Machining method, device, equipment and medium

Abstract

The invention belongs to the technical field of machining, and particularly relates to a machining method, device and equipment and a medium. According to the method and device, the mapping relation between the position coordinates of all the points in the machining breadth and the movement displacement of the machining head moving to all the points in the machining breadth is constructed through the multiple calibration points on the first bottom plate, and during machining, the position data of the to-be-machined material placed on the second bottom plate are obtained; and based on the position data and the mapping relation, a machining instruction is generated, and based on the machining instruction, a machining head is controlled to machine the to-be-machined material. The displacement coordinates of the machining head are corrected through the first bottom plate, the mapping relation is constructed, the position data of the to-be-machined material can be calibrated based on the mapping relation during machining, the machining deviation caused by inconsistency of the motion coordinates and the coordinates in the machining area is solved to a certain extent, and the machining precision is improved.

Description

[0001] This application is required to be submitted to the State Intellectual Property Office on June 28, 2023, with application number

[0002] 2023107826100, and the priority of the Chinese patent application entitled “Mechanical processing method, device, terminal and medium”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present invention relates to the field of mechanical processing technology, and in particular to a mechanical processing method, device, equipment and medium. Background Art

[0004] During the laser processing, the material to be processed needs to be identified and located before it can be laser processed. Laser processing requires very high processing accuracy. During the processing, the motion system is responsible for driving the laser processing head to move according to the predetermined path and speed to process the material to be processed. However, due to assembly errors, inaccurate calibration of the control system and other reasons, there will be inconsistencies between the coordinates of the processing point and the motion coordinates of the motion system, causing the actual position of the processing head to deviate from the expected processing path. This deviation will directly lead to a decrease in processing accuracy, thereby affecting the processing accuracy.

[0005] Therefore, how to reduce the impact of the deviation between the machining coordinates of the machining area and the actual motion coordinates of the motion system on the machining accuracy is a difficult problem that urgently needs to be solved in the field of mechanical machining technology. Summary of the invention

[0006] The main purpose of the present invention is to provide a mechanical processing method, device, equipment and medium, aiming to reduce the processing deviation caused by the inconsistency between the processing coordinates of the processing area and the motion coordinates of the motion system, and improve the processing accuracy.

[0007] According to one aspect of an embodiment of the present application, a machining method is disclosed, comprising:

[0008] According to the plurality of calibration points on the first base plate, a mapping relationship between the position coordinates of each point in the processing format and the motion displacement coordinates of the processing head moving to each point in the processing format is constructed;

[0009] After the material to be processed is placed on the second bottom plate, obtaining position data of the material to be processed placed on the second bottom plate; and

[0010] A processing instruction is generated according to the position data and the mapping relationship, and the processing head is controlled to process the material to be processed based on the processing instruction.

[0011] According to one aspect of an embodiment of the present application, a machining device is disclosed, comprising:

[0012] A mapping relationship determination module, used to construct a mapping relationship between the position coordinates of each point in the processing format and the motion displacement coordinates of the processing head moving to each point in the processing format according to a plurality of calibration points on the first base plate;

[0013] A position data acquisition module, used for acquiring position data of the material to be processed placed on the second bottom plate after the material to be processed is placed on the second bottom plate; and

[0014] A processing instruction generating module is used to generate a processing instruction according to the position data and the mapping relationship, and control the processing head to process the material to be processed based on the processing instruction.

[0015] According to one aspect of an embodiment of the present application, an electronic device is disclosed, comprising: a memory, a processor, and a machining program stored in the memory and executable on the processor, wherein the machining program implements the machining method in the above technical solution when executed by the processor.

[0016] According to one aspect of the embodiments of the present application, a computer program product or a computer program is provided, the computer program product or the computer program including computer instructions, the computer instructions being stored in a computer-readable storage medium. A processor of an electronic device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the machining method in the above technical solution.

