Method of manufacturing semiconductor component
By forming a fragile connection part in the encapsulant and disconnecting, the problems of difficulty in cutting the encapsulant and component shedding in the prior art are solved, and stable monomerization and easy manufacturing of semiconductor components are achieved.
Patent Information
- Application Number
- CN202410823641.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-28
- Filing Date
- 2024-06-25
- Publication Date
- 2024-12-31
AI Technical Summary
In the existing semiconductor component manufacturing method, cutting of the encapsulant is difficult to achieve, resulting in severe wear of the saw tool and falling off the semiconductor component from the lead frame, making it difficult to handle.
By forming fragile connections in the encapsulation, forming tabs with cutting or molds, and disconnecting these fragile connections by applying force, the semiconductor components are monomerized, and the processing process is simplified.
The stable connection and easy handling of semiconductor components are achieved, and the problems of saw tool wear and component shedding are avoided, and the ease of manufacturing of components is improved.
Smart Images
Figure CN119230417A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a method for manufacturing a semiconductor component and to a semiconductor component. Background Art
[0002] Semiconductor components, such as transistors, are manufactured as layered components that include components such as a semiconductor die, a die pad, leads, and an encapsulation. The encapsulation provides a protective function and at least partially surrounds the semiconductor die and other components that form part of the semiconductor component. The encapsulation may also be referred to as a housing or a casing.
[0003] The manufacture of semiconductor components generally includes: forming semiconductor dies using photolithography; then attaching the semiconductor dies to a die pad. The die pad is formed as an array extending from a lead frame. Once the semiconductor dies have been attached to the die pad, leads are provided on the side of the semiconductor die opposite the die pad. An encapsulation is then formed over each semiconductor die and other components. A portion of the die pad and a portion of the leads may extend from the encapsulation. The semiconductor dies, other components, and encapsulation may be referred to as a semiconductor component. An array of semiconductor components is formed, each of which is attached to a lead frame. Finally, the semiconductor components are separated from the lead frame. This may be referred to as singulation.
[0004] A disadvantage of the above method is that it may be difficult to form an encapsulation for each semiconductor die. It has been proposed to form a single encapsulation covering a row of semiconductor dies and then cut through the single encapsulation to form individual encapsulations. This may make the formation of the encapsulation easier. A disadvantage of this proposed method is that the saw used to cut the encapsulation will be subject to considerable wear. Another disadvantage is that once the encapsulation is cut, the semiconductor component will fall off the lead frame and it may be difficult to handle the semiconductor component formed in this way.
[0005] There is a need to overcome the shortcomings associated with existing semiconductor components and related manufacturing methods, whether or not mentioned in this document. Summary of the invention
[0006] According to a first aspect of the present invention, a method for manufacturing semiconductor components is provided, the method comprising: forming an array of semiconductor components, the semiconductor components comprising an encapsulation having fragile connections between adjacent semiconductor components; and applying force to the semiconductor components to disconnect the fragile connections, thereby singulating the semiconductor components.
[0007] Advantageously, the semiconductor component remains connected until the frangible connection is severed, thereby making handling of the semiconductor component easier.
[0008] The enclosure may be formed without a frangible connection, and wherein cutting is used to cut into the enclosure and thereby form the frangible connection.
[0009] The cutting may be performed from above the semiconductor component. The cutting may be performed from below the semiconductor component.
[0010] The encapsulation body may be formed to have a frangible connection.
[0011] The frangible connection may be a tab having a thickness of at least 0.1 mm.
[0012] The frangible connection may be a tab having a thickness of up to 3 mm.
[0013] A mold may be used to form the encapsulation.
[0014] The non-lead bearing side of the encapsulation may include an upper side that tapers inwardly.
[0015] The lower surface of the encapsulation may be connected to the non-lead bearing side of the encapsulation by a bent edge or a chamfered edge.
[0016] The non-lead bearing side of the encapsulation may include vertical sides extending from the frangible connection.
[0017] According to a second aspect of the present invention, there is provided a semiconductor component comprising a die secured in an encapsulation with leads extending out of the encapsulation, wherein a non-lead bearing side of the encapsulation comprises a portion that has been formed by breaking a frangible connection.
[0018] Advantageously, fabrication of semiconductor components may be more easily accomplished than using conventional methods without adversely affecting the semiconductor components.
