Stamping die for circuit board production

Abstract

The invention relates to the technical field of printed circuit manufacturing, in particular to a stamping die for circuit board production. Comprising an upper mold and a lower mold, the lower mold comprises a fixing frame and positioning rods, the positioning rods are installed at the top of the fixing frame at intervals, the upper mold comprises an installation frame, the installation frame is located over the fixing frame, positioning holes are formed in the bottom of the installation frame at intervals, a sliding seat is arranged on the fixing frame in a sliding mode, and a supporting module is arranged on the sliding seat in a sliding mode; a printed circuit board is placed on the supporting module, and a stamping module is arranged in the mounting frame in a sliding mode and used for stamping the printed circuit board. By integrating the electric cleaning brush and the dust collector system, dust and chippings generated in the stamping process can be effectively removed, the situation that the dust and the chippings are pressed into a printed circuit board to cause physical damage or unstable electrical performance is avoided, the quality and reliability of finished products are improved, and workers can conveniently conduct centralized treatment on the dust and the chippings.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing printed circuits, and particularly to a stamping die for printed circuit board production. Background Art

[0002] A printed circuit board can be called a printed wiring board or a printed circuit board. With the rapid development of electronic devices towards miniaturization and multi-functional integration, as a basic component for connecting and supporting between electronic components - the manufacturing precision and production efficiency of printed circuit boards (PCBs) are facing increasingly high requirements. In this context, stamping dies, as key tools for achieving precise cutting, forming, and punching, play an indispensable role in ensuring the quality of PCB products.

[0003] During the stamping process of traditional stamping dies, dust or debris generated is likely to remain on the die surface. This causes the dust or debris to be easily pressed into the surface of the next printed circuit board when the die stamps the next one, thus having an adverse impact on the finished product quality. It will not only cause physical damage to the circuit board, such as scratches or fractures, but may also lead to instability in electrical performance. Worse still, once these residues are not cleaned in time, as the number of times the stamping die presses in increases, the residues tend to adhere more and more firmly to the die, making subsequent cleaning extremely difficult and affecting the continuity and efficiency of production. Summary of the Invention

[0004] In view of this, the present invention provides a stamping die for printed circuit board production, which can solve the drawbacks that during the stamping process of traditional stamping dies, dust or debris generated is likely to remain on the die surface, which is not only likely to cause physical damage to the printed circuit board, but also troublesome for subsequent cleaning.

[0005] The technical solution of the present invention is as follows: A stamping die for printed circuit board production includes an upper die and a lower die. The lower die includes a fixed frame and positioning rods. The positioning rods are installed at intervals on the top of the fixed frame. The upper die includes an installation frame. The installation frame is located directly above the fixed frame. Positioning holes are provided at intervals at the bottom of the installation frame. A sliding seat is slidably arranged on the fixed frame. A support module is slidably arranged on the sliding seat. The support module is used for placing the printed circuit board. A stamping module is slidably arranged in the installation frame. The stamping module is used for stamping the printed circuit board. Limiting mechanisms are provided on both the fixed frame and the installation frame. The limiting mechanisms are used for limiting the sliding seat and the stamping module. A pressing mechanism for pressing the printed circuit board is provided on the stamping module. An electric slide rail is installed on the side of the fixed frame. A hollow frame is connected to the slider of the electric slide rail. Electric cleaning brushes are symmetrically rotatably arranged on the hollow frame. The electric cleaning brushes are used for cleaning foreign matters adhered to the support module and the pressing mechanism. A vacuum cleaner and a converging frame are installed on the side of the hollow frame. The vacuum cleaner is used to suck the foreign matters into the converging frame through the hollow frame. A collecting mechanism for collecting foreign matters is provided in the converging frame.

[0006] In one embodiment, the limiting mechanism includes a first electric push rod, a first limiting block, a second electric push rod and a second limiting block. The first electric push rods are symmetrically arranged on the fixed frame. A first limiting block is connected to the telescopic rod of the first electric push rod. The first limiting block is used to limit the sliding seat. The second electric push rods are symmetrically arranged on the mounting frame. A second limiting block is connected to the telescopic rod of the second electric push rod. The second limiting block is used to limit the stamping module.