[0017] In the present application, a mapping relationship between the position coordinates of the processing area and the motion displacement of the processing head to the position coordinates is first constructed through multiple calibration points on the first base plate. When processing, the position data of the material to be processed on the second base plate is obtained, and processing instructions are generated based on the position data and the mapping relationship. As a result, the processing instructions are more accurate, and accurate processing of the material to be processed is achieved. To a certain extent, the processing deviation caused by the inconsistency between the motion coordinates and the coordinates in the processing area is solved, which is conducive to improving the processing accuracy.

[0018] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A flowchart of the steps of a machining method in one embodiment of the present application is shown.

[0021] Figure 2 A schematic diagram showing the effect of setting calibration points on the first base plate in one embodiment of the present application is shown.

[0022] Figure 3 A schematic diagram showing the principle of triangulation ranging according to an embodiment of the present application is shown.

[0023] Figure 4 The structural block diagram of the mechanical processing device provided in the embodiment of the present application is schematically shown.

[0024] Figure 5 The structure block diagram of a computer system suitable for implementing an electronic device of an embodiment of the present application is schematically shown. DETAILED DESCRIPTION

[0025] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0026] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0027] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0028] The flowcharts shown in the accompanying drawings are only exemplary and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined, so the actual execution order may change according to actual conditions.

[0029] The following is a detailed description of the technical solutions such as the mechanical processing method, device, terminal and medium provided in the present application in combination with specific implementation methods.

[0030] In the related art, during the mechanical processing, the material to be processed needs to be identified and positioned before being processed. The material identification and positioning method includes fixing a soft pad with a groove at a specific position of the processing format, and placing the material to be processed on the groove of the software, so that the processing equipment performs processing according to the groove position. However, the above method requires preparing a soft pad with a groove corresponding to the shape of the different materials to be processed, which seriously affects the processing efficiency, and the manufacture of soft pads of various specifications also greatly increases the production cost.

[0031] During the machining process, the motion system is responsible for driving the machining head to move according to the predetermined path and speed to process the material to be processed. However, due to the wear of mechanical parts, assembly errors, inaccurate calibration of the control system and other reasons, there will be inconsistencies between the coordinates of the machining point and the motion coordinates of the motion system, causing the actual position of the machining head to deviate from the expected machining path. This deviation will directly lead to a decrease in machining accuracy, thereby affecting the machining accuracy.

[0032] Therefore, how to reduce the impact of the deviation between the machining coordinates of the machining area and the actual motion coordinates of the motion system on the machining accuracy is a difficult problem that urgently needs to be solved in the field of mechanical machining technology.

[0033] In order to solve the above technical problems, Figure 1 A flowchart of the steps of a machining method in one embodiment of the present application is shown. Figure 1 As shown, the machining method may mainly include the following steps S100 to S300.

[0034] S100: constructing a mapping relationship between the position coordinates of each point in the processing area and the motion displacement coordinates of the processing head moving to each point in the processing area according to a plurality of calibration points on the first base plate.

[0035] Since there may be deviations between the coordinate points on the processing surface and the displacement coordinates of the motion system, the processing accuracy is affected. For this reason, a first base plate can be set up, and the second base plate of the processing equipment can be replaced during calibration. The coordinate point calibration is performed through the first base plate to reduce the influence of the coordinate deviation on the processing. Therefore, before positioning and processing the material to be processed, a mapping relationship is established between the position coordinates of the processing point and the motion displacement coordinates of the processing head to improve the accuracy of subsequent processing.

[0036] Multiple calibration points may be provided on the first base plate, and the coordinate data of each calibration point is known. When constructing the mapping relationship, the processing head may be controlled to move to the position aligned with each calibration point on the first base plate, and the change in the motion coordinates of the processing head during movement may be obtained, and the motion displacement coordinates of the processing head moving to each calibration point may be associated with the position coordinates of the calibration point on the first base plate. Based on the position coordinates of multiple calibration points and the motion displacement coordinates of the processing head moving to the calibration point, the mapping relationship between the position coordinates of each point on the first base plate and the motion displacement coordinates of the processing head moving to the corresponding points on the first base plate may be constructed by fitting or other methods. The processing head may be a laser head or a tool head, etc., which are not listed here one by one.

