Laser device and package for mounting optical module

Abstract

This laser device is provided with: a package (100) having a base (110) and a lens (130); and a laser oscillator (150) housed in the package (100). Furthermore, the base body (110) has a first recessed portion (112) and a surface mount type mounting surface (125), the laser oscillator (150) is housed in the first recessed portion (112), the lens (130) is joined to the base body (110) and seals the first recessed portion (112), and laser light emitted from the laser oscillator (150) is irradiated to the outside of the package (100) via the lens (130).

Description

Technical Field

[0001] The present invention relates to a laser device and a package for mounting an optical component. Background Art

[0002] Japanese Patent Application Laid-Open No. 2022-021419 discloses a laser device in which a laser oscillator is housed in a package, and a collimator lens for converting laser light emitted from the laser device into parallel light. Summary of the invention

[0003] The laser device of the present invention has:

[0004] A package having a base and a lens; and

[0005] a laser oscillator, housed in the package,

[0006] The base has a first recess and a surface-mounted mounting surface,

[0007] The laser oscillator is accommodated in the first recess,

[0008] The lens is bonded to the base and seals the first recess.

[0009] The laser beam emitted from the laser oscillator is irradiated to the outside of the package through the lens.

[0010] The optical component mounting package of the present invention comprises:

[0011] substrate and lens,

[0012] The base includes a first recess and a surface-mounted mounting surface, and the first recess has a mounting portion for the optical component.

[0013] The lens can seal the first recess by being bonded to the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view showing a laser device and an optical component mounting package according to a first embodiment of the present invention.

[0015] Figure 2 Yes means Figure 1 An exploded perspective view of a package for mounting an optical component.

[0016] Figure 3 Yes means Figure 1 Top view of the laser device.

[0017] Figure 4A is along Figure 1 Cross-sectional view along line AA.

[0018] Figure 4B is along Figure 1 Cross-sectional view of line BB.

[0019] Figure 4C is along Figure 1 A modified example of the cross-sectional view taken along line BB.

[0020] Figure 5 It is shown in detail Figure 4A An enlarged view of portion C1.

[0021] Fig. 6A It is a longitudinal cross-sectional view showing a laser device and an optical component mounting package according to a second embodiment.

[0022] Figure 6B It is shown in detail Fig. 6A A first example of an enlarged view of portion C2.

[0023] Figure 6C It is shown in detail Fig. 6A A second example of an enlarged view of portion C2.

[0024] Figure 7 1 is a longitudinal sectional view showing a laser device and an optical component mounting package according to a third embodiment.

[0025] Figure 8 It is a perspective view showing a laser device and an optical component mounting package according to a fourth embodiment.

[0026] Fig. 9 is along Figure 8 Cross-sectional view of line DD.

[0027] Fig. 10A This is a perspective view showing a laser device and an optical component mounting package according to a fifth embodiment.

[0028] Fig. 10B It is a perspective view showing a laser device and an optical component mounting package according to a sixth embodiment.

[0029] Fig.11A It is a perspective view showing a laser device and an optical component mounting package according to a seventh embodiment.

[0030] Fig. 11B It is a perspective view showing a laser device and an optical component mounting package according to an eighth embodiment.

[0031] Fig. 12A 1 is a longitudinal sectional view showing a laser device and an optical component mounting package according to a ninth embodiment.

[0032] Fig. 12B It is shown in detail Fig. 12A An enlarged view of portion C3.

[0033] Fig.13A 1 is a longitudinal sectional view showing a laser device and an optical component mounting package according to a tenth embodiment.

[0034] Fig. 13B It is shown in detail Fig.13A Magnified view of portion C4. DETAILED DESCRIPTION

[0035] Hereinafter, various embodiments of the present invention will be described in detail with reference to the drawings.

[0036] (Implementation Method 1)

[0037] Figure 1 It is a perspective view showing a laser device and an optical component mounting package according to a first embodiment of the present invention. Figure 2 Yes means Figure 1 An exploded perspective view of a package for mounting an optical component. Figure 3 Yes means Figure 1 Top view of the laser device. Figure 4A is along Figure 1 Cross-sectional view along line AA. Figure 4B is along Figure 1 Cross-sectional view of line BB. Figure 4C is along Figure 1 A modified example of the cross-sectional view taken along line BB. Figure 5 It is shown in detail Figure 4A An enlarged view of portion C1.

[0038] The laser device 1 according to the first embodiment of the present invention comprises: a package (equivalent to a package for mounting an optical component) 100 having a base 110 and a lens 130; and a laser oscillator (equivalent to an optical component) 150 housed in the package 100. The base 110 may have a first recess 112 and a surface mounting surface 125 (see Figure 4A ).

[0039] The substrate 110 may have an upper surface 110a, a side surface 110b and a lower surface 110c (see Figure 1 The minimum width of the substrate 110 in the horizontal direction may be greater than the dimension in the height direction. The minimum width refers to the distance between the two parallel vertical surfaces when the distance between the two surfaces is the smallest when the substrate 110 is sandwiched between the two parallel vertical surfaces.

