A cold plate assembly, electronic device and liquid cooling system

Abstract

A cold plate assembly, electronic device, and liquid cooling system are disclosed. The cold plate assembly includes a cold plate body and a flexible plate. The cold plate body has refrigerant channels for refrigerant to flow through. The cold plate body is thermally connected to an electronic device, and the refrigerant conducts heat from the electronic device through the cold plate body, thereby dissipating heat from the electronic device. The flexible plate is integrated into the cold plate body and has high-speed signal lines and power interconnects, which are used for electrical connection to the electronic device. The high-speed signal lines are used to transmit high-speed signals to the electronic device, and the power interconnects are used to supply power to the electronic device. The flexible plate is made of a flexible material and is insulating. The cold plate assembly provides heat dissipation, signal transmission, and power supply functions, reducing cable connections in the electronic device. This helps to reduce the number of cables in the electronic device and decrease its size.

Description

[0001] This application is a divisional application. The original application has the application number 202310270108.1 and the original application date is March 14, 2023. The entire contents of the original application are incorporated herein by reference.

[0002] This application claims priority to Chinese Patent Application No. 202211559617.8, filed on December 6, 2022, entitled "A Circuit Board Assembly and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of electronic equipment technology, specifically to a cold plate assembly, electronic equipment, and liquid cooling system. Background Technology

[0004] With technological advancements, the demands on electronic devices are gradually increasing, and the interface speeds of these devices are also gradually improving, for example, from 25Gbps to 112Gbps. Interconnection between modules or individual boards is shifting from printed circuit board (PCB) architectures to high-speed cable interconnect architectures. Existing interconnection solutions utilize cables to achieve connectivity and power supply between modules or individual boards, but cables occupy a significant amount of space and are relatively complex to maintain. Summary of the Invention

[0005] This application provides a cold plate assembly, electronic device, and liquid cooling system, which enable the cold plate assembly to have three functions: heat dissipation, signal transmission, and power supply, thereby reducing cable connections, which is beneficial for reducing the number of cables in electronic devices and reducing the size of electronic devices.

[0006] Firstly, this application provides a cold plate assembly comprising a cold plate body and a flexible plate. The cold plate body has a refrigerant channel through which refrigerant flows. The cold plate body is thermally connected to an electronic device, whereby the refrigerant conducts heat from the electronic device through the cold plate body, thereby dissipating heat. The flexible plate is integrated into the cold plate body and includes high-speed signal lines and power interconnects, which are used for electrical connections to the electronic device. Specifically, the high-speed signal lines transmit high-speed signals to the electronic device, and the power interconnects supply power to the electronic device. The flexible plate is made of a flexible material and is insulating. In this technical solution, the cold plate assembly provides three functions: heat dissipation, signal transmission, and power supply. That is, the cold plate assembly can dissipate heat from electronic devices in a circuit board module and can achieve signal transmission and power supply connections between different circuit board modules, reducing cable connections. This helps reduce cables in electronic devices and decrease the size of the electronic devices.

[0007] When specifically configuring the flexible printed circuit board (FPCB), it can be integrated onto one side or both sides of the cold plate body. Firstly, integrating the FPCB onto the surface of the cold plate body facilitates the electrical connection of high-speed signal lines and power interconnects to electronic devices. Secondly, the FPCB can be integrated onto one side or both sides of the cold plate body, depending on requirements. This can be determined based on the number of circuit board modules connected to the cold plate assembly. For example, when the number of circuit board modules connected to the cold plate assembly is large, the FPCB can be integrated onto both sides of the cold plate body, allowing circuit board modules to be installed on both sides of the cold plate, further enhancing the integration of the electronic equipment.

[0008] The specific processes and methods used to integrate the flexible plate into the cold plate body are not limited. For example, the surface of the cold plate body can have a mounting groove, into which the flexible plate is embedded. Alternatively, the flexible plate can be directly attached to the surface of the cold plate body. Furthermore, the flexible plate can be fixedly connected to the cold plate body using processes such as bonding or welding, and this application does not impose any restrictions on this.

[0009] This application does not impose specific limitations on the size of the flexible plate. In one possible technical solution, the area of ​​the flexible plate is smaller than the surface area of ​​the cold plate body facing the flexible plate. Specifically, the flexible plate avoids the area where the cold plate body and the electronic device are thermally connected. This arrangement of the flexible plate allows the electronic device to be directly thermally connected to the cold plate body without the need for a flexible plate between them. This shortens the connection between the electronic device and the cold plate body, reduces thermal resistance, and improves the heat exchange efficiency of the electronic device.

[0010] The number and shape of the flexible circuit boards integrated into the aforementioned cold plate body are not limited and can be designed according to specific requirements. For example, the cold plate body can integrate one or more flexible circuit boards. When the cold plate body includes one flexible circuit board, the flexible circuit board can be of a regular or irregular shape. To avoid the area where the cold plate body and electronic devices are thermally connected, the flexible circuit board can have a perforated structure, allowing the cold plate body and electronic devices to be thermally connected through the perforated structure. In one technical solution, the edge shape of the flexible circuit board can be the same as the edge shape of the cold plate body. When the cold plate body includes multiple flexible circuit boards, the multiple flexible circuit boards can be positioned to avoid the area where the cold plate body and electronic devices are thermally connected. Regardless of the solution adopted, the main design idea is to avoid the area where the cold plate body and electronic devices are thermally connected and to shorten the connection path between different circuit board modules, thereby improving the heat dissipation capacity of the circuit board modules and improving the efficiency of signal transmission between different circuit board modules.

