Multi-column high-speed rubberizing machine for PCB (Printed Circuit Board)

Abstract

The invention relates to a multi-column high-speed rubberizing machine for PCBs. The multi-column high-speed rubberizing machine is characterized by comprising a conveying mechanism; a rubberizing mechanism is arranged above the conveying mechanism; a cutting mechanism is arranged above the conveying mechanism; a paper tape conveying mechanism is arranged below the cutting mechanism; according to the application, a plurality of rows of high-temperature-resistant red adhesive tapes can be adhered to the bottom of the groove for accommodating the copper block on the PCB at the same time, and when the high-temperature-resistant red adhesive tapes need to be torn off, all the high-temperature-resistant red adhesive tapes can be torn off at one time only by pulling the high-temperature-resistant paper tape.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB production equipment, and more specifically, to a multi-column high-speed glue sticking machine for PCB. Background Art

[0002] In the current PCB industry, the copper embedding process is an important production link. The current process includes a series of steps, such as milling grooves, manually pasting high-temperature resistant red tape, manually placing copper blocks and sticking the tape to the bottom of the groove, drilling auxiliary holes for the first time at the joint, and plugging holes with vacuum resin. In this process, in order to ensure that the copper block can adhere well and facilitate the subsequent drilling and filling of glue holes and vacuum resin plugging operations, a layer of high-temperature resistant red glue needs to be pasted on the bottom of the groove that holds the copper block, and the edge of the glue needs to be folded to leave a margin for subsequent tearing of the tape.

[0003] Usually, during production, the shipping unit (SET) array is combined into a production unit (PNL) to increase the single production area and improve efficiency. However, the industry generally adopts the manual tape sticking and tearing method, which has many obvious disadvantages.

[0004] First of all, the efficiency of manual operation is extremely low, which seriously limits the improvement of overall production efficiency. When faced with large-scale production needs, the speed of manual gluing is far from meeting the requirements. Secondly, manual gluing requires a large amount of labor input and the labor intensity is very high, which not only increases the manpower cost of the enterprise, but also puts a great burden on the workers' bodies. Furthermore, in the process of manual picking and placing of boards, it is very easy to cause quality problems such as scratches due to improper operation, which will directly affect the quality and pass rate of the products. In addition, the accuracy and consistency of manual gluing are also difficult to be reliably guaranteed, which may cause deviations in subsequent processes and thus affect the performance of the entire product. In short, the existing manual tape pasting and tearing method has become an important factor restricting the development of the PCB industry, and a more efficient, precise and labor-saving solution is urgently needed to change this situation. Summary of the invention

[0005] In view of the deficiencies in the prior art, the object of the present invention is to provide a multi-column high-speed glue sticking machine for PCBs to solve the above technical problems.

[0006] The above technical purpose of the present invention is achieved through the following technical scheme: a multi-column high-speed glue sticking machine for PCB, comprising: a conveying mechanism; a glue sticking mechanism is arranged above the conveying mechanism; a cutting mechanism is arranged above the conveying mechanism; and a paper tape conveying mechanism is arranged below the cutting mechanism.

[0007] Specifically, the PCB board to be pasted with tape is placed on the conveying mechanism, the PCB board is conveyed by the conveying mechanism, and the gluing mechanism pastes the tape to the position to be pasted on the PCB board on the conveying mechanism. After the pasting is completed at the position to be pasted on the PCB board, the paper tape conveying mechanism conveys the paper tape to the end of the PCB board, so that the end of the high-temperature resistant red tape is adhered to the high-temperature resistant paper tape, and the tape and paper tape are cut by the cutting mechanism, so that the high-temperature resistant red tape can be exposed on the one hand, and the high-temperature resistant red tape can be easily torn off in the subsequent process on the other hand.

[0008] Optionally, the gluing mechanism includes: a spline shaft; the spline shaft is arranged above the conveying mechanism, and a plurality of gluing modules are arranged on the spline shaft; and a pressure wheel module corresponding to the plurality of gluing modules is also arranged above the conveying mechanism.

[0009] Since there are many locations on the PCB board where the high temperature resistant red tape needs to be pasted, a corresponding number of glue pasting modules are installed on the spline shaft according to the produced PCB board, and the position of each glue pasting module is adjusted so that it can correspond to the position of the bottom of the groove accommodating the copper block on the PCB board. When pasting the high temperature resistant red tape, the high temperature resistant red tape is pulled out from the glue pasting module and pasted on the corresponding position on the PCB board, and then the PCB board is transported forward by the transportation mechanism. At the same time, the high temperature resistant red tape is acted upon by the corresponding pressure wheel module and closely adheres to the board surface of the PCB board, thereby realizing the gluing of the PCB board.

[0010] Among them, a film roll is arranged outside the gluing module, the gluing module can be correspondingly engaged with the spline shaft and fixed at a corresponding position on the spline shaft, and the film roll can rotate on the gluing module to output the high-temperature resistant red tape.

[0011] Optionally, the pressing wheel module includes: a pressing roller; the pressing roller is arranged above the conveying mechanism; and a plurality of pressing wheels corresponding to a plurality of glue laminating modules are arranged on the pressing roller.

[0012] After the high temperature resistant red tape is pasted on the PCB, the PCB moves along with the conveying mechanism, so that the high temperature resistant red tape moves to the bottom of the corresponding pressing wheel, and the high temperature resistant red tape is pressed on the PCB by the corresponding pressing wheel. The pressing wheel can be slidably arranged on the pressing roller, and the number and position of the pressing wheel can be adjusted according to the position of the bottom of the groove accommodating the copper block on the PCB, so that the high temperature resistant red tape is closely attached to the board surface of the PCB.

[0013] Optionally, the pressure wheel module further includes a pressure wheel cylinder; the pressure wheel cylinder is arranged above the conveying mechanism; and the pressure roller is arranged at the output end of the pressure wheel cylinder.

[0014] The height of the pressing roller can be adjusted by the pressing wheel cylinder pusher to adapt to PCB boards of different sizes, and the pressing wheel can press the high-temperature resistant red tape tightly onto the PCB board.

[0015] Optionally, the cutting mechanism includes: a cutter upper cylinder; the cutter upper cylinder is arranged above the conveying mechanism; and a cutter is arranged at the output end of the cutter upper cylinder.

[0016] After the end of the PCB board moves below the cutter, the upper cylinder of the cutter is started to push the cutter down, and the cutter contacts and cuts the high-temperature resistant red tape, thereby completing the gluing of the PCB board.

[0017] Optionally, the cutting mechanism further includes: a lower cutter cylinder; the lower cutter cylinder is arranged below the conveying mechanism, and a negative pressure platform is arranged at the output end of the lower cutter cylinder.

[0018] After the end of the PCB board moves under the cutter, the negative pressure press table receives the high temperature resistant paper tape delivered by the paper tape conveying mechanism, and fixes the high temperature resistant paper tape by adsorbing it. Then, the cylinder under the cutter pushes the negative pressure press table upward, and after the cutter contacts the negative pressure press table, the high temperature resistant red tape and the high temperature resistant paper tape are cut off, so that the end of the high temperature resistant red tape can be stuck to the high temperature resistant paper tape.

[0019] Optionally, the paper tape conveying mechanism includes: an electric slide; the electric slide is arranged below the conveying mechanism; a sliding clamping module is arranged at the output end of the electric slide; a paper roll is arranged on one side of the conveying mechanism; and a paper roll cutting blade is arranged on the cutter.

[0020] The high temperature resistant paper tape output from the paper roll is clamped by the sliding clamping module, and the sliding clamping module is moved by the electric slide table to make the high temperature resistant paper tape flat on the negative pressure table. After the end of the PCB board moves below the cutter, the cutter moves downward under the action of the cylinder on the cutter, and the cutting edge of the paper roll contacts and cuts off the high temperature resistant paper tape.

[0021] Optionally, a clamping spring is provided on the negative pressure platform.

[0022] The high temperature resistant paper tape output from the paper roll is clamped on the negative pressure platform by the clamping spring, and the sliding clamping module can clamp the high temperature resistant paper tape output from the paper roll. The cutting point of the paper roll cutting blade is on the side of the clamping spring away from the paper roll, which can ensure that the high temperature resistant paper tape extending from the paper roll after cutting is always under the clamping spring.

[0023] Optionally, the sliding clamping module includes: a sliding cylinder; the sliding cylinder is arranged at the output end of the electric slide; and a clamping cylinder is arranged at the output end of the sliding cylinder.

