Radiating system and annular radiator

Abstract

A heat dissipation system comprises an annular radiator and two flow guide baffles. Each flow guide baffle is provided with a connecting end and a free end which are opposite to each other; the connecting ends of the two flow guide baffles are connected with the annular radiator. The two flow guide baffles and the annular radiator surround a heat source area. The heat source region has a lateral opening. The lateral opening is formed by the free ends of the two flow guide baffles, and the lateral opening and the annular radiator are located on the two sides of the heat source area respectively.

Description

Technical Field

[0001] The present invention relates to a heat dissipation system, in particular to a heat dissipation system and an annular radiator. Background Art

[0002] As technology advances, the central processing unit (CPU) on the circuit board module is becoming more and more advanced, and the performance of the CPU is improved, so the heat that needs to be solved is also increasing.

[0003] Generally speaking, a heat sink is installed near the main heat generating components in the circuit board module, and the heat dissipation efficiency of the heat sink is proportional to its volume. Specifically, the heat sink generally increases the heat dissipation area by increasing the number of fins of the heat sink, so as to improve the heat dissipation efficiency. In order to maintain the air flow channel between two adjacent heat sink fins, the volume of the heat sink will increase as the number of fins increases. However, with the development of high performance and multi-functionality of electronic devices, the heat generating components (such as CPU) on the circuit board module will generate higher heat due to performance improvement, but the space that the circuit board module can provide for component installation will not increase accordingly, so that it is difficult to improve the heat dissipation efficiency by expanding the volume of the heat sink, thereby removing higher heat.

[0004] In order to improve the heat dissipation efficiency of the radiator under limited installation space, the airflow channel between two adjacent heat dissipation fins must be reduced to install more heat dissipation fins. In other words, under limited space, increasing the number of heat dissipation fins will increase the heat dissipation area but will produce a larger flow resistance. Conversely, reducing the number of heat dissipation fins will reduce the flow resistance but will also reduce the heat dissipation area. Therefore, when the heat dissipation area and flow resistance change in opposite directions, it is difficult to determine whether the heat dissipation efficiency of the radiator is improved or reduced. Therefore, under limited installation space, some radiators can only increase the heat dissipation area by using heat dissipation fins that extend in a curve (from a top-down perspective), thereby reducing the reduction in the width of the air duct and greatly affecting the flow resistance. Summary of the invention

[0005] However, if the heat sink fins of these heat sinks are viewed from the side, they are still extended in straight lines rather than curves. In other words, the air duct paths of these heat sink fins, which are extended in curves when viewed from the top, remain unchanged when perpendicular to the circuit board module. When the air duct path remains unchanged, the flow rate also remains roughly unchanged, so the heat dissipation efficiency that can be improved is limited.

[0006] In view of this, the present invention provides a heat dissipation system and an annular heat sink to solve the problem of insufficient heat dissipation efficiency caused by the improvement of the performance of the heating element, thereby more efficiently increasing the heat dissipation efficiency and / or specifically increasing the heat dissipation efficiency for a specific heat source while keeping the overall appearance size roughly unchanged.

[0007] In some embodiments, a heat dissipation system includes an annular heat sink and two guide baffles. Each guide baffle has a connection end and a free end opposite to each other, wherein the connection ends of the two guide baffles are connected to the annular heat sink. The two guide baffles and the annular heat sink surround a heat source area. The heat source area has a lateral opening. The lateral opening is formed by the free ends of the two guide baffles, and is located on both sides of the heat source area with the annular heat sink.

[0008] In some embodiments, the annular heat sink includes a heat-conducting body, a plurality of heat-dissipating fins, and a plurality of heat-conducting branches. The plurality of heat-dissipating fins and the plurality of heat-conducting branches are radially arranged and connected to the peripheral side surface of the heat-conducting body. Each heat-conducting branch has a first end and a second end opposite to each other, the first end of each heat-conducting branch is connected to the peripheral side surface of the heat-conducting body, and the connecting ends of the two guide baffles are respectively connected to the second ends of two heat-conducting branches among the plurality of heat-conducting branches.

[0009] In some embodiments, the annular heat sink includes a heat-conducting body, a plurality of heat-dissipating fins, and a plurality of heat-conducting branches. The plurality of heat-dissipating fins and the plurality of heat-conducting branches are radially arranged and connected to the peripheral side surface of the heat-conducting body. Each heat-conducting branch has a first end and a second end opposite to each other, the first end of each heat-conducting branch is connected to the peripheral side surface of the heat-conducting body, and the connecting ends of the two guide baffles are respectively connected to the second ends of two heat-conducting branches among the plurality of heat-conducting branches.

[0010] In some embodiments, the first ends of the two heat-conducting branches respectively connected to the connecting ends of the two guide baffles are respectively connected to the opposite sides of the heat-conducting body.

[0011] In some embodiments, the plurality of heat dissipation fins are divided into a first fin group and a second fin group by a line connecting the connection ends of the two guide baffles. The first fin group is adjacent to the heat source area, and the total heat dissipation area of ​​the first fin group is smaller than the total heat dissipation area of ​​the second fin group.

[0012] In some embodiments, a gap between any two adjacent heat dissipation fins in the first fin group is greater than a gap between any two adjacent heat dissipation fins in the second fin group.

[0013] In some embodiments, the connection ends of the two guide baffles are respectively connected to opposite sides of the annular heat sink, and the number of fins in the first fin group is less than the number of fins in the second fin group.

[0014] In some embodiments, a gap between any two adjacent heat dissipation fins in the first fin group is greater than a gap between any two adjacent heat dissipation fins in the second fin group.

[0015] In some embodiments, the connection ends of the two guide baffles are respectively connected to opposite sides of the annular heat sink, and the number of fins in the first fin group is less than the number of fins in the second fin group.

[0016] In some embodiments, the fin length of the first fin group is smaller than the fin length of the second fin group.

[0017] In some embodiments, the total heat dissipation area of ​​the first fin group is less than or equal to 80% of the total heat dissipation area of ​​the second fin group.

[0018] In some embodiments, the plurality of heat sink fins are divided into a first fin group and a second fin group by two guide baffles. The first fin group is adjacent to the heat source area. The gap between any two adjacent heat sink fins in the first fin group is greater than the gap between any two adjacent heat sink fins in the second fin group, and the fin length of the first fin group is greater than the fin length of the second fin group.

[0019] In some embodiments, the fin height of the aforementioned plurality of heat dissipation fins is smaller than the baffle height of the guide baffle.

[0020] In some embodiments, the distance between the guide baffle and the circuit board is greater than or equal to 0 mm and less than or equal to 0.5 mm.

[0021] In some embodiments, the difference between the height of the plurality of heat dissipating fins and the height of the heat conducting body is greater than or equal to 0 mm.

