A MiniLED circuit board processing fixture with a pressing structure

Abstract

The present invention relates to the technical field of circuit board processing, and discloses a MiniLED circuit board processing jig with a pressing structure, comprising a lower module, a slide bar fixedly arranged on the top of the lower module for carrying a stacked substrate; a pressing assembly slidably arranged on the outside of the slide bar for pressing the stacked substrate; a positioning assembly arranged around the inner side of the lower module for positioning the stacked substrate before pressing, wherein the positioning assembly comprises a U-shaped block, the U-shaped block is slidably installed around the inner side of the lower module, and a positioning blade is arranged on the side of the U-shaped block close to the stacked substrate. The MiniLED circuit board processing jig with a pressing structure can effectively solve the problem in the prior art that since the jig needs to be transferred to the pressing station, external forces such as vibration will be generated during the transfer process, resulting in obvious offset and misalignment between the stacked core board, prepreg and copper foil, making it difficult to ensure the pressing quality of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a MiniLED circuit board processing jig with a pressing structure. Background Art

[0002] The main purpose of lamination during the processing of MiniLED circuit boards is to combine different inner core boards and outer copper foils through "heat and pressure" to form a multi-layer structure and ensure the stability between layers and circuit performance. During the processing of MiniLED circuit boards, jigs are mainly used to improve processing accuracy and efficiency.

[0003] A traditional circuit board processing jig with a pressing structure consists of an upper mold and a lower mold. The upper mold is vertically slidably set on the top of the lower mold, and the circuit board substrate on the lower mold is pressed downward by the upper mold; before pressing, the lower mold needs to bear the substrate formed by the stacking of core board, prepreg and copper foil. In order to meet the process requirements of the circuit board, the areas of the core board, prepreg and copper foil are increased successively; because the jig needs to be transferred to the pressing station, external forces such as vibration will be generated during the transfer process, resulting in obvious offset and misalignment between the stacked core board, prepreg and copper foil, making it difficult to ensure the pressing quality of the circuit board. Summary of the invention

[0004] Technical issues solved

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides a MiniLED circuit board processing jig with a pressing structure, which can effectively solve the problem in the prior art that, since the jig needs to be transferred to the pressing station, external forces such as vibration will be generated during the transfer process, resulting in obvious offset and misalignment between the stacked core board, prepreg and copper foil, making it difficult to ensure the pressing quality of the circuit board.

[0006] Technical Solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] The present invention provides a MiniLED circuit board processing jig with a pressing structure, comprising:

[0009] A lower module, a sliding rod is fixedly arranged on the top of the lower module for carrying the stacked substrates;

[0010] A pressing assembly, slidably disposed on the outside of the slide bar, for pressing the laminated substrates;

[0011] Positioning components are arranged around the inner side of the lower module and are used to position the laminated substrates before lamination;

[0012] Among them, the positioning component includes a U-shaped block, which is slidably installed at the inner side of the lower module. A positioning blade is provided on the side of the U-shaped block close to the stacked substrate. A plurality of positioning blades are stacked and arranged to laterally position a plurality of core boards, prepregs and copper foils in the stacked substrate before lamination, and the positioning action of the stacked substrate is released by sliding the U-shaped block.

[0013] Furthermore, the positioning blades are all slidably connected to the U-shaped block, and through holes are opened on the inner sides of the positioning blades for cooperating with tools to slide and adjust the length of the positioning blades. The top of the U-shaped block is threaded with screws for fixing the positioning blades.

[0014] Further, the pressing assembly includes a side plate, and the side plate is located on the outside of the lower module;

[0015] The positioning assembly further includes a cam, which is rotatably mounted on the outer side of the lower module through a support plate, and the cam is driven by the side plate to rotate in one direction, so as to push the U-shaped block toward the stacked substrate through a rotational force;

[0016] Wherein, the positioning assembly also includes a spring arranged on the outside of the lower module, which is used to drive the U-shaped block to automatically reset.

[0017] Furthermore, a tooth plate is fixedly provided on the outer side of the side plate, and the tooth plate is located on the outer side of the positioning assembly;

[0018] A tooth block is fixedly provided at the shaft end of the cam, and the cam is driven by the power of the tooth plate when it moves downward to push the U-shaped block to slide a certain distance. After the tooth block rotates more than 180°, it rotates downward and resets by its own gravity;

[0019] When the tooth plate moves upward to reset, it cannot drive the cam to rotate upward to push the U-shaped block to slide.

[0020] Furthermore, a vertical plate is fixedly arranged on the outer side of the lower module, and an elastic pin is arranged on a side of the vertical plate close to the baffle;

[0021] The pressing assembly also includes two slide rails and baffles fixed at the ends of the two slide rails, a slide plate is slidably arranged between the two slide rails, a pressing block is arranged at the bottom of the slide plate, and the slide rails are all slidably arranged on the outside of the slide rod;

[0022] A wedge-shaped block A is fixedly arranged on the top of the baffle plate corresponding to the elastic pin, and a locking hole is opened on the inner side of the baffle plate corresponding to the elastic pin. The elastic pin automatically disengages from the locking hole after the slide plate slides horizontally.

