A method for detecting semiconductor devices

Abstract

The present invention relates to the technical field of semiconductor device detection, and discloses a method for detecting semiconductor devices, including: marking the surface of the soldering pins in the sample to be detected as the soldering surface; performing a preprocessing strategy on the detection group and the grinding surface to obtain all the grinding lines on the grinding surface; marking the connecting line segment between the soldering surface and the grinding surface as the reference line segment; respectively marking the two side edges perpendicular to the reference line segment on the grinding surface as the starting side edge and the ending side edge; obtaining the midpoint of the reference line segment, and drawing a straight line parallel to the starting side edge through the midpoint, denoted as the bisecting straight line; obtaining the pins to be detected in the detection group, denoted as the pins to be detected; marking the surface enclosed by the bisecting straight line and the starting side edge on the grinding surface as the first surface; marking the surface enclosed by the bisecting straight line and the ending side edge on the grinding surface as the second surface; performing a determination grinding strategy to obtain the grinding direction of the sample to be detected. During grinding, continuously change the grinding direction to improve the grinding efficiency and save time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device detection, and specifically provides a method for detecting semiconductor devices. Background Art

[0002] Semiconductor devices are an essential part of modern electronic devices. With the increasing complexity of the functions of integrated circuits, the miniaturization of device sizes and the complexity of the production process are also constantly increasing. Traditional visual and manual testing methods can no longer meet the requirements of high precision and high efficiency, so automated and high-precision detection technologies have emerged. Modern semiconductor device detection technologies include, but are not limited to, optical detection, X-ray imaging, electron beam detection, and various electrical property tests. Chip metallographic inspection is a method that uses microscopy techniques to analyze the microstructure of semiconductor or metal materials. The key to this detection technology lies in the detailed observation of the crystal structure, defects, phase boundaries, etc. of the chip, so as to evaluate the quality and performance of the material. In the semiconductor manufacturing process, metallographic inspection is used to identify possible problems in material processing, such as lattice misalignment, impurity aggregation, or cracks. These factors can all affect the electronic characteristics of the chip. Through metallographic analysis, the manufacturing process can be optimized, the output efficiency can be improved, and the reliability and performance of the final product can be ensured. This technology is one of the key steps to ensure the reliable operation of semiconductor devices under high-performance requirements.

[0003] When sampling and detecting a chip in the prior art, it is necessary to perform a metallographic section to obtain the pins in the chip that need to be detected, and grind the chip to the cross-section where the pins are located. Usually, the grinding direction remains unchanged. When there are multiple pins that need to be detected, only grinding the chip in one direction without considering the optimization of the direction during the grinding process results in low grinding efficiency.

[0004] This solution proposes to continuously change the grinding direction during the grinding process by comparing the distances between the first marking execution line, the second marking execution line, the starting side, and the ending side. Summary of the Invention

[0005] The present invention provides a method for detecting semiconductor devices to help solve the problems mentioned in the above background art.

[0006] The present invention provides the following technical solution: A method for detecting semiconductor devices, comprising:

[0007] Obtain a chip that needs to be detected, denoted as the sample to be detected;

[0008] Denote the surface where the welding pins are located on the sample to be detected as the welding surface;

[0009] Obtain any two mutually parallel welding surfaces on the sample to be detected, denoted as the detection group;

[0010] Obtain any surface without soldering pins in the sample to be detected, and denote it as the grinding surface;

[0011] Denote the connecting line segment between the soldering surface and the grinding surface as the reference line segment;

[0012] Execute a preprocessing strategy on the detection group and the grinding surface to obtain all grinding lines on the grinding surface;

[0013] Denote the two side edges perpendicular to the reference line segment on the grinding surface as the starting side edge and the ending side edge respectively;

[0014] Obtain the midpoint of the reference line segment, and draw a straight line parallel to the starting side edge through the midpoint, and denote it as the bisecting straight line;

[0015] Obtain the pins to be detected in the detection group, and denote them as the pins to be detected;

[0016] Denote the surface enclosed by the bisecting straight line and the starting side edge on the grinding surface as the first surface;

[0017] Denote the surface enclosed by the bisecting straight line and the ending side edge on the grinding surface as the second surface;

[0018] Denote the grinding line corresponding to the pin to be detected on the grinding surface as the execution line;

[0019] Execute a determination grinding strategy to obtain the grinding direction of the sample to be detected.