[0022] In some embodiments, an annular heat sink includes a heat-conducting body and a plurality of heat-dissipating fins. The plurality of heat-dissipating fins are radially arranged and connected to the peripheral side surface of the heat-conducting body. The plurality of heat-dissipating fins are divided into a first fin group and a second fin group, and the gap between any two adjacent heat-dissipating fins in the first fin group is greater than the gap between any two adjacent heat-dissipating fins in the second fin group.

[0023] In some embodiments, the number of fins in the first fin group is less than the number of fins in the second fin group.

[0024] In some embodiments, the fin length of each heat dissipation fin in the first fin group is equal to the fin length of each heat dissipation fin in the second fin group.

[0025] In some embodiments, the plurality of heat dissipation fins are divided into the first fin group and the second fin group by an extension line that is vertical and passes through the heat-conducting body.

[0026] In some embodiments, the aforementioned annular heat sink is sandwiched between the fan and the circuit board, and a plurality of heating elements are provided on the circuit board in the aforementioned heat source area.

[0027] In summary, the annular heat sink and the heat dissipation system in any embodiment can provide higher heat dissipation efficiency without increasing the overall size of the heat sink. In some embodiments, the annular heat sink is sandwiched between the fan and the circuit board, which can provide flow field control to effectively guide the flow field to the heat source area, thereby providing more efficient heat dissipation efficiency. In some embodiments, the annular heat sink can be applied to the circuit board, and it can provide low flow resistance heat dissipation fins adjacent to the heat source area, so that the flow of the guide element (i.e., the air flow channel between two adjacent heat dissipation fins) becomes larger, thereby providing more efficient heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a top view of a heat dissipation system according to one embodiment;

[0029] Figure 2 is a partial schematic diagram of a circuit board module according to an embodiment;

[0030] Figure 3 yes Figure 2 A three-dimensional exploded view of the circuit board module in FIG.

[0031] Figure 4 yes Figure 2 A three-dimensional schematic diagram of the heat dissipation system in FIG.

[0032] Figure 5 is a partial schematic diagram of a circuit board module of a first example in a top view;

[0033] Figure 6 is a partial schematic diagram of a circuit board module of a second example in a top view;

[0034] Figure 7 is a partial schematic diagram of a circuit board module of a third example in a top view;

[0035] Figure 8 is a partial schematic diagram of a circuit board module of a fourth example in a top view;

[0036] Fig. 9 is a partial schematic diagram of a circuit board module of a fifth example in a top view;

[0037] Fig.10 is a partial schematic diagram of a circuit board module of a sixth example in a top view;

[0038] Fig.11 is a partial schematic diagram of a circuit board module of a seventh example in a top view; and

[0039] Fig.12 1 is a partial schematic diagram of the circuit board module of the eighth example viewed from above. DETAILED DESCRIPTION

[0040] It should be noted that the terms “first” and “second” are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0041] Moreover, in this article, a "free end" of an element refers to the end of the element that is not connected to other elements (from a top view), and a "connected end" of an element refers to the end of the element that is physically connected to other elements (from a top view).

[0042] See also Figure 1 The heat dissipation system 1 includes an annular radiator 100 and two guide baffles 200. Each guide baffle 200 has a connecting end 201 and a free end 202, and the connecting end 201 and the free end 202 are opposite to each other. The connecting ends 201 of the two guide baffles 200 are connected to the annular radiator 100. The two guide baffles 200 and the annular radiator 100 surround the heat source area 600, and the heat source area 600 has a lateral opening 670. The lateral opening 670 is formed by the free ends 202 of the two guide baffles 200, and is located on both sides of the heat source area 600 together with the annular radiator 100.

[0043] In some embodiments, the guide baffle 200 and the annular heat sink 100 are independent components, and the connecting end 201 of the guide baffle 200 is connected to the annular heat sink 100 by welding, pasting, snapping, locking or riveting. Figure 1 In other embodiments, the baffle plate 200 and the annular heat sink 100 are integrally formed as a single component, such as Figure 3 In other words, from a top view, the baffle plate 200 is a plate body that protrudes outward from the annular heat sink 100 and extends a predetermined distance. For example, the baffle plate 200 and the annular heat sink 100 are heat dissipation elements formed by an aluminum extrusion die.

[0044] In some embodiments, the guide baffle 200 and the annular heat sink 100 are made of a metal with high thermal conductivity. For example, the guide baffle 200 and the annular heat sink 100 may be made of, but not limited to, aluminum.

[0045] In some embodiments, the guide baffle 200 may be, but is not limited to, a rectangular parallelepiped, a plate having one or more bends, or a plate having a curved arc.

[0046] In some embodiments, the annular heat sink 100 includes a heat-conducting body 10, a plurality of heat-dissipating fins 20, and a plurality of heat-conducting branches 300. The plurality of heat-dissipating fins 20 and the plurality of heat-conducting branches 300 are radially arranged and connected to the peripheral side surface of the heat-conducting body 10. Each heat-conducting branch 300 is located between any two adjacent heat-dissipating fins 20, and has a first end 301 and a second end 302 opposite to each other (from a top view). The first end 301 of each heat-conducting branch 300 is connected to the peripheral side surface of the heat-conducting body 10, and the connecting ends 201 of the two guide baffles 200 are respectively connected to the second ends 302 of two heat-conducting branches 300 among the plurality of heat-conducting branches 300.

[0047] In some embodiments, the two heat-conducting branches 300 connecting the two flow-guiding baffles 200 may be respectively connected to two non-opposite sides of the heat-conducting body 10 .

[0048] In other embodiments, the two heat-conducting branches 300 connecting the two guide baffles 200 may also be connected to opposite sides of the annular heat sink 100. Specifically, the first ends 301 of the two heat-conducting branches 300 connecting the two guide baffles 200 are connected to opposite sides of the heat-conducting body 10, such as Figure 1 In other words, the line connecting the first ends 301 of the two heat-conducting branches 300 passes through the axis of the heat-conducting body 10 .

[0049] In some embodiments, the number of heat-conducting branches 300 may be an even number, and two of them are connected to opposite sides of the heat-conducting body 10. For example, assuming that the annular heat sink 100 has four heat-conducting branches 300, the four heat-conducting branches 300 can be connected to the heat-conducting body 10 in a cross-shaped configuration.

[0050] In some embodiments, the second ends 302 of the plurality of heat-conducting branches 300 can also be configured to provide fastening elements to fix the heat-conducting branches 300 with other elements. For example, the fastening elements can be screws, snap-fit ​​columns, snap hooks, or rivets.

[0051] In some embodiments, the heat sink fins 20, the heat conducting branches 300 and the heat conducting body 10 are independent components, and the heat sink fins 20 and the heat conducting branches 300 are connected to the heat conducting body 10 by welding, pasting, snapping, locking or riveting (not shown). In other embodiments, the heat sink fins 20, the heat conducting branches 300 and the heat conducting body 10 are a single component formed integrally, such as Figure 1As shown. In other words, from a top view, the heat sink fins 20 and the heat-conducting branches 300 are sheet structures that protrude outward from the heat-conducting body 10 and extend a predetermined distance. For example, the heat sink fins 20, the heat-conducting branches 300 and the heat-conducting body 10 are heat-dissipating elements formed by an aluminum extrusion die. In some other embodiments, the heat-conducting branches 300 and the heat-conducting body 10 are a single component formed in one piece. The heat sink fins 20 are independent components of the heat-conducting body 10, but are connected to the heat-conducting body 10 by welding, gluing, snapping, locking or riveting (not shown). In some other embodiments, the heat sink fins 20 and the heat-conducting body 10 are a single component formed in one piece. The heat-conducting branches 300 are independent components of the heat-conducting body 10, but are connected to the heat-conducting body 10 by welding, gluing, snapping, locking or riveting (not shown).

[0052] In some embodiments, the baffle plate 200 and the heat conducting branch 300 are independent components, and the baffle plate 200 is connected to the second end 302 of the heat conducting branch 300 by welding, pasting, snapping, locking or riveting. Figure 1 In other embodiments, the flow guide baffle 200 and the heat conduction branch 300 may also be a single component formed in one piece, such as Figure 3 and Figure 4 In other words, from a top view, the baffle plate 200 is a plate body that protrudes outward from the second end 302 of the heat-conducting branch 300 and extends a predetermined distance. For example, the baffle plate 200 and the heat-conducting branch 300 are heat-dissipating elements formed by an aluminum extrusion die.

[0053] Reference Figure 4 To clearly present the design of the cooling system 1, Figure 4 The fan 500 is omitted. In some embodiments, from a side view, the fin height h2 of the heat dissipation fin 20 is less than the baffle height h1 of the guide baffle 200. In other words, the absolute distance between the upper edge and the lower edge of the heat dissipation fin 20 is less than the absolute distance between the upper edge and the lower edge of the guide baffle 200.

[0054] In some embodiments, reference back Figure 1 , each guide baffle 200 has a baffle length L0, L0' extending from the connection end 201 to the free end 202. Each heat sink fin 20 has a fin length L1, L2, that is, the absolute distance from the side surface of the heat-conducting body 10 to the end of the heat sink fin 20. Here, the baffle length L0, L0' of the guide baffle 200 is greater than or equal to the fin length L1, L2 of the heat sink fin 20.

[0055] In some embodiments, the branch length of each heat-conducting branch 300 may be greater than the fin length L1, L2 of the heat-dissipating fin 20. That is, from a top view, the heat-conducting branch 300 will protrude from the end of the heat-dissipating fin 20. Here, the branch length refers to the absolute distance from the side surface of the heat-conducting body 10 to the second end 302 (end) of the heat-conducting branch 300. In some embodiments, the second end 302 of each heat-conducting branch 300 completely protrudes from the end of the heat-dissipating fin 20. Specifically, the second end 302 of each heat-conducting branch 300 is located on the other side of the line connecting the ends of two heat-dissipating fins 20 adjacent to the heat-conducting branch 300 relative to the heat-conducting body 10.

[0056] See also Figure 1 In some embodiments, the plurality of heat dissipation fins 20 are divided into a first fin group 21 and a second fin group 22 by a line connecting the connection ends 201 of the two guide baffles 200. The first fin group 21 is adjacent to the heat source area 600, and the total heat dissipation area of ​​the first fin group 21 is smaller than the total heat dissipation area of ​​the second fin group 22.

[0057] In some embodiments, when two guide baffles 200 connected to two guide baffles 200 are respectively connected to opposite sides of the heat-conducting body 10, the plurality of heat-dissipating fins 20 are divided into two groups by an extension line LL (straight line) perpendicular to and passing through the axis of the heat-conducting body 10: a first fin group 21 and a second fin group 22. Specifically, the annular heat sink 100 is divided into two blocks by an extension line LL passing through the connection end 201 of the two guide baffles 200 and the axis of the heat-conducting body 10, such as Figure 1 As shown. In the following, the two blocks located on the left are referred to as the left block, and the blocks located on the right are referred to as the right block. The heat dissipation fins 20 located in the left half block among the multiple heat dissipation fins 20 belong to the first fin group 21, and the heat dissipation fins 20 located in the right half block among the multiple heat dissipation fins 20 belong to the second fin group 22. In some embodiments, the extension line LL overlaps with the axis of the two heat-conducting branches 300 connecting the two guide baffles 200 and connected to the opposite sides of the heat-conducting body 10. In other words, the multiple heat dissipation fins 20 are also divided into the first fin group 21 and the second fin group 22 by the axis of the two heat-conducting branches 300 connecting the two guide baffles 200 and connected to the opposite sides of the heat-conducting body 10.

[0058] In some embodiments, when the total heat dissipation area is different, the gap I1 between any two adjacent heat dissipation fins 20 in the first fin group 21 is greater than the gap I2 between any two adjacent heat dissipation fins 20 in the second fin group 22. Figure 1 Here, the gaps I1 and I2 refer to the shortest distances between any two adjacent heat sink fins 20 and the connection points of the heat conducting body 10 .

[0059] In some embodiments, when the total heat dissipation area is different, the number of fins of the first fin group 21 (i.e., the total number of heat dissipation fins 20 in the first fin group 21) may be less than the number of fins of the second fin group 22 (i.e., the total number of heat dissipation fins 20 in the second fin group 22). For example, the number of fins of the second fin group 22 is 30 pieces (PCS), while the number of fins of the first fin group 21 is 10 to 22 pieces. In some examples, the number of fins of the second fin group 22 is 30 pieces, and the number of fins of the first fin group 21 is 10, 16, or 22 pieces.

[0060] In some embodiments, when the gaps I1 and I2 between the heat dissipation fins 20 are different and / or the number of fins is different, the fin length L1 of the first fin group 21 may be smaller than the fin length L2 of the second fin group 22. Figure 1 For example, the fin length L2 of the second fin set 22 is 27 mm, and the fin length L1 of the first fin set 21 is 13.5 mm.

[0061] In other embodiments, when the gaps I1 and I2 between the heat dissipation fins 20 are different and / or the number of fins is different, the fin length L1 of the first fin group 21 may be the same as the fin length L2 of the second fin group 22. Figure 8 For example, the fin lengths L1 and L2 of the first fin set 21 and the second fin set 22 are both 27 mm.