[0023] Furthermore, a wedge-shaped block B is fixedly provided on the side of the top of the slide away from the baffle, which is used to drive the slide to translate and descend under the horizontal thrust, and a latch is fixedly provided on the side of the slide close to the baffle corresponding to the lock hole;

[0024] Among them, the slide plate is subjected to horizontal thrust to insert the pin into the lock hole and then move downward. When the slide plate moves downward, the lock hole and the elastic pin are automatically staggered with each other, and when the slide plate is reset upward, the pin is driven away from the lock hole, which is used to trigger the self-locking action of the elastic pin on the baffle.

[0025] Furthermore, a vertical plate is fixedly provided on the top of the lower module, and a slope A is provided on the side of the top of the vertical plate away from the elastic pin, which is used to drive the pressing block to be positioned at the pressing position during the pressing process;

[0026] Slide grooves A adapted to the slide rails are provided on both sides of the slide plate, a cutout is provided at one end of the bottom of the slide groove A close to the vertical plate, a slope B adapted to the slope A is provided on the side of the cutout away from the elastic pin, and a plate hole adapted to the vertical plate is provided at the top of the slide groove A.

[0027] Furthermore, it also includes a material taking assembly, which is symmetrically arranged on both sides of the pressing block and is used for the pressing block to move upward to drive the stacked substrate to be separated from the interior of the lower module;

[0028] The material taking assembly comprises two groups of connecting rods, which are rotatably arranged on both sides of the pressing block respectively, and the two connecting rods in each group are fixedly provided with a hook at one end away from each other, and a counterweight wheel is rotatably arranged at the other end;

[0029] Among them, a magnetic attraction plate is slidably arranged inside the pressing block, and the magnetic attraction plate is located at the top of the connecting rod. A pull rod is fixedly arranged at one end of the magnetic attraction plate, which is used to pull the magnetic attraction plate to slide and release the adsorption of the connecting rod.

[0030] Furthermore, it also includes a locking assembly, which is located outside the side plate and is used to lock the side plate during cooling;

[0031] The locking assembly includes a locking plate fixed to the outside of the side plate and a fixing plate fixed to the outside of the lower module, a wedge block C is fixedly provided on one side of the fixing plate close to the locking plate, a wedge block D is slidably provided on the inclined surface of the wedge block C, a fixing block is fixedly provided on the top of the fixing plate, a screw B is threadedly provided on the inner side of the fixing block, a hexagonal bolt head is fixedly provided on the top of the screw B, and the screw B is pressed against the wedge block D by an external torsion force.

[0032] Furthermore, the positioning assembly also includes a slider, which is slidably arranged on the inner side of the U-shaped block, and a receiving groove is provided on the side of the slider close to the positioning blade. An ear plate is fixedly arranged on the outer side of the slider, and a screw A is threadedly arranged on the inner side of the ear plate, and one end of the screw A is rotatably connected to the U-shaped block.

[0033] Beneficial Effects

[0034] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0035] The present invention is provided with a lower module to carry and transfer the stacked substrate. Before transferring to the laminating station for laminating, the U-shaped blocks on the four sides of the sliding lower module are used to push the positioning blades toward the outside of the stacked substrate, so that a plurality of preset positioning blades are used to position and straighten the corresponding core board, prepreg and copper foil in the stacked substrate, so as to prevent the core board, prepreg and copper foil from being seriously offset during the transfer process and affecting the processing quality of the circuit board. After positioning, the positioning blades are driven away from the stacked substrate by sliding the U-shaped blocks and then the laminating action is performed, so as to achieve the effect of conveniently positioning the stacked substrate before laminating. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 It is a three-dimensional structural schematic diagram of an embodiment of the present invention;

[0038] Figure 2 It is a structural schematic diagram of a module and a press-fit assembly according to an embodiment of the present invention;

[0039] Figure 3 It is a schematic diagram of the structure of the module in the embodiment of the present invention;

[0040] Figure 4 This is a schematic structural diagram of a sleeve mold according to an embodiment of the present invention;

[0041] Figure 5 It is a schematic structural diagram of a pressing assembly according to an embodiment of the present invention;

[0042] Figure 6 This is a schematic diagram of the structure of a baffle according to an embodiment of the present invention;

[0043] Figure 7 This is a schematic diagram of the structure of a skateboard according to an embodiment of the present invention;

[0044] Figure 8It is a structural schematic diagram of a positioning component according to an embodiment of the present invention;

[0045] Fig. 9 It is a structural schematic diagram of a locking assembly according to an embodiment of the present invention;

[0046] Fig.10 It is a schematic diagram of the coordination structure between the module and the conveying platform in an embodiment of the present invention;

[0047] Fig.11 It is a schematic diagram of the coordination structure between the module and the pressing device in an embodiment of the present invention.