[0007] In one embodiment, the pressing mechanism includes a guide rod, a pressing plate and a first spring. The guide rods are slidably arranged at intervals on the stamping module. A pressing plate is connected between the bottoms of the guide rods. A through hole for the stamping module to pass through is formed in the pressing plate. The pressing plate is used to press the printed circuit board. A first spring is connected between the pressing plate and the stamping module.

[0008] In one embodiment, the collecting mechanism includes a filter cloth, a collecting frame and magnetic strips. The filter cloth is arranged in the converging frame. The filter cloth is used to filter foreign matters in the air. A collecting frame for collecting foreign matters is installed in the converging frame. The magnetic strips are symmetrically arranged on the converging frame. The magnetic strips are used to adsorb and fix the collecting frame.

[0009] In one embodiment, a guiding block is further included. The guiding blocks are symmetrically arranged on the fixed frame. The opposite sides of the two guiding blocks are both arranged as inclined surfaces. The inclined surfaces on the guiding blocks are used to guide the sliding seat and the supporting module.

[0010] In one embodiment, a positioning mechanism is further included. The positioning mechanism includes a limiting strip and a second spring. The limiting strip is slidably arranged on the supporting module. The limiting strip is used to position the printed circuit board. A second spring is connected between the limiting strip and the supporting module.

[0011] In one embodiment, a concentrating mechanism is further included. The concentrating mechanism includes a connecting plate, a third electric push rod and a movable frame. The connecting plate is arranged at the bottom of the fixed frame. The top of the connecting plate is used to collect the waste materials that fall after the stamping of the printed circuit board. The third electric push rods are symmetrically installed on the fixed frame. A movable frame is connected between the telescopic rods of the two third electric push rods. The bottom of the movable frame contacts the top of the connecting plate.

[0012] In one embodiment, a stabilizing mechanism is further included. The stabilizing mechanism includes a sealing ring and an air pump. The sealing ring is arranged at the top of the movable frame. The sealing ring contacts the bottom of the fixed frame. The air pump is installed on the side of the movable frame. The air inlet of the air pump is communicated with the movable frame.

[0013] Advantages of the present invention: 1. By integrating an electric cleaning brush and a vacuum cleaner system, the present invention can effectively remove dust and debris generated during the stamping process, preventing them from being pressed into the printed circuit board and causing physical damage or unstable electrical performance. This not only improves the quality and reliability of the finished product but also facilitates the centralized treatment of dust and debris by workers.

[0014] 2. By adopting a slidable sliding seat, a support module, and a stamping module, as well as a design equipped with a limiting mechanism, the present invention makes the installation and replacement of the mold more convenient and rapid, so as to adapt to the processing of printed circuit boards with different specifications and requirements.

[0015] 3. By setting a positioning mechanism, the present invention can ensure the precise positioning of the printed circuit board before stamping, preventing inaccurate stamping caused by position deviation. Then, through the application of a stabilizing mechanism, a negative pressure environment is created before stamping to fix the printed circuit board and prevent it from warping, ensuring high precision and flatness during the stamping process. Brief Description of the Drawings

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.

[0017] Figure 2 It is a three-dimensional structural schematic diagram of the fixing frame, sliding seat, and support module of the present invention.

[0018] Figure 3 It is a separated structural diagram of the fixing frame, sliding seat, and support module of the present invention.

[0019] Figure 4 It is a three-dimensional structural schematic diagram of the installation frame, stamping module, and pressing mechanism of the present invention.

[0020] Figure 5 It is a separated structural diagram of the installation frame and stamping module of the present invention.

[0021] Figure 6 It is a three-dimensional structural schematic diagram of the fixing frame, electric slide rail, and hollow frame of the present invention.

[0022] Figure 7 It is a three-dimensional structural schematic diagram of the collection mechanism of the present invention.

[0023] Figure 8 It is a separated diagram of the collection mechanism of the present invention.

[0024] Figure 9 It is a three-dimensional structural schematic diagram of the guiding block, limiting strip, and connecting plate of the present invention.

[0025] Figure 10 It is a three-dimensional structural schematic diagram of the positioning mechanism of the present invention.

[0026] Figure 11This is the structural separation diagram of the fixed frame, connecting plate and the third electric push rod of the present invention.

[0027] Reference numerals in the drawings: 101, fixed frame; 102, positioning rod; 201, mounting frame; 202, positioning hole; 3, sliding seat; 4, support module; 5, stamping module; 601, first electric push rod; 602, first limit block; 603, second electric push rod; 604, second limit block; 701, guide rod; 702, pressing plate; 703, first spring; 8, electric slide rail; 9, hollow frame; 10, electric cleaning brush; 11, vacuum cleaner; 12, converging frame; 1301, filter cloth; 1302, collection box; 1303, magnetic strip; 14, guide block; 15, limit strip; 16, second spring; 17, connecting plate; 18, third electric push rod; 19, movable frame; 20, sealing ring; 21, air pump. Detailed implementation manners

[0028] The present invention will be further described below in conjunction with the accompanying drawings and detailed implementation manners.

[0029] Embodiment: A stamping die for circuit board production, as shown in Figures 1-8 the figure, includes an upper die and a lower die; the lower die includes a fixed frame 101 and a positioning rod 102. The middle area of the fixed frame 101 is a hollow structure, and four positioning rods 102 are installed at intervals on the top of the fixed frame 101; the upper die includes a mounting frame 201. The mounting frame 201 is located directly above the fixed frame 101, and four positioning holes 202 are opened at intervals at the bottom of the mounting frame 201. The distribution of the four positioning holes 202 is consistent with the distribution of the four positioning rods 102; It also includes a sliding seat 3, a support module 4, a stamping module 5, a limiting mechanism, a pressing mechanism, an electric slide rail 8, a hollow frame 9, an electric cleaning brush 10, a vacuum cleaner 11, a converging frame 12 and a separating and collecting mechanism; a sliding seat 3 is slidably arranged on the fixed frame 101; a support module 4 is slidably arranged on the sliding seat 3, the top of the support module 4 is used for placing a printed circuit board, and a stamping hole for stamping the printed circuit board is opened on the support module 4; a stamping module 5 is slidably arranged in the installation frame 201, and the stamping module 5 is used for stamping the printed circuit board; limiting mechanisms are arranged on both the fixed frame 101 and the installation frame 201, and the limiting mechanisms are used for limiting the sliding seat 3 and the stamping module 5; a pressing mechanism for pressing the printed circuit board is arranged on the stamping module 5; an electric slide rail 8 is installed on the upper side of the rear of the fixed frame 101; the front side of the slider of the electric slide rail 8 is connected with a hollow frame 9; four electric cleaning brushes 10 are rotatably installed on the hollow frame 9 symmetrically up and down, and the electric cleaning brushes 10 are used for cleaning foreign matters adhered to the support module 4 and the pressing mechanism; a vacuum cleaner 11 is installed on the upper right side of the hollow frame 9, the middle part on the right side of the hollow frame 9 is communicated with a converging frame 12, the suction pipe of the vacuum cleaner 11 is communicated with the converging frame 12, and the vacuum cleaner 11 is used for sucking the foreign matters into the converging frame 12 through the hollow frame 9; a collecting mechanism for collecting foreign matters is arranged in the converging frame 12.

[0030] See Figures 2-5 As shown, the limiting mechanism includes a first electric push rod 601, a first limiting block 602, a second electric push rod 603 and a second limiting block 604; first electric push rods 601 are symmetrically arranged on the left and right sides of the fixed frame 101; a first limiting block 602 is connected to the telescopic rod of the first electric push rod 601, and the first limiting block 602 is used for limiting the sliding seat 3, and the opposite sides of the two first limiting blocks 602 are both set as inclined surfaces; second electric push rods 603 are symmetrically arranged on the left and right sides of the installation frame 201; a second limiting block 604 is connected to the telescopic rod of the second electric push rod 603, and the second limiting block 604 is used for limiting the stamping module 5, and the opposite sides of the two second limiting blocks 604 are both set as inclined surfaces.