[0062] In some other embodiments, when the gaps I1 and I2 between the heat dissipation fins 20 are different and / or the number of fins is different, the fin length L1 of the first fin group 21 is greater than the fin length L2 of the second fin group 22. For example, the fin length L2 of the second fin group 22 is 27 mm, and the fin length L1 of the first fin group 21 is 40.5 mm.

[0063] For example, in the first embodiment, the gap I1 between any two adjacent heat dissipation fins 20 in the first fin group 21 is greater than the gap I2 between any two adjacent heat dissipation fins 20 in the second fin group 22, the number of fins in the first fin group 21 is less than the number of fins in the second fin group 22, and the fin length L1 of the first fin group 21 is less than the fin length L2 of the second fin group 22, such as Figure 1 and Fig.11 shown.

[0064] In the second embodiment, only the fin length L1 of the first fin group 21 is smaller than the fin length L2 of the second fin group 22, and the gap I1 between any two adjacent cooling fins 20 in the first fin group 21 is the same as the gap I2 between any two adjacent cooling fins 20 in the second fin group 22, and the number of fins in the first fin group 21 is the same as the number of fins in the second fin group 22 (not shown).

[0065] In the third embodiment, the gap I1 between any two adjacent heat dissipation fins 20 in the first fin group 21 is greater than the gap I2 between any two adjacent heat dissipation fins 20 in the second fin group 22, and the number of fins in the first fin group 21 is less than the number of fins in the second fin group 22, but the fin length L1 of the first fin group 21 is the same as the fin length L2 of the second fin group 22, such as Figures 8 to 10 shown.

[0066] In the fourth embodiment, the gap I1 between any two adjacent heat dissipation fins 20 in the first fin group 21 is greater than the gap I2 between any two adjacent heat dissipation fins 20 in the second fin group 22, the number of fins in the first fin group 21 is less than the number of fins in the second fin group 22, and the fin length L1 of the first fin group 21 is greater than the fin length L2 of the second fin group 22, such as Fig.12 shown.

[0067] In the fifth embodiment, only the fin length L1 of the first fin group 21 is greater than the fin length L2 of the second fin group 22, and the gap I1 between any two adjacent cooling fins 20 in the first fin group 21 is the same as the gap I2 between any two adjacent cooling fins 20 in the second fin group 22, and the number of fins in the first fin group 21 is the same as the number of fins in the second fin group 22 (not shown).

[0068] In some embodiments, the total heat dissipation area of ​​the first fin set 21 is less than or equal to 80% of the total heat dissipation area of ​​the second fin set 22 .

[0069] In one example, the total heat dissipation area may refer to the sum of the surface areas of all heat dissipation fins 20 in the fin group. Specifically, the sum of the surface areas of all heat dissipation fins 20 in the first fin group 21 is less than or equal to 80% of the sum of the surface areas of all heat dissipation fins 20 in the second fin group 22.

[0070] In another example, the total heat dissipation area may refer to the sum of the distribution areas occupied by all the heat dissipation fins 20 of the fin group from a top view. Specifically, the sum of the distribution areas occupied by all the heat dissipation fins 20 in the first fin group 21 in the heat source area 600 (i.e., the area distributed in the heat source area 600) is less than or equal to 80% of the sum of the distribution areas occupied by all the heat dissipation fins 20 in the second fin group 22 in the non-heat source area (i.e., the area distributed in the non-heat source area).

[0071] See also Figures 2 to 4 . The heat dissipation system 1 of any of the aforementioned embodiments can be applied to the circuit board module 2. In other words, the circuit board module 2 includes a circuit board 400, a heat dissipation system 1 having an annular heat sink 100 and two guide baffles 200 of any of the aforementioned embodiments, a fan 500, and a plurality of heating elements 650. Moreover, the annular heat sink 100 of the heat dissipation system 1 is sandwiched between the fan 500 and the circuit board 400, and a plurality of heating elements 650 are provided on the circuit board 400 in the heat source area 600. Here, the structural design of the annular heat sink 100 and the two guide baffles 200 of the heat dissipation system 1 is as described above, so it will not be repeated.

[0072] The annular heat sink 100 is disposed on the circuit board 400. In some embodiments, the heat-conducting body 10 of the annular heat sink 100 is disposed on the circuit board 400, and the lower surface of the heat-conducting body 10 is attached to the surface of the circuit board 400. In some embodiments, the circuit board 400 and the second ends 302 of at least two heat-conducting branches 300 of the annular heat sink 100 can be fastened together by a fastening element so that the annular heat sink 100 is firmly fixed on the circuit board 400. For example, the fastening element can be a screw, a snap-fit ​​column, a snap hook or a rivet. Specifically, in one example, the second ends 302 of at least two heat-conducting branches 300 have a limiting hole, and the circuit board 400 has a fixing hole at a position corresponding to the second end 302 of the heat-conducting branch 300. Each screw passes through the limiting hole on the second end 302 of the heat-conducting branch 300 and is locked into the fixing hole on the circuit board 400, thereby fixing the annular heat sink 100 on the circuit board 400. In another example, the second ends 302 of at least two heat-conducting branches 300 have snap hooks, and the circuit board 400 has protruding snap posts at positions corresponding to the second ends 302 of the heat-conducting branches 300. The snap hooks of the heat-conducting branches 300 snap into the corresponding snap posts on the circuit board 400, thereby fixing the annular heat sink 100 on the circuit board 400. Figure 7 shown.

[0073] The fan 500 is electrically connected to the circuit board 400 and is disposed on the annular heat sink 100. In some embodiments, the fan 500 is assembled on the annular heat sink 100. In some embodiments, the fan 500 can be fastened together with the second ends 302 of at least two heat-conducting branches 300 of the annular heat sink 100 by fastening elements so that the fan 500 is firmly fixed on the annular heat sink 100. For example, the fastening elements can be screws, snap-fit ​​columns, snap hooks or rivets. Specifically, in one example, the second ends 302 of at least two heat-conducting branches 300 have fixing holes, and the fan 500 has limiting holes at positions corresponding to the second ends 302 of the heat-conducting branches 300. Each screw passes through the limiting holes on the fan 500 and is locked into the fixing holes on the second ends 302 of the heat-conducting branches 300, thereby fixing the fan 500 on the annular heat sink 100 (not shown). In some embodiments, the fastening element can simultaneously fasten the fan 500 and the second ends 302 of at least two heat-conducting branches 300 of the annular heat sink 100 to the circuit board 400. For example, taking screws as an example, the second ends 302 of at least two heat-conducting branches 300 have limiting holes, the position of the second ends 302 of the heat-conducting branches 300 of the fan 500 corresponding to the fan 500 also has limiting holes, and the position of the second ends 302 of the heat-conducting branches 300 of the circuit board 400 corresponding to the fan 500 has fixing holes. Each screw simultaneously passes through the limiting holes on the fan 500 and the limiting holes on the second ends 302 of the heat-conducting branches 300 in sequence and then locks into the fixing holes on the circuit board 400, thereby fixing the fan 500 and the annular heat sink 100 to the circuit board 400, as shown in FIG. Figure 3 shown.

[0074] See also Figures 1 to 3 , the heating element 650 is located in the heat source area 600 surrounded by the guide baffle 200 and the annular heat sink 100 and assembled on the circuit board 400. In other words, the guide baffle 200 and the annular heat sink 100 surround the three sides of the heating element 650. Here, since the guide baffle 200 can guide the airflow generated by the fan 500 to the lateral opening 670, the flow field can accurately guide the heating element 650 located in the heat source area 600 to dissipate heat, thereby enabling the heating element 650 to obtain a better cooling effect.

[0075] In some embodiments, each guide baffle 200 is a plate body standing above the circuit board 400 .

[0076] See also Figure 4. In some embodiments, there is a distance H1 between the lower edge of the deflector baffle 200 and the upper surface of the circuit board 400. Here, the distance H1 is greater than or equal to 0 mm and less than or equal to 0.5 mm. In other words, the difference in distance H1 between the deflector baffle 200 and the circuit board 400 is greater than or equal to 0 mm and less than or equal to 0.5 mm, so the deflector baffle 200 may or may not contact the circuit board 400. In some examples, when the difference in distance H1 between the deflector baffle 200 and the circuit board 400 is equal to 0 mm, the deflector baffle 200 will contact the circuit board 400; conversely, in other examples, the difference in distance H1 between the deflector baffle 200 and the circuit board 400 is greater than 0 mm but not greater than 0.5 mm, and the deflector baffle 200 does not contact the surface of the circuit board 400.

[0077] In some embodiments, there is a distance H2 between the lower edge of the heat dissipation fin 20 and the upper surface of the circuit board 400 , and the distance H2 is greater than the distance H1 .

[0078] Here, the connection line of the connection ends 201 of the two guide baffles 200 divides the heat dissipation fins 20 of the annular heat sink 100 into two groups: a first fin group 21 and a second fin group 22. Among them, the plurality of heat dissipation fins 20 close to the heat source area 600 are the first fin group 21, and the plurality of heat dissipation fins 20 far from the heat source area 600 are the second fin group 22.

[0079] In some embodiments, the annular heat sink 100 is divided into two blocks in a non-half manner: a left block on the left and a right block on the right. In other embodiments, the annular heat sink 100 can also be divided into two blocks in a half manner: a left block on the left and a right block on the right.

[0080] The left block is adjacent to the heat source area 600. At this time, the first fin group 21 is all the heat dissipation fins 20 located in the left block, and the second fin group 22 is all the heat dissipation fins 20 located in the right block. In other words, the first fin group 21 is adjacent to the heat generating element 650 relative to the second fin group 22.

[0081] Moreover, as mentioned above, the first fin group 21 and the second fin group 22 may have the same total heat dissipation area, gaps I1, I2 between the heat dissipation fins 20, number of fins, fin lengths L1, L2 or any combination thereof, and may also differ in at least one of the various structural parameters such as the heat dissipation area, gaps I1, I2 between the heat dissipation fins 20, number of fins, and fin lengths L1, L2.

[0082] See also Figure 6In some embodiments, the heat dissipation system 1 may not have the baffle plate 200, but the heat dissipation fins 20 of the annular heat sink 100 have different densities, so that the flow rate becomes larger to improve the heat dissipation effect. Here, the components of the annular heat sink 100 and their connection relationship are substantially the same as those described above. It should be clear that the annular heat sink 100 may have a structural design with a heat conduction branch 300 or a structural design without a heat conduction branch 300.

[0083] In these embodiments, all the heat dissipating fins 20 of the annular heat sink 100 are divided into two groups: a first fin group 21 and a second fin group 22 , and a gap I1 between any two adjacent heat dissipating fins 20 in the first fin group 21 is larger than a gap I2 between any two adjacent heat dissipating fins 20 in the second fin group 22 .

[0084] In some embodiments, the annular heat sink 100 can be divided into two blocks in a non-half manner: a left block on the left and a right block on the right. In other embodiments, the annular heat sink 100 can also be divided into two blocks in a half manner: a left block on the left and a right block on the right. In other words, the plurality of heat dissipating fins 20 are distinguished by an extension line LL that is perpendicular and passes through the axis of the heat conducting body 10 to distinguish the first fin group 21 and the second fin group 22.

[0085] The first fin group 21 includes all the heat dissipation fins 20 located in the left block, and the second fin group 22 includes all the heat dissipation fins 20 located in the right block.

[0086] In some embodiments, when the gaps I1 and I2 between the heat dissipation fins 20 are different, the number of fins in the first fin group 21 may be less than the number of fins in the second fin group 22. For example, the number of fins in the second fin group 22 is 30 (PCS), while the number of fins in the first fin group 21 is 10 to 22. In some examples, the number of fins in the second fin group 22 is 30, and the number of fins in the first fin group 21 is 10, 16, or 22.

[0087] In some embodiments, when the gaps I1 and I2 between the heat dissipation fins 20 are different and / or the number of fins is different, the fin length L1 of the first fin group 21 can be the same as the fin length L2 of the second fin group 22. Figure 6 For example, the fin lengths L1 and L2 of the first fin set 21 and the second fin set 22 are both 27 mm.

[0088] In some embodiments, the annular heat sink 100 of any of the above embodiments which is not connected to the guide baffle 200 but has heat dissipation fins 20 of different densities can also be used in the circuit board module 2. Figure 6The circuit board module 2 includes a circuit board 400, a plurality of heating elements 650, a heat dissipation system 1 without a guide baffle 200 (i.e., the aforementioned annular heat sink 100 with heat dissipation fins 20 of different densities) and a fan 500 ( Figure 6 (not shown).

[0089] Here, the plurality of heating elements 650 and the annular heat sink 100 are disposed on the circuit board 400, and from a top view, the plurality of heating elements 650 are located on one side of the annular heat sink 100. The fan 500 is electrically connected to the circuit board 400 and is located on the annular heat sink 100 (see FIG. Figure 2 and Figure 3 The configuration relationship of the fan 500 is shown in FIG. 1 ).

[0090] Here, the detailed structural design and configuration relationship of each component in the circuit board module 2 are substantially the same as the circuit board module 2 of any of the aforementioned embodiments, and the detailed structural design and configuration relationship of the heat-conducting body 10 and the heat-dissipating fins 20 of the annular heat sink 100 are substantially the same as the annular heat sink 100 of any of the aforementioned embodiments that is not connected to the guide baffle 200 but has heat-dissipating fins 20 of different densities, so it is not repeated. It should be clear that when the annular heat sink 100 does not have the heat-conducting branch 300, the annular heat sink 100 can be fixed on the circuit board 400 by fixing the heat-conducting body 10 (e.g., sticking it with a heat-conducting adhesive) on the circuit board 400.

