Circuit board detection device and detection method

Abstract

The invention provides a circuit board detection device and a detection method. The circuit board detection device comprises a first image acquisition module used for acquiring a 3D point cloud image of a to-be-detected circuit board; the first output end of the linear module assembly is provided with a first image acquisition module; the linear module assembly is configured to drive the first image acquisition module to do reciprocating linear motion in the X and Y directions; the flexible mechanical arm is configured to rotate at any angle of X, Y and Z; the probe detection module comprises a third linear module, a second image acquisition module, a first probe and a second probe; the third linear module is provided with a third fixed end and a third output end; the third fixed end is connected with the first probe, the flexible mechanical arm and the second image acquisition module, the third output end is connected with the second probe, and the third output end is used for driving the second probe to be close to or away from the first probe in the horizontal direction. According to the detection device, the test efficiency is greatly improved, and the test error caused by manual test is completely eradicated.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit board detection, and in particular to a circuit board detection device and a detection method. Background Art

[0002] PCBA is one of the most important components in 3C products such as computers and home appliances. Before, during and after the product is launched, a lot of testing work will be done on the PCBA signal ICT test (automatic online test), FCT performance test (functional test), stability aging test, etc., in order to improve or enhance product quality and enhance product competitiveness. However, PCBA boards often have the characteristics of more test content, more soldering pins (pins), and small pins, which requires a lot of work and takes a long time.

[0003] For large-scale PCBA board testing, corresponding test fixtures are generally issued to assist in completing the test content efficiently. The principle of the test fixture is to connect the test probe with the test point of the PCBA board. When powered on, key data such as voltage and current in the circuit are obtained and displayed on the display screen of the test fixture to achieve the purpose of rapid detection.

[0004] However, for the testing of small batches or PCBA boards to be developed and launched, there is no corresponding test fixture. The common testing method on the market is to use two hands to form a loop at two pin solder joints, and then perform point tests step by step according to requirements or plans. During point tests, the probe is connected to the test pin point of the PCBA board. When the power is turned on, the key data such as voltage and current in the circuit are obtained and displayed on the display screen of the test fixture. Point tests are performed step by step according to requirements. The data values ​​are recorded in handwriting one by one and manually entered into the system one by one.

[0005] The disadvantages of the above scheme are that there is no automation: the whole process is purely manual operation; the operation is cumbersome: two hands cooperate, each holding a probe (needle) to form a loop at two pin solder joints, and it is necessary to manually record various data, manually upload various data, check and confirm the coordinate information of each point, and the test content of each point; high labor intensity: PCBA boards often have many test contents (ICT, FCT, aging test), many soldering pins, small pins, etc., pure manual operation relies on personnel's hands and eyes to work highly intensely, repetitive work, and high labor intensity; low efficiency: pure manual operation, cumbersome operation, many test contents (ICT, FCT, aging test), many soldering pins, small pins, etc., often manual testing is time-consuming and inefficient; easy to make mistakes: each step of the operation process and data requires personnel to repeatedly confirm, and work for a long time. In the process of manual testing, errors are prone to occur, such as solder joint coordinate errors, operation process errors, data record upload errors, statistical induction errors, etc.; low accuracy: all points are manually measured, and the pins are small. Repeated point measurement position accuracy, angle accuracy, and probe pressure may be inconsistent each time. That is, the same point is tested twice by the same person or the data is different, and different people test the same point or the data is different; the intelligence is not high. Summary of the invention

[0006] The present disclosure provides a circuit board detection device and a detection method to at least solve one of the technical problems existing in the prior art.

[0007] According to a first aspect of the present disclosure, there is provided a circuit board detection device, comprising:

[0008] The first image acquisition module is used to obtain a 3D point cloud image of the circuit board to be tested;

[0009] A linear module assembly having a first output end, on which the first image acquisition module is mounted; the linear module assembly is configured to drive the first image acquisition module to reciprocate linearly in the X and Y directions;

[0010] A flexible robotic arm, wherein the flexible robotic arm is configured to be able to rotate at any angle in the X, Y and Z directions;

[0011] The probe detection module includes a third linear module, a second image acquisition module for acquiring a 2D image of the circuit board to be tested, a first probe and a second probe; the third linear module has a third fixed end and a third output end capable of reciprocating linear motion; the third fixed end is respectively connected to the first probe, the free end of the flexible mechanical arm and the second image acquisition module, the third output end is connected to the second probe, and the third output end is used to synchronously drive the second probe to approach or move away from the first probe in a horizontal direction.

[0012] In one possible embodiment, the probe detection module also includes an auxiliary component, which includes a driving mechanism and a light source; the driving mechanism is fixed on the third fixed end in the vertical direction and the telescopic end of the driving mechanism is connected to the light source provided below the second image acquisition module, for driving the light source to approach or move away from the second image acquisition module vertically.

[0013] In one embodiment, the probe detection module further includes:

[0014] A position sensor, the position sensor is mounted on the third fixed end and is respectively arranged corresponding to the movement starting position and the maximum stroke position of the third output end;

[0015] The position sensing piece cooperates with the sensing end of the position sensor, the position sensing piece is connected to the third output end, and the position sensing piece is used to approach or move away from the position sensor under the reciprocating linear drive of the third output end.

[0016] In one embodiment, the linear module assembly includes:

[0017] A first linear module, having a first output end capable of reciprocating linear motion, wherein the first image acquisition module is installed on the first output end;

[0018] The second linear module has a second output end capable of reciprocating linear motion, and the motion direction of the second output end is perpendicular to the motion direction of the first output end. The first linear module is installed on the second output end.