[0037] S200, after the material to be processed is placed on the second bottom plate, the position data of the material to be processed placed on the second bottom plate is obtained.

[0038] Specifically, the second bottom plate is arranged inside the processing equipment and is used to place the material to be processed so that the processing equipment can process the material to be processed. The first bottom plate and the second bottom plate can be the same bottom plate, or two bottom plates. The first bottom plate can be arranged on the second bottom plate, and the second bottom plate can also be arranged on the first bottom plate, or one of the first bottom plate and the second bottom plate can be arranged inside the processing equipment. For example, one of the first bottom plate and the second bottom plate is arranged inside the processing equipment, and when step S100 needs to be performed, the second bottom plate can be replaced by the first bottom plate. For another example, if the first bottom plate and the second bottom plate are provided at the same time, the first bottom plate or the second bottom plate can be presented by disassembly and assembly.

[0039] The second bottom plate may be provided with marking points for positioning, and the position data of the material to be processed can be obtained through the marking points. Alternatively, a positioning device may be provided in the processing equipment, and the material to be processed can be aligned by the positioning device to obtain the position data of the material to be processed. The position data of the material to be processed may include the size of the material to be processed and the position in the second bottom plate.

[0040] S300, generating a processing instruction according to the position data and the mapping relationship, and controlling the processing head to process the material to be processed based on the processing instruction.

[0041] Specifically, the processing instructions are used to control the movement of the processing head to process the material to be processed. The placement position of the material to be processed on the processing surface and the size of the material to be processed can be determined through the position data, and the position data of the material to be processed in the motion system can be obtained through the mapping relationship, and then accurate processing instructions can be generated, so that the processing movement trajectory of the processing head according to the processing instructions corresponds to the processing range of the material to be processed, ensuring the processing accuracy.

[0042] In this embodiment, a mapping relationship between the position coordinates of each point in the processing area and the motion displacement of the processing head to each point in the processing area is constructed through multiple calibration points on the first base plate. When processing, the position data of the material to be processed placed on the second base plate is obtained, and processing instructions are generated based on the position data and the mapping relationship. The material to be processed is processed based on the processing instructions. As a result, the processing instructions are more accurate and accurate processing of the material to be processed is achieved. That is, the embodiment of the present application solves the processing deviation caused by the inconsistency between the motion coordinates and the coordinates in the processing area to a certain extent, which is conducive to improving the processing accuracy.

[0043] Further, S100, based on multiple calibration points on the first base plate, a mapping relationship between the position coordinates of each point in the processing area and the motion displacement coordinates of the processing head moving to each point in the processing area is constructed, including steps S110 to S130.

[0044] S110, controlling the movement of the machining head so that the machining head is aligned with the calibration point;

[0045] S120, acquiring the basic coordinates of the calibration point on the first base plate and the motion displacement coordinates when the machining head moves to align with the calibration point;

[0046] S130, constructing a mapping relationship based on the basic coordinates of the multiple calibration points and the corresponding motion displacement coordinates.

[0047] Figure 2 The schematic diagram shows the effect of setting calibration points on the first bottom plate. Figure 2 The number and arrangement of the calibration points are for illustration only and should not limit the technical solution of this embodiment.

[0048] Among them, the basic coordinates of each calibration point on the calibration base plate are known. The processing head can be controlled to move to a position relative to the first calibration point, that is, the processing head is aligned with the first calibration point, and the basic coordinates of the first calibration point and the motion displacement coordinates when the processing head moves to the first calibration point are recorded. For example, if the position coordinates of the first calibration point on the first base plate are (1,1), and the corresponding motion displacement coordinates when the processing head is actually controlled to move to the first calibration point are (1.02,0.98). Then align the processing head with the second calibration point, and record the basic coordinates and corresponding motion displacement coordinates of the second calibration point at the same time. Record the basic coordinates and corresponding motion displacement coordinates of a sufficient number of calibration points in sequence. Then, based on the basic coordinates and corresponding motion displacement coordinates of multiple calibration points, a mapping relationship can be constructed by fitting and other methods. For example, taking the processing head as a laser head as an example, the alignment is that the light spot projected by the laser head is aligned with the calibration point.