[0011] To improve the heat dissipation capacity of the flexible circuit board, an insulating thermal interface material layer can be provided between the flexible circuit board and the cold plate body. This allows the cold plate body to dissipate heat for the high-speed signal lines and power interconnects in the flexible circuit board, thereby extending the service life of the high-speed signal lines and power interconnects in the flexible circuit board.

[0012] In the specific implementation of the connection between the flexible board and the circuit board module, the flexible board can be equipped with a first connector, which is electrically connected to high-speed signal lines and power interconnects. Electronic components are connected to the first connector; specifically, the aforementioned electronic components can be connected to a second connector, and the first connector can be connected to the second connector, thereby achieving the connection between the electronic components and the first connector. In this solution, the electronic components of the circuit board module and the cold plate module are detachably connected, facilitating flexible adjustment of the connection relationship and the maintenance and replacement of the circuit board module.

[0013] The specific form of the first connector is not limited. For example, the first connector can be a flexible connector. The flexible connector has a certain degree of elasticity, which enables a floating connection between the circuit board module and the cold plate assembly to absorb the tolerance between the circuit board module and the cold plate assembly, reduce the coplanar constraint between the circuit board module and the cold plate assembly, and facilitate installation.

[0014] To facilitate the connection between the circuit board module and the cold plate assembly, the cold plate assembly can also include a first positioning component. This first positioning component includes a first guide pin and a second guide pin, with a preset distance between their opposing surfaces. The first positioning component is used to position the electronic components on the cold plate assembly. During actual installation, the distance between the electronic components and the first positioning component is a preset value, and the circuit board module has a second positioning component adapted to the first positioning component. The first and second positioning components first contact each other for initial positioning, improving the positioning accuracy between the circuit board module and the cold plate assembly and simplifying the installation process.

[0015] The aforementioned flexible circuit board enables signal transmission and power supply within the cold plate assembly. However, signal transmission and power supply may also be required between different cold plate assemblies. Therefore, the flexible circuit board in this application also includes a first inter-board connector, which is electrically connected to high-speed signal lines and power interconnects. The first inter-board connector is used for electrical connection with cables. In this solution, cables can also be used to connect the cold plate assembly to other circuit board assemblies via the first inter-board connector for signal transmission and power supply.

[0016] Secondly, this application also provides an electronic device comprising the cold plate assembly described in the first aspect, and multiple circuit board modules. Each circuit board module includes electronic components, is mounted on the cold plate assembly, and is electrically connected to high-speed signal lines and power interconnects. At least two circuit board modules are electrically connected via the high-speed signal lines and power interconnects. Specifically, the electronic components in each circuit board module are electrically connected to the high-speed signal lines and power interconnects, and the electronic components in at least two circuit board modules are electrically connected via the high-speed signal lines and power interconnects. In this solution, the cold plate assembly provides three functions: heat dissipation, signal transmission, and power supply. It can dissipate heat from the electronic components in the circuit board modules and enables signal transmission and power supply connections between different circuit board modules, reducing cable connections. This helps reduce the number of cables in the electronic device and decrease its size.

[0017] In one possible technical solution, the flexible plate is integrated on both sides of the cold plate body, and circuit board modules are respectively arranged on both sides of the cold plate assembly. One cold plate assembly can connect multiple circuit board modules, providing heat dissipation, signal transmission, and power supply for multiple circuit board modules, which helps to reduce the number of cold plate assemblies in electronic devices and improve the integration of electronic devices.

[0018] In the specific technical solution, the circuit board module includes a circuit board, electronic components, and a second connector. The electronic components and the second connector are disposed on the circuit board and electrically connected through the circuit board. The flexible board also includes a first connector, which is electrically connected to high-speed signal lines and power interconnects. The connection between the first and second connectors enables the electronic components to be electrically connected to the high-speed signal lines and power interconnects in the flexible board. In this solution, the electronic components of the circuit board module are detachably connected to the cold plate module, facilitating flexible adjustment of the connection relationship and maintenance and replacement of the circuit board module.

[0019] The specific forms of the first and second connectors are not limited. In one technical solution, the first and second connectors are flexible connectors. The flexible connectors in this solution enable a floating connection between the circuit board module and the cold plate assembly, thereby absorbing the tolerances between the circuit board module and the cold plate assembly, reducing the coplanar constraints between the circuit board module and the cold plate assembly, and facilitating installation.

[0020] To facilitate positioning during the connection of the circuit board module and the cold plate assembly, the cold plate assembly further includes a first positioning component. This first positioning component includes a first guide pin and a second guide pin, with a preset distance between their opposing surfaces. The circuit board module also includes a second positioning component, which includes a first bracket and a second bracket, with a preset distance between their opposing surfaces. The first and second brackets are installed between the first and second guide pins to position the circuit board module and the cold plate assembly. When installing the circuit board module onto the cold plate assembly, the first and second brackets are first inserted between the first and second guide pins, and then the first and second connectors are connected. This initial positioning by the first and second positioning components improves the positioning accuracy between the circuit board module and the cold plate assembly, simplifying the installation process.

[0021] To improve the heat dissipation effect of the cold plate body on electronic components, the cold plate body can be equipped with bosses, which are thermally connected to the electronic components. In this solution, in addition to signal transmission and power supply through high-speed signal lines and power interconnects in the flexible board, the circuit board module can also be equipped with a second inter-board connector for signal transmission and power supply between circuit board modules that are far apart or different cold plate components. This second inter-board connector can be connected to a cable, thus enabling signal transmission and power supply between circuit board modules that are far apart or different cold plate components using cables, thereby enriching the application scenarios of electronic devices.

[0022] The type of circuit board modules included in the electronic device in this application is not limited. For example, at least two circuit board modules may include a switching module and a computing module, with the computing modules arranged around the periphery of the switching module. The proximity of multiple computing modules to the switching module facilitates signal exchange via a cold plate assembly, thereby improving the signal transmission efficiency between the switching module and the computing module.

[0023] Thirdly, this application also provides a liquid cooling system, which includes a refrigeration device, a liquid pump, and the cold plate assembly described in the first aspect. The cold plate assembly is disposed in the electronic device described in the second aspect. The refrigeration device and the liquid pump are connected to the refrigerant flow channel of the cold plate body. Driven by the liquid pump, the refrigerant circulates between the refrigeration device and the refrigerant flow channel, thereby dissipating heat for the electronic components in the electronic device and improving the service life and computing power of the electronic components. Attached Figure Description

[0024] Figure 1 This is a schematic diagram illustrating the connection between circuit board modules in traditional technology.

[0025] Figure 2 A side view of an electronic device with a liquid cooling system provided in this application;

[0026] Figure 3 A top view of an electronic device provided in this application;

[0027] Figure 4 A schematic diagram of the side structure of a circuit board assembly provided in this application;

[0028] Figure 5 This application provides a structural schematic diagram of a cold plate assembly;

[0029] Figure 6 A partial cross-sectional view of another circuit board assembly provided in this application;

[0030] Figure 7 A schematic diagram of the structure of an electronic device provided in this application;

[0031] Figure 8 This is a schematic diagram of the side structure of a circuit board assembly provided in this application.

[0032] Figure label:

[0033] 1-Cable; 2-Circuit board module;

[0034] 3-Housing; 4-Circuit board assembly;

[0035] 5-Management circuit board; 6-Cold plate assembly;

[0036] 7-Liquid pump; 8-Refrigeration equipment;

[0037] 9-Liquid piping; 10-Liquid inlet channel;

[0038] 11-Liquid outlet channel; 12-Cold plate body;

[0039] 13-Flexible plate; 14-Refrigerant flow channel;

[0040] 15-Circuit board; 16-Electronic components;

[0041] 17-Insulating thermal interface material layer; 18-Boss;

[0042] 19 - First connector; 20 - Second connector;

[0043] 21-First guide pin; 22-Second guide pin;

[0044] 23-First bracket; 24-Second bracket;

[0045] 25 - First inter-board connector; 26 - Second inter-board connector. Detailed Implementation

[0046] Figure 1 This is a schematic diagram illustrating the connection between circuit board modules in traditional technology, such as... Figure 1 As shown, cable 1 is used to achieve signal transmission and power supply between different circuit board modules 2. Cable 1 occupies a lot of space, and the burden of cable management is also heavy. With the comprehensive application scenarios of high speed, high power density, high node power consumption, large bandwidth and low insertion loss, the size of cable 1 is also getting larger and larger, resulting in more circuit space being occupied and the burden of cable management being heavier. On the other hand, different circuit board modules 2 need to use cable 1 for signal transmission and / or power supply, which also increases the number of cables 1 in circuit board modules 2, the space occupied, and the maintenance complexity.

[0047] Therefore, this application provides a cold plate assembly that integrates the cold plate body with a flexible board 13 equipped with high-speed signal lines and power interconnects, making the cold plate assembly a structure with three functions: cooling, signal transmission, and power supply. This eliminates the need for cables 1 for signal transmission and / or power supply, reducing the size of electronic devices and simplifying their maintenance.

[0048] The cold plate assembly can be used to dissipate heat from electronic devices, which may be devices with high-power components, such as computing devices (e.g., servers), network devices (e.g., switches), or storage devices (e.g., storage arrays). Optionally, the electronic device may include a cabinet and nodes disposed within the cabinet. The nodes include circuit board modules 2, which include circuit boards 15, such as printed circuit boards (PCBs), and electronic devices 16 are disposed on the circuit boards 15. For ease of description, this embodiment uses a server as an example.

[0049] As servers become more feature-rich, the power consumption of the electronic components 16 mounted on the node's circuit board 15 also increases, generating more and more heat. For example, the circuit board 15 often houses multiple electronic components, including high-power devices such as central processing units (CPUs), artificial intelligence (AI) chips, or graphics processing units (GPUs) for performing computationally intensive or memory-intensive business data processing such as artificial intelligence or high-performance computing (HPC). As the computing power of the chips increases, the demand for heat dissipation also continues to increase.

[0050] It is worth noting that, in addition to cooling high-power devices such as CPUs and GPUs, the cold plate assembly of this application can also be used to dissipate heat from other devices according to business needs. For example, the cold plate assembly can also be used to dissipate heat from memory.

[0051] Figure 2 This application provides a side view of an electronic device with a liquid cooling system. Figure 3 This application provides a top view schematic diagram of the structure of an electronic device, as shown below. Figure 2 and Figure 3 As shown, the electronic device in this application includes a housing 3 and a circuit board assembly 4, and the electronic device is also equipped with a liquid cooling system. The circuit board assembly 4 is disposed within the housing 3. When the above-mentioned electronic device is a rack-mount server, the housing 3 can also be called a cabinet, and the circuit board assembly 4 can also be called a node, for example, in a blade server, the node is disposed within the cabinet. In a specific embodiment, the above-mentioned electronic device may include multiple nodes, and may also include a management circuit board 5. Each node can be electrically connected to the management circuit board 5 to transmit signals, realize power supply to the node, or communication between different nodes, etc.

[0052] The circuit board assembly 4 includes a cold plate assembly 6 and multiple circuit board modules 2, which are mounted on the cold plate assembly 6. In a specific embodiment, the liquid cooling system includes a liquid pump 7, a refrigeration device 8, a liquid pipeline 9, and the cold plate assembly 6. The liquid pump 7, the refrigeration device 8, and the cold plate assembly 6 are connected through the liquid pipeline 9. The liquid pump 7 drives the refrigerant to flow between the refrigeration device 8 and the cold plate assembly 6, so that the cold plate assembly 6 is used to dissipate heat from the circuit board modules 2.

[0053] Please combine Figure 2 When the cold plate assembly 6 is connected to the refrigeration equipment 8, the liquid pipeline 9 can include an inlet channel 10 and an outlet channel 11, which are respectively connected to the refrigeration equipment 8. The liquid pump 7 can be installed in the inlet channel 10 and / or the outlet channel 11. The refrigerant flows out of the refrigeration equipment 8 from the outlet channel 11 and flows to the cold plate assembly 6. After heat exchange in the cold plate assembly 6, it flows back to the refrigeration equipment 8 from the inlet channel 10 to achieve refrigerant circulation. In specific embodiments, the refrigerant flow channels 14 of different cold plate assemblies 6 can be connected in series or in parallel, and this application does not limit this. When cold plate assemblies 6 at different nodes are connected in parallel, the heat exchange efficiency is higher, and the heat dissipation effect on the circuit board module 2 is better. When different cold plate assemblies 6 are connected in series, the design of the liquid pipeline 9 can be simplified, which is beneficial to reducing the size of electronic equipment.

[0054] Figure 4 This is a schematic diagram of the side structure of a circuit board assembly provided in this application. Figure 3 and Figure 4As shown, the circuit board assembly 4 includes a cold plate assembly 6 and multiple circuit board modules 2. The circuit board modules 2 are detachably connected to the cold plate assembly 6, and the multiple circuit board modules 2 can be electrically connected through the cold plate assembly 6. Furthermore, the cold plate assembly 6 has a refrigerant flow channel 14 inside, through which the refrigerant flows under the drive of the liquid pump 7. In this technical solution, the cold plate assembly 6 has three functions: heat dissipation, signal transmission, and power supply. That is, the cold plate assembly 6 can dissipate heat for the electronic devices 16 in the circuit board modules 2, and can realize signal transmission and power supply connections between different circuit board modules 2, reducing the number of cable connections. This helps to reduce the number of cables in electronic devices and reduce the size of electronic devices.

[0055] Please continue to refer to this. Figure 3 and Figure 4 In a specific embodiment, the circuit board module 2 includes a circuit board 15 and an electronic device 16. The electronic device 16 can be a chip, and the chip is electrically connected to the circuit board 15, so that the electronic device 16 can be electrically connected to other electronic devices 16 or the circuit board module 2 through the circuit board 15. The electronic device 16 may generate a lot of heat during operation, therefore heat dissipation is required. To this end, the electronic device 16 can be thermally connected to the cold plate body 12 of the cold plate assembly 6. For example, the electronic device 16 and the cold plate body 12 can be in direct thermal contact, or a thermally conductive layer can be provided between the electronic device 16 and the cold plate body 12 to improve the reliability of the contact between the electronic device 16 and the cold plate body 12, improve heat exchange efficiency, and enhance the heat dissipation capacity of the electronic device 16, thereby resulting in higher operating efficiency and a longer service life for the electronic device 16.

[0056] In specific embodiments, the specific type of circuit board module 2 is not limited. For example, it can be a switching module, a computing module, or a storage module, which are used to realize signal switching, computing, and storage, respectively.

[0057] by Figure 3 and Figure 4 Taking the circuit board assembly 4 as an example, the circuit board assembly 4 includes at least two circuit board modules 2, which may include a switching module and a computing module. The computing module is arranged around the periphery of the switching module. In this scheme, more computing modules can be arranged adjacent to the switching module. Therefore, the distance between more computing modules and the switching module is relatively short, so that more computing modules can be connected to the switching module through the cold plate assembly 6 to realize signal exchange, and the signal transmission efficiency between the switching module and the computing module can be improved.

[0058] Figure 5 A structural schematic diagram of a cold plate assembly provided in this application is shown below. Figure 5As shown, the cold plate assembly 6 includes a cold plate body 12 and a flexible plate 13. The cold plate body 12 includes a refrigerant channel 14, which is connected to the refrigeration equipment 8 and a liquid pump 7. The liquid pump 7 drives the refrigerant to flow between the refrigeration equipment 8 and the refrigerant channel 14. The refrigerant conducts heat from the electronic device 16, thus enabling the cold plate assembly 6 to dissipate heat from the electronic device 16 in the circuit board module 2. Specifically, the cold plate body 12 is thermally connected to the electronic device 16 in the circuit board module 2, particularly ensuring thermal conductivity for heat dissipation. Specifically, the electronic device 16 can be directly connected to the cold plate body 12, or a thermally conductive layer can be provided between the electronic device 16 and the cold plate body 12, both methods achieving thermal conductivity between the cold plate body 12 and the circuit board module 2.

[0059] The flexible board 13 is fixed to the surface of the cold plate body 12, and the flexible board 13 is provided with interconnect circuits and at least two interfaces. The at least two interfaces are electrically connected to the interconnect circuits, so that the interfaces are electrically connected through the interconnect circuits. The circuit board module 2 is connected to the interfaces, so that at least two circuit board modules 2 are electrically connected through the interconnect circuits. The interconnect circuits include high-speed signal lines and power interconnect lines. The high-speed signal lines and power interconnect lines are electrically connected to the interfaces, and then electrically connected to the electronic devices 16 of the circuit board module 2. The high-speed signal lines are used to transmit high-speed signals to the electronic devices 16, and the power interconnect lines are used to supply power to the electronic devices 16. Thus, the cold plate assembly 6 can realize the functions of signal transmission and power supply to the circuit board module 2. The flexible board 13 is made of flexible material, which is convenient to deform with the shape of the cold plate body 12 and can improve the connection reliability between the flexible board 13 and the cold plate body 12.

[0060] In this solution, the flexible board 13, equipped with high-speed signal lines and power interconnects, is integrated with the cold plate body 12, realizing three functions: heat dissipation, signal transmission, and power supply, without the need for additional connectors or other connection structures. Compared to traditional technologies where heat dissipation, signal transmission, and power supply require different structures, this integrated cold plate assembly achieves all three functions. The smaller size of the cold plate assembly also reduces the size of the circuit board assembly 4, thus minimizing its space occupation and improving the integration of the electronic device. This meets the rapidly evolving business needs, providing a high-performance computing node with characteristics such as high speed, high density, high bandwidth, and high power consumption.

[0061] On the other hand, the technical solution provided in this application uses high-speed signal lines and power interconnects provided in the flexible board 13 to replace the cable 1 in the prior art, thus eliminating the need for cable 1 management and making the circuit board assembly 4 easier to manage. The specific method of integrating the flexible board 13 with the cold plate body 12 is not limited.

[0062] In one possible implementation, the cold plate body 12 has a mounting groove, and the flexible plate 13 is embedded in the mounting groove. In this solution, the periphery of the mounting groove of the cold plate body 12 protrudes from the bottom of the mounting groove, and can contact or thermally connect with the electronic device 16, so as to improve the heat dissipation efficiency of the cold plate assembly 6 for the circuit board module 2.

[0063] In another possible implementation, the cold plate body 12 has a planar mounting area, and the flexible plate 13 is mounted in the planar mounting area of ​​the cold plate body 12.

[0064] In another possible implementation, the flexible plate 13 can be attached to the surface of the cold plate body 12, and the flexible plate 13 and the cold plate body 12 can be fixed by adhesive bonding. Optionally, the flexible plate 13 can also be welded to the surface of the cold plate body 12, and the flexible plate 13 and the cold plate body 12 can be fixed by welding.

[0065] Furthermore, in addition to the solutions described above, in order to increase the heat dissipation effect of the cold plate, an insulating thermal interface material layer 17 (TIM) can also be provided between the flexible plate 13 and the cold plate body 12.

[0066] Please continue to refer to the specific plan. Figure 5 The cold plate body 12 has good thermal conductivity and is generally made of metal, thus possessing electrical conductivity. In this embodiment, the insulating thermal interface material layer 17 allows the flexible plate 13 to be insulated from the insulating thermal interface material layer 17, thereby reducing the insulation requirements on the surface of the flexible plate 13 itself. Furthermore, the insulating thermal interface material layer 17 has good thermal conductivity, which is beneficial for utilizing the cold plate body 12 to dissipate heat from the flexible plate 13.

[0067] The specific arrangement of the refrigerant flow channels 14 within the cold plate body 12 is not limited. In one possible implementation, the refrigerant flow channels 14 are liquid cooling chambers within the cold plate body 12. To improve heat exchange efficiency, heat dissipation fins can also be provided within the liquid cooling chambers. In another possible implementation, the refrigerant flow channels 14 within the cold plate body 12 can be arranged in a serpentine pattern.

