High-voltage switch cabinet and heat dissipation control method

Abstract

The invention provides a high-voltage switch cabinet and a heat dissipation control method, and relates to the technical field of power grids. The heat dissipation fan is arranged at the bottom of the high-voltage switch cabinet, heat dissipation is achieved through the heat dissipation metal plate, convection in the cabinet under the condition that the cabinet body is closed is achieved, and the heat dissipation efficiency is improved. Furthermore, a sealing baffle and a waterproof breathable film are arranged at the top of the cabinet body, when the temperature in the cabinet is high, the sealing baffle is opened, air circulation between the interior and the exterior of the cabinet body is achieved, and the heat dissipation efficiency is further improved. And the waterproof breathable film can prevent moisture and dust outside the cabinet body from entering the cabinet, so that the protection level of the high-voltage switch cabinet is ensured. The heat dissipation effect of the high-voltage switch cabinet is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electric power grid, and in particular to a high-voltage switch cabinet and a heat dissipation control method. Background Art

[0002] High-voltage switchgear is a crucial device in mine circuit equipment. It is responsible for controlling, protecting and managing the high-voltage power supply in the mine to ensure the stability and safety of mine production. Since high-voltage switchgear is often used in harsh environments such as humidity, high temperature and dust, there are strict requirements for the protection of high-voltage switchgear. For example, the protection level of the high-voltage switchgear housing should not be lower than IP54, that is, the housing should be dustproof and splashproof.

[0003] Due to the higher protection level, high-voltage switchgear used in mining environments cannot dissipate heat through the heat dissipation holes on the shell surface like ordinary armored metal switchgear, resulting in poor heat dissipation of the high-voltage switchgear, which may cause equipment failure in severe cases. Summary of the invention

[0004] The embodiments of the present invention provide a high-voltage switch cabinet and a heat dissipation control method, which can improve the heat dissipation effect of the high-voltage switch cabinet.

[0005] In a first aspect, an embodiment of the present invention provides a heat dissipation control method for a high-voltage switch cabinet, wherein the high-voltage switch cabinet includes a cabinet body, a heat dissipation fan arranged at the bottom of the cabinet body, a heat dissipation metal plate arranged at the side of the cabinet body, a sealing baffle arranged at the top of the cabinet body, and a waterproof and breathable film is arranged on the cabinet body corresponding to the sealing baffle. The heat dissipation control method includes monitoring the real-time temperature inside the high-voltage switch cabinet; if the real-time temperature is greater than a first temperature and less than or equal to a second temperature, controlling the heat dissipation fan to turn on so that air in the cabinet flows and exchanges heat with the heat dissipation metal plate; if the real-time temperature is greater than the second temperature, controlling the sealing baffle to open so that the air in the cabinet flows to the outside of the cabinet through the waterproof and breathable film; wherein the first temperature is lower than the second temperature.

[0006] In one possible implementation, if the real-time temperature is greater than the first temperature and less than or equal to the second temperature, the cooling fan is controlled to turn on, including: if the real-time temperature is greater than the first temperature and less than or equal to the third temperature, the cooling fan is controlled to run at the first power; if the real-time temperature is greater than the third temperature and less than or equal to the second temperature, the cooling fan is controlled to run at the second power; wherein the first temperature is lower than the third temperature, and the third temperature is lower than the second temperature.

[0007] In a possible implementation, a driving motor, a driving spindle, a first connecting rod, a second connecting rod and a sliding bracket are arranged on the top of the high-voltage switch cabinet; the driving spindle is connected to the first connecting rod, the first connecting rod is connected to the second connecting rod, and the second connecting rod is connected to the sliding bracket; the first end of the sliding bracket is connected to the bracket guide rail, and the second end of the sliding bracket is connected to the sealing baffle; the driving spindle rotates under the drive of the driving motor and drives the first connecting rod to move, the first connecting rod drives the second connecting rod to move, and the second connecting rod drives the sliding bracket to slide in the bracket guide rail, so that the sealing baffle moves to achieve the sealing and opening of the air outlet at the waterproof and breathable film position. If the real-time temperature is greater than the second temperature, the sealing baffle is controlled to open, including: if the real-time temperature is greater than the second temperature, a first control signal is generated; based on the first control signal, the driving motor is controlled to operate so that the sealing baffle is opened at a first speed.

[0008] In one possible implementation, the heat dissipation control method also includes: monitoring the real-time current of the high-voltage switchgear; if the real-time current is greater than the set current, generating a second control signal; based on the second control signal, controlling the operation of the drive motor to open the sealing baffle at a second speed, wherein the second speed is greater than the first speed.

[0009] In a possible implementation, a heat dissipation baffle is provided outside the cabinet of the waterproof and breathable film, and the heat dissipation baffle isolates particulate impurities.

[0010] In a possible implementation, the heat dissipation metal plate is an internal hollow structure, and a coolant is disposed inside the heat dissipation metal plate.

[0011] In a second aspect, an embodiment of the present invention provides a heat dissipation control device for a high-voltage switch cabinet, wherein the high-voltage switch cabinet includes a cabinet body, a heat dissipation fan arranged at the bottom of the cabinet body, a heat dissipation metal plate arranged at the side of the cabinet body, a sealing baffle arranged at the top of the cabinet body, and a waterproof and breathable film is arranged on the cabinet body corresponding to the sealing baffle. The heat dissipation control device includes: a communication module, used to monitor the real-time temperature in the high-voltage switch cabinet; a processing module, used to control the heat dissipation fan to turn on if the real-time temperature is greater than a first temperature and less than or equal to a second temperature, so that the air in the cabinet flows and exchanges heat with the heat dissipation metal plate; if the real-time temperature is greater than the second temperature, the sealing baffle is controlled to open, so that the air in the cabinet flows to the outside of the cabinet through the waterproof and breathable film; wherein the first temperature is lower than the second temperature.

[0012] In a third aspect, an embodiment of the present invention provides an electronic device, comprising a memory and a processor, the memory storing a computer program, the processor being used to call and run the computer program stored in the memory to perform the steps of the method described in the first aspect and any possible implementation method of the first aspect.

[0013] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and wherein when the computer program is executed by a processor, the steps of the method described in the first aspect and any possible implementation method of the first aspect are implemented.

[0014] In the fifth aspect, an embodiment of the present invention provides a high-voltage switch cabinet, which includes a cabinet body, a cooling fan arranged at the bottom of the cabinet body, a cooling metal plate arranged at the side of the cabinet body, a sealing baffle arranged at the top of the cabinet body, and a waterproof and breathable film is arranged on the cabinet body corresponding to the sealing baffle; a driving motor, a driving main shaft, a first connecting rod, a second connecting rod and a sliding bracket are arranged at the top of the cabinet of the high-voltage switch cabinet; the driving main shaft is connected to the first connecting rod, the first connecting rod is connected to the second connecting rod, and the second connecting rod is connected to the sliding bracket; the first end of the sliding bracket is connected to the bracket guide rail, and the second end of the sliding bracket is connected to the sealing baffle; the driving main shaft rotates under the drive of the driving motor and drives the first connecting rod to move, the first connecting rod drives the second connecting rod to move, and the second connecting rod drives the sliding bracket to slide in the bracket guide rail, so that the sealing baffle moves, thereby realizing the sealing and opening of the air outlet at the position of the waterproof and breathable film.

[0015] The embodiment of the present invention provides a high-voltage switch cabinet and a heat dissipation control method. The present invention arranges a heat dissipation fan at the bottom of the high-voltage switch cabinet and dissipates heat through a heat dissipation metal plate to achieve convection inside the cabinet when the cabinet is closed, thereby improving the heat dissipation efficiency. Furthermore, a sealing baffle and a waterproof breathable film are arranged on the top of the cabinet. When the temperature inside the cabinet is high, the sealing baffle is opened to achieve air circulation between the inside and outside of the cabinet, thereby further improving the heat dissipation efficiency. The waterproof breathable film can prevent moisture and dust outside the cabinet from entering the cabinet, thereby ensuring the protection level of the high-voltage switch cabinet. The present invention improves the heat dissipation effect of the high-voltage switch cabinet. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 is a structural schematic diagram of a high-voltage switchgear provided by an embodiment of the present invention;

[0018] Figure 2 It is a structural schematic diagram of a driving mechanism in a high-voltage switch cabinet provided by an embodiment of the present invention;

[0019] Figure 3is a structural schematic diagram of another driving mechanism in a high-voltage switch cabinet provided by an embodiment of the present invention;

[0020] Figure 4 is a structural schematic diagram of another driving mechanism in a high-voltage switch cabinet provided by an embodiment of the present invention;

[0021] Figure 5 It is a schematic structural diagram of a waterproof and breathable film provided by an embodiment of the present invention;

[0022] Figure 6 It is a structural schematic diagram of a heat dissipation fan provided by an embodiment of the present invention;

[0023] Figure 7 It is a structural schematic diagram of a heat dissipation metal plate provided by an embodiment of the present invention;

[0024] Figure 8 It is a structural schematic diagram of a heat dissipation baffle provided by an embodiment of the present invention;

[0025] Fig. 9 It is a flow chart of a heat dissipation control method of a high-voltage switch cabinet provided by an embodiment of the present invention;

[0026] Fig.10 It is a structural schematic diagram of a heat dissipation control device for a high-voltage switch cabinet provided by an embodiment of the present invention;

[0027] Fig.11 It is a structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0028] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0029] In the description of the present invention, unless otherwise specified, " / " means "or", for example, A / B can mean A or B. "And / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, "at least one" and "plurality" refer to two or more. The words "first", "second", etc. do not limit the quantity and execution order, and the words "first", "second", etc. do not limit them to be different.

[0030] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete way for easy understanding.

[0031] In addition, the terms "including" and "having" and any variations thereof mentioned in the description of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or modules is not limited to the listed steps or modules, but may optionally include other steps or modules that are not listed, or may optionally include other steps or modules that are inherent to these processes, methods, products or devices.

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clear, the following will be described through specific embodiments in conjunction with the accompanying drawings of the present invention.

[0033] As described in the background art, currently, since the protection level of the high-voltage switchgear used in the mining environment is relatively high, the heat dissipation effect of the high-voltage switchgear is relatively poor.

[0034] Furthermore, due to the higher protection level, high-voltage switchgear used in mining environments cannot reserve pressure relief holes on the shell surface like ordinary armored metal switchgear. This will result in the high-temperature and high-pressure gas generated having nowhere to be discharged when a short circuit occurs in the primary circuit of the high-voltage switchgear. The pressure can only be borne by the structure of the shell itself, which may cause the switchgear to explode, damage adjacent switchgears, and pose a threat to personal safety.

[0035] To solve the above technical problems, Figure 1 As shown, an embodiment of the present invention provides a high-voltage switch cabinet. The high-voltage switch cabinet includes a cabinet, a heat dissipation fan arranged at the bottom of the cabinet, a heat dissipation metal plate arranged at the side of the cabinet, a sealing baffle arranged at the top of the cabinet, and a waterproof and breathable film arranged on the cabinet corresponding to the sealing baffle.

[0036] like Figure 2 , Figure 3 and Figure 4 As shown, a driving mechanism is arranged on the top of the high-voltage switch cabinet and below the sealing baffle, and the driving mechanism includes a driving main shaft, a first connecting rod, a second connecting rod and a sliding bracket. The driving main shaft is connected to the first connecting rod, the first connecting rod is connected to the second connecting rod, and the second connecting rod is connected to the sliding bracket; the first end of the sliding bracket is connected to the bracket guide rail, and the second end of the sliding bracket is connected to the sealing baffle.

[0037] The driving mechanism also includes a driving motor. The driving main shaft rotates under the drive of the driving motor and drives the first connecting rod to move, the first connecting rod drives the second connecting rod to move, and the second connecting rod drives the sliding bracket to slide in the bracket guide rail to move the sealing baffle to achieve the sealing and opening of the air outlet at the waterproof and breathable film position above the sealing baffle.

[0038] like Figure 5 As shown, an embodiment of the present invention provides a schematic structural diagram of a waterproof and breathable film. Figure 5 The top middle picture is a top view of the waterproof breathable film, and the bottom picture is a cross-sectional view. The waterproof breathable film is installed on the baffle bracket.

[0039] like Figure 6 As shown, an embodiment of the present invention provides a schematic diagram of a heat dissipation fan. Figure 7 As shown, an embodiment of the present invention provides a schematic diagram of a heat dissipation metal plate. The heat dissipation metal plate is an internal hollow structure, and a coolant is arranged inside the heat dissipation metal plate.

[0040] like Figure 8 As shown, an embodiment of the present invention provides a schematic diagram of a heat dissipation baffle. A heat dissipation baffle is arranged outside the cabinet of the waterproof and breathable film, and the heat dissipation baffle isolates particle impurities.

[0041] based on Figures 1 to 8 The switch cabinet shown in Fig. 9 As shown, an embodiment of the present invention provides a heat dissipation control method for a high-voltage switch cabinet, and the heat dissipation control method includes steps S101-S103.

[0042] S101. Monitor the real-time temperature inside the high-voltage switch cabinet.

[0043] S102: If the real-time temperature is greater than the first temperature and less than or equal to the second temperature, the cooling fan is controlled to turn on to allow air in the cabinet to flow and perform heat exchange with the cooling metal plate.

[0044] Exemplarily, if the real-time temperature is greater than the first temperature and less than or equal to the third temperature, the cooling fan is controlled to operate at the first power.

[0045] Exemplarily, if the real-time temperature is greater than the third temperature and less than or equal to the second temperature, the cooling fan is controlled to operate at the second power.

[0046] The first temperature is lower than the third temperature, and the third temperature is lower than the second temperature.

[0047] S103: If the real-time temperature is greater than the second temperature, the sealing baffle is controlled to open, so that the air in the cabinet flows to the outside of the cabinet through the waterproof and breathable film.

[0048] The first temperature is lower than the second temperature.

[0049] As a possible implementation, if the real-time temperature is greater than the second temperature, a first control signal is generated; based on the first control signal, the drive motor is controlled to operate so that the sealing baffle opens at a first speed.

[0050] The embodiment of the present invention provides a heat dissipation control method for a high-voltage switch cabinet. By arranging a heat dissipation fan at the bottom of the high-voltage switch cabinet and dissipating heat through a heat dissipation metal plate, convection in the cabinet is achieved when the cabinet is closed, thereby improving the heat dissipation efficiency. Furthermore, a sealing baffle and a waterproof breathable film are arranged on the top of the cabinet. When the temperature in the cabinet is high, the sealing baffle is opened to achieve air circulation between the inside and outside of the cabinet, thereby further improving the heat dissipation efficiency. The waterproof breathable film can prevent moisture and dust outside the cabinet from entering the cabinet, thereby ensuring the protection level of the high-voltage switch cabinet. The present invention improves the heat dissipation effect of the high-voltage switch cabinet.

[0051] For example, most of the heat in the high-voltage switch cabinet is generated at the rear of the cabinet, where the copper bars are overlapped. Therefore, a hollow heat dissipation metal plate is installed on the sheet metal on both sides of the rear of the cabinet, such as Figure 7 As shown. The heat dissipation metal plate contains liquid. When it is heated, the liquid in the heat dissipation plate will absorb heat and turn into gas, and diffuse to other parts and the metal plate parts on the side of the cabinet to achieve the effect of heat exchange. This method can dissipate heat without affecting the protection level of the high-voltage switch cabinet shell.

[0052] Another example is that in addition to the heat dissipation metal plate installed on the rear side of the cabinet, a fan is also installed at the bottom of the cabinet. Since the components installed inside the switch cabinet are different, the voltage transformer, current transformer, copper busbar, grounding switch, etc., the heat generation of each component is also different, which may cause uneven heat distribution inside the switch cabinet. When the internal temperature of the high-voltage switch cabinet is T>T1, the bottom fan is started, and the wind blown by the fan forms a convection airflow inside the high-voltage switch cabinet, dissipating the heat more evenly to the periphery of each heat dissipation metal plate, playing a role in average heat dissipation. At the same time, the power of the fan can also be controlled according to the temperature, for example, the temperature T1 is refined into T11 and T12. Among them, T11<T12<T2; the power of the fan is set to W1 and W2. When T11<T<T12, the fan power runs according to W1; when T12<T<T2, the fan runs according to W2.

[0053] When the temperature T>T2, the internal temperature of the high-voltage switch cabinet is too high and emergency cooling is required. Figure 2 , Figure 3 and Figure 4As shown, the driving spindle is installed on both sides of the high-voltage switch cabinet, the driving spindle is connected to the first connecting rod; the first connecting rod is connected to the second connecting rod; the second connecting rod is connected to the sliding bracket; one end of the sliding bracket is connected to the bracket guide rail and moves in the guide rail; the other end is connected to the sealing baffle, driving the sealing baffle to move together; sealing strips are installed on all four sides of the sealing baffle, when it is in close contact with the baffle bracket, it can be rainproof and dustproof through the sealing strips; a waterproof and breathable film is installed on the lower part of the sealing baffle and the baffle bracket; the baffle bracket is fixedly welded to the top cover plate of the high-voltage switch cabinet; the bracket guide rail is the same as the driving spindle, and is fixedly installed on both sides of the high-voltage switch cabinet.

[0054] When the temperature T>T2, the fan installed at the bottom works at the power W2, and the motor drives the driving spindles on both sides to rotate. The driving spindles rotate to drive the first connecting rod to move, the first connecting rod drives the second connecting rod to move, and the second connecting rod drives the sliding bracket to slide in the guide rail. At this time, the driving spindle, the first connecting rod, the second connecting rod and the sliding bracket form a crank slider mechanism to drive the sealing baffle to open, exposing the waterproof and breathable film below. The waterproof and breathable membrane allows gas molecules to pass through and prevents liquid molecules (such as water droplets) from passing through its unique microporous structure, and can withstand high temperatures of more than 200 degrees. Therefore, the hot air in the high-voltage cabinet can be dissipated through the waterproof and breathable film, while external dust and water cannot enter through the waterproof and breathable film, that is, heat dissipation can be achieved while waterproofing and dustproofing can be achieved. A heat dissipation baffle is installed above the waterproof and breathable film. Through the openings on the heat dissipation baffle, it can not only meet the heat dissipation requirements, but also prevent particulate impurities from falling in and damaging the waterproof and breathable film.

[0055] When the internal temperature of the high-voltage switch cabinet is T<T2, the motor drives the driving main shaft to move in the opposite direction to close the sealing baffle. Sealing strips are installed on all four sides of the sealing baffle. When it is in close contact with the baffle bracket, it can prevent rain and dust.

[0056] In this way, the heat dissipation metal plate installed on the side of the cabinet can dissipate heat without affecting the protection level of the shell; when the sealing baffle is in the closed state, the sealing strips installed on the four sides of the sealing baffle can also prevent rain and dust; when the sealing baffle is in the open state, the waterproof and breathable film under the sealing baffle can dissipate heat and prevent rain and dust due to its unique structure. Therefore, the heat dissipation structure and method proposed in this scheme can make the protection level of the high-voltage switch cabinet shell meet the IP54 requirements.

[0057] Optionally, the heat dissipation control method for a high-voltage switch cabinet provided in an embodiment of the present invention further includes steps S201-S203.

[0058] S201. Monitor the real-time current of the high-voltage switchgear.

[0059] S202: If the real-time current is greater than the set current, generate a second control signal.

[0060] S203: Based on the second control signal, control the driving motor to operate so that the sealing baffle opens at a second speed.

[0061] The second speed is greater than the first speed.

[0062] It should be noted that the embodiment of the present invention can use a temperature sensor to monitor the temperature inside the high-voltage switch cabinet, and set a first temperature T1 and a second temperature T2, where T2>T1. When the internal temperature T of the high-voltage switch cabinet is greater than T2, the internal temperature of the high-voltage switch cabinet is too high, which may cause equipment failure. At the same time, a current sensor is used to monitor the current in the switch cabinet, and a critical current is set, that is, the set current A1. When the current A inside the high-voltage switch cabinet suddenly increases and is greater than the set current A1, a primary circuit short circuit fault occurs inside the high-voltage switch cabinet, and pressure relief is required.

[0063] When the current A suddenly increases and A>A1, a short circuit fault occurs inside the high-voltage switch cabinet, and pressure relief is required. At this time, the motor drives the drive spindle to move quickly with high power, and quickly opens the sealing baffle. Since the waterproof and breathable film can only withstand limited pressure, it cannot prevent the high-temperature and high-pressure gas generated by the short circuit fault. Therefore, these gases will be discharged along the gap opened by the sealing baffle, reducing the damage to the high-voltage switch cabinet. This can not only meet the heat dissipation problem of the high-voltage switch cabinet at a higher protection level, but also solve the pressure relief problem of the high-voltage switch cabinet under extreme conditions.

[0064] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0065] The following is an embodiment of the device of the present invention. For details not described in detail therein, reference may be made to the corresponding method embodiment described above.

[0066] Fig.10 The schematic diagram of the structure of a heat dissipation control device for a high-voltage switch cabinet provided by an embodiment of the present invention is shown. The heat dissipation control device 300 includes a communication module 301 and a processing module 302 .

[0067] Communication module, used to monitor the real-time temperature inside the high-voltage switchgear.

[0068] The processing module is used to control the cooling fan to turn on if the real-time temperature is greater than the first temperature and less than or equal to the second temperature, so that the air in the cabinet flows and exchanges heat with the heat dissipation metal plate; if the real-time temperature is greater than the second temperature, control the sealing baffle to open so that the air in the cabinet flows to the outside of the cabinet through the waterproof and breathable film; wherein the first temperature is lower than the second temperature.

[0069] Fig.11Schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. Fig.11 As shown, the electronic device 400 of this embodiment includes: a processor 401, a memory 402, and a computer program 403 stored in the memory 402 and executable on the processor 401. When the processor 401 executes the computer program 403, the steps in the above-mentioned method embodiments are implemented, for example Fig. 9 Alternatively, when the processor 401 executes the computer program 403, the functions of each module / unit in the above-mentioned device embodiments are realized, for example, Fig.10 The functions of the power failure detection unit 301 and the processing module 302 are shown.

[0070] Exemplarily, the computer program 403 may be divided into one or more modules / units, which are stored in the memory 402 and executed by the processor 401 to implement the present invention. The one or more modules / units may be a series of computer program instruction segments that can implement specific functions, and the instruction segments are used to describe the execution process of the computer program 403 in the electronic device 400. For example, the computer program 403 may be divided into Fig.10 The power failure detection unit 301 and the processing module 302 are shown.

[0071] The processor 301 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0072] The memory 402 may be an internal storage unit of the electronic device 400, such as a hard disk or memory of the electronic device 400. The memory 402 may also be an external storage device of the electronic device 400, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device 400. Further, the memory 402 may also include both an internal storage unit of the electronic device 400 and an external storage device. The memory 402 is used to store the computer program and other programs and data required by the terminal. The memory 402 may also be used to temporarily store data that has been output or is to be output.

[0073] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0074] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0075] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0076] In the embodiments provided by the present invention, it should be understood that the disclosed devices / terminals and methods can be implemented in other ways. For example, the device / terminal embodiments described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0077] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0078] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0079] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present invention implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium, etc.

[0080] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A heat dissipation control method for a high-voltage switch cabinet, characterized in that: The high-voltage switch cabinet includes a cabinet, a heat dissipation fan arranged at the bottom of the cabinet, a heat dissipation metal plate arranged at the side of the cabinet, a sealing baffle arranged at the top of the cabinet, and a waterproof and breathable film arranged on the cabinet corresponding to the sealing baffle. The heat dissipation control method includes: Monitor the real-time temperature inside the high-voltage switchgear; If the real-time temperature is greater than the first temperature and less than or equal to the second temperature, the cooling fan is controlled to turn on to allow air in the cabinet to flow and perform heat exchange with the cooling metal plate; If the real-time temperature is greater than the second temperature, the sealing baffle is controlled to open, so that the air in the cabinet flows to the outside of the cabinet through the waterproof and breathable film; Wherein, the first temperature is lower than the second temperature.

2. The heat dissipation control method of high-voltage switch cabinet according to claim 1, characterized in that: If the real-time temperature is greater than the first temperature and less than or equal to the second temperature, controlling the cooling fan to turn on includes: If the real-time temperature is greater than the first temperature and less than or equal to the third temperature, controlling the cooling fan to operate at the first power; If the real-time temperature is greater than the third temperature and less than or equal to the second temperature, controlling the cooling fan to operate at the second power; The first temperature is lower than the third temperature, and the third temperature is lower than the second temperature.

3. The heat dissipation control method of high-voltage switch cabinet according to claim 1, characterized in that: A driving motor, a driving main shaft, a first connecting rod, a second connecting rod and a sliding bracket are arranged on the top of the high-voltage switch cabinet; the driving main shaft is connected to the first connecting rod, the first connecting rod is connected to the second connecting rod, and the second connecting rod is connected to the sliding bracket; the first end of the sliding bracket is connected to the bracket guide rail, and the second end of the sliding bracket is connected to the sealing baffle; the driving main shaft rotates under the drive of the driving motor and drives the first connecting rod to move, the first connecting rod drives the second connecting rod to move, and the second connecting rod drives the sliding bracket to slide in the bracket guide rail, so that the sealing baffle moves, so as to realize the sealing and opening of the air outlet at the position of the waterproof and breathable film; If the real-time temperature is greater than the second temperature, the sealing baffle is controlled to open, comprising: If the real-time temperature is greater than the second temperature, a first control signal is generated; Based on the first control signal, the driving motor is controlled to operate so that the sealing baffle is opened at a first speed.

4. The heat dissipation control method of a high-voltage switch cabinet according to claim 1, characterized in that: The heat dissipation control method further includes: Monitor the real-time current of high-voltage switchgear; If the real-time current is greater than the set current, generating a second control signal; Based on the second control signal, the driving motor is controlled to operate so that the sealing baffle is opened at a second speed, wherein the second speed is greater than the first speed.

5. The heat dissipation control method of high-voltage switch cabinet according to claim 1, characterized in that: A heat dissipation baffle is arranged outside the cabinet of the waterproof and breathable film, and the heat dissipation baffle isolates particulate impurities.

6. The heat dissipation control method of high-voltage switch cabinet according to claim 1, characterized in that: The heat dissipation metal plate is an internal hollow structure, and a coolant is arranged inside the heat dissipation metal plate.

7. A heat dissipation control device for a high-voltage switch cabinet, characterized in that: The high-voltage switch cabinet includes a cabinet, a heat dissipation fan arranged at the bottom of the cabinet, a heat dissipation metal plate arranged at the side of the cabinet, a sealing baffle arranged at the top of the cabinet, and a waterproof and breathable film arranged on the cabinet corresponding to the sealing baffle, and the heat dissipation control device includes: Communication module, used to monitor the real-time temperature inside the high-voltage switchgear; The processing module is used to control the cooling fan to turn on if the real-time temperature is greater than the first temperature and less than or equal to the second temperature, so that the air in the cabinet flows and exchanges heat with the heat dissipation metal plate; if the real-time temperature is greater than the second temperature, control the sealing baffle to open so that the air in the cabinet flows to the outside of the cabinet through the waterproof and breathable film; wherein the first temperature is lower than the second temperature.

8. An electronic device, characterized in that: The electronic device comprises a memory and a processor, wherein the memory stores a computer program, and the processor is used to call and run the computer program stored in the memory to execute the steps of the method according to any one of claims 1 to 6.

9. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A high voltage switch cabinet, characterized in that: The high-voltage switch cabinet comprises a cabinet, a cooling fan arranged at the bottom of the cabinet, a cooling metal plate arranged at the side of the cabinet, a sealing baffle arranged at the top of the cabinet, and a waterproof and breathable film is arranged on the cabinet corresponding to the sealing baffle; A driving motor, a driving spindle, a first connecting rod, a second connecting rod and a sliding bracket are arranged on the top of the high-voltage switch cabinet; the driving spindle is connected to the first connecting rod, the first connecting rod is connected to the second connecting rod, and the second connecting rod is connected to the sliding bracket; the first end of the sliding bracket is connected to the bracket guide rail, and the second end of the sliding bracket is connected to the sealing baffle; the driving spindle rotates under the drive of the driving motor and drives the first connecting rod to move, the first connecting rod drives the second connecting rod to move, and the second connecting rod drives the sliding bracket to slide in the bracket guide rail, so that the sealing baffle moves, thereby realizing the sealing and opening of the air outlet at the position of the waterproof and breathable film.

Images