[0040] The so-called surface mounting type mounting surface 125 (refer to Figure 4A) refers to: a mounting surface that can be mounted on a portion of a module substrate (not shown) where the laser device 1 is mounted and has no through-holes. The surface-mounted mounting surface 125 may be a structure that does not have a rod-shaped lead (specifically, a rod-shaped lead arranged in a direction perpendicular to the mounting surface 125). The surface-mounted mounting surface 125 may also have a mounting surface that is opposite to the electrode pad of the module substrate. The mounting surface may be a surface that can be bonded to the electrode pad by solder or conductive paste. Although in Figures 1 to 5 In the example shown, the mounting surface 125 is a metal plane, but the mounting surface 125 may include small bumps and depressions, and may also include electrode pads.

[0041] The surface-mounted mounting surface 125 may be located on the side of the base 110 opposite to the first recess 112. That is, when the surface of the opening of the first recess 112 is the upper surface, the mounting surface 125 may be located at the lower part of the base 110. According to this structure, when the laser device 1 is mounted on a module substrate (not shown), the laser can be irradiated in a direction intersecting the substrate surface of the module substrate. In addition, the configuration of the mounting surface 125 is not limited to the above example. When the surface of the opening of the first recess 112 is the upper surface, the mounting surface 125 may be located at other parts such as the side or upper part of the base 110.

[0042] The laser oscillator 150 may be accommodated in the first recess 112. The lens 130 may be bonded to the base 110 to seal the first recess 112. When the laser oscillator 150 is not mounted, the base 110 and the lens 130 are separated, and the lens 130 may be bonded to the base 110 to seal the first recess 112.

[0043] The opening of the first recess 112 may be rectangular in a plan view, or may be Figure 3 The so-called top view refers to the view from the opening side of the first recess 112. The opening of the first recess 112 can be in various shapes such as polygonal, elliptical, oblong, circular, or a combination of these shapes when viewed from top.

[0044] The lens 130 may reduce the spread of the laser light emitted from the laser oscillator 150 . The lens 130 may be a collimating lens. The laser light emitted from the laser oscillator 150 may be irradiated to the outside of the package 100 through the lens 130 .

[0045] The lens 130 can play the above-mentioned role on the laser, and seals the first recess 112 by bonding with the base 110. By sealing the first recess 112, it is possible to reduce the degradation of the laser oscillator 150 over time, and to stably drive the laser oscillator 150. Furthermore, since the lens 130 seals the first recess 112, the number of components can be reduced compared to a structure having both a transparent sealing member and a lens.

[0046] like Figure 3 As shown, in a plan view, the area of ​​the first region 11 of the region occupied by the upper portion of the substrate 110 excluding the region overlapping with the lens 130 may be larger than the area of ​​the lens 130. Figure 3 In the figure, the first region 11 is indicated by a shadow. This structure produces the following effect. That is, when the lens 130 is bonded, the base 110 is fixed by a clamp, and the lens 130 is held by a holder. Since the base 110 has a surface-mounted mounting surface 125, it is easy to use a structure that fixes the base 110 from the side as a clamp structure. Therefore, when the clamp and the holder are close to each other, they interfere with each other. However, by utilizing a structure with a larger area of ​​the first region 11 as described above, the holder that holds the lens 130 and the clamp that fixes the base 110 can be separated in the horizontal direction (i.e., along the direction of the plane when viewed from above). As a result, the possibility of the clamp and the holder interfering with each other can be reduced. Therefore, a stable bonding process of the lens 130 can be achieved. In addition, by utilizing a structure with a larger area of ​​the first region 11 as described above, electrodes 121a to 121d can be added to the first region 11 of the base 110 (see Figure 1 ) and other components other than the lens.

[0047] like Figure 3 As shown, the first region 11 may surround the entire periphery of the lens 130 in a plan view. According to this structure, when the lens 130 is bonded, interference between the jig and the holder can be further prevented, so that a more stable bonding process of the lens 130 can be achieved.

[0048] The lens 130 may have a side surface that can be gripped in a horizontal direction.

[0049] The lens 130 may include a main portion 132 including a curved surface through which the laser passes, and a base portion 134 connected to the main portion 132. The main portion 132 and the base portion 134 may be an integral structure having the same composition. The base portion 134 may have a curved surface, but may also be in the shape of a plate. When viewed from above, the lens 130 may be located at the center of the first region 11, and the main portion 132 may be located at a position offset from the center of the lens 130. By locating the lens 130 at the above-mentioned center, a more stable bonding process of the lens 130 can be achieved. The emission position of the laser (i.e., the emission position from the inside to the outside of the package 100) may sometimes be offset from the center of the base 110 when viewed from above due to the configuration of the constituent elements in the first recess 112. However, by locating the main portion 132 at a position offset from the center of the lens 130, the main portion 132 of the lens 130 can be configured to cope with the offset of the emission position of the laser.

[0050] The base 134 of the lens 130 may be rectangular or shaped as shown in a top view. Figure 3 The base 134 may be in various shapes such as polygonal, elliptical, oblong, circular, or a combination of these shapes when viewed from above.

[0051] Furthermore, the lens 130 is located at the center of the first region 11 in a plan view, while the optical axis of the laser oscillator 150, the reflector 170, or the laser light on the opening may be located at a position offset from the center of the first region 11 in a plan view. Even if the optical axis of the laser oscillator 150, the reflector 170, or the laser light on the opening is located at an offset position, by locating the lens 130 at the center, a stable bonding process of the lens 130 can be achieved.

[0052] Here, the so-called A being located at the center of B may mean that the center of A coincides with the center of B. The so-called center may refer to the center of the plane figure when looking down at the object + the range of the error. The above error may be 5% of the minimum width of the plane figure when looking down at the object. The minimum width may refer to the minimum width when the plane figure is sandwiched by two parallel line segments.

[0053] The laser oscillator 150 may be a semiconductor laser. The optical axis of the laser oscillator 150 may be oriented in the horizontal direction (ie, in the direction along the plane when viewed from above).

[0054] The reflector (equivalent to the optical component) 170 can be mounted on the first recess 112 (see Figure 4B ), the reflector 170 reflects the laser light emitted from the laser oscillator 150 in a vertical direction (i.e., in the direction of the line of sight when viewed from above). The reflector 170 may be a prism reflector. The laser light emitted from the inside of the package 100 to the outside may be the laser light reflected by the reflector 170.

[0055] The portion where the laser oscillator 150 is mounted may be referred to as a first mounting portion 118a (see Figure 4B The portion where the reflector 170 is mounted may be referred to as the second mounting portion 118b (see Figure 4B ).

[0056] There may be a step 113 between the first mounting portion 118a and the second mounting portion 118b (see Figure 4B ), the step 113 is formed so that the first mounting portion 118a is higher than the second mounting portion 118b. According to this structure, when the laser oscillator 150 is mounted on the first mounting portion 118a directly or via a bonding material, the laser emitted from the laser oscillator 150 can be irradiated away from the lower end of the reflector 170. Therefore, it is possible to reduce the waste of laser light. In addition, compared with a structure in which the laser oscillator 150 is mounted via a base such as a sub-mount, it is possible to improve the heat dissipation from the laser oscillator 150 to the base 110.

[0057] The second mounting portion 118b may include an inclined surface inclined relative to the first mounting portion 118a, and the reflector 170 may be mounted on the inclined surface. With this structure, the positioning of the reflector 170 becomes easy when the reflector 170 is mounted. Figure 4C As shown, the second mounting portion 118b may include a horizontal surface, and a reflector 171 having an inclined reflective surface such as a prism reflector may be mounted on the horizontal surface.

[0058] The base 110 may have electrodes 115a to 115e (see FIG. 1 ) in addition to the first mounting portion 118a and the second mounting portion 118b in the first recess 112. Figure 3 ). Any of the electrodes 115a to 115e can be electrically connected to the laser oscillator 150 via a connecting member such as a bonding wire, and supply a driving current to the laser oscillator 150. An element for noise removal (for example, a Zener diode, etc.) can be mounted on any of the electrodes 115a to 115e. An element for monitoring the output power of the laser (for example, a PD: Photo Diode (photodiode)) can be mounted on any of the electrodes 115a to 115e. Any of the electrodes 115a to 115e can be electrically connected to the above-mentioned elements and transmit signals. Any of the electrodes 115a to 115e in the first recess 112 can be connected to the electrodes 121a to 121d outside the first recess 112 via an internal conductor of the substrate 110 (see Figure 1 )Electrical connection.

[0059] The base 110 may have second step portions 114a and 114b located in the first recess 112 (see Figure 3 and Figure 4A). The electrodes 115a to 115e may be located on the second step portions 114a and 114b. With this structure, when any of the electrodes 115a to 115b is electrically connected to the laser oscillator 150, the height of one of the electrodes to be connected can be made close to the height of the other electrode, thereby making the connection easy.

[0060] The second step portions 114a and 114b may be located on one side and the other side so as to sandwich the laser oscillator 150 and the reflector 170 in a plan view. The second step portions 114a and 114b may be included in the first base 110A (see Figure 4A ).

[0061] The base 110 may have a first step portion 123, and a portion of the lens 130 is located in the first step portion 123 (see Figure 1 The first step portion 123 may have directions A2 and A3 (corresponding to the first direction, see FIG. 1 ) which are not parallel to the optical axis A1 of the lens 130. Figure 1 ) on the side surface 123a opposite to the lens 130, there may be a gap 201 between the lens 130 and the side surface 123a (refer to Figure 3 and Figure 5 The gap 201 may be large enough to adjust the horizontal position of the lens 130 when the lens 130 is joined. According to this structure, when the lens 130 is joined, the first step portion 123 can be used to roughly align the lens 130, and the gap 201 can be used to align the optical axis A1 of the lens 130.

[0062] The gap 201 refers to the interval between the side surface 123 a of the first step portion 123 and the lens 130 . The interval is not necessarily occupied by a space, and a bonding material may be placed in the gap 201 .

[0063] The first step portion 123 is annular in plan view and may be provided along the outer circumference of the lens 130. This structure can improve the sealing performance of the lens 130 to the first recess 112. Furthermore, the lens 130 can be positioned and bonded stably.

[0064] The base 110 may have second recesses 124a to 124d connected to the gap 201 (see Figure 1 The second recesses 124a to 124d may be adjacent to the lens 130. The second recesses 124a to 124d may be open to the top of the base 110. Figure 1In the example, there are four second recesses 124a to 124d, but there may be one or more than two. If there are two, the two second recesses 124a and 124c may be arranged to be opposite to each other with the first recess 112 therebetween. According to this structure, when the lens 130 is joined, the holder of the lens 130 can be inserted into the second recesses 124a to 124d. Thus, the lens 130 can be held from the side. If there is one second recess, the lens 130 can be held by suction. If there are two or more second recesses, the lens 130 can be held by suction or gripping. By having the second recesses 124a to 124d, it is possible to stably achieve the process of aligning the optical axis of the lens 130 when the lens 130 is joined.

[0065] like Figure 5 As shown, the lens 130 and the substrate 110 may be bonded by a bonding material 221. The lens 130 may be glass, and the bonding material 221 may be solder.

[0066] The lens 130 may have a metal film 136 at a portion where it is bonded to the substrate 110. Figure 3 As shown, the metal film 136 may be continuous in a ring shape over the entire circumference of the bonding portion. The metal film 136 may be a thin film formed by a film forming device.

[0067] The base 110 may have a metal film 116 at a portion where it is bonded to the lens 130. Figure 3 As shown, the metal film 116 may be continuous in a ring shape over the entire circumference of the bonding portion. The metal film 116 may be a metallized film or a film formed by electroplating on the basis of metallization.

[0068] With the above-described structure of the metal films 116 and 136 and the bonding material 221 , it is possible to achieve high sealing performance of the first recess 112 through the lens 130 .

[0069] In addition, although not shown, the metal films 116 and 136 may be located on the side of the first step portion 123 and the side of the lens 130, and the solder, i.e., the bonding material 221, may be located in the gap 201. In addition, the bonding material 221 bonding the lens 130 and the base 110 may be a resin (e.g., a curable adhesive), and the lens 130 may also be a resin.

[0070] like Figure 2As shown, the substrate 110 may include: a first substrate 110A, which is provided with a through hole 119; and a second substrate 110B, which is made of metal and blocks one opening of the through hole 119. Furthermore, the through hole 119 whose opening is blocked on one side by the second substrate 110B may constitute a first recess 112. The laser oscillator 150 may be mounted on the second substrate 110B. The reflector 170 may be mounted on the second substrate 110B. The second substrate 110B may also be copper. According to this structure, the heat dissipation of the laser oscillator 150 can be improved. That is, when the laser oscillator 150 generates heat, the heat of the laser oscillator 150 can be dissipated through the second substrate 110B with high thermal conductivity and the surface-mounted mounting surface 125 (refer to Figure 4A ) is effectively released to a module substrate (not shown).

[0071] like Figure 2 As shown, the second base 110B may have a convex portion 118 protruding into the first concave portion 112. In addition, the upper surface of the convex portion 118 may include a first mounting portion 118a for mounting the laser oscillator 150 and a second mounting portion 118b for mounting the reflector 170. According to this structure, in addition to the laser oscillator 150 having high heat dissipation, the optical path length from the laser oscillator 150 to the lens 130 is shortened. As a result, the diffusion of the laser light at this stage reaching the lens 130 can be reduced.

[0072] The first substrate 110A is mainly composed of an insulating member, and may have one or both of a conductor film and an interlayer via (i.e., a conductor) on the surface or inside. The first substrate 110A may have a laminated structure formed by laminating a plurality of insulating layers. The insulating member may be ceramic, glass, or resin. The conductor film and the interlayer via may be a metallized conductor.

[0073] Conductive film 117 (see Figure 4A ) may be located on the bottom surface of the first base 110A (ie, the surface facing the second base 110B). Furthermore, the conductor film 117 and the second base 110B may be bonded together by a bonding material 211 such as a brazing material.

[0074] (Implementation Method 2)

[0075] Fig. 6A It is a longitudinal cross-sectional view showing a laser device and an optical component mounting package according to a second embodiment. Figure 6B It is shown in detail Fig. 6A A first example of an enlarged view of portion C2. Figure 6C It is shown in detail Fig. 6AThe structure of the joint between the lens 130 and the base 110 of the laser device 1A and the package (equivalent to the package for mounting an optical component) 100A of the second embodiment is different from that of the first embodiment or the third to eighth embodiments described later, and the other components may be the same as those of the first embodiment or the third to eighth embodiments described later.

[0076] like FIG. 6A to FIG. 6C As shown, the bonding material 221A bonding the lens 130 and the substrate 110 may be low melting point glass. Fig. 6A In the laser device 1A, the following manufacturing process can be adopted. That is, first, the first substrate 110A and the second substrate 110B are joined by brazing or the like. This process is recorded as the first joining process. Next, the laser oscillator 150 and the reflector 170 are joined to the first mounting portion 118a and the second mounting portion 118b by solder or the like. This process is recorded as the second joining process. If components such as PD and Zener diodes are to be mounted, the joining is performed in the second joining process. Then, the laser oscillator 150 and the like are wired and connected by a wire bonder or the like. Next, the lens 130 is joined to the substrate 110. This process is recorded as the third joining process. In such a manufacturing process, the joining temperature of each joining process can be set in the order of "joining temperature of the first joining process>joining temperature of the second joining process>joining temperature of the third joining process". By using low-melting-point glass as the joining material 221A, the setting of the above-mentioned joining temperature can be easily achieved.