[0020] Optionally, the executing a preprocessing strategy on the detection group and the grinding surface includes:

[0021] For any soldering surface in the detection group:

[0022] Obtain the position points of each pin;

[0023] On the soldering surface, draw a straight line perpendicular to the reference line segment through each position point, and denote the intersection point with the reference line segment as the reference point;

[0024] On the grinding surface, draw a straight line perpendicular to the reference line segment through each reference point, and denote it as the grinding line.

[0025] Optionally, the executing a preprocessing strategy on the detection group and the grinding surface includes:

[0026] Denote the two soldering surfaces in the detection group as the first soldering surface and the second soldering surface respectively;

[0027] Obtain the grinding lines corresponding to the first soldering surface on the grinding surface to form a first set of grinding lines;

[0028] Obtain the grinding lines corresponding to the second soldering surface on the grinding surface to form a second set of grinding lines;

[0029] Traverse the elements in the first set of grinding lines and the second set of grinding lines;

[0030] Obtain all the elements in the union of the first set of grinding lines and the second set of grinding lines to get all the grinding lines on the grinding surface.

[0031] Optionally, the execution of the determination grinding strategy includes:

[0032] Obtain the execution line closest to the bisecting straight line, denoted as the execution end line;

[0033] When there is only an execution line on the first surface:

[0034] Grind the sample to be detected from the starting side until it stops at the execution end line;

[0035] When grinding past each execution line, detect the pins to be detected on the execution line;

[0036] When there is only an execution line on the second surface:

[0037] Grind the sample to be detected from the termination side until it stops at the execution end line;

[0038] When grinding past each execution line, detect the pins to be detected on the execution line.

[0039] Optionally, the execution of the determination grinding strategy includes:

[0040] When there are execution lines on both the first surface and the second surface:

[0041] Obtain the execution line closest to the bisecting straight line in the first surface, denoted as the first marked execution line;

[0042] Measure the distance between the first marked execution line and the starting side, denoted as the first starting distance;

[0043] Obtain the execution line closest to the bisecting straight line in the second surface, denoted as the second marked execution line;

[0044] Measure the distance between the second marked execution line and the termination side, denoted as the second starting distance.

[0045] Optionally, the execution of the determination grinding strategy includes:

[0046] Compare the first starting distance and the second starting distance:

[0047] When the first starting distance is less than the second starting distance:

[0048] Grind the sample to be detected from the starting side to the first marked execution line;

[0049] When grinding past each execution line, detect the pins to be detected on the execution line;

[0050] Measure the distance between the first marker execution line and the second marker execution line, denoted as the judgment distance;

[0051] Compare the judgment distance with the second starting distance:

[0052] When the judgment distance is greater than or equal to the second starting distance;

[0053] Then, grind the sample to be detected from the termination side to the second marker execution line;

[0054] When grinding past each execution line, detect the pins to be detected on the execution line;

[0055] When the judgment distance is less than the second starting distance;

[0056] Then, execute the first orientation strategy.

[0057] Optionally, the execution of the determination grinding strategy includes:

[0058] When the second starting distance is less than the first starting distance:

[0059] Grind the sample to be detected from the termination side to the second marker execution line;

[0060] When grinding past each execution line, detect the pins to be detected on the execution line;

[0061] Compare the judgment distance with the first starting distance:

[0062] When the judgment distance is greater than or equal to the first starting distance;

[0063] Then, grind the sample to be detected from the starting side to the first marker execution line;

[0064] When grinding past each execution line, detect the pins to be detected on the execution line;

[0065] When the judgment distance is less than the first starting distance;

[0066] Then, execute the second orientation strategy.

[0067] Optionally, the execution of the first orientation strategy includes:

[0068] Denote the execution line corresponding to the undetected pins among the pins to be detected as the execution line to be detected;

[0069] S1. Obtain the execution line to be detected closest to the first marker execution line, denoted as the first starting execution line;

[0070] S2. Measure the distance between the first marker execution line and the first starting execution line, denoted as the first orientation starting distance;

[0071] S3. Obtain the to-be-detected execution line closest to the termination side, denoted as the first termination execution line;

[0072] S4. Measure the distance between the termination side and the first termination execution line, denoted as the first directional termination distance;

[0073] S5. When the first directional start distance is less than or equal to the first directional termination distance;

[0074] Grind the to-be-detected sample from the first marked execution line to the first start execution line, and when grinding through each execution line, detect the to-be-detected pins on the execution line;

[0075] Record the first start execution line as the new first marked execution line;

[0076] S6. When the first directional termination distance is less than or equal to the first directional start distance;

[0077] Grind the to-be-detected sample from the termination side to the first termination execution line, and when grinding through each execution line, detect the to-be-detected pins on the execution line;

[0078] Record the first termination execution line as the new termination side;

[0079] S7. Repeat S1 - S6 until all the to-be-detected pins are detected.

[0080] Optionally, the implementation of the second directional strategy includes:

[0081] S8. Obtain the to-be-detected execution line closest to the start side, denoted as the second start execution line;

[0082] S9. Measure the distance between the start side and the second start execution line, denoted as the second directional start distance;

[0083] S10. Obtain the to-be-detected execution line closest to the second marked execution line, denoted as the second termination execution line;

[0084] S11. Measure the distance between the second marked execution line and the second termination execution line, denoted as the second directional termination distance;

[0085] S12. When the second directional start distance is less than or equal to the second directional termination distance;

[0086] Grind the to-be-detected sample from the start side to the second start execution line, and when grinding through each execution line, detect the to-be-detected pins on the execution line;

[0087] Record the second start execution line as the new start side;

[0088] S13. When the second orientation termination distance is less than or equal to the second orientation start distance;

[0089] Grind the sample to be detected from the second marking execution line to the second termination execution line. When grinding past each execution line, detect the pins to be detected on the execution line;

[0090] Record the second termination execution line as the new second marking execution line;

[0091] S14. Repeat S8 - S13 until all the pins to be detected are detected.

[0092] The present invention has the following beneficial effects:

[0093] 1. For the method of detecting semiconductor devices, obtain the position points of each pin. On the welding surface, draw a straight line perpendicular to the reference line segment through each position point respectively to obtain reference points. On the grinding surface, draw a straight line perpendicular to the reference line segment through each reference point respectively to obtain grinding lines. The grinding lines represent the paths for actual physical inspection. In this way, the calculation of subsequent steps can be simplified.

[0094] 2. For the method of detecting semiconductor devices, for the detection group, each welding surface corresponds to multiple grinding lines. Obtain the first set of grinding lines corresponding to the first welding surface, obtain the second set of grinding lines corresponding to the second welding surface, and obtain all the elements in the union of the first set of grinding lines and the second set of grinding lines. When the grinding lines corresponding to the two welding surfaces overlap, regard the overlapping grinding lines as one grinding line to obtain all the grinding lines on the grinding surface, and confirm all the grinding lines that need to be inspected to ensure that no pin to be detected is missed.

[0095] 3. For the method of detecting semiconductor devices, when there are only execution lines on the first surface, grind the sample to be detected from the starting side until it stops at the execution end line; when there are only execution lines on the second surface: grind the sample to be detected from the termination side until it stops at the execution end line. When grinding past each execution line, detect the pins to be detected on the execution line to ensure that the grinding work starts from the most suitable end, minimizing the grinding path and improving efficiency. Systematically perform detection during grinding, discover problems and make adjustments.

