Storage device with multi-channel capacitive sensor for detecting gesture-based commands

Abstract

Systems and methods for providing a multi-channel capacitive sensor for detecting gestures of a user are disclosed. In some embodiments, a data storage device includes a non-volatile memory; a plurality of metal sheets configured to form one or more heat sinks of the data storage device and to form a plurality of capacitive pads of a capacitive sensor configured to detect a user gesture; and a controller configured to: detect a gesture of a user in the vicinity of the plurality of capacitive pads using the capacitive sensor; and executing a command associated with the data storage device based on the detected gesture.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Non-Provisional Application No. 18 / 231,718, filed in the U.S. Patent and Trademark Office on August 8, 2023, entitled “STORAGE DEVICES HAVING MULTI-CHANNELCAPACITIVE SENSORS FOR DETECTING GESTURE BASED COMMANDS,” and is hereby incorporated by reference in its entirety for all purposes, and claims priority to U.S. Provisional Application No. 63 / 435,768, filed on December 28, 2022. Background Art Technical Field

[0003] The present disclosure relates to data storage systems. In particular, the present disclosure relates to processing data requests in data storage systems.

[0004] Description of Related Technology

[0005] The data storage system / device can process various data requests from the host. For example, the host can receive a user command or input to initiate a data request and can send a data request to the data storage system / device. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Various embodiments are shown in the drawings for illustrative purposes and should in no way be construed as limiting the scope of the present disclosure. In addition, various features of different disclosed embodiments may be combined to form further embodiments, which are part of the present disclosure.

[0007] Figure 1 An example system architecture is shown for an example storage system related to providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0008] Figure 2 is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0009] Figure 3A is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0010] Figure 3Bis a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0011] Figure 4A is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0012] Figure 4B is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0013] Figure 4C is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0014] Figure 4D is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0015] Figure 5A is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0016] Figure 5B is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0017] Figure 5C is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0018] Figure 5D is a block diagram illustrating an example storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments.

[0019] Figure 6 A workflow process for performing capacitive sensor calibration in a data storage device is shown according to one or more embodiments.

[0020] Figure 7 A workflow process is shown for providing a multi-channel capacitive sensor for detecting gesture-based commands in a data storage device according to one or more embodiments.

[0021] Figure 8 is a diagram of a computing device according to one or more embodiments. DETAILED DESCRIPTION

[0022] Although certain embodiments are described, these embodiments are presented only as examples and are not intended to limit the scope of protection. In fact, the novel methods and systems described herein can be embodied in various other forms. In addition, various omissions, substitutions, and changes can be made to the form of the methods and systems described herein without departing from the scope of protection.

[0023] Storage device with multi-channel capacitive sensor for detecting gesture-based commands built from heat sink

[0024] The data storage system / device can process various data requests from the host. For example, a user can provide a user input or command at the host to initiate a data request, and the host can send the data request to the data storage system / device. Examples of data storage systems / devices may include removable devices, such as external solid-state drives (SSDs), universal serial bus (USB) flash drives, secure digital (SD) cards, micro secure digital (uSD) cards, compact flash, CFast, CFexpress, redundant array of independent disks (RAID) controllers, etc. Such devices may rely on user commands from the host to perform any data operations, such as initiating data transfer to and / or from the data storage device. For example, data storage devices generally require user input at the host to perform data operations. However, it may be convenient for users to request data operations from data storage devices without having to provide input through the host. In addition, authentication based on online fast identity (FIDO) may require contact input from the user (e.g., pressing a button or touching a touch sensor), and authentication based on Bluetooth may require the use of another device, such as a host or mobile phone. In these cases, it may also be convenient for users to have other ways to interact with data storage devices to perform related operations.

[0025] To address these and other challenges, a storage system / device according to certain aspects may implement a multi-channel capacitive sensor for detecting gesture-based commands. For example, a storage device may provide a multi-channel capacitive sensor including multiple capacitive pads to detect user gestures. Different gestures may be associated with different commands and / or data operations. Therefore, a user can request a data operation from a storage device without having to provide input through a host. Gestures may also be used for FIDO authentication, Bluetooth authentication, and the like. In some cases, due to thermal challenges, it may be difficult to implement a capacitive sensor for sensing user gestures in an external solid-state drive. For example, many external SSDs may be waterproof and may not include vents or fans to cool the drive. Such external SSDs may include several metal layers as heat sinks to dissipate heat from the drive. However, many metal layers in an external SSD may make it difficult to implement a multi-channel capacitive sensor for detecting gestures within the SSD, for example due to interference with the electric field of the capacitive pads. Therefore, a heat sink sheet in an external SSD may be used to form a multi-channel capacitive sensor and may be used to form the capacitive pads of the multi-channel capacitive sensor. Using a metal sheet of a heat sink to form a capacitive sensor may also be applicable to other storage devices other than an external SSD. In this way, the storage device can be more compact and thermal requirements can be managed.Details related to a storage system / device including a multi-channel capacitive sensor for detecting gesture-based commands are provided below.

