Non-closed phase change immersion cooling system

Abstract

The invention relates to the technical field of heat exchange equipment, and provides a non-closed phase-change immersion cooling system which comprises a non-closed cooling box, an ejector and a heat exchanger, a phase-change cooling working medium is arranged in the cooling box, and supercooled liquid on the outer side of a gas collecting hood enters the ejector through a cooling liquid outlet via a working medium pump to form primary flow; when the cooling heat source device generates heat, the phase change cooling working medium on the inner side of the gas-collecting hood is locally boiled and forms secondary flow of the ejector through a gas-collecting hood outlet in the gas-collecting hood, the primary flow and the secondary flow are mixed to become a series of tiny bubbles which are ejected together with the phase change cooling working medium, and the tiny bubbles inside are condensed to become supercooled liquid through supercooling of the heat exchanger. And cooling the computer mainboard and the power battery in the cooling box. According to the phase change immersion cooling system, efficient cooling is guaranteed, meanwhile, the operation process is simplified, the safety and maintainability of the system are improved, and an innovative and practical solution is provided for cooling of a data center and a battery.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchange equipment, and in particular to a non-closed phase-change immersion cooling system, particularly a non-closed phase-change immersion cooling system suitable for data center and battery cooling. Background Art

[0002] With the rapid development of information technology and new energy technology, the heat dissipation demand of data centers and battery systems is increasing. Traditional heat dissipation methods, such as air cooling, have gradually shown their limitations when facing high-density, high-heat data center servers and battery systems. Specifically, traditional air cooling methods have the following significant problems:

[0003] First, air cooling is inefficient. The heat transfer efficiency of air is much lower than that of liquid, especially in high power density areas. Air cooling is difficult to quickly remove a large amount of heat, which can easily lead to excessively high local temperatures and affect the normal operation of the equipment.

[0004] Secondly, the energy consumption of air-cooled heat dissipation systems is high. Data centers and battery systems usually require a large number of fans and heat dissipation equipment to maintain a suitable operating temperature, which not only increases the complexity and cost of the equipment, but also significantly increases energy consumption, which is contrary to the current trend of energy conservation and emission reduction.

[0005] In response to the heat dissipation needs of data centers and battery systems, the next generation of cooling technology for high-heat electronic devices uses phase change immersion cooling systems, such as Figure 1 As shown, it includes a sealed box structure, and a cooling coil A and a server motherboard B are arranged inside it. Although this type of cooling can provide a more efficient heat dissipation effect, it also has the following shortcomings:

[0006] First, such systems usually require strict sealing of the box to prevent the cooling medium from evaporating and becoming a gas and then losing a large amount of gas. However, insufficient sealing is often a major challenge faced by such systems. Once the seal fails, the system will not work properly.

[0007] Second: This type of phase change immersion cooling system also has many inconveniences in equipment disassembly and maintenance. Since the system needs to remain sealed, complex operating procedures and strict airtightness testing are required when disassembling servers or batteries, which not only increases maintenance costs but also reduces the maintainability of the system.

[0008] Third: This type of phase change immersion cooling system also has hidden dangers in terms of safety. During the sealed phase change process, due to the change in pressure inside the system, higher pressure may be generated, posing a threat to the safety and stability of the system. Especially when replacing the motherboard or battery, the heat exchange process in the entire box usually needs to be stopped, which not only affects the continuous operation of the system, but may also cause damage to the equipment.

[0009] Therefore, existing data center and battery cooling technologies have significant deficiencies in heat dissipation efficiency, energy consumption, maintainability and safety. There is an urgent need for a more efficient, energy-saving, easy-to-maintain and safe cooling system to meet the growing heat dissipation needs. Summary of the invention

[0010] In view of this, the present invention proposes a non-closed phase change immersion cooling system, which aims to solve the technical problems of traditional phase change immersion cooling systems, such as high sealing requirements, complicated disassembly and assembly process, low operating safety, and the need for downtime maintenance. The system achieves the goals of simplifying the disassembly and assembly process, improving operating safety, and eliminating the need for downtime maintenance through the non-sealed design, the combined use of the gas hood and the ejector, and the assistance of the float controller and the stop valve.