[0096] 4. The detection method for the pair of semiconductor devices. Obtain the first marked execution line: Determine the important detection points closest to the center, which helps optimize the detection process, reduce the grinding range, and thus protect the sample from excessive processing. Measure the distance between the first marked execution line and the starting side: Accurate measurement of the distance helps plan the starting and ending points of grinding. Obtain the second marked execution line: Similarly, this helps with precise area positioning on the other side to ensure the integrity and effectiveness of the detection. Measure the distance between the second marked execution line and the terminating side: Provides accurate measurement data for the other side, which is used to coordinate and balance the double-sided detection strategy.

[0097] 5. The detection method for the pair of semiconductor devices. When the first starting distance is less than the second starting distance, grind the sample to be detected from the starting side to the first marked execution line. When it is judged that the distance is greater than or equal to the second starting distance, grind the sample to be detected from the terminating side to the second marked execution line; when the second starting distance is less than the first starting distance: grind the sample to be detected from the terminating side to the second marked execution line; when it is judged that the distance is greater than or equal to the first starting distance; then, grind the sample to be detected from the starting side to the first marked execution line; Compare the first starting distance, the second starting distance, and the judged distance: Determine which side's execution line is closer to the edge, which helps with prioritized processing, reduces unnecessary grinding, saves time, and protects the sample.

[0098] 6. The detection method for the pair of semiconductor devices. When the first starting distance is less than the second starting distance and the judged distance is less than the second starting distance, obtain the first starting execution line and the first terminating execution line, calculate the first directional starting distance and the first directional terminating distance, compare the first directional starting distance and the first directional terminating distance. When the first directional starting distance is less than or equal to the first directional terminating distance, grind the sample to be detected from the first marked execution line to the first starting execution line; when the first directional terminating distance is less than or equal to the first directional starting distance, grind the sample to be detected from the terminating side to the first terminating execution line, and continuously update the first directional starting distance and the first directional terminating distance. Similarly, when the second starting distance is less than the first starting distance and the judged distance is less than the first starting distance, execute the second directional strategy. By dynamically adjusting the grinding direction and starting to grind from the end closest to the execution line to be detected each time, the grinding efficiency is improved and time is saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0099] Figure 1 It is a schematic diagram of the method of the present invention;

[0100] Figure 2 It is a schematic diagram of the grinding surface for executing the first directional strategy;

[0101] Figure 3 It is a schematic diagram of the grinding surface for executing the second directional strategy. DETAILED DESCRIPTION OF THE INVENTION

[0102] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0103] Embodiment 1, referring to Figure 1 , a method for detecting semiconductor devices;

[0104] Obtain the chip to be detected, denoted as the sample to be detected;

[0105] The shape of the sample to be detected is a cuboid;

[0106] The surface with soldering pins in the sample to be detected is denoted as the soldering surface;

[0107] Obtain any two mutually parallel soldering surfaces in the sample to be detected, denoted as the detection group;

[0108] Obtain any surface without soldering pins in the sample to be detected, denoted as the grinding surface;

[0109] Denote the connecting line segment between the soldering surface and the grinding surface as the reference line segment;

[0110] Execute a preprocessing strategy on the detection group and the grinding surface to obtain all the grinding lines on the grinding surface;

[0111] On the grinding surface, the two side edges perpendicular to the reference line segment are respectively denoted as the starting side edge and the ending side edge;

[0112] Obtain the midpoint of the reference line segment, and draw a straight line parallel to the starting side edge through the midpoint, denoted as the bisecting straight line;

[0113] Obtain the pins to be detected in the detection group, denoted as the pins to be detected;

[0114] Denote the surface enclosed by the bisecting straight line and the starting side edge on the grinding surface as the first surface;

[0115] Denote the surface enclosed by the bisecting straight line and the ending side edge on the grinding surface as the second surface;

[0116] Denote the grinding line corresponding to the pins to be detected on the grinding surface as the execution line;

[0117] Execute a determination grinding strategy to obtain the grinding direction of the sample to be detected.