[0026] Figure 1 An example system architecture 100 is shown in connection with providing an example storage system 140 associated with a multi-channel capacitive sensor for detecting user gestures according to one or more embodiments. The architecture 100 may include one or more client computing devices or hosts 110. The client computing device 110 may include a processor 116 and a memory 117. The architecture 100 may also include a storage system 140 for providing a multi-channel capacitive sensor. The storage system 140 may include one or more storage devices 145. The client computing device 110 may be coupled to the storage system 140 and / or the storage device 145. The client computing device 110 may be coupled directly to the storage system 140 and / or the storage device 145. In some cases, the client computing device 110 may be coupled to the storage system 140 and / or the storage device 145 via a network 120. The types of client computing devices 110 that may access the storage system 140 may include a phone 110a such as a smart phone, a laptop computer 110b, a tablet computer 110c, a desktop computer 110d, a wearable computer, and / or other network-connected computing devices. The network 120 may be a local area network (LAN), a wide area network (WAN) (eg, the Internet), or other type of computer network, and the connections between the various client components of the architecture 100 and the network 120 may be wired or wireless.

[0027] As described above, the storage system 140 may include one or more storage devices 145. The storage device 145a may include a controller 146, a memory 147, and a data storage device 148 (e.g., a non-volatile memory). The storage device 145b may also include similar components. The storage system 140 may store data and / or data objects that can be accessed by the client computing device 110. The storage system 140 may include multiple storage devices 145 (e.g., multiple storage drives, such as hard disk drives (HDDs), solid-state drives (SSDs), etc.). The storage device 145 may include magnetic media (e.g., magnetic disks, shingled magnetic recording (SMR) media / disks, etc.) and / or solid-state media.

[0028] Although certain embodiments are described herein, it should be understood that different types of storage devices and random access memory (RAM) technologies may be used in the above embodiments. For example, the RAM may include any of the following: static RAM (SRAM), dynamic RAM (DRAM), synchronous dynamic RAM (SDRAM), single data rate synchronous dynamic RAM (SDR SDRAM), double data rate synchronous dynamic RAM (e.g., DDR SDRAM, DDR2, DDR3, DDR4), graphic double data rate synchronous dynamic RAM (e.g., GDDR SDRAM, GDDR2, GDDR3, GDDR4, GDDR5), and / or flash memory. Non-volatile random access memory, such as non-volatile dual in-line memory modules (NVDIMMs), NVDIMM-Ns, NVDIMM-Ps, and / or NVDIMM-Fs, may also be used.

[0029] In addition, the storage device may utilize a hard disk drive (HDD) and / or different types of non-volatile memory, such as NAND and its variants, such as SLC (single level cell), eMLC (enterprise multi-level cell), MLC (multi-level cell), TLC (triple level cell), and QLC (quad level cell). New types of emerging non-volatile memory, such as program-in-place or storage class memory (SCM), such as resistive random access memory (ReRam), phase change memory (PCM), and magnetoresistive random access memory (MRAM) may also be used.

[0030] In some embodiments, a "host" may refer to a system or device from which data on a storage system or device is accessed or requested. For example, client computing device 110 may be a host. In some embodiments, a "device" may refer to a storage system or device from which data is obtained (e.g., to be provided to a host).

[0031] According to certain embodiments, the storage system 140 and / or the storage device 145 may be configured to provide a multi-channel capacitive sensor for detecting user gestures, as described herein. For illustrative purposes, a multi-channel capacitive sensor for detecting user gestures is described in conjunction with the storage device 145. The storage device 145 may have a multi-channel capacitive sensor including a plurality of capacitive pads configured to detect user gestures. User gestures may include various types of gestures that can be performed by a user. For example, a user gesture may be performed by a user's hand near a capacitive pad. As an example, the capacitive pads may be arranged in series and may detect a swipe in one dimension (e.g., from left to right, from right to left). As another example, the capacitive pads may be arranged in a matrix and may detect a swipe in two dimensions (e.g., from left to right, from right to left, from top to bottom, from bottom to top, etc.). Various gestures may be associated with different commands so that the storage device 145 may execute an associated command in response to detecting a specific gesture. Gestures may also be used to perform, for example, FIDO authentication or Bluetooth authentication to provide a seamless user experience and facilitate user interaction. According to an embodiment, storage device 145 may include one or more multi-channel capacitive sensors.

