlet opening 415a (or in a manner that is toward the outlet 305). The outlet opening 415b may provide a fluid path that can be discharged after the cooling water w delivered to the inside of the mounting area 441a through the inlet opening 415a cools the laser output portion 310. In one embodiment, the outlet opening 415b may be fluidly connected to the discharge opening 417. In addition, a second receiving portion 414 may be provided between the outlet opening 415b and the discharge opening 417. For example, the cooling water w discharged from the outlet opening 415b is filled in the second receiving portion 414, and the cooling water w filled in the second receiving portion 414 may be discharged through the discharge opening 417.

[0134] In one embodiment, the opening 411 and / or the discharge opening 417 may have a specified depth relative to the direction of travel of the cooling water w (e.g., the Z-axis direction). Here, the specified depth may be set to be able to pass through the opening 411 when a specified pressure is applied to the cooling water w. That is, for example, the depth of the opening 411 may be determined in such a way that the cooling water w can flow through the opening 411 only when the cooling water w filled in the first cavity 308a fills more than the specified capacity. Thus, the cooling water w can simultaneously flow into a plurality of openings 411 arranged in the length direction of the support member 401 (e.g., the Y-axis direction). The description of the opening 411 may also be similarly applicable to the discharge opening 417, the inlet opening 415a, and / or the outlet opening 415b.

[0135] According to various embodiments, a laser device may be provided, in which a laser device (e.g. Figure 1 The laser device 100 includes a housing (eg: Figure 2 The second housing 107); an inlet valve (for example: Figure 2 The inlet 103 is arranged in the first direction of the housing and flows into the cooling water; the outlet valve (for example: Figure 2 The outlet 105 is arranged in the second direction of the housing and discharges cooling water; the laser output part (for example: Figure 2 The laser output unit 110 is contained in the housing and is configured to output a laser beam by applying power; and a cooling structure (for example: Figure 2 A cooling structure 200) is used to cool the laser output part, and the cooling structure includes: a supporting member (for example: Figure 2 a support member 201) for accommodating the laser output unit internally; and a flow path formed on the surface of the support member in a manner toward the inner side of the support member and for providing a path for the cooling water to flow.

[0136] According to one embodiment, the following laser device may be provided: the support component includes a mounting portion (eg: Figure 5 The mounting portion 441 extends along the length direction of the supporting component at the inner side of the supporting component and is used to mount the laser output unit.

[0137] According to one embodiment, the following laser device may be provided: the flow path includes a plurality of openings (for example: Figure 7 opening 411).

[0138] According to one embodiment, the following laser device may be provided: the flow path includes a plurality of discharge openings (for example: Fig. 9 The outlet opening 417).

[0139] According to one embodiment, the following laser device may be provided: a cavity for filling the cooling water is provided between the housing and the support member (for example: Fig. 9 The cavity 308 includes a first cavity near the inlet valve (e.g.: Fig. 9 The first cavity 308a) and the second cavity near the outlet valve (for example: Fig. 9 The second cavity 308b).

[0140] According to an embodiment, a laser device may be provided in which the widths of the plurality of openings are provided to be less than a predetermined width so that the cooling water filled in the first cavity can flow through the plurality of openings when the cooling water has a predetermined capacity or more.

[0141] According to an embodiment, a laser device may be provided in which the depth of the plurality of openings is provided to be greater than a predetermined depth so that the cooling water filled in the first cavity can flow through the plurality of openings when the cooling water has a predetermined volume or greater.

[0142] According to one embodiment, the following laser device may be provided: the cooling structure further includes a first receiving portion (eg, Fig. 9 The first receiving portion 412).

[0143] According to one embodiment, the following laser device may be provided: the cooling structure further comprises: a plurality of inlet openings (e.g.: Fig. 9 The inlet opening 415a is connected to the interior of the mounting portion and is used to provide a fluid movement path for the cooling water so that the cooling water is in direct contact with the laser output portion.