[0049] As an optional implementation, the number of calibration points is positively correlated with the level of machining accuracy. The higher the machining accuracy, the more calibration points are needed on the first base plate or the more calibration points are needed to build the mapping relationship. Therefore, the higher the accuracy of the mapping relationship established based on the calibration points on the first base plate, the smaller the error of the machining equipment in controlling the movement of the machining head. It can be understood that when a large number of calibration points are used to establish the mapping relationship, the control error of the machining equipment can be reduced to a lower level. In actual applications, the user can determine the number of calibration points used to establish the above-mentioned mapping relationship based on the actual requirements of the machining accuracy level, and then establish the above-mentioned mapping relationship based on the number of calibration points.

[0050] As an optional implementation, Figure 2 As shown, a plurality of calibration points are arranged in an array on the first base plate. The array arrangement may be arranged in the form of N rows and M columns, whereby the movement of the machining head during calibration is smoother and the calibration efficiency is relatively higher.

[0051] Further, as an optional implementation, S200, after the material to be processed is placed on the second bottom plate, obtaining position data of the material to be processed on the second bottom plate includes the following steps S210 to S220.

[0052] S210, acquiring an image of the second base plate on which the material to be processed is placed, the image including marking points arranged around the material to be processed.

[0053] S220, identifying the marking points in the image, and determining the position data of the material to be processed according to the marking points.

[0054] Specifically, the second base plate may be provided with marking points around the processing surface, the material to be processed may be placed on the processing surface, and the processing surface on which the material to be processed is placed may be photographed by a photographing device to obtain an image containing the material to be processed and the marking points. As an optional embodiment, the photographing device may be a camera arranged inside the processing equipment, or a handheld photographing device (such as a mobile phone, a tablet, a camera, etc.) independent of the processing equipment, and the image may be transmitted to the processing equipment by wire or wireless means. The handheld photographing device may enable the processing equipment without a camera to be positioned by photographing, which makes the processing more convenient and intelligent for the user. The marking points in the recognition image may be identified, and the position data of the material to be processed on the processing surface may be calculated by using the principle of triangulation distance measurement. The marking points may have logo patterns, identification codes, etc., so that the marking points can be identified from the image.

[0055] Among them, the executor of the mechanical processing method can be the handheld shooting device itself, or a terminal that communicates with the handheld shooting device (such as a laptop computer, desktop computer, etc.), or the processing device itself that wirelessly communicates with the handheld shooting device.

[0056] Furthermore, the marking points include position marking points and height marking points. The number of position marking points may be multiple, and the heights of the multiple position marking points are the same. The heights of the position marking points and the height marking points are different, and the height of the height marking points may be higher than the position marking points. Among them, the marks (such as patterns, QR codes, etc.) of the position marking points and the height marking points may be different to distinguish the position marking points from the height marking points. For example, when setting the position marking points and the height marking points, different identification codes are assigned to the position marking points and the height marking points. When identifying the marking points, the position marking points and the height marking points can be distinguished according to the identification codes. The properties (such as patterns) of different position marking points may be different to facilitate the distinction between the various position marking points.

[0057] In this embodiment, a plurality of position marking points and height marking points are set around the processing surface. When the material to be processed is placed on the processing surface for processing, a picture can be taken. According to the position marking points and height marking points in the image, the size of the material to be processed and the position in the processing area can be accurately identified. Materials to be processed of various shapes can be positioned without the need to set cushions of different shapes corresponding to materials to be processed of different shapes. The cost is relatively low and the operation is convenient.

[0058] S210, identifying the marking points in the image, and determining the position data of the material to be processed according to the marking points, including the following steps S2101 to S2103.

[0059] S2101, construct an enclosed area based on a preset number of position marker points.

[0060] Specifically, an enclosed area may be constructed according to a preset number of position markers. All or part of the position markers in the image may be sequentially connected together to form an enclosed area.