[0068] In specific embodiments, the specific method of connecting the circuit board module 2 and the flexible board 13 is not limited. The interface provided on the flexible board 13 refers to the structure of the interconnect circuit in the flexible board 13 used to connect with the circuit board module 2. In one possible implementation, the interface is a solder point, such as a solder pad, and the circuit board module 2 is electrically connected to the interface by soldering. This solution helps to reduce the size of the circuit board assembly 4 and improve the integration of electronic devices.

[0069] Please continue to refer to this. Figure 4 and Figure 5 As one possible implementation, the flexible board 13 is integrated on both sides of the cold plate body 12, and the circuit board modules 2 are respectively connected to both sides of the cold plate assembly 6. In this solution, the heat dissipation capacity of the cold plate body 12 and the interconnection capability of the flexible board 13 can be fully utilized. This is beneficial to improving the integration of the circuit board assembly 4 and reducing the space occupied by the circuit board assembly 4.

[0070] The number and shape of the flexible plates 13 in this application are not limited and can be designed according to requirements. For example, the area of ​​the flexible plate 13 is smaller than the area of ​​the surface of the cold plate body 12 facing the flexible plate 13. Specifically, the flexible plate 13 avoids the area where the cold plate body 12 and the electronic device 16 are thermally connected. The arrangement of the flexible plates 13 in this solution allows the electronic device 16 to be directly thermally connected to the cold plate body 12 without the need for a flexible plate between the electronic device 16 and the cold plate body 12, thereby shortening the link between the electronic device 16 and the cold plate body 12, reducing thermal resistance, and improving the heat exchange efficiency of the electronic device 16.

[0071] In one possible implementation, the flexible board 13 can be irregularly shaped, designed according to requirements. Specifically, the flexible board 13 is configured to avoid the area where the cold plate body 12 and the electronic device 16 are thermally connected, and the distance between different circuit board modules 2 connected to the flexible board 13 is short, thereby reducing signal transmission loss and improving signal transmission efficiency. In another possible implementation, the flexible board 13 can be a flexible board with regular edges, such as a square or rectangle; or the edge shape of the flexible board 13 can be the same as the edge shape of the cold plate body 12. In this solution, a cutout structure can be provided in the flexible board 13, which avoids the area where the cold plate body 12 and the electronic device 16 are thermally connected.

[0072] Furthermore, in different implementations, the cold plate assembly 6 may include one or more flexible plates 13. When the cold plate assembly 6 includes one flexible plate 13, the flexible plate 13 may be irregular in shape or have regular edges, which will not be elaborated here. When the cold plate assembly 6 includes multiple flexible plates 13, the multiple flexible plates 13 are arranged to avoid the area where the cold plate body 12 and the electronic device 16 are thermally connected.

[0073] Furthermore, to further enhance the thermal conductivity of the cold plate and electronic components, please refer to [further details needed]. Figure 4In a specific embodiment, the cold plate body 12 may have a boss 18, which is thermally connected to the electronic device 16. Specifically, when the boss 18 is connected to the electronic device 16, the electronic device 16 and the boss 18 are in direct contact. Alternatively, a thermally conductive layer can be provided between the electronic device 16 and the cold plate body 12 to achieve thermal connection between the electronic device 16 and the boss 18. Specifically, the position of the boss 18 can be set according to the layout of the circuit board module 2, so that the boss 18 and the electronic device 16 of the circuit board module 2 can be thermally connected to each other. Specifically, the area of ​​the surface of the boss 18 facing the electronic device 16 can be larger than the area of ​​the surface of the electronic device 16 facing the boss 18, so that the entire surface of the electronic device 16 can contact the boss 18, thereby improving the heat dissipation effect of the electronic device 16. In this design, the cold plate body 12 is provided with a boss 18, which extends toward the circuit board 15. This can compensate for the height difference between the electronic device 16 and other structures in the circuit board assembly 4, so that the electronic device 16 can make full contact with the cold plate body 12, thereby improving the heat dissipation capacity of the electronic device 16. As one possible implementation, the boss 18 extends out of the hollow structure of the flexible plate 13.

[0074] Figure 6 A partial cross-sectional view of another circuit board assembly 4 provided in this application is shown below. Figure 4 and Figure 6 As shown, the interface described above is the first connector 19, which is electrically connected to the high-speed signal line and the power interconnect. Correspondingly, the circuit board module 2 also includes a second connector 20, which is disposed on the circuit board 15 and electrically connected to the circuit pattern in the circuit board 15. The second connector 20 is electrically connected to the electronic device 16 through the circuit board 15. The first connector 19 and the second connector 20 are adapted to each other. In this scheme, the electronic device 16 in the circuit board module 2 is electrically connected to the interconnect circuit of the flexible board 13 in the cold plate assembly 6 through the first connector 19 and the second connector 20. Optionally, the first connector 19 and the second connector 20 can be detachably connected by a plug-in connection or other connection method, so that the circuit board module 2 and the cold plate assembly 6 can be detachably connected, and the circuit board module 2 can be replaced as needed. For example, when the circuit board module 2 is damaged, or the configuration of the circuit board assembly 4 changes, different first connectors 19 and second connectors 20 can be disassembled and connected as needed to flexibly replace the circuit board assembly 4, which offers high flexibility. In addition, the first connector 19 and the second connector 20 adapted in this solution can also achieve the purpose of positioning, and the loading and unloading process of the circuit board module 2 is relatively simple.