[0011] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0012] A non-closed phase change immersion cooling system, comprising:

[0013] A cooling box, comprising an outer wall of the box, wherein the outer wall of the box is designed with an opening at the top, a phase-change cooling medium, an air collecting hood, and a cooling heat source device are arranged inside the outer wall of the box, the air collecting hood is semi-enclosed and arranged outside the cooling heat source device, the phase-change cooling medium is liquid at room temperature and locally boils to generate bubbles when the cooling heat source device generates heat, an air collecting hood outlet is designed at the upper end of the air collecting hood, and a coolant outlet is arranged on the outer wall of the box;

[0014] An ejector, wherein a secondary flow inlet and a primary flow inlet are provided on the ejector, wherein the primary flow inlet is connected to the coolant outlet via a first connecting pipe, and the secondary flow inlet is connected to the air collecting hood outlet via a second connecting pipe, and the cooling medium flowing into the secondary flow inlet and the primary flow inlet is mixed in the ejector and then flows to the heat exchanger via the mixed flow outlet;

[0015] The heat exchanger is used to cool the mixed liquid injected by the injector, and the cooled working fluid flows to the cooling box through the return pipeline and the coolant inlet.

[0016] Furthermore, a working fluid pump is provided on the first connecting pipeline.

[0017] Furthermore, a stop valve is provided on the second connecting pipeline.

[0018] Furthermore, the ejector comprises a converging nozzle, a mixing section and a diffuser section which are connected in sequence, the primary flow inlet is arranged on the converging nozzle, and the secondary flow inlet is arranged on the mixing section.

[0019] Furthermore, the cross section of the mixing section is gradually converged from one end close to the convergent nozzle to one end close to the diffuser section, and the cross section of the diffuser section is gradually expanded from one end close to the mixing section to the far end.

[0020] Furthermore, a pipeline of the same diameter is arranged on one side of the mixing section close to the diffuser section.

[0021] Furthermore, the cooling heat source includes a computer motherboard and / or a power battery, the air collecting hood is arranged in a semi-enclosed shape with an opening at the bottom on the outside of the computer motherboard and the power battery, and the air collecting hood outlet is arranged on a plane in the middle of the upper end of the air collecting hood.

[0022] Furthermore, before the system is operated, the liquid level of the phase-change cooling medium in the cooling box is higher than the setting height of the coolant outlet on the outer wall of the box.

[0023] Furthermore, a float controller is arranged in the cooling box, and the float controller is used to give an alarm when there is too much gas on the upper part of the gas collecting hood or the liquid level of the working fluid drops to a warning position.

[0024] Furthermore, the non-enclosed phase change immersion cooling system described in the present application has at least the following three operating states:

[0025] The first single-phase operation state: the load is low, the temperature of the cooling heat source device is below the saturation temperature of the phase change cooling medium, and the gas collection hood outlet is pure liquid;

[0026] The first two-phase operation state: the load is high, the surface temperature of the cooling heat source device is higher than the saturation temperature of the phase change cooling medium, bubbles appear, and the outlet of the gas collecting hood is a gas-liquid mixture;

[0027] The second two-phase operating state: the load is very high, the surface temperature of the cooling heat source device is higher than the saturation temperature of the phase change cooling medium, bubbles appear, the gas gathers above the gas collecting hood, and the gas collecting hood outlet is pure gas.

[0028] Compared with the prior art, the non-enclosed phase change immersion cooling system of the present invention has the following advantages:

[0029] (1) The non-enclosed phase change immersion cooling system described in the present invention adopts a non-enclosed cooling box with a top opening, and a cover plate can be set at the opening to reduce medium volatilization. Through the design of the gas collecting hood and the ejector, the high efficiency of phase change cooling is effectively utilized, while avoiding the sealing and high pressure problems that may occur in traditional phase change cooling.