[0048] The reference numerals in the figure represent: 100, laminated substrate;

[0049] 1. Lower module; 11. Slide bar; 12. Support plate; 13. Vertical plate; 14. Elastic pin; 15. Vertical plate; 16. Inclined surface A; 17. Heating plate; 18. Side hole; 19. Ball bearing; 110. Sleeve mold; 111. Adjustment port; 112. Bottom plate; 113. Positioning port;

[0050] 2. Press-fit assembly; 21. Side plate; 22. Tooth plate; 23. Slide rail; 24. Baffle plate; 241. Wedge block A; 242. Lock hole; 25. Slide plate; 251. Wedge block B; 252. Latch; 253. Slide groove A; 254. Notch; 255. Inclined surface B; 256. Plate hole; 26. Press-fit block; 27. Boss;

[0051] 3. Positioning assembly; 31. U-shaped block; 32. Positioning blade; 321. Through hole; 33. Screw; 34. Sliding block; 341. Accommodating groove; 342. Sliding groove B; 343. Ear plate; 35. Push plate; 36. Spring; 37. Connecting piece; 38. Cam; 381. Tooth block; 382. Roller; 39. Screw A;

[0052] 4. Material taking assembly; 41. Connecting rod; 42. Hook; 43. Counterweight wheel; 44. Magnetic plate; 45. Pull rod;

[0053] 5. Locking assembly; 51. Locking plate; 52. Fixing plate; 53. Wedge block C; 54. Wedge block D; 55. Fixing block; 56. Screw B; 57. Hexagon socket bolt head;

[0054] 6. Conveying platform; 61. Carrying plate; 62. Positioning block; 7. Closing device; 71. Electric push rod A; 72. Wedge block E; 8. Pressing device; 81. Hydraulic push rod; 82. Pressing plate;

[0055] 9. Unlocking assembly; 91. Bushing; 92. Flower shaft; 93. Hexagonal wrench; 94. Connecting frame; 95. Electric push rod B; 96. Support frame; 97. Gear ring; 98. Motor. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0057] The present invention will be further described below in conjunction with the embodiments.

[0058] Example:

[0059] See also Figure 1-Figure 11 The present invention provides a technical solution: a MiniLED circuit board processing fixture with a pressing structure, comprising:

[0060] A lower module 1, a slide bar 11 is fixedly disposed on the top of the lower module 1 for carrying the stacked substrate 100;

[0061] A pressing assembly 2, slidably disposed outside the slide bar 11, for pressing the laminated substrate 100;

[0062] The positioning assembly 3 is arranged around the inner side of the lower module 1 and is used to position the laminated substrate 100 before lamination;

[0063] Among them, the positioning component 3 includes a U-shaped block 31, which is slidably installed at the inner side of the lower module 1. A positioning blade 32 is provided on the side of the U-shaped block 31 close to the stacked substrate 100. A plurality of positioning blades 32 are stacked and arranged to laterally position a plurality of core boards, prepregs and copper foils in the stacked substrate 100 before lamination, and the positioning action of the stacked substrate 100 is released by sliding the U-shaped block 31.

[0064] The positioning blades 32 are all slidably connected to the U-shaped block 31. Through holes 321 are opened on the inner sides of the positioning blades 32 for slidingly adjusting the length of the positioning blades 32 with the help of tools. The top of the U-shaped block 31 is threaded with screws 33 for fixing the positioning blades 32.

[0065] The pressing assembly 2 includes a side plate 21, and the side plate 21 is located on the outer side of the lower module 1;

[0066] The positioning assembly 3 further includes a cam 38, which is rotatably mounted on the outer side of the lower module 1 through the support plate 12. The cam 38 is driven by the side plate 21 to rotate unidirectionally, and is used to push the U-shaped block 31 to approach the stacked substrate 100 through the rotation force;

[0067] The positioning assembly 3 further includes a spring 36 disposed on the outer side of the lower module 1 for driving the U-shaped block 31 to automatically reset.

[0068] The positioning assembly 3 also includes a slider 34, which is slidably arranged on the inner side of the U-shaped block 31. A receiving groove 341 is provided on the side of the slider 34 close to the positioning blade 32. An ear plate 343 is fixedly arranged on the outer side of the slider 34. A screw A39 is threadedly arranged on the inner side of the ear plate 343, and one end of the screw A39 is rotatably connected to the U-shaped block 31. Specifically, the slider 34 is slidably installed on the surrounding sides of the lower module 1. Side holes 18 are provided on the surrounding sides of the lower module 1, and balls 19 are provided on the top and bottom of the side holes 18. Slide grooves B342 are provided on the top and bottom of the receiving groove 341, and the slide grooves B342 cooperate with the balls 19. A push plate 35 is fixedly arranged on the outer side of the slider 34, and a spring 36 is fixedly arranged on the outer side of the push plate 35. The other end of the spring 36 is fixed to the outer side of the lower module 1 through a connecting piece 37.

[0069] A tooth plate 22 is fixedly disposed on the outer side of the side plate 21, and the tooth plate 22 is located on the outer side of the positioning assembly 3;

[0070] The shaft end of the cam 38 is fixedly provided with a tooth block 381. When the tooth plate 22 moves downward, the cam 38 pushes the U-shaped block 31 to slide a certain distance. After the tooth block 381 rotates more than 180°, it rotates downward and resets by its own gravity. The protruding end of the cam 38 is rotatably provided with a roller 382 to reduce the resistance during rotation.

