Laser carving machine for IC carrier plate machining

Abstract

The invention provides a laser carving machine for IC carrier plate machining, and relates to the technical field of IC carrier plate machining equipment, the laser carving machine comprises a laser carving machine base, a first adjusting frame is arranged at the upper end of the laser carving machine base, a second adjusting frame is installed on the first adjusting frame, a laser box is installed on the second adjusting frame, and a laser head is arranged in the laser box; a top rod is fixedly installed at the upper end of the laser box, clamping plates are fixedly installed at the opposite ends of the two sets of connecting strips, fourth sliding grooves are symmetrically formed in the upper end of the placing frame, sliding columns are symmetrically installed in the two fourth sliding grooves in a sliding mode, and two first limiting blocks and inner columns are pushed to slide outwards through two second threaded rings. And then positioning and clamping are completed through the inserting blocks, in the whole overturning process, one end of the containing frame is located in the inner groove all the time, then the overturning stability of the containing frame is guaranteed, the phenomenon that the containing frame falls off due to careless taking is avoided, the existing overturning steps are simplified through the overturning mode, and the machining efficiency of equipment is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of IC substrate processing equipment, and more specifically, particularly relates to a laser engraving machine used for IC substrate processing. Background Art

[0002] Laser engraving machines for IC substrate processing refer to equipment specially used for laser engraving on integrated circuit (IC) substrates. Such laser engraving machines usually have the characteristics of high precision, high stability and high adaptability to meet the strict requirements for fineness, consistency and material compatibility in the IC substrate processing process.

[0003] However, the existing laser engraving machines for IC substrate processing still have the following shortcomings when used: 1. Before processing the IC substrate, it needs to be fixed to ensure stability. However, since the IC substrate may contain embedded passive components (such as resistors, capacitors), buried interconnect structures or bumps, these structures will cause local height differences on the surface of the substrate, which makes it easy for the processing position of the IC substrate to change due to changes in the clamping position. As a result, the height difference of the IC substrate after each fixation is large. Therefore, before each processing, the distance (focal length) between the laser engraving head and the IC substrate needs to be adjusted, which affects the processing efficiency.

[0004] 2. When the IC substrate needs double-sided laser engraving, the existing technology usually removes the IC substrate from the fixture, then turns it over and installs it on the fixture again. The repeated clamping process is inefficient, and there is a risk of it falling and breaking during the removal process.

[0005] Therefore, in view of this, the existing structure and defects are studied and improved, and a laser engraving machine for IC substrate processing is provided, in order to achieve a more practical purpose. Summary of the invention

[0006] In order to solve the above technical problems, the present invention provides a laser engraving machine for IC substrate processing to solve the above problems.

[0007] A laser engraving machine for processing IC substrates, comprising a laser engraving machine base, a first adjustment frame is arranged at the upper end of the laser engraving machine base, a second adjustment frame is mounted on the first adjustment frame, a laser box is mounted on the second adjustment frame, a laser head is arranged inside the laser box, a push rod is fixedly mounted on the upper end of the laser box, first slide grooves are opened on both side walls of the push rod, first screw rods are fixedly mounted on both side walls of the laser head, and first threaded rings are threadedly mounted on the two first screw rods; A protective mechanism is slidably mounted on the laser box; The protection mechanism includes a U-shaped frame, which is slidably installed on the laser box. First sliders are fixedly installed on both side walls of the U-shaped frame. Two first sliders are respectively slidably installed in two first sliding grooves. Two first threaded rings are respectively located under the two first sliders and fit therewith.

[0008] Preferably, a circular groove is opened through the center of the U-shaped frame, cleaning cotton is installed in the inner wall of the circular groove, the laser head is fitted with the cleaning cotton, a vertical bar is fixedly installed at the lower end of the U-shaped frame, side bars are fixedly installed on the side walls of the vertical bars, and a fan assembly is fixedly installed on the side bars.

[0009] Preferably, a placing table is fixedly mounted on the upper end of the base of the laser engraving machine, inner grooves are symmetrically opened in the inner wall of the placing table, and card slots are opened in the inner walls of the two inner grooves, and a placing rack is placed inside the placing table.

[0010] Preferably, a second sliding groove is symmetrically opened in the inner wall of the placing rack, column grooves are symmetrically opened on both side walls of the placing rack, threaded barrels are fixedly installed on both side walls of the placing rack, and strip grooves are opened inside the two threaded barrels.

[0011] Preferably, the two threaded barrels are both threadedly mounted with a second threaded ring, the two threaded barrels are both slidably mounted with an inner column, the two inner columns are both fixedly mounted with a first limit block, and the two groups of the first limit blocks are respectively slidably mounted in the two strip grooves.

[0012] Preferably, plug blocks are fixedly mounted on the ends of the two inner columns that are away from each other, and the two plug blocks are respectively matched with the two card slots.

[0013] Preferably, moving bars are symmetrically slidably installed inside the placement rack, and second limit blocks are fixedly installed on both side walls of the two moving bars, and two groups of the second limit blocks are respectively slidably installed in two second sliding grooves.

[0014] Preferably, a third sliding groove is opened inside the two moving bars, and a third screw is symmetrically fixedly installed on the opposite ends of the two moving bars. The two groups of the third screws are respectively inserted in the two column grooves, and the two groups of the third screws are threadedly installed with a third threaded ring.

[0015] Preferably, a fixing frame is fixedly installed on the opposite ends of the two movable bars, a driving motor is fixedly installed on the upper ends of the two fixing frames, a threaded sleeve is symmetrically fixedly installed on the output shafts of the two driving motors, the threads of the two threaded sleeves are opposite, connecting strips are symmetrically slidably installed inside the two third sliding grooves, and the two groups of connecting strips are respectively threadedly installed on the two groups of threaded sleeves.

[0016] Preferably, clamps are fixedly installed on the opposite ends of the two groups of connecting strips, fourth sliding grooves are symmetrically opened on the upper end of the placement rack, sliding columns are symmetrically slidably installed inside the two fourth sliding grooves, springs are fixedly installed on each group of sliding columns, fixed blocks are fixedly installed on the upper ends of the two groups of sliding columns, and the two groups of fixed blocks are respectively slidably installed inside the two groups of fourth sliding grooves.

[0017] Compared with the prior art, the present invention has the following beneficial effects: In the present invention, by providing the column groove, the moving bar, the third screw rod and the third threaded ring, the movement of the two moving bars will also drive the two groups of the third screw rods to slide inside the two groups of column grooves. When the two moving bars move to abut against the two ends of the IC carrier, the two groups of the third threaded rings can be rotated on the two groups of the third screw rods to complete the position limiting of the two moving bars, so that the device is suitable for fixing and processing IC carriers of any specifications when in use, thereby enhancing the scope of application of the device; In the present invention, by providing a laser head, a third slide groove, a driving motor, a threaded sleeve, a connecting strip and a clamping plate, the driving motor will drive the two threaded sleeves connected to the output shaft thereof to rotate accordingly, and because the two threaded sleeves are structures with opposite threads, the two connecting strips will be driven to move toward the middle in the third slide groove under their rotation, and at this time, the two connecting strips will respectively drive the two groups of clamping plates to move toward the middle, and the two ends of the IC carrier will be fixed under the movement of the two clamping plates, and the IC carrier will be fixed by designing the two clamping plates to be synchronously adjusted and clamped, so that the position of the IC carrier can always be kept at the center after each fixation, so that the placement height of the IC carrier is not easy to be offset and misaligned, and the cumbersome steps of adjusting the spacing between the laser head and the IC carrier before each processing are effectively reduced, thereby enhancing the convenience of IC carrier processing; In the present invention, an inner groove, a placing frame, a threaded barrel, a second threaded ring, an inner column, a first limiting block, a sliding column, a spring and a fixed block are provided. When the two fixed blocks move, the two sliding columns will be driven to move relative to each other. At this time, the spring will be compressed accordingly. When the two sliding columns slide out of the two inner grooves, the placing frame can be turned counterclockwise by 180° on the first screw rod, and then the two sliding columns are inserted back into the inner groove to complete the installation. Then, the two second threaded rings can be rotated again on the two threaded barrels, and the two first limiting blocks and the inner column are pushed to slide outwards through the two second threaded rings. Then, the positioning and clamping are completed through the inserting block. During the entire flipping process, one end of the placing frame will always be located inside the inner groove, thereby ensuring its stability when flipping over, and will not fall due to careless taking. In addition, this flipping method simplifies the existing flipping steps and increases the processing efficiency of the equipment. In the present invention, by providing a laser head, a U-shaped frame, a circular groove, cleaning cotton and a fan assembly, the laser head will slide out of the circular groove when the U-shaped frame moves, and then the IC carrier board can be laser engraved. When the U-shaped frame moves, the laser head will contact the cleaning cotton, and then the laser head can be effectively cleaned. The fan assembly can also be started during laser engraving, and the fan assembly can blow air to clean the processing part of the IC carrier board, so that the equipment is convenient for cleaning the laser head and the IC carrier board when in use, ensuring that the IC carrier board is in a clean state during processing, thereby enhancing the processing effect; In the present invention, by providing a laser head, a first screw rod, a first threaded ring and a U-shaped frame, the first threaded ring can be rotated on the first screw rod, and at this time, the two first sliders will drive the U-shaped frame to slide downward under the action of gravity. When the U-shaped frame slides to the bottom of the laser head, the U-shaped frame will effectively protect the laser head, ensuring that the laser head will not be damaged due to accidental touch, thereby enhancing its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the connection structure of the laser box of the present invention; Figure 3 This is a schematic diagram of the U-shaped frame connection explosion structure of the present invention; Figure 4 This is a schematic diagram of the explosion structure of the placement rack connection of the present invention; Figure 5 It is a schematic diagram of the sliding column connection explosion structure of the present invention; Figure 6 It is a schematic diagram of the mobile strip connection explosion structure of the present invention; Figure 7 This is a schematic diagram of the splint connection explosion structure of the present invention; Figure 8 It is a schematic diagram of the plug-in block connection explosion structure of the present invention.

[0019] In the figure, the corresponding relationship between the component names and the figure numbers is as follows: 11, laser engraving machine base; 12, first adjustment frame; 13, second adjustment frame; 14, laser box; 15, laser head; 16, push rod; 17, first slide groove; 18, first screw rod; 19, first threaded ring; 21, U-shaped frame; 22, first slider; 23, round groove; 24, cleaning cotton; 25, vertical bar; 26, side bar; 27, fan assembly; 31, placement table; 32, inner groove; 33, card slot; 34, placement Frame; 35, second slide groove; 36, column groove; 41, threaded tube; 42, strip groove; 43, second threaded ring; 44, inner column; 45, first limit block; 46, plug block; 51, moving bar; 52, second limit block; 53, third slide groove; 54, third screw; 55, third threaded ring; 56, fixed frame; 57, drive motor; 58, threaded sleeve; 59, connecting strip; 61, splint; 62, fourth slide groove; 63, slide column; 64, spring; 65, fixed block. DETAILED DESCRIPTION

[0020] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0021] See also Figure 1-Figure 8 The present invention provides a laser engraving machine for IC substrate processing, comprising a laser engraving machine base 11, a first adjustment frame 12 is arranged at the upper end of the laser engraving machine base 11, a second adjustment frame 13 is installed on the first adjustment frame 12, a laser box 14 is installed on the second adjustment frame 13, a laser head 15 is arranged inside the laser box 14, a push rod 16 is fixedly installed at the upper end of the laser box 14, first slide grooves 17 are opened on both side walls of the push rod 16, first screws 18 are fixedly installed on both side walls of the laser head 15, and first threaded rings 19 are threadedly installed on the two first screws 18; A protective mechanism is slidably mounted on the laser box 14; The protection mechanism includes a U-shaped frame 21, which is slidably installed on the laser box 14. First sliders 22 are fixedly installed on both side walls of the U-shaped frame 21. The two first sliders 22 are respectively slidably installed in the two first slide grooves 17. The two first threaded rings 19 are respectively located under the two first sliders 22 and fit therewith. When the equipment is used up, the first threaded ring 19 can be rotated on the first screw 18. At this time, the two first sliders 22 will drive the U-shaped frame 21 to slide downward under the action of gravity. When the U-shaped frame 21 slides to the bottom of the laser head 15, the U-shaped frame 21 will effectively protect the laser head 15, ensuring that the laser head 15 will not be damaged due to accidental touch, thereby enhancing its service life.

[0022] A circular groove 23 is provided at the center of the U-shaped frame 21. A cleaning cotton 24 is installed in the inner wall of the circular groove 23. The laser head 15 fits with the cleaning cotton 24. When in use, the two first threaded rings 19 can be rotated on the two first screws 18. The rotation of the two first threaded rings 19 will drive the two first sliders 22 to move upward in the two first slide grooves 17. At this time, the two first sliders 22 will drive the U-shaped frame 21 to move upward. Under the movement of the U-shaped frame 21, the laser head 15 will slide out of the circular groove 23, and then the IC carrier board can be laser engraved. Under the movement of the U-shaped frame 21, the laser head 15 will contact with the cleaning cotton 24, and then the laser head 15 can be effectively cleaned. In the laser engraving, the fan assembly 27 can also be started. The fan assembly 27 can blow and clean the processing part of the IC carrier board, so that the equipment is convenient for cleaning the laser head 15 and the IC carrier board when in use, ensuring that the IC carrier board is in a clean state during processing, thereby enhancing the processing effect; A vertical bar 25 is fixedly installed at the lower end of the U-shaped frame 21, and a side bar 26 is fixedly installed on the side wall of the vertical bar 25. A fan assembly 27 is fixedly installed on the side bar 26. A placement table 31 is fixedly installed at the upper end of the laser engraving machine base 11. Inner grooves 32 are symmetrically opened in the inner wall of the placement table 31, and a card slot 33 is opened in the inner wall of the two inner grooves 32. A placement rack 34 is placed inside the placement table 31, and a second slide slot 35 is symmetrically opened in the inner wall of the placement rack 34. Column slots 36 are symmetrically opened on the side walls of the placement rack 34, and the side walls of the placement rack 34 are fixedly installed. Threaded barrel 41, two threaded barrels 41 are provided with strip grooves 42 inside, two threaded barrels 41 are threadedly installed with second threaded rings 43, two threaded barrels 41 are slidably installed with inner columns 44 inside, two inner columns 44 are fixedly installed with first limit blocks 45, two groups of first limit blocks 45 are respectively slidably installed in the two strip grooves 42, two inner columns 44 are fixedly installed with plug blocks 46 at the ends opposite to each other, and the two plug blocks 46 are respectively adapted to the two card slots 33, and the placement rack 34 is symmetrically slidably installed with moving bars 51 inside, and the two moving bars 51 are Second limit blocks 52 are fixedly installed on both side walls, and two groups of second limit blocks 52 are slidably installed in the two second slide grooves 35 respectively. A third slide groove 53 is opened inside the two moving bars 51. Third screw rods 54 are symmetrically fixedly installed on the opposite ends of the two moving bars 51. The two groups of third screw rods 54 are respectively inserted into the two column grooves 36. The two groups of third screw rods 54 are threadedly installed with third threaded rings 55. When in use, the two ends of the IC carrier can be placed between the two groups of clamping plates 61 respectively. At this time, the two moving bars 51 can be relatively moved. The movement of the moving bar 51 will drive the two sets of second limit blocks 52 to slide in the two second slide grooves 35. At the same time, the movement of the two moving bars 51 will also drive the two sets of third screw rods 54 to slide inside the two sets of column grooves 36. When the two moving bars 51 move to abut against the two ends of the IC carrier, the two sets of third threaded rings 55 can be rotated on the two sets of third screw rods 54 to complete the limiting of the two moving bars 51, so that the device is suitable for fixing and processing IC carriers of any specifications when in use, thereby enhancing the scope of application of the device. A fixing frame 56 is fixedly installed on the opposite ends of the two moving bars 51, and a driving motor 57 is fixedly installed on the upper ends of the two fixing frames 56. Threaded sleeves 58 are symmetrically fixedly installed on the output shafts of the two driving motors 57. The threads of the two threaded sleeves 58 are opposite. Connecting bars 59 are symmetrically slidably installed inside the two third slide grooves 53. The two groups of connecting bars 59 are respectively threadedly installed on the two groups of threaded sleeves 58. When the two moving bars 51 limit the IC carrier, the two driving motors 57 can be selectively started at this time (when the clamping part of the IC carrier is flat, the two driving motors 57 can be started at the same time, and when the clamping part of the IC carrier is uneven, the driving motor 57 at the flat end can be started). Under the action of the driving motor 57, the threaded sleeve 5 connected to its output shaft will be driven 8 rotates accordingly, and because the two threaded sleeves 58 are structures with opposite threads, the two connecting strips 59 are driven to move toward the middle in the third slide groove 53 under their rotation, and at this time, the two connecting strips 59 will respectively drive the two clamping plates 61 to move toward the middle, and the two ends of the IC carrier will be fixed under the movement of the two clamping plates 61, and the IC carrier is fixed by designing the two clamping plates 61 to be synchronously adjusted and clamped, so that the position of the IC carrier can always be kept at the center after each fixation, so that the placement height of the IC carrier is not easy to be offset and misplaced, effectively reducing the cumbersome steps of adjusting the distance between the laser head 15 and the IC carrier before each processing, thereby enhancing the convenience of IC carrier processing; The clamping plates 61 are fixedly installed on the opposite ends of the two groups of connecting strips 59, and the fourth sliding grooves 62 are symmetrically opened on the upper end of the placement frame 34. The sliding posts 63 are symmetrically slidably installed inside the two fourth sliding grooves 62. A spring 64 is fixedly installed on each group of sliding posts 63. The upper ends of the two groups of sliding posts 63 are fixedly installed with fixed blocks 65. The two groups of fixed blocks 65 are slidably installed inside the two groups of fourth sliding grooves 62 respectively. When it is necessary to turn over the IC carrier, the two second threaded rings 43 can be rotated toward the middle on the two threaded cylinders 41, and then the two first limiting blocks 45 can be moved toward the middle. Under the movement of the two first limiting blocks 45, the two plug-in blocks 46 will be driven to slide out of the two card slots 33. At this time, they can be relatively squeezed to form the two fixed blocks 65 at the rear. When the two fixed blocks 65 are moved, The movement will drive the two sliding posts 63 to move relative to each other, and the spring 64 will be compressed. When the two sliding posts 63 slide out of the two inner grooves 32, the placement rack 34 can be flipped counterclockwise by 180° on the first screw rod, and then the two sliding posts 63 are inserted back into the inner grooves 32 to complete the installation. Then the two second threaded rings 43 can be rotated again on the two threaded cylinders 41, and the two first limit blocks 45 and the inner column 44 are pushed to slide outward by the two second threaded rings 43, and then the positioning card is completed by the insertion block 46. During the entire flipping process, one end of the placement rack 34 will always be located inside the inner groove 32, thereby ensuring its stability when flipping over, and will not fall due to careless picking up. In addition, this flipping method simplifies the existing flipping steps and increases the processing efficiency of the equipment.

[0023] Working principle: In the first step, when using, the two ends of the IC carrier can be placed between the two groups of clamping plates 61 respectively. At this time, the two moving bars 51 can be relatively moved. The movement of the two moving bars 51 will drive the two groups of second limit blocks 52 to slide in the two second slide grooves 35. At the same time, the movement of the two moving bars 51 will also drive the two groups of third screw rods 54 to slide inside the two groups of column grooves 36. When the two moving bars 51 move to abut against the two ends of the IC carrier, the two groups of third threaded rings 55 can be rotated on the two groups of third screw rods 54 to complete the limiting of the two moving bars 51, so that the device is suitable for fixing and processing IC carriers of any specifications when in use, thereby enhancing the scope of application of the device; In the second step, after the two moving bars 51 limit the position of the IC carrier, the two driving motors 57 can be selectively started (when the clamping part of the IC carrier is flat, the two driving motors 57 can be started at the same time, and when the clamping part of the IC carrier is uneven, the driving motor 57 at the flat end can be started). Under the action of the driving motor 57, the threaded sleeve 58 connected to its output shaft will be driven to rotate accordingly. Since the two threaded sleeves 58 have opposite threads, the two connecting bars 59 will be driven to move toward the middle in the two third slide grooves 53 under their rotation. At this time, the two connecting bars 59 are connected to the second drive motor 57. The connecting bar 59 will drive the two clamping plates 61 to move toward the middle, and the two ends of the IC carrier will be fixed under the movement of the two clamping plates 61. The IC carrier is fixed by designing the two clamping plates 61 to be adjusted and clamped synchronously, so that the position of the IC carrier can always be kept at the center after each fixation, so that the placement height of the IC carrier is not easy to be offset and misaligned, which effectively reduces the cumbersome steps of adjusting the distance between the laser head 15 and the IC carrier before each processing, thereby enhancing the convenience of IC carrier processing; In the third step, when the IC carrier needs to be turned over, the two second threaded rings 43 can be rotated toward the middle on the two threaded barrels 41, and then the two first limit blocks 45 can be moved toward the middle. The movement of the two first limit blocks 45 will drive the two inserting blocks 46 to slide out of the two card slots 33. At this time, they can be relatively squeezed to form the two fixed blocks 65 at the rear. The movement of the two fixed blocks 65 will drive the two slide posts 63 to move relatively. At this time, the spring 64 will be compressed. When the two slide posts 63 slide out of the two inner grooves 32, the placement rack 34 can be turned counterclockwise. The first screw is turned 180°, and then the two slide posts 63 are inserted back into the inner groove 32 to complete the installation. Then, the two second threaded rings 43 can be rotated again on the two threaded cylinders 41, and the two first limit blocks 45 and the inner column 44 are pushed to slide outward by the two second threaded rings 43, and then the positioning and clamping are completed by the inserting block 46. During the entire flipping process, one end of the placement rack 34 will always be located inside the inner groove 32, thereby ensuring its stability when flipping, and will not fall due to careless picking up. In addition, this flipping method simplifies the existing flipping steps and increases the processing efficiency of the equipment. The fourth step is that when in use, the two first threaded rings 19 can be rotated on the two first screw rods 18. The rotation of the two first threaded rings 19 will drive the two first sliders 22 to move upward in the two first slide grooves 17. At this time, the two first sliders 22 will drive the U-shaped frame 21 to move upward. Under the movement of the U-shaped frame 21, the laser head 15 will slide out of the circular groove 23, and then the IC carrier board can be laser engraved. Under the movement of the U-shaped frame 21, the laser head 15 will contact the cleaning cotton 24, and then the laser head 15 can be effectively cleaned. In the laser engraving, the fan assembly 27 can also be started. The fan assembly 27 can blow and clean the processing part of the IC carrier board, so that the equipment is convenient for cleaning the laser head 15 and the IC carrier board when in use, ensuring that the IC carrier board is in a clean state during processing, thereby enhancing the processing effect; The fifth step, after the equipment is used, the first threaded ring 19 can be rotated on the first screw 18. At this time, the two first sliders 22 will drive the U-shaped frame 21 to slide downward under the action of gravity. When the U-shaped frame 21 slides below the laser head 15, the U-shaped frame 21 will effectively protect the laser head 15, ensuring that the laser head 15 will not be damaged due to accidental touch, thereby enhancing its service life.

[0024] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A laser engraving machine for processing IC substrates, comprising a laser engraving machine base (11), wherein a first adjustment frame (12) is arranged at the upper end of the laser engraving machine base (11), and characterized in that: A second adjustment frame (13) is mounted on the first adjustment frame (12), a laser box (14) is mounted on the second adjustment frame (13), a laser head (15) is arranged inside the laser box (14), and a push rod (16) is fixedly mounted on the upper end of the laser box (14); Wherein, first slide grooves (17) are provided on both side walls of the push rod (16), first screw rods (18) are fixedly mounted on both side walls of the laser head (15), and first threaded rings (19) are threadedly mounted on both first screw rods (18); A protective mechanism is slidably mounted on the laser box (14); The protection mechanism comprises a U-shaped frame (21), the U-shaped frame (21) is slidably mounted on the laser box (14), first sliders (22) are fixedly mounted on both side walls of the U-shaped frame (21), two first sliders (22) are respectively slidably mounted in two first slide grooves (17), and two first threaded rings (19) are respectively located below the two first sliders (22) and are in contact with them.

2. A laser engraving machine for IC substrate processing as claimed in claim 1, characterized in that: A circular groove (23) is formed through the center of the U-shaped frame (21), a cleaning cotton (24) is installed in the inner wall of the circular groove (23), and the laser head (15) is fitted with the cleaning cotton (24); Wherein, a vertical bar (25) is fixedly mounted on the lower end of the U-shaped frame (21), a side bar (26) is fixedly mounted on the side wall of the vertical bar (25), and a fan assembly (27) is fixedly mounted on the side bar (26).

3. A laser engraving machine for IC substrate processing as claimed in claim 1, characterized in that: A placement table (31) is fixedly mounted on the upper end of the laser engraving machine base (11), and inner grooves (32) are symmetrically provided in the inner wall of the placement table (31); Wherein, a clamping groove (33) is provided in the inner wall of each of the two inner grooves (32), and a placement rack (34) is placed inside the placement platform (31).

4. A laser engraving machine for IC substrate processing as claimed in claim 3, characterized in that: A second slide groove (35) is symmetrically provided in the inner wall of the placement rack (34), and column grooves (36) are symmetrically provided on both side walls of the placement rack (34); Wherein, threaded barrels (41) are fixedly mounted on both side walls of the placement rack (34), and strip-shaped grooves (42) are provided inside the two threaded barrels (41).

5. A laser engraving machine for IC substrate processing as claimed in claim 4, characterized in that: A second threaded ring (43) is threadedly mounted on each of the two threaded barrels (41), and an inner column (44) is slidably mounted inside each of the two threaded barrels (41); Wherein, first limit blocks (45) are fixedly mounted on the two inner columns (44), and two groups of the first limit blocks (45) are slidably mounted in the two strip-shaped grooves (42) respectively.

6. A laser engraving machine for IC substrate processing as claimed in claim 5, characterized in that: Insert blocks (46) are fixedly mounted on the ends of the two inner columns (44) that are separated from each other. The two insert blocks (46) are respectively matched with the two card slots (33).

7. A laser engraving machine for IC substrate processing as claimed in claim 4, characterized in that: The placement rack (34) has movable bars (51) symmetrically slidably installed inside, and second limit blocks (52) are fixedly installed on both side walls of the two movable bars (51); Wherein, two groups of the second limit blocks (52) are slidably mounted in the two second sliding grooves (35) respectively.

8. A laser engraving machine for IC substrate processing as claimed in claim 7, characterized in that: A third sliding groove (53) is provided inside each of the two moving bars (51), and a third screw rod (54) is symmetrically fixedly mounted on opposite ends of the two moving bars (51); The two groups of third screw rods (54) are respectively inserted into the two column grooves (36), and the two groups of third screw rods (54) are both threadedly mounted with third threaded rings (55).

9. A laser engraving machine for IC substrate processing as claimed in claim 8, characterized in that: A fixing frame (56) is fixedly mounted on the ends of the two moving bars (51) that are separated from each other, and a driving motor (57) is fixedly mounted on the upper ends of the two fixing frames (56); The output shafts of the two drive motors (57) are both symmetrically fixedly mounted with threaded sleeves (58), the threads of the two threaded sleeves (58) are opposite to each other, and the insides of the two third slide grooves (53) are both symmetrically slidably mounted with connecting strips (59), and the two groups of connecting strips (59) are respectively threadedly mounted on the two groups of threaded sleeves (58).

10. A laser engraving machine for IC substrate processing as claimed in claim 9, characterized in that: Clamps (61) are fixedly mounted on opposite ends of the two groups of connecting strips (59), fourth slide grooves (62) are symmetrically opened on the upper end of the placement frame (34), and slide columns (63) are symmetrically slidably mounted inside the two fourth slide grooves (62); Wherein, a spring (64) is fixedly mounted on each group of the sliding columns (63), a fixing block (65) is fixedly mounted on the upper ends of the two groups of the sliding columns (63), and the two groups of the fixing blocks (65) are respectively slidably mounted inside the two groups of fourth sliding grooves (62).

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