[0019] In one possible implementation manner, the third fixed end is detachably connected to a vertically arranged first probe through a first connecting assembly;

[0020] The third output end is detachably connected to a second probe that is tilted toward the first probe through a second connecting assembly.

[0021] In one embodiment, the circuit board detection device further includes a fixture assembly for accommodating the circuit board to be tested, and the fixture assembly includes:

[0022] jig;

[0023] There are multiple magnetic suction parts, and the multiple magnetic suction parts can be magnetically connected to the surface of the fixture at any position;

[0024] An insulating connector, wherein a first end of the insulating connector is detachably connected to the magnetic attraction member, and a second end of the insulating connector is insulated and detachably connected to the circuit board to be tested.

[0025] According to a second aspect of the present disclosure, a circuit board detection method is provided, which is applied to a circuit board detection device in any one of the embodiments of the first aspect, and the detection method includes:

[0026] Get the QR code information or OCR information of the circuit board to be tested;

[0027] Based on the two-dimensional code information or the OCR information, a standard data model of the circuit board to be tested, standard position information of each test point of the circuit board to be tested, and test content are obtained;

[0028] Acquire a 3D point cloud image of the circuit board to be tested, convert the 3D point cloud image into a data model, and then match and fit the data model with the standard data model to obtain the position difference of each test point of the circuit board to be tested; and determine the actual three-dimensional coordinate position of each test point based on the 3D point cloud image;

[0029] Planning the motion path and posture transformation of the flexible robotic arm based on the standard position information of each test point, the actual three-dimensional coordinate position of each test point and the test content;

[0030] Based on the position difference of each test point and the planned motion path of the flexible robotic arm, the probe detection module is started to test each test point.

[0031] In one possible implementation manner, obtaining the two-dimensional code information or OCR information of the circuit board to be tested includes:

[0032] The ID code on the circuit board to be tested is scanned by the first image acquisition module or the second image acquisition module to extract the two-dimensional code information or the OCR information.

[0033] In one possible implementation manner, the acquiring the standard data model of the circuit board to be tested based on the two-dimensional code information or the OCR information includes:

[0034] Based on the two-dimensional code information or the OCR information, the model information of the circuit board to be tested is obtained, and based on the model information, a standard model model of the circuit board to be tested is obtained, and the standard model model is converted into a standard data model.

[0035] In one possible implementation, starting the probe detection module to test each test point based on the position difference of each test point and the planned motion path of the flexible robotic arm includes:

[0036] (1) Based on the 3D point cloud image and the motion path of the flexible robotic arm, determine multiple set points where the flexible robotic arm needs to move;

[0037] (2) The flexible robotic arm moves to a certain set point, and the light source is turned on to trigger the second image acquisition module to take a photo to obtain a 2D image of the circuit board to be tested at the certain set point;

[0038] (3) capturing the marking points and features in the 2D image to confirm the accurate position of each test point in the 2D image;

[0039] (4) Based on the position difference corresponding to each test point and the accurate position of each test point in the 2D image, the probe contacts each test point for testing;

[0040] Steps (2) to (4) are repeated to complete the testing of all test points on the circuit board to be tested.

[0041] Compared with the prior art, the advantages of the present application are: 1) The circuit board detection device of the present application drives the first image acquisition module to perform 3D image acquisition on the circuit board to be tested to obtain a 3D point cloud image by setting a linear module component, and can drive the probe detection module set at the free end to accurately move to the test point position on the circuit board to be tested by setting a flexible mechanical arm, and the test of each test point on the circuit board to be tested is realized through the cooperation of the first probe and the second probe, which greatly improves the test efficiency and eliminates the test error caused by manual testing. 2) The circuit board detection device of the present application has high compatibility by setting a fixture component, without the need to open a matching fixture for the circuit board to be tested. 3) The circuit board detection device of the present application is flexible, does not need to open a corresponding fixture, has a variable test spacing, and is compatible with multi-functional tests, including ICT and FCT functional tests. 4) The point measurement repeatability of the circuit board detection device of the present application can reach ±0.01mm, and the repeat positioning accuracy is high. Even the smallest pin tin point can achieve accurate point measurement with good consistency. 5) The detection method of the present application can realize automatic testing of the detection device. 6) The circuit board detection device of the present application is highly efficient. One detection device can carry multiple flexible robotic arms to collaborate simultaneously to improve detection efficiency.

[0042] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0044] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0045] Figure 1 The structure of the circuit board detection device according to the embodiment of the present disclosure is shown in FIG. Figure 1 ;

[0046] Figure 2 The structure diagram of the circuit board detection device according to the embodiment of the present disclosure is shown in FIG. Figure 2 (external frame not shown);

[0047] Figure 3 The structure diagram of the circuit board detection device according to the embodiment of the present disclosure is shown in FIG. Figure 3 ;

[0048] Figure 4 The structure diagram of the probe detection module of the circuit board detection device of the embodiment of the present disclosure is shown in FIG. Figure 1 ;

[0049] Figure 5 The structure diagram of the probe detection module of the circuit board detection device of the embodiment of the present disclosure is shown in FIG. Figure 2 ;

[0050] Figure 6 The structure diagram of the probe detection module of the circuit board detection device of the embodiment of the present disclosure is shown in FIG. Figure 3 ;

[0051] Figure 7 The schematic diagram shows the structure of the probe detection module of the circuit board detection device of the embodiment of the present disclosure. Figure 4 ;

[0052] Figure 8 The schematic diagram shows the structure of the second probe of the probe detection module of the circuit board detection device of the embodiment of the present disclosure in the initial position. Figure 1 ;

[0053] Fig. 9 A schematic diagram showing the structure of the second probe of the probe detection module of the circuit board detection device of the embodiment of the present disclosure when it is in the middle position Figure 2 ;

[0054] Fig.10 The schematic diagram shows the structure of the second probe of the probe detection module of the circuit board detection device of the embodiment of the present disclosure at the maximum stroke position. Figure 3 ;

[0055] Fig.11 A flow chart of a detection method of a circuit board detection device according to an embodiment of the present disclosure is shown.