[0032] A removable storage device (such as an external SSD) may include multiple metal layers or materials to act as one or more heat sinks to address thermal requirements. For example, a removable device may need to be compact and in some cases waterproof, and may not include vents or fans. Since the metal layer or material may interfere with the electric field of the capacitor pad, it may be challenging to implement a multi-channel capacitive sensor in a removable device. In addition, additional materials will be added to the removable device to implement the capacitive sensor, thereby increasing the size of the removable device. Therefore, the storage device 145 may use a heat sink to implement a multi-channel capacitive sensor. For example, the heat sink may be divided into multiple metal sheets and may be used to form a multi-channel capacitive sensor. In an example, the heat sink may be a metal sheet embedded in or placed near a plastic cover, and may be divided into multiple metal sheets electrically insulated from each other to form the capacitive pads of the multi-channel capacitive sensor. For example, the heat sink may be embedded in the cover so that the edge of the heat sink is partially or completely surrounded or covered by the edge of the cover. In another example, the heat sink may be the metal cover itself, and the metal cover may be divided into multiple metal sheets electrically insulated from each other to form the capacitive pads of the multi-channel capacitive sensor. For example, multiple metal sheets can form a capacitor array. In this way, a multi-channel capacitive sensor can be included in a removable device without adding additional metal layers or materials in the storage device 145, and the storage device 145 can be more compact while managing thermal requirements. Examples of removable devices may include external SSDs, USB flash drives, SD cards, uSD cards, compact flash, CFast, CFexpress, RAID controllers, etc. For illustrative purposes, the use of a heat sink to implement a multi-channel capacitive sensor is explained in conjunction with a removable device, but may also be applicable to other types of storage devices. The following description will be made in conjunction with, for example, Figures 2 to 6 Details related to providing a multi-channel capacitive sensor for detecting user gestures are described.

[0033] Figure 2 2 is a block diagram 200 illustrating an example storage device 245 for providing a multi-channel capacitive sensor for detecting gesture-based commands according to one or more embodiments. In some embodiments, Figure 2 The components may be similar to those having similar names and / or reference numbers. Figure 1 For example, the storage device 245 may be similar to Figure 1 The storage device 145 in the above Figure 1 Certain details related to block diagram 200 are described.

[0034] Storage device 245 may communicate with a host such as a client computing device. Figure 2In the example of , the storage device 245 may be an external SSD. For illustrative purposes, the multi-channel capacitive sensor for detecting user gestures is described in conjunction with an external SSD, but may be implemented in other types of storage devices. Figure 2 As shown, the storage device 245 may include a host connector 249, a controller application specific integrated circuit (ASIC) chip 246, a capacitive sensor chip 250, and a plurality of capacitive pads or electrodes 251. The storage device 245 may be connected to the host via the host connector 249. The controller chip 246 may receive commands from the host via the host connector 249. The capacitive sensor chip 250 may be mounted on a printed circuit board assembly (PCBA) of the storage device 245. The capacitive sensor chip 250 may communicate with the controller chip 246 via a serial peripheral interface (SPI), an inter-integrated circuit (I2C), a universal asynchronous receiver / transmitter (UART), or a similar interface. There may be an interrupt line from the capacitive sensor chip 250 to the controller chip 246 to indicate when the user's hand is close to the storage device 245. The capacitive sensor chip 250 may drive a plurality of capacitive pads 251. Figure 2 The example of shows four (4) capacitor pads 251: pad 1 251-1, pad 2 251-2, pad 3 251-3, and pad 4 251-4. The capacitor pads 251 are arranged in series or in a row and can detect user gestures in one dimension. For example, the capacitive sensor chip 250 can detect gestures from left to right or from right to left. As an example, the capacitor pads 251 can be made of copper. The capacitor pads 251 can be made of any suitable material. The capacitor pads 251 can also be arranged in two or more dimensions so that the capacitor pads 251 can detect user gestures in two or more dimensions. For example, the capacitor pads 251 can be arranged in a matrix or multiple rows to detect gestures in two dimensions. The capacitor pads 251 can also be considered to be implemented in rows and / or columns or in an array. Depending on the embodiment, the storage device 245 and / or the controller chip 246 may include additional or fewer components. Depending on the embodiment, one or more components of the storage device 245 may be implemented separately, or may be combined or integrated. For example, in some cases, controller chip 246 may include the functionality of capacitive sensor chip 250. Depending on the implementation, some or all of the functionality of capacitive sensor chip 250 may be integrated into controller 246.