[0118] The execution of the preprocessing strategy on the detection group and the grinding surface includes:

[0119] For any welding surface in the detection group:

[0120] Obtain the position points of each pin;

[0121] On the welding surface, draw a straight line perpendicular to the reference line segment through each position point, and mark the intersection point with the reference line segment as the reference point;

[0122] On the grinding surface, draw a straight line perpendicular to the reference line segment through each reference point, and mark it as the grinding line.

[0123] Obtain the position points of each pin, draw a straight line perpendicular to the reference line segment through each position point on the welding surface to obtain the reference point, draw a straight line perpendicular to the reference line segment through each reference point on the grinding surface to obtain the grinding line. The grinding line represents the path for the actual physical inspection, which simplifies the calculation of subsequent steps.

[0124] The preprocessing strategy for the detection group and the grinding surface includes:

[0125] Mark the two welding surfaces in the detection group as the first welding surface and the second welding surface respectively;

[0126] Obtain the grinding lines corresponding to the first welding surface on the grinding surface to form the first grinding line set;

[0127] Obtain the grinding lines corresponding to the second welding surface on the grinding surface to form the second grinding line set;

[0128] Traverse the elements in the first grinding line set and the second grinding line set;

[0129] Obtain all the elements in the union of the first grinding line set and the second grinding line set to get all the grinding lines on the grinding surface.

[0130] For the detection group, each welding surface corresponds to multiple grinding lines. Obtain the first grinding line set corresponding to the first welding surface, obtain the second grinding line set corresponding to the second welding surface, and obtain all the elements in the union of the first grinding line set and the second grinding line set. When the grinding lines corresponding to the two welding surfaces overlap, regard the overlapping grinding lines as one grinding line to get all the grinding lines on the grinding surface, and confirm all the grinding lines to be inspected to ensure that no pin to be detected is missed.

[0131] The execution of the determination grinding strategy includes:

[0132] Obtain the execution line closest to the distance bisecting line, and mark it as the execution end line;

[0133] When there is only an execution line on the first surface:

[0134] Grind the sample to be detected from the starting side until it stops at the execution end line;

[0135] When grinding past each execution line, detect the pins to be detected on the execution line;

[0136] When there is only an execution line on the second side:

[0137] Grind the sample to be detected starting from the termination side until it stops at the execution end line;

[0138] When grinding past each execution line, detect the pins to be detected on the execution line.

[0139] When there is only an execution line on the first side, grind the sample to be detected starting from the starting side until it stops at the execution end line; when there is only an execution line on the second side: grind the sample to be detected starting from the termination side until it stops at the execution end line. When grinding past each execution line, detect the pins to be detected on the execution line, ensuring that the grinding work starts from the most appropriate end, minimizing the grinding path and improving efficiency. Systematically perform detection during grinding, identify problems and make adjustments.

[0140] The described execution determination grinding strategy includes:

[0141] When there are execution lines on both the first side and the second side:

[0142] Obtain the execution line closest to the bisecting straight line in the first side, denoted as the first marked execution line;

[0143] Measure the distance from the first marked execution line to the starting side, denoted as the first starting distance;

[0144] Obtain the execution line closest to the bisecting straight line in the second side, denoted as the second marked execution line;

[0145] Measure the distance from the second marked execution line to the termination side, denoted as the second starting distance.

[0146] Obtain the first marked execution line: Determine the important detection points closest to the center, which helps to optimize the detection process, reduce the grinding range, and thus protect the sample from excessive processing. Measure the distance from the first marked execution line to the starting side: Accurate distance measurement helps to plan the starting and ending points of grinding, ensuring that all important parts are detected. Obtain the second marked execution line: Similarly, this helps to accurately locate the area on the other side to ensure the integrity and effectiveness of detection. Measure the distance from the second marked execution line to the termination side: Provides accurate measurement data for the other side, used to coordinate and balance the double-sided detection strategy.