[0030] (2) The non-enclosed phase change immersion cooling system described in the present invention allows the computer motherboard and power battery to be disassembled and assembled without stopping the machine, which simplifies the operation process, improves the operation and maintenance efficiency, enhances the safety and maintainability of the system, and greatly reduces downtime and maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0032] Figure 1 It is a schematic structural diagram of a conventional phase change immersion cooling system in the prior art;

[0033] Figure 2 It is a schematic diagram of the principle of the non-closed phase change immersion cooling system according to an embodiment of the present invention;

[0034] Figure 3 This is a schematic diagram of the structure inside the cooling box according to an embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the flow channel structure in the cooling box according to an embodiment of the present invention;

[0036] Figure 5 It is a structural schematic diagram of the ejector according to an embodiment of the present invention;

[0037] Description of reference numerals:

[0038] 1. Cooling box; 101. Outer wall of the box; 102. Float controller; 103. Air hood; 104. Computer motherboard; 105. Power battery; 106. Phase change cooling medium; 107. Working medium liquid level; 108. Hose; 2. Ejector; 201. Gradually converging nozzle; 202. Mixing section; 203. Diffuser section; 3. Working medium pump; 4. Heat exchanger; 5. Chiller; 6. Stop valve; 7. First connecting pipeline; 8. Second connecting pipeline; 9. Return pipeline; 10. Heat exchange pipeline; 11. Air hood outlet; 12. Coolant outlet; 13. Coolant inlet; 14. Secondary flow inlet; 15. Primary flow inlet; 16. Mixed flow outlet. DETAILED DESCRIPTION

[0039] In order to make the technical means, objectives and effects of the present invention easy to understand, the embodiments of the present invention are described in detail below with reference to specific drawings.

[0040] It should be noted that all the terms used in the present invention for directional and positional indications, such as "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside", "top", "low", "lateral", "longitudinal", "center", etc., are only used to explain the relative positional relationship and connection status between the components in a certain state (as shown in the accompanying drawings), and are only for the convenience of describing the present invention, rather than requiring the present invention to be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes, and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features.

[0041] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0043] like Figures 2 to 5 As shown, the present application discloses a non-closed phase change immersion cooling system, comprising:

[0044] A cooling box 1, comprising an outer wall 101, wherein the outer wall 101 is designed with an opening at the top, and a phase-change cooling medium 106, an air collecting hood 103 and a cooling heat source device are arranged inside the outer wall 101, wherein the cooling heat source device comprises a computer motherboard 104 and / or a power battery 105, and may also comprise other cooling heat source devices that generate heat and need to be cooled when in use, wherein the air collecting hood 103 is semi-enclosed and arranged outside the computer motherboard 104 and the power battery 105, wherein the phase-change cooling medium 106 is liquid at room temperature and locally boils to generate bubbles when the computer motherboard 104 or the power battery 105 generates heat, wherein an air collecting hood outlet 11 is designed at the upper end of the air collecting hood 103, and a coolant outlet 12 is arranged on the outer wall 101;

[0045] The ejector 2 is provided with a secondary inlet 14 and a primary inlet 15, the primary inlet 15 is connected to the coolant outlet 12 through a first connecting pipe 7, the secondary inlet 14 is connected to the air collecting hood outlet 11 through a second connecting pipe 8, and the cooling medium flowing into the secondary inlet 14 and the primary inlet 15 is mixed in the ejector 2 and then flows to the heat exchanger 4 through the mixing outlet 16;

[0046] The heat exchanger 4 is used to cool the mixed liquid injected by the injector 2 and to make the cooled working fluid flow to the cooling box 1 through the return pipe 9 and then through the coolant inlet 13 .

