Circuit board manufacturing method of large-size metalized through hole and circuit board

Abstract

The invention relates to a manufacturing method of a circuit board with a large-size metalized through hole and the circuit board, and the main points of the technical scheme are that the method comprises the steps: installing a supporting part in the large-size metalized through hole after carrying out a copper plate deposition process on the circuit board; applying a dry film to the opening of the large-size metalized through hole; after the circuit board is subjected to pressed film exposure, development and etching, the dry film on the large-size metalized through hole is removed, the supporting piece is taken out of the large-size metalized through hole, and a subsequent process is carried out; the method has the advantage of ensuring that the large-size metalized through hole can be normally sealed in the acid etching process.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and more specifically, to a method for manufacturing a circuit board with large-size metallized through holes and a circuit board. Background Art

[0002] Plated through hole (PTH) is a metallized hole set on the circuit board to connect the inner and outer layers of the circuit board. For large-sized plated through holes with a diameter greater than 9mm, an alkaline etching process is generally required after electroplating. Before alkaline etching, tin plating is used on the surface of the metal through hole to protect the copper layer in the metal through hole.

[0003] However, since some circuit boards are not suitable for alkaline etching, dry film sealing is required for acid etching. In the acid etching process, for large-sized metallized through holes, after dry film sealing, the dry film is thin and can be easily broken by high-pressure water flow during acid etching, resulting in sealing failure, etching of the copper layer in the metallized through hole, and affecting the conduction of the inner and outer layers of the circuit board. Therefore, how to ensure that large-sized metallized through holes can be properly sealed during acid etching has become a technical problem that needs to be solved urgently by technicians in this field. Summary of the invention

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a method for manufacturing a circuit board with large-sized metallized through holes and a circuit board to solve the above-mentioned technical problems.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions: A method for manufacturing a circuit board with large-sized metallized through holes, comprising:

[0006] After the copper plate electroplating process is carried out on the circuit board, the support parts are installed in the large-sized metallized through holes;

[0007] Apply dry film to large-sized plated through-hole openings;

[0008] After lamination, exposure, development and etching of the circuit board, the dry film on the large-sized metallized through-hole is removed, and the support is taken out from the large-sized metallized through-hole to enter the post-process.

[0009] The production process of circuit boards generally includes lamination, drilling, copper plate electroplating, dry film exposure, development, etching, and solder mask molding. Among them, the copper plate electroplating process metallizes the large-sized through holes, and copper layers are plated in the large-sized through holes to obtain large-sized metallized through holes. By installing a support member in the large-sized metallized through hole, the support member can support the dry film when applying a dry film to the opening of the large-sized metallized through hole, so that when acid etching is performed, the dry film is supported by the support member, ensuring that the large-sized metallized through hole can be sealed normally during the acid etching process, and preventing the dry film from being broken by high-pressure water flow. After etching, the dry film on the circuit board is removed, and the support member is removed from the large-sized metallized through hole, and the production of the circuit board with large-sized metallized through holes can be completed.

[0010] Optionally, the support member includes an elastic ring, and a support substrate corresponding to the thickness of the circuit board is arranged inside the elastic ring.

[0011] The support member composed of an elastic collar and a supporting substrate is used. The elastic collar is first put on the outside of the supporting substrate, and then the supporting substrate with the elastic collar is inserted into the large-sized metallized through hole. The supporting substrate turns the large-sized metallized through hole into a hole ring. The supporting substrate supports the middle part of the dry film, which can ensure that the dry film will not be broken by the high-pressure water flow. The elastic collar has a certain elastic deformation ability, which can fix the relative position of the supporting substrate and the large-sized metallized through hole, and improve the connection stability between the supporting substrate and the large-sized metallized through hole.

[0012] Optionally, after the drilling process, the locations of the large-sized metallized through holes to be processed on the circuit board are drilled to obtain large-sized through holes and drilled-out board materials.

[0013] After completing the drilling of the circuit board, use a gong cutter to gong out the large-sized through holes. At this time, the gong cutter is gonged into a ring shape, which can obtain the large-sized through holes to be processed and the gonged circuit board sheet, completing the pre-processing of the large-sized metallized through holes.

[0014] Optionally, drilling holes at locations where large-sized metallized through holes to be processed on the circuit board are located includes:

[0015] The circuit board is drilled along the hole edge of the large-size metallized through hole to be processed with a first preset distance as the ring width.

