Environment-friendly halogen-free printing NFC (Near Field Communication) electronic tag manufacturing equipment and manufacturing method thereof

Abstract

The invention discloses environment-friendly halogen-free printing NFC electronic tag manufacturing equipment and a manufacturing method thereof, and particularly relates to the technical field of electronic tag production, the equipment comprises a rack, an electronic tag combination material is arranged on the rack, and a gluer, a chip feeding table, a press-fit bearing table and a traction assembly are further arranged on the rack; a pressing device is arranged above the pressing bearing table, the pressing device is installed on the pressing device in a sliding mode, a fluid pressure cavity is formed in the pressing device, a flow injection pipe is installed on the fluid pressure cavity, the flow injection pipe is connected with a flow supply system, and the flow supply system is used for providing pressure fluid for the fluid pressure cavity. The pressure fluid is injected into the fluid pressure cavity, downward pressure is formed in the fluid pressure cavity, the covering material is pressed downwards in a gentle mode, air between the covering material and the base material is squeezed out, an inner core cannot be damaged, the product quality can be guaranteed, and the product reject ratio is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic tag production, and more specifically, to an environmentally friendly halogen-free printed NFC electronic tag manufacturing device and a manufacturing method thereof. Background Art

[0002] NFC (Near Field Communication) electronic tags are smart tags that integrate NFC chips and antennas for wireless communication within a short distance (usually no more than a few centimeters). These tags usually exist in the form of stickers, patches, or other forms, and can be attached to the surface of an object or embedded in a product. NFC electronic tags can be used to store data, communicate with NFC devices (such as smartphones or readers), and perform specific functions. They do not require batteries and communicate with devices through wireless induction technology.

[0003] NFC tags have a wide range of applications, including but not limited to: payment and transactions, access control and identity authentication, logistics and inventory management, and device pairing, etc. In the prior art, the core structure of NFC tags is the NFC chip. During production, the manufactured chip and antenna need to be packaged to form the core of the electronic tag. The final product of the electronic tag is the core component consisting of the NFC chip and antenna structure, which is assembled into the final card or other product structure. That is, the NFC chip and antenna are wrapped inside with a two-layer structure to protect the NFC chip and antenna, and then printed or processed accordingly to form the final NFC electronic tag product.

[0004] In some electronic tag products, a certain degree of flexibility is required. Therefore, the substrate that carries the NFC chip and antenna needs to use a flexible structure, such as polyester film, polyamide film, etc. The material covering the NFC chip and antenna also uses corresponding flexible materials. The two are bonded to wrap the NFC chip and antenna inside. For some scenarios, it is necessary to ensure that the electronic products have a certain degree of protection. For example, in cargo transportation and other scenarios where collisions often occur, it is necessary to ensure that the electronic tags are impact-resistant to avoid damage caused by impact or collision. At this time, the thickness of the packaging materials (substrate and covering material) required for such products needs to be increased accordingly to increase the service life of the electronic tags.

[0005] However, during the production of the above-mentioned flexible electronic tags, the NFC chip and antenna need to be placed between two layers of flexible materials (the base material at the bottom and the cover material at the top) and the two layers of materials need to be bonded. If bubbles remain in the two layers of materials, it is easy to cause the NFC chip and antenna to loosen, affecting their service life. When the corresponding extrusion equipment is used to squeeze the air, the required pressure increases accordingly due to the increase in the thickness of the flexible material. At this time, the pressure directly applied to the NFC chip and antenna also increases, which can easily cause damage to the NFC chip and antenna and affect the use effect. Summary of the invention

[0006] The present invention provides an environmentally friendly halogen-free printed NFC electronic tag manufacturing device and a manufacturing method thereof, and aims to solve the problem that when the existing flexible electronic tags are produced and pressed, the thickness of the flexible material increases, and the pressure required for squeezing the air also increases accordingly, which easily causes damage to the NFC chip and antenna, thereby affecting the product quality.

[0007] To achieve the above object, the present invention provides the following technical solutions: an environmentally friendly halogen-free printed NFC electronic tag manufacturing device, comprising a frame, on which an electronic tag composite material is arranged, the electronic tag composite material comprising a substrate, a covering material and an inner core; The frame is also provided with a glue coater, a chip loading platform, a pressing platform and a pulling assembly. The strip of the substrate passes through the glue coater, the chip loading platform and the pressing platform, and the strip of the covering material passes above the pressing platform and is combined with the substrate and then connected to the pulling assembly together with the substrate. An inner core loading manipulator is provided above the chip loading platform. A presser is arranged above the pressing platform, and the presser is slidably installed on the presser. A fluid pressure chamber is arranged in the presser, and the bottom of the side wall of the fluid pressure chamber is used to contact the covering material. An injection pipe is installed on the fluid pressure chamber, and the injection pipe is connected to the fluid supply system. The fluid supply system is used to provide pressure fluid to the fluid pressure chamber. An upper concave structure is arranged at the bottom of the side wall of the fluid pressure chamber, and a negative pressure hole is arranged in the upper concave structure. The negative pressure hole is connected to the exhaust equipment through an air pipe.

[0008] In a preferred embodiment, the substrate includes a first substrate and a second substrate, the first substrate, the second substrate and the covering material are all installed on a frame in the form of a roll, the first substrate, the second substrate and the covering material are all flexible strips, the thickness of the first substrate is higher than that of the second substrate, and the first substrate, the second substrate and the covering material are all distributed by guiding rollers.

[0009] In a preferred embodiment, the press is connected to the frame via a lifting drive, which is used to control the lifting of the press. The glue applicator includes a first glue coating roller and a second glue coating roller. The first glue coating roller is used to apply glue to the bottom of the second substrate, and the second glue coating roller is used to apply glue to the top of the second substrate.

[0010] In a preferred embodiment, a suction pipe is provided at the bottom of the side wall of the fluid pressure chamber, and the suction pipe is connected to a suction pump through a pipeline. A control valve is provided on the pipeline. The suction pipe is provided corresponding to the upper surface of the covering material in the fluid pressure chamber. The fluid supply system includes an injection pump, which is connected to the injection pipe. The injection pump is connected to the hot source fluid and the cold source fluid respectively through a reversing valve.

[0011] In a preferred embodiment, a plurality of groups of convergence covers are arranged in the fluid pressure chamber, the convergence covers are fixedly installed in the fluid pressure chamber, and the bottom ports of the convergence covers are arranged close to the inner core.

[0012] In a preferred embodiment, an exhaust hole is provided above the fluid pressure chamber, a floating plug is provided below the exhaust hole, a connecting rod is fixedly installed on the top of the floating plug, and the connecting rod is slidably inserted into the exhaust hole.

[0013] In a preferred embodiment, elastic sealing pads are provided at the bottom of the side walls around the fluid pressure chamber, and a groove is provided at the bottom of the side wall of the fluid pressure chamber. The elastic sealing pad is fixedly installed in the groove, and the area of ​​the elastic sealing pad corresponding to the upper concave structure is set as a free section. The side wall of the elastic sealing pad at the position corresponding to the upper concave structure is slidably matched with the side wall of the groove at the bottom of the side wall of the fluid pressure chamber, and an air guide hole is provided at the position of the elastic sealing pad corresponding to the upper concave structure.

[0014] In a preferred embodiment, a large-diameter hole is provided on the top of the air guide hole, and the diameter of the large-diameter hole is larger than the diameter of the air guide hole. A movable ball is placed in the large-diameter hole, and the diameter of the movable ball is smaller than the diameter of the large-diameter hole and larger than the diameter of the air guide hole. The air pipe is also connected to an inflation device through a three-way pipe.

[0015] In a preferred embodiment, push-out blocks are slidably installed at the bottom of both ends of the suppressor, a piston hole is provided in the suppressor, the piston hole is connected to the fluid pressure chamber, a piston rod is fixedly installed on the push-out block, and the piston rod is slidably installed in the piston hole.

[0016] A method for manufacturing an environmentally friendly halogen-free printed NFC electronic tag comprises the following steps: Step 1: Pass the substrate through the glue applicator, then through the chip loading platform and the pressing platform, and pass the covering material through the top of the pressing platform to correspond to the substrate, and connect it to the traction assembly together with the substrate; Step 2: The glue applicator applies glue to the surface of the substrate, and the traction component pulls the substrate to move; Step 3: The inner core loading robot automatically grabs the inner core placed on the chip loading table and places it on the substrate for bonding; Step 4: Control the pressing device to descend, so that the fluid pressure chamber is pressed down corresponding to the inner core, and the substrate is in contact with the covering material; Step 5: Control the negative pressure hole to form negative pressure, so as to suck the covering material at the upper concave structure upwards, thereby forming a "gap" between the covering material and the substrate; Step 6: Control the fluid supply system to input pressure fluid into the fluid pressure chamber, and use the fluid pressure to pressurize the covering material, so that the air between the covering material and the substrate is squeezed out through the "gap", and the covering material and the substrate are completely fitted; Step 7: Release the negative pressure at the negative pressure hole to make the "gap" disappear, and then control the press to rise to complete the pressing; Step 8: The traction component continues to reel up the substrate, and gradually collects the strip containing the inner core after pressing for subsequent processing.

[0017] The beneficial effect of the present invention is that: by injecting pressure fluid into the fluid pressure chamber, the present invention forms a downward pressure in the fluid pressure chamber, and this pressure can cover all surfaces of the covering material, and press the covering material downward in a "gentle" manner, so that the air between the covering material and the substrate can be squeezed out from the "gap" formed by the covering material sucked up by the upper concave structure, thereby completing the uniform and complete pressing of the substrate and the covering material. Moreover, since this method does not have a strong structure for pressing, it will not cause damage to the inner core, and can ensure the quality of the product and reduce the product defect rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 It is a schematic diagram of the processing state of the present invention.

[0020] Figure 3 It is a schematic diagram of the suppressor of the present invention after it is lowered.

[0021] Figure 4 This is a state diagram of the pressing device of the present invention when initially pressing the covering material.

[0022] Figure 5 It is a side view of the pressing device of the present invention when initially pressing the covering material.

[0023] Figure 6 The present invention is based on Figure 4 A diagram showing the state of the covering material being pressed after pressure fluid is injected into the fluid pressure chamber.

[0024] Figure 7 The present invention is based on Figure 5 A diagram showing the state of the covering material being pressed after pressure fluid is injected into the fluid pressure chamber.

[0025] Figure 8 For the present invention Figure 5 A-section structure enlarged view.

[0026] Fig. 9This is a state diagram of the edge of the electronic tag combination material corresponding to the extraction tube of the present invention.

[0027] Fig.10 It is a system composition diagram of the fluid supply system of the present invention.

[0028] Fig.11 This is a schematic structural diagram of the upward concave structure provided at the bottom edge of the fluid pressure chamber of the present invention.

[0029] Fig.12 For the present invention Fig.11 Enlarged view of the structure of part B.

[0030] Fig.13 The present invention is based on Fig.12 The elastic sealing gasket is automatically pressed down after the negative pressure hole is depressurized.

[0031] Fig.14 This is a state diagram of the elastic sealing pad being improved by the present invention and controlling its downward pressure to press the covering material.

[0032] Fig.15 The figure is a schematic diagram of the internal structure of the fluid pressure chamber after adding a convergence cover in the present invention.

[0033] Fig.16 For the present invention Fig.15 Enlarged view of the C structure.

[0034] Fig.17 The manufacturing method flow chart of the present invention.

[0035] The reference numerals are: 1, frame; 11, traction assembly; 12, glue applicator; 121, first glue coating roller; 122, second glue coating roller; 13, chip loading platform; 14, inner core loading manipulator; 15, pressing platform; 16, lifting drive; 17, small halogen-free printer; 2, electronic label combination material; 21, substrate; 211, first substrate; 212, second substrate; 22, covering material; 23, inner core; 3, press; 31, fluid pressure force chamber; 311, injection pipe; 312, extraction pipe; 313, exhaust hole; 32, push-out block; 321, piston rod; 33, piston hole; 34, upper concave structure; 341, negative pressure hole; 342, air pipe; 35, elastic sealing pad; 351, air guide hole; 352, movable ball; 36, convergence cover; 37, floating plug; 371, connecting rod; 4, injection pump; 5, reversing valve; 6, heat source fluid; 7, cold source fluid; 8, extraction pump. DETAILED DESCRIPTION

[0036] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0037] Refer to the instruction manual Figures 1 to 16 , an environmentally friendly halogen-free printed NFC electronic tag manufacturing device, comprising a frame 1, on which an electronic tag composite material 2 is arranged, specifically, the electronic tag composite material 2 comprises a substrate 21, a covering material 22 and an inner core 23, wherein the substrate 21 comprises a first substrate 211 and a second substrate 212, the first substrate 211, the second substrate 212 and the covering material 22 are all installed on the frame 1 in the form of a roll, the first substrate 211, the second substrate 212 and the covering material 22 are all flexible strips, specifically, they can be materials such as polyester film and polyamide film, and the first substrate 211 is thicker than the second substrate 212, and the second substrate 212 is softer than the first substrate 211, so that after the inner core 23 is coated in the covering material 22, the second substrate 212 can be recessed, so as to form a better coating for the inner core 23, and the inner core 23 is a combined structure of an NFC chip and an antenna (it can also be a separate monomer structure), which is installed together on the substrate 21 during manufacturing; The frame 1 is also provided with a glue coater 12, a chip loading platform 13, a pressing platform 15 and a traction assembly 11. The strip of the substrate 21 passes through the glue coater 12, the chip loading platform 13 and the pressing platform 15, and the strip of the covering material 22 passes through the pressing platform 15 and is combined with the substrate 21 and then connected to the traction assembly 11 together with the substrate 21. The traction assembly 11 can use a winding roller structure or other traction equipment for traction. The glue coater 12 is used to apply glue on the surface of the substrate 21. The chip loading platform 13 is used to apply glue on the surface of the substrate 21. An inner core loading manipulator 14 is arranged on the top, and a material tray for placing the inner core 23 is arranged on the outer side of the chip loading platform 13. The inner core loading manipulator 14 is used to grab the inner core 23 stored on the chip loading platform 13 and place it on the substrate 21 passing on the inner core loading manipulator 14. At this time, the surface of the substrate 21 has glue after being coated by the glue coater 12. The inner core 23 can be bonded to the surface of the substrate 21 and fixed, and then with the traction of the traction component 11, it moves with the substrate 21 and contacts with the covering material 22 on the pressing bearing platform 15; A press 3 is arranged above the pressing platform 15, and the press 3 is slidably mounted on the press 3. The press 3 is connected to the frame 1 through a lifting drive 16, and the lifting drive 16 is used to control the lifting of the press 3. A fluid pressure chamber 31 is arranged in the press 3, and the bottom of the side wall of the fluid pressure chamber 31 is used to contact the covering material 22. An injection pipe 311 is installed on the fluid pressure chamber 31, and the injection pipe 311 is connected to a fluid supply system, which is used to provide pressure fluid to the fluid pressure chamber 31. An upper concave structure 34 is arranged at the bottom of the side wall of the fluid pressure chamber 31, and the upper concave structure 34 is an arc-shaped structure within a small area on the bottom of the side wall of the fluid pressure chamber 31. For details, please refer to the attached manual Fig.12 , a negative pressure hole 341 is provided in the upper concave structure 34, and the negative pressure hole 341 is connected to the air extraction device through the air pipe 342; When the inner core 23 moves on the substrate 21 to the pressing support platform 15, the press 3 descends, and the fluid pressure chamber 31 is arranged corresponding to the surrounding of the inner core 23. At this time, the bottom of the fluid pressure chamber 31 first contacts the covering material 22, wherein, at this time, the vacuum device can be controlled to vacuum in the negative pressure hole 341 to form a negative pressure, so that the position of the covering material 22 corresponding to the upper concave structure 34 is adsorbed upward, and the remaining parts are in contact with the bottom of the side wall of the fluid pressure chamber 31, and then the press 3 continues to descend, and the peripheral area of ​​the covering material 22 can be pressed tightly against the substrate 21 (because there is no pressure in the middle area at this time, there is air between the middle area of ​​the covering material 22 and the substrate 21), which is equivalent to the periphery being bonded before the substrate 21, and the inner core 23 located at the upper concave structure 34 is sucked upward, so that a breathable "gap" can be retained between it and the substrate 21, and then the pressure fluid is injected into the fluid pressure chamber 31 through the flow supply system. The bottom of the side wall of the body pressure chamber 31 is in contact with each other, so the pressure fluid will not flow out temporarily. As the pressure fluid gradually increases, a downward pressure is formed in the fluid pressure chamber 31. This pressure can cover all surfaces of the covering material 22, and the covering material 22 is pressed downward in a "gentle" manner, so that the air between the covering material 22 and the substrate 21 can be squeezed out from the "gap" formed by the covering material 22 sucked up by the upper concave structure 34, thereby completing the uniform and complete pressing of the substrate 21 and the covering material 22. Since this method does not have a strong structure for pressing, it will not cause damage to the inner core 23, and the quality of the product can be guaranteed. When the pressing is completed, the inflation structure is closed. At this time, the position of the covering material 22 corresponding to the upper concave structure 34 can automatically fall, and the pressure fluid in the fluid pressure chamber 31 can flow out, so that the "gap" can also be pressure-bonded to complete the pressing. Then the press 3 can be controlled to rise, and the substrate 21 and the covering material 22 can be controlled to move for subsequent processing.

[0038] Among them, refer to the instructions attached Figure 2The glue coating device 12 includes a first glue coating roller 121 and a second glue coating roller 122. The first glue coating roller 121 is used to coat glue on the bottom of the second substrate 212 so that the second substrate 212 is pre-bonded to the first substrate 211, and the second glue coating roller 122 is used to coat glue on the top of the second substrate 212 so that the inner core 23 can be bonded to the second substrate 212 and subsequently contact and bond with the covering material 22. For the arrangement and guidance of the first substrate 211, the second substrate 212 and the covering material 22, corresponding guiding roller structures are used. The specific settings can be determined according to the equipment processing requirements and space. The first glue coating roller 121 and the second glue coating roller 122 used are both commonly used technical solutions in the field of glue coating. Other glue coating solutions can also be used. The automatic grasping of the inner core feeding robot 14 and the specific selection of the lifting drive 16 (such as a hydraulic cylinder, a cylinder, etc.) are all commonly used equipment in industrial production. This embodiment will not be explained in detail. This embodiment only focuses on solving the technical problems raised and describes the work of the relevant presser 3 in detail.

[0039] In the above embodiment, the pressure fluid used in the fluid pressure chamber 31 can be gas. When gas is used, the suppressor 3 can be directly raised after the processing is completed. The pressure fluid can also be water or other liquids without any influence. However, after use, the discharge of the liquid needs to be considered. Therefore, refer to the attached manual for details. Figure 7 and Fig. 9 A suction pipe 312 is provided at the bottom of the side wall of the fluid pressure chamber 31. The suction pipe 312 is connected to the suction pump 8 through a pipeline. A control valve is provided on the pipeline. The suction pipe 312 is provided corresponding to the upper surface of the covering material 22 in the fluid pressure chamber 31. In order to avoid water leakage, a convex structure can be provided on the outer side of the side wall of the fluid pressure chamber 31. The convex structure contacts and seals with the side edges of the substrate 21 and the covering material 22, so that the suction pipe 312 can be set to a minimum. After the pressing is completed, the control valve can be opened, and the liquid in the fluid pressure chamber 31 can be extracted by the suction pump 8, and then the press 3 is lifted. A drying structure can be provided on the pressing support platform 15 to dry the surface of the covering material 22 after pressing.

[0040] For further information, please refer to the attached manual. Fig.10 The flow supply system includes an injection pump 4, which is connected to the injection pipe 311. The injection pump 4 is connected to the hot source fluid 6 and the cold source fluid 7 through the reversing valve 5, wherein the hot source fluid 6 and the cold source fluid 7 are both storage structures, and high-temperature liquid and low-temperature liquid are stored in the internal distribution. A heating structure can be set in the hot source fluid 6 to maintain the high temperature of the liquid.

[0041] It should be noted that, since the flexible materials used for the substrate 21 and the covering material 22 will become relatively softer at a higher temperature, and the adhesive used can be a hot melt adhesive, during the actual pressing, the heat source fluid 6 can be connected first, hot water can be injected into the fluid pressure chamber 31, and high pressure can be provided, so that the covering material 22 can become relatively soft, and at the same time, the fluidity of the adhesive can be improved, so that during uniform pressing, the covering material 22 can better cover the inner core 23, forming a tighter package, and improving the air exhaust efficiency and product quality. After pressing, the suction pump 8 and the injection pump 4 can be opened synchronously, and the reversing valve 5 can be controlled to be connected to the cold source fluid 7 to provide low-temperature liquid to the fluid pressure chamber 31 for fluidity, and cool the covering material 22, the substrate 21 and the adhesive, so that the adhesive can be solidified and fixed to ensure the stability of the product.

[0042] For further information, please refer to the attached manual. Fig.15 When liquid is used as the pressure fluid, a plurality of convergence covers 36 can be arranged in the fluid pressure chamber 31. The convergence covers 36 are fixedly installed in the fluid pressure chamber 31. The bottom port of the convergence cover 36 is arranged close to the inner core 23. In actual use, when the liquid is injected into the fluid pressure chamber 31 from the fluid pressure chamber 31, it preferentially flows into the middle convergence cover 36. At this time, the liquid pressure is first concentrated in the middle of the inner core 23, and the injection speed of the liquid is controlled to be greater than the outflow speed of the liquid from the bottom port of the convergence cover 36, and the liquid is gradually flowed outward and passes through the bottom ports of each convergence cover 36 in turn, and then, with the middle of the inner core 23 as the center, outward pressure can be formed in turn, which is conducive to achieving gradual compression from the middle to the outside, accelerating the air discharge speed, and increasing the air discharge effect.

[0043] Refer to the instruction manual Fig.15 and Fig.16 In order to prevent the residual air in the original fluid pressure chamber 31 from affecting the liquid pressure, the present embodiment also provides the following technical solutions. Specifically, an exhaust hole 313 is provided above the fluid pressure chamber 31, and a floating plug 37 is provided below the exhaust hole 313. A connecting rod 371 is fixedly installed on the top of the floating plug 37, and the connecting rod 371 is slidably inserted into the exhaust hole 313. When liquid is injected, the air in the fluid pressure chamber 31 can be discharged from the exhaust hole 313 first until the liquid is full. The floating plug 37 floats up due to the buoyancy, which can block the exhaust hole 313, and then form a closed space in the fluid pressure chamber 31 to increase the liquid pressure.

[0044] Refer to the instruction manual Figure 7 , Figure 8 as well as Figures 11 to 14, elastic sealing pads 35 are arranged at the bottom of the side walls around the fluid pressure chamber 31, and a groove is arranged at the bottom of the side wall of the fluid pressure chamber 31, and the elastic sealing pads 35 are fixedly installed in the groove, and the area of ​​the elastic sealing pad 35 corresponding to the upper concave structure 34 is arranged as a free section, that is, this section of the elastic sealing pad 35 is not fixedly connected to the upper concave structure 34, and can move freely according to its elasticity, and when moving, the side wall of the elastic sealing pad 35 corresponding to the position of the upper concave structure 34 slides with the side wall of the groove at the bottom of the side wall of the fluid pressure chamber 31, that is, no matter how the elastic sealing pad 35 moves, the elastic sealing pad 35 It is still located in the groove to maintain the sealing inside and outside of the fluid pressure chamber 31. When the presser 3 is pressed down, the elastic sealing pad 35 contacts and cooperates with the covering material 22 to achieve sealing, and the elastic sealing pad 35 located at the upper concave structure 34 can move relatively. At the same time, the elastic sealing pad 35 is provided with an air guide hole 351 at the position corresponding to the upper concave structure 34. After the elastic sealing pad 35 contacts the covering material 22, the air extraction device is started to extract air, so that the upper concave structure 34 forms a negative pressure, and then the air guide hole 351 also forms a negative pressure, so that the covering material 22 corresponding to the position can be lifted upwards. Refer to the attached manual Figure 8 and Fig.12 , so that a "gap" is formed between the covering material 22 and the substrate 21 at this position, so that the gas between the covering material 22 and the substrate 21 can be discharged, and under the action of negative pressure, the covering material 22 at this position is always in close contact with 25, so that under the action of the liquid pressure in the fluid pressure chamber 31, the complete seal between the fluid pressure chamber 31 and the covering material 22 can be maintained until the pressing is completed, the exhaust device is turned off, the negative pressure disappears, and 25 is actively pressed down under the action of its own elastic force, refer to the attached manual Fig.13 , the covering material 22 and the base material 21 are completely pressed together to eliminate the "gap", thereby ensuring the stable discharge of air when the base material 21 and the covering material 22 are pressed together.

[0045] Furthermore, the pressure exerted on the covering material 22 by the elastic force of the elastic sealing pad 35 to reset the covering material 22 is limited. Therefore, the elastic sealing pad 35 is improved in this embodiment. For details, refer to the attached description. Fig.14 A large-diameter hole is provided on the top of the air guide hole 351, and the diameter of the large-diameter hole is larger than the diameter of the air guide hole 351. An active ball 352 is placed in the large-diameter hole, and the diameter of the active ball 352 is smaller than the diameter of the large-diameter hole and larger than the diameter of the air guide hole 351, so that the active ball 352 and the air guide hole 351 form a one-way valve, and the air pipe 342 is also connected to an inflation device through a three-way pipe. Specifically, when air is pumped out, the active ball 352 is automatically turned on to form a negative pressure normally. After the pressing is completed, when it is necessary to control the position of the elastic sealing pad 35 located at the upper concave structure 34 to be pressed downward, the inflation device can be used to inflate the air guide hole 351, and the active ball 352 blocks the air guide hole 351, thereby increasing the pressure above the elastic sealing pad 35, and using this pressure to improve the pressing effect on the covering material 22.

[0046] In the above embodiment, when the covering material 22 initially covers the inner core 23, it is lifted up by the inner core 23, so there are more suspended areas. During the actual pressing, the covering materials 22 on both sides of the inner core 23 are prone to wrinkles or stress concentration due to the large amount of material. For this reason, this embodiment also provides the following technical solutions. For details, refer to the attached manual. Figure 4 and Figure 6 , push-out blocks 32 are slidably installed at the bottom of both ends of the pressing device 3 (both ends along the length direction of the substrate 21 strip), and a piston hole 33 is provided in the pressing device 3, which is connected to the fluid pressure chamber 31, and a piston rod 321 is fixedly installed on the push-out block 32, and the piston rod 321 is slidably installed in the piston hole 33. When the pressing device 3 is pressed down, the push-out block 32 contacts the covering material 22, and then when the pressure fluid is injected into the fluid pressure chamber 31, the pressure fluid pushes the piston rod 321 outward in the piston hole 33, and then when the pressure fluid presses and heats the covering material 22, the push-out block 32 can apply a pulling force to the covering material 22 along its length direction, thereby reducing the formation of wrinkles or stress concentration of the covering material 22 on the substrate 21 (in order to facilitate the identification of the inner core 23 in the drawings of the present invention, the thickness is increased, and the actual thickness of the inner core 23 is relatively thin, so the thickness of the product covered with the covering material 22 is not much different, and the probability of wrinkles during the processing is not very high).

[0047] It should be noted that the bonded substrate 21 and cover material 22 can be subsequently cut and trimmed to obtain the final NFC electronic tag product. The NFC electronic tag manufactured by the present invention has an NFC chip and an antenna structure with dual performance. It can also be selected to use only the NFC chip or the antenna structure. However, no matter how to choose, the final product manufactured by this equipment has a certain flexibility, and the substrate 21 and the cover material 22 are relatively thick. At the same time, the composite bonding strength of the two is high, and there is less internal air residue. The final protection ability of the product is strong, the adaptability is high, and the service life is longer.

[0048] For further information, please refer to the attached manual. Figure 1 and Figure 2During the manufacturing process, the surface of the product can also be printed. For example, a small halogen-free printer 17 is fixedly installed on the frame 1. The small halogen-free printer 17 is located between the traction component 11 and the pressing platform 15. The substrate 21 and the covering material 22 after pressing and bonding are transported to the small halogen-free printer 17, and the small halogen-free printer 17 prints corresponding marks on the outer surface of the covering material 22. In order to make the production process more environmentally friendly, the above-mentioned printing adopts halogen-free printing. Halogen-free printing means that materials containing halogen elements are not used in the printing process (traditional printing materials may contain halogens, such as halogenated organic solvents. Since halogen elements may have adverse effects on the environment and human health in some cases, halogen-free printing technology can reduce or avoid the use of these harmful substances, thereby reducing the impact on the environment).

[0049] Refer to the instruction manual Fig.17 The present invention also provides an environmentally friendly halogen-free printed NFC electronic tag manufacturing method, comprising the following steps: Step 1: Pass the substrate 21 through the glue applicator 12, then through the chip loading platform 13 and the pressing platform 15, and pass the covering material 22 through the top of the pressing platform 15, corresponding to the substrate 21, and connected to the pulling component 11 together with the substrate 21; Step 2: The glue applicator 12 applies glue to the surface of the substrate 21, and the traction assembly 11 tractions the substrate 21 to move; Step 3: The inner core loading robot 14 automatically grabs the inner core 23 placed on the chip loading platform 13 and places it on the substrate 21 for bonding; Step 4: Control the pressing device 3 to descend, so that the fluid pressure chamber 31 presses down the inner core 23 correspondingly, and the substrate 21 contacts the covering material 22; Step 5: Control the negative pressure hole 341 to form negative pressure, so as to suck the covering material 22 at the upper concave structure 34 upward, so as to form a "gap" between the covering material 22 and the substrate 21; Step 6: Control the fluid supply system to input pressure fluid into the fluid pressure chamber 31, and use the fluid pressure to pressurize the covering material 22, so that the air between the covering material 22 and the substrate 21 is squeezed out through the "gap", and the covering material 22 and the substrate 21 are completely attached; Step 7, release the negative pressure at the negative pressure hole 341 to make the "gap" disappear, and then control the pressing device 3 to rise to complete the pressing; Step eight: The traction assembly 11 continues to roll up the substrate 21, and gradually collects the strip containing the inner core 23 after pressing for subsequent processing.

[0050] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. An environmentally friendly halogen-free printed NFC electronic label manufacturing device, characterized by: It comprises a frame (1), on which an electronic label composite material (2) is arranged, and the electronic label composite material (2) comprises a base material (21), a covering material (22) and an inner core (23); The frame (1) is also provided with a glue coater (12), a chip loading platform (13), a pressing platform (15) and a pulling assembly (11); the strip of the substrate (21) passes through the glue coater (12), the chip loading platform (13) and the pressing platform (15); the strip of the covering material (22) passes above the pressing platform (15) and is combined with the substrate (21) and then connected to the pulling assembly (11) together with the substrate (21); an inner core loading robot (14) is provided above the chip loading platform (13); A press (3) is arranged above the pressing platform (15), the press (3) is slidably mounted on the press (3), a fluid pressure chamber (31) is arranged in the press (3), the bottom of the side wall of the fluid pressure chamber (31) is used to contact the covering material (22), an injection pipe (311) is installed on the fluid pressure chamber (31), the injection pipe (311) is connected to a fluid supply system, and the fluid supply system is used to provide pressure fluid to the fluid pressure chamber (31), an upper concave structure (34) is arranged at the bottom of the side wall of the fluid pressure chamber (31), a negative pressure hole (341) is arranged in the upper concave structure (34), and the negative pressure hole (341) is connected to an exhaust device through an air pipe (342).

2. The environmentally friendly halogen-free printed NFC electronic tag manufacturing equipment according to claim 1 is characterized in that: The substrate (21) comprises a first substrate (211) and a second substrate (212); the first substrate (211), the second substrate (212) and the covering material (22) are all installed on the frame (1) in the form of rolls; the first substrate (211), the second substrate (212) and the covering material (22) are all flexible strips; the thickness of the first substrate (211) is greater than that of the second substrate (212); the first substrate (211), the second substrate (212) and the covering material (22) are all distributed by guiding guide rollers.

3. The environmentally friendly halogen-free printed NFC electronic label manufacturing equipment according to claim 2 is characterized in that: The press (3) is connected to the frame (1) via a lifting drive (16), the lifting drive (16) being used to control the lifting of the press (3), the glue coating device (12) comprising a first glue coating roller (121) and a second glue coating roller (122), the first glue coating roller (121) being used to coat glue on the bottom of the second substrate (212), and the second glue coating roller (122) being used to coat glue on the top of the second substrate (212).

4. The environmentally friendly halogen-free printed NFC electronic tag manufacturing equipment according to claim 3 is characterized by: A flow extraction pipe (312) is provided at the bottom of the side wall of the fluid pressure chamber (31), the flow extraction pipe (312) is connected to a flow extraction pump (8) via a pipeline, a control valve is provided on the pipeline, the flow extraction pipe (312) is provided corresponding to the upper surface of the covering material (22) in the fluid pressure chamber (31), the fluid supply system comprises an injection pump (4), the injection pump (4) is connected to the injection pipe (311), and the injection pump (4) is respectively connected to a hot source fluid (6) and a cold source fluid (7) via a reversing valve (5).

5. The environmentally friendly halogen-free printed NFC electronic tag manufacturing equipment according to claim 4, characterized in that: A plurality of groups of convergence covers (36) are arranged in the fluid pressure chamber (31); the convergence covers (36) are fixedly installed in the fluid pressure chamber (31); and the bottom ports of the convergence covers (36) are arranged close to the inner core (23).

6. The environmentally friendly halogen-free printed NFC electronic tag manufacturing equipment according to claim 5, characterized in that: An exhaust hole (313) is provided above the fluid pressure chamber (31), a floating plug (37) is provided below the exhaust hole (313), a connecting rod (371) is fixedly mounted on the top of the floating plug (37), and the connecting rod (371) is slidably inserted into the exhaust hole (313).

7. The environmentally friendly halogen-free printed NFC electronic label manufacturing equipment according to claim 6, characterized in that: The bottom of the side walls around the fluid pressure chamber (31) are all provided with elastic sealing pads (35), the bottom of the side wall of the fluid pressure chamber (31) is provided with a groove, the elastic sealing pad (35) is fixedly installed in the groove, the area of ​​the elastic sealing pad (35) corresponding to the upper concave structure (34) is set as a free section, the side wall of the elastic sealing pad (35) at the position corresponding to the upper concave structure (34) is slidably matched with the side wall of the groove at the bottom of the side wall of the fluid pressure chamber (31), and the position of the elastic sealing pad (35) corresponding to the upper concave structure (34) is provided with an air guide hole (351).

8. The environmentally friendly halogen-free printed NFC electronic tag manufacturing equipment according to claim 7, characterized in that: A large-diameter hole is provided at the top of the air guide hole (351), the diameter of the large-diameter hole is larger than the diameter of the air guide hole (351), a movable ball (352) is placed in the large-diameter hole, the diameter of the movable ball (352) is smaller than the diameter of the large-diameter hole and larger than the diameter of the air guide hole (351), and the air pipe (342) is also connected to an inflation device via a three-way pipe.

9. The environmentally friendly halogen-free printed NFC electronic label manufacturing equipment according to claim 8, characterized in that: An outward push block (32) is slidably mounted at the bottom of both ends of the suppressor (3). A piston hole (33) is provided in the suppressor (3), and the piston hole (33) is communicated with the fluid pressure chamber (31). A piston rod (321) is fixedly mounted on the outward push block (32), and the piston rod (321) is slidably mounted in the piston hole (33).

10. A method for manufacturing the environmentally friendly halogen-free printed NFC electronic tag manufacturing equipment as claimed in claim 1, characterized in that: The following steps are involved: Step 1: Pass the substrate (21) through the glue applicator (12), then through the chip loading platform (13) and the pressing platform (15), and pass the covering material (22) through the top of the pressing platform (15) to correspond to the substrate (21), and connect it to the pulling component (11) together with the substrate (21); Step 2: The glue applicator (12) applies glue to the surface of the substrate (21), and the traction component (11) tractions the substrate (21) to move; Step 3: The inner core loading robot (14) automatically grabs the inner core (23) placed on the chip loading platform (13) and places it on the substrate (21) for bonding; Step 4: Control the pressing device (3) to descend, so that the fluid pressure chamber (31) presses down the corresponding inner core (23), and the base material (21) contacts the covering material (22); Step 5: Control the negative pressure hole (341) to form a negative pressure, so as to suck the covering material (22) at the upper concave structure (34) upwards, thereby forming a "gap" between the covering material (22) and the base material (21); Step 6: Control the fluid supply system to input pressure fluid into the fluid pressure chamber (31), and apply pressure to the covering material (22) by means of the fluid pressure, so that the air between the covering material (22) and the substrate (21) is squeezed out through the "gap", and the covering material (22) and the substrate (21) are completely fitted together; Step 7: Release the negative pressure at the negative pressure hole (341) to make the "gap" disappear, and then control the pressing device (3) to rise to complete the pressing; Step eight: The traction assembly (11) continues to roll up the substrate (21), and gradually collects the strip containing the inner core (23) after pressing for subsequent processing.

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