[0047] The non-enclosed phase-change immersion cooling system disclosed in the present application is mainly an improvement made for the traditional phase-change immersion cooling system, which has the problem that the cooling box needs to be enclosed, which leads to inconvenience in disassembly and maintenance, poor reliability in use, and possible safety issues. The core of the improvement lies in the improvement of the structure and flow path in the cooling box 1 and the organic combination of the ejector 2 and the heat exchanger 4. The cooling box 1 is filled with a phase-change cooling medium 106, i.e., a fluorinated liquid, which directly immerses the computer motherboard 104 and the power battery 105. The heat generated by the computer motherboard 104 and the power battery 105 causes the fluorinated liquid to boil locally. The generated bubbles rise to the air collecting hood 103 and are guided to the injector 2. At the same time, the supercooled liquid outside the air collecting hood 103 can also be transported to the injector 2. In the injector 2, the bubbles from the air collecting hood 103 are mixed with the supercooled liquid in the cooling box 1. The bubbles are broken into a series of tiny bubbles and leave the injector 2 through the mixing outlet 16 together with the supercooled liquid of the phase change cooling medium 106. They are supercooled by the heat exchanger 4, and the internal tiny bubbles condense into supercooled liquid, which returns to the cooling box 1 through the coolant inlet 13 to cool the computer motherboard 104 and the power battery 105.

[0048] The non-closed phase-change immersion cooling system described in the present application reduces the volatilization of the medium by adopting a non-closed cooling box 1 with a top opening, and a cover plate can be set at the opening. The design of the gas collecting hood 103 and the ejector 2 effectively utilizes the high efficiency of phase-change cooling, while avoiding the sealing and high-pressure problems that may occur in traditional phase-change cooling. In addition, the system allows the computer motherboard 104 and the power battery 105 to be disassembled and assembled without stopping, which greatly improves the operation and maintenance efficiency. The non-closed phase-change immersion cooling system described in the present application simplifies the operating process while ensuring efficient cooling, improves the safety and maintainability of the system, and provides an innovative and practical solution for data center and battery cooling.

[0049] As a preferred example of the present application, a working fluid pump 3 is provided on the first connecting pipe 7. The working fluid pump 3 is used to flow the supercooled liquid outside the air collecting cover 103 in the cooling box 1 to the primary inlet 15 of the ejector 2 through the cooling liquid outlet 12 and the first connecting pipe 7.

[0050] This setting, by adding a working fluid pump and cleverly utilizing its power, on the one hand enhances the fluidity of the coolant, so that the supercooled liquid outside the gas hood 103 can be quickly and stably transported to the ejector 2, fully mixed with the gas-liquid mixture, and effectively improves the heat exchange efficiency of the system. On the other hand, it also optimizes the circulation path of the coolant, reduces unnecessary energy loss, and makes the operation of the entire cooling system more efficient and energy-saving. In addition, the application of the working fluid pump 3 also enhances the stability and reliability of the system, and ensures the continuous and stable operation of the system even when the heat load is large and the demand for coolant increases, providing more reliable cooling guarantee for key equipment such as data centers and batteries.

[0051] As a preferred example of the present application, a stop valve 6 is provided on the second connecting pipeline 8 .

[0052] By setting a stop valve 6 on the second connecting pipe 8 connecting the air collecting hood outlet 11 with the injector 2, when it is necessary to add a computer motherboard 104, a power battery 105 or perform equipment maintenance, the operator first uses the thermal power of the computer motherboard 104 and the power battery 105 to reduce their temperature to below the saturation temperature of the phase change cooling medium 106, thereby allowing the system to enter a single-phase heat transfer state; then, close the stop valve 6 set on the second connecting pipe 8 to block the circulation path of the coolant. At this time, the operator can safely raise the air collecting hood 103 to perform maintenance or replacement operations on the computer motherboard 104, the power battery 105, etc. in the cooling box without shutting down the entire cooling system.

[0053] This design improvement achieves continuous operation of the cooling system during maintenance by flexibly using the stop valve 6, improves the availability and flexibility of the system, reduces downtime caused by system downtime, improves the operating efficiency of key equipment such as data centers and batteries, and reduces economic losses caused by downtime. In addition, the application of the stop valve 6 makes maintenance operations more convenient and safer. Operators do not need to worry about coolant leakage or system pressure changes, which reduces maintenance risks and enables it to better meet the use requirements in different scenarios.