[0077] The lens 130 is made of glass, and the portion bonded to the base 110 may be a surface where the material of the lens 130 is exposed.

[0078] The base 110 includes an insulating member such as ceramic, and the portion bonded to the lens 130 may be the exposed surface of the insulating member.

[0079] like Figure 6B and Figure 6C As shown, the bonding material 221A may be located on two surfaces of the first step portion 123 (i.e., the lower surface 123e and the side surface 123a). Furthermore, the bonding material 221A may be located on the lower surface and the side surface of the edge portion of the lens 130. Furthermore, the bonding material 221A may be located between the substrate 110 and the lens 130. According to this structure, the path (also referred to as "leakage path") that destroys the seal of the first recess 112 can be extended, and the occurrence of leakage of the seal can be reduced. Figure 6BAs shown, the bonding material 221A can be in full contact with both the lower surface 123e and the side surface 123a of the first step portion 123 in at least one longitudinal section. Further, the bonding material 221A can be in full contact with both surfaces not only in one longitudinal section but also in the longitudinal section at any position of the first step portion 123. According to this structure, the occurrence of sealing leakage can be further reduced.

[0080] like Figure 6B and Figure 6C As shown, the bonding material 221A may have a concave meniscus (ie, curved surface) 222 between the base 110 and the lens 130. With this structure, the stress resistance of the bonding material 221A can be improved.

[0081] (Implementation Method 3)

[0082] Figure 7 1 is a longitudinal cross-sectional view showing a laser device and an optical component mounting package according to Embodiment 3. The structure of the laser device 1B and the mounting surface 125 side of the package (equivalent to the optical component mounting package) 100B according to Embodiment 3 is different from that of Embodiment 1, Embodiment 2, or Embodiments 4 to 11 described later, and the other components may be the same as those of Embodiment 1, Embodiment 2, or Embodiments 4 to 11 described later.

[0083] The through hole 119 of the first substrate 110A may have a longitudinal cross section from one end to the other end of the through hole 119. Figure 7 The shape shown. In this shape, the middle width W2 of the through hole 119 is smaller among the widths W1 to W3. Here, the width W1 is the width of the portion close to one opening, the width W3 is the width of the portion close to the other opening, and the width W2 is the width of the portion located between the two portions.

[0084] The first substrate 110A may have a first bottom surface 111A, and the second substrate 110B may have a second bottom surface 111B, and the first bottom surface 111A and the second bottom surface 111B may be adjacent. In the above longitudinal section, the first substrate 110A may have two first bottom surfaces 111A, and the two first bottom surfaces 111A may be located on one side and the other side across the second bottom surface 111B. When viewed from below, the first bottom surface 111A may be a continuous bottom surface and surround the second bottom surface 111B.

[0085] The structure of widths W1 to W3 and the structure of the first bottom surface 111A and the second bottom surface 111B are not limited to the structure in the above-mentioned one longitudinal section, but may also be a structure appearing in a longitudinal section in any direction from one end to the other end of the through hole 119 .

[0086] According to this structure, a part of the first base 110A can be included in the surface mounting surface 125. The first base 110A can include a wiring conductor (i.e., a conductor film and an interlayer via), and the first bottom surface 111A can include an electrode 125a. The electrode 125a can be connected to the above-mentioned wiring conductor. With this structure, it is possible to exchange signals or power through the surface mounting part.

[0087] The second bottom surface 111B may be lower than the first bottom surface 111A. If the first bottom surface 111A includes the electrode 125a, the second bottom surface 111B may be lower than the bottom surface of the electrode 125a. According to this structure, when the first bottom surface 111A and the second bottom surface 111B are mounted on a module substrate (not shown), the second bottom surface 111B can be closer to the module substrate than the first bottom surface 111A. Therefore, when the first bottom surface 111A and the second bottom surface 111B are bonded to the module substrate, the thermal conductivity from the second base 110B to the module substrate can be improved, and the heat dissipation of the laser oscillator 150 can be improved. That is, as a method of bonding to the module substrate, it is assumed that the first bottom surface 111A and the second bottom surface 111B are bonded to the module substrate (or the electrode pad of the module substrate) by a bonding material such as solder or conductive paste. In this assumption, by utilizing the height difference between the second bottom surface 111B and the first bottom surface 111A, the thickness of the bonding material of the second bottom surface 111B can be made thinner, thereby reducing the reduction in thermal conductivity caused by the bonding material. Therefore, the heat dissipation of the second base 110B to the laser oscillator 150 can be improved. In addition, the second bottom surface 111B can also be higher than the first bottom surface 111A. In this case, for example, when a conductive adhesive with a metal filler is used for bonding an MCPCB (Metal Core Printed Circuit Board), the mountability can be improved.