[0056] Explanation of the numbers in the figure: 1-first image acquisition module, 2-circuit board to be tested, 3-linear module assembly, 4-flexible robotic arm, 5-probe detection module, 6-detection table, 7-fixture assembly, 8-controller, 31-first linear module, 32-second linear module, 51-third linear module, 52-second image acquisition module, 53-first probe, 54-second probe, 55-driving mechanism, 56-light source, 57-position sensor, 58-position sensing sheet, 59-probe, 71- Fixture, 72-magnetic part, 73-insulating connector, 311-first output end, 321-second output end, 511-third fixed end, 512-third output end, 513-motor, 514-angle support, 515-extension support, 516-second probe fixing base, 517-vertical plate, 518-first probe fixing base, 519-bottom plate, 531-first probe mother seat, 571-first position sensor, 572-second position sensor, 573-third position sensor. DETAILED DESCRIPTION

[0057] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0058] Since the current small batch or undeveloped PCBA board testing does not have the conditions for the corresponding test fixture, the current fixture is manually tested. Due to the large amount of test content, the manual testing process is cumbersome, prone to errors and low test efficiency. Based on this, the present application provides an automatic detection device for testing PCBA boards. The detection device can greatly improve the test efficiency.

[0059] Specifically, in the first aspect, according to an embodiment of the present disclosure, as Figure 1-10 As shown, the present invention provides a circuit board detection device, comprising:

[0060] The first image acquisition module 1 is used to obtain a 3D point cloud image of the circuit board 2 to be tested;

[0061] The linear module assembly 3 has a first output end 311, and the first image acquisition module 1 is installed on the first output end 311; the linear module assembly 3 is configured to drive the first image acquisition module 1 to reciprocate linearly in the X and Y directions;

[0062] The flexible robotic arm 4 is configured to be able to rotate at any angle in the X, Y and Z directions;

[0063] The probe detection module 5 includes a third linear module 51, a second image acquisition module 52 for acquiring a 2D image of the circuit board 2 to be tested, a first probe 53 and a second probe 54; the third linear module 51 has a third fixed end 511 and a third output end 512 that can reciprocate linearly; the third fixed end 511 is respectively connected to the first probe 53, the free end of the flexible robotic arm 4 and the second image acquisition module 52, and the third output end 512 is connected to the second probe 54, and the third output end 512 is used to synchronously drive the second probe 54 to approach or move away from the first probe 53 in the horizontal direction.

[0064] The circuit board detection device of the present application drives the first image acquisition module 1 to perform 3D image acquisition on the circuit board 2 to be tested to obtain a 3D point cloud image by setting a linear module component 3, and can drive the probe detection module 5 set at the free end to accurately move to the test point position on the circuit board 2 to be tested by setting a flexible mechanical arm 4, and test each test point of the circuit board 2 to be tested is tested through the cooperation of the first probe 53 and the second probe 54, which greatly improves the test efficiency and eliminates the test errors caused by manual testing.

[0065] For example, the circuit board detection device of the present application includes a detection table 6 for installing the linear module assembly 3 and the flexible mechanical arm 4. The circuit board 2 to be tested is placed on the detection table 6 through the fixture assembly 7. For example, the circuit board 2 to be tested can be a PCBA board.

[0066] For example, the first image acquisition module 1 can be a 3D smart camera. The main principle of the 3D smart camera is that the 3D smart camera is also called a depth camera. Unlike a 2D camera, the 3D smart camera can obtain the depth of field distance of the shooting space. Through the data obtained by the 3D smart camera, we can accurately know the distance from each test point in the image to the camera, and add the X, Y coordinates of the test point in the 2D image, we can obtain the three-dimensional space coordinates of each test point in the image, restore the real scene through the three-dimensional space coordinates, and realize scene modeling and circuit board detection.

[0067] The 3D smart camera itself carries a 3D camera control system. Therefore, when the 3D smart camera is used to take a picture of the circuit board 2 to be tested, the 3D camera control system forms a point cloud diagram of the 3D space with the data taken, and uses different colors to represent the heights of different components.

[0068] For example, the linear module assembly 3 includes a first linear module 31 having a first output end 311 capable of reciprocating linear motion, and a first image acquisition module 1 is installed on the first output end 311;

[0069] The second linear module 32 has a second output end 321 capable of reciprocating linear motion, and the motion direction of the second output end 321 is perpendicular to the motion direction of the first output end 311. The first linear module 31 is mounted on the second output end 321. Figure 2 It can be seen that the fixed end of the first linear module 31 is fixed to the second output end 321 of the second linear module 32. And the movement directions of the output ends of the first linear module and the second linear module are arranged perpendicularly, so when the first linear module 31 is installed on the detection table 6 along the Y direction, the second linear module 32 is installed on the detection table 6 along the X direction. Figure 1-2 It can be seen that the first image acquisition module 1 is arranged above the circuit board 2 to be tested. With the cooperation of the first linear module and the second linear module, the first image acquisition module 1 moves to the top of the circuit board 2 to be tested, and performs image acquisition on the circuit board 2 to obtain a 3D point cloud image.

[0070] Furthermore, the first linear module 31 and the second linear module 32 may adopt a guide rail slide mechanism, a linear slide mechanism, a lead screw nut mechanism, etc., as long as the output end thereof can realize reciprocating linear motion.

[0071] For example, the flexible robotic arm 4 of the present application can adopt a current industrial flexible robotic arm, such as a seven-axis flexible robotic arm. In addition to the mechanical structure, the flexible robotic arm 4 also has a built-in robot control system, which plans the motion path and posture of the flexible robotic arm.

[0072] For example, the probe detection module 5 serves as the terminal of the flexible robotic arm, which is driven by the flexible robotic arm to the designated test point to complete the test of each test point on the circuit board 2 to be tested. The probe detection module 5 includes a third linear module 51, which is mounted on the free end of the flexible robotic arm 4 in the horizontal direction. The third linear module 51 has a third output end 512 and a third fixed end 511, a first probe 53 is mounted on the third fixed end 511, and a second probe 54 is mounted on the third output end 512, so that when the third linear module 51 is working, the third output end 512 can synchronously drive the second probe 54 to approach or move away from the first probe 53 in the horizontal direction. The third fixed end 511 is connected to the free end of the flexible robotic arm 4 through a flange 5111.

[0073] For example, Figure 4-7As shown, the third fixed end 511 is detachably connected to the vertically arranged first probe 53 through the first connecting assembly; the third output end 512 is detachably connected to the second probe 54 inclined toward the first probe 53 through the second connecting assembly. Specifically, the first connecting assembly includes a vertical plate 517 and a first probe fixing base 518; the first end of the vertical plate 517 is fixedly connected to the third fixed end 511 through a bottom plate 519 arranged in a horizontal direction, so that the vertical plate 517 is arranged perpendicular to the movement direction of the third output end, the second end of the vertical plate 517 is detachably connected to the first end of the first probe fixing base 518, and the second end of the first probe fixing base 518 is connected to the vertically arranged first probe 53. Preferably, for example, the vertical plate 517 can be detachably connected to the first probe fixing base 518 through a pin shaft, and the second end of the first probe fixing base 518 is plug-in connected to the first probe 53. Specifically, the first probe 53 has a first probe base 531 that matches the first probe 53. The first probe base 531 is precisely slidably matched with the first probe 53. A compression spring is provided at the bottom of the first probe base 531. When the first probe 53 is in contact with the test, an appropriate amount of elastic expansion and contraction can be performed in the first probe base 531 to ensure that the test point is not damaged by external forces and to extend the life of the probe. The first probe 53 and the first probe base 531 can be directly purchased as finished products that have been assembled on the market. Then, the second end of the first probe fixing base 518 is provided with a first mounting hole for accommodating the first probe base 531 along its length direction, and a second mounting hole 5181 connected to the first mounting hole and vertically arranged is provided on the first probe fixing base 518. When the first probe base 531 is inserted into the first mounting hole of the first probe fixing base 518, a positioning shaft passes through the second mounting hole 5181 and abuts against the first probe base 531, thereby fixing the first probe 53 on the first probe fixing base 518. Of course, the assembled first probe 53, the first probe mother seat 531 and the first probe fixing base 518 can also be set to be fixedly connected. When the first probe 53 needs to be replaced, it is only necessary to remove the first probe fixing base 518 from the vertical plate 517. Of course, it is also possible that when the first probe needs to be replaced, it is only necessary to remove the first probe and its mother seat from the first probe fixing base 518. Alternatively, it is also possible to directly pull the first probe 53 out of the first probe mother seat 531, and then replace the new probe and insert it into the first probe mother seat.

[0074] The second connection assembly includes an angle support 514, an extension support 515 and a second probe fixing base 516; the third output end 512 is fixedly connected to the first end of the angle support 514, the second end of the angle support 514 has an inclined surface tilted toward the first probe 53, the extension support 515 is detachably mounted on the inclined surface of the angle support 514, the second probe fixing base 516 is detachably connected to the extension support 515, and the second probe 54 is mounted on the second probe fixing base, so that the second probe 54 is tilted toward the first probe 53. Among them, the second probe fixing base 516 and the second probe 54 can be set to be fixedly connected, or the existing technology can be used to realize that the second probe 54 can be pluggably connected to the second probe fixing base 516. Among them, the second probe 54 is also provided with a matching second probe mother seat on the outside, and the second probe and its mother seat can be directly purchased as assembled finished products on the market. The connection method between the second probe and the second probe mother seat and the second probe fixing base 516 is the same as that of the first probe, and will not be repeated here. Therefore, when the second probe needs to be replaced, if the second probe is fixedly connected to the second probe fixing base, the new second probe fixing base and the second probe can be directly replaced; if the second probe is pluggable and connected to the second probe fixing base, the second probe and its mother base can be directly replaced. Among them, the first probe and the second probe are both commonly used chip test probes on the market, and the head shape of the active end of the probe can be selected according to the specific circuit board to be tested.

[0075] After continuous testing, the performance parameters of the first probe and the second probe will decrease, such as the wear of the gold-plated layer. Therefore, the service life of the detection device can be increased and the hardware cost can be reduced by replacing the first probe and the second probe as scheduled.

[0076] For example, the first probe 53 is set as a positive probe (+), the second probe 54 is set as a zero probe (-), the first probe 53 is connected to the positive pole of the probe rod 59, and the second probe 54 is connected to the negative pole of the probe rod 59. Further, for the convenience of connection, the probe rod 59 can be installed on the third fixed end 511.

[0077] The main function of the probe detection module 5 is to replace manual holding of the positive and negative probes with both hands. The positive and negative probes contact the pin solder points (i.e., test points), forming a loop between the two solder points. During point testing, the probes are connected to the test pin points of the circuit board to be tested. When power is turned on, key data such as voltage and current in the circuit are obtained.

[0078] For example, the third linear module 51 can adopt a micro linear module 28 series ball screw precision type (referred to as "micro linear module"). The micro linear module has a micro closed-loop integrated step servo motor 513. The advantages of the micro linear module over the traditional linear module are that it is small in size and high in precision. The repeatability of the micro linear module is as high as ±0.01mm, and its horizontal load is 5KG and its vertical load is 3KG. The year-on-year parameters are excellent, which can meet the high-precision measurement work in a small space and provide the necessary hardware conditions for this. The advantages of the micro closed-loop integrated step servo motor 513 (referred to as "motor") over the traditional stepper motor are high precision and no step loss. Generally speaking, the advantage of the micro linear module is that it has a higher load and repeatability in a small volume structure.

[0079] The opening and closing action of the probe detection module 5 is driven by the motor 513, which drives the ball screw to rotate. The ball screw nut seat is squeezed by the rotation of the ball screw and moves linearly. The second probe 54 is fixedly mounted on the ball screw nut seat (i.e., the third output end 512), and the second probe 54 moves with the movement of the ball screw nut seat. The closed-loop integrated stepper motor and controller are fully closed-loop controlled. After receiving the corresponding pulse, the motor rotates the corresponding number of circles, and the encoder feeds back the number of pulses to the controller to achieve precise control of the motor. The forward or reverse rotation of the motor pushes the second probe 54 to move left or right. With the combination of 3 sets of position sensors, safe, controllable and precise position movement can be achieved.

[0080] For example, the second image acquisition module 52 uses a 2D camera to acquire a 2D image of the circuit board 2 to be tested. The purpose of using the second image acquisition module 52 to take a photo of the circuit board 2 to be tested and acquire its 2D image is to capture the marking points and features in the 2D image to obtain the accurate position of the solder points (i.e., each test point) on the circuit board 2 to be tested.

[0081] In one embodiment of the present disclosure, the probe detection module 5 also includes an auxiliary component, which includes a driving mechanism 55 and a light source 56; the driving mechanism 55 is fixed on the third fixed end 511 in the vertical direction and the telescopic end 551 of the driving mechanism 55 is connected to the light source 56 located below the second image acquisition module 52, and is used to drive the light source 56 to approach or move away from the second image acquisition module 52 in the vertical direction.

[0082] The driving mechanism 55 may be a telescopic cylinder having a telescopic end 551, which is fixedly connected to a light source 56, and the light source 56 is arranged directly below the second image acquisition module 52. Therefore, when the probe detection module 5 is driven by the flexible mechanical arm 4 to move to a set point, in order to further confirm the accurate position of each test point of the circuit board 2 to be tested before testing, the light source 56 is driven by the driving mechanism 55 to move toward the circuit board 2 to be tested below, until the light source 56 is close to the circuit board 2 to be tested, and then the second image acquisition module 52 takes a picture to collect a 2D image of the circuit board to be tested at the set point.

[0083] Preferably, when the distance between the light source 56 and the circuit board 2 to be tested is 15±2mm, and the lens of the second image acquisition module 52 is about 100mm away from the circuit board 2 to be tested, sufficient light can be provided and the imaging is optimal. In subsequent point testing, the light source 56 needs to be kept away from the circuit board to be tested to avoid obstacles during point testing.

[0084] Furthermore, in order to further realize safe, controllable and accurate position movement of the probe, the probe detection module 5 further includes a position sensor 57, which is mounted on the third fixed end 511 and is respectively set to correspond to the movement starting position and the maximum stroke position of the third output end 512;

[0085] The position sensing sheet 58 cooperates with the sensing end of the position sensor 57 . The position sensing sheet is connected to the third output end 511 . The position sensing sheet 58 is used to approach or move away from the position sensor 57 under the reciprocating linear drive of the third output end 511 .

[0086] like Figure 4 As shown, there are three position sensors 57, which are respectively set as the first position sensor 571, the second position sensor 572 and the third position sensor 573, wherein the first position sensor 571 and the second position sensor 572 are respectively set corresponding to the movement starting position and the maximum stroke position of the third output end, and the third position sensor 573 is correspondingly set between the movement starting position and the maximum stroke position. Among them, the position sensing sheet 58 is installed on the angle support 514, when the third output end 512 synchronously drives the second probe 54 to reciprocate linear motion through the angle support 514 and the extension support 515, the position sensing sheet 58 is synchronously driven to reciprocate linearly, passing through the first position sensor, the third position sensor and the second position sensor.

[0087] For example, Figure 8-10 As shown, when the motor 513 of the third linear module 51 returns to the initial value, the third output end 512 synchronously drives the second probe 54 back to the starting position of the movement, and the distance between the second probe 54 and the first probe 53 is the smallest, as shown in FIG. Figure 8 shown.

[0088] When the motor 513 rotates and receives the corresponding number of pulses, the third output terminal 512 drives the second probe 54 to move the designed distance. At this time, the distance between the second probe 54 and the first probe 53 becomes larger. Fig. 9 shown.

[0089] When the motor 513 continues to rotate and the third output end 512 moves to the maximum stroke position, the distance between the second probe 54 and the first probe 53 is the largest, reaching the upper limit of the second probe distance change value, ensuring the distance change within a safe range. Fig.10 shown.

[0090] In one embodiment of the present disclosure, the circuit board detection device of the present application further includes a fixture assembly 7 for accommodating the circuit board to be tested, and the fixture assembly 7 includes:

[0091] Fixture 71;

[0092] There are multiple magnetic members 72, and the multiple magnetic members 72 can be magnetically connected to the surface of the fixture 71 at any position;

[0093] An insulating connector 73, wherein the first end of the insulating connector 73 is detachably connected to the magnetic member 72, and the second end is insulated and detachably connected to the circuit board 2 to be tested. The present application sets a jig assembly 7, which is a key component for placing the circuit board 2 to be tested on the test bench 6. The jig 71 is fixed on the test bench 6, and the magnetic member is composed of a plurality of neodymium magnets superimposed on each other, so that the magnetic attraction of the magnetic member is greatly increased, and the surface of the jig 71 is roughened after being sandblasted with steel sand, and the surface friction coefficient is increased. When the friction coefficient and the magnetic attraction are increased at the same time, the friction force is increased by dozens of times. The first end of the insulating connector 73 can be threadedly connected to the magnetic member 72, and the second end of the insulating connector 73 can be inserted into the reserved hole of the circuit board to be tested, thereby realizing the detachable connection between the circuit board 2 to be tested and the insulating connector 73. There are multiple magnetic suction members 72, and the magnetic suction members 72 can be arbitrarily adsorbed on the position of the circuit board 2 to be tested, so that the circuit board to be tested remains relatively horizontal, so that the circuit board to be tested has high stability, and is insulated from the detection platform 6, which can ensure that the circuit board 2 to be tested will not shake or deviate when the flexible mechanical arm 4 is performing point measurement. The second end of the insulating connector 73 can also be directly supported on the surface of the circuit board 2 to be tested. It is only necessary to set multiple groups of insulating connectors 73 and magnetic suction members 72, such as 10 groups or more, distributed around the circuit board to be tested, and the circuit board 2 to be tested can also be stably supported, ensuring that the circuit board 2 to be tested will not shake or deviate during point measurement.

[0094] Of course, the circuit board 2 to be tested can also be fixed to the surface of the fixture by other insulating parts, such as bonding or snapping the circuit board to be tested and the insulating part, as long as the circuit board to be tested is stably supported and fixed on the surface of the fixture and is insulated from the fixture and the test bench.

[0095] Therefore, the circuit board detection device of the present application has high compatibility by setting the fixture assembly 7, without the need to prepare a matching fixture for the circuit board to be tested. In addition, the assembly operation of the circuit board to be tested is simple and easy to use, and because there is a strong friction between the magnetic suction part in the fixture assembly and the fixture surface, the circuit board to be tested can be fixed on the fixture more stably without changing position.

[0096] In one embodiment of the present disclosure, the circuit board detection device further includes a controller 8, which is electrically connected to the first image acquisition module 1, the first linear module 31, the second linear module 32, the flexible mechanical arm 4, the third linear module 51, the second image acquisition module 52, the drive mechanism 55, the light source 56, and the position sensor 57. Specifically, the controller 8 is electrically connected to the 3D camera control system in the first image acquisition module, the motor of the linear module, the robot control system carried by the flexible mechanical arm 4 itself, the second image acquisition module, the drive mechanism, the light source, and the position sensor. Thus, the automatic test of the circuit board 2 to be tested by the detection device is mainly realized by the cooperation of the controller and the components electrically connected thereto (i.e., the first image acquisition module, the linear module, the flexible mechanical arm, the second image acquisition module, the drive mechanism, the light source, and the position sensor). The controller 8, the first image acquisition module 1, the first linear module 31, the second linear module 32, the flexible mechanical arm 4, the third linear module 51, the second image acquisition module 52, the drive mechanism 55, the light source 56, and the position sensor 57 realize the automatic detection of the detection device by sending and receiving control signals.

[0097] For example, the controller 8 includes: a storage module, which is used to store standard machine model of different circuit boards; a server module, which is used to receive two-dimensional code information or OCR information, and confirm the machine model information corresponding to the circuit board to be tested according to the two-dimensional code information or OCR information; a processing unit: including, a first processing module, which is used to receive the machine model information and generate a standard machine model instruction based on the machine model information; a second processing module, which is used to obtain the standard machine model of the circuit board to be tested and convert it into a standard data model, and generate standard position information and test content of each test point of the circuit board to be tested based on the standard data model; A third processing module is used to receive a 3D point cloud image and convert the 3D point cloud image into a data model, and then match and fit it with a standard data model to obtain the position difference of each test point of the circuit board to be tested; and determine the actual three-dimensional coordinate position of each test point based on the 3D point cloud image; a fourth processing module, the fourth processing module is used to send the standard position information, test content and actual three-dimensional coordinate position of each test point to the flexible robotic arm, so that the flexible robotic arm can plan the motion path and posture change; a control module is used to start the probe detection module and the flexible robotic arm to test each test point based on the actual three-dimensional coordinate position and test content of the test point.

[0098] In a second aspect, the present disclosure further provides a detection method for a circuit board detection device in any one of the embodiments in the first aspect, which can automatically complete the detection of the detection device, reduce labor costs, and improve test efficiency. Fig.11 As shown, the detection method comprises the following steps:

[0099] Step 100: Obtaining the QR code information or OCR information of the circuit board 2 to be tested;

[0100] Step 200: Based on the two-dimensional code information or the OCR information, obtain the standard data model of the circuit board 2 to be tested, the standard position information of each test point of the circuit board 2 to be tested, and the test content;

[0101] Step 300: Acquire a 3D point cloud image of the circuit board 2 to be tested, convert the 3D point cloud image into a data model, and then match and fit it with the standard data model to obtain the position difference of each test point of the circuit board 2 to be tested; and determine the actual three-dimensional coordinate position of each test point based on the 3D point cloud image;

[0102] Step 400: planning the motion path and posture transformation of the flexible manipulator based on the standard position information of each test point, the actual three-dimensional coordinate position of each test point and the test content;

[0103] Step 500: Based on the actual three-dimensional coordinate position of each test point, the position difference of each test point and the planned motion path of the flexible robotic arm, start the probe detection module 5 to test each test point.

[0104] The advantages of the detection method of the present application are: 1) Flexibility: no corresponding fixture is required, the test spacing is variable, and it is compatible with multi-function tests, including ICT and FCT functional tests. 2) Accuracy: the point measurement repeatability accuracy can reach ±0.01mm, and the repeat positioning accuracy is high. Even the smallest pin tin point can achieve accurate point measurement with good consistency. 3) Intelligence: the detection method of the present application can realize automatic testing of the detection device. 4) Efficiency: one detection device can carry multiple flexible robotic arms to collaborate simultaneously to improve detection efficiency.

[0105] For example, in one embodiment of the present disclosure, in step 100), obtaining the two-dimensional code information or OCR information of the circuit board 2 to be tested includes:

[0106] The ID code on the circuit board to be tested 2 is scanned by the first image acquisition module 1 or the second image acquisition module 52 to extract the two-dimensional code information or OCR information (optical character recognition information).

[0107] In one embodiment of the present disclosure, in step 200), obtaining a standard data model of the circuit board to be tested based on the two-dimensional code information or the OCR information includes:

[0108] Based on the QR code information or OCR information, obtain the model information of the circuit board 2 to be tested and obtain the standard model model of the circuit board 2 to be tested based on the model information, and convert the standard model model into a standard data model. For example, based on the standard model model, open the standard model model stp file and then convert it into a standard data model (such as an OBJ file). Based on the standard data model, obtain the standard position information and test content of each test point;

[0109] In step 200), the test content includes but is not limited to the location information of each test point and task information, and the task information includes but is not limited to voltage, current and / or electrode testing.

[0110] In one embodiment of the present disclosure, in step 300), the linear module assembly 3 is driven to move the first image acquisition module 1 to the top of the circuit board 2 to be tested, and the circuit board 2 to be tested is photographed and collected to obtain the actual 3D point cloud image of the circuit board 2 to be tested. The 3D point cloud image is then converted into a data model and matched with the standard data model to obtain the position difference of each test point of the circuit board 2 to be tested (i.e., the three-dimensional coordinate difference of each test point).

[0111] In step 300), the actual three-dimensional coordinate position of each test point of the circuit board 2 to be tested is determined based on the 3D point cloud image.

[0112] Among them, in step 300), the purpose of converting the 3D point cloud image into a data model and matching it with the standard data model is to compensate for the difference between the actual material and the standard machine model. In the SMT (surface mount technology) process of the circuit board to be tested (such as PCBA), since the manufacturing tolerance of components, patch tolerance and reflow soldering processes will affect the position of components, it is necessary to compensate for the dela difference in combination with the actual component position.

[0113] The principle of matching and fitting the machine model with the 3D camera imaging is: after the 3D point cloud image is converted into a data model, the standard data model is overlapped, the overlap difference is highlighted with different colors, and the dela difference is sent to the flexible robotic arm.

[0114] Compared with 2D cameras, the main benefits brought by 3D smart cameras are: 3D cameras retain the functions of 2D cameras; they have the ability to capture the Z-direction coordinates of 3D space, while 2D cameras only have XY-direction plane data; and they can avoid the trouble and solution of unknown Z-direction data of the robotic arm caused by different component heights.

[0115] In one embodiment of the present disclosure, in step 400), based on the standard position information of each test point, the actual three-dimensional coordinate position of each test point and the test content, the motion path and posture transformation of the flexible robotic arm are planned. Specifically, according to the standard position information of each test point, the actual three-dimensional coordinate information of each test point, the position difference of each test point and the test content, the robot control system in the flexible robotic arm plans the motion path and posture transformation of the flexible robotic arm.

[0116] In one embodiment of the present disclosure, in step 500), starting the probe detection module to test each test point based on the position difference of each test point and the planned motion path of the flexible robotic arm includes:

[0117] Step 501) based on the 3D point cloud image and the motion path of the flexible robotic arm, determine a plurality of set points for the flexible robotic arm to move, wherein the set points can completely cover the test points required to be tested;

[0118] Step 502) The flexible mechanical arm moves to a certain set point, and the light source is turned on to trigger the second image acquisition module to take a photo to obtain a 2D image of the circuit board to be tested at the certain set point;

[0119] Step 503) Capture the marker points and features in the 2D image to confirm the exact position of each test point in the 2D image;

[0120] Step 504) Based on the position difference corresponding to each test point and the accurate position of each test point in the 2D image, the probe contacts each test point for testing;

[0121] Steps 502) to 504) are looped to complete the testing of all the test points on the circuit board to be tested.

[0122] For example, in step 501), determining the multiple set points that the flexible manipulator needs to move includes: first, according to the 3D point cloud image and the movement path of the flexible manipulator, the circuit board area to be tested is planned to be divided into multiple set points, and then the flexible manipulator moves to the position directly above the set point according to the planned path, and then the second image acquisition module (2D camera) and the light source are used to obtain a 2D image of the circuit board to be tested at the set point. The marking points and features in the 2D image are captured to confirm the accurate three-dimensional position of each test point in the 2D image.

[0123] The flexible robotic arm moves to the planned point, and based on the test content, the three-dimensional position difference corresponding to each test point, and the probe opening and closing set distance, the third linear module drives the second probe to cooperate with the first probe to test each test point. Among them, according to the position of each test point, the third linear module is controlled to drive the second probe to open and close the set distance, and cooperate with the first probe to test each test point.

[0124] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0125] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0126] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A circuit board detection device, characterized in that: include: The first image acquisition module is used to obtain a 3D point cloud image of the circuit board to be tested; The linear module assembly has a first output end, and the first image acquisition module is installed on the first output end; The linear module assembly is configured to drive the first image acquisition module to reciprocate linearly in the X and Y directions; A flexible robotic arm, wherein the flexible robotic arm is configured to be able to rotate at any angle in the X, Y and Z directions; The probe detection module includes a third linear module, a second image acquisition module for acquiring a 2D image of the circuit board to be tested, a first probe and a second probe; the third linear module has a third fixed end and a third output end capable of reciprocating linear motion; the third fixed end is respectively connected to the first probe, the free end of the flexible mechanical arm and the second image acquisition module, the third output end is connected to the second probe, and the third output end is used to synchronously drive the second probe to approach or move away from the first probe in a horizontal direction.

2. The circuit board detection device according to claim 1, characterized in that: The probe detection module also includes an auxiliary component, which includes a driving mechanism and a light source; the driving mechanism is fixed on the third fixed end in the vertical direction and the telescopic end of the driving mechanism is connected to the light source arranged below the second image acquisition module, so as to drive the light source to approach or move away from the second image acquisition module in the vertical direction.

3. The circuit board detection device according to claim 2, characterized in that: The probe detection module also includes: A position sensor, the position sensor is mounted on the third fixed end and is respectively arranged corresponding to the movement starting position and the maximum stroke position of the third output end; The position sensing piece cooperates with the sensing end of the position sensor, the position sensing piece is connected to the third output end, and the position sensing piece is used to approach or move away from the position sensor under the reciprocating linear drive of the third output end.

4. The circuit board detection device according to claim 1, characterized in that: The linear module assembly comprises: A first linear module, having a first output end capable of reciprocating linear motion, wherein the first image acquisition module is installed on the first output end; The second linear module has a second output end capable of reciprocating linear motion, and the motion direction of the second output end is perpendicular to the motion direction of the first output end. The first linear module is installed on the second output end.

5. The circuit board detection device according to claim 1, characterized in that: The third fixed end is detachably connected to a vertically arranged first probe through a first connecting assembly; The third output end is detachably connected to a second probe that is tilted toward the first probe through a second connecting assembly.

6. The circuit board detection device according to any one of claims 1 to 5, characterized in that: The circuit board detection device also includes a fixture assembly for accommodating the circuit board to be tested, and the fixture assembly includes: jig; There are multiple magnetic suction parts, and the multiple magnetic suction parts can be magnetically connected to the surface of the fixture at any position; An insulating connector, wherein a first end of the insulating connector is detachably connected to the magnetic attraction member, and a second end of the insulating connector is insulated and detachably connected to the circuit board to be tested.

7. A circuit board detection method, characterized in that: The circuit board detection device according to any one of claims 1 to 6, wherein the detection method comprises: Get the QR code information or OCR information of the circuit board to be tested; Based on the two-dimensional code information or the OCR information, a standard data model of the circuit board to be tested, standard position information of each test point of the circuit board to be tested, and test content are obtained; Acquire a 3D point cloud image of the circuit board to be tested, convert the 3D point cloud image into a data model, and then match and fit the data model with the standard data model to obtain the position difference of each test point of the circuit board to be tested; and determine the actual three-dimensional coordinate position of each test point based on the 3D point cloud image; Planning the motion path and posture transformation of the flexible robotic arm based on the standard position information of each test point, the actual three-dimensional coordinate position of each test point and the test content; Based on the position difference of each test point and the planned motion path of the flexible robotic arm, the probe detection module is started to test each test point.

8. The detection method according to claim 7, characterized in that: The obtaining of the two-dimensional code information or OCR information of the circuit board to be tested includes: The ID code on the circuit board to be tested is scanned by the first image acquisition module or the second image acquisition module to extract the two-dimensional code information or the OCR information.

9. The detection method according to claim 7, characterized in that: The acquiring of the standard data model of the circuit board to be tested based on the two-dimensional code information or the OCR information includes: Based on the two-dimensional code information or the OCR information, the model information of the circuit board to be tested is obtained, and based on the model information, a standard model model of the circuit board to be tested is obtained, and the standard model model is converted into a standard data model.

10. The detection method according to claim 7, characterized in that: The step of starting the probe detection module to test each test point based on the position difference of each test point and the planned motion path of the flexible robotic arm includes: (1) Based on the 3D point cloud image and the motion path of the flexible robotic arm, determine multiple set points where the flexible robotic arm needs to move; (2) The flexible robotic arm moves to a certain set point, and the light source is turned on to trigger the second image acquisition module to take a photo to obtain a 2D image of the circuit board to be tested at the certain set point; (3) capturing the marking points and features in the 2D image and confirming the accurate position of each test point in the 2D image; (4) Based on the position difference corresponding to each test point and the accurate position of each test point in the 2D image, the probe contacts each test point for testing; Steps (2) to (4) are repeated to complete the testing of all test points on the circuit board to be tested.

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