[0024] The sliding cylinder pushes the clamping cylinder close to the high temperature resistant paper tape, and the high temperature resistant paper tape is clamped by the clamping cylinder. Then the electric slide drives the sliding cylinder to slide, and the high temperature resistant paper tape is laid on the negative pressure press table. Then the high temperature resistant paper tape is released, and the sliding cylinder and the electric slide are reset.

[0025] Optionally, the conveying mechanism includes: a frame; a loading conveyor belt and a unloading conveyor belt are arranged on the frame; the gluing mechanism is arranged on the frame and located above the loading conveyor belt; the cutting mechanism is arranged on the frame and located between the loading conveyor belt and the unloading conveyor belt; the paper tape conveying mechanism is arranged on the frame and located between the loading conveyor belt and the unloading conveyor belt.

[0026] Specifically, both the feeding conveyor belt and the unloading conveyor belt are synchronous conveyor belts with adjustable spacing; and a flange limit roller is provided on the feeding conveyor belt to limit the position of the PCB board. The cutting mechanism and the paper tape conveying mechanism are both located between the feeding conveyor belt and the unloading conveyor belt, and can cut the high-temperature resistant red tape at the end of the PCB board, and facilitate the high-temperature resistant paper tape to be pasted on the high-temperature resistant red tape.

[0027] In summary, the present invention has the following beneficial effects:

[0028] By setting the same number of adhesive pasting modules as the bottom of the grooves accommodating the copper blocks on the PCB board, multiple rows of high-temperature resistant red adhesive tapes can be pasted to the grooves on the PCB board at the same time, thereby improving production efficiency;

[0029] By setting up a paper tape conveying mechanism, the ends of multiple columns of high temperature resistant red tape can be pasted on the high temperature resistant paper tape. When the high temperature resistant red tape needs to be torn off, all the high temperature resistant red tapes can be torn off at one time by simply pulling the high temperature resistant paper tape. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 It is a schematic cross-sectional structure diagram of the present invention highlighting the cutting mechanism;

[0032] Figure 3 It is a schematic cross-sectional structure diagram of the highlighting glue sticking mechanism of the present invention.

[0033] In the figure: 1. PCB board; 2. frame; 3. conveying mechanism; 31. feeding conveyor belt; 32. unloading conveyor belt; 4. gluing mechanism; 41. spline shaft; 42. gluing module; 43. pressure wheel module; 431. pressure roller; 432. pressure wheel; 433. pressure wheel cylinder; 5. cutting mechanism; 51. upper cylinder of cutter; 52. cutter; 53. lower cylinder of cutter; 54. negative pressure press table; 6. paper tape conveying mechanism; 61. electric slide table; 62. sliding clamping module; 621. sliding cylinder; 622. clamping cylinder; 63. paper roll; 7. paper roll cutting blade; 8. clamping spring. DETAILED DESCRIPTION

[0034] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings. Several embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0036] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments.

[0037] Embodiment 1

[0038] This embodiment provides a multi-column high-speed adhesive bonding machine for PCBs, such as Figure 1-3 As shown, it comprises: a conveying mechanism 3; a gluing mechanism 4 is arranged above the conveying mechanism 3; a cutting mechanism 5 is arranged above the conveying mechanism 3; and a paper tape conveying mechanism 6 is arranged below the cutting mechanism.

[0039] Specifically, the PCB board 1 to be pasted with the tape is placed on the conveying mechanism 3, the PCB board 1 is conveyed by the conveying mechanism 3, and the adhesive mechanism 4 pastes the tape to the position to be pasted on the PCB board 1 on the conveying mechanism 3. After the pasting is completed at the position to be pasted on the PCB board 1, the paper tape conveying mechanism 6 conveys the paper tape to the end of the PCB board 1, so that the end of the high temperature resistant red tape is adhered to the high temperature resistant paper tape, and the tape and the paper tape are cut by the cutting mechanism 5, so that the high temperature resistant red tape can be exposed on the one hand, and the high temperature resistant red tape can be easily torn off in the subsequent process on the other hand.

[0040] Optionally, the gluing mechanism 4 includes: a spline shaft 41; the spline shaft 41 is arranged above the conveying mechanism 3, and a plurality of gluing modules 42 are arranged on the spline shaft 41; and a pressure wheel module 43 corresponding to the plurality of gluing modules 42 is also arranged above the conveying mechanism 3.

[0041] Since there are multiple locations on the PCB board 1 where the high temperature resistant red tape needs to be pasted, a corresponding number of glue pasting modules 42 are installed on the spline shaft 41 according to the produced PCB board 1, and the position of each glue pasting module 42 is adjusted so that it can correspond to the position of the bottom of the groove accommodating the copper block on the PCB board 1. When pasting the high temperature resistant red tape, the high temperature resistant red tape is pulled out from the glue pasting module 42, and pasted on the corresponding position on the PCB board 1, and then the PCB board 1 is transported forward by the transportation mechanism, and at the same time, the high temperature resistant red tape is acted upon by the corresponding pressure wheel module 43, and is tightly attached to the board surface of the PCB board 1, thereby realizing the gluing of the PCB board 1.

[0042] Among them, a film roll is arranged outside the gluing module 42, and the gluing module 42 can be correspondingly engaged with the spline shaft 41 and fixed at a corresponding position on the spline shaft 41, and the film roll can rotate on the gluing module 42 to output the high temperature resistant red tape.

[0043] Optionally, the pressing wheel module 43 includes: a pressing roller 431 ; the pressing roller 431 is arranged above the conveying mechanism 3 ; and a plurality of pressing wheels 432 corresponding to a plurality of glue laminating modules 42 are arranged on the pressing roller 431 .

[0044] After the high temperature resistant red tape is pasted on the PCB board 1, the PCB board 1 moves along with the conveying mechanism 3, so that the high temperature resistant red tape moves to the bottom of the corresponding pressing wheel 432, and the high temperature resistant red tape is pressed on the PCB board 1 by the corresponding pressing wheel 432. The pressing wheel 432 can be slidably arranged on the pressing roller 431, and the number and position of the pressing wheel 432 can be adjusted according to the position of the bottom of the groove accommodating the copper block on the PCB board 1, so that the high temperature resistant red tape is closely attached to the board surface of the PCB board 1.

[0045] Optionally, the pressing wheel module 43 further includes a pressing wheel cylinder 433 ; the pressing wheel cylinder 433 is arranged above the conveying mechanism 3 ; and the pressing roller 431 is arranged at the output end of the pressing wheel cylinder 433 .

[0046] The height of the pressing roller 431 can be adjusted by pushing the pressing wheel cylinder 433 to adapt to PCB boards 1 of different sizes, and the pressing wheel 432 can press the high-temperature resistant red tape tightly onto the PCB board 1.

[0047] Embodiment 2

[0048] This embodiment provides a multi-column high-speed adhesive bonding machine for PCBs, such as Figure 1-3 As shown, it comprises: a conveying mechanism 3; a gluing mechanism 4 is arranged above the conveying mechanism 3; a cutting mechanism 5 is arranged above the conveying mechanism 3; and a paper tape conveying mechanism 6 is arranged below the cutting mechanism.

[0049] Specifically, the PCB board 1 to be pasted with the tape is placed on the conveying mechanism 3, the PCB board 1 is conveyed by the conveying mechanism 3, and the adhesive mechanism 4 pastes the tape to the position to be pasted on the PCB board 1 on the conveying mechanism 3. After the pasting is completed at the position to be pasted on the PCB board 1, the paper tape conveying mechanism 6 conveys the paper tape to the end of the PCB board 1, so that the end of the high temperature resistant red tape is adhered to the high temperature resistant paper tape, and the tape and the paper tape are cut by the cutting mechanism 5, so that the high temperature resistant red tape can be exposed on the one hand, and the high temperature resistant red tape can be easily torn off in the subsequent process on the other hand.

[0050] Optionally, the gluing mechanism 4 includes: a spline shaft 41; the spline shaft 41 is arranged above the conveying mechanism 3, and a plurality of gluing modules 42 are arranged on the spline shaft 41; and a pressure wheel module 43 corresponding to the plurality of gluing modules 42 is also arranged above the conveying mechanism 3.

[0051] Since there are multiple locations on the PCB board 1 where the high temperature resistant red tape needs to be pasted, a corresponding number of glue pasting modules 42 are installed on the spline shaft 41 according to the produced PCB board 1, and the position of each glue pasting module 42 is adjusted so that it can correspond to the position of the bottom of the groove accommodating the copper block on the PCB board 1. When pasting the high temperature resistant red tape, the high temperature resistant red tape is pulled out from the glue pasting module 42, and pasted on the corresponding position on the PCB board 1, and then the PCB board 1 is transported forward by the transportation mechanism, and at the same time, the high temperature resistant red tape is acted upon by the corresponding pressure wheel module 43, and is tightly attached to the board surface of the PCB board 1, thereby realizing the gluing of the PCB board 1.

[0052] Among them, a film roll is arranged outside the gluing module 42, and the gluing module 42 can be correspondingly engaged with the spline shaft 41 and fixed at a corresponding position on the spline shaft 41, and the film roll can rotate on the gluing module 42 to output the high temperature resistant red tape.

[0053] Optionally, the pressing wheel module 43 includes: a pressing roller 431 ; the pressing roller 431 is arranged above the conveying mechanism 3 ; and a plurality of pressing wheels 432 corresponding to a plurality of glue laminating modules 42 are arranged on the pressing roller 431 .

[0054] After the high temperature resistant red tape is pasted on the PCB board 1, the PCB board 1 moves along with the conveying mechanism 3, so that the high temperature resistant red tape moves to the bottom of the corresponding pressing wheel 432, and the high temperature resistant red tape is pressed on the PCB board 1 by the corresponding pressing wheel 432. The pressing wheel 432 can be slidably arranged on the pressing roller 431, and the number and position of the pressing wheel 432 can be adjusted according to the position of the bottom of the groove accommodating the copper block on the PCB board 1, so that the high temperature resistant red tape is closely attached to the board surface of the PCB board 1.

[0055] Optionally, the pressing wheel module 43 further includes a pressing wheel cylinder 433 ; the pressing wheel cylinder 433 is arranged above the conveying mechanism 3 ; and the pressing roller 431 is arranged at the output end of the pressing wheel cylinder 433 .

[0056] The height of the pressing roller 431 can be adjusted by pushing the pressing wheel cylinder 433 to adapt to PCB boards 1 of different sizes, and the pressing wheel 432 can press the high-temperature resistant red tape tightly onto the PCB board 1.

[0057] Optionally, the cutting mechanism 5 includes: a cutter upper cylinder 51; the cutter upper cylinder 51 is arranged above the conveying mechanism 3; and a cutter 52 is arranged at the output end of the cutter upper cylinder 51.

[0058] After the end of the PCB board 1 moves below the cutter 52, the cutter upper cylinder 51 is started to push the cutter 52 downward, and the cutter 52 contacts and cuts the high temperature resistant red tape, thereby completing the gluing of the PCB board 1.

[0059] Optionally, the cutting mechanism 5 further includes: a lower cutter cylinder 53 ; the lower cutter cylinder 53 is arranged below the conveying mechanism 3 , and a negative pressure platform 54 is arranged at the output end of the lower cutter cylinder 53 .

[0060] After the end of the PCB board 1 moves to the bottom of the cutter 52, the negative pressure pressing platform 54 receives the high temperature resistant paper tape conveyed by the paper tape conveying mechanism 6, and fixes the high temperature resistant paper tape by adsorbing the negative pressure pressing platform 54. Subsequently, the lower cylinder 53 of the cutter pushes the negative pressure pressing platform 54 upward, and after the cutter 52 contacts the negative pressure pressing platform 54, the high temperature resistant red tape and the high temperature resistant paper tape are cut off, so that the end of the high temperature resistant red tape is adhered to the high temperature resistant paper tape.

[0061] Embodiment 3

[0062] This embodiment provides a multi-column high-speed adhesive bonding machine for PCBs, such as Figure 1-3 As shown, it comprises: a conveying mechanism 3; a gluing mechanism 4 is arranged above the conveying mechanism 3; a cutting mechanism 5 is arranged above the conveying mechanism 3; and a paper tape conveying mechanism 6 is arranged below the cutting mechanism.

[0063] Specifically, the PCB board 1 to be pasted with the tape is placed on the conveying mechanism 3, the PCB board 1 is conveyed by the conveying mechanism 3, and the adhesive mechanism 4 pastes the tape to the position to be pasted on the PCB board 1 on the conveying mechanism 3. After the pasting is completed at the position to be pasted on the PCB board 1, the paper tape conveying mechanism 6 conveys the paper tape to the end of the PCB board 1, so that the end of the high temperature resistant red tape is adhered to the high temperature resistant paper tape, and the tape and the paper tape are cut by the cutting mechanism 5, so that the high temperature resistant red tape can be exposed on the one hand, and the high temperature resistant red tape can be easily torn off in the subsequent process on the other hand.

[0064] Optionally, the gluing mechanism 4 includes: a spline shaft 41; the spline shaft 41 is arranged above the conveying mechanism 3, and a plurality of gluing modules 42 are arranged on the spline shaft 41; and a pressure wheel module 43 corresponding to the plurality of gluing modules 42 is also arranged above the conveying mechanism 3.

[0065] Since there are multiple locations on the PCB board 1 where the high temperature resistant red tape needs to be pasted, a corresponding number of glue pasting modules 42 are installed on the spline shaft 41 according to the produced PCB board 1, and the position of each glue pasting module 42 is adjusted so that it can correspond to the position of the bottom of the groove accommodating the copper block on the PCB board 1. When pasting the high temperature resistant red tape, the high temperature resistant red tape is pulled out from the glue pasting module 42, and pasted on the corresponding position on the PCB board 1, and then the PCB board 1 is transported forward by the transportation mechanism, and at the same time, the high temperature resistant red tape is acted upon by the corresponding pressure wheel module 43, and is tightly attached to the board surface of the PCB board 1, thereby realizing the gluing of the PCB board 1.

[0066] Among them, a film roll is arranged outside the gluing module 42, and the gluing module 42 can be correspondingly engaged with the spline shaft 41 and fixed at a corresponding position on the spline shaft 41, and the film roll can rotate on the gluing module 42 to output the high temperature resistant red tape.

[0067] Optionally, the pressing wheel module 43 includes: a pressing roller 431 ; the pressing roller 431 is arranged above the conveying mechanism 3 ; and a plurality of pressing wheels 432 corresponding to a plurality of glue laminating modules 42 are arranged on the pressing roller 431 .

[0068] After the high temperature resistant red tape is pasted on the PCB board 1, the PCB board 1 moves along with the conveying mechanism 3, so that the high temperature resistant red tape moves to the bottom of the corresponding pressing wheel 432, and the high temperature resistant red tape is pressed on the PCB board 1 by the corresponding pressing wheel 432. The pressing wheel 432 can be slidably arranged on the pressing roller 431, and the number and position of the pressing wheel 432 can be adjusted according to the position of the bottom of the groove accommodating the copper block on the PCB board 1, so that the high temperature resistant red tape is closely attached to the board surface of the PCB board 1.

[0069] Optionally, the pressing wheel module 43 further includes a pressing wheel cylinder 433 ; the pressing wheel cylinder 433 is arranged above the conveying mechanism 3 ; and the pressing roller 431 is arranged at the output end of the pressing wheel cylinder 433 .

[0070] The height of the pressing roller 431 can be adjusted by pushing the pressing wheel cylinder 433 to adapt to PCB boards 1 of different sizes, and the pressing wheel 432 can press the high-temperature resistant red tape tightly onto the PCB board 1.

[0071] Optionally, the cutting mechanism 5 includes: a cutter upper cylinder 51; the cutter upper cylinder 51 is arranged above the conveying mechanism 3; and a cutter 52 is arranged at the output end of the cutter upper cylinder 51.

[0072] After the end of the PCB board 1 moves below the cutter 52, the cutter upper cylinder 51 is started to push the cutter 52 downward, and the cutter 52 contacts and cuts the high temperature resistant red tape, thereby completing the gluing of the PCB board 1.

[0073] Optionally, the cutting mechanism 5 further includes: a lower cutter cylinder 53 ; the lower cutter cylinder 53 is arranged below the conveying mechanism 3 , and a negative pressure platform 54 is arranged at the output end of the lower cutter cylinder 53 .

[0074] After the end of the PCB board 1 moves to the bottom of the cutter 52, the negative pressure pressing platform 54 receives the high temperature resistant paper tape conveyed by the paper tape conveying mechanism 6, and fixes the high temperature resistant paper tape by adsorbing the negative pressure pressing platform 54. Subsequently, the lower cylinder 53 of the cutter pushes the negative pressure pressing platform 54 upward, and after the cutter 52 contacts the negative pressure pressing platform 54, the high temperature resistant red tape and the high temperature resistant paper tape are cut off, so that the end of the high temperature resistant red tape is adhered to the high temperature resistant paper tape.