[0088] (Implementation method 4)

[0089] Figure 8 It is a perspective view showing a laser device and an optical component mounting package according to a fourth embodiment. Fig. 9 is along Figure 8 The structure of the upper part of the base 110 and a part of the lens 130 of the laser device 1C and the package (equivalent to the package for mounting the optical component) 100C of the fourth embodiment is different from that of the first to third embodiments or the fifth to ninth embodiments described later, and the other components may be the same as those of the first to third embodiments or the fifth to ninth embodiments described later.

[0090] like Figure 8 As shown, the base 110 may not have the second recesses 124a to 124b shown in the first embodiment (see Figure 1). With this structure, the base 110 can be made thinner.

[0091] like Fig. 9 As shown, the thickness T1 of at least the portion of the lens 130 located at the first step portion 123 may be greater than the height H1 of the first step portion 123. With this structure, the lens 130 can protrude outward from the first step portion 123, and when the lens 130 is bonded, the protruding portion can be held by a holder.

[0092] (Implementation methods five and six)

[0093] Fig. 10A This is a perspective view showing a laser device and an optical component mounting package according to a fifth embodiment. Fig. 10B 1 is a perspective view showing a laser device and an optical component mounting package according to Embodiment 6. The structures of the elements in the first recess 112 of the laser devices 1D, 1E and the packages (equivalent to optical component mounting packages) 100D, 100E according to Embodiments 5 and 6 are different from those of Embodiments 1 to 4 or Embodiments 7 and 8 described later, and the other components may be the same as those of Embodiments 1 to 4 or Embodiments 7 and 8 described later.

[0094] like Fig. 10A As shown in the fifth embodiment, the laser oscillator 150 may be a dual-system laser oscillator capable of emitting two laser beams. In the emitting portion of the laser oscillator 150, the optical axes of the two laser beams are parallel and may be arranged in the horizontal direction.

[0095] The lens 130 is a cylindrical lens, and the central axis of the cylindrical surface of the cylindrical lens can be arranged along the direction in which the optical axes of the two laser beams are arranged.

[0096] like Fig. 10B As shown in the sixth embodiment, the PD 190 for monitoring the power of the laser light can be located on the opposite side of the reflector 170 across the laser oscillator 150. The PD 190 can be mounted on the second substrate 110B. A portion of the laser light from the laser oscillator 150 sometimes leaks to the opposite side of the laser light emission side. According to the above structure, by detecting the leakage of the laser light, the power of the laser light can be monitored more accurately.

[0097] (Implementation methods seven and eight)

[0098] Fig.11A It is a perspective view showing a laser device and an optical component mounting package according to a seventh embodiment. Fig. 11B1 is a perspective view showing a laser device and an optical component mounting package according to Embodiment 8. The shape of the lens 130 of the laser device 1F, 1G and the package (equivalent to the optical component mounting package) 100F, 100G according to Embodiments 7 and 8 and the shape of the joint between the base 110 and the lens 130 are different from those of Embodiments 1 to 6 or Embodiments 9 and 10 described later, and the other components may be the same as those of Embodiments 1 to 6 or Embodiments 9 and 10 described later.

[0099] like Fig.11A As shown in the seventh embodiment, the lens 130 may be circular when viewed from above. The lens surface of the lens 130 (specifically, a curved surface that has the function of reducing the diffusion of laser light) may be located in the entire region when viewed from above. The lens surface may be a spherical surface or an aspherical surface.

[0100] like Fig. 11B As shown in the eighth embodiment, the lens 130 includes a main portion 132 and a base portion 134. The base portion 134 may be circular in a plan view. The base portion 134 may be a disk having side surfaces.

[0101] In the seventh and eighth embodiments, the first step portion 123 of the base 110 may have a circular shape corresponding to the planar shape of the lens 130 in a plan view.

[0102] In the seventh and eighth embodiments, the circle may be replaced by an ellipse or an oblong.

[0103] (Implementation Methods Nine and Ten)

[0104] Fig. 12A 1 is a longitudinal sectional view showing a laser device and an optical component mounting package according to a ninth embodiment. Fig. 12B It is shown in detail Fig. 12A An enlarged view of portion C3. Fig.13A 1 is a longitudinal sectional view showing a laser device and an optical component mounting package according to a tenth embodiment. Fig. 13B It is shown in detail Fig.13A The structure of the joint between the lens 130 and the base 110 of the laser devices 1H, 1I and the packages (equivalent to the packages for mounting optical components) 100H, 100I of the ninth and tenth embodiments is different from that of the first to eighth embodiments, and the other components may be the same as those of the first to eighth embodiments.

[0105] like Fig. 12A Implementation Methods Nine and Fig.13A As shown in the tenth embodiment, the base 110 may not have the first step portion 123 shown in the first embodiment (see Figure 1). In addition, the lens 130 may be bonded to the upper surface 110a of the base 110. The bonded portion between the lens 130 and the base 110 is annular in a plan view and may surround the opening of the first recess 112. By omitting the first step portion 123, the base 110 may be made thinner.

[0106] like Fig. 12B As shown, in the ninth embodiment, the bonding material 221 may be solder or conductive paste. The lens 130 may have a metal film 136 at a portion bonded to the base 110. The base 110 may have a metal film 116 at a portion bonded to the lens 130.