[0035] The storage device 245 may detect a user gesture within a predetermined proximity or distance from the storage device 245. For example, the storage device 245 may detect a user gesture from 0 centimeters (cm) to 5 centimeters from the top of the storage device 245. Figure 2In the example of , if the user makes a gesture by swiping the user's hand in the air from left to right, pad 1 251-1 will first sense the user's hand, followed by pad 2 251-2, pad 3 251-3, and pad 4 251-4, respectively. Similarly, in the case of a swipe from right to left, pad 4 251-4 will first sense the user's hand, followed by pad 3 251-3, pad 2 251-2, and pad 1 251-1, respectively. Information about which capacitive pad senses the user's hand can be used to determine the direction in which the user gesture is performed. For example, which capacitive pad senses the user's hand first and / or the timing or sequential order in which the capacitive pads sense the user's hand can be used to determine whether the user gesture is a swipe from left to right or a swipe from right to left.

[0036] Different meanings or commands may be assigned to different gestures. In an example, a left-to-right swipe may be associated with a full file copy of the contents of storage device 245 to the host, and storage device 245 may automatically begin copying storage device 245 data to the host in response to detecting the left-to-right swipe. As another example, a right-to-left swipe may be associated with a full file copy of the contents of the host to storage device 245 for backup, and storage device 245 may automatically begin copying host data to storage device 245 in response to detecting the right-to-left swipe. The source and / or target location (e.g., a directory) may be predefined or configured in the settings. Additional examples of gestures and associated commands are included below:

[0037] gesture Command to execute Gesture 1 (Swipe from left to right) Go to sleep Gesture 2 (swipe from right to left) Connect Bluetooth Gesture 3 (Swipe from top to bottom) Reduce performance to save power Gesture 4 (Swipe from bottom to top) Maximize performance Gesture 5 (Place your hand on top of the drive) Stop all data transfers in anticipation of unplug events

[0038] Table 1 - Example gestures and commands

[0039] The above examples are provided for illustrative purposes, and many variations are possible.

[0040] Gestures can also be used for FIDO or Bluetooth authentication. The FIDO protocol can use standard public key cryptography to provide stronger authentication. The user's device can create a new key pair, and can retain the private key and, for example, register the public key with the service. Authentication can be completed by proving that the device has the private key. The user's private key can only be used after the user unlocks it on the device. Unlocking can be achieved in different ways, including pressing a button, touching a touch sensor, etc. In some cases, gestures can replace the function of physical user input for FIDO, such as contact with a pressing button or a touch sensor. For FIDO authentication, the user can be prompted to press a button or contact a touch sensor on the device to release the key information. Instead of physical contact input, the user can perform a specific gesture near the storage device 245 to release the key information. In this way, the user can use gestures to perform FIDO authentication on the storage device 245. Therefore, in some cases, components for physical contact input for FIDO authentication, such as pressing a button or a touch sensor, can be removed from the storage device 245. In some cases, gestures can be used for Bluetooth-based authentication, such as Bluetooth Low Energy (BLE). For Bluetooth-based unlocking, the user can use a host or mobile phone to push notifications to authenticate and authorize access. Instead of using a host or mobile phone, the user can perform a specific gesture near the storage device 245 for a Bluetooth-based unlocking scenario. In this way, the user can use gestures to facilitate various types of authentication, such as having to provide manual input or use a host or another device.

[0041] According to certain aspects, the capacitor pad 251 for the multi-channel capacitive sensor may be implemented in or near the cover of the storage device 245 (e.g., an external SSD). Having the capacitor pad 251 close to the cover may enable it to more effectively detect user gestures and reduce interference with other metal layers (e.g., used as a heat sink) within the storage device 245. For example, the distance between the heat dissipation layer (such as the cover) in which the capacitor pad is implemented and the other metal layers in the storage device 245 may be increased. In some embodiments, the cover of the storage device 245 may be made of plastic, and the capacitor pad 251 may be a metal sheet embedded in the cover or placed near the cover, which also forms a heat sink. In certain embodiments, the cover of the storage device 245 may be made of metal, and the capacitor pad 251 may be formed by the metal cover by dividing the cover into multiple metal sheets and electrically isolating it from other materials (such as plastic). The above examples are described for illustrative purposes, and the capacitor pad 251 may be appropriately implemented in various locations and positions within the storage device 245.