[0019] The portion formed by breaking the fragile connection portion may have a rougher surface than other portions of the encapsulation body.
[0020] The portion formed by breaking the frangible connection may include a broken frangible tab protruding from a non-lead bearing side of the encapsulation.
[0021] The portion formed by breaking the frangible connection may include a broken frangible tab that is generally flush with the non-lead bearing side of the encapsulation.
[0022] The upper non-lead bearing side of the encapsulation may include an inwardly tapered upper side.
[0023] Optional and / or preferred features described herein for each aspect of the invention also apply to any other aspect of the invention (where applicable). BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which:
[0025] Figures 1 to 8 Schematically depicts a process for forming a semiconductor component according to an embodiment of the present invention;
[0026] Fig. 9A and Fig. 9B A semiconductor component according to an embodiment of the present invention is schematically depicted;
[0027] FIG. 10A to FIG. 10C Schematically depicting a process for separating semiconductor components according to an embodiment of the present invention Fig.11A and Fig. 11B schematically depicts a semiconductor component according to an alternative embodiment of the present invention;
[0028] FIG. 12A to FIG. 12C schematically illustrates a semiconductor device according to another embodiment of the present invention; and
[0029] FIG. 13A to FIG. 13D A process of separating semiconductor components according to yet another embodiment of the present invention is schematically depicted. DETAILED DESCRIPTION
[0030] Figures 1 to 8 The process of forming a semiconductor component according to an embodiment of the present invention is schematically depicted. Each figure depicts the process viewed from above and from a cross-section.
[0031] Figure 1 1 and 2. A lead frame 2 is shown in FIG. 2. The lead frame 2 is formed of a metal such as copper. The lead frame 2 comprises a first bar 4 and a second bar 6 connected by a connecting bar 8 extending between the bars. A die pad 10 is connected to the connecting bar via leads 12 extending from the die pad 10 to the connecting bar 8. Additional leads 14 extend from the connecting bar 8. The additional leads 14 extend towards the die pad 10 but do not reach the die pad (there is a gap between the additional leads and the die pad).
[0032] refer to Figure 2 , a die 16 (which may be, for example, a MOSFET) is bonded to each die pad 10. The die 16 may be attached to the die pad 10 using, for example, solder.
[0033] refer to Figure 3 , a wire or clip 18 is bonded to the upper surface of each die 16, and the wire or clip is connected to the corresponding additional lead 14. In this way, the lead 12 is connected to one side of the die 16, and the additional lead 14 is connected to the opposite side of the die.
[0034] refer to Figure 4 An encapsulation 20 (which may be referred to as a shell) is formed around the die 16, the die pad 10, a portion of the lead 12, and the additional lead 14. The encapsulation 20 may be formed, for example, using injection molding. The encapsulation may be, for example, a polymer. The encapsulation 20 extends between the first rod 4 and the second rod 6. Each encapsulation encapsulates a plurality of dies. In the illustrated example, each encapsulation 20 encapsulates four dies 16 and associated components.
[0035] refer to Figure 5 , tin (Sn) plating is applied to the exposed portions of the lead frame 2, the leads 12 and the additional leads 14. The tin plating is solderable and thus facilitates the subsequent connection of the semiconductor assembly with other electronic components.
[0036] refer to Figure 6 , a cut is made midway through the encapsulation 20 (e.g., using a saw). The cut forms a groove 21 in the encapsulation 20. The groove 21 formed in the encapsulation generally extends parallel to the first rod 4 and the second rod 6. The groove 21 generally extends parallel to the lead 12 and the additional lead 14. The encapsulation material located below the groove 21 can be referred to as a tab 22. The encapsulation material located below the groove 21 is fragile. Therefore, the tab 22 can be referred to as a fragile tab.
[0037] refer to Figure 7 , a punch (not shown) is used to punch out the connecting bars 8 of the lead frame 2 , and optionally parts of the leads 12 and the additional leads 14 .
[0038] refer to Figure 8 , and then the semiconductor components 24 are singulated using a punch. In other words, the semiconductor components 24 are separated from each other using a punch. The punch is pressed against the tabs 22 of the package 20 that connect the semiconductor components. This causes the tabs 22 to break, thereby separating the semiconductor components 24. The use of the punch will be described in more detail below. .
[0039] Reference again Figure 6 , the groove 21 formed in the encapsulation 20 makes the remaining thickness of the encapsulation 20 thin enough and fragile. In other words, the tab 22 of the encapsulation is fragile. Therefore, the groove 21 has a sufficient depth so that when the punch is pressed against the semiconductor component 24, the encapsulation 20 of each semiconductor component will be separated from each other. The encapsulations are separated from each other along the line corresponding to the position of the groove 21. The encapsulations are separated from each other in a manner that does not damage the encapsulation 20 (for example, without exposing a portion of the tube core 16). This also applies to other embodiments.
[0040] The semiconductor device 124 formed according to the embodiment of the present invention is as follows Fig. 9A and Fig. 9B drawn. Fig. 9A The semiconductor device 124 is shown in a perspective view, and Fig. 9B The semiconductor component is shown viewed from one end. It can be seen that the semiconductor component 124 includes an encapsulation 120 from which extend a first lead 112 and a second lead 114. Other components of the semiconductor component, such as the die, are not visible. Fig. 9B A clear view of the shape of the non-lead bearing side 130 of the encapsulation 120 (ie, the side from which the leads 112 , 114 do not extend) is provided.
[0041] refer to Fig. 9B , the side 130 of the encapsulation 120 includes an upper portion 131 that tapers inwardly toward an upper surface 132 of the encapsulation. The upper surface 132 of the encapsulation 120 is flat. The side 130 of the encapsulation also includes a non-tapered lower portion 134 (vertical when the semiconductor component 124 has the illustrated orientation). Therefore, the encapsulation 120 includes a vertical lower side 134 connected to the inwardly tapered upper side 131. The lower surface 136 of the encapsulation 120 is flat. At least a portion of the lower surface of the first lead 112 and the second lead 114 can remain exposed and not covered by the encapsulation 120.
[0042] Combined with reference Figure 6 9, the upper portion 138 of the vertical side 134 of the encapsulation body 120 is formed by cutting the encapsulation body 120 (for example, using a saw). Therefore, the upper portion 138 of the vertical side 134 shown in FIG. 9 each includes one side of the groove 21 formed using a saw (see Figure 6 ). The lower portion 140 of the vertical side has not been cut using a saw. Instead, this lower portion 140 has been formed by pressing against the enclosure 120 to cause the enclosure 120 to break away from an adjacent enclosure (not shown). Therefore, the cutting of the upper portion 138 of the vertical side 134 leaves a fragile residual connection between adjacent enclosures 120. The fragile connection (which may be referred to as a fragile tab) is broken by pressing against the enclosure (for example, using a punch or other device designed to break away from the enclosure). It is this breaking of the fragile connection that provides the lower portion 140 of the vertical side 131. The lower portion 140 of the vertical side may include an irregular surface because it is formed by breaking the fragile connection, rather than by cutting. In other words, the lower portion 140 of the vertical side may have a rougher surface than the upper portion 138 of the vertical side.
[0043] FIG. 10A to FIG. 10C Schematically depicting the Fig. 9A and Fig. 9B The semiconductor device shown in FIG. Figures 5 to 8 steps.
[0044] exist Fig. 10A In FIG. 1 , an encapsulation 120 has been provided above two semiconductor components 124. The encapsulation comprises an inwardly tapering upper side 131. Below the inwardly tapering upper side 131, the encapsulation 120 extends as a tab 123 between the semiconductor components.
[0045] exist Fig. 10B , portions of the tab are cut (e.g., using a saw) to form a groove 121 between the two semiconductor components 124. This provides a non-tapered lower portion 134 for the side 130 of the package (vertical when the semiconductor components 124 have the orientation shown). The fragile tab 122 remains. The fragile tab 122 connects the semiconductor components 124.
[0046] exist Fig. 10C In the embodiment of the present invention, a punch 150 is used to separate semiconductor components 124 by breaking off the fragile tabs 122. A support 152 is provided on the side of the semiconductor components 124 opposite to the punch 150. The support 152 may be laterally away from the punch 150. When the punch is pressed against the fragile tabs 122, this causes the fragile tabs to bend until the fragile tabs break off (as shown). The semiconductor components 124 are thereby separated from each other. This separation may be referred to as singulation.