[0061] Furthermore, in some embodiments, the image includes at least N different position markers, N≥2, and the value of N is related to the direction attribute of the position marker, and the direction attribute is the number of directions indicated by the position marker.

[0062] At least N position markers in different positions are required to enclose an enclosed area. According to the number of directions indicated by the directional attributes of the position markers, the minimum number of position markers that need to be captured when taking the initial image can be determined so that the initial image can meet the positioning requirements. It can be understood that in mathematical concepts, for points without directionality or with only one directional attribute, at least three non-collinear points are required to determine a plane, and for points with directionality (for example, a point can indicate two or more directions), only two points are required to determine a plane. That is, when each position marker can indicate one direction or cannot indicate a direction, N=3; when each position marker can indicate more than two directions, N=2.

[0063] S2102, confirming the height of the image shooting device relative to the material to be processed based on at least one position mark point and a height mark point.

[0064] Among them, based on the relative position relationship between at least one position mark point and a height mark point in the image, the relative position relationship between at least one position mark point and a height mark point on the second base plate, and the height difference between the position mark point and the height mark point, the height of the image shooting device relative to the position mark point can be calculated by the principle of triangulation. The height of the position mark point is the same as the height of the plane of the second base plate where the material to be processed is placed. Then, the height of the shooting device relative to the material to be processed can be obtained by subtracting the thickness of the material to be processed from the height of the shooting device relative to the position mark point.

[0065] As an optional embodiment, the height of the image shooting device relative to the material to be processed can be calculated based on the relative position relationship between one of the position marking points and the height marking point, the relative position relationship between the corresponding position marking point and the height marking point on the second base plate, and the height difference between the position marking point and the height marking point by the principle of triangulation. As another optional embodiment, the height of the image shooting device relative to the material to be processed can be calculated based on the relative position relationship between multiple position marking points and the height marking point, the relative position relationship between the corresponding multiple position marking points and the height marking point on the second base plate, and the height difference between the position marking point and the height marking point by the principle of triangulation. The shooting height determined based on multiple position marking points is more accurate.

[0066] As an optional implementation, Figure 3 The schematic diagram of the calculation principle of the triangulation distance measurement principle is shown as follows: Figure 3 As shown, it includes shooting point X, shooting point Y, plane α, plane β, position mark point A, and height mark point C. There is a height difference between height mark point C and position mark point A.

[0067] Among them, the position mark point A is set on plane α, and the height mark point C is correspondingly set on plane β. The intersection point of the carrier of the height mark point C and the plane α is point B, which is offset by 200mm compared to the position mark point A. The shooting point X and the shooting point Y can be used as the location of the shooting equipment, and the distances between them and plane α are 100mm and 200mm respectively. Since the height mark point C is 20mm higher than plane α, when plane α is photographed at different heights, the projection point of the height mark point C on plane α is different. Therefore, the shooting height can be measured according to the distance between the height mark point C and the position mark point A in the captured image, the distance between point B and the position mark point A, the height of the height mark point C, and the actual distance between the height mark point C and the position mark point A in the processing area using the triangulation principle. For example, combined with Figure 5 When shooting from shooting point X, the distance between position marker point A and point B: the distance between position marker point A and projection point C1 of height marker point C on plane α = 200:250; when shooting from shooting point Y, the distance between position marker point A and point B: the distance between position marker point A and projection point C2 of height marker point C on plane α = 200:222.22; when shooting at different heights, the distance between position marker point A and height marker point C in the corresponding image is different, while the distance between position marker point A and point B changes proportionally with the shooting height. On this basis, the shooting height can be calculated by applying the principle of triangulation.

[0068] S2103, determining the position data of the material to be processed according to the relative position relationship and height between the material to be processed and the enclosed area.

[0069] The position data of the material to be processed includes the size of the material to be processed and the position in the second bottom plate. The enclosed area is determined by the image captured by the camera, and the size and position of the material to be processed can be calculated based on the relative position between the enclosed area and the material to be processed in the image and the height of the camera relative to the material to be processed by the principle of triangulation.