[0042] As described above, storage device 245 may include multiple metal layers used as heat sinks, which may affect the electric field of capacitor pad 251. For example, storage device 245 such as an external SSD may include one or more of an aluminum heat sink, a nano-carbon copper tape, and a thermal interface material. According to certain aspects, calibration may be performed to compensate for the interference of such metal layers to the electric field of capacitor pad 251. For example, when storage device 245 is inserted into a host, calibration may be performed to determine the initial capacitance value of capacitor pad 251 and set such value to ground zero or reference capacitance value. Subsequent changes from the initial capacitance value may be used to detect user gestures. Calibration may take into account other metal objects in the environment, such as tables, computers, laptops, etc. Calibration is described in more detail below.

[0043] Figure 3A 3 is a block diagram 300a illustrating an example storage device 345a for providing a multi-channel capacitive sensor for detecting gesture-based commands according to certain embodiments. In some embodiments, Figure 3A The components may be similar to those having similar names and / or reference numbers. Figure 1 to Figure 2 For example, the storage device 345a may be similar to Figure 1 to Figure 2 The storage devices 145, 245 in the above Figure 1 to Figure 2 Certain details are described with respect to block diagram 300a.

[0044] exist Figure 3A In an example of , a storage device 345a (such as an external SSD) includes four (4) capacitor pads 351a for detecting user gestures: pad 1 351a-1, pad 2 351a-2, pad 3351a-3, and pad 4 351a-4. For example, the capacitor pads 351a can be implemented with a heat sink embedded in or placed near the cover of the storage device 345a. The heat sink embedded in or placed near the cover of the storage device 345a can be divided into multiple pieces to form the capacitor pads 351a. The capacitor pads 351a can be on the underside of the cover. The capacitor pads 351a are arranged in a row or in series, and can detect user gestures on one dimension 370a-1 (e.g., the x-axis or horizontal axis). The capacitor pads 351a can detect gestures in different directions within one dimension 370a-1, for example, user gestures from left to right or from right to left. Each gesture can be associated with a specific command regarding the storage device 345a. In response to detecting the gesture, storage device 345a may determine the associated command and execute the command appropriately.

[0045] Figure 3B 300b is a block diagram illustrating an example storage device 345b for providing a multi-channel capacitive sensor for detecting gesture-based commands according to certain embodiments. In some embodiments, Figure 3BThe components can be similar to Figures 1 to 3A For example, storage device 345b may be similar to Figures 1 to 3A The storage devices 145, 245, 345a in the above Figures 1 to 3A Certain details are described in relation to block diagram 300b.

[0046] exist Figure 3B In an example of , a storage device 345b (such as an external SSD) includes eight (8) capacitor pads 351b for detecting user gestures: pad 1 351b-1, pad 2 351b-2, pad 3 351b-3, pad 4 351b-4, pad 5 351b-5, pad 6 351b-6, pad 7 351b-7, and pad 8 351b-8. For example, the capacitor pads 351b can be implemented with a heat sink embedded in or placed near the cover of the storage device 345b. The heat sink embedded in or placed near the cover of the storage device 345b can be divided into multiple pieces to form the capacitor pads 351b. The capacitor pads 351b can be on the underside of the cover. The capacitor pads 351b are arranged in multiple rows or matrices and can detect user gestures in two dimensions (e.g., x-axis and y-axis, or horizontal axis and vertical axis). Capacitive pad 351b can detect gestures in different directions within each dimension. In the first dimension 370b-1 (e.g., along the x-axis or horizontal axis), capacitive pad 351b can detect user gestures from left to right or from right to left. In the second dimension 370b-2 (e.g., along the y-axis or vertical axis), capacitive pad 351b can detect user gestures from top to bottom or from bottom to top. Each gesture can be associated with a specific command about storage device 345b. In response to detecting a gesture, storage device 345b can determine the associated command and execute the command appropriately. FIG. 3A to FIG. 3B The examples are provided for illustrative purposes, and the capacitive pad 351 may be implemented in any suitable manner or configuration. For example, if the capacitive pad 351 is configured to be three-dimensional, the capacitive pad 351 may be able to detect user gestures in three dimensions.

[0047] Figure 4A 4 is a block diagram 400a illustrating an example storage device 445a for providing a multi-channel capacitive sensor for detecting gesture-based commands according to certain embodiments. In some embodiments, Figure 4A The components can be similar to Figures 1 to 3B For example, storage device 445a may be similar to Figures 1 to 3B The storage devices 145, 245, 345 in the above Figures 1 to 3B Certain details are described regarding block diagram 400a.