[0071] When the tooth plate 22 moves upward to reset, it cannot drive the cam 38 to rotate upward to push the U-shaped block 31 to slide.

[0072] A vertical plate 13 is fixedly disposed on the outer side of the lower module 1, and an elastic pin 14 is disposed on one side of the vertical plate 13 close to the baffle 24;

[0073] The pressing assembly 2 also includes two slide rails 23 and baffles 24 fixed at the ends of the two slide rails 23. A slide plate 25 is slidably arranged between the two slide rails 23. A pressing block 26 is arranged at the bottom of the slide plate 25. The slide rails 23 are all slidably arranged on the outside of the slide rod 11. Correspondingly, a heating plate 17 is fixedly arranged at the bottom of the lower module 1. The heating plate 17 and the pressing block 26 heat the copper foil after power is turned on to ensure the hot pressing effect. A boss 27 for cooperating with the pressing device 8 is fixedly arranged on the top of the slide rail 23.

[0074] A wedge block A241 is fixedly arranged on the top of the baffle 24 corresponding to the elastic pin 14 , and a locking hole 242 is opened on the inner side of the baffle 24 corresponding to the elastic pin 14 . The elastic pin 14 automatically disengages from the locking hole 242 after the slide plate 25 slides horizontally.

[0075] A wedge block B251 is fixedly provided on the top of the slide plate 25 away from the baffle plate 24, and is used to drive the slide plate 25 to move and descend under the horizontal thrust. A latch 252 is fixedly provided on the side of the slide plate 25 close to the baffle plate 24 corresponding to the lock hole 242;

[0076] Among them, the slide plate 25 is subjected to horizontal thrust to insert the pin 252 into the lock hole 242 and then move downward. When the slide plate 25 moves downward, the lock hole 242 is automatically staggered with the elastic pin 14, and when the slide plate 25 is reset upward, it drives the pin 252 away from the lock hole 242, which is used to trigger the self-locking action of the elastic pin 14 on the baffle 24.

[0077] A vertical plate 15 is fixedly provided on the top of the lower module 1, and a slope A16 is provided on the side of the top of the vertical plate 15 away from the elastic pin 14, which is used to drive the pressing block 26 to be positioned at the pressing position during the pressing process;

[0078] Slide grooves A253 adapted to the slide rails 23 are provided on both sides of the slide plate 25, a cutout 254 is provided at one end of the bottom of the slide groove A253 close to the vertical plate 15, a slope B255 adapted to the slope A16 is provided on the side of the cutout 254 away from the elastic pin 14, and a plate hole 256 adapted to the vertical plate 15 is provided at the top of the slide groove A253.

[0079] It also includes a material taking component 4, which is symmetrically arranged on both sides of the pressing block 26, and is used for the pressing block 26 to move upward to drive the stacked substrate 100 to be separated from the interior of the lower module 1;

[0080] The material taking assembly 4 comprises two groups of connecting rods 41, which are rotatably arranged on both sides of the pressing block 26. The two connecting rods 41 in each group are fixedly provided with a hook 42 at one end away from each other, and a counterweight wheel 43 is rotatably arranged at the other end.

[0081] A magnetic plate 44 is slidably disposed inside the pressing block 26 , and the magnetic plate 44 is located at the top of the connecting rod 41 . A pull rod 45 is fixedly disposed at one end of the magnetic plate 44 , and is used to pull the magnetic plate 44 to slide and release the adsorption of the connecting rod 41 .

[0082] It also includes a locking assembly 5, which is located outside the side plate 21 and is used to lock the side plate 21 during cooling;

[0083] The locking assembly 5 includes a locking plate 51 fixed to the outside of the side plate 21 and a fixing plate 52 fixed to the outside of the lower module 1, a wedge block C53 is fixedly provided on one side of the fixing plate 52 close to the locking plate 51, a wedge block D54 is slidably provided on the inclined surface of the wedge block C53, a fixing block 55 is fixedly provided on the top of the fixing plate 52, a screw B56 is threadedly provided on the inner side of the fixing block 55, a hexagonal bolt head 57 is fixedly provided on the top of the screw B56, and the screw B56 is pressed against the wedge block D54 by an external torque force.

[0084] The principle and advantages of MiniLED circuit board processing fixture with pressing structure:

[0085] First, when the conventional laminated substrate 100 is placed inside the lower module 1 for transfer, it is usually transferred manually or by automated conveying equipment. During the transfer process, the core board, prepreg and copper foil in the laminated substrate 100 are easily vibrated and deviated due to their light weight. Although the length and width of the core board, prepreg and copper foil increase successively, a slight deviation within the reserved size range has little effect on the processing quality of the circuit board, but a more obvious deviation will cause the core board, prepreg and copper foil to be misaligned with each other, that is, there is no gap between the adjacent copper foil, prepreg and core board. The method is to completely cover the core board, the prepreg and the copper foil before lamination, so it is necessary to calibrate the core board, the prepreg and the copper foil before lamination to reduce the impact of large offset on the processing quality of the circuit board; it is worth noting that in order to ensure the transfer efficiency of the lower module 1 and the laminated substrate 100, the lower module 1 is transferred by the conveyor 6, and the sleeve mold 110 fixedly arranged on the outer side of the lower module 1 is wrapped around the lower module 1 to ensure the stability of the internal structure, and the outer adjustment port 111 is convenient for adjusting the initial position of the positioning blade 32, so that the positioning component 3 can adapt to the use of laminated substrates 100 of different sizes, and the bottom plate 112 at the bottom thereof The positioning opening 113 on the outside facilitates positioning with the positioning block 62 on the top of the carrier plate 61, so that the lower module 1 can be conveniently loaded on the top of the carrier plate 61, so as to facilitate the lower module 1 to be transported from the unloading station to the lid closing device 7, the pressing device 8 and the unloading station in sequence, and in order to facilitate the loading of materials into the lower module 1, at the loading station, the slide plate 25 in the pressing assembly 2 slides to one side and is in an open state, and after the materials are loaded and transferred to the station of the lid closing device 7, the lid closing device 7 applies a horizontal thrust to close the slide plate 25, and at the same time releases the locking effect on the height of the slide plate 25, and then the slide plate 25 is closed by the carrier plate 61. The carrier plate 61 drives the lower module 1 to be hot-pressed inside the laminating device 8, so that the hydraulic push rod 81 on the top of the laminating device 8 drives the pressing plate 82 to approach the top of the boss 27, so that the slide rail 23 drives the slide plate 25 and the laminating block 26 at the bottom thereof to approach the stacked substrate 100 inside the lower module 1. It should be noted that when the laminating block 26 moves down to the first height, the side plate 21 triggers the correction positioning action of the positioning component 3, and after the laminating block 26 moves down to the second height, the positioning component 3 automatically releases the correction positioning action and automatically resets, and then the stacked substrate 100 is pressed by the laminating block 26.

[0086] Its advantage is that the lower module 1 is driven by the carrying plate 61 to pass through the loading station, the cover closing device 7, the pressing device 8 and the unloading station in sequence, thereby ensuring the transfer efficiency of the stacked substrate 100, and in order to facilitate the loading of the stacked substrate 100 from the top to the lower module 1, the slide plate 25 slides to one side and is in an open state during loading, and when it is located at the station of the cover closing device 7, the slide plate 25 is automatically slid closed, and the height limit of the slide plate 25 is automatically released, so that it can move downward during subsequent pressing; when the lower module 1 is located at the pressing station of the pressing device 8, the pressing block 26 at the bottom of the slide plate 25 is moved downward along the slide rod 11 for pressing under the action of the hydraulic push rod 81, and the pressing block 26 will first drive the positioning component 3 to perform a correction and positioning on the stacked substrate 100 during the downward movement process. The stacked substrate 100 after the correction and positioning has a smaller offset during pressing, which prevents the stacked substrate 100 from having a large offset and affecting the processing quality.

[0087] When the positioning assembly 3 in the MiniLED circuit board processing fixture with a pressing structure of the present application is corrected and positioned, the slide rail 23 moves downward to drive the side plate 21 to move downward, so that the side plate 21 drives the tooth plate 22 to approach the outer side of the tooth block 381, and finally engages with the tooth block 381 to drive the cam 38 to rotate, so that the cam 38 pushes the push plate 35 on the outer side of the slider 34 through the roller 382 at the protruding end, and then the slider 34 drives the positioning blade 32 on one side of the U-shaped block 31 to approach the outer side of the laminated substrate 100, so as to achieve the correction and positioning effect; when the tooth plate 22 passes the tooth block 381, it drives the cam 38 to rotate at an angle greater than 180°, at this time, the cam 38 automatically rotates downward and resets by its own gravity, and then drives the tooth block 381 to reset. During the pressing process, the tooth plate 22 is located below the tooth block 381, and the slider 34 automatically resets under the action of the spring 36, without any The pressing of the stacked substrate 100 is affected; during the sliding process, the slider 34 cooperates with the ball 19 on the inner side of the side hole 18 through the slide groove B342 to maintain the stability and smoothness of sliding, and for stacked substrates 100 of different sizes, the distance between the U-shaped block 31 and the stacked substrate 100 can be adjusted by rotating the screw A39, and the distance is equal to the pushing distance of the cam 38 on the push plate 35. At the same time, for stacked substrates 100 with different reserved residual materials, the positioning blade 32 can be slid on one side of the U-shaped block 31 to adjust the extended length through the tool cooperation through the through hole 321, so that the corresponding positioning blade 32 can adapt to core boards, semi-cured sheets and copper foils of different lengths and widths; when the pressing block 26 moves upward to reset after pressing, the tooth plate 22 on the outer side of the side plate 21 cannot drive the cam 38 to rotate through the tooth block 381, so that the cam 38 maintains the initial state to prepare for the next correction positioning action.

[0088] It is worth mentioning that the above correction and positioning method has the following advantages:

[0089] Advantage 1: By rotating the screw A39 to adjust the distance between the U-shaped block 31 and the laminated substrate 100, the U-shaped block 31 can automatically cooperate with the outer side of the laminated substrate 100 to position after sliding a certain distance under the drive of the slider 34, and can adapt to the use of laminated substrates 100 of different sizes.

[0090] Advantage 2: When the distance between the U-shaped block 31 and the laminated substrate 100 is adjusted and fixed, the positioning blade 32 can be adapted to the positioning function of core boards and prepregs of different sizes by adjusting the extension length of the positioning blade 32 .

[0091] Advantage three, when the pressing block 26 descends, the tooth plate 22 can drive the cam 38 to rotate and push the slider 34 to slide to trigger the correction positioning action of the positioning blade 32, and it can automatically reset after the correction positioning to prevent affecting the subsequent pressing, and the cam 38 can automatically reset by its own gravity after the correction positioning is completed.

[0092] Advantage four, when the pressing block 26 moves upward to reset after pressing, the tooth plate 22 on the outside of the side plate 21 cannot drive the cam 38 to rotate in the opposite direction by an angle greater than 180°, so that the cam 38 always maintains its initial state before triggering the correction positioning, preparing for the next correction positioning work, and can be used repeatedly.

[0093] When loading materials, the pressing assembly 2 in the MiniLED circuit board processing fixture with a pressing structure of the present application slides the slide plate 25 located on the inner side of the slide rail 23 to one side of the pressing assembly 2, so that the space between the slide rail 23 and the baffle plate 24 is in an open state, so as to facilitate automatic loading from the top to the inside of the lower module 1 at the loading station. The loading action can be completed by a loading device such as a manipulator at the loading station. After loading, the lower module 1 is moved to the station of the cover closing device 7 under the drive of the carrier plate 61, so that the electric pusher Rod A71 pushes wedge block E72 to apply horizontal thrust to wedge block B251 at the top of slide plate 25. At this time, baffle plate 24 is locked to the outside of vertical plate 13 by elastic pin 14. Then slide plate 25 slides between slide rails 23 under the action of horizontal thrust until latch 252 at the outside of slide plate 25 is inserted into lock hole 242 and elastic pin 14 is pushed out to release the lock of baffle plate 24. As electric push rod A71 continues to apply thrust, wedge block E72 finally squeezes wedge block B251 downward to push slide plate 25. The slide rail 23 moves downward, so that the lock hole 242 on the inner side of the baffle 24 is offset from the elastic pin 14, and at this time, the outer side of the slide plate 25 is fitted with the outer side of the inclined surface A16 on the inclined surface B255; then the lower module 1 is transported to the inside of the pressing device 8 for pressing. During the pressing process, the slide rail 23 drives the slide plate 25 to move downward, so that the outer side of the slide plate 25 is inclined along the outer side of the inclined surface A16, and then the slide plate 25 drives the latch pin 252 to disengage from the inside of the lock hole 242, and pass through the outer plate hole 256 along the As the vertical plate 15 slides vertically, when the slide plate 25 moves upward after pressing, the vertical plate 15 makes the pin 252 on the outside of the slide plate 25 always stay away from the locking hole 242. Then, when the slide plate 25 moves to the highest point, it can drive the wedge block A241 on the top of the baffle 24 to squeeze the elastic pin 14 in the reset state, and finally make the elastic pin 14 inserted into the locking hole 242 again to lock the baffle 24, so as to lock the pressing assembly 2 above the lower module 1 for operation when unloading.

[0094] It is worth mentioning that the above-mentioned feeding method has the following advantages:

[0095] Advantage 1: The pressing block 26 is driven to one side of the lower module 1 by the horizontal sliding slide 25 to prevent obstruction of the space above the lower module 1, so as to facilitate placing the stacked substrate 100 from top to bottom inside the lower module 1 at the loading station, and the slide rail 23 used to support the slide 25 is locked at a certain height through the baffle 24 and the elastic pin 14 to ensure the stability of the pressing block 26 before pressing.

[0096] Advantage two, by setting a wedge block B251 on the top of the slide plate 25, when the wedge block B251 is subjected to the horizontal thrust of the electric push rod A71, it drives the slide plate 25 to slide between the two slide rails 23, so that when the slide plate 25 approaches the baffle plate 24, the elastic pin 14 automatically releases the lock on the baffle plate 24, and as the wedge block E72 squeezes the wedge block B251 to make the slide plate 25 move downward, the locking hole 242 on the inner side of the baffle plate 24 is misaligned with the elastic pin 14, preventing the elastic pin 14 from locking the baffle plate 24 again during the subsequent movement, thereby preparing for the subsequent pressing action in advance.

[0097] Advantage three, during the pressing process, the inclined surface B255 on the outside of the slide plate 25 cooperates with the inclined surface A16 to drive the pin 252 on one side of the slide plate 25 to disengage from the lock hole 242, and the slide plate 25 always slides along the vertical plate 15 during the lifting process, so that when the baffle 24 is reset upward again, it can automatically lock with the elastic pin 14 to ensure the stability of the pressing block 26 after pressing.