[0054] As a preferred example of the present application, the ejector 2 includes a converging nozzle 201, a mixing section 202 and a diffuser section 203 which are sequentially connected, the primary inlet 15 is arranged on the converging nozzle 201, and the secondary inlet 14 is arranged on the mixing section 202. Preferably, the cross section of the mixing section 202 from one end close to the converging nozzle 201 to one end close to the diffuser section 203 is also arranged in a converging shape, and the cross section of the diffuser section 203 from one end close to the mixing section 202 to the far end is designed in a gradually expanding shape.

[0055] The arrangement optimizes the structure of the ejector 2, and the ejector 2 is composed of a converging nozzle 201, a mixing section 202, and a diffuser section 203 connected in sequence. This design makes the flow of the coolant in the ejector 2 more efficient and stable. On the basis that the primary inlet 15 is arranged on the converging nozzle 201, and the secondary inlet 14 is arranged on the mixing section 202, the mixing section 202 adopts a design in which the cross section gradually decreases from one end close to the converging nozzle 201 to one end close to the diffuser section 203, while the diffuser section 203 adopts a design in which the cross section gradually expands from one end close to the mixing section 202 to the far end, so that the primary inflow medium and the secondary inflow medium are mixed more fully and evenly in the mixing section 202, and the heat exchange efficiency of the coolant is improved, thereby more effectively reducing the temperature of the computer motherboard 104 and the power battery 105. At the same time, the design of the diffuser section 203 can reduce the flow rate of the mixed fluid, increase the static pressure of the fluid, and reduce energy loss, thereby enhancing the overall performance of the ejector 2 and improving the cooling efficiency. Preferably, a pipeline of the same diameter is arranged on one side of the mixing section 202 close to the diffuser section 203. This arrangement enables the primary inflow medium and the secondary inflow medium to smoothly enter the diffuser section 203 after being fully mixed in the mixing section 202, thereby avoiding the phenomenon of eddy current or uneven flow of the fluid at the transition point, thereby improving the mixing efficiency.

[0056] As a preferred example of the present application, the gas hood 103 is arranged in a semi-enclosed shape with an opening at the bottom, outside the computer motherboard 104 and the power battery 105, and the gas hood outlet 11 is arranged on a plane in the middle of the upper end of the gas hood 103. In the example of the present application, the gas hood outlet 11 is connected to the second connecting pipe 8 through a hose 108, or the gas hood outlet 11 is directly connected to the secondary inlet 14 of the ejector 2 through a hose 108. This setting optimizes the structure of the gas hood 103, so that the gas hood 103 can effectively gather and guide the bubbles generated by the phase change cooling medium 106 when it is heated and boiled, and the ejector 2 processes the bubbles to avoid cavitation. At the same time, the combined use of the gas hood 103 and the ejector 2 can effectively process the bubbles generated by boiling on the one hand, and avoid the generation of internal high pressure on the other hand, thereby improving the safety of the system.

[0057] As a preferred example of the present application, before the system is operated, the height of the working fluid level 107 of the phase change cooling medium 106 in the cooling box 1 is higher than the setting height of the coolant outlet 12 on the outer wall 101 of the box. As a specific example of the present application, the coolant inlet 13 is designed at the bottom of the outer wall 101 of the box, and the coolant inlet 13 can be set one or more, the upper top surface of the air collecting hood 103 is arranged parallel to the bottom wall of the outer wall 101 of the box, the side wall of the air collecting hood 103 is arranged parallel to the side wall of the outer wall 101 of the box, and a spacing of 10mm to 200mm is set between the side wall of the air collecting hood 103 and the side wall of the outer wall 101 of the box, and the lower end of the side wall of the air collecting hood 103 is parallel to the lower end of the side wall of the outer wall 101 of the box. A spacing of 10mm to 200mm is set between the bottom walls, an inclined connecting wall is set between the upper top surface of the air collecting hood 103 and the side wall of the air collecting hood 103, the coolant outlet 12 is set on the side wall of the outer wall 101 of the box, and the upper top surface of the air collecting hood 103 and the coolant outlet 12 are roughly close in height, and can be equal, or the upper top surface height of the air collecting hood 103 can be higher than the setting height of the coolant outlet 12, or the setting height of the coolant outlet 12 is higher than the upper top surface height of the air collecting hood 103.