[0075] As one possible implementation, convenient installation between the circuit board module and the cold plate assembly can be achieved through flexible connectors. Please refer to [link / reference needed]. Figure 4 and Figure 6 In a specific embodiment, the first connector 19 and the second connector 20 are elastic connectors. In this scheme, the circuit board module 2 and the cold plate assembly 6 are connected via elastic connectors. The elastic connectors have a certain degree of elasticity; in specific embodiments, the pins of the elastic connectors can be elastic pins, or the elastic connectors can be connected to elastic elements, allowing them to deform along the insertion direction of the first connector 19 and the second connector 20. This allows for a floating connection between the circuit board module 2 and the cold plate assembly 6, absorbing the tolerances between them, reducing the coplanar constraints between them, and facilitating installation.

[0076] As one possible implementation, to position the assembly between the circuit board module 2 and the cold plate assembly 6, a first positioning component can be provided in the cold plate assembly 6. This first positioning component is fixedly connected to the cold plate body 12. Specifically, the first positioning component can be welded, threaded, or bonded to the cold plate body 12; the specific fixing method is not limited. For example, please refer to... Figure 6 The first positioning component includes a first guide pin 21 and a second guide pin 22. A preset distance exists between the opposing surfaces of the first guide pin 21 and the second guide pin 22, forming a limiting groove. The circuit board module 2 includes a second positioning component, which can be fixed to the circuit board 15. Specifically, the second positioning component can be welded, threaded, or bonded to the circuit board 15; the specific fixing method is not limited. The second positioning component includes a first bracket 23 and a second bracket 24. A preset distance exists between the opposing surfaces of the first bracket 23 and the second bracket 24. The first bracket 23 and the second bracket 24 are installed between the first guide pin 21 and the second guide pin 22. Specifically, the second positioning component is inserted into the first positioning component to position the circuit board module 2 and the cold plate assembly 6. This makes it easier to align the first connector 19 and the second connector 20, facilitating the insertion of the first connector 19 and the second connector 20.

[0077] Specifically, the preset distance between the opposing surfaces of the first guide pin 21 and the second guide pin 22 and the preset distance between the opposing surfaces of the first bracket 23 and the second bracket 24 can theoretically be equal, but can have a certain tolerance, as long as the first positioning component and the second positioning component can achieve positioning.

[0078] In specific implementation, the first guide pin 21 and the second guide pin 22 can be set at both ends of the first connector 19, and the first bracket 23 and the second bracket 24 can be set at both ends of the second connector 20, thereby facilitating the insertion of the first connector 19 and the second connector 20.

[0079] Please continue to refer to this. Figure 5In cases where signal transmission and power supply cannot be achieved using the interconnect circuitry on the flexible board, inter-board connectors can be used for connection. Optionally, the cold plate assembly 6 may also include a first inter-board connector 25, which is also electrically connected to the interconnect circuitry of the flexible board 13. Specifically, the first inter-board connector 25 is electrically connected to the high-speed signal line and the power interconnect line, respectively. The first inter-board connector 25 is used for electrical connection with the cable 1.

[0080] Specifically, the Board to Board Connector (BTB) in this embodiment is mounted on a circuit board and can connect to a peer connector. Specifically, the peer connector can be connected to a cable. In one possible implementation, a connection assembly includes two circuit boards and a cable. One circuit board is fixedly connected to one BTB connector, and the other circuit board is fixedly connected to another BTB connector; both ends of the cable have peer connectors, and each peer connector connects to one BTB connector, thereby connecting the two circuit boards using the cable, and thus connecting the electronic devices mounted on the two circuit boards.

[0081] Figure 5 The first inter-board connector shown can be used not only inside and outside the same circuit board assembly, but also for connecting multiple circuit board assemblies.

[0082] Figure 7 This is a schematic diagram of the structure of an electronic device in an embodiment of this application, such as... Figure 7 As shown, when an electronic device includes multiple circuit board assemblies 4, each circuit board assembly 4 is provided with a first inter-board connector 25. The cable 1 can be connected to the first inter-board connector 25 of different circuit board assemblies 4, so that high-speed signal transmission and power signal transmission can be realized between different circuit board assemblies 4 through the cable 1.

[0083] In one specific implementation, the first inter-board connector 25 can also be a flexible connector, thereby enabling a floating connection between the cable 1 and the first inter-board connector 25.

[0084] In addition to the circuit board assemblies being connected using inter-board connectors, the circuit board modules within the circuit board assembly can also be connected to circuit board modules located further apart using inter-board connectors. For example, in one possible implementation, Figure 8 Please refer to the side view diagram of a circuit board assembly provided in this application. Figure 8In another embodiment, the circuit board module 2 is further provided with a second inter-board connector 26, which is used for electrical connection with the cable 1. The electronic device includes multiple circuit board assemblies 4, and the circuit board modules 2 disposed on different circuit board assemblies 4 can be electrically connected to each other through the second inter-board connector 26 and the cable 1. Alternatively, in the same circuit board assembly 4, multiple circuit board modules 2 are disposed, and it is difficult to interconnect some circuit board modules 2 using the flexible board 13. For example, the interconnection between circuit board modules 2 that are far apart can be achieved by using the second inter-board connector 26 and the cable 1.

[0085] The second inter-board connector 26 can be a flexible connector, thereby enabling a floating connection between cable 1 and the second inter-board connector.

[0086] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of protection of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A cold-plate assembly, characterized in that, The cold plate assembly includes: The cold plate body is provided with a refrigerant flow channel, which is used for the flow of refrigerant. The flexible board is integrated with the cold plate body and is provided with high-speed signal lines and power interconnects. The high-speed signal lines and power interconnects are used to electrically connect to electronic devices. The high-speed signal lines are used to transmit high-speed signals to the electronic devices, and the power interconnects are used to supply power to the electronic devices. The flexible board is made of flexible material.

2. The cold plate assembly as described in claim 1, characterized in that, The flexible plate is integrated on one side surface of the cold plate body, or on both sides surface of the cold plate body.

3. The cold plate assembly as described in claim 1 or 2, characterized in that, The surface of the cold plate body has a mounting groove, and the flexible plate is embedded in the mounting groove.

4. The cold plate assembly as described in any one of claims 1 to 3, characterized in that, The flexible plate is attached to the surface of the cold plate body.

5. The cold plate assembly as described in any one of claims 1 to 4, characterized in that, An insulating thermal interface material layer is provided between the flexible plate and the cold plate body.

6. The cold plate assembly as described in any one of claims 1 to 5, characterized in that, The flexible board is also provided with a first connector, which is electrically connected to the high-speed signal line and the power interconnect line, and the electronic device is connected to the first connector.

7. The cold plate assembly as described in claim 6, characterized in that, The first connector is a flexible connector.

8. The cold plate assembly according to any one of claims 1 to 7, characterized in that, It also includes a first positioning component, which includes a first guide pin and a second guide pin, with a preset distance between the opposing surfaces of the first guide pin and the second guide pin; the first positioning component is used to position the electronic device in the cold plate assembly.

9. The cold plate assembly according to any one of claims 1 to 8, characterized in that, The flexible board is also provided with a first inter-board connector, which is electrically connected to the high-speed signal line and the power interconnect line, and is used for electrical connection with the cable.

10. The cold plate assembly according to any one of claims 1 to 9, characterized in that, The area of ​​the flexible plate is smaller than the area of ​​the surface of the cold plate body facing the flexible plate, and the flexible plate avoids the area where the cold plate body is thermally connected to the electronic device.

11. An electronic device, characterized in that, The assembly includes a cold plate assembly as described in any one of claims 1 to 10, and a plurality of circuit board modules, wherein the circuit board modules are mounted on the cold plate assembly, the circuit board modules are electrically connected to the high-speed signal line and to the power interconnect line, and at least two of the circuit board modules are electrically connected through the high-speed signal line and the power interconnect line.

12. The electronic device as claimed in claim 11, characterized in that, The flexible plate is integrated on both sides of the cold plate body, and the circuit board module is respectively provided on both sides of the cold plate assembly.

13. The electronic device as claimed in claim 11 or 12, characterized in that, The circuit board module includes a circuit board, electronic components, and a second connector. The electronic components and the second connector are disposed on the circuit board and are electrically connected through the circuit board. The flexible board is also provided with a first connector, which is electrically connected to the high-speed signal line and the power interconnect line. The first connector and the second connector are connected.

14. The electronic device as claimed in claim 13, characterized in that, The first connector and the second connector are flexible connectors.

15. The electronic device according to any one of claims 11 to 14, characterized in that, The cold plate assembly further includes a first positioning component, which includes a first guide pin and a second guide pin, with a preset distance between the opposing surfaces of the first guide pin and the second guide pin; the circuit board module further includes a second positioning component, which includes a first bracket and a second bracket, with the preset distance between the opposing surfaces of the first bracket and the second bracket, and the first bracket and the second bracket are installed between the first guide pin and the second guide pin for positioning the circuit board module and the cold plate assembly.

16. The electronic device according to any one of claims 11 to 15, characterized in that, The cold plate body has a boss, which is thermally connected to the electronic device.

17. The electronic device according to any one of claims 11 to 16, characterized in that, The circuit board module is also provided with a second inter-board connector.

18. The electronic device according to any one of claims 11 to 17, characterized in that, At least two of the circuit board modules include a switching module and a computing module, with the computing module arranged around the periphery of the switching module.

19. A liquid cooling system, characterized in that, It includes a refrigeration device, a liquid pump, and a cold plate assembly as described in any one of claims 1 to 10, wherein the cold plate assembly is disposed in an electronic device as described in any one of claims 11 to 18, and the refrigeration device and the liquid pump are in communication with the refrigerant flow channel of the cold plate body.

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