[0098] In practical applications, the processing and blanking methods of the laminated substrate 100 are as follows:

[0099] First, the lower module 1 is transported to the interior of the laminating device 8 through the carrier plate 61, so that the laminating device 8 presses down the laminating assembly 2 to press the laminated substrate 100. During the pressing process, the laminating assembly 2 can drive the positioning assembly 3 to perform one-side correction positioning, and then the hydraulic push rod 81 applies pressure to the laminating assembly 2 to make the laminating block 26 press the laminated substrate 100. During the pressing process, the heating plate 17 at the bottom of the laminating block 26 and the bottom of the lower module 1 can be heated by connecting the power supply through the conductive member to ensure the hot pressing effect;

[0100] When the laminated substrate 100 is cooled after hot pressing, in order to prevent the laminated substrate 100 from being affected by temperature during the cooling process and causing deformation and other adverse conditions, after hot pressing, while maintaining a certain pressure, the unlocking component 9 on the top of the pressing device 8 drives the locking component 5 to lock the side plate 21 to ensure that the pressing block 26 applies a certain pressure to the laminated substrate 100; specifically, the electric push rod B95 fixed to the top of the pressing device 8 by the support frame 96 pushes the connecting frame 94 to move downward, so that the connecting frame 94 drives the flower shaft 92 at the four corners to slide downward on the inside of the sleeve 91, and then the hexagonal wrench 93 at the bottom of the flower shaft 92 is close to the inside of the hexagonal bolt head 57 for cooperation, and at this time the motor 98 on the top of the pressing device 8 drives the gear ring 97 rotates, so that the gear ring 97 drives the inner meshing sleeve 91 to rotate at the top of the pressing device 8, thereby driving the hexagonal wrench 93 at the bottom of the flower shaft 92 to rotate. Under the drive of the electric push rod B95, the hexagonal wrench 93 can drive the hexagonal bolt head 57 to rotate and move downward with the feeding of the screw B56, so that the screw B56 presses down the wedge block D54. When the wedge block D54 moves downward, it squeezes and fixes the lock plate 51 under the pressure of the wedge block C53, thereby achieving the compression and fixation of the side plate 21; finally, the lower module 1 is moved out of the interior of the pressing device 8 through the carrier plate 61, and moved to the cooling channel for cooling, wherein the cooling channel is a prior art, and an unlocking component 9 is arranged at the top of the cooling channel, which will not be repeated here;

[0101] When disassembling the laminated substrate 100 after cooling, first drive the screw B56 to reverse through the unlocking assembly 9 at the top of the cooling channel to loosen the wedge block D54, release the pressure on the side plate 21, and then the slide rail 23 can drive the side plate 21 to move upward and reset; and in order to facilitate the removal of the laminated substrate 100 from the interior of the lower module 1, the laminated substrate 100 can be moved out of the interior of the lower module 1 by arranging a material taking assembly 4 on the outside of the pressing block 26; specifically, when the pressing block 26 is pressed, the counterweight wheel 43 at one end of the connecting rod 41 is supported by the bottom of the lower module 1 to push the connecting rod 41 to rotate, so that the top of the connecting rod 41 gradually approaches the bottom of the magnetic suction plate 44, and at this time, the hook 42 at the other end of the connecting rod 41 rotates downward, and the end gradually approaches the outside of the laminated substrate 100, and when the magnetic suction plate 44 adsorbs the connecting rod 41, the end of the hook 42 is located at the bottom of the semi-cured sheet in the laminated substrate 100, When the laminated substrate 100 has been cooled and the overall structure is stable, the laminated substrate 100 can be driven away from the interior of the lower module 1 by the curved hook 42 when the pressing block 26 moves upward. After the pressing assembly 2 is locked on the outside of the sliding rod 11, the slide plate 25 is slid to one side of the lower module 1 by applying a horizontal thrust, which can drive the laminated substrate 100 at the bottom of the pressing block 26 to be located on one side of the lower module 1, and then a horizontal thrust in the same direction as the thrust of the slide plate 25 is applied to the pull rod 45 to drive the magnetic suction plate 44 and the connecting rod 41 to slide and stagger with each other, thereby releasing the adsorption of the connecting rod 41, causing the counterweight wheel 43 to press the connecting rod 41 downward to rotate, and then driving the curved hook 42 to release the support for the laminated substrate 100, so that the laminated substrate 100 automatically disengages from the pressing block 26, so as to facilitate the removal of the laminated substrate 100. The horizontal thrust of the slide plate 25 and the pull rod 45 is realized by the existing pushing equipment, which will not be repeated here.