[0058] This arrangement further optimizes the flow path in the cooling box 1. Before the system is operated, the liquid level of the phase change cooling medium 106 in the cooling box 1 is higher than the setting height of the coolant outlet 12 on the outer wall 101 of the box, ensuring that the medium can circulate naturally. In addition, the coolant inlet 13 is arranged at the bottom of the outer wall 101 of the box, the upper top surface of the air hood 103 is parallel to the bottom wall of the outer wall 101 of the box, and the side wall is parallel to the side wall of the outer wall 101 of the box and maintains a certain interval to form a gas channel; when the heat generated by the computer motherboard 104 and the power battery 105 causes the phase change cooling medium 106 (fluorinated liquid) to boil locally, the generated bubbles enter the injector 2 through the air hood 103 and mix with the supercooled liquid entering the injector 2 through the coolant outlet 12. The mixed fluid is cooled by the heat exchanger 4 and then re-enters the cooling box to form a closed-loop cooling cycle, which simplifies the disassembly and assembly process of the load in the box. There is no need to detect the air tightness, and the operation can be carried out by simply raising the air hood, which greatly saves time and labor costs; at the same time, when replacing the computer motherboard 104 or the power battery 105, it is only necessary to reduce the heat load and raise the air hood 103, without shutting down the entire system, thereby improving the availability and operation efficiency of the system.

[0059] As a preferred example of the present application, a float controller 102 is provided in the cooling box 1, and the float controller 102 is used to give an alarm when there is too much gas on the upper part of the gas collecting hood 103 or the working fluid liquid level 107 drops to the warning position. In the example of the present application, the float controller 102 is provided on the inner side of the gas collecting hood 103. This setting introduces the float controller 102 in the cooling box 1, and the float controller 102 is preferably cleverly placed on the inner side of the gas collecting hood 103, and is used to monitor the height change of the working fluid liquid level 107 in real time, which is convenient for monitoring and reduces the interference of the external environment, and further ensures the accuracy and reliability of monitoring. When the system is running, the heat generated by the computer motherboard 104 and the power battery 105 causes the phase change cooling medium 106 (fluorinated liquid) to boil locally, and the bubbles formed gather in the upper part of the gas collecting hood 103. If the heat load is too large, the amount of gas in the gas collecting hood 103 increases sharply, causing the liquid level 107 of the working medium to drop significantly. At this time, the float controller 102 can quickly sense that the liquid level has dropped to the warning position and immediately trigger the alarm mechanism to remind the operator to pay attention to the system status. At the same time, the system heat load can be automatically or manually reduced to prevent the liquid level from dropping further, thereby ensuring the stable operation of the cooling system.

[0060] This arrangement achieves real-time monitoring and early warning of the working fluid level 107 in the cooling system by introducing the float controller 102, significantly improving the reliability and stability of the system, reducing the system maintenance cost, and improving the operating efficiency and availability of the system.

[0061] As a preferred example of the present application, the heat exchanger 4 is connected to the chiller 5 through a heat exchange pipe 10, which is used to supercool the mixed liquid entering the heat exchanger 4. This setting realizes supercooling of the mixed liquid through the connection between the heat exchanger 4 and the chiller 5, greatly improving the heat exchange efficiency of the cooling system, so that the computer motherboard 104 and the power battery 105 can be quickly and stably maintained within a suitable operating temperature range, reducing the evaporation of the coolant, reducing the energy consumption and operating costs of the cooling system, enhancing the adaptability and reliability of the cooling system, and being able to adapt to the cooling needs under different workloads and environmental conditions, providing a more stable and efficient cooling guarantee for key equipment such as data centers and batteries.

[0062] The non-enclosed phase change immersion cooling system described in this application operates as follows:

[0063] 1) The heat generated by the computer motherboard 104 and the power battery 105 causes the phase change cooling medium 106 (fluorinated liquid) to boil locally, and the generated bubbles rise to the upper layer of the gas collecting hood 103, and come to the ejector 2 through the gas collecting hood outlet 11, and mix with the primary flow through the secondary flow inlet 14. The supercooled liquid outside the gas collecting hood 103 passes through the coolant outlet 12 and the working medium pump 3 (fluorine pump) to enter the ejector 2, and mix with the secondary flow through the primary flow inlet 15. After the primary flow and the secondary flow are mixed, the bubbles contained in the secondary flow are broken and become a series of tiny bubbles. Together with the phase change cooling medium, they leave the ejector 2 through the mixed flow outlet 16, and are supercooled by the heat exchanger 4. The internal tiny bubbles condense into supercooled liquid, and return to the cooling box 1 through the coolant inlet 13 to cool the computer motherboard 104 and the power battery 105.

[0064] 2) Function of the ejector 2: The medium at the gas collecting hood outlet 11 may be pure liquid, gas, or a gas-liquid mixture. Setting the working fluid pump 3 as a power source may cause cavitation, but the ejector 2 does not have this problem.

[0065] 3) Function of the float controller 102: When the heat load is too large, there is too much gas on the upper part of the gas collecting hood, and the liquid level drops to a certain level, an alarm is issued and the load is reduced.

[0066] 4) Function of the stop valve 6: When it is necessary to add a computer motherboard 104 or a power battery 105 or to perform maintenance, it is only necessary to reduce the thermal power and temperature of the computer motherboard 104 and the power battery 105 to below the saturation temperature of the phase change cooling medium 106, so that the working state is single-phase heat transfer, and then close the stop valve 6, raise the air collecting hood 103, and the cooling box 1 operates in a single-phase immersion cooling mode without shutting down all loads in the box.

[0067] The non-enclosed phase change immersion cooling system described in the present application has at least the following three operating states:

[0068] First single-phase operation state: the load is low, the temperature of the computer mainboard 104 and the power battery 105 are both below the saturation temperature of the phase change cooling medium 106, and the gas hood outlet 11 is pure liquid;

[0069] The first two-phase operation state: the load is high, the surface temperature of the computer motherboard 104 and the power battery 105 is higher than the saturation temperature of the phase change cooling medium 106, bubbles appear, and the gas hood outlet 11 is a gas-liquid mixture;

[0070] The second two-phase operation state: the load is very high, the surface temperature of the computer motherboard 104 and the power battery 105 is higher than the saturation temperature of the phase change cooling medium 106, bubbles appear, and the gas gathers above the gas collecting hood 103, and the gas collecting hood outlet 11 is pure gas.

[0071] Compared with the traditional phase change immersion cooling system, the non-closed phase change immersion cooling system described in this application has the following advantages:

[0072] 1. The box does not need to be sealed, only a cover is needed on the top to reduce the volatilization of the medium;

[0073] 2. The process of disassembling and assembling the load in the box is simple. Just lift the gas collecting hood, and there is no need to test the air tightness.

[0074] 3. No high voltage will be generated during operation, which is safer;

[0075] 4. When replacing the mainboard or battery, you only need to reduce the heat load and raise the air hood without stopping the machine.

[0076] In summary, the non-closed phase change immersion cooling system described in the present application combines innovative cooling box design and ejector technology, adopts a non-closed cooling box, reduces medium volatilization by setting a cover structure, and effectively utilizes the high efficiency of phase change cooling through the optimization design of the internal structure and flow path of the cooling box, as well as the organic combination of the ejector and the heat exchanger. At the same time, it avoids the sealing and high pressure problems that may occur in traditional phase change cooling; on the flow path, by adding a working fluid pump and a shut-off valve, the fluidity of the coolant and the optimization of the circulation path are enhanced respectively, and the heat exchange efficiency and stability of the system are improved. During operation, the system can automatically adjust the working state according to the load, including single-phase operation state and two-phase operation state, to adapt to different cooling needs. Compared with the traditional phase change immersion cooling system, the non-closed phase change immersion cooling system described in the present application not only simplifies the operating process, improves safety and maintainability, but also greatly reduces downtime and maintenance costs, providing an efficient, practical and innovative solution for data center and battery cooling.

[0077] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A non-closed phase change immersion cooling system, characterized in that: include: A cooling box (1), comprising a box outer wall (101), the box outer wall (101) being designed with an opening at the top, a phase change cooling medium (106), an air collecting hood (103), and a cooling heat source device being arranged inside the box outer wall (101), the air collecting hood (103) being arranged in a semi-enclosed shape outside the cooling heat source device, the phase change cooling medium (106) being in a liquid state at room temperature and locally boiling to generate bubbles when the cooling heat source device generates heat, an air collecting hood outlet (11) being designed at the upper end of the air collecting hood (103), and a cooling liquid outlet (12) being arranged on the box outer wall (101); An ejector (2), wherein a secondary inlet (14) and a primary inlet (15) are provided on the ejector (2), wherein the primary inlet (15) is connected to the coolant outlet (12) via a first connecting pipe (7), and the secondary inlet (14) is connected to the air collecting hood outlet (11) via a second connecting pipe (8), and the cooling medium flowing into the secondary inlet (14) and the primary inlet (15) is mixed in the ejector (2) and then flows to the heat exchanger (4) via a mixing outlet (16); The heat exchanger (4) is used to cool the mixed liquid injected by the injector (2), and to make the cooled working fluid flow to the cooling box (1) through the return pipeline (9) and then through the cooling liquid inlet (13).

2. The non-closed phase change immersion cooling system according to claim 1, characterized in that: A working fluid pump (3) is arranged on the first connecting pipeline (7).

3. The non-closed phase change immersion cooling system according to claim 1, characterized in that: A stop valve (6) is provided on the second connecting pipeline (8).

4. The non-closed phase change immersion cooling system according to claim 1, characterized in that: The ejector (2) comprises a converging nozzle (201), a mixing section (202) and a diffuser section (203) which are connected in sequence, the primary inlet (15) being arranged on the converging nozzle (201), and the secondary inlet (14) being arranged on the mixing section (202).

5. The non-closed phase change immersion cooling system according to claim 4, characterized in that: The cross section of the mixing section (202) is gradually narrowed from one end close to the convergent nozzle (201) to one end close to the diffuser section (203), and the cross section of the diffuser section (203) is gradually widened from one end close to the mixing section (202) to the far end.

6. The non-closed phase change immersion cooling system according to claim 5, characterized in that: A section of pipeline with the same diameter is arranged on one side of the mixing section (202) close to the diffuser section (203).

7. The non-closed phase change immersion cooling system according to claim 1, characterized in that: The cooling heat source comprises a computer motherboard (104) and / or a power battery (105); the air collecting hood (103) is arranged in a semi-enclosed shape with an opening at the bottom outside the computer motherboard (104) and the power battery (105); and the air collecting hood outlet (11) is arranged on a plane in the middle of the upper end of the air collecting hood (103).

8. The non-closed phase change immersion cooling system according to claim 7, characterized in that: Before the system is operated, the liquid level (107) of the phase-change cooling medium (106) in the cooling box (1) is higher than the setting height of the cooling liquid outlet (12) on the outer wall (101) of the box.

9. The non-closed phase change immersion cooling system according to claim 8, characterized in that: A float controller (102) is arranged in the cooling box (1), and the float controller (102) is used to generate an alarm when there is too much gas on the upper part of the gas collecting hood (103) or the working fluid level (107) drops to a warning position.

10. The non-closed phase change immersion cooling system according to claim 1, characterized in that: Its operating states include at least the following three: The first single-phase operation state: the load is relatively low, the temperature of the cooling heat source device is below the saturation temperature of the phase-change cooling medium (106), and the gas collecting hood outlet (11) is pure liquid; The first two-phase operation state: the load is relatively high, the surface temperature of the cooling heat source device is higher than the saturation temperature of the phase-change cooling medium (106), bubbles appear, and the gas collecting hood outlet (11) is a gas-liquid mixture; The second two-phase operation state: the load is very high, the surface temperature of the cooling heat source device is higher than the saturation temperature of the phase change cooling medium (106), bubbles appear, the gas gathers above the gas collecting hood (103), and the gas collecting hood outlet (11) is pure gas.

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