[0107] like Fig. 13B As shown, in the tenth embodiment, the bonding material 221A may be low melting point glass. The lens 130 is glass, and the portion bonded to the substrate 110 may be the surface where the material of the lens 130 is exposed. The substrate 110 includes an insulating member such as ceramic, and the portion bonded to the lens 130 may be the surface where the insulating member is exposed. The bonding material 221A may be located on the lower surface and side surface of the edge of the lens 130.

[0108] In the above-described structures of the ninth and tenth embodiments, it is also possible to achieve high sealing performance of the first recessed portion 112 by the lens 130 .

[0109] In the tenth embodiment, the bonding material 221A may include a concave meniscus (ie, a curved surface) 222 between the base 110 and the lens 130. With this structure, the stress resistance of the bonding material 221A can be improved.

[0110] The embodiments of the present invention have been described above. However, the laser device and the optical component mounting package of the present invention are not limited to the above-described embodiments. The structures shown in the embodiments can be appropriately changed within the scope of the invention.

[0111] An embodiment of the present invention is shown below. In one embodiment,

[0112] (1) The laser device has:

[0113] A package having a base and a lens; and

[0114] a laser oscillator, housed in the package,

[0115] The base has a first recess and a surface-mounted mounting surface,

[0116] The laser oscillator is accommodated in the first recess,

[0117] The lens is bonded to the base and seals the first recess.

[0118] The laser beam emitted from the laser oscillator is irradiated to the outside of the package through the lens.

[0119] (2) The laser device described in (1) above,

[0120] In a plan view, an area of ​​a first region of an area occupied by the upper portion of the base excluding an area overlapping with the lens is larger than an area of ​​the lens.

[0121] (3) The laser device described in (2) above,

[0122] When viewed from above, the first region surrounds the entire periphery of the lens.

[0123] (4) The laser device described in (2) or (3) above,

[0124] The lens has:

[0125] a main portion including a curved surface through which the laser passes; and

[0126] A base portion, connected to the main portion,

[0127] When viewed from above, the lens is located in the center of the first area.

[0128] The main portion is located at a position offset from the center of the lens in a plan view.

[0129] (5) The laser device described in any one of (2) to (4) above,

[0130] When viewed from above, the lens is located in the center of the first area.

[0131] The laser oscillator is located at a position offset from the center of the first region in a plan view.

[0132] (6) The laser device according to any one of (1) to (5) above,

[0133] The base also has a first step portion, and a portion of the lens is located on the first step portion.

[0134] The first step portion has a first side surface facing the lens in a first direction that is not parallel to the optical axis direction of the lens.

[0135] There is a gap between the first side surface and the lens.

[0136] (7) The laser device described in (6) above,

[0137] In a plan view, the first step portion is annular and is disposed along the outer circumference of the lens.

[0138] (8) The laser device described in (6) or (7) above,

[0139] The laser device includes a bonding material bonding the lens and the base.

[0140] The bonding material is provided to extend from a portion of the lower surface of the lens to the gap.

[0141] (9) The laser device described in any one of (6) to (8) above,

[0142] The base body has a second recess connected to the gap,

[0143] The second recessed portion and the lens are adjacent to each other in a plan view.

[0144] (10) The laser device described in any one of (1) to (9) above,

[0145] The laser device includes a bonding material bonding the lens and the base.

[0146] The bonding material is low melting point glass.

[0147] (11) The laser device according to any one of (1) to (9) above,

[0148] The laser device includes a bonding material bonding the lens and the base.

[0149] The bonding material is solder,

[0150] The lens has a metal film at a portion bonded to the base.

[0151] (12) The laser device according to any one of (1) to (11) above,

[0152] The substrate has:

[0153] A first substrate having a through hole; and

[0154] a second substrate which is made of metal and blocks one opening of the through hole;

[0155] The through hole having one opening blocked by the second base constitutes the first recessed portion, and the laser oscillator is mounted on the second base.

[0156] (13) The laser device described in (12) above,

[0157] The second substrate has:

[0158] a convex portion, protruding into the first concave portion;

[0159] A first carrying portion, located on the upper surface of the convex portion, carrying the laser oscillator;

[0160] The second mounting portion is located on the upper surface of the convex portion and is equipped with a reflecting mirror.

[0161] (14) The laser device described in (13) above,

[0162] The second base body is provided with a step between the first mounting portion and the second mounting portion so that the first mounting portion is higher than the second mounting portion.

[0163] (15) The laser device described in (13) or (14) above,

[0164] The second mounting portion includes an inclined surface inclined relative to the first mounting portion,

[0165] The reflector is installed on the inclined surface.

[0166] (16) The laser device described in any one of (13) to (15) above,

[0167] The first base body has a second step portion located in the first recess and an electrode located in the second step portion.

[0168] (17) The laser device described in any one of (12) to (16) above,

[0169] The first substrate has a first bottom surface,

[0170] The second substrate has a second bottom surface,

[0171] The first bottom surface and the second bottom surface are adjacent to each other,

[0172] The second bottom surface is lower than the first bottom surface.

[0173] (18) The laser device according to any one of (1) to (17) above,

[0174] The mounting surface is located on the opposite side of the first recess.