[0144] According to an embodiment, the following laser device may be provided: the first cavity, the plurality of openings, the first receiving portion, and the plurality of inlet openings are fluidically connected to each other.

[0145] According to one embodiment, the following laser device may be provided: the cooling structure further includes: a partition (for example: Figure 8 The partition plate 431 is configured to divide the first cavity and the second cavity in a fluid manner and is arranged between the shell and the supporting member.

[0146] According to one embodiment, the following laser device may be provided: the cooling structure further comprises: an outlet opening (e.g.: Fig. 9 The outlet opening 415b) is configured to connect from the inside of the mounting portion to the outside of the mounting portion and to provide a discharge path for cooling water for cooling the laser output portion, and is formed in a direction different from that of the inlet opening.

[0147] According to an embodiment, the following laser device may be provided: the flow path is formed by processing the outer surface of the support member.

[0148] According to one embodiment, the following laser device may be provided: the support member further includes: a plurality of partition wall portions (for example: Figure 4 The partition wall portion 211 is arranged at a predetermined interval along the length direction of the support member; and the channel portion (for example: Figure 4 The channel portion 212) is provided by the space between the partition wall portions.

[0149] According to an embodiment, a laser device may be provided in which at least a part of the plurality of partition wall portions is arranged to surround the support member in a circumferential direction.

[0150] According to one embodiment, the following laser device may be provided: the support member further includes: an injection opening (eg: Figure 3 The support member and the laser output unit are provided with an injection opening 224) for injecting a curing agent for fixing the support member and the laser output unit.

[0151] According to an embodiment, the following laser device may be provided: the laser output portion includes a laser active medium.

[0152] According to various embodiments, a laser device may be provided, in which a laser device (e.g. Figure 5 The laser device 300 includes: a housing (for example: Figure 5 The second housing 307); inlet valve (for example: Figure 5 The inlet 303 is arranged in the first direction of the housing and flows into the cooling water; the outlet valve (for example: Figure 5The outlet 305 is arranged in the second direction of the housing and discharges cooling water; the laser output part (for example: Figure 5 The laser output unit 310 is contained in the housing and is configured to output a laser beam when a power source is applied; and a cooling structure (for example: Figure 5 A cooling structure 400) is used to cool the laser output part, and the cooling structure includes: a supporting member (for example: Figure 5 A support member 401) for accommodating the laser output unit inside; and a flow path area (for example: Figure 6 A flow path area 410) is provided in the support component and provides a fluid movement path for the cooling water, and the flow path area includes a first flow path area provided near the inlet valve (for example: Figure 6 The first flow path area 410a) and the second flow path area provided near the outlet valve (for example: Figure 6 of the second flow path region 410b).

[0153] According to one embodiment, the following laser device may be provided: the first flow path region includes a plurality of first openings arranged along the length direction of the support member (for example: Figure 6 The second flow path region includes a plurality of second openings (for example: Figure 6 The first opening provides an inflow path for the cooling water to flow into the interior of the support component, and the second opening provides a discharge path for the cooling water heated by the laser output unit inside the support component.

[0154] As described above, although the embodiments are described using limited embodiments and drawings, technicians in the corresponding technical field can make various modifications and variations based on the above description. For example, even if the described technology is performed in a different order from the described method, or and / or the described system, structure, device, circuit and other components are combined or combined in a different form from the described method, or replaced or substituted by other components or equivalents, appropriate results can be achieved.

[0155] Accordingly, other implementations, other embodiments, and equivalents to the claims are within the scope of the following claims.

Claims

1. A laser device, wherein: include: case; An inlet valve is configured to be arranged in a first direction of the housing and to flow cooling water therein; An outlet valve is configured to be arranged in the second direction of the housing and discharge cooling water; A laser output unit is housed in the housing and is configured to output a laser beam when a power source is applied; as well as A cooling structure is used to cool the laser output part. The cooling structure comprises: A supporting component, used for accommodating the laser output unit inside; as well as The flow path is formed on the surface of the support member so as to face the inner side of the support member and is used to provide a path for the cooling water to flow.