[0031] See Figure 4 and Figure 5 As shown, the pressing mechanism includes a guide rod 701, a pressing plate 702 and a first spring 703; four guide rods 701 are slidably arranged on the stamping module 5 at intervals; a pressing plate 702 is connected between the bottoms of the four guide rods 701, a through hole for the stamping module 5 to pass through is opened on the pressing plate 702, and the pressing plate 702 is used for pressing the printed circuit board; four first springs 703 are connected between the top of the pressing plate 702 and the bottom of the stamping module 5.

[0032] See Figure 7 and Figure 8As shown, the collection mechanism includes a filter cloth 1301, a collection frame 1302, and a magnetic strip 1303; a filter cloth 1301 is arranged inside the converging frame 12, and the filter cloth 1301 is used to filter foreign matters in the air; a collection frame 1302 for collecting foreign matters is placed in the converging frame 12, the collection frame 1302 is located directly below the filter cloth 1301, and the material of the collection frame 1302 is iron; magnetic strips 1303 are symmetrically arranged before and after the converging frame 12, and the magnetic strips 1303 are used to attract and fix the collection frame 1302.

[0033] During use, first install the fixed frame 101 in the lower mold and the mounting frame 201 in the upper mold at the specified positions on the stamping device respectively, with the mounting frame 201 directly above the fixed frame 101. Then place the printed circuit board on top of the support module 4. Next, drive the upper mold downward by the stamping device, thereby driving the mounting frame 201, the stamping module 5, the guide rod 701, and the pressing plate 702 downward until the positioning rod 102 on the fixed frame 101 is completely docked with the positioning hole 202 on the mounting frame 201. During this period, when the pressing plate 702 contacts the printed circuit board, the pressing plate 702 will press the printed circuit board tightly against the top of the support module 4 to fix the printed circuit board. At the same time, the printed circuit board will block the downward movement of the pressing plate 702 and the guide rod 701. When the mounting frame 201 and the stamping module 5 continue to move downward, the first spring 703 is compressed. When the stamping module 5 passes through the through-hole in the pressing plate 702 and contacts the printed circuit board, the stamping module 5 will stamp the printed circuit board. The waste generated by the stamping of the printed circuit board will fall downward through the stamping hole on the support module 4, and the waste will fall out through the hollow structure in the middle of the fixed frame 101. After the printed circuit board is stamped, drive the upper mold upward to reset by the stamping device, thereby driving the mounting frame 201 and the stamping module 5 upward to reset. During this period, the first spring 703 will gradually return to its original state. After the first spring 703 is reset, the stamping module 5 will pull the guide rod 701 and the pressing plate 702 upward to reset through the first spring 703, so that the pressing plate 702 releases the stamped printed circuit board. Then take out the stamped printed circuit board from the top of the support module 4, and drive the hollow frame 9 and the electric cleaning brush 10 to move leftward by the electric slide rail 8. At the same time, control the electric cleaning brush 10 to rotate, and start the vacuum cleaner 11. When the electric cleaning brush 10 contacts the bottom of the pressing plate 702 and the top of the support module 4, the electric cleaning brush 10 will brush off the dust or debris adhered to the bottom of the pressing plate 702 and the top of the support module 4, so that the dust or debris detaches from the bottom of the pressing plate 702 and the top of the support module 4. Immediately afterwards, use the vacuum cleaner 11 to suck the dust or debris into the hollow frame 9, and the dust or debris will enter the converging frame 12 through the hollow frame 9. In this way, the dust or debris adhered to the bottom of the pressing plate 702 and the top of the support module 4 can be cleaned to facilitate the stamping of the next printed circuit board. After the dust or debris enters the converging frame 12, use the filter cloth 1301 to filter the dust or debris in the converging frame 12, so that the dust or debris is blocked below the filter cloth 1301. After the dust or debris adhered to the bottom of the pressing plate 702 and the top of the support module 4 is cleaned, drive the hollow frame 9 and