[0016] The hole edge of the large-sized metallized through hole to be processed is taken as the outer diameter, and the first preset distance is taken as the ring width. The circuit board hole ring can be used to obtain a large-sized through hole and a circuit board material with the same inner diameter as the ring. Among them, the first preset distance should be within the sealing capacity range of the dry film used to ensure that the dry film will not break through the ring area when the dry film is sealed.

[0017] Optionally, the outer diameter of the elastic ring is D+d, and the inner diameter is DLd; wherein D is the diameter of the large-sized metallized through hole, L is the first preset distance, and d is the preset thickening distance.

[0018] The outer diameter of the elastic collar is slightly larger than the diameter of the large-sized metallized through hole, and the inner diameter of the elastic collar is slightly smaller than the diameter of the supporting substrate, thereby ensuring the connection stability between the elastic collar, the supporting substrate and the large-sized metallized through hole.

[0019] Optionally, the first preset distance is 1.5mm-3.0mm.

[0020] The first preset distance is set to 1.5 mm-3.0 mm, which can meet the sealing capacity of most dry films.

[0021] Optionally, the preset thickening distance is 0.2mm-0.4mm.

[0022] The preset thickening distance is set to 0.2mm-0.4mm, which can meet the clamping requirements of the elastic ring and the supporting substrate, and at the same time facilitate the elastic ring to be clamped into the large-sized metallized through hole, ensuring the installation stability of the supporting substrate.

[0023] Optionally, the supporting substrate is a gong-out sheet material.

[0024] Directly using the gong-out sheet material as the supporting substrate can reduce production costs and improve the convenience of installing the supporting substrate and the elastic sleeve.

[0025] Optionally, the elastic ring is a silicone ring, a rubber ring, or a metal spring clamp.

[0026] The elastic collar is only used to fix the support substrate and the large-sized metallized through hole. A silicone collar or a rubber collar with a certain elastic deformation capacity can be selected, wherein the outer diameter of the elastic collar is slightly larger than the diameter of the large-sized metallized through hole, and the inner diameter of the elastic collar is slightly smaller than the diameter of the support substrate, thereby ensuring the connection stability between the elastic collar, the support substrate and the large-sized metallized through hole. A metal spring clamp can also be selected to fix the support substrate and the inner wall of the large-sized metallized through hole through the spring, which can also ensure the connection stability between the support substrate and the large-sized metallized through hole.

[0027] The present application also provides a circuit board, which is prepared using the circuit board manufacturing method with large-sized metallized through holes as described above.

[0028] In summary, the present invention has the following beneficial effects:

[0029] By installing a support composed of an elastic collar and a supporting substrate in a large-sized plated through hole, the large-sized plated through hole is turned into a hole ring. When a dry film is applied to the large-sized plated through hole, the support can support the dry film, thereby preventing the dry film from being broken by high-pressure water flow, ensuring that the large-sized plated through hole can be normally sealed during the acid etching process, and completing the production of a complete large-sized plated through hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 The present invention provides a flowchart of a method for manufacturing a circuit board with large-sized metallized through holes. DETAILED DESCRIPTION

[0031] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings. Several embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0033] In the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature. The terms "vertical", "horizontal", "left", "right", "above", "below" and similar expressions are for illustrative purposes only, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0034] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments.

[0035] Embodiment 1

[0036] This embodiment provides a method for manufacturing a circuit board with large-sized metallized through holes, such as Figure 1 As shown, including:

[0037] After the copper plate electroplating process is carried out on the circuit board, the support parts are installed in the large-sized metallized through holes;

[0038] Apply dry film to large-sized plated through-hole openings;

[0039] After lamination, exposure, development and etching of the circuit board, the dry film on the large-sized metallized through-hole is removed, and the support is taken out from the large-sized metallized through-hole to enter the post-process.

[0040] The production process of circuit boards generally includes lamination, drilling, copper plate electroplating, dry film exposure, development, etching, and solder mask molding. Among them, the copper plate electroplating process metallizes the large-sized through holes, and copper layers are plated in the large-sized through holes to obtain large-sized metallized through holes. By installing a support member in the large-sized metallized through hole, the support member can support the dry film when applying a dry film to the opening of the large-sized metallized through hole, so that when acid etching is performed, the dry film is supported by the support member, ensuring that the large-sized metallized through hole can be sealed normally during the acid etching process, and preventing the dry film from being broken by high-pressure water flow. After etching, the dry film on the circuit board is removed, and the support member is removed from the large-sized metallized through hole, and the production of the circuit board with large-sized metallized through holes can be completed.

