Cooling device of electronic equipment

Abstract

The invention relates to the technical field of electronic equipment cooling, and discloses an electronic equipment cooling device which comprises a shell, a plurality of sets of cooling liquid pipes are evenly arranged and laid in the shell, and a pump machine used for conveying cooling liquid into the cooling liquid pipes is arranged outside the shell. Compensation cooling mechanisms which are equal to the cooling liquid pipes in number and are in one-to-one correspondence with the cooling liquid pipes are arranged in the shell and used for storing cooling liquid and supplementing the cooling liquid to the middle part of the middle section pipe. The compensation cooling mechanism comprises a liquid storage tank arranged in the shell, a branch pipe connected with the liquid inlet pipe in a penetrating mode, a connecting pipe of the branch pipe, a liquid discharging pipe connected with the liquid storage tank in a penetrating mode and an arc-shaped connecting plate connected with the liquid discharging pipe in a penetrating mode. The compensation cooling mechanism is arranged to supplement cooling liquid to the middle part of the middle section pipe, and the temperature of the rear half part of the middle section pipe and the temperature of the cooling liquid in the rear section pipe can be effectively reduced under the condition that new cooling liquid in the middle does not exchange heat with a heating source.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling electronic equipment, and in particular to a cooling device for electronic equipment. Background Art

[0002] As the performance of electronic equipment continues to improve, the assembly density of internal components is also gradually increasing. This high-density design significantly increases the total heat consumption and local heat flux density generated by electronic equipment during operation. At present, traditional heat dissipation methods, such as natural heat dissipation and air cooling, can no longer effectively meet the heat dissipation needs of modern high-performance electronic equipment. Therefore, liquid cooling technology has gradually become a feasible and effective heat dissipation solution. Liquid cooling technology can transfer heat from heating elements to heat dissipation devices through the high thermal conductivity and good heat conduction ability of liquid, thereby achieving thermal management. Compared with traditional heat dissipation methods, liquid cooling systems can handle higher heat flux densities and ensure system stability and reliability.

[0003] The liquid cooling plate and electronic equipment disclosed in the existing publication number CN115297693A include a cooling body, a leak-proof shell, a liquid inlet pipe and a liquid outlet pipe; the cooling body includes a base plate and a cover plate arranged on the base plate, a flow channel is provided in an area on the base plate corresponding to the cover plate, the flow channel and the cover plate form a cooling space for the flow of coolant, and a liquid inlet and a liquid outlet communicating with the cooling space are provided on the cover plate; at least a part of the area of ​​the base plate and the leak-proof shell form a leak-proof cavity, and the cover plate and the cooling space are both located in the leak-proof cavity; one end of the liquid inlet pipe is connected to the liquid inlet, one end of the liquid outlet pipe is connected to the liquid outlet, and the other end of the liquid inlet pipe and the other end of the liquid outlet pipe both pass through the leak-proof shell and are located outside the leak-proof shell.

[0004] Although the above technical solution can reduce the probability of coolant falling on electronic devices near the liquid cooling plate and has the advantage of improving the anti-leakage performance of the liquid cooling plate, in the prior art, although the liquid cooling system quickly removes heat from the heat source by circulating the coolant in the heat dissipation channel, when the coolant passes through the channel, the coolant in the front half of the channel has already undergone a certain degree of heat exchange with the heat source and removed part of the heat. As the coolant continues to flow, its temperature gradually increases. Therefore, when flowing through the second half of the channel, its heat dissipation capacity is significantly reduced compared to the first half, resulting in the coolant in the second half being unable to remove the remaining heat as effectively as in the first half, thereby reducing the overall heat dissipation efficiency. In addition, due to the reduction in temperature difference, the heat exchange efficiency between the coolant in the second half and the channel wall will also be reduced accordingly, further limiting the improvement in the heat dissipation effect. Therefore, a new type of cooling device for electronic equipment is needed to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a cooling device for an electronic device to solve the problem raised in the above-mentioned background technology that when the coolant passes through the channel, the coolant in the front half of the channel has already exchanged heat with the heat source, resulting in a decrease in the heat dissipation capacity of the coolant when it flows through the back half of the channel.