[0070] Among them, step S2102 and step S2101 can be processed in parallel or executed one after another, and there is no limitation here.

[0071] In some embodiments, due to the shooting angle of the shooting device and other reasons, there may be a certain difference between the enclosed area formed by the multiple position marking points in the captured image and the actual enclosed area. The image can be corrected, such as geometric correction, so that the enclosed area formed by the multiple position marking points in the image is less different from the actual enclosed area, and then the position data of the material to be processed is recognized based on the corrected image. That is, the above steps S2101 to S2103 are implemented based on the corrected image.

[0072] For example, the shape of the enclosed area formed by the position marking points in the image can be compared with the preset standard shape to determine the image correction parameters. The image correction parameters are used to correct the image, eliminate the problem of geometric distortion, and make the image more accurate. The image can be corrected according to the image correction parameters to obtain a corrected image. For example, the initial image can be corrected using a geometric correction-related algorithm to obtain a corrected image. Among them, the preset standard shape can be the shape of the preset enclosed area formed by the corresponding position marking points inside the machine at a frontal view, which can be preset in the memory; or, a preset image can be obtained by photographing the inside of the machine at a preset view by a photographing device, and the corresponding position marking points in the preset image enclose a preset enclosed area. The preset view can be a frontal view, or it can be set to other view according to the processing scene.

[0073] After obtaining the corrected image, the position marking points and height marking points in the corrected image can be identified, and then the position marking points can be enclosed to form a target enclosed area, and the size and position of the object to be processed can be determined based on the position marking points, height marking points and target enclosed area in the corrected image. That is, steps S2101 to S2103 are implemented based on the corrected image.

[0074] As an optional implementation, S200, after the material to be processed is placed on the second bottom plate, obtaining position data of the material to be processed on the second bottom plate includes:

[0075] S230, aligning the material to be processed by a positioning device inside the processing equipment to determine the position data of the material to be processed.

[0076] Specifically, the alignment instruction can be triggered to control the alignment device inside the processing equipment to align the material to be processed and move on the processing surface. After the material to be processed is aligned, the position data of the material to be processed is matched according to the movement trajectory of the alignment device.

[0077] As an optional implementation, the positioning device is moved along the material to be processed, and the movement trajectory displacement of the positioning device is associated with the movement displacement coordinates of the processing equipment, so that the processing head determines the position data of the material to be processed.

[0078] As an optional implementation, a scale may be set on the processing surface to obtain the position data of the equipment to be processed based on the scale, or the processing surface may be divided into multiple cells to determine the position data of the material to be processed based on the cells covered by the material to be processed.

[0079] As an optional implementation, an alignment mark (such as a cross light) may be emitted to the material to be processed by an alignment device, and the position of the material to be processed may be determined according to an area enclosed by a plurality of alignment marks.

[0080] Further, S300, generating a processing instruction according to the position data and the mapping relationship, and controlling the processing head to process the material to be processed based on the processing instruction, including steps S310 to S320.

[0081] S310, determining the coordinate range of the material to be processed in the processing head motion system according to the position data and the mapping relationship.

[0082] S320, generating a processing instruction according to the coordinate range of the material to be processed in the processing head motion system.

[0083] Specifically, the coordinates of the processing area where the material to be processed needs to be processed can be obtained, and the coordinate range of the material to be processed in the processing head motion system can be calculated according to the coordinate data and mapping relationship of the processing area. Based on the coordinate range, the processing path can be planned and the processing instructions can be generated, so as to accurately process the material to be processed.

[0084] The following introduces an embodiment of the device of the present application, which can be used to execute the mechanical processing method in the above-mentioned embodiment of the present application. Figure 4 The structural block diagram of the mechanical processing device provided in the embodiment of the present application is schematically shown. Figure 4 As shown, the machining device 400 includes:

[0085] A mapping relationship building module 410 is used to build a mapping relationship between the position coordinates of each point in the processing format and the motion displacement coordinates of the processing head moving to each point in the processing format according to multiple calibration points on the first base plate;

[0086] A position data acquisition module 420 is used to acquire position data of the material to be processed placed on the second bottom plate after the material to be processed is placed on the second bottom plate;

[0087] The processing control module 430 is used to generate processing instructions according to the position data and the mapping relationship, and control the processing head to process the material to be processed based on the processing instructions.

[0088] Furthermore, the mapping relationship building module 410 includes:

[0089] A machining head control unit, used for controlling the movement of the machining head so that the machining head is aligned with the calibration point;

[0090] A coordinate acquisition unit, used to acquire the basic coordinates of the calibration point on the first base plate and the motion displacement coordinates when the machining head moves to align with the calibration point;

[0091] The mapping relationship building unit is used to build a mapping relationship based on the basic coordinates of multiple calibration points and the corresponding motion displacement coordinates.

[0092] Furthermore, the location data acquisition module 420 includes:

[0093] An image acquisition unit is used to acquire an image of a second bottom plate on which the material to be processed is placed, and the second bottom plate is provided with marking points around the material to be processed;

[0094] The position data unit is used to identify the marking points in the image and determine the position data of the material to be processed according to the marking points.

[0095] Furthermore, the marking points include position marking points and height marking points, and the position data unit is configured as follows:

[0096] Construct an enclosed area based on a preset number of position marker points;

[0097] According to at least one position mark point and a height mark point, confirming the height of the image shooting device relative to the material to be processed;

[0098] The position data of the material to be processed is determined according to the relative position relationship and height between the material to be processed and the enclosed area.

[0099] As an optional implementation, the location data acquisition module 420 includes:

[0100] The alignment unit is used to align the material to be processed through the alignment device inside the processing equipment to determine the position data of the material to be processed.

[0101] Furthermore, the processing control module 430 includes:

[0102] A motion displacement coordinate generating unit, used for generating motion displacement coordinates for processing the material to be processed according to the position data and the mapping relationship;

[0103] The processing instruction generating unit is used to generate processing instructions according to the motion displacement coordinates.

[0104] Figure 5 The structure block diagram of a computer system for implementing an electronic device according to an embodiment of the present application is schematically shown.

[0105] It should be noted that Figure 5The computer system 500 of the electronic device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0106] like Figure 5 As shown, the computer system 500 includes a central processing unit 501 (CPU), which can perform various appropriate actions and processes according to the program stored in the read-only memory 502 (ROM) or the program loaded from the storage part 508 to the random access memory 503 (RAM). In the random access memory 503, various programs and data required for system operation are also stored. The central processing unit 501, the read-only memory 502 and the random access memory 503 are connected to each other through a bus 504. An input / output interface 505 (I nput / Output interface, i.e., I / O interface) is also connected to the bus 504.

[0107] The following components are connected to the input / output interface 505: an input section 506 including a keyboard, a mouse, etc.; an output section 507 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 508 including a hard disk, etc.; and a communication section 509 including a network interface card such as a local area network card, a modem, etc. The communication section 509 performs communication processing via a network such as the Internet. A drive 510 is also connected to the input / output interface 505 as needed. A removable medium 511, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 510 as needed so that a computer program read therefrom is installed into the storage section 508 as needed.

[0108] In particular, according to an embodiment of the present application, the process described in each method flow chart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer readable medium, and the computer program contains a program code for executing the method shown in the flow chart. In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 509, and / or installed from the removable medium 511. When the computer program is executed by the central processor 501, various functions defined in the system of the present application are executed.

[0109] It should be noted that the computer-readable medium shown in the embodiment of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (Erasab le Programmab le Read On ly Memory, EPROM), a flash memory, an optical fiber, a portable compact disk read-only memory (Compact Disc Read-Only Memory, CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program, which may be used by an instruction execution system, device or device or used in combination with it. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, wherein a computer-readable program code is carried. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer readable signal media may also be any computer readable medium other than computer readable storage media, which may send, propagate, or transmit programs for use by or in conjunction with an instruction execution system, apparatus, or device. The program code contained on the computer readable medium may be transmitted using any suitable medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0110] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the above-mentioned module, program segment or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flow chart, and the combination of the boxes in the block diagram or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0111] It should be noted that, although several modules or units of the equipment for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present application, the features and functions of two or more modules or units described above can be embodied in one module or unit. On the contrary, the features and functions of one module or unit described above can be further divided into being embodied by multiple modules or units.

[0112] Through the description of the above implementation methods, it is easy for those skilled in the art to understand that the example implementation methods described here can be implemented by software, or by combining software with necessary hardware. Therefore, the technical solution according to the implementation method of the present application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a sports hard disk, etc.) or on a network, including several instructions to enable a computing device (which can be a personal computer, a server, a touch terminal, or a network device, etc.) to execute the method according to the implementation method of the present application.

[0113] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary technical means in the art that are not disclosed in the present application.

[0114] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A machining method, characterized in that: The machining method comprises: According to the plurality of calibration points on the first base plate, a mapping relationship between the position coordinates of each point in the processing format and the motion displacement coordinates of the processing head moving to each point in the processing format is constructed; After the material to be processed is placed on the second bottom plate, obtaining position data of the material to be processed on the second bottom plate; and A processing instruction is generated according to the position data and the mapping relationship, and the processing head is controlled to process the material to be processed based on the processing instruction.

2. The machining method according to claim 1, characterized in that: The step of constructing a mapping relationship between the position coordinates of each point in the processing format and the motion displacement coordinates of the processing head moving to each point in the processing format according to the plurality of calibration points on the first base plate includes: Controlling the movement of the machining head to align the machining head with the calibration point; Acquire the basic coordinates of the calibration point on the first base plate and the motion displacement coordinates of the machining head when the machining head moves to align with the calibration point; The mapping relationship is constructed based on the basic coordinates of a plurality of the calibration points and the corresponding motion displacement coordinates.

3. The machining method according to claim 1, characterized in that: After the material to be processed is placed on the second bottom plate, obtaining position data of the material to be processed on the second bottom plate includes: Acquire an image of the second bottom plate on which the material to be processed is placed, wherein the second bottom plate is provided with marking points around the material to be processed; The marking points in the image are identified, and the position data of the material to be processed is determined according to the marking points.

4. The machining method according to claim 3, characterized in that: The marking points include position marking points and height marking points, and the identifying of the marking points in the image and determining the position data of the material to be processed according to the marking points include: Constructing an enclosed area according to a preset number of position marking points; According to at least one of the position marking points and the height marking points, confirming the height of the image shooting device relative to the material to be processed; The position data of the material to be processed is determined according to the relative position relationship between the material to be processed and the enclosed area and the height.

5. The machining method according to claim 1, characterized in that: The plurality of calibration points are arranged in an array on the first base plate; and / or the number of the calibration points is positively correlated with the machining accuracy level.

6. The machining method according to claim 1, characterized in that: The step of obtaining the position data of the material to be processed placed on the second bottom plate includes: The material to be processed is aligned by a positioning device inside the processing equipment to determine the position data of the material to be processed.

7. The machining method according to claim 1, characterized in that: Generating a processing instruction according to the position data and the mapping relationship includes: Determining the coordinate range of the material to be processed in the processing head motion system according to the position data and the mapping relationship; The processing instruction is generated according to the coordinate range.

8. A mechanical processing device, characterized in that: The device comprises: A mapping relationship building module, used to build a mapping relationship between the position coordinates of each point on the first base plate and the motion displacement coordinates of the processing head moving to each point on the first base plate according to a plurality of calibration points on the first base plate; A position data acquisition module, used for acquiring position data of the material to be processed placed on the second bottom plate after the material to be processed is placed on the second bottom plate; and A processing control module is used to generate a processing instruction according to the position data and the mapping relationship, and control the processing head to process the material to be processed based on the processing instruction.

9. An electronic device, characterized in that: The electronic device comprises: a memory, a processor, and a machining program stored in the memory and executable on the processor, wherein the machining program implements the machining method according to any one of claims 1 to 7 when executed by the processor.

10. A storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the machining method according to any one of claims 1 to 7 is implemented.

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