[0048] exist Figure 4A In an example of , a storage device 445a (such as an external SSD) includes four (4) capacitor pads 451a for detecting user gestures: pad 1 451a-1, pad 2 451a-2, pad 3 451a-3, and pad 4 451a-4. For example, the capacitor pads 451a can be implemented with a heat sink embedded in or placed near the cover 460a of the storage device 445a. The heat sink embedded in or placed near the cover 460a of the storage device 445a can be divided into multiple pieces to form the capacitor pads 451a. The capacitor pads 451a can be on the underside of the cover 460a. Figure 4A The example of shows the underside of the cover 460a of the storage device 445a. The capacitor pads 451a are arranged in a row or in series and can detect user gestures in one dimension. The capacitor pads 451a can detect gestures in different directions within one dimension, for example, a user gesture from left to right or from right to left. Each gesture can be associated with a specific command with respect to the storage device 445a. In response to detecting a gesture, the storage device 445a can determine the associated command and execute the command appropriately.

[0049] Figure 4B 4 is a block diagram 400b illustrating an example storage device 445b for providing a multi-channel capacitive sensor for detecting gesture-based commands according to certain embodiments. In some embodiments, Figure 4B The components can be similar to Figures 1 to 4A For example, storage device 445b may be similar to Figures 1 to 4A The storage devices 145, 245, 345, 445a in the above Figures 1 to 4A Certain details are described regarding block diagram 400b.

[0050] Figure 4B An example storage device such as Figure 4A For example, Figure 4BA perspective view of different components or layers within a storage device 445b such as an external SSD is shown. Under a cover 460b, a plurality of metal sheets separated from a heat sink may form a plurality of capacitor pads 451b of a multi-channel capacitive sensor in the storage device 445b. The storage device 445b includes four (4) capacitor pads 451b: pad 1 451b-1, pad 2 451b-2, pad 3 451b-3, and pad 4 451b-4. The metal sheets forming the capacitor pads 451b are electrically isolated from each other. The capacitor pads 451b may be electrically connected to exposed copper 463b on a PCBA 461b of the storage device 445b. For example, the capacitor pads 451b may be connected to the exposed copper 463b via a conductive sponge 462b. For example, the conductive sponge 462b may be a conductive sponge of a type commonly used for grounding. In addition to the conductive sponge, any suitable material may be used to electrically connect the capacitor pad 451b and the exposed copper 463b, such as a metal screw, a metal clamp, a flexible printed circuit board (PCB), etc. Figure 4B In the example of FIG. 4 , the cover 460 b may be made of plastic or other non-conductive material, but in other examples, the cover 460 b may be made of metal.

[0051] According to certain aspects, one or more other metal layers may be between the cover 460b and the PCBA 461b. For example, such metal layers may act as heat sinks in the external SSD to manage thermal requirements. In an example, the external SSD may include various types of layers, which may include a cover, a nano-carbon copper tape (NCCT), a foam, an aluminum heat sink (HS), a thermal interface material (TIM), and a PCBA. Similar layers may be included on either side of the PCBA. For example, the external SSD may include a top cover, a top NCCT, a top foam, a top aluminum HS, a top TIM, a PCBA, a bottom TIM, a bottom aluminum HS, a bottom foam, a bottom NCCT, and a bottom cover. Multiple layers may be metal layers or layers including metals, such as NCCT, aluminum HS, TIM, etc.

[0052] If there are one or more other metal layers between the cover and the PCBA, the metal-containing layer may affect the electric field of the capacitor pads in the cover. Therefore, a calibration may be performed on the external SSD to determine the capacitance value of the capacitor pads in an initial state (e.g., when connected or coupled to a host). For example, the aluminum HS may be grounded and affect the electric field of the capacitor pads. Calibration may be performed when the external SSD is inserted into the host to determine the capacitance values ​​of the capacitor pads and set these values ​​to ground zero or reference values. Subsequently, the fluctuation of the capacitance value of the capacitor pads relative to the ground zero value may be used to determine whether a user gesture is detected. In this way, the presence of a metal-containing layer close to the capacitor pads may be considered when detecting a user gesture. In some cases, if thermal requirements are not required, one or more of the other metal layers between the cover and the PCBA may be removed to reduce the interference of these layers with the electric field of the capacitor pads in the cover.

[0053] Figure 4C 4 is a block diagram 400c illustrating an example storage device 445c for providing a multi-channel capacitive sensor for detecting gesture-based commands according to certain embodiments. In some embodiments, Figure 4C The components can be similar to Figures 1 to 4B For example, storage device 445c may be similar to Figures 1 to 4B The storage devices 145, 245, 345, 445a, 445b in the above Figures 1 to 4B Certain details are described regarding block diagram 400c.