[0091] In some embodiments, the aforementioned heat-conducting body 10 may be a three-dimensional structure having at least one side surface, such as a cylinder or a cube, but is not limited thereto.

[0092] In some embodiments, from a top view, each of the heat dissipation fins 20 may be, but not limited to, a sheet-like structure extending in a straight line, a sheet-like structure with a curved arc, or a Y-shaped sheet-like structure. In some embodiments, from a top view, when the heat dissipation fins 20 are a Y-shaped sheet-like structure, each of the heat dissipation fins 20 may be divided into a forked section and an unforked section, and the two ends of the unforked section are respectively connected to the side surface of the heat-conducting body 10 and one end of the forked section. In some embodiments, the fin length of the forked section of each heat dissipation fin 20 may be substantially equal to the fin length of the unforked section.

[0093] In some embodiments, from a top view, each heat-conducting branch 300 may include a main branch and at least one sub-branch. From a top view, the width of the main branch is greater than the width of the sub-branch (unbranched section). The first end 301 of each heat-conducting branch 300 is formed by merging (fusing) one end of the main branch with one end of each sub-branch. The other end of the main branch is the second end 302 of the heat-conducting branch 300. From a top view, the other end of each sub-branch has the same shape as the end of each heat-dissipating fin 20. In some embodiments, the other end of each sub-branch is flush with the end of each heat-dissipating fin 20. Specifically, the absolute distance from the side surface of the heat-conducting body 10 to the other end of each sub-branch is substantially the same as the absolute distance from the side surface of the heat-conducting body 10 to the end of each heat-dissipating fin 20.

[0094] In some embodiments, the aforementioned circuit board 400 may be, but is not limited to, a general printed circuit board (PCB), a flexible PCB, or a rigid flexible printed circuit board (RFPC).

[0095] In some embodiments, in the application of the circuit board module 2 , each heat dissipation fin 20 is a sheet-like structure standing above the circuit board 400 .

[0096] In some embodiments, each heating element 650 may be an electronic element such as a processor (CPU), a memory, a metal oxide semiconductor (MOS), a ballast (Choke), a resistor, a capacitor, or a base (Cap).

[0097] Reference Figures 5 to 12 . Figures 5 to 12 The following are partial schematic diagrams of the circuit board modules 2 of the first to eighth examples. In order to clearly present the design of the heat dissipation system 1, Figures 5 to 12 The fan 500 is omitted. The following is a flow field simulation experiment using the circuit board module 2 of the first example to the eighth example to detect the temperature of the heating element 650. Here, the heating element 650 is a processor (CPU), a metal oxide semiconductor (MOS), a ballast (Choke), and a base (Cap). In the first example to the eighth example, the settings of the heating element 650 and the fan 500 are the same.

[0098] Among them, neither the first example nor the second example is provided with a guide baffle 200, and the difference between the two lies in the density of the heat dissipation fins 20. Figure 5 and Figure 6 The third to eighth examples are all provided with a guide baffle 200. The difference between these embodiments lies in the number of fins and / or the length of the fins in the first fin group 21. Figures 7 to 12The specific structural parameters of the first to eighth examples are shown in Table 1 below.

[0099] Table 1

[0100]

[0101]

[0102] The first example is a common heat dissipation system 1, which has no guide baffle 200 and has the same gaps I1 and I2 between the plurality of heat dissipation fins 20. Figure 5 The second example is to adjust the number of fins of the first fin group 21 (ie, the heat sink fins 20 adjacent to the heat source area 600) based on the first example, and reduce the number to 16 heat sink fins 20, as shown in FIG. Figure 6 The third example is to add two guide baffles 200 on opposite sides of the heat source area 600 based on the first example, as shown in FIG. Figure 7 The fourth example is to adjust the number of fins of the first fin group 21 (ie, the heat sink fins 20 adjacent to the heat source area 600) based on the third example, and reduce the number to 16 heat sink fins 20, as shown in FIG. Figure 8 shown.

[0103] In the simulation experiment, the circuit board module 2 of the first example has densely distributed heat dissipation fins 20 and no air guide is set, and it can be detected that: under the architecture of the first example, the maximum temperature of the CPU is 61.98°C, the maximum temperature of the MOS is 122.66°C, the maximum temperature of the Choke is 90.84°C, and the maximum temperature of the Cap is 67.08°C.

[0104] Compared to the first example, the circuit board module 2 of the second example provides sparsely distributed heat dissipation fins 20 adjacent to the heating element 650 to reduce impedance. Moreover, it can be detected in the simulation experiment that under the architecture of the second example, the maximum temperature of the CPU is 63.28°C, the maximum temperature of the MOS is 121.22°C, the maximum temperature of the Choke is 84.34°C, and the maximum temperature of the Cap is 62.54°C. In other words, compared to the first example, the maximum temperature of the MOS has dropped by 1.17%, the maximum temperature of the Choke has dropped by 7.15%, and the maximum temperature of the Cap has dropped by 6.77%. It can be seen that the circuit board module 2 of the second example increases the flow rate directed to the heating element 650 by reducing the number of fins of the first fin group 21 adjacent to the heating element 650 in the annular heat sink 100, thereby effectively improving the heat dissipation efficiency of the heating element 650.

[0105] Compared with the first example, the circuit board module 2 of the third example is additionally provided with a guide baffle 200 to control the flow field. Moreover, it can be detected in the simulation experiment that: under the architecture of the third example, the maximum temperature of the CPU is 61.60°C, the maximum temperature of the MOS is 116.40°C, the maximum temperature of the Choke is 83.40°C, and the maximum temperature of the Cap is 63.46°C. That is to say, compared with the first example, under the architecture of the third example, the maximum temperature of the CPU is reduced by 0.61%, the maximum temperature of the MOS is reduced by 5.1%, the maximum temperature of the Choke is reduced by 8.2%, and the maximum temperature of the Cap is reduced by 5.4%. It can be seen that the circuit board module 2 of the third example directs the flow field to the heating element 650 with a higher temperature without reducing the area of ​​the heat dissipation fins, and then provides the heating element 650 with priority cooling compared to other electronic components under the same heat dissipation area, thereby effectively improving the heat dissipation efficiency of the heating element 650.