[0075] Optionally, the paper tape conveying mechanism 6 includes: an electric slide 61; the electric slide 61 is arranged below the conveying mechanism 3; a sliding clamping module 62 is arranged at the output end of the electric slide 61; a paper roll 63 is arranged on one side of the conveying mechanism 3; and a paper roll cutting blade 7 is arranged on the cutter 52.

[0076] The high temperature resistant paper tape outputted from the paper roll 63 is clamped by the sliding clamping module 62, and the sliding clamping module 62 is moved by the electric slide 61, so that the high temperature resistant paper tape is laid flat on the negative pressure press 54. After the end of the PCB board 1 moves below the cutter 52, the cutter 52 moves downward under the action of the cutter upper cylinder 51, and the paper roll cutting blade 7 contacts and cuts the high temperature resistant paper tape.

[0077] Optionally, a clamping spring 8 is provided on the negative pressure platform 54 .

[0078] The high temperature resistant paper tape outputted from the paper roll 63 is clamped on the negative pressure platform 54 by the clamping spring 8, and the slidable clamping module 62 can clamp the high temperature resistant paper tape outputted from the paper roll 63. The cutting point of the paper roll cutting blade 7 is located on the side of the clamping spring 8 away from the paper roll 63, which can ensure that the high temperature resistant paper tape extending from the paper roll 63 after cutting is always located below the clamping spring 8.

[0079] Optionally, the sliding clamping module 62 includes: a sliding cylinder 621 ; the sliding cylinder 621 is arranged at the output end of the electric slide 61 ; and a clamping cylinder 622 is arranged at the output end of the sliding cylinder 621 .

[0080] The sliding cylinder 621 pushes the clamping cylinder 622 close to the high temperature resistant paper tape, and the high temperature resistant paper tape is clamped by the clamping cylinder 622. Then the electric slide 61 drives the sliding cylinder 621 to slide, and the high temperature resistant paper tape is laid on the negative pressure press 54. Then the high temperature resistant paper tape is released, and the sliding cylinder 621 and the electric slide 61 are reset.

[0081] Optionally, the conveying mechanism 3 includes: a frame 2; a loading conveyor belt 31 and a unloading conveyor belt 32 are arranged on the frame 2; the gluing mechanism 4 is arranged on the frame 2 and located above the loading conveyor belt 31; the cutting mechanism 5 is arranged on the frame 2 and located between the loading conveyor belt 31 and the unloading conveyor belt 32; the paper tape conveying mechanism 6 is arranged on the frame 2 and located between the loading conveyor belt 31 and the unloading conveyor belt 32.

[0082] Specifically, the feeding conveyor belt 31 and the unloading conveyor belt 32 are both synchronous conveyor belts with adjustable spacing; and a flange limiting roller is provided on the feeding conveyor belt 31, which can limit the position of the PCB board 1. The cutting mechanism 5 and the paper tape conveying mechanism 6 are both located between the feeding conveyor belt 31 and the unloading conveyor belt 32, and can cut the high temperature resistant red tape at the end of the PCB board 1, and facilitate the high temperature resistant paper tape to be pasted on the high temperature resistant red tape.

[0083] Embodiment 4

[0084] This embodiment provides a method for gluing a bottom of a groove for accommodating a copper block on a PCB, comprising:

[0085] Place the PCB board to be glued on the feeding conveyor belt 31, adjust the distance between the feeding conveyor belt 31 and the unloading conveyor belt 32, adjust the positions of the glue sticking module 42 and the pressing wheel 432 to correspond to the groove, pull out the high temperature resistant red tape and stick it to the corresponding position of the groove, release the pressing wheel cylinder 433, push the pressing roller 431 to make the pressing wheel 432 press the high temperature resistant red tape;

[0086] Start the feeding conveyor belt 31, and the multi-row glue-applying modules 42 are moved to the designated positions at fixed intervals under the drive of the feeding conveyor belt 31, and the high-temperature resistant red adhesive tape is output, and the pressing wheel 432 presses the high-temperature resistant red adhesive tape onto the board surface;

[0087] The lower cylinder 53 of the cutter drives the negative pressure table 54 to descend to the bottom, the electric slide 61 is in the initial position, the clamping spring 8 is in the initial drooping position, and the electric slide 61 drives the sliding cylinder 621 and the clamping cylinder 622 to move to the exit position of the paper roll 63;

[0088] The sliding cylinder 621 drives the clamping cylinder 622 to move forward, and the high temperature resistant paper tape is clamped by the clamping cylinder 622. The electric slide 61 drives the sliding cylinder 621 to move horizontally, and the high temperature resistant paper tape is pulled out to the notch of the negative pressure press 54 at the end.