[0054] Figure 4C An example of Figure 4B , but in Figure 4C In the example of , the storage device 445c may include a top cover 460c-1 and a bottom cover 460c-2, and the capacitor pad 451c may be implemented in or near the top cover 460c-1 and the bottom cover 460c-2. For example, a heat sink in or near the bottom cover 460c-2 may be used to form the additional capacitor pad 451c. Figure 4C In the example of , the top cover 460c-1 includes pad 1 451c-1, pad 2 451c-2, pad 3 451c-3 and pad 4 451c-4; the bottom cover 460c-2 includes pad 5 451c-5, pad 6 451c-6, pad 7 451c-7 and pad 8 451c-8. The metal sheets forming the capacitor pads 451c are electrically isolated from each other. The capacitor pads 451c can be electrically connected to the exposed copper on the PCBA 461c of the storage device 445c. For example, the capacitor pads 451c-1, c-2, c-3, c-4 can be connected to the exposed copper 463c-1, c-2, c-3, c-4 through the conductive sponges 462c-1, c-2, c-3, c-4, respectively. Capacitor pads 451c-5, c-6, c-7, c-8 may be connected to exposed copper (not shown) on the other side of PCBA 461c through conductive sponges 462c-5, c-6, c-7, c-8, respectively. The exposed copper (not shown) connected to capacitor pads 451c-5, c-6, c-7, c-8 may be similar to exposed copper 463c-1, c-2, c-3, c-4. Conductive sponge is provided as an example, and other types of materials may be used to connect capacitor pads 451c and exposed copper on PCBA 461c, including metal screws, metal clamps, flexible PCBs, etc.

[0055] Figure 4D 4 is a block diagram 400d illustrating an example storage device 445d for providing a multi-channel capacitive sensor for detecting gesture-based commands according to certain embodiments. Figure 4D The components can be similar to Figures 1 to 4C For example, storage device 445d may be similar to Figures 1 to 4C The storage devices 145, 245, 345, 445a, 445b, 445c in the above. Figures 1 to 4C Certain details are described regarding block diagram 400d.

[0056] Figure 4D An example of Figure 4B , but in Figure 4D In the example of , the storage device 445d may include a top cover 460d-1 and a side cover 460d-2, and the capacitor pad 451d may be implemented in or near the top cover 460d-1 and the side cover 460d-2. For example, a heat sink in or near the side cover 460c-2 may be used to form the additional capacitor pad 451d. Figure 4D In the example of , the top cover 460d-1 includes pad 1 451d-1, pad 2 451d-2, pad 3 451d-3 and pad 4 451d-4; the side cover 460d-2 includes pad 5 451d-5 and pad 6 451d-6. As an example, the side cover 460d-2 is shown as including two capacitor pads 451d-5, d-6, and the side cover 460d-2 may include any number of capacitor pads 451d. The capacitor pads 451d may be arranged in series or in a matrix as appropriate. The metal sheets forming the capacitor pads 451d are electrically isolated from each other. The capacitor pads 451d-5, d-6 on the side cover 460d-2 may be electrically connected to the PCBA 461d of the storage device 445d, for example on one side of the PCBA 461d. The electrical connection between capacitor pads 451d-5, d-6 and PCBA 461d is Figure 4D d-5, d-6 can be connected to the exposed copper on the side of PCBA 461d using a suitable connection. Figure 4D The example shows one side cover 460d-2 for illustrative purposes, and the capacitor pad 451d can be implemented in or near multiple side covers 460d-2. For example, the storage device 445d may include a heat sink embedded in or near one or more side covers 460d-2 or on the side to improve thermal management. In some embodiments, Figure 4D The example can be combined with Figure 4C In an example implementation, a capacitor pad 451 using a heat sink may be implemented in or near a top cover, a bottom cover, and a side cover 460 of a storage device 445 .

[0057] Figure 5Ais a block diagram 500a illustrating an example storage device 545a for providing a multi-channel capacitive sensor for detecting gesture-based commands according to some embodiments. Figure 5B is a block diagram 500b illustrating an example storage device 545b for providing a multi-channel capacitive sensor for detecting gesture-based commands according to some embodiments. Figure 5C is a block diagram 500c illustrating an example storage device 545c for providing a multi-channel capacitive sensor for detecting gesture-based commands in accordance with certain embodiments. Figure 5D 5 is a block diagram 500d illustrating an example storage device 545d for providing a multi-channel capacitive sensor for detecting gesture-based commands according to certain embodiments. FIG. 5A to FIG. 5D The components can be similar to Figures 1 to 4D For example, the storage device 545 may be similar to Figures 1 to 4D The storage devices 145, 245, 345, 445 in the above are combined Figures 1 to 4D Certain details are described regarding block diagrams 500a, 500b, 500c, 500d.