[0102] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A MiniLED circuit board processing jig with a pressing structure, characterized in that: include: A lower module, a sliding rod is fixedly arranged on the top of the lower module for carrying the stacked substrates; A pressing assembly, slidably disposed on the outside of the slide bar, for pressing the laminated substrates; Positioning components are arranged around the inner side of the lower module and are used to position the stacked substrates before lamination; The positioning assembly includes a U-shaped block, which is slidably mounted on the inner side of the lower module. A positioning blade is provided on one side of the U-shaped block close to the laminated substrate. A plurality of positioning blades are stacked and arranged to perform lateral positioning of a plurality of core boards, prepregs and copper foils in the laminated substrate before lamination, and the positioning action of the laminated substrate is released by sliding the U-shaped block. Wherein, the pressing assembly includes a side plate, and the side plate is located on the outside of the lower module; The positioning assembly further includes a cam, which is rotatably mounted on the outer side of the lower module through a support plate, and the cam is driven by the side plate to rotate in one direction, so as to push the U-shaped block toward the stacked substrate through a rotational force; Wherein, the positioning assembly further includes a spring arranged on the outer side of the lower module, which is used to drive the U-shaped block to automatically reset; A vertical plate is fixedly arranged on the outer side of the lower module, and an elastic pin is arranged on a side of the vertical plate close to the baffle; The pressing assembly also includes two slide rails and baffles fixed at the ends of the two slide rails, a slide plate is slidably arranged between the two slide rails, a pressing block is arranged at the bottom of the slide plate, and the slide rails are all slidably arranged on the outside of the slide rod; Wherein, a wedge block A is fixedly arranged on the top of the baffle plate corresponding to the elastic pin, and a lock hole is opened on the inner side of the baffle plate corresponding to the elastic pin, and the elastic pin automatically disengages from the lock hole after the slide plate slides horizontally; A wedge-shaped block B is fixedly provided on the side of the top of the slide away from the baffle, which is used to drive the slide to move and descend under the horizontal thrust, and a latch is fixedly provided on the side of the slide close to the baffle corresponding to the lock hole; In which, the slide is subjected to a horizontal thrust to insert the pin into the lock hole and then move downward, and the lock hole is automatically staggered with the elastic pin when the slide moves downward, and the slide is reset upward to drive the pin away from the lock hole, which is used to trigger the self-locking action of the elastic pin on the baffle, and a vertical plate is fixedly provided on the top of the lower module, and a slope A is provided on the side of the top of the vertical plate away from the elastic pin, which is used to drive the pressing block to the pressing position during the pressing process, and slide grooves A adapted to the slide rails are provided on both sides of the slide, and a notch is provided at one end of the bottom of the slide groove A close to the vertical plate, and a slope B adapted to the slope A is provided on the side of the notch away from the elastic pin, and a plate hole adapted to the vertical plate is provided on the top of the slide groove A.

2. The MiniLED circuit board processing jig with a pressing structure according to claim 1, characterized in that: The positioning blades are all slidably connected to the U-shaped block, and through holes are opened on the inner sides of the positioning blades for cooperating with tools to slide and adjust the length of the positioning blades. The top of the U-shaped block is threaded with screws for fixing the positioning blades.

3. The MiniLED circuit board processing jig with a pressing structure according to claim 1, characterized in that: A tooth plate is fixedly arranged on the outer side of the side plate, and the tooth plate is located on the outer side of the positioning assembly; A tooth block is fixedly provided at the shaft end of the cam, and the cam is driven by the power of the tooth plate when it moves downward to push the U-shaped block to slide a certain distance. After the tooth block rotates more than 180°, it rotates downward and resets by its own gravity; When the tooth plate moves upward to reset, it cannot drive the cam to rotate upward to push the U-shaped block to slide.

4. The MiniLED circuit board processing jig with a pressing structure according to claim 1, characterized in that: It also includes a material taking assembly, which is symmetrically arranged on both sides of the pressing block and is used for the pressing block to move upward to drive the stacked substrate to be separated from the interior of the lower module; The material taking assembly comprises two groups of connecting rods, which are rotatably arranged on both sides of the pressing block respectively, and the two connecting rods in each group are fixedly provided with a hook at one end away from each other, and a counterweight wheel is rotatably arranged at the other end; Among them, a magnetic attraction plate is slidably arranged inside the pressing block, and the magnetic attraction plate is located at the top of the connecting rod. A pull rod is fixedly arranged at one end of the magnetic attraction plate, which is used to pull the magnetic attraction plate to slide and release the adsorption of the connecting rod.

5. The MiniLED circuit board processing jig with a pressing structure according to claim 1, characterized in that: It also includes a locking assembly, which is located outside the side plate and is used to lock the side plate during cooling; The locking assembly includes a locking plate fixed to the outside of the side plate and a fixing plate fixed to the outside of the lower module, a wedge block C is fixedly provided on one side of the fixing plate close to the locking plate, a wedge block D is slidably provided on the inclined surface of the wedge block C, a fixing block is fixedly provided on the top of the fixing plate, a screw B is threadedly provided on the inner side of the fixing block, a hexagonal bolt head is fixedly provided on the top of the screw B, and the screw B is pressed against the wedge block D by an external torsion force.

6. The MiniLED circuit board processing jig with a pressing structure according to claim 1, characterized in that: The positioning assembly also includes a slider, which is slidably arranged on the inner side of the U-shaped block. A receiving groove is provided on the side of the slider close to the positioning blade. An ear plate is fixedly arranged on the outer side of the slider. A screw A is threadedly arranged on the inner side of the ear plate. One end of the screw A is rotatably connected to the U-shaped block.

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