[0047] Fig.11A and Fig. 11B An alternative embodiment of a semiconductor component 224 is depicted. In the alternative embodiment, an encapsulation 220 is again provided, from which first and second leads extend. In the figure, only the first wiring 212 is visible. Fig. 9A and Fig. 9B Similar to the embodiment shown in FIG. 1 , the encapsulation body 220 includes a non-lead bearing side 230. The non-lead bearing side 230 includes a vertical lower side 234 connected to an inwardly tapered upper side 231. A rounded edge 250 connects the inwardly tapered upper side 231 to an upper surface 232 of the encapsulation body 220.
[0048] The upper portion 238 of the vertical side 234 is formed by cutting (eg, using a saw) the encapsulation body 220. The upper portion 238 of the vertical side 234 includes one side of the groove 21 formed by the cutting (see FIG. Figure 6 ). The lower portion 240 of the vertical side 234 has not yet been cut using a saw, but is fragile and has been formed by pressing against the enclosure 220 so that the enclosure 220 is separated from an adjacent enclosure (not shown).
[0049] The enclosure also includes a rounded edge 252 that connects the lower surface 236 to the lower portion 240 of the vertical side 234. The rounded edge 252 can reduce the thickness of the fragile connection between the enclosure 220 and the adjacent enclosure (compared to the thickness that would exist if the edge did not have rounded corners). The rounded edge can also help guide the break of the enclosure so that the break does not, for example, extend across the body of the enclosure.
[0050] In alternative embodiments (not shown), the edge of the lower portion 240 (fragile portion) connecting the lower surface 236 of the enclosure 220 to the vertical side may be chamfered or have other forms including upwardly extending parts.
[0051] FIG. 12A to FIG. 12C A semiconductor device 324 is shown according to yet another alternative embodiment of the present invention. FIG. 11A to FIG. 11B , the encapsulation body 320 and the gull-wing leads 312, 314 are shown. The gull-wing leads 312, 314 extend upward from the middle of the encapsulation body 320, rather than extending at the bottom of the encapsulation body (as shown in FIG. Fig. 9A , Fig. 9B and Fig.11A , Fig. 11B ). The gull-wing leads 312, 314 include a bend rather than being straight.
[0052] The package 320 has a non-lead bearing side 330. The non-lead bearing side 330 includes an upper side 331 that tapers inwardly. The lower side 334 of the package 320 includes a generally vertical lower portion 360. The upper portion of the lower side 334 includes a disconnected fragile tab 322. Fig. 12A As shown, the broken frangible tab 322 can protrude from the side 330 of the enclosure 320. In other embodiments, the broken frangible tab can be substantially flush with the side 330 of the enclosure.
[0053] FIG. 13A to FIG. 13D Schematically depicting the FIG. 11A to FIG. 11B The semiconductor device shown in FIG. Figures 5 to 8 steps.
[0054] exist Fig.13A In FIG. 3 , an encapsulation 320 has been provided above two semiconductor components 324. The encapsulation comprises an inwardly tapering upper side 324. Below the inwardly tapering upper side 324, the encapsulation 320 extends as a tab 323 between the semiconductor components.
[0055] exist Fig. 13B3, portions of the tab 323 are cut (e.g., using a saw) to form a groove 321 between the two semiconductor components 324. The cut is provided from below the semiconductor components 324. The cut provides a generally vertical lower portion 334 for the side 330 of the package (i.e., vertical when the semiconductor components 324 have the orientation shown). The fragile tab 322 remains. The fragile tab 322 connects the semiconductor components 324.
[0056] exist Fig. 13C In the embodiment of the present invention, the leads 312, 314 of the semiconductor component 324 are bent into a desired shape. The step is optional. It can be performed at different points in the process. As another option, if straight leads are desired, the step can be omitted.
[0057] exist Fig.13D In the embodiment of the present invention, a punch 350 is used to separate semiconductor components 324 by breaking off the fragile tabs 322. A support 352 is provided on the side of the semiconductor components 324 opposite to the punch 350. The support 352 may be laterally away from the punch 350. When the punch is pressed against the fragile tabs 322, this causes the fragile tabs to bend until the fragile tabs break off (as shown). The semiconductor components 324 are thereby separated from each other.
[0058] The enclosure 120, 220, 320 may be a polymer. The enclosure 120, 220, 320 may be injection molded. This allows the enclosure to have any desired shape without incurring significant additional cost.
[0059] Some embodiments of the present invention are described as including rounded edges. Generally, any form of edge may be provided, such as a curved edge, a chamfered edge, a sharp edge, etc.