[0058] In some embodiments, the cover of the storage device 545 can be made of metal and can be used to form the capacitive pads 551 of the multi-channel capacitive sensor in the storage device 545 . Figure 5A The storage device 545a is shown as an external SSD, and Figure 5B Storage device 545b is shown as a USB flash drive. Figure 5A In the example of , storage device 545a includes two (2) capacitor pads or electrodes 551a formed by a sheet of metal cover. Storage device 545a includes pad 1 551a-1 and pad 2 551a-2 separated by insulating sheet 564a. Insulating sheet 564a can be made of plastic or any other suitable material. Insulating sheet 564a can electrically isolate capacitor pad 551a. Similarly, in Figure 5BIn the example of , the storage device 545b includes two (2) capacitor pads or electrodes 551b formed by a sheet of metal cover. The storage device 545b includes pad 1 551b-1 and pad 2 551b-2 separated by an insulating sheet 564b. The insulating sheet 564b may be made of plastic or any other suitable material. The insulating sheet 564b may electrically isolate the capacitor pads 551b. As an example, the insulating sheet 564 may be a transparent or translucent sheet, for example, through which light emitting diode (LED) lighting is shown. Two capacitor pads 551 are shown as an example, and the storage device 545 may include any number of capacitor pads. In some cases, the capacitor pads made of metal cover can be used for USB drives, because USB drives tend to be small and mostly made of metal. As described in conjunction with other examples, the storage device 545 may also include other metal layers or materials that affect the electric field of the capacitor pads 551 and perform calibration appropriately.

[0059] FIG. 5C to FIG. 5D Respectively similar to FIG. 5A to FIG. 5B , but four (4) capacitor pads or electrodes 551 are shown. Figure 5C Storage device 545c is shown as an external SSD. Capacitor pads 551c-1, c-2, c-3, c-4 may be arranged in series and may be electrically isolated by insulating sheets 564c-1, c-2, c-3. Figure 5D Storage device 545d is shown as a USB flash drive. Capacitor pads 551d-1, d-2, d-3, d-4 may be arranged in series and may be electrically isolated by insulating sheets 564d-1, d-2, d-3. Capacitor pads 551c, 551d may also be arranged in a matrix. One or more insulating sheets 564c, 564d may divide capacitor pads 551c, 551d. Insulating sheet 564 may be linear or have any suitable shape for dividing capacitor pads 551. As an example, cross-shaped insulating sheets 564c, 564d may isolate capacitor pads 551c, 551d into a two-by-two (2×2) matrix.

[0060] A storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands can enable data requests or operations without the user having to provide commands through a host. A user can directly initiate a data request or operation through a storage device using a gesture. In addition, gestures can also be used to facilitate user interaction with a storage device to perform different types of authentication, such as FIDO, Bluetooth, etc. In this way, a storage device for providing a multi-channel capacitive sensor for detecting gesture-based commands can make it easy and seamless for a user to perform various functionalities associated with the storage device. In addition, by implementing the capacitive pads of the multi-channel capacitive sensor within the storage device using a heat sink, the storage device can remain compact and manage thermal requirements. The examples described herein are provided for illustrative purposes, and many variations are possible. The features described in conjunction with the various embodiments and / or examples can be implemented individually or in combination.

[0061] Figure 6 600 is shown for performing capacitance sensor calibration in a data storage device according to one or more embodiments. The workflow process 600 may be implemented by a storage system or storage device, such as Figures 1 to 5D The storage system 140 or storage device 145, 245, 345, 445, 545 in FIG. 700 may be partially or completely executed by a controller of the storage device and / or a multi-channel capacitive sensor. Figure 2 The storage device 245 in the embodiment of the present invention explains the process 600. Figures 1 to 5D Certain details related to process 600 are explained in greater detail. Depending on the implementation, process 600 may include fewer or additional blocks, and the blocks may be performed in a different order than shown.

[0062] Process 600 may start at block 605. Process 600 may be performed in part or in whole by another component of controller 246, capacitive sensor chip 250, and / or storage device 245. At block 610, power is turned on for storage device 245. At block 615, storage device 245 may train the sensor or capacