Optical signal processing device and optical signal measuring method

Abstract

The invention provides an optical signal processing device which is used for measuring a plurality of micro light-emitting diodes at a wafer level. The optical signal processing device comprises a plurality of optical signal testing elements and an optical signal sensing device, the optical signal testing elements are used for transmitting a plurality of optical signals emitted by a plurality of micro light-emitting diodes. An optical signal test element transmits an optical signal emitted by a micro light emitting diode. The optical signal sensing device is used for sensing the optical signals transmitted by the optical signal testing elements in a plurality of time intervals and generating a plurality of sensing signals according to the optical signals.

Description

Technical Field

[0001] The present disclosure relates to an optical signal processing device, and more particularly to an optical signal processing device for sensing an optical signal generated by a light emitting element. Background Art

[0002] As the size of light-emitting components is getting smaller and smaller, the number of light-emitting components per unit area is increasing. Before light-emitting components are made into products and shipped, they must be tested. Therefore, how to efficiently test the increasing number and density of light-emitting components has become an important issue in this field.

[0003] The above “prior art” description is only to provide background technology, and does not admit that the above “prior art” description reveals the subject matter of the present disclosure, does not constitute the prior art of the present disclosure, and any description of the above “prior art” should not be regarded as any part of this case. Summary of the invention

[0004] An embodiment of the present disclosure provides an optical signal processing device for testing an optical signal of a micro-LED array, wherein the micro-LED array is divided into a plurality of test blocks, each test block includes a plurality of micro-LEDs, and the optical signal processing device tests a single test block at a time, and the optical signal processing device includes a plurality of optical signal testing elements and an optical signal sensing device. The optical signal testing elements are used to transmit a plurality of first optical signals emitted by a plurality of first micro-LEDs of a selected test block within a first time interval; and transmit a plurality of second optical signals emitted by a plurality of second micro-LEDs of the selected test block within a second time interval. An optical signal testing element is used to sense the first optical signals transmitted by the optical signal testing elements within the first time interval; sense the second optical signals transmitted by the optical signal testing elements within the second time interval; and generate a plurality of sensing signals based on the first optical signals and the second optical signals.

[0005] An embodiment of the present disclosure provides an optical signal measurement method for an optical signal processing device, which is used to test an optical signal of a micro-LED array, wherein the micro-LED array is divided into a plurality of test blocks, each test block includes a plurality of micro-LEDs, the optical signal processing device tests a single test block at a time, the optical signal processing device includes a plurality of optical signal test elements and an optical signal sensing device, and the optical signal measurement method includes: aligning the optical signal test elements with a plurality of micro-LEDs of a selected test block on a wafer, the micro-LEDs include a plurality of first LEDs and a plurality of second LEDs; the optical signal test elements transmit the first micro-LEDs to the optical signal processing device; A plurality of first light signals are emitted by a diode within a first time interval, wherein one of the light signal test elements transmits a light signal emitted by a first micro-light emitting diode; the light signal sensing device senses the first light signals transmitted by the light signal test elements, and generates a plurality of first sensing signals based on the first light signals; the light signal test elements transmit a plurality of second light signals emitted by the second micro-light emitting diodes within a second time interval, wherein one of the light signal test elements transmits a light signal emitted by a second micro-light emitting diode; and the light signal sensing device senses the second light signals transmitted by the light signal test elements, and generates a plurality of second sensing signals based on the second light signals.

[0006] An embodiment of the present disclosure provides an optical signal measurement method for an optical signal processing device, which is used to test an optical signal of a micro-LED array. The micro-LED array is divided into a plurality of test blocks, each test block includes a plurality of micro-LEDs, and the optical signal processing device tests a single test block at a time. The optical signal processing device includes a plurality of optical signal test elements and an optical signal sensing device. The optical signal measurement method includes: aligning the optical signal test elements with a plurality of first micro-LEDs of a selected test block on a wafer; the optical signal test elements transmit a plurality of first optical signals emitted by the first micro-LEDs in a first time interval, wherein one of the optical signal test elements The optical signal testing components transmit an optical signal emitted by a first micro-LED; the optical signal sensing device senses the first optical signals transmitted by the optical signal testing components and generates a plurality of first sensing signals according to the first optical signals; the optical signal testing components are aligned with a plurality of second micro-LEDs of another selected test block on the wafer; the optical signal testing components transmit a plurality of second optical signals emitted by the second micro-LEDs within a second time interval, wherein one of the optical signal testing components transmits an optical signal emitted by a first micro-LED; and the optical signal sensing device senses the second optical signals transmitted by the optical signal testing components and generates a plurality of second sensing signals according to the second optical signals.

[0007] The above has outlined the technical features and advantages of the present disclosure in a fairly broad manner, so that the detailed description of the present disclosure below can be better understood. Other technical features and advantages that constitute the subject matter of the claims of the present disclosure will be described below. It should be understood by those with ordinary knowledge in the technical field to which the present disclosure belongs that the concepts and specific embodiments disclosed below can be used to modify or design other structures or processes to achieve the same purpose as the present disclosure. It should also be understood by those with ordinary knowledge in the technical field to which the present disclosure belongs that such equivalent constructions cannot depart from the spirit and scope of the present disclosure as defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] A more complete understanding of the disclosure of the present application may be obtained by referring to the embodiments and claims in conjunction with the drawings, in which the same reference numerals refer to the same elements.

[0009] Figure 1 A schematic diagram illustrating an optical signal processing device according to some embodiments of the present disclosure.

[0010] Figure 2 A schematic diagram illustrating an optical signal processing device according to some embodiments of the present disclosure.

[0011] Figure 3 A schematic diagram illustrating an optical signal processing device according to some embodiments of the present disclosure.

[0012] Figure 4A Schematic diagram illustrating the structure and operation of the light guiding unit of some embodiments of the present disclosure.

[0013] Figure 4B Schematic diagram illustrating the structure and operation of the light guiding unit of some embodiments of the present disclosure.

[0014] Figure 4C Schematic diagram illustrating the structure and operation of the light guiding unit of some embodiments of the present disclosure.

[0015] Figure 5A Schematic diagram illustrating the structure and operation of the light guiding unit of some embodiments of the present disclosure.

[0016] Figure 5B Schematic diagram illustrating the structure and operation of the light guiding unit of some embodiments of the present disclosure.

[0017] Figure 5C Schematic diagram illustrating the structure and operation of the light guiding unit of some embodiments of the present disclosure.

[0018] Fig. 6A Schematic diagram illustrating the operation of optical fiber array blocks and wafers according to some embodiments of the present disclosure.

[0019] Figure 6B Schematic diagram illustrating the operation of optical fiber array blocks and wafers according to some embodiments of the present disclosure.

[0020] Figure 6C Schematic diagram illustrating the operation of optical fiber array blocks and wafers according to some embodiments of the present disclosure.

[0021] Fig. 7A Schematic diagram illustrating the operation of optical fiber array blocks and wafers according to some embodiments of the present disclosure.

[0022] Figure 7B Schematic diagram illustrating the operation of optical fiber array blocks and wafers according to some embodiments of the present disclosure.

[0023] Figure 8 A flow chart illustrating a measurement method according to some embodiments of the present disclosure.

[0024] Fig. 9 A flow chart illustrating a measurement method according to some embodiments of the present disclosure.

[0025] Fig.10 A flow chart illustrating a measurement method according to some embodiments of the present disclosure.

[0026] The reference numerals are described as follows:

[0027] 10: Optical signal processing device

[0028] 110: Optical signal test element

[0029] 120: Optical signal sensing device

[0030] 20: Optical signal processing device

[0031] 210: Optical signal test element

[0032] 220: Optical signal sensing device

[0033] 230: Positioning device

[0034] 240: Probe

[0035] 245: Probe Card

[0036] 30: Optical signal processing device

[0037] 310: Optical signal test element

[0038] 311: Light guide unit

[0039] 312: Probe

[0040] 320: Optical signal sensing device

[0041] 330: Positioning device

[0042] MLED: Micro Light Emitting Diode

[0043] S1: First surface

[0044] S2: Second surface

[0045] FAB: Fiber Array Block

[0046] SC: Control signal

[0047] SP: light signal

[0048] SS: Sensing signal

[0049] D1: Distance

[0050] D2: Distance

[0051] D3: Distance

[0052] D4: Distance

[0053] D5: Distance

[0054] D6: Distance

[0055] R1: Radius

[0056] R2: Radius

[0057] R3: Radius

[0058] R4: Radius

[0059] R5: Radius

[0060] R6: Radius

[0061] θ1: Divergence angle

[0062] θ2: Divergence angle

[0063] θ3: Divergence angle

[0064] θ4: Divergence angle

[0065] θ5: Divergence angle

[0066] θ6: Divergence angle

[0067] B1: Test Block

[0068] B2: Test Block

[0069] B3: Test Block

[0070] B4: Test Block

[0071] C1: Intersection

[0072] C2: Intersection

[0073] C3: Intersection

[0074] C4: Intersection

[0075] 210A: Flat

[0076] 210B: Concave

[0077] 210C: Convex

[0078] 311A: Flat

[0079] 311B: Concave

[0080] 311C: Convex

[0081] 800: Optical Signal Measurement Methods

[0082] S801: Steps

[0083] S802: Steps

[0084] S803: Steps

[0085] S804: Steps

[0086] S805: Steps

[0087] 900: Optical signal measurement methods

[0088] S901: Steps

[0089] S902: Steps

[0090] S903: Steps

[0091] S904: Steps

[0092] S905: Steps

[0093] S906: Steps

[0094] S907: Steps

[0095] 1000: Optical signal measurement methods

[0096] S1001: Steps

[0097] S1002: Steps

[0098] S1003: Steps

[0099] S1004: Steps

[0100] S1005: Steps

[0101] S1006: Steps DETAILED DESCRIPTION

[0102] The following description of the present disclosure is accompanied by the drawings which are incorporated into and constitute a part of the specification, and illustrates an embodiment of the present disclosure, but the present disclosure is not limited to the embodiment. In addition, the following embodiments can be properly integrated to complete another embodiment.

[0103] "One embodiment", "an embodiment", "illustrative embodiment", "another embodiment", "another embodiment", etc. mean that the embodiments described in the present disclosure may include specific features, structures or characteristics, but not every embodiment must include the specific features, structures or characteristics. Furthermore, repeated use of the phrase "in an embodiment" does not necessarily refer to the same embodiment, but may refer to the same embodiment.

[0104] In order to make the present disclosure fully understood, the following description provides detailed steps and structures. Obviously, the implementation of the present disclosure will not be limited to the specific details known to those skilled in the art. In addition, the known structures and steps are no longer described in detail to avoid unnecessarily limiting the present disclosure. The preferred embodiments of the present disclosure are described in detail below. However, in addition to the detailed description, the present disclosure can also be widely implemented in other embodiments. The scope of the present disclosure is not limited to the content of the detailed description, but is defined by the claims.

[0105] It should be understood that the following disclosure provides many different embodiments or examples for implementing different features of the present invention. Specific embodiments or examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, the size of the element is not limited to the disclosed range or value, but may depend on the process conditions and / or the desired properties of the device. In addition, the following description of forming a first feature "on" or "on" a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. For the sake of simplicity and clarity, various features can be drawn arbitrarily at different scales. In the accompanying drawings, some layers / features may be omitted for simplicity.

[0106] Furthermore, for ease of description, spatially relative terms such as "beneath," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature shown in the figures to another (other) element or feature. The spatially relative terms are intended to encompass different orientations of the elements in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0107] refer to Figure 1 , which is a schematic diagram of an optical signal processing device 10 according to some embodiments of the present disclosure. The optical signal processing device 10 is used to measure a plurality of optical signals SP emitted by a plurality of micro light emitting diodes MLED within a time interval.

[0108] Specifically, the optical signal processing device 10 includes a plurality of optical signal test elements 110 and an optical signal sensing device 120. Each optical signal test element 110 is used to receive an optical signal SP emitted by a corresponding micro-light emitting diode MLED and transmit the optical signal SP to the optical signal sensing device 120. In some embodiments, the optical signal test element 110 and the micro-light emitting diode MLED are in one-to-one correspondence. In other words, each optical signal test element 110 receives and transmits an optical signal emitted by a corresponding micro-light emitting diode MLED, and the micro-light emitting diode MLED corresponding to each optical signal test element 110 is not repeated.

[0109] Furthermore, the optical signal sensing device 120 is coupled to the optical signal testing elements 110 to sense the optical signals SP transmitted by the optical signal testing elements 110 and generate a plurality of sensing signals SS according to the optical signals SP. In this way, the sensing signals SS can be analyzed by a back-end analysis device (not shown) to obtain relevant test results.

[0110] In some embodiments, the micro LEDs MLED are wafer-scale micro LEDs, which are disposed on a wafer W. In other words, the optical signal processing device 10 is used to directly measure the optical signals of the micro LEDs MLED on the wafer W. However, the present disclosure is not limited thereto, for example, the micro LEDs MLED may be other types of components that generate optical signals.

[0111] In some other embodiments, the micro-LEDs MLED are RGB LEDs. In this embodiment, each optical signal testing element 110 is used to receive RGB optical signals SP emitted by a plurality of micro-LEDs MLEDs in a time interval. The optical signal SP may include a single color optical signal in RGB, such as a red optical signal, a green optical signal, or a blue optical signal.

[0112] refer to Figure 2 , which is a schematic diagram of an optical signal processing device 20 according to some embodiments of the present disclosure. The optical signal processing device 20 is used to measure a plurality of optical signals SP emitted by a plurality of micro light emitting diodes MLED within a time interval.

[0113] Specifically, the optical signal processing device 20 includes a plurality of optical signal testing elements 210, an optical signal sensing device 220, a positioning device 230, and a plurality of probes 240. Each probe 240 is used to transmit a control signal SC to a corresponding micro-LED MLED, so that the micro-LED MLED emits an optical signal SP according to the control signal SC. Furthermore, the probes 240 are used to contact the micro-LEDs MLED and transmit the control signals SC to activate the micro-LEDs MLED, so that the micro-LEDs MLED emit optical signals SP.

[0114] In some embodiments, the probes 240 are disposed on a probe card 245, and the positions of the probes 240 are adjusted by the probe card 245 so that each probe 240 can contact the corresponding micro light emitting diode MLED. However, the present disclosure is not limited thereto, and various mechanisms or assemblies that can be provided with multiple probes 240 are within the scope of the present disclosure.

[0115] In some embodiments, each optical signal test element 210 includes a light guide unit for receiving an optical signal SP emitted by a corresponding micro light emitting diode MLED and transmitting the optical signal SP to the optical signal sensing device 220. In some embodiments, each light guide unit may be an optical fiber, and the optical signal test elements 210 may be arranged in a fiber array block (FAB) structure. In some embodiments, the optical signal processing device 20 includes at least 48, 240, 480, or 960 optical signal test elements 210.

[0116] In some embodiments, the micro-LEDs MLED are disposed on a wafer W and are wafer-level micro-LEDs. In other words, the optical signal processing device 20 is used to directly measure the optical signals of the micro-LEDs MLEDs on the wafer W. However, the present disclosure is not limited thereto, for example, the micro-LEDs MLEDs are other types of components that can generate optical signals, and the optical signal processing device 20 is used to measure non-wafer-level micro-LEDs MLEDs.

[0117] In other embodiments, the micro-LEDs MLED are RGB light emitting diodes. In this embodiment, each optical signal testing element 210 is used to receive RGB optical signals SP emitted by a plurality of micro-LEDs MLED within a time interval. The optical signal SP may include a single color optical signal in RGB, such as a red optical signal, a green optical signal, or a blue optical signal.

[0118] It should be noted that for micro-LEDs (MLEDs), the existing technology can use an integrating sphere to receive the light emitted by them and perform subsequent measurements. However, since the volume of the integrating sphere is very large compared to the micro-LEDs, it is difficult to arrange multiple integrating spheres for measurement. In addition, the integrating sphere has its limitations on the degree of light collection during measurement. It is not possible to completely receive the light signal, and it is not necessarily possible to completely transmit the received light signal to the measuring instrument. There will inevitably be losses during transmission, which will inevitably cause errors. What's more, the number of micro-LEDs that can be covered by the integrating sphere at a time is extremely limited (for example: 4, 8, 16, 32 micro-LEDs), and only a single micro-LED within the range can be lit at the same time to measure a single micro-LED. Therefore, the measurement of a large number of micro-LEDs is very time-consuming.

[0119] Accordingly, compared to the above-mentioned prior art, the optical signal test element 210 used in the present disclosure is small in size. Therefore, the optical signal test element 210 will not be affected by insufficient space and can be configured one-to-one corresponding to the arrangement of micro-LEDs to greatly increase the number of micro-LEDs that can be covered by a single measurement. In addition, since the optical signal test element 210 and the micro-LEDs are configured one-to-one, multiple micro-LEDs can be lit up at the same time for measurement, that is, the optical signal test element 210 transmits multiple optical signals SP emitted by multiple micro-LEDs MLEDs at the same time to greatly reduce the measurement time. Furthermore, the optical signal test element 210 uses optical fiber, so the received optical signal SP can be transmitted to the optical signal sensing device 220 almost losslessly to improve the measurement quality and reduce the measurement error.

[0120] For example, assuming that the integrating sphere of the prior art covers 8 micro-LEDs MLED, the lighting test time of a single micro-LED MLED is n seconds, and the time for the integrating sphere to move once is m seconds, then the time for testing 24,000 micro-LEDs is approximately 24,000*n+(24,000 / 8)*m seconds, that is, 24,000*n+3,000*m seconds. However, using the present invention, assuming that the number of optical signal test elements 210 of the optical signal processing device 20 is 240, the lighting test time of a single micro-LED MLED is n seconds, and the time for the optical signal test element 210 to move once as a whole is m seconds, the time for measuring the same number of 24,000 micro-LEDs MLED is approximately (24,000 / 240)*n+(24,000 / 240)*m seconds, that is, 100*n+100*m seconds. Obviously, the present disclosure effectively and significantly reduces the test time.

[0121] In some embodiments, a micro LED MLED includes a pixel of three primary color LEDs and is disposed on a display panel (not shown). In other words, the optical signal processing device 20 is used to measure the optical signal of the pixel on the display panel.

[0122] Furthermore, the optical signal sensing device 220 is coupled to the optical signal testing elements 210 to sense the optical signals SP transmitted by the optical signal testing elements 110 and generate a plurality of sensing signals SS according to the optical signals SP. In some embodiments, the optical signal sensing device 220 includes a camera to capture an image of the optical signals SP on an imaging plane in the camera and then generate the sensing signals SS according to the image. In some embodiments, the optical signal sensing device 220 includes a CMOS image sensor (CIS) to sense the optical signals SP using photodiodes on the CIS and generate the sensing signals SS accordingly.

[0123] In some embodiments, the sensing signals SS are transmitted to an analysis instrument (not shown), and one sensing signal SS represents the performance of one micro-LED MLED. For example, the analysis instrument can analyze the sensing signal SS to obtain the brightness, color difference, etc. of the micro-LED MLED. After the brightness and / or color difference of all the micro-LEDs MLED are obtained, all the micro-LEDs MLED can be classified (binning) according to the brightness and / or color difference, so that the micro-LEDs MLED with similar brightness and / or color difference are classified into the same category.

[0124] In some embodiments, the positioning device 230 is used to align the probes 240 and the light guide units of the optical signal testing elements 210 with two different surfaces of the micro light emitting diodes MLED. Figure 2 As shown, the micro-LED MLED contacts the probe 240 from the first surface S1 to receive the control signal SC, and sends the optical signal SP from the second surface S2 to the light guide unit of the optical signal test element 210, wherein the first surface S1 is opposite to the second surface S2. In some embodiments, the positioning device 230 is used to align the control probes 240 (or the probe card 245) and the light guide units of the optical signal test elements 210 with the micro-LEDs MLED. For example, the positioning device 230 controls the probes 240 to align and contact the micro-LEDs MLED, or controls the light guide units of the optical signal test elements 210 to align the micro-LEDs MLED.

[0125] refer to Figure 3, which is a schematic diagram of an optical signal processing device 30 of some embodiments of the present disclosure. The optical signal processing device 30 is used to measure the optical signals SP emitted by a plurality of micro light emitting diodes MLED. The optical signal processing device 30 includes a plurality of optical signal testing elements 310, an optical signal sensing device 320 and a positioning device 330.

[0126] In some embodiments, the positioning device 330 is used to align the probes 312 and the light guide units 311 with the micro light emitting diodes MLED. Figure 3 As shown, the positioning device 330 aligns the probe 312 and the light guiding unit 311 with the first surface S1 of the micro LED MLED. Compared with the optical signal processing device 20, in the optical signal processing device 30, the probe 312 and the light guiding unit 311 are both located on the same side of the micro LED MLED during measurement.

[0127] Each optical signal test element 310 includes a light guide unit 311 and a probe 312, and corresponds to a micro light emitting diode MLED. The light guide unit 311 and the probe 312 are located on the same side surface of the micro light emitting diode MLED. The probe 312 is used to contact the micro light emitting diode MLED to transmit a control signal SC to the micro light emitting diode MLED, so that the micro light emitting diode MLED emits an optical signal SP. The light guide unit 311 is used to receive the optical signal SP emitted by the micro light emitting diode MLED and transmit the optical signal SP to the optical signal sensing device 320. In some embodiments, the light guide unit 311 includes an optical fiber. In some embodiments, the optical signal processing device 30 includes at least 48, 240, 480 or 960 optical signal test elements 310.

[0128] In some embodiments, the micro-LEDs MLED are light-emitting diodes and are disposed on a wafer W. In some embodiments, the micro-LEDs MLED are wafer-level micro-LEDs. In other words, the optical signal processing device 30 is used to directly measure the optical signals of the micro-LEDs on the wafer W. However, the present disclosure is not limited thereto. For example, the micro-LEDs MLED are other types of components that can generate optical signals, and the optical signal processing device 30 is used to measure non-wafer-level micro-LEDs MLED.

[0129] In some other embodiments, the micro-LEDs MLED are RGB LEDs. In this embodiment, each optical signal testing element 310 is used to receive RGB optical signals SP emitted by a plurality of micro-LEDs MLEDs in a time interval. The optical signal SP may include a single color optical signal in RGB, such as a red optical signal, a green optical signal, or a blue optical signal.

[0130] In some embodiments, a micro LED MLED includes a pixel of three primary color LEDs and is disposed on a display panel (not shown). In other words, the optical signal processing device 30 is used to measure the optical signal of the pixel on the display panel.

[0131] In some embodiments, the optical signal sensing device 320 is coupled to the optical signal test elements 310 to sense the optical signals SP transmitted by the optical signal test elements 310 and generate a plurality of sensing signals SS according to the optical signals SP. In some embodiments, the optical signal sensing device 320 includes a camera to capture an image of the optical signals SP on an imaging plane in the camera and then generate the sensing signals SS according to the image. In some embodiments, the optical signal sensing device 320 includes a CIS to sense the optical signals SP using a photodiode on the CIS and generate the sensing signals SS accordingly.

[0132] In some embodiments, the sensing signals SS are transmitted to an analysis instrument (not shown), and one sensing signal SS represents the performance of one micro-LED MLED. For example, the analysis instrument can analyze the sensing signal SS to obtain the brightness, color difference, etc. of the micro-LED MLED. After the brightness and / or color difference of all micro-LEDs MLED are obtained, all micro-LEDs MLED can be classified according to the brightness and / or color difference, so that micro-LEDs MLED with similar brightness and / or color difference are classified into the same category.

[0133] refer to Figure 4A, which is a schematic diagram of the structure and operation of the light guide unit of the optical signal test element 210 of some embodiments of the present disclosure. In some embodiments, one end of the light guide unit of the optical signal test element 210 for receiving the optical signal SP includes a plane 210A. When the light guide unit of the optical signal test element 210 receives the optical signal SP, in order to make the plane 210A cover the entire divergence range of the optical signal SP as much as possible, the position of the light guide unit of the optical signal test element 210 and the distance D1 of the micro-LED MLED must be adjusted according to the divergence angle θ1 of the micro-LED MLED and the axial radius R1 of the light guide unit of the optical signal test element 210, wherein the distance D1 is adjusted by the positioning device 230. In some embodiments, the optical signal receiving range of the light guide unit can completely cover (or "only cover") the divergence range of the optical signal SP of the corresponding micro-LED MLED, and does not include the divergence range of the optical signal SP of the adjacent micro-LED MLED. In such a case, whether the adjacent micro-LED MLED emits an optical signal SP will not affect the optical signal SP received by the light guide unit. In other embodiments, the light signal receiving range of the light guiding unit only partially covers the divergence range of the light signal SP of the corresponding micro-light emitting diode MLED, so the divergence range of the light signal SP of the micro-light emitting diode MLED may be partially located in the light signal receiving range of other light guiding units. In this case, in order to prevent the light signal received by the light signal receiving range of the light guiding unit from being interfered by other signals, adjacent or close micro-light emitting diodes MLED can be lit separately in different time intervals, so that each time the light guiding unit receives the light signal SP, it can be as little interfered by the light signal SP emitted by the adjacent or close micro-light emitting diodes MLED as possible, thereby reducing distortion. In some embodiments, the distance D1 is the shortest distance between the second surface S2 of the light measuring element DUT and the plane 210A. In some embodiments, the second surface S2 of the light measuring element DUT and the plane 210A are parallel to each other. In other embodiments, the second surface S2 of the light measuring element DUT and the plane 210A are not parallel to each other.

[0134] The distance D1 between the plane 210A and the second surface S2 of the luminescence device DUT must at least satisfy equation (1).

[0135]

[0136] In some embodiments, in order to make the plane 210A cover the entire divergence range of the optical signal SP, when the divergence angle θ1 increases, the distance D1 needs to be shortened, and when the divergence angle θ1 decreases, the distance D1 may increase. In other words, when the divergence angle θ1 increases, the distance D1 decreases.

[0137] refer to Figure 4B, which is a schematic diagram of the structure and operation of the light guiding unit of the optical signal test element 210 of some embodiments of the present disclosure. In some embodiments, the light guiding unit of the optical signal test element 210 includes a concave surface 210B at one end for receiving the optical signal SP. Similarly, the position of the light guiding unit of the optical signal test element 210 and the distance D2 between the micro-LED MLED must be adjusted according to the divergence angle θ2 of the micro-LED MLED and the axial radius R2 of the light guiding unit of the optical signal test element 210, wherein the distance D2 is adjusted by the positioning device 230. In some embodiments, the distance D2 is the shortest distance between the second surface S2 of the micro-LED MLED and the concave surface 210B. In some embodiments, the side wall of the light guiding unit of the optical signal test element 210 intersects with the concave surface 210B at the intersection C1, and the distance D2 is the shortest distance between the second surface S2 of the micro-LED MLED and the intersection C1.

[0138] The distance D2 between the concave surface 210B and the second surface S2 of the luminescence device DUT must at least satisfy equation (2).

[0139]

[0140] In some embodiments, in order to make the concave surface 210B cover the entire divergence range of the optical signal SP, when the divergence angle θ2 increases, the distance D2 needs to be shortened, and when the divergence angle θ2 decreases, the distance D2 may increase. In other words, when the divergence angle θ2 increases, the distance D2 decreases.

[0141] refer to Figure 4C , which is a schematic diagram of the structure and operation of the light guiding unit of the optical signal test element 210 of some embodiments of the present disclosure. In some embodiments, the light guiding unit of the optical signal test element 210 includes a convex surface 210C at one end for receiving the optical signal SP. Similarly, the position of the light guiding unit of the optical signal test element 210 and the distance D3 between the micro-LED MLED must be adjusted according to the divergence angle θ3 of the micro-LED MLED and the axial radius R3 of the light guiding unit of the optical signal test element 210, wherein the distance D3 is adjusted by the positioning device 230. In some embodiments, the side wall of the light guiding unit of the optical signal test element 210 intersects with the convex surface 210C at an intersection C2, and the distance D3 is the shortest distance between the second surface S2 of the micro-LED MLED and the intersection C2.

[0142] The distance D3 between the convex surface 210C and the second surface S2 of the light emitting device DUT must at least satisfy equation (3).

[0143]

[0144] In some embodiments, in order to make the convex surface 210C cover the entire divergence range of the optical signal SP, when the divergence angle θ3 increases, the distance D3 needs to be shortened, and when the divergence angle θ3 decreases, the distance D3 may be increased. In other words, when the divergence angle θ3 increases, the distance D3 decreases.

[0145] In some embodiments, the radius R1, the radius R2 and the radius R3 are equal. In some embodiments, the divergence angle θ1, the divergence angle θ2 and the divergence angle θ3 are equal. In some embodiments, the radius R1, R2 and R3 are the axial radius of the core of the optical fiber of the light guide unit of the optical signal test component 210.

[0146] refer to Figure 5A , Figure 5B and Figure 5C , the structure and operation of the light guide unit 311 are similar FIG. 4A to FIG. 4C The structure and operation of the light guide unit of the optical signal test element 210 described in the specification. That is, the end of the light guide unit 311 for receiving the optical signal SP includes a flat surface 311A, a concave surface 311B and a convex surface 311C in different embodiments, and the distance between the end of the light guide unit 311 and the first surface S1 of the micro light emitting diode MLED is at least the distance of equation (4).

[0147]

[0148] Wherein D represents the distance D4, D5, or D6 between one end of the light guiding unit 311 for receiving the light signal SP and the first surface S1 of the micro light emitting diode MLED, R represents the axial radius R4, R5, or R6 of the light guiding unit 311, and θ represents the divergence angle θ4, θ5, or θ6 of the micro light emitting diode MLED.

[0149] In some embodiments, the distance D4 is the shortest distance between the first surface S1 of the light-detecting element DUT and the plane 311A. In some embodiments, the distance D5 is the shortest distance between the first surface S1 of the micro-LED MLED and the concave surface 311B. In some embodiments, the side wall of the light-guiding unit 311 intersects with the concave surface 311B at the intersection C3, and the distance D5 is the shortest distance between the first surface S1 of the micro-LED MLED and the intersection C3. In some embodiments, the side wall of the light-guiding unit 311 intersects with the convex surface 311C at the intersection C4, and the distance D6 is the shortest distance between the first surface S1 of the micro-LED MLED and the intersection C4. In some embodiments, the radii R4, R5, and R6 are the axial radii of the core of the optical fiber of the light-guiding unit 311.

[0150] In some embodiments, in order to make the plane 311A ​​cover the divergence range of the entire optical signal SP, when the divergence angle θ4, θ5 or θ6 increases, the corresponding distance D4, D5 or D6 needs to be shortened, and when the divergence angle θ4, θ5 or θ6 decreases, the corresponding distance D4, D5 or D6 can be increased. In other words, when the divergence angle θ4, θ5 or θ6 is larger, the corresponding distance D4, D5 or D6 is smaller, and when the divergence angle θ4, θ5 or θ6 is smaller, the corresponding distance D4, D5 or D6 is larger.

[0151] refer to FIG. 6A to FIG. 6C , which is a schematic diagram of the operation of the fiber array block FAB and the wafer W in some embodiments of the present disclosure. In some embodiments, the number of optical signal test elements 210 included in the fiber array block FAB is less than the number of micro-LEDs MLEDs in the micro-LED array on the wafer W. It should be noted that for the sake of simplicity and convenience in further understanding of the present invention, FIG. 6A to FIG. 6C The number and size of the optical signal test elements 210 and the micro-LEDs MLEDs shown are for illustration only. In the illustrated embodiment, the number of optical fibers in the optical fiber array block FAB and the number of MLEDs corresponding thereto are 16 as an example, but these are not actual numbers. In some embodiments, a wafer W may include more micro-LEDs MLEDs, and the optical fiber array block FAB may include different numbers of optical signal test elements 210. For example, the optical signal processing device 20 includes at least 48, 240, 480 or 960 optical signal test elements 210, and correspondingly, the micro-LEDs MLEDs include at least 48, 240, 480 or 960.

[0152] Please refer to Fig. 6A As shown, the fiber array block FAB includes 16 optical signal test elements 210, and the micro-LED array is divided into a plurality of test blocks B1, B2, B3 and B4 (the ranges divided by the dashed boxes in the figure). The fiber array block FAB of the optical signal processing device tests a single test block at a time, in other words, a test block is selected for testing at a time. Fig. 6A In the example of , the test block B1 is selected for testing. Therefore, in one alignment performed by the positioning device 230 (eg Fig. 6A Aligned position), the fiber array block FAB is aligned with the 16 micro light emitting diodes MLED contained in the test block B1.

[0153] Please refer to Figure 6B As shown, the fiber array block FAB includes 16 optical signal test elements 210. Figure 6B In the example of FIG. 1 , the test block B4 is selected for testing, and in one alignment performed by the positioning device 230 (eg Figure 6BThe number of micro light-emitting diodes MLED included in the fiber array block FAB alignment test block B4 may be less than 16.

[0154] Please refer to Figure 6C As shown, the fiber array block FAB includes 16 optical signal test elements 210. Figure 6C In the example of FIG. 1 , the test block B1 is selected for testing, and in an alignment performed by the positioning device 230 (eg Figure 6C The optical fiber array block FAB is aligned with the 16 micro-LEDs MLEDs included in the test block B1. The light source of the LED has a light-emitting angle, that is, the scattering angle of the LED light. In particular, the micro-LEDs MLEDs have smaller grains and are arranged more densely. When adjacent micro-LEDs MLEDs emit light at the same time, light interference will occur between them, affecting the optical signal test element 210 receiving the optical signal of a single micro-LED MLED. In order to reduce the situation of light interference, the micro-LEDs MLEDs of the test block B1 can be divided into two or more groups at intervals, and different groups of micro-LEDs MLEDs light up at different time intervals, and the optical signal test element 210 is also divided into two or more groups corresponding to the micro-LEDs MLEDs of the test block B1.

[0155] like Figure 6C The optical signal test elements 210 are divided into two groups for example, the circular dotted line represents the first group, and the square dotted line represents the second group. The first group of optical signal test elements 210 correspond to the first group of micro-LEDs MLED, and the second group of optical signal test elements 210 correspond to the second group of micro-LEDs MLED. The first group of micro-LEDs MLED and the second group of micro-LEDs MLED are staggered (for example Figure 6C As shown, the first group of micro-LEDs MLED are arranged with a unit interval up and down, left and right, and the second group of micro-LEDs MLED are arranged with a unit interval up and down, left and right, and the first group of micro-LEDs MLED and the second group of micro-LEDs MLED are arranged alternately), and the first group of micro-LEDs MLED and the second group of micro-LEDs MLED do not have repeated micro-LEDs. In some embodiments, the number of optical signal test elements 210 of the optical fiber array block FAB must at least cover the number of all micro-LEDs. In other words, the sum of the numbers of the two groups of micro-LEDs is equal to or less than the number of optical signal test elements 210 of the optical fiber array block FAB.

[0156] In this embodiment, the first group of 8 micro-LEDs MLED are lit in the first time interval, and the optical signal test element 210 performs the first measurement in the first time interval to collect light from the corresponding 8 micro-LEDs MLED. The second group of 8 micro-LEDs MLED are lit in the second time interval, and the optical signal test element 210 performs the second measurement in the second time interval to collect light from the corresponding 8 micro-LEDs MLED. In addition, during the first measurement and the second measurement, the optical fiber array block FAB does not need to be repositioned with the micro-LEDs MLED. In other words, the position of the optical signal sensing device 220 remains unchanged in the first time interval and the second time interval.

[0157] like Fig. 7A The optical signal test elements 210 are divided into two groups for example, the circular dotted line represents the first group, and the square dotted line represents the second group. The first group of optical signal test elements 210 correspond to the first group of micro-LEDs MLED, and the second group of optical signal test elements 210 correspond to the second group of micro-LEDs MLED. The first group of micro-LEDs MLED and the second group of micro-LEDs MLED are staggered (for example Fig. 7A As shown, the first group of micro-LEDs MLED are arranged at intervals of three units in the vertical direction, the second group of micro-LEDs MLED are arranged at intervals of three units in the vertical direction, the first group of micro-LEDs MLED and the second group of micro-LEDs MLED are arranged alternately), and the first group of micro-LEDs MLED and the second group of micro-LEDs MLED do not have repeated micro-LEDs. In some embodiments, the number of optical signal test elements 210 of the optical fiber array block FAB must at least cover the number of all micro-LEDs, in other words, the sum of the numbers of the two groups of micro-LEDs is equal to or less than the number of optical signal test elements 210 of the optical fiber array block FAB.

[0158] In this embodiment, the first group of 8 micro-LEDs MLED are lit in the first time interval, and the optical signal test element 210 performs the first measurement in the first time interval to collect light from the corresponding 8 micro-LEDs MLED. The second group of 8 micro-LEDs MLED are lit in the second time interval, and the optical signal test element 210 performs the second measurement in the second time interval to collect light from the corresponding 8 micro-LEDs MLED. In addition, during the first measurement and the second measurement, the optical fiber array block FAB does not need to be repositioned with the micro-LEDs MLED. In other words, the position of the optical signal sensing device 220 remains unchanged in the first time interval and the second time interval.

[0159] It should be noted that the aforementioned spacing units are not intended to limit the implementation of the present invention. A person skilled in the art may adjust the staggered arrangement and spacing units of the first group of micro-LEDs MLED and the second group of micro-LEDs MLED according to actual needs.

[0160] Please refer to Figure 7B As shown, the fiber array block FAB includes 36 optical signal test elements 210, and in one alignment performed by the positioning device 230 (eg Figure 7B The optical fiber array block FAB aligns 36 micro-LEDs MLED. The light source of LED has a light-emitting angle, that is, the scattering angle of LED light. In particular, the grains of the micro-LEDs MLED are smaller and the arrangement is denser. When the adjacent micro-LEDs MLED emit light at the same time, light interference will occur between them, which will affect the optical signal test element 210 receiving the light signal of a single micro-LED MLED. In order to reduce the situation of light interference, the micro-LEDs MLED can be divided into two or more groups at intervals. Different groups of micro-LEDs MLED light up at different time intervals, and the optical signal test element 210 is also divided into two or more groups corresponding to the micro-LEDs MLED.

[0161] like Figure 7B The optical signal test elements 210 are divided into three groups for example, the circular dotted line represents the first group, the square dotted line represents the second group, and the triangular dotted line represents the third group. The first group of optical signal test elements 210 respectively correspond to the micro-LEDs MLEDs of the first group, the second group of optical signal test elements 210 respectively correspond to the micro-LEDs MLEDs of the second group, and the third group of optical signal test elements 210 respectively correspond to the micro-LEDs MLEDs of the third group. The first group of micro-LEDs MLEDs, the second group of micro-LEDs MLEDs, and the third group of micro-LEDs MLEDs are staggered (e.g. Figure 7B As shown, the first group of micro-LEDs MLED are arranged at intervals of two units in the same row or column, the second group of micro-LEDs MLED are arranged at intervals of two units in the same row or column, and the third group of micro-LEDs MLED are arranged at intervals of two units in the same row or column), and the first group of micro-LEDs MLED, the second group of micro-LEDs MLED and the third group of micro-LEDs MLED do not have repeated micro-LEDs. In some embodiments, the number of optical signal test elements 210 of the optical fiber array block FAB must at least cover the number of all micro-LEDs, in other words, the sum of the numbers of the three groups of micro-LEDs is equal to or less than the number of optical signal test elements 210 of the optical fiber array block FAB.

[0162] In this embodiment, the 12 micro-LEDs MLED of the first group are lit in the first time interval, and the optical signal test component 210 performs the first measurement in the first time interval to collect light from the corresponding 12 micro-LEDs MLEDs. The 12 micro-LEDs MLED of the second group are lit in the second time interval, and the optical signal test component 210 performs the second measurement in the second time interval to collect light from the corresponding 12 micro-LEDs MLEDs. The 12 micro-LEDs MLED of the third group are lit in the third time interval, and the optical signal test component 210 performs the third measurement in the third time interval to collect light from the corresponding 12 micro-LEDs MLEDs. In addition, during the three measurements, the optical fiber array block FAB does not need to be repositioned with the micro-LEDs MLEDs. In other words, the position of the optical signal sensing device 220 remains unchanged in the first time interval, the second time interval, and the third time interval.

[0163] exist FIG. 6A to FIG. 7B In the embodiment shown, due to the circuit distance or the designer's intention, in one alignment, the micro-LEDs MLED aligned by the optical fiber array block FAB emit light signals SP at different time points in the same time interval, and the optical fiber array block FAB transmits the light signals SP emitted at multiple different time points in the time period. In other embodiments, the micro-LEDs MLED emit light signals SP at the same time, and the optical fiber array block FAB transmits the light signals SP at the same time.

[0164] refer to Figure 8 , which is a flow chart of an optical signal measurement method 800 of some embodiments of the present disclosure. In some embodiments, the measurement method 800 is implemented using an optical signal processing device (such as the optical signal processing device of the aforementioned embodiment), the optical signal processing device includes multiple optical signal test elements and an optical signal sensing device, the optical signal processing device is used to test the optical signal of a micro-LED array, the micro-LED array is divided into multiple test blocks, each test block includes multiple micro-LEDs, and the optical signal processing device tests a single test block at a time. The detailed steps are described as follows.

[0165] Specifically, execute step S801, align multiple optical signal test elements to multiple micro-LEDs of a selected test block on a wafer. The multiple micro-LEDs include multiple first LEDs and multiple second LEDs. Execute step S802, multiple optical signal test elements transmit multiple first optical signals emitted by multiple first micro-LEDs within a first time interval. One optical signal test element transmits an optical signal emitted by one first micro-LED. Execute step S803, an optical signal sensing device senses multiple first optical signals transmitted by multiple optical signal test elements, and generates multiple first sensing signals based on the multiple first optical signals.

[0166] Step S804 is executed, and the plurality of optical signal test components transmit the plurality of second optical signals emitted by the plurality of second micro-LEDs in a second time interval. One optical signal test component transmits the optical signal emitted by one second micro-LED. Step S805 is executed, and the optical signal sensing device senses the plurality of second optical signals transmitted by the plurality of optical signal test components, and generates a plurality of second sensing signals according to the plurality of second optical signals.

[0167] In some embodiments, there is no need to move the wafer or the optical signal processing device after step S802 is executed, that is, the positions of the multiple optical signal test elements remain unchanged within the first time interval and the second time interval. In some embodiments, each of the multiple first micro-LEDs and the multiple second micro-LEDs corresponds to an optical signal test element, and each optical signal test element transmits an optical signal emitted by a corresponding micro-LED. In some embodiments, the multiple first micro-LEDs and the multiple second micro-LEDs are alternately arranged on the wafer. In some embodiments, the first time interval and the second time interval do not overlap. In some embodiments, the micro-LEDs corresponding to each optical signal test element are not repeated.

[0168] refer to Fig. 9 , which is a flow chart of an optical signal measurement method 900 of some embodiments of the present disclosure. In some embodiments, the measurement method 900 is implemented using an optical signal processing device (such as the optical signal processing device of the aforementioned embodiment), the optical signal processing device includes multiple optical signal test elements and an optical signal sensing device, the optical signal processing device is used to test the optical signal of a micro-LED array, the micro-LED array is divided into multiple test blocks, each test block includes multiple micro-LEDs, and the optical signal processing device tests a single test block at a time. The detailed steps are described as follows.

[0169] Specifically, execute step S901, align multiple optical signal test elements to multiple micro-LEDs of a selected test block on a wafer. The multiple micro-LEDs include multiple first LEDs, multiple second LEDs, and multiple third LEDs. Execute step S902, multiple optical signal test elements transmit multiple first optical signals emitted by multiple first micro-LEDs within a first time interval. One optical signal test element transmits an optical signal emitted by one first micro-LED. Execute step S903, an optical signal sensing device senses multiple first optical signals transmitted by multiple optical signal test elements, and generates multiple first sensing signals based on the multiple first optical signals.

[0170] Step S904 is executed, and the plurality of optical signal test elements transmit the plurality of second optical signals emitted by the plurality of second micro-LEDs of the selected test block within a second time interval. One optical signal test element transmits the optical signal emitted by one second micro-LED. Step S905 is executed, and the optical signal sensing device senses the plurality of second optical signals transmitted by the plurality of optical signal test elements, and generates a plurality of second sensing signals according to the plurality of second optical signals.

[0171] Step S906 is executed, and the plurality of optical signal test components transmit the plurality of third optical signals emitted by the plurality of third micro-LEDs in a third time interval. One optical signal test component transmits the optical signal emitted by one third micro-LED. Step S907 is executed, and the optical signal sensing device senses the plurality of third optical signals transmitted by the plurality of optical signal test components, and generates a plurality of third sensing signals according to the plurality of third optical signals.

[0172] In some embodiments, after steps S902 and S904 are executed, there is no need to move the wafer or the optical signal processing device, that is, the positions of the multiple optical signal test components remain unchanged in the first time interval, the second time interval, and the third time interval. In some embodiments, the multiple first micro-LEDs, the multiple second micro-LEDs, and the multiple third micro-LEDs are staggered on the wafer. In some embodiments, the first time interval, the second time interval, and the third time interval do not overlap. In some embodiments, the micro-LEDs corresponding to each optical signal test component are not repeated.

[0173] refer to Fig.10 , which is a flow chart of an optical signal measurement method 1000 of some embodiments of the present disclosure. In some embodiments, the measurement method 1000 is implemented using an optical signal processing device (such as the optical signal processing device of the aforementioned embodiment), and the optical signal processing device includes multiple optical signal test elements and an optical signal sensing device. The detailed steps are described as follows.

[0174] Specifically, step S1001 is executed to align a plurality of optical signal test elements with a plurality of first micro-LEDs of a selected test block on a wafer. Step S1002 is executed to transmit a plurality of first optical signals emitted by a plurality of first micro-LEDs within a first time interval. One optical signal test element transmits an optical signal emitted by one first micro-LED. Step S1003 is executed to sense a plurality of first optical signals transmitted by a plurality of optical signal test elements, and generate a plurality of first sensing signals according to the plurality of first optical signals.

[0175] Execute step S1004, align the multiple optical signal test elements with the multiple second micro-LEDs of another selected test block on the wafer. Execute step S1005, the multiple optical signal test elements transmit the multiple second optical signals emitted by the multiple second micro-LEDs in a second time interval. Among them, one optical signal test element transmits the optical signal emitted by one second micro-LED. Execute step S1006, the optical signal sensing device senses the multiple second optical signals transmitted by the multiple optical signal test elements, and generates multiple second sensing signals according to the multiple second optical signals.

[0176] In some embodiments, the alignment is mainly accomplished by moving the wafer. For example, in step S1001, the wafer is mainly moved to align the plurality of optical signal test components with the plurality of first micro-LEDs on the wafer; and in step S1004, the wafer is mainly moved to align the plurality of optical signal test components with the plurality of second micro-LEDs on the wafer.

[0177] In some prior arts, the time required to test a unit area of ​​light-emitting elements has increased significantly due to the continuous reduction in size of light-emitting elements (such as micro-LEDs) as demand continues. Through the aforementioned optical signal processing device disclosed in the present invention, the optical signal of the micro-LED is transmitted by the optical signal test element, so that multiple micro-LEDs can be directly measured in one test, thereby increasing the efficiency of the measurement. Furthermore, the optical signal test element disclosed in the present invention uses an optical fiber to receive the optical signal. Since the size of the optical fiber can match the size and spacing of the micro-LED, multiple optical fibers can be set in the optical signal test element. One optical fiber corresponds to one micro-LED, so when the number of optical fibers increases, the efficiency of the measurement is also improved. Furthermore, if the divergence angle of the light emitted by the micro-LED is large, it is necessary to get as close to the micro-LED as possible when capturing the optical signal to avoid the optical signal processing device taking up too much space. The optical fiber is small in size, so it can be close to the micro-LED and completely receive the optical signal, thereby improving the accuracy of the measurement and reducing the volume of the optical signal processing device.

[0178] Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and replacements may be made without departing from the spirit and scope of the present disclosure as defined in the claims. For example, many of the above processes may be implemented in different ways, and other processes or combinations thereof may be used to replace many of the above processes.

[0179] Furthermore, the scope of the present application is not limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, means, methods, and steps described in the specification. A person skilled in the art can understand from the disclosure of the present disclosure that existing or future developed processes, machines, manufactures, compositions of matter, means, methods, or steps that have the same functions or achieve substantially the same results as the corresponding embodiments described herein can be used according to the present disclosure. Accordingly, such processes, machines, manufactures, compositions of matter, means, methods, or steps are included in the claims of the present application.

Claims

1. An optical signal processing device for testing an optical signal of a micro-LED array, wherein the micro-LED array is divided into a plurality of test blocks, each test block comprising a plurality of micro-LEDs, and the optical signal processing device tests a single test block at a time, the optical signal processing device comprising: Multiple optical signal test elements for: transmitting a plurality of first light signals emitted by a plurality of first micro-LEDs of a selected test block within a first time interval, and transmitting a plurality of second optical signals emitted by a plurality of second micro-LEDs of the selected test block within a second time interval; as well as A light signal sensing device, for: sensing the plurality of first optical signals transmitted by the plurality of optical signal testing elements within the first time interval; sensing the plurality of second optical signals transmitted by the plurality of optical signal testing elements within the second time interval; as well as generating a plurality of sensing signals according to the plurality of first optical signals and the plurality of second optical signals; Each of the plurality of first micro-LEDs and the plurality of second micro-LEDs corresponds to an optical signal test element, and each optical signal test element transmits an optical signal emitted by a corresponding micro-LED; wherein the micro-LEDs corresponding to each optical signal test element are not repeated; Wherein, the plurality of first micro-LEDs and the plurality of second micro-LEDs are arranged alternately; Wherein, within the first time interval and the second time interval, the positions of the plurality of optical signal testing elements remain unchanged.

2. The optical signal processing device as claimed in claim 1, wherein the sum of the number of the plurality of first micro LEDs and the number of the plurality of second micro LEDs is equal to or less than the number of the plurality of optical signal test elements.

3. The optical signal processing device according to claim 2, wherein: Each optical signal test element contains: A light guiding unit is used to transmit the light signal emitted by the micro light emitting diode corresponding to each light signal testing element.

4. The optical signal processing device according to claim 2, wherein: Each optical signal testing element further comprises a probe, and the probes of the plurality of optical signal testing elements are used to: contacting the plurality of micro light emitting diodes; and A plurality of control signals are transmitted to enable the plurality of micro light emitting diodes to generate the plurality of light signals.

5. The optical signal processing device as claimed in claim 2, further comprising: Multiple probes for: contacting the plurality of micro light emitting diodes; and A plurality of control signals are transmitted to enable the plurality of micro light emitting diodes to generate the plurality of light signals.

6. The optical signal processing device as claimed in claim 3, further comprising an optical fiber array block, wherein: The optical fiber array block includes a plurality of optical signal testing elements, and each optical guiding unit is an optical fiber.

7. The optical signal processing device according to claim 3, wherein: One end of each light guiding unit for receiving a corresponding light signal includes a flat surface, a convex surface or a concave surface.

8. The optical signal processing device as claimed in claim 2, further comprising: A positioning device is used to align the plurality of light guiding units with the plurality of first micro LEDs and the plurality of second micro LEDs.

9. The optical signal processing device according to claim 8, wherein: The positioning device is further used to: The distance between the plurality of light guiding units and the plurality of first micro-LEDs is positioned so that the optical signal receiving range of one end of each light guiding unit covers the first optical signal generated by the corresponding first micro-LED but does not cover the divergent range of the first optical signal generated by the adjacent first micro-LED.

10. The optical signal processing device according to claim 8, wherein: The positioning device is further used to: The distance between the plurality of light guiding units and the plurality of second micro LEDs is positioned so that the optical signal receiving range of one end of each light guiding unit covers the second optical signal generated by the corresponding second micro LED, but does not cover the divergent range of the second optical signal generated by the adjacent second micro LED.

11. The optical signal processing device according to claim 1, wherein: The optical signal sensing device includes a camera or a CMOS image sensor. 12 . The optical signal processing device as claimed in claim 1 , wherein the plurality of optical signal testing elements simultaneously transmit the plurality of first optical signals emitted by the plurality of first micro-LEDs.

13. An optical signal processing device as described in claim 1, wherein the multiple first micro-LEDs and the multiple second micro-LEDs are RGB light-emitting diodes, and the multiple optical signal testing elements receive the RGB light signals emitted by the multiple first micro-LEDs in the first time interval or the RGB light signals emitted by the multiple second micro-LEDs in the second time interval.

14. The optical signal processing device as claimed in claim 1, wherein the plurality of optical signal test elements are further used to transmit a plurality of third optical signals emitted by a plurality of third micro-LEDs of the selected test block within a third time. The optical signal sensing device is further used to sense the plurality of third optical signals transmitted by the plurality of optical signal testing elements within the third time interval; in, The plurality of first micro LEDs, the plurality of second micro LEDs and the plurality of third micro LEDs are arranged alternately; In which, within the first time interval, the second time interval and the third time interval, the position of the optical signal sensing device remains unchanged.

15. The optical signal processing device as claimed in claim 14, wherein the sum of the number of the plurality of first micro LEDs, the number of the plurality of second micro LEDs and the number of the plurality of third micro LEDs is equal to or less than the number of the plurality of optical signal test elements.

16. A method for measuring an optical signal of an optical signal processing device, for testing an optical signal of a micro-LED array, wherein the micro-LED array is divided into a plurality of test blocks, each test block comprising a plurality of micro-LEDs, the optical signal processing device tests a single test block at a time, the optical signal processing device comprising a plurality of optical signal test elements and an optical signal sensing device, the optical signal measuring method comprising: Aligning the plurality of optical signal test elements to a plurality of micro light emitting diodes of a selected test area on a wafer, the plurality of micro light emitting diodes comprising a plurality of first light emitting diodes and a plurality of second light emitting diodes; The plurality of optical signal test elements transmit a plurality of first optical signals emitted by the plurality of first micro-LEDs within a first time interval, wherein one optical signal test element transmits an optical signal emitted by one first micro-LED; The optical signal sensing device senses the plurality of first optical signals transmitted by the plurality of optical signal testing elements, and generates a plurality of first sensing signals according to the plurality of first optical signals; The plurality of optical signal test elements transmit a plurality of second optical signals emitted by the plurality of second micro LEDs within a second time interval, wherein one optical signal test element transmits an optical signal emitted by one second micro LED; and The optical signal sensing device senses the plurality of second optical signals transmitted by the plurality of optical signal testing elements, and generates a plurality of second sensing signals according to the plurality of second optical signals; in, Each of the plurality of first micro-LEDs and the plurality of second micro-LEDs corresponds to an optical signal test element, and each optical signal test element transmits an optical signal emitted by a corresponding micro-LED; Wherein, the micro-LEDs corresponding to each optical signal test element are not repeated; Wherein, the plurality of first micro-LEDs and the plurality of second micro-LEDs are arranged alternately; Wherein, within the first time interval and the second time interval, the positions of the plurality of optical signal testing elements remain unchanged. 17 . The optical signal measurement method as claimed in claim 16 , wherein the first time interval and the second time interval do not overlap with each other.

18. The optical signal measurement method as claimed in claim 16, wherein the plurality of optical signal test elements are further used to transmit a plurality of third optical signals emitted by a plurality of third micro-LEDs of the selected test block within a third time. The optical signal sensing device is further used to sense the plurality of third optical signals transmitted by the plurality of optical signal testing elements within the third time interval; in, The plurality of first micro LEDs, the plurality of second micro LEDs and the plurality of third micro LEDs are arranged alternately; In which, within the first time interval, the second time interval and the third time interval, the position of the optical signal sensing device remains unchanged.

19. A method for measuring an optical signal of an optical signal processing device, for testing an optical signal of a micro-LED array, wherein the micro-LED array is divided into a plurality of test blocks, each test block comprising a plurality of micro-LEDs, the optical signal processing device tests a single test block at a time, the optical signal processing device comprising a plurality of optical signal test elements and an optical signal sensing device, the optical signal measuring method comprising: Aligning the plurality of optical signal test elements to a plurality of first micro light emitting diodes of a selected test area on a wafer; The plurality of optical signal test elements transmit a plurality of first optical signals emitted by the plurality of first micro-LEDs within a first time interval, wherein one optical signal test element transmits an optical signal emitted by one first micro-LED; The optical signal sensing device senses the plurality of first optical signals transmitted by the plurality of optical signal testing elements, and generates a plurality of first sensing signals according to the plurality of first optical signals; Aligning the plurality of optical signal test elements to a plurality of second micro light emitting diodes of another test block on the wafer; The plurality of optical signal test elements transmit a plurality of second optical signals emitted by the plurality of second micro LEDs within a second time interval, wherein one optical signal test element transmits an optical signal emitted by a first micro LED; and The optical signal sensing device senses the plurality of second optical signals transmitted by the plurality of optical signal testing elements, and generates a plurality of second sensing signals according to the plurality of second optical signals.

20. The optical signal measurement method according to claim 19, wherein: Aligning the plurality of optical signal test elements to the plurality of second micro-LEDs on the wafer further comprises: The wafer is moved to align the plurality of optical signal test elements with the plurality of second micro light emitting diodes on the wafer.

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