[0006] The present invention provides a cooling device for electronic equipment, which adopts the following technical solution:

[0007] A cooling device for an electronic device, comprising a shell, wherein a plurality of groups of coolant pipes are evenly arranged and laid inside the shell, and a pump for conveying coolant into the coolant pipes is arranged outside the shell, wherein each group of the coolant pipes comprises a front section pipe, a middle section pipe and a rear section pipe, wherein the front section pipe, the middle section pipe and the rear section pipe are sequentially connected in series, wherein an end of the front section pipe away from the middle section pipe is connected in series with a liquid delivery pipe, an output end of the pump is connected in series with a liquid inlet pipe, the liquid delivery pipe is connected in series with the liquid inlet pipe, and an end of the rear section pipe away from the middle section pipe is connected in series with a liquid outlet pipe;

[0008] The shell is provided with compensating cooling mechanisms, which are equal in number to and correspond to the coolant pipes, and are used to store the coolant and replenish the coolant to the middle part of the middle pipe.

[0009] Further, the compensating cooling mechanism includes a liquid storage tank arranged in the shell, a branch pipe connected to the liquid inlet pipe, a connecting pipe for connecting the liquid storage tank and the branch pipe, a liquid discharge pipe connected to the liquid storage tank, and an arc-shaped connecting plate connected to the liquid discharge pipe, at least three groups of nozzles are arranged on the arc-shaped connecting plate, a sealing ring is arranged in the middle sealing sleeve of the middle section pipe, the nozzle passes through the sealing ring, and is inserted into the middle section pipe;

[0010] A channel is provided in the arc-shaped connecting plate, and the three groups of nozzles are all connected to the channel. The coolant is transported by the pump and passes through the branch pipe, the connecting pipe, the liquid storage tank, the discharge pipe, the channel and the nozzle in sequence, and is finally injected into the middle section of the pipe.

[0011] Furthermore, the liquid storage tank comprises a liquid storage section, a liquid inlet section and a tapered section, one end of the liquid storage section is threadedly connected to the liquid inlet section, the other end of the liquid storage section is threadedly connected to the tapered section, and a spiral groove is provided in the tapered section;

[0012] A temperature control mechanism is provided in the liquid storage section, and the temperature control mechanism includes an inclined plate fixed in the liquid storage section, an opening provided on the inclined plate, a baffle rotatably provided in the opening, a hinge block movably provided on the baffle, a connecting rod rotatably connected to the hinge block, a piston block fixedly connected to the connecting rod, and a sleeve rod fixed at the bottom of the liquid storage section, the piston block is slidably provided in the sleeve rod, the connecting rod passes through the liquid storage section and is inserted in the sleeve rod, an end of the sleeve rod away from the liquid storage section is through-connected with an air pipe, the air pipe is filled with gaseous refrigerant, the air pipe passes through the outside of the shell and is fixed with a heat-conducting copper block.

[0013] Furthermore, the liquid storage section is provided with a hole for the connecting rod to be inserted, and two groups of sealing gaskets for sealing the hole are fixed on the connecting rod.

[0014] Furthermore, the baffle is rotatably connected in the opening via a rotating shaft, and torsion springs are provided at both ends of the rotating shaft.

[0015] Furthermore, a limiting strip is fixed below one side of the inclined plate close to the liquid inlet section, and the limiting strip abuts against the baffle.

[0016] Furthermore, a sliding block is fixed on the hinge block, and a sliding groove for limiting the sliding of the sliding block is provided on the baffle.

[0017] Furthermore, the end of the liquid inlet section away from the liquid storage section is provided with a liquid inlet, and the liquid inlet is connected to the connecting pipe. The end of the conical section away from the liquid storage section is provided with a liquid outlet, and the liquid outlet is connected to the discharge pipe.

[0018] Furthermore, a supporting component is provided outside the liquid storage section, and the supporting component includes a supporting rod fixed in the shell and a clamp provided on the supporting rod, and the clamp is provided outside the liquid storage section for supporting the liquid storage tank as a whole.

[0019] Furthermore, a heat conduction mechanism is provided at the bottom of the shell, and the heat conduction mechanism includes a plurality of groups of fins fixed to the bottom of the shell and a heat conduction rod passing between the plurality of groups of fins.