[0147] The described execution determination grinding strategy includes:

[0148] Compare the first starting distance with the second starting distance:

[0149] When the first starting distance is less than the second starting distance:

[0150] Grind the sample to be detected from the starting side to the first marking execution line;

[0151] When grinding past each execution line, detect the pins to be detected on the execution line;

[0152] Measure the distance between the first marking execution line and the second marking execution line, and record it as the judgment distance;

[0153] Compare the judgment distance with the second starting distance:

[0154] When the judgment distance is greater than or equal to the second starting distance;

[0155] Then, grind the sample to be detected from the termination side to the second marking execution line;

[0156] When grinding past each execution line, detect the pins to be detected on the execution line;

[0157] When the judgment distance is less than the second starting distance;

[0158] Then, execute the first orientation strategy.

[0159] The described execution judgment grinding strategy includes:

[0160] When the second starting distance is less than the first starting distance:

[0161] Grind the sample to be detected from the termination side to the second marking execution line;

[0162] When grinding past each execution line, detect the pins to be detected on the execution line;

[0163] Compare the judgment distance with the first starting distance:

[0164] When the judgment distance is greater than or equal to the first starting distance;

[0165] Then, grind the sample to be detected from the starting side to the first marking execution line;

[0166] When grinding past each execution line, detect the pins to be detected on the execution line;

[0167] When the judgment distance is less than the first starting distance;

[0168] Then, execute the second orientation strategy.

[0169] In this embodiment, as Figure 2 shown, the first starting distance is less than the second starting distance, and the sample to be detected is ground from the starting side to the first marking execution line;

[0170] And if the judged distance is less than the second starting distance, execute the first directional grinding strategy;

[0171] In this embodiment, as Figure 3 shown, the second starting distance is less than the first starting distance, and grind the sample to be detected from the termination side to the second marking execution line;

[0172] And if the judged distance is less than the first starting distance, execute the second directional strategy.

[0173] When the first starting distance is less than the second starting distance, grind the sample to be detected from the starting side to the first marking execution line. When the judged distance is greater than or equal to the second starting distance, then grind the sample to be detected from the termination side to the second marking execution line; when the second starting distance is less than the first starting distance: grind the sample to be detected from the termination side to the second marking execution line; when the judged distance is greater than or equal to the first starting distance; then grind the sample to be detected from the starting side to the first marking execution line; Compare the first starting distance, the second starting distance and the judged distance: determine which side's execution line is closer to the edge, which helps to give priority to processing, reduce unnecessary grinding, save time and protect the sample.

[0174] The execution of the first directional strategy includes:

[0175] Record the execution line corresponding to the undetected pin in the pins to be detected as the execution line to be detected;

[0176] S1. Obtain the execution line to be detected that is closest to the first marking execution line, and record it as the first starting execution line;

[0177] S2. Measure the distance between the first marking execution line and the first starting execution line, and record it as the first directional starting distance;

[0178] S3. Obtain the execution line to be detected that is closest to the termination side, and record it as the first termination execution line;

[0179] S4. Measure the distance between the termination side and the first termination execution line, and record it as the first directional termination distance;

[0180] S5. When the first directional starting distance is less than or equal to the first directional termination distance;

[0181] Grind the sample to be detected from the first marking execution line to the first starting execution line. When grinding through each execution line, detect the pins to be detected on the execution line;

[0182] Record the first starting execution line as the new first marking execution line;

[0183] S6. When the first directional termination distance is less than or equal to the first directional starting distance;

[0184] Grind the sample to be detected from the termination side to the first termination execution line. When grinding past each execution line, detect the pins to be detected on the execution line.

[0185] Record the first termination execution line as the new termination side.

[0186] S7. Repeat S1 - S6 until all the pins to be detected are detected.

[0187] Performing the second orientation strategy includes:

[0188] S8. Obtain the execution line to be detected closest to the starting side, and record it as the second starting execution line.

[0189] S9. Measure the distance from the starting side to the second starting execution line, and record it as the second orientation starting distance.