the electric cleaning brush 10 to move rightward to reset by the electric slide rail 8. At the same time, control the electric cleaning brush 10 to stop rotating, and turn off the vacuum cleaner 11, so that the dust or debris below the filter cloth 1301 falls downward into the collection frame 1302 for collection. After that, repeat the above operations to repeat the stamping of the printed circuit board.When an appropriate amount of dust or debris is collected in the collection box 1302, the collection box 1302 is pulled out by moving it to the right, so that the collection box 1302 is separated from the magnetic strip 1303. Then, the dust or debris in the collection box 1302 is cleaned up, and the collection box 1302 is pushed back to its original position to the left, so that the collection box 1302 comes into contact with the magnetic strip 1303, thereby enabling the magnetic strip 1303 to adsorb the collection box 1302 to fix the collection box 1302. When it is necessary to replace the support module 4 and the stamping module 5, the first electric push rod 601 drives the first limiting block 602 to move towards the back side, so that the first limiting block 602 releases the limit on the sliding seat 3. Then, the sliding seat 3 is pulled out forward, and the support module 4 on the sliding seat 3 is pushed out to the left. In this way, the support module 4 can be removed. Then, the replaced support module 4 is pushed back to the sliding seat 3 to the right, and the sliding seat 3 is pushed back to the fixed frame 101 to the back. Then, the first electric push rod 601 drives the first limiting block 602 to move back to its original position towards the opposite side. When the inclined surface of the first limiting block 602 contacts the sliding seat 3, the first limiting block 602 will squeeze the sliding seat 3 to move back to its original position, so as to ensure that the position of the sliding seat 3 is completely reset. After the first limiting block 602 moves back to its original position, the first limiting block 602 will limit the sliding seat 3 to prevent the sliding seat 3 from shifting; then, the second electric push rod 603 drives the second limiting block 604 to move towards the back side, so that the second limiting block 604 releases the limit on the stamping module 5. Then, the stamping module 5 is pulled forward, and then the stamping module 5 and the pressing mechanism are replaced. Then, the replaced stamping module 5 is pushed back to its original position to the back. Then, the second electric push rod 603 drives the second limiting block 604 to move back to its original position towards the opposite side. When the inclined surface of the second limiting block 604 contacts the stamping module 5, the second limiting block 604 will squeeze the stamping module 5 to move back to its original position, so as to ensure that the position of the stamping module 5 is completely reset. After the second limiting block 604 moves back to its original position, the second limiting block 604 will limit the stamping module 5 to prevent the stamping module 5 from shifting. In this way, the replacement of the support module 4 and the stamping module 5 can be completed.

[0034] See Figure 9 As shown, it further includes a guide block 14; guide blocks 14 are symmetrically arranged on the upper left and right sides of the front of the fixed frame 101. The inclined surfaces on both sides of the two guide blocks 14 facing each other are used to guide the sliding seat 3 and the support module 4.

[0035] By setting the guiding block 14, when the sliding seat 3 is pushed backward onto the fixed frame 101, the inclined surface on the guiding block 14 can guide the sliding seat 3 and the support module 4, thus facilitating the sliding seat 3 to return into the fixed frame 101. When the support module 4 contacts the inclined surface of the guiding block 14, the inclined surface of the guiding block 14 will squeeze the support module 4, causing the support module 4 to completely return onto the sliding seat 3, avoiding the situation of the support module 4 being displaced on the sliding seat 3.

[0036] See Figure 9 and Figure 10 As shown, it further includes a positioning mechanism, and the positioning mechanism includes a limiting strip 15 and a second spring 16; a limiting strip 15 is slidably arranged on the top of the support module 4. The limiting strip 15 is L-shaped, and the right side surface of the limiting strip 15 is an inclined surface. The limiting strip 15 is used for positioning the printed circuit board; two second springs 16 are connected between the bottom of the limiting strip 15 and the support module 4.