[0020] Beneficial effects of the present invention:

[0021] 1. By providing a compensating cooling mechanism, the middle part of the middle section of the middle section pipe can be supplemented with coolant. The new coolant in the middle can effectively reduce the temperature of the coolant in the rear half of the middle section pipe and the rear section pipe without heat exchange with the heat source, so as to maintain a high heat exchange capacity and reduce the temperature at the heat source of the electronic equipment, thereby improving the overall heat dissipation efficiency. After the coolant enters the drain pipe through the tapered section, it can enter the middle section pipe in a spraying manner through the nozzle. The sprayed supplemented coolant can be quickly dispersed to the rear half of the middle section pipe, thereby promoting uniform mixing between coolants of different temperatures, helping to reduce the temperature of the coolant and more effectively take away heat.

[0022] 2. By setting up a temperature control mechanism, the baffle can be controlled to rotate when the temperature of a local area of ​​the electronic equipment rises, and the middle part of the middle tube can be supplemented with coolant. By timely supplementing the coolant, the temperature of the electronic equipment can be effectively reduced to avoid performance degradation or hardware damage caused by overheating. The temperature of the local area of ​​the electronic equipment can be detected and conducted by the thermal copper block, and the coolant can be supplemented according to the needs of the electronic equipment, thereby improving the utilization efficiency of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0024] Figure 2 It is a schematic cross-sectional view of the three-dimensional structure of the housing of the present invention;

[0025] Figure 3 It is a partial schematic diagram of the three-dimensional structure of the cooling liquid pipe, the liquid delivery pipe, the liquid inlet pipe, the liquid outlet pipe and the compensating cooling mechanism of the present invention;

[0026] Figure 4 It is a partial schematic diagram of the three-dimensional structure of the front section tube, the middle section tube, the rear section tube, the infusion tube, the liquid outlet tube and the liquid storage tank of the present invention;

[0027] Figure 5 For the present invention Figure 2 A schematic diagram of the structure enlargement in the middle;

[0028] Figure 6 It is a schematic diagram of the three-dimensional structure of the liquid storage tank and the temperature control mechanism of the present invention;

[0029] Figure 7 It is a schematic diagram of the explosion of the three-dimensional structure of the liquid storage tank of the present invention;

[0030] Figure 8 It is a schematic diagram of the side structural section of the liquid discharge pipe, arc-shaped connecting plate, nozzle, sealing ring and middle pipe of the present invention;

[0031] Fig. 9It is a schematic diagram of the front view structure section of the liquid storage section, liquid inlet section, tapered section and temperature control mechanism of the present invention;

[0032] Fig.10 It is a schematic diagram of the three-dimensional structure of the liquid storage section, inclined plate, baffle, hinge block, connecting rod, sleeve rod, air pipe and heat-conducting copper block of the present invention;

[0033] Fig.11 It is an exploded schematic diagram of the three-dimensional structure of the inclined plate, baffle plate and connecting rod of the present invention;

[0034] Fig.12 It is a schematic cross-sectional view of the housing, liquid storage tank and supporting component of the present invention;

[0035] Fig.13 It is a bottom view schematic diagram of the three-dimensional structure of the shell in the figure of the present invention.

[0036] In the figure:

[0037] 1. Shell; 11. Cooling liquid pipe; 111. Front pipe; 112. Middle pipe; 113. Rear pipe; 12. Pump; 13. Infusion pipe; 14. Inlet pipe; 15. Outlet pipe; 2. Compensation cooling mechanism; 21. Liquid storage tank; 211. Liquid storage section; 212. Inlet section; 2121. Liquid inlet; 213. Conical section; 2131. Liquid outlet; 2132. Spiral groove; 22. Branch pipe; 23. Connecting pipe; 24. Drain pipe; 25. Arc connecting plate; 251. Through pipe channel; 26, nozzle; 27, sealing ring; 3, temperature control mechanism; 31, inclined plate; 311, opening; 312, limit strip; 32, baffle; 33, rotating shaft; 331, torsion spring; 34, hinge block; 341, slider; 342, slide groove; 35, connecting rod; 351, sealing pad; 36, piston block; 37, sleeve rod; 38, air pipe; 39, heat-conducting copper block; 4, supporting component; 41, supporting rod; 42, clamp; 5, heat-conducting mechanism; 51, fin; 52, heat-conducting rod. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0039] Reference Figure 1-Figure 2A cooling device for an electronic device comprises a housing 1, wherein a plurality of groups of cooling liquid pipes 11 are evenly arranged and laid in the housing 1, and a pump 12 for conveying cooling liquid into the cooling liquid pipes 11 is arranged outside the housing 1, wherein each group of cooling liquid pipes 11 comprises a front section pipe 111, a middle section pipe 112 and a rear section pipe 113, wherein the front section pipe 111, the middle section pipe 112 and the rear section pipe 113 are sequentially connected through and through, wherein one end of the front section pipe 111 away from the middle section pipe 112 is connected through and through with a liquid infusion pipe 13, wherein one end of the plurality of groups of front section pipes 111 away from the middle section pipe 112 is connected through and through with the liquid infusion pipe 13, wherein the liquid infusion pipe 13 is fixedly installed in the housing 1, and ... The outlet end is connected with a liquid inlet pipe 14, the liquid delivery pipe 13 is connected with the liquid inlet pipe 14, the input end of the pump 12 is connected with a coolant tank, the pump 12 is used to transport the coolant in the coolant tank to the liquid inlet pipe 14, the liquid delivery pipe 13 and the coolant pipe 11 in sequence to achieve cooling, the end of the rear section pipe 113 away from the middle section pipe 112 is connected with a liquid outlet pipe 15, and the ends of multiple groups of rear section pipes 113 away from the middle section pipe 112 are all connected with the liquid outlet pipe 15, the liquid outlet pipe 15 is fixedly installed in the shell 1, the discharge port of the liquid outlet pipe 15 extends to the outside of the shell 1, and is externally connected to a radiator, and the radiator and the coolant tank are connected by a pipeline to achieve circulation.

[0040] Reference Figure 2-Figure 8 The housing 1 is provided with a compensating cooling mechanism 2 having the same number as the coolant pipes 11 and corresponding to each other. The compensating cooling mechanism 2 is used to store the coolant and to supplement the coolant to the middle part of the middle pipe 112;

[0041] Specifically, the compensating cooling mechanism 2 includes a liquid storage tank 21 arranged in the shell 1, a branch pipe 22 connected to the liquid inlet pipe 14, a connecting pipe 23 for connecting the liquid storage tank 21 and the branch pipe 22, a liquid discharge pipe 24 connected to the liquid storage tank 21, and an arc-shaped connecting plate 25 connected to the liquid discharge pipe 24. At least three groups of nozzles 26 are arranged on the arc-shaped connecting plate 25. The middle sealing sleeve of the middle section pipe 112 is provided with a sealing ring 27. The nozzle 26 penetrates the sealing ring 27 and is inserted into the middle section pipe 112. By replenishing the coolant in the middle part of the middle section pipe 112, the new coolant in the middle can effectively reduce the temperature of the coolant in the rear half without heat exchange with the heat source, so that it maintains a high heat exchange capacity, thereby improving the overall heat dissipation efficiency.

[0042] Among them, the inner wall of the liquid storage tank 21 is made of stainless steel, which can enhance the thermal insulation performance of the coolant.

[0043] It is worth mentioning that a channel 251 is opened in the arc-shaped connecting plate 25, and three groups of nozzles 26 are connected to the channel 251. Under the transportation of the pump 12, the coolant passes through the branch pipe 22, the connecting pipe 23, the liquid storage tank 21 and the discharge pipe 24 in sequence, and enters the channel 251 and is sprayed into the middle part of the middle section pipe 112 through the nozzle 26, thereby entering the middle section pipe 112 to replenish the coolant. The coolant can be quickly dispersed into the middle section pipe 112 by spraying, so that the coolant can evenly cover the rear half of the middle section pipe 112 and the rear section pipe 113, thereby improving the efficiency of flow and heat exchange.

[0044] Reference Figure 6-Figure 7 The liquid storage tank 21 includes a liquid storage section 211, a liquid inlet section 212 and a tapered section 213;

[0045] Specifically, one end of the liquid storage section 211 is threadedly connected to the liquid inlet section 212, and the other end of the liquid storage section 211 is threadedly connected to the conical section 213. A spiral groove 2132 is provided in the conical section 213. The design of the spiral groove 2132 enables the coolant to generate a rotational motion during the flow process, thereby helping to increase the flow speed of the coolant and improve the heat exchange efficiency.