[0106] Compared with the first example, the circuit board module 2 of the fourth example provides sparsely distributed heat sink fins 20 adjacent to the heating element 650 to reduce impedance and adds a guide baffle 200 to control the flow field. In addition, it can be detected in the simulation experiment that: under the architecture of the fourth example, the maximum temperature of the CPU is 60.14°C, the maximum temperature of the MOS is 114.06°C, the maximum temperature of the Choke is 82.02°C, and the maximum temperature of the Cap is 60.14°C. That is to say, compared with the first example, under the architecture of the fourth example, the maximum temperature of the CPU is reduced by 2.97%, the maximum temperature of the MOS is reduced by 7.01%, the maximum temperature of the Choke is reduced by 9.71%, and the maximum temperature of the Cap is reduced by 10.34%. It can be seen that the circuit board module 2 of the fourth example combines the characteristics of the circuit board module 2 of the second example and the circuit board module 2 of the third example, that is, the density of the heat sink fins 20 adjacent to the heating element 650 is reduced to make the impedance smaller and the flow rate larger, so the cooling effect is not only better than the first example, but also better than the third example; and, due to the relationship between the two guide baffles 200 affecting the flow field, the temperature of the CPU does not tend to rise due to the reduction of the total heat dissipation area of ​​the heat sink fins 20. It can be seen that under the architecture of the fourth example, the CPU and other heating elements 650 can obtain better heat dissipation performance and reduce the cost of components.

[0107] Moreover, in the simulation experiment, on the circuit board module 2 of the fourth example, most of the flow field is concentrated on the heating element 650, and due to the design of the heat source area 600 of the lateral opening 670 on the left side, its flow rate is increased by about 50% compared with the first example. This experimental data represents that the heat dissipation system 1 in the fourth example can effectively guide the flow field in the direction of the lateral opening 670, and can concentrate most of the flow field on the heating element 650, so as to effectively control the flow field in the heat source area 600. In addition, due to the presence of the guide baffle 200, many reflux flow fields are generated in the flow field, thereby increasing the pressure difference of the flow field and making the flow rate faster. Therefore, the heat dissipation system 1 or circuit board module 2 of the fourth example can significantly improve the cooling effect of the heating element 650, and can be applied to the heat dissipation of a specific heating element 650, or applied to a block where most of the flow field needs to be concentrated for heat dissipation.

[0108] Next, the fifth example reduces the number of fins of the first fin group 21 adjacent to the heat source area 600 to 10 based on the fourth example. Fig. 9 The sixth example is to increase the number of fins of the first fin group 21 adjacent to the heat source area 600 to 22 based on the fourth example. Fig.10 The seventh example is based on the fourth example, and the fin length L1 of the first fin group 21 adjacent to the heat source area 600 is reduced to 13.5 mm. Fig.11 The eighth example is based on the fourth example, but the fin length L1 of the first fin group 21 adjacent to the heat source area 600 is increased to 40.5 mm. Fig.12 shown.

[0109] Compared with the fourth example, the circuit board module 2 of the fifth example provides more sparsely distributed heat dissipation fins 20 adjacent to the heating element 650, and it can be detected in the simulation experiment that under the architecture of the fifth example, the maximum temperature of the CPU is 65.81°C, the maximum temperature of the MOS is 114.36°C, the maximum temperature of the Choke is 85.245°C, and the maximum temperature of the Cap is 63.08°C. That is, in the case of significantly reducing the total heat dissipation area of ​​the first fin group 21, the cooling effect of the heat dissipation system 1 in the fifth example on the heating element 650 is still better than that of the first example.

[0110] Compared with the fourth example, the circuit board module 2 of the sixth example increases the number of scales of the heat sink fins 20 adjacent to the heating element 650, and it can be detected in the simulation experiment that under the architecture of the sixth example, the maximum temperature of the CPU is 60.7657°C, the maximum temperature of the MOS is 115.06°C, the maximum temperature of the Choke is 82.611°C, and the maximum temperature of the Cap is 61.56°C. That is, when the gap I1 between the heat sink fins 20 of the first fin group 21 is reduced to increase the impedance relative to the fourth example, the cooling effect of the heat dissipation system 1 in the sixth example on the heating element 650 is still better than that of the first example.

[0111] Compared with the fourth example, the circuit board module 2 of the seventh example increases the fin length L1 of the heat sink fin 20 adjacent to the heating element 650, and it can be detected in the simulation experiment that under the architecture of the seventh example, the maximum temperature of the CPU is 67.452°C, the maximum temperature of the MOS is 112.86°C, the maximum temperature of the Choke is 82.085°C, and the maximum temperature of the Cap is 60.127°C. In other words, compared with the fourth example, under the architecture of the seventh example, the maximum temperature of the MOS is reduced by 1.05%, and the maximum temperature of the Cap is reduced by 0.02%. In other words, the heat dissipation system 1 in the seventh example can further improve the heat dissipation effect of the specific heating element 650. Moreover, compared with the first example, the cooling effect of the heat dissipation system 1 in the seventh example on the heating element 650 is still better than that of the first example.

[0112] Compared with the fourth example, the circuit board module 2 of the eighth example significantly increases the fin length L1 of the heat sink fin 20 adjacent to the heating element 650, and it can be detected in the simulation experiment that under the architecture of the eighth example, the maximum temperature of the CPU is 58.727°C, the maximum temperature of the MOS is 117.27°C, the maximum temperature of the Choke is 85.29°C, and the maximum temperature of the Cap is 61.37°C. In other words, compared with the fourth example, under the architecture of the eighth example, the maximum temperature of the CPU is reduced by 2.35%. In other words, the heat dissipation system 1 in the eighth example can further improve the heat dissipation effect of the specific heating element 650. Moreover, compared with the first example, the cooling effect of the heat dissipation system 1 in the eighth example on the heating element 650 is still better than that of the first example.

[0113] It can be seen that the heat dissipation system 1 can produce different degrees of heat dissipation effects and / or significantly improve the heat dissipation of different heating elements 650 under different structural parameters of the heat dissipation fins 20, so the fin parameters can be adaptively adjusted according to the actual use status and needs to provide the required heat dissipation effect. For example, the heat dissipation system 1 of the eighth example can significantly improve the heat dissipation efficiency of the CPU, and the heat dissipation system 1 of the fourth example can significantly improve the heat dissipation efficiency of the heating element 650 other than the CPU.

[0114] In addition, the shapes, sizes, proportions, and configurations and relative distances of the components in the drawings are for illustration only; their positions or sequences may be adjusted up or down or exist simultaneously. They are provided for those having ordinary knowledge in the technical field to understand the present invention, and are not intended to limit the scope of implementation of the present invention.