[0041] Optionally, the support member includes an elastic ring, and a support substrate corresponding to the thickness of the circuit board is arranged inside the elastic ring.

[0042] The support member composed of an elastic collar and a supporting substrate is used. The elastic collar is first put on the outside of the supporting substrate, and then the supporting substrate with the elastic collar is inserted into the large-sized metallized through hole. The supporting substrate turns the large-sized metallized through hole into a hole ring. The supporting substrate supports the middle part of the dry film, which can ensure that the dry film will not be broken by the high-pressure water flow. The elastic collar has a certain elastic deformation ability, which can fix the relative position of the supporting substrate and the large-sized metallized through hole, and improve the connection stability between the supporting substrate and the large-sized metallized through hole.

[0043] Optionally, the outer diameter of the elastic ring is D+d, and the inner diameter is DLd; wherein D is the diameter of the large-sized metallized through hole, L is the first preset distance, and d is the preset thickening distance.

[0044] The outer diameter of the elastic collar is slightly larger than the diameter of the large-sized metallized through hole, and the inner diameter of the elastic collar is slightly smaller than the diameter of the supporting substrate, thereby ensuring the connection stability between the elastic collar, the supporting substrate and the large-sized metallized through hole.

[0045] Optionally, the first preset distance is 1.5mm-3.0mm.

[0046] The first preset distance is set to 1.5 mm-3.0 mm, which can meet the sealing capacity of most dry films. In this embodiment, the first preset distance is 1.5 mm.

[0047] Optionally, the preset thickening distance is 0.2mm-0.4mm.

[0048] The preset thickening distance is set to 0.2 mm-0.4 mm, which can meet the requirements of the clamping connection between the elastic collar and the supporting substrate, and at the same time facilitate the clamping of the elastic collar into the large-sized metallized through hole to ensure the installation stability of the supporting substrate. The preset thickening distance in this embodiment is 0.2 mm.

[0049] For example, the diameter of the large-sized metallized through hole in this embodiment is 10 mm, and the outer diameter of the elastic ring is 10.2 mm and the inner diameter is 8.3 mm.

[0050] Optionally, the elastic ring is a silicone ring, a rubber ring, or a metal spring clamp.

[0051] The elastic collar is only used to fix the support substrate and the large-sized metallized through hole. A silicone collar or a rubber collar with a certain elastic deformation capacity can be selected, wherein the outer diameter of the elastic collar is slightly larger than the diameter of the large-sized metallized through hole, and the inner diameter of the elastic collar is slightly smaller than the diameter of the support substrate, thereby ensuring the connection stability between the elastic collar, the support substrate and the large-sized metallized through hole. A metal spring clamp can also be selected to fix the support substrate and the inner wall of the large-sized metallized through hole through the spring, which can also ensure the connection stability between the support substrate and the large-sized metallized through hole.

[0052] Specifically, the elastic ring in this embodiment is a silicone ring, and the supporting substrate is a polypropylene (PP) plate that matches the inner diameter of the silicone ring, and the thickness of the polypropylene plate is consistent with the thickness of the circuit board.

[0053] In this embodiment, a support member composed of an elastic ring and a supporting substrate is installed in the large-sized metallized through hole to convert the large-sized metallized through hole into a hole ring. When a dry film is applied to the large-sized metallized through hole, the support member can support the dry film, thereby preventing the dry film from being broken by high-pressure water flow, ensuring that the large-sized metallized through hole can be normally sealed during the acid etching process, and completing the production of a complete large-sized metallized through hole.

[0054] Embodiment 2

[0055] This embodiment provides a method for manufacturing a circuit board with large-sized metallized through holes, comprising:

[0056] After the copper plate electroplating process is carried out on the circuit board, the support parts are installed in the large-sized metallized through holes;

[0057] Apply dry film to large-sized plated through-hole openings;

[0058] After lamination, exposure, development and etching of the circuit board, the dry film on the large-sized metallized through-hole is removed, and the support is taken out from the large-sized metallized through-hole to enter the post-process.

[0059] The production process of circuit boards generally includes lamination, drilling, copper plate electroplating, dry film exposure, development, etching, and solder mask molding. Among them, the copper plate electroplating process metallizes the large-sized through holes, and copper layers are plated in the large-sized through holes to obtain large-sized metallized through holes. By installing a support member in the large-sized metallized through hole, the support member can support the dry film when applying a dry film to the opening of the large-sized metallized through hole, so that when acid etching is performed, the dry film is supported by the support member, ensuring that the large-sized metallized through hole can be sealed normally during the acid etching process, and preventing the dry film from being broken by high-pressure water flow. After etching, the dry film on the circuit board is removed, and the support member is removed from the large-sized metallized through hole, and the production of the circuit board with large-sized metallized through holes can be completed.

[0060] Optionally, the support member includes an elastic ring, and a support substrate corresponding to the thickness of the circuit board is arranged inside the elastic ring.

[0061] The support member composed of an elastic collar and a supporting substrate is used. The elastic collar is first put on the outside of the supporting substrate, and then the supporting substrate with the elastic collar is inserted into the large-sized metallized through hole. The supporting substrate turns the large-sized metallized through hole into a hole ring. The supporting substrate supports the middle part of the dry film, which can ensure that the dry film will not be broken by the high-pressure water flow. The elastic collar has a certain elastic deformation ability, which can fix the relative position of the supporting substrate and the large-sized metallized through hole, and improve the connection stability between the supporting substrate and the large-sized metallized through hole.

[0062] Optionally, after the drilling process, the locations of the large-sized metallized through holes to be processed on the circuit board are drilled to obtain large-sized through holes and drilled-out board materials.

[0063] After completing the drilling of the circuit board, use a gong cutter to gong out the large-sized through holes. At this time, the gong cutter is gonged into a ring shape, which can obtain the large-sized through holes to be processed and the gonged circuit board sheet, completing the pre-processing of the large-sized metallized through holes.

[0064] Optionally, drilling holes at locations where large-sized metallized through holes to be processed on the circuit board are located includes:

[0065] The circuit board is drilled along the hole edge of the large-size metallized through hole to be processed with a first preset distance as the ring width.

[0066] The hole edge of the large-sized metallized through hole to be processed is taken as the outer diameter, and the first preset distance is taken as the ring width. The circuit board hole ring can be used to obtain a large-sized through hole and a circuit board material with the same inner diameter as the ring. Among them, the first preset distance should be within the sealing capacity range of the dry film used to ensure that the dry film will not break through the ring area when the dry film is sealed.

[0067] Specifically, since the large-sized metallized through hole may be a round hole, a slotted hole or a special-shaped hole, the hole edge along the large-sized metallized through hole is the outer diameter of the movement of the gong cutter, and the first preset distance is used as the gong hole range to gong out the hole ring, so that the large-sized through hole and the corresponding circuit board material can be obtained.

[0068] Optionally, the outer diameter of the elastic ring is D+d, and the inner diameter is DLd; wherein D is the diameter of the large-sized metallized through hole, L is the first preset distance, and d is the preset thickening distance.

[0069] The outer diameter of the elastic collar is slightly larger than the diameter of the large-sized metallized through hole, and the inner diameter of the elastic collar is slightly smaller than the diameter of the supporting substrate, thereby ensuring the connection stability between the elastic collar, the supporting substrate and the large-sized metallized through hole.

[0070] Specifically, for a circular hole, the size of the elastic collar can be directly set using the above size. If the large-sized metallized through hole is a slotted hole or a special-shaped hole, the edge of the large-sized metallized through hole extending outward d is used as the outer size of the elastic collar, and the edge of the large-sized metallized through hole extending inward L+d is used as the inner size of the elastic collar.

[0071] Optionally, the first preset distance is 1.5mm-3.0mm.

[0072] The first preset distance is set to 1.5 mm-3.0 mm, which can meet the sealing capacity of most dry films. In this embodiment, the first preset distance is 3.0 mm.

[0073] Optionally, the preset thickening distance is 0.2mm-0.4mm.

[0074] The preset thickening distance is set to 0.2mm-0.4mm, which can meet the clamping requirements of the elastic collar and the supporting substrate, and facilitate the insertion of the elastic collar into the large-sized metallized through hole, thereby ensuring the installation stability of the supporting substrate. In this embodiment, the preset thickening distance is 0.4mm.

[0075] For example, the large-sized metallized through hole in this embodiment is a circular hole with a diameter of 10 mm, and the outer diameter of the elastic ring is 10.4 mm and the inner diameter is 6.6 mm.