[0046] Among them, a liquid inlet 2121 is provided at one end of the liquid inlet section 212 away from the liquid storage section 211, and the liquid inlet 2121 is connected to the connecting pipe 23. A liquid outlet 2131 is provided at one end of the conical section 213 away from the liquid storage section 211, and the liquid outlet 2131 is connected to the drain pipe 24. The coolant enters the liquid storage section 211 through the liquid inlet 2121 for storage, and is transported to the drain pipe 24 through the liquid outlet 2131.

[0047] Reference Fig.12 , a supporting component 4 is provided outside the liquid storage section 211;

[0048] Specifically, the support component 4 includes a support rod 41 fixed in the shell 1 and a clamp 42 arranged on the support rod 41. The clamp 42 is sleeved outside the liquid storage section 211. The support rod 41 and the clamp 42 are used to support the entire liquid storage tank 21 by utilizing the cooperation of the support rod 41 and the clamp 42.

[0049] Further, see Figure 6 as well as Figure 9-12 , a temperature control mechanism 3 is provided in the liquid storage section 211;

[0050] Specifically, the temperature control mechanism 3 includes an inclined plate 31 fixed in the liquid storage section 211, an opening 311 provided on the inclined plate 31, a baffle 32 rotatably arranged in the opening 311, a hinge block 34 movably arranged on the baffle 32, a connecting rod 35 rotatably connected to the hinge block 34, a piston block 36 fixedly connected to the connecting rod 35, and a sleeve rod 37 fixed at the bottom of the liquid storage section 211, the piston block 36 is slidably arranged in the sleeve rod 37, the connecting rod 35 penetrates the liquid storage section 211 and is inserted in the sleeve rod 37, and the end of the sleeve rod 37 away from the liquid storage section 211 is connected with an air pipe 38, and the air pipe 38 is filled with a gaseous refrigerant, and the gaseous refrigerant can be carbon dioxide, and the end of the air pipe 38 away from the liquid storage section 211 penetrates to the outside of the shell 1 , and a heat-conducting copper block 39 is fixed. When the temperature of the electronic equipment is high, the temperature of the local area of ​​the electronic equipment is conducted by using the heat-conducting copper block 39. When the temperature of the local area of ​​the electronic equipment is high, the corresponding heat-conducting copper block 39 conducts the high temperature, so that the gaseous refrigerant in the corresponding air pipe 38 is heated. As the temperature rises, the pressure of the gaseous refrigerant increases, thereby pushing the piston block 36 to move upward in the sleeve rod 37, and through the cooperation of the connecting rod 35 and the hinge block 34, the baffle 32 is pushed to rotate, and the opening 311 is opened to release the coolant, so that the coolant passes through the tapered section 213, the drain pipe 24, the arc-shaped connecting plate 25 and the nozzle 26 into the middle part of the middle section pipe 112 for compensatory cooling.

[0051] Among them, a slider 341 is fixed on the hinge block 34, and a sliding groove 342 is provided on the baffle 32 for the slider 341 to slide in a limited position. When the connecting rod 35 is pushed upward, the hinge block 34 can control the rotation of the baffle 32 under the sliding cooperation of the slider 341 and the sliding groove 342.

[0052] By setting the temperature control mechanism 3, when the overall temperature of the electronic device is normal, the coolant can be stored in the liquid storage section 211. When the temperature of the local area of ​​the electronic device rises, the baffle 32 is controlled to rotate, and the middle part of the middle section tube 112 is supplemented with coolant, thereby improving the heat dissipation efficiency of the coolant in the rear half of the middle section tube 112 and the rear section tube 113. By timely supplementing the coolant to lower the temperature of the electronic device, it is possible to effectively avoid performance degradation or hardware damage caused by overheating. In addition, the temperature of the local area of ​​the electronic device is detected and conducted by the heat-conducting copper block 39, and the coolant can be supplemented according to demand, thereby improving the utilization efficiency of resources.

[0053] Reference Fig.11 The baffle 32 is rotatably connected to the opening 311 through the rotating shaft 33. Both ends of the rotating shaft 33 are provided with torsion springs 331. The torsion springs 331 are wound around the two ends of the rotating shaft 33. The two ends of the torsion spring 331 are respectively welded to the opening 311 and the baffle 32. Through the setting of the torsion spring 331, the baffle 32 can be controlled to reset and close after the heat dissipation in the high-temperature area of ​​the electronic equipment is completed.