[0190] S10. Obtain the execution line to be detected closest to the second marked execution line, and record it as the second termination execution line.

[0191] S11. Measure the distance from the second marked execution line to the second termination execution line, and record it as the second orientation termination distance.

[0192] S12. When the second orientation starting distance is less than or equal to the second orientation termination distance;

[0193] Grind the sample to be detected from the starting side to the second starting execution line. When grinding past each execution line, detect the pins to be detected on the execution line.

[0194] Record the second starting execution line as the new starting side.

[0195] S13. When the second orientation termination distance is less than or equal to the second orientation starting distance;

[0196] Grind the sample to be detected from the second marked execution line to the second termination execution line. When grinding past each execution line, detect the pins to be detected on the execution line.

[0197] Record the second termination execution line as the new second marked execution line.

[0198] S14. Repeat S8 - S13 until all the pins to be detected are detected.

[0199] When the first starting distance is less than the second starting distance and the judgment distance is less than the second starting distance, obtain the first starting execution line and the first ending execution line, calculate the first directional starting distance and the first directional ending distance, compare the first directional starting distance and the first directional ending distance. When the first directional starting distance is less than or equal to the first directional ending distance, grind the sample to be detected from the first marking execution line to the first starting execution line; when the first directional ending distance is less than or equal to the first directional starting distance, grind the sample to be detected from the ending side to the first ending execution line, and continuously update the first directional starting distance and the first directional ending distance. Similarly, when the second starting distance is less than the first starting distance and the judgment distance is less than the first starting distance, execute the second directional strategy. By dynamically adjusting the grinding direction and starting to grind from the end closest to the execution line to be detected each time, the grinding efficiency is improved and time is saved.

[0200] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or also includes elements inherent in such process, method, article or device.

[0201] The above are only the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for detecting a semiconductor device, comprising: Obtain the chip to be tested, which is recorded as the sample to be tested; The surface of the sample to be tested where the pins are welded is recorded as the welding surface; Obtain any two mutually parallel welding surfaces of the sample to be tested, and record them as a test group; Obtain any surface of the sample to be tested that does not have a soldered pin, and record it as the grinding surface; The connecting line segment between the welding surface and the grinding surface is recorded as the reference line segment; Execute the preprocessing strategy on the inspection group and the grinding surface to obtain all grinding lines on the grinding surface; include , for any welding surface in the inspection group: Get the location point of each pin; Draw a straight line perpendicular to the reference line segment through each position point on the welding surface, and the intersection with the reference line segment is recorded as the reference point; Draw a straight line perpendicular to the reference line segment through each reference point on the grinding surface, which is recorded as the grinding line; The two sides perpendicular to the reference line segment on the grinding surface are respectively recorded as the starting side and the ending side; Get the midpoint of the reference line segment, and draw a straight line through the midpoint parallel to the starting side, which is recorded as the bisector line; Get the pins that need to be tested in the test group and record them as the pins to be tested; The surface enclosed by the bisector line and the starting side edge on the grinding surface is recorded as the first surface; The surface enclosed by the bisector line and the terminal side edge on the grinding surface is recorded as the second surface; The grinding line corresponding to the pin to be inspected on the grinding surface is recorded as the execution line; Execute the determination grinding strategy to obtain the grinding direction of the sample to be tested; Execution of the grinding strategy includes: Get the execution line closest to the bisector line and record it as the execution end line; When only the first side has an execution line: Grind the sample to be tested from the starting side to the execution end line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When only the second side has an execution line: Grind the sample to be tested from the end side to the execution end line; When grinding passes through each execution line, the pin to be inspected on the execution line is inspected.

2. The method for detecting a semiconductor device according to claim 1, wherein: The pre-processing strategy for the detection group and the grinding surface includes: The two welding surfaces in the inspection group are respectively recorded as a first welding surface and a second welding surface; Obtaining grinding lines corresponding to the first welding surface on the grinding surface to form a first grinding line set; Obtaining grinding lines corresponding to the second welding surface on the grinding surface to form a second grinding line set; Traverse the elements in the first grinding line set and the second grinding line set; All elements in the union of the first grinding line set and the second grinding line set are obtained to obtain all grinding lines on the grinding surface.