[0037] By setting the positioning mechanism, when the printed circuit board is placed on the top of the support module 4, the rear side and the left side of the printed circuit board can be made to contact the limiting strip 15, thereby using the limiting strip 15 to position the printed circuit board for the worker to place it; when the pressing plate 702 is pressed down to contact the top of the limiting strip 15, or when the hollow frame 9 moves leftward to contact the inclined surface of the limiting strip 15, the pressing plate 702 or the hollow frame 9 will squeeze the limiting strip 15 to move downward, and the second spring 16 is compressed. When the pressing plate 702 moves upward to separate from the limiting strip 15, or when the hollow frame 9 moves rightward to separate from the limiting strip 15, the second spring 16 returns to its original state, and the second spring 16 drives the limiting strip 15 to move upward and reset.

[0038] See Figure 9 and Figure 11 As shown, it further includes a concentrating mechanism, and the concentrating mechanism includes a connecting plate 17, a third electric push rod 18 and a movable frame 19; a connecting plate 17 is arranged at the bottom of the fixed frame 101, and the top of the connecting plate 17 is used for collecting the waste materials that fall after the stamping of the printed circuit board; third electric push rods 18 are symmetrically installed on the front and rear sides of the lower side of the fixed frame 101; a movable frame 19 is connected between the telescopic rods of the two third electric push rods 18, and the bottom of the movable frame 19 contacts the top of the connecting plate 17.

[0039] By setting up a centralized mechanism, when the waste material falls out through the hollow structure in the middle of the fixed frame 101, the waste material will fall on the connecting plate 17 and accumulate inside the movable frame 19. After an appropriate amount of waste material has accumulated on the connecting plate 17, the third electric push rod 18 is used to drive the movable frame 19 to move to the left, so that the movable frame 19 pushes the waste material accumulated on the connecting plate 17 to the left. When the waste material separates from the connecting plate 17, the waste material will fall out from the left side of the connecting plate 17. In this way, it is convenient for workers to centrally process the waste material. After that, the third electric push rod 18 is used to drive the movable frame 19 to move to the right to reset it.

[0040] See Figure 11 As shown, it further includes a stabilizing mechanism. The stabilizing mechanism includes a sealing ring 20 and an air pump 21; a sealing ring 20 is arranged on the top of the movable frame 19, and the sealing ring 20 contacts the bottom of the fixed frame 101. The sealing ring 20 is used to seal between the fixed frame 101 and the movable frame 19; an air pump 21 is installed on the left front side of the movable frame 19, and the air inlet of the air pump 21 is communicated with the movable frame 19.

[0041] By setting up the stabilizing mechanism, after placing the printed circuit board on the top of the support module 4, the air pump 21 can be started to pump out the air inside the movable frame 19 and the fixed frame 101, so that a negative pressure is formed inside the movable frame 19 and the fixed frame 101, thereby pressing the printed circuit board tightly against the top of the support module 4 by the external pressure. In this way, it is possible to prevent the printed circuit board from warping on the top of the support module 4 and avoid problems such as inaccurate positioning and hole position deviation in subsequent stamping due to warping of the printed circuit board; after the printed circuit board is stamped, the air pump 21 can be turned off.

[0042] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention.

Claims

1. A stamping die for circuit board production, comprising an upper die and a lower die. The lower die includes a fixed frame (101) and positioning rods (102). The positioning rods (102) are installed at intervals on the top of the fixed frame (101). The upper die includes an installation frame (201). The installation frame (201) is located directly above the fixed frame (101). Positioning holes (202) are provided at intervals at the bottom of the installation frame (201). It is characterized in that, A sliding seat (3) is slidably arranged on a fixed frame (101), a support module (4) is slidably arranged on the sliding seat (3), a printed circuit board is placed on the support module (4), a stamping module (5) is slidably arranged in an installation frame (201), the stamping module (5) is used for stamping the printed circuit board, limiting mechanisms are arranged on both the fixed frame (101) and the installation frame (201), the limiting mechanisms are used for limiting the sliding seat (3) and the stamping module (5), a pressing mechanism for pressing the printed circuit board is arranged on the stamping module (5), an electric slide rail (8) is installed on the side of the fixed frame (101), a hollow frame (9) is connected to the slider of the electric slide rail (8), electric cleaning brushes (10) are symmetrically rotatably arranged on the hollow frame (9), the electric cleaning brushes (10) are used for cleaning foreign matters adhered to the support module (4) and the pressing mechanism, a dust collector (11) and a converging frame (12) are installed on the side of the hollow frame (9), the dust collector (11) is used for sucking the foreign matters into the converging frame (12) through the hollow frame (9), and a collecting mechanism for collecting the foreign matters is arranged in the converging frame (12).

2. A stamping die for printed circuit board production according to claim 1, characterized in that, The limiting mechanism includes a first electric push rod (601), a first limiting block (602), a second electric push rod (603) and a second limiting block (604). The first electric push rods (601) are symmetrically arranged on the fixed frame (101), the telescopic rod of the first electric push rod (601) is connected with the first limiting block (602), and the first limiting block (602) is used for limiting the sliding seat (3). The second electric push rods (603) are symmetrically arranged on the installation frame (201), the telescopic rod of the second electric push rod (603) is connected with the second limiting block (604), and the second limiting block (604) is used for limiting the stamping module (5).

3. A stamping die for circuit board production according to claim 2, characterized in that, The pressing mechanism includes a guide rod (701), a pressing plate (702) and a first spring (703). The guide rods (701) are slidably arranged at intervals on the stamping module (5), the pressing plate (702) is connected between the bottoms of the guide rods (701), a through hole for the stamping module (5) to pass through is formed in the pressing plate (702), the pressing plate (702) is used for pressing the printed circuit board, and a first spring (703) is connected between the pressing plate (702) and the stamping module (5).

4. A stamping die for circuit board production according to claim 3, characterized in that, The collecting mechanism includes a filter cloth (1301), a collecting frame (1302) and a magnetic strip (1303). The filter cloth (1301) is arranged in the converging frame (12), the filter cloth (1301) is used for filtering out foreign matters in the air, the collecting frame (1302) for collecting foreign matters is installed in the converging frame (12), the magnetic strips (1303) are symmetrically arranged on the converging frame (12), and the magnetic strips (1303) are used for sucking and fixing the collecting frame (1302).

5. A stamping die for circuit board production according to claim 4, characterized in that, It further includes guide blocks (14). The guide blocks (14) are symmetrically arranged on the fixed frame (101), the opposite sides of the two guide blocks (14) are both inclined surfaces, and the inclined surfaces on the guide blocks (14) are used for guiding the sliding seat (3) and the support module (4).

6. A stamping die for printed circuit board production according to claim 5, characterized in that, It further includes a positioning mechanism, which includes a limiting strip (15) and a second spring (16). The limiting strip (15) is slidably arranged on the support module (4). The limiting strip (15) is used to position the printed circuit board. A second spring (16) is connected between the limiting strip (15) and the support module (4).

7. A stamping die for circuit board production according to claim 6, characterized in that, It further includes a concentrating mechanism, which includes a connecting plate (17), a third electric push rod (18) and a movable frame (19). The connecting plate (17) is arranged at the bottom of the fixed frame (101). The top of the connecting plate (17) is used to collect the waste materials falling after the stamping of the printed circuit board. The third electric push rods (18) are symmetrically installed on the fixed frame (101). An activity frame (19) is connected between the telescopic rods of the two third electric push rods (18). The bottom of the movable frame (19) is in contact with the top of the connecting plate (17).

8. A stamping die for circuit board production according to claim 7, characterized in that, It further includes a stabilizing mechanism, which includes a sealing ring (20) and an air pump (21). The sealing ring (20) is arranged at the top of the movable frame (19). The sealing ring (20) is in contact with the bottom of the fixed frame (101). The air pump (21) is installed on the side of the movable frame (19). The air inlet of the air pump (21) is communicated with the movable frame (19).

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