[0115] In summary, the annular heat sink 100, the heat dissipation system 1 and the circuit board module 2 of any embodiment can provide higher heat dissipation efficiency without increasing the overall size of the heat sink. In some embodiments, the heat dissipation system 1 can be applied to the circuit board module 2, and can provide flow field control to effectively guide the flow field to the heat source area 600, thereby providing more efficient heat dissipation efficiency. In some embodiments, the annular heat sink 100 can be applied to the circuit board module 2, and can provide low flow resistance heat dissipation fins 20 adjacent to the heat source area 600, so that the flow of the guide element (i.e., the air flow channel between two adjacent heat dissipation fins 20) becomes larger, thereby providing more efficient heat dissipation efficiency. In this way, the overall module environment can have a better heat dissipation effect without increasing the cost. In some embodiments, the annular heat sink 100, the heat dissipation system 1 or the circuit board module 2 can design the structural parameters of different heat dissipation fins 20 according to the actual application environment and heat dissipation requirements, so as to obtain a better heat dissipation effect. For example, by adding a guide baffle 200 and reducing the number of fins of the heat sink fins 20 adjacent to the heat source area 600, the heat dissipation system 1 can moderately improve the heat dissipation efficiency of the CPU, greatly improve the heat dissipation efficiency of other heat-generating components 650 other than the CPU, and greatly reduce the system temperature of the circuit board module 2 while keeping the price unchanged or reducing.

[0116] The technical contents of the present invention have been disclosed in the preferred embodiments as described above, but they are not used to limit the present invention. Any slight changes and modifications made by any technical personnel in this field without departing from the spirit of the present invention should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the appended claims.

[0117] [Description of Reference Numerals]

[0118] 1: Cooling system

[0119] 2: Circuit board module

[0120] 10: Heat conducting body

[0121] 20: Heat sink fins

[0122] 21: First fin group

[0123] 22: Second fin group

[0124] 100: Ring radiator

[0125] 200: guide baffle

[0126] 201: Connection end

[0127] 202: Free end

[0128] 300: Heat conduction branch

[0129] 301: First end

[0130] 302: Second end

[0131] 400: Circuit board

[0132] 500: Fan

[0133] 600: Heat source area

[0134] 650: Heating element

[0135] 670: Side opening

[0136] L0: baffle length

[0137] L0': baffle length

[0138] L1: Fin length

[0139] L2: Fin length

[0140] LL: Extension Line

[0141] I1: Clearance

[0142] I2: Clearance

[0143] H1: Distance

[0144] H2: Distance

[0145] h1: baffle height

[0146] h2: Fin height

Claims

1. A heat dissipation system, comprising: Ring radiator; as well as Two guide baffles, each of which has a connecting end and a free end opposite to each other, wherein the connecting ends of the two guide baffles are connected to the annular radiator, and the two guide baffles and the annular radiator surround a heat source area; Wherein, the heat source area has a lateral opening, and the lateral opening is formed by the free ends of the two guide baffles, and is located on both sides of the heat source area together with the annular radiator.

2. The heat dissipation system according to claim 1, wherein the annular heat sink comprises: Heat conducting body; A plurality of heat dissipation fins are radially arranged and connected to the peripheral side surface of the heat-conducting body; as well as A plurality of heat-conducting branches are radially arranged with the plurality of heat-dissipating fins and connected to the peripheral side surface of the heat-conducting body. 3 . The heat dissipation system as claimed in claim 2 , wherein each of the heat-conducting branches has a first end and a second end opposite to each other, and the first end of each of the heat-conducting branches is connected to the peripheral side surface of the heat-conducting body. 4 . The heat dissipation system according to claim 3 , wherein the connecting ends of the two guide baffles are respectively connected to the second ends of two heat-conducting branches among the plurality of heat-conducting branches. 5 . The heat dissipation system as claimed in claim 3 , wherein the first ends of the two heat-conducting branches are respectively connected to opposite sides of the heat-conducting body. 6 . The heat dissipation system as claimed in claim 2 , wherein the plurality of heat dissipation fins are divided into a first fin group and a second fin group by a line connecting the connection ends of the two guide baffles, and the first fin group is adjacent to the heat source area. 7 . The heat dissipation system as claimed in claim 6 , wherein a total heat dissipation area of ​​the first fin group is smaller than a total heat dissipation area of ​​the second fin group. 8 . The heat dissipation system according to claim 7 , wherein a gap between any two adjacent heat dissipation fins in the first fin group is larger than a gap between any two adjacent heat dissipation fins in the second fin group.

9. The heat dissipation system as claimed in claim 7, wherein the connection ends of the two guide baffles are respectively connected to opposite sides of the annular heat sink, and the number of fins in the first fin group is less than the number of fins in the second fin group. 10 . The heat dissipation system according to claim 7 , wherein the fin length of the first fin group is smaller than the fin length of the second fin group. 11 . The heat dissipation system of claim 7 , wherein the total heat dissipation area of ​​the first fin group is less than or equal to 80% of the total heat dissipation area of ​​the second fin group.

12. The heat dissipation system as described in claim 2, wherein the multiple heat dissipation fins are divided into a first fin group and a second fin group by the two guide baffles, the first fin group is adjacent to the heat source area, the gap between any two adjacent heat dissipation fins in the first fin group is larger than the gap between any two adjacent heat dissipation fins in the second fin group, and the fin length of the first fin group is larger than the fin length of the second fin group. 13 . The heat dissipation system according to claim 2 , wherein a fin height of the plurality of heat dissipation fins is smaller than a baffle height of the guide baffle.

14. The heat dissipation system according to claim 1, wherein the annular heat sink is sandwiched between a fan and a circuit board, and a plurality of heat generating elements are provided on the circuit board in the heat source area. 15 . The heat dissipation system according to claim 14 , wherein the distance between the guide baffle and the circuit board is greater than or equal to 0 mm and less than or equal to 0.5 mm.

16. An annular radiator, comprising: Heat conducting body; as well as A plurality of heat dissipation fins are radially arranged and connected to the peripheral side surface of the heat-conducting body, wherein the plurality of heat dissipation fins are divided into a first fin group and a second fin group, and a gap between any two adjacent heat dissipation fins in the first fin group is greater than a gap between any two adjacent heat dissipation fins in the second fin group. 17 . The annular heat sink according to claim 16 , wherein the number of fins in the first fin group is smaller than the number of fins in the second fin group. 18 . The annular heat sink as claimed in claim 16 , wherein a fin length of each of the heat dissipating fins in the first fin group is equal to a fin length of each of the heat dissipating fins in the second fin group. 19 . The annular heat sink as claimed in claim 16 , wherein the plurality of heat dissipating fins are divided into the first fin group and the second fin group by an extension line perpendicular to and passing through an axis of the heat conducting body.

20. The annular heat sink as claimed in claim 16, wherein the annular heat sink is sandwiched between a fan and a circuit board, and the circuit board has a plurality of heating elements thereon.

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