3. The method for detecting a semiconductor device according to claim 2, wherein: The execution and determination of the grinding strategy comprises: When execution lines exist on both the first and second sides: Obtain the execution line closest to the bisector line in the first face, and record it as the first marked execution line; Measure the distance between the first marking execution line and the starting side edge, and record it as the first starting distance; Obtain the execution line closest to the bisector line in the second face, and record it as the second marked execution line; Measure the distance from the second marking execution line to the terminating side edge, and record it as the second starting distance.

4. The method for detecting a semiconductor device according to claim 3, wherein: The execution and determination of the grinding strategy comprises: Compare the first starting distance to the second starting distance: When the first starting distance is smaller than the second starting distance: Grind the sample to be tested from the starting side to the first marked execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; Measure the distance between the first marking execution line and the second marking execution line, and record it as the judgment distance; Compare the judged distance with the second starting distance: When the distance is judged to be greater than or equal to the second starting distance; Then, the sample to be tested is ground from the end side to the second marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When the judged distance is less than the second starting distance; Then, the first directional strategy is executed.

5. The method for detecting a semiconductor device according to claim 3, wherein: The execution and determination of the grinding strategy comprises: When the second starting distance is smaller than the first starting distance: Grinding the sample to be tested from the end side to the second marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; Compare the judged distance with the first starting distance: When the distance is judged to be greater than or equal to the first starting distance; Then, the sample to be tested is ground from the starting side to the first marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When the judged distance is less than the first starting distance; Then, execute the second directional strategy.

6. The method for detecting a semiconductor device according to claim 4, wherein: The executing the first directional strategy includes: Recording the execution lines corresponding to the undetected pins among the pins to be detected as the execution lines to be detected; S1, obtaining the execution line to be detected that is closest to the first marked execution line, and recording it as the first starting execution line; S2, measuring the distance between the first marking execution line and the first starting execution line, and recording it as the first orientation starting distance; S3, obtaining the execution line to be detected that is closest to the termination side edge, and recording it as the first termination execution line; S4, measuring the distance between the terminating side and the first terminating execution line, and recording it as the first orientation terminating distance; S5, when the first orientation starting distance is less than or equal to the first orientation ending distance; Grinding the sample to be tested from the first marked execution line to the first starting execution line, and testing the pins to be tested on each execution line when grinding through each execution line; Record the first starting execution line as a new first marked execution line; S6, when the first orientation end distance is less than or equal to the first orientation start distance; Grind the sample to be tested from the termination side to the first termination execution line, and test the pins to be tested on the execution line when grinding through each execution line; Record the first terminating execution line as the new terminating side; S7. Repeat S1-S6 until all the pins to be tested are tested.

7. The method for detecting a semiconductor device according to claim 5, wherein: The executing the second directional strategy comprises: S8, obtaining the execution line to be detected that is closest to the starting side edge, and recording it as the second starting execution line; S9, measuring the distance between the starting side and the second starting execution line, and recording it as the second orientation starting distance; S10, obtaining the execution line to be detected that is closest to the second marked execution line, and recording it as the second termination execution line; S11, measuring the distance between the second marking execution line and the second termination execution line, and recording it as the second orientation termination distance; S12, when the second orientation starting distance is less than or equal to the second orientation ending distance; Grind the sample to be tested from the starting side to the second starting execution line, and test the pins to be tested on the execution line when grinding through each execution line; Record the second starting execution line as the new starting side; S13, when the second orientation end distance is less than or equal to the second orientation start distance; Grinding the sample to be tested from the second marking execution line to the second termination execution line, and testing the pins to be tested on the execution line when grinding through each execution line; Record the second terminated execution line as a new second marked execution line; S14. Repeat S8-S13 until all the pins to be tested are tested.

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