[0076] Optionally, the supporting substrate is a gong-out sheet material.

[0077] Directly using the gong-out sheet material as the supporting substrate can reduce production costs and improve the convenience of installing the supporting substrate and the elastic sleeve.

[0078] Optionally, the elastic ring is a silicone ring, a rubber ring, or a metal spring clamp.

[0079] The elastic collar is only used to fix the support substrate and the large-sized metallized through hole. A silicone collar or a rubber collar with a certain elastic deformation capacity can be selected, wherein the outer diameter of the elastic collar is slightly larger than the diameter of the large-sized metallized through hole, and the inner diameter of the elastic collar is slightly smaller than the diameter of the support substrate, thereby ensuring the connection stability between the elastic collar, the support substrate and the large-sized metallized through hole. A metal spring clamp can also be selected to fix the support substrate and the inner wall of the large-sized metallized through hole through the spring, which can also ensure the connection stability between the support substrate and the large-sized metallized through hole.

[0080] In this embodiment, the elastic ring is a rubber ring.

[0081] In this embodiment, after drilling a hole in the circuit board, the circuit board is drilled with the hole edge of the large-sized metallized through hole to be processed as the outer diameter and the first preset distance as the ring width to obtain a large-sized through hole and a drilled sheet material with the same inner diameter as the ring. The drilled sheet material is used as a supporting substrate, which can reduce production costs and improve the convenience of installing the supporting substrate and the elastic ring.

[0082] Embodiment 3

[0083] This embodiment provides a circuit board, which is prepared by the method for manufacturing a circuit board with large-sized metallized through holes as described in the first embodiment.

[0084] In a circuit board of the present embodiment, since a support is provided in the large-sized metallized through hole before acid etching, the large-sized metallized through hole is converted into a hole ring, and the ring width is within the sealing capacity range of the dry film used, so as to ensure that the dry film will not break through the ring area during the dry film sealing, thereby ensuring that the large-sized metallized through hole can be normally sealed during the acid etching process, so that after the circuit board is subjected to the acid etching process, the large-sized metallized through hole can remain intact, ensuring that the inner and outer layers of the circuit board are conductive.

[0085] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A method for manufacturing a circuit board with large-sized metallized through holes, characterized in that: include: After the copper plate electroplating process is carried out on the circuit board, the support parts are installed in the large-sized metallized through holes; Apply dry film to large-sized plated through-hole openings; After lamination, exposure, development and etching of the circuit board, the dry film on the large-sized metallized through-hole is removed, and the support is taken out from the large-sized metallized through-hole to enter the post-process.

2. A method for manufacturing a circuit board with large-sized metallized through holes according to claim 1, characterized in that: The support member comprises an elastic sleeve ring, in which a support base material corresponding to the thickness of the circuit board is arranged.

3. The method for manufacturing a circuit board with large-sized metallized through holes according to claim 2, characterized in that: After the drilling process, the locations of the large-sized metallized through holes to be processed on the circuit board are drilled to obtain large-sized through holes and drilled-out sheets.

4. The method for manufacturing a circuit board with large-sized metallized through holes according to claim 3, characterized in that: The method of drilling holes at locations where large-sized metallized through holes to be processed are located on the circuit board includes: The circuit board is drilled along the hole edge of the large-size metallized through hole to be processed with a first preset distance as the ring width.

5. The method for manufacturing a circuit board with large-sized metallized through holes according to claim 4, characterized in that: The outer diameter of the elastic collar is D+d, and the inner diameter is DLd; wherein D is the diameter of the large-sized metallized through hole, L is the first preset distance, and d is the preset thickening distance.

6. The method for manufacturing a circuit board with large-sized metallized through holes according to claim 5, characterized in that: The first preset distance is 1.5 mm-3.0 mm.

7. The method for manufacturing a circuit board with large-sized metallized through holes according to claim 5, characterized in that: The preset thickening distance is 0.2mm-0.4mm.

8. The method for manufacturing a circuit board with large-sized metallized through holes according to claim 3, characterized in that: The supporting substrate is a gong-out sheet material.

9. The method for manufacturing a circuit board with large-sized metallized through holes according to claim 2, characterized in that: The elastic sleeve ring is one of a silicone sleeve ring, a rubber sleeve ring, or a metal spring clamp ring.

10. A circuit board, characterized in that: The large-sized metallized through hole is prepared by the method for making the large-sized metallized through hole as described in any one of claims 1 to 9.

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