[0089] The high temperature resistant paper tape is sucked onto the negative pressure pressing platform 54 by the negative pressure, and the clamping cylinder 622 retracts after being relaxed;

[0090] When the feeding conveyor belt 31 moves the two adjacent PCBs to the cutting position with a fixed distance, the negative pressure of the negative pressure table 54 is turned on, and the upper cylinder 51 and the lower cylinder 53 of the cutter move toward the middle;

[0091] The paper tape is sucked upward by the negative pressure, driving the reed to move together. When it reaches the end point, multiple rows of tapes are cut off, and the paper tape is cut horizontally at the same time. During the process, the paper tape is pressed by the negative pressure table and adhered to the reverse side of the tape.

[0092] Repeat the above steps until all PCB boards 1 are glued and the process ends.

[0093] After the PCB board 1 is glued in the above steps, multiple rows of tapes can be torn off at the same time by simply pulling the high temperature resistant paper tape.

[0094] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A multi-column high-speed glue sticking machine for PCB, characterized in that: include: A conveying mechanism; a gluing mechanism is arranged above the conveying mechanism; a cutting mechanism is arranged above the conveying mechanism; and a paper tape conveying mechanism is arranged below the cutting mechanism.

2. A multi-column high-speed glue sticking machine for PCB according to claim 1, characterized in that: The gluing mechanism comprises: a spline shaft; the spline shaft is arranged above the conveying mechanism, and a plurality of gluing modules are arranged on the spline shaft; and a pressure wheel module corresponding to the plurality of gluing modules is also arranged above the conveying mechanism.

3. A multi-column high-speed glue sticking machine for PCB according to claim 2, characterized in that: The pressing wheel module comprises: a pressing roller; the pressing roller is arranged above the conveying mechanism; and a plurality of pressing wheels corresponding to a plurality of glue laminating modules are arranged on the pressing roller.

4. A multi-column high-speed glue sticking machine for PCB according to claim 3, characterized in that: The pressure wheel module also includes a pressure wheel cylinder; the pressure wheel cylinder is arranged above the conveying mechanism; and the pressure roller is arranged at the output end of the pressure wheel cylinder.

5. The multi-column high-speed glue sticking machine for PCB according to claim 1, characterized in that: The cutting mechanism comprises: a cutter upper cylinder; the cutter upper cylinder is arranged above the conveying mechanism; and a cutter is arranged at the output end of the cutter upper cylinder.

6. A multi-column high-speed glue sticking machine for PCB according to claim 5, characterized in that: The cutting mechanism further comprises: a lower cutter cylinder; the lower cutter cylinder is arranged below the conveying mechanism, and a negative pressure platform is arranged at the output end of the lower cutter cylinder.

7. The multi-column high-speed glue sticking machine for PCB according to claim 5, characterized in that: The paper tape conveying mechanism comprises: an electric slide; the electric slide is arranged below the conveying mechanism; a sliding clamping module is arranged at the output end of the electric slide; a paper roll is arranged on one side of the conveying mechanism; and a paper roll cutting blade is arranged on the cutter.

8. The multi-column high-speed glue sticking machine for PCB according to claim 6, characterized in that: A clamping spring is arranged on the negative pressure platform.

9. The multi-column high-speed glue sticking machine for PCB according to claim 7, characterized in that: The sliding clamping module comprises: a sliding cylinder; the sliding cylinder is arranged at the output end of the electric slide; and a clamping cylinder is arranged at the output end of the sliding cylinder.

10. The multi-column high-speed glue sticking machine for PCB according to claim 1, characterized in that: The conveying mechanism includes: a frame; a loading conveyor belt and a unloading conveyor belt are arranged on the frame; the gluing mechanism is arranged on the frame and located above the loading conveyor belt; the cutting mechanism is arranged on the frame and located between the loading conveyor belt and the unloading conveyor belt; the paper tape conveying mechanism is arranged on the frame and located between the loading conveyor belt and the unloading conveyor belt.

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