[0054] A limit strip 312 is fixed below one side of the inclined plate 31 close to the liquid inlet section 212 , and the limit strip 312 abuts against the baffle 32 . The limit strip 312 is used to limit the baffle 32 , so as to facilitate the resetting of the baffle 32 .

[0055] Reference Figure 9-10 The liquid storage section 211 is provided with a hole for the connecting rod 35 to be inserted, and two sets of sealing gaskets 351 for sealing the hole are fixed on the connecting rod 35. When the connecting rod 35 pushes the baffle 32 upward, the sealing gasket 351 located below the connecting rod 35 can seal the bottom of the hole, and when the connecting rod 35 is reset, the sealing gasket 351 located above the connecting rod 35 can seal the top of the hole.

[0056] Reference Fig.12 , a heat conducting mechanism 5 is provided at the bottom of the housing 1;

[0057] Specifically, the heat conducting mechanism 5 includes a plurality of fins 51 fixed to the bottom of the shell 1 and a heat conducting rod 52 passing through the plurality of fins 51. The fins 51 and the heat conducting rod 52 are in contact with the heat source of the electronic device, and the bottom of the heat conducting copper block 39 is flush with the bottom of the fins 51, so as to conduct heat of the electronic device.

[0058] The working principle of the cooling device of an electronic device of the present invention is as follows: firstly, the housing 1 is installed at the heat source of the electronic device, and the fins 51 and the heat-conducting copper block 39 are in contact with the heat source, and then the pump 12 is started to transmit the coolant in the external coolant tank, so that the coolant passes through the liquid inlet pipe 14 and the liquid delivery pipe 13 in sequence and enters the coolant pipe 11, and the coolant entering the coolant pipe 11 is cooled in sequence through the front section pipe 111, the middle section pipe 112 and the rear section pipe 113, and then discharged to the external radiator through the liquid outlet pipe 15, and finally enters the coolant tank through the pipeline to realize circulation;

[0059] During the process of the coolant being transmitted through the liquid inlet pipe 14, a part of the coolant is transmitted through the branch pipe 22, and enters the liquid storage section 211 through the connecting pipe 23, the liquid inlet 2121, and the liquid inlet section 212 in sequence. When the temperature of a local area of ​​the electronic equipment is high, the corresponding heat-conducting copper block 39 conducts the high temperature, and the gaseous refrigerant in the corresponding air pipe 38 is heated during the conduction process. As the temperature rises, the pressure of the gaseous refrigerant increases, thereby pushing the piston block 36 to move upward in the sleeve rod 37, and at the same time controlling The connecting rod 35 moves upward, and the baffle 32 rotates around the rotating shaft 33 by sliding cooperation of the hinge block 34, the slider 341 and the slide groove 342, thereby opening the opening 311 to release the coolant. At this time, the coolant enters the drain pipe 24 through the tapered section 213 and the liquid outlet 2131, and enters the channel 251 through the drain pipe 24, and is finally sprayed into the middle part of the middle section pipe 112 through the nozzle 26, and enters the middle section pipe 112 to replenish the coolant and achieve compensatory cooling.

[0060] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A cooling device for an electronic device, comprising a housing (1), wherein a plurality of groups of cooling liquid pipes (11) are evenly arranged in the housing (1), and a pump (12) is provided outside the housing (1) for conveying cooling liquid into the cooling liquid pipes (11), wherein: Each group of the cooling liquid pipes (11) comprises a front section pipe (111), a middle section pipe (112) and a rear section pipe (113); the front section pipe (111), the middle section pipe (112) and the rear section pipe (113) are connected in sequence; an end of the front section pipe (111) away from the middle section pipe (112) is connected in series with a liquid infusion pipe (13); an output end of the pump (12) is connected in series with a liquid inlet pipe (14); the liquid infusion pipe (13) is connected in series with the liquid inlet pipe (14); and an end of the rear section pipe (113) away from the middle section pipe (112) is connected in series with a liquid outlet pipe (15); The housing (1) is provided with compensating cooling mechanisms (2) whose number is equal to and corresponds to the number of the cooling liquid pipes (11) and which are used to store the cooling liquid and to replenish the cooling liquid in the middle part of the middle pipe (112).

2. The cooling device for electronic equipment according to claim 1, characterized in that: The compensating cooling mechanism (2) comprises a liquid storage tank (21) arranged in the housing (1), a branch pipe (22) connected to the liquid inlet pipe (14), a connecting pipe (23) for connecting the liquid storage tank (21) and the branch pipe (22), a liquid discharge pipe (24) connected to the liquid storage tank (21), and an arc-shaped connecting plate (25) connected to the liquid discharge pipe (24), at least three groups of nozzles (26) are arranged on the arc-shaped connecting plate (25), a sealing ring (27) is arranged on the middle sealing sleeve of the middle section pipe (112), and the nozzle (26) passes through the sealing ring (27) and is inserted into the middle section pipe (112); A channel (251) is provided in the arc-shaped connecting plate (25), and the three groups of nozzles (26) are all connected to the channel (251). The coolant is transported by the pump (12) and sequentially passes through the branch pipe (22), the connecting pipe (23), the liquid storage tank (21), the liquid discharge pipe (24), the channel (251) and the nozzle (26), and is finally injected into the middle section pipe (112).

3. The cooling device for electronic equipment according to claim 2, characterized in that: The liquid storage tank (21) comprises a liquid storage section (211), a liquid inlet section (212) and a tapered section (213); one end of the liquid storage section (211) is threadedly connected to the liquid inlet section (212); the other end of the liquid storage section (211) is threadedly connected to the tapered section (213); a spiral groove (2132) is provided in the tapered section (213); A temperature control mechanism (3) is provided in the liquid storage section (211), and the temperature control mechanism (3) comprises an inclined plate (31) fixed in the liquid storage section (211), an opening (311) provided on the inclined plate (31), a baffle (32) rotatably provided in the opening (311), a hinge block (34) movably provided on the baffle (32), a connecting rod (35) rotatably connected to the hinge block (34), a piston block (36) fixedly connected to the connecting rod (35), and a fixed A sleeve rod (37) is fixed at the bottom of the liquid storage section (211), the piston block (36) is slidably arranged in the sleeve rod (37), the connecting rod (35) passes through the liquid storage section (211) and is inserted in the sleeve rod (37), and the end of the sleeve rod (37) away from the liquid storage section (211) is connected to an air pipe (38), the air pipe (38) is filled with gaseous refrigerant, and the air pipe (38) passes through the outside of the shell (1) and is fixed with a heat-conducting copper block (39).

4. The cooling device for electronic equipment according to claim 3, characterized in that: The liquid storage section (211) is provided with a hole for the connecting rod (35) to be inserted into, and two groups of sealing gaskets (351) for sealing the hole are fixed to the connecting rod (35).

5. The cooling device for electronic equipment according to claim 3, characterized in that: The baffle (32) is rotatably connected in the opening (311) via a rotating shaft (33), and torsion springs (331) are provided at both ends of the rotating shaft (33).

6. The cooling device for electronic equipment according to claim 3, characterized in that: A limit strip (312) is fixed below one side of the inclined plate (31) close to the liquid inlet section (212), and the limit strip (312) and the baffle plate (32) are in contact with each other.

7. The cooling device for electronic equipment according to claim 3, characterized in that: A sliding block (341) is fixed on the hinge block (34), and a sliding groove (342) for limiting the sliding of the sliding block (341) is provided on the baffle plate (32).

8. The cooling device for electronic equipment according to claim 3, characterized in that: An end of the liquid inlet section (212) away from the liquid storage section (211) is provided with a liquid inlet (2121), and the liquid inlet (2121) is connected to the connecting pipe (23); an end of the conical section (213) away from the liquid storage section (211) is provided with a liquid outlet (2131), and the liquid outlet (2131) is connected to the liquid discharge pipe (24).

9. The cooling device for electronic equipment according to claim 3, characterized in that: A support component (4) is provided outside the liquid storage section (211), the support component (4) comprising a support rod (41) fixed inside the housing (1) and a clamp (42) provided on the support rod (41), the clamp (42) being sleeved outside the liquid storage section (211) and used to support the liquid storage tank (21) as a whole.

10. The cooling device for electronic equipment according to claim 1, characterized in that: A heat conduction mechanism (5) is provided at the bottom of the shell (1), and the heat conduction mechanism (5) comprises a plurality of groups of fins (51) fixed to the bottom of the shell (1) and a heat conduction rod (52) passing between the plurality of groups of fins (51).

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