[0060] Embodiments of the present invention include fragile connections (also referred to as fragile tabs) between adjacent packages. A fragile connection may be considered to be a connection that is configured to break when a force is applied to one or more adjacent packages. Being configured to break may be interpreted to mean that the packages will be disconnected from each other without exposing the die or other internal parts of the semiconductor component. Being configured to break may be interpreted to mean that the disconnection between the packages follows a predetermined path (e.g., along the path of the sawed groove). Breaking is a form of disconnection. Breaking may be considered to mean a disconnection that occurs substantially simultaneously along and through the connection. This is in contrast to cutting, for example, where cutting may start at one end of a connection and then proceed along the connection.
[0061] The thickness of the fragile tab 22, 222, 322 is about 0.2 mm. The thickness of the fragile tab 22, 222, 322 is, for example, at least 0.05 mm. Fragile tabs with a thickness of less than 0.05 mm are not strong enough to reliably secure the semiconductor components together before desired singulation. The thickness of the fragile tab 22, 222, 322 may be, for example, up to 0.3 mm. Tabs with a thickness greater than 0.3 mm may not be reliably fragile (i.e., it may be difficult to break thicker tabs, and thicker tabs may not be able to break in some cases).
[0062] In the described embodiment, a cutting step is used to reduce the thickness of the encapsulation connection between adjacent semiconductor components. Cutting can be performed from above or below the semiconductor components.
[0063] In other embodiments, no sawing step is required.For example, the encapsulation may be formed with fragile encapsulation connections between adjacent semiconductor components (eg, through tapered sides of adjacent encapsulations).
[0064] In a semiconductor component manufactured according to an embodiment of the present invention, the surface of the non-lead bearing side may include a relatively smooth portion (e.g., formed by molding or cutting) and a relatively rough portion formed by breaking the fragile connection portion. The relatively rough portion may protrude from the wall of the semiconductor component, or may be substantially flush with the wall of the semiconductor component.
[0065] The embodiments described above illustrate the breaking of a frangible connection between semiconductor components. A frangible connection between a semiconductor component and a lead frame can be broken in a corresponding manner.
Claims
1. A method for manufacturing a semiconductor component, the method comprising: forming an array of semiconductor components, the semiconductor components including an encapsulation having fragile connections between adjacent semiconductor components; as well as A force is applied to the semiconductor component to disconnect the fragile connection and thereby singulate the semiconductor component.
2. The method of claim 1, wherein the encapsulation is formed without a frangible connection, and wherein cutting is used to cut into the encapsulation and thereby form the frangible connection. The method of claim 2 , wherein the cutting is performed from above the semiconductor component. The method according to claim 1 , wherein the encapsulation body is formed to have a frangible connection.
5. A method according to any preceding claim, wherein the frangible connection is a tab having a thickness of at least 0.1 mm.
6. A method according to any preceding claim, wherein the frangible connection is a tab having a thickness of up to 3 mm.
7. A method according to any preceding claim, wherein a mould is used to form the enclosure.
8. A method according to any preceding claim, wherein the non-lead bearing side of the encapsulation comprises an inwardly tapered upper side.
9. A method according to any preceding claim, wherein the lower surface of the encapsulation is connected to the non-lead bearing side of the encapsulation by a bent edge or a chamfered edge.
10. A method according to any preceding claim, wherein the non-lead bearing side of the encapsulation comprises a vertical side extending from the frangible connection.
11. A semiconductor component comprising a die secured in an encapsulation with leads extending out of the encapsulation, wherein a non-lead bearing side of the encapsulation includes a portion that has been formed by breaking a frangible connection. 12 . The semiconductor component according to claim 11 , wherein the portion formed by disconnecting the fragile connection has a surface rougher than other portions of the encapsulation body.
13. A semiconductor component as claimed in claim 11 or claim 12, wherein the portion formed by breaking the frangible connection comprises a broken frangible tab protruding from a non-lead bearing side of the encapsulation.
14. A semiconductor component as claimed in claim 11 or claim 12, wherein the portion formed by breaking the frangible connection comprises a broken frangible tab which is generally flush with a non-lead bearing side of the encapsulation.
15. The semiconductor component of any one of claims 11 to 14, wherein the upper non-lead bearing side of the encapsulation comprises an inwardly tapered upper side.