2. The laser device according to claim 1, characterized in that The supporting component includes a mounting portion, which extends inside the supporting component along a length direction of the supporting component and is used to mount the laser output unit.

3. The laser device according to claim 2, characterized in that: The flow path includes a plurality of openings formed on a surface of the support member so as to face the inlet valve.

4. The laser device according to claim 3, characterized in that The flow path includes a plurality of discharge openings formed on a surface of the support member so as to face the outlet valve.

5. The laser device according to claim 3, characterized in that: providing a cavity for filling the cooling water between the housing and the support member, The cavity includes a first cavity proximate to the inlet valve and a second cavity proximate to the outlet valve.

6. The laser device according to claim 5, characterized in that The widths of the plurality of openings are provided to be equal to or less than a predetermined width so that the cooling water can flow through the plurality of openings when the cooling water filled in the first cavity has a predetermined capacity or more.

7. The laser device according to claim 5, characterized in that The depth of the plurality of openings is provided to be greater than or equal to a predetermined depth so that the cooling water filled in the first cavity can flow through the plurality of openings when the cooling water has a predetermined volume or greater.

8. The laser device according to claim 3, characterized in that: The cooling structure further includes a first receiving portion provided between the mounting portion and the plurality of openings.

9. The laser device according to claim 8, characterized in that The cooling structure further includes: a plurality of inlet openings connected to the interior of the mounting portion and configured to provide a fluid movement path for the cooling water so that the cooling water is in direct contact with the laser output portion.

10. The laser device according to claim 9, characterized in that The first cavity, the plurality of openings, the first receiving portion, and the plurality of inlet openings are fluidically connected to one another.

11. The laser device according to claim 5, characterized in that The cooling structure further includes a partition plate configured to divide the first cavity and the second cavity in a fluid manner and arranged between the housing and the supporting component.

12. The laser device according to claim 10, characterized in that The cooling structure further includes an outlet opening connected from the inside of the mounting portion to the outside of the mounting portion and providing a discharge path for cooling water for cooling the laser output portion, and formed in a direction different from that of the inlet opening.

13. The laser device according to claim 1, characterized in that The flow path is formed by processing the outer surface of the support member.

14. The laser device according to claim 13, characterized in that The support member further includes: a plurality of partition walls arranged at predetermined intervals along a length direction of the support member; and a channel portion provided by spaces between the plurality of partition walls.

15. The laser device according to claim 14, characterized in that At least a portion of the plurality of partition wall portions is arranged so as to surround the support member in a circumferential direction.

16. The laser device according to claim 1, characterized in that The support member further includes an injection opening configured to inject a curing agent for fixing the support member and the laser output unit.

17. The laser device according to claim 1, characterized in that The laser output portion includes a laser active medium.

18. A laser device, wherein: include: case; An inlet valve is configured to be arranged in a first direction of the housing and to flow cooling water therein; An outlet valve is configured to be arranged in the second direction of the housing and discharge cooling water; A laser output unit is housed in the housing and is configured to output a laser beam when a power source is applied thereto; as well as A cooling structure is used to cool the laser output part. The cooling structure comprises: A supporting component, used for accommodating the laser output unit inside; as well as A flow path region is provided in the support member and provides a fluid movement path of the cooling water, the flow path region including a first flow path region provided near the inlet valve and a second flow path region provided near the outlet valve.

19. The laser device according to claim 18, characterized in that The first flow path region includes a plurality of first openings arranged along the length direction of the support member. The second flow path region includes a plurality of second openings arranged along the length direction of the support member, The first opening provides an inflow path for the cooling water to flow into the interior of the support member. The second opening provides a discharge path for cooling water heated by the laser output unit inside the support member.

Images