[0175] In one embodiment, (19) an optical component mounting package comprises:

[0176] substrate and lens,

[0177] The base includes a first recess and a surface-mounted mounting surface, and the first recess has a mounting portion for the optical component.

[0178] The lens can seal the first recess by being bonded to the base.

[0179] Industrial Applicability

[0180] The present invention can be used for a laser device and an optical component mounting package.

[0181] Description of Reference Numerals

[0182] 1. 1A~1I laser device

[0183] 11. First Area

[0184] 100 Package (package for mounting optical components)

[0185] 110 Matrix

[0186] 110A First substrate

[0187] 110B Second substrate

[0188] 111A First bottom surface

[0189] 111B Second bottom surface

[0190] 112 First recess

[0191] 113 steps

[0192] 114a, 114b Second step portion

[0193] 115a~115e Electrode

[0194] 116 metal film

[0195] 117 Conductive film

[0196] 118 convex part

[0197] 118a First loading unit

[0198] 118b Second mounting part

[0199] 119 Through hole

[0200] 121a~121d Electrode

[0201] 123 First step

[0202] 123a Side

[0203] 125 Mounting surface

[0204] 130 Lens

[0205] 132 Main Department

[0206] 134 base

[0207] A1 Optical Axis

[0208] A2, A3 first direction

[0209] 150 Laser Oscillator

[0210] 170 Reflector

[0211] 190 PD

[0212] 201 Gap

[0213] 211, 221, 221A Bonding materials

[0214] 222 Meniscus

[0215] T1 Thickness

[0216] H1 Height

[0217] W1~W3 Width

Claims

1. A laser device comprising: A package having a base and a lens; and a laser oscillator, housed in the package, The base has a first recess and a surface-mounted mounting surface, The laser oscillator is accommodated in the first recess, The lens is bonded to the base and seals the first recess. The laser beam emitted from the laser oscillator is irradiated to the outside of the package through the lens.

2. The laser device according to claim 1, wherein: In a plan view, an area of ​​a first region of an area occupied by the upper portion of the base excluding an area overlapping with the lens is larger than an area of ​​the lens.

3. The laser device according to claim 2, wherein: When viewed from above, the first region surrounds the entire periphery of the lens.

4. The laser device according to claim 3, wherein: The lens has: a main portion including a curved surface through which the laser passes; and A base portion, connected to the main portion, When viewed from above, the lens is located in the center of the first area. The main portion is located at a position offset from the center of the lens in a plan view.

5. The laser device according to claim 3, wherein: When viewed from above, the lens is located in the center of the first area. The laser oscillator is located at a position offset from the center of the first region in a plan view.

6. The laser device according to claim 1, wherein: The base also has a first step portion, and a portion of the lens is located on the first step portion. The first step portion has a first side surface facing the lens in a first direction that is not parallel to the optical axis direction of the lens. There is a gap between the first side surface and the lens.

7. The laser device according to claim 6, wherein: In a plan view, the first step portion is annular and is disposed along the outer circumference of the lens.

8. The laser device according to claim 6, wherein: The laser device includes a bonding material bonding the lens and the base. The bonding material is provided to extend from a portion of the lower surface of the lens to the gap.

9. The laser device according to claim 6, wherein: The base body has a second recess connected to the gap, The second recessed portion and the lens are adjacent to each other in a plan view.

10. The laser device according to claim 1, wherein: The laser device includes a bonding material bonding the lens and the base. The bonding material is low melting point glass.

11. The laser device according to claim 1, wherein: The laser device includes a bonding material bonding the lens and the base. The bonding material is solder, The lens has a metal film at a portion bonded to the base.

12. The laser device according to claim 1, wherein: The substrate has: A first substrate having a through hole; and a second substrate which is made of metal and blocks one opening of the through hole; The through hole with one opening blocked by the second base body constitutes the first recessed portion. The laser oscillator is mounted on the second base.

13. The laser device according to claim 12, wherein: The second substrate has: a convex portion, protruding into the first concave portion; A first mounting portion, located on an upper surface of the convex portion, mounting the laser oscillator; and The second mounting portion is located on the upper surface of the convex portion and is equipped with a reflecting mirror.

14. The laser device according to claim 13, wherein: The second base body is provided with a step between the first mounting portion and the second mounting portion so that the first mounting portion is higher than the second mounting portion.

15. The laser device according to claim 13, wherein: The second mounting portion includes an inclined surface inclined relative to the first mounting portion, The reflector is installed on the inclined surface.

16. The laser device according to claim 13, wherein: The first base body has a second step portion located in the first recess and an electrode located in the second step portion.

17. The laser device according to claim 12, wherein: The first substrate has a first bottom surface, The second substrate has a second bottom surface, The first bottom surface and the second bottom surface are adjacent to each other, The second bottom surface is lower than the first bottom surface.

18. The laser device according to claim 1, wherein: The mounting surface is located on the opposite side of the first recess.

19. A package for mounting an optical component, comprising: substrate and lens, The base includes a first recess and a surface-mounted mounting surface, and the first recess has a mounting portion for the optical component. The lens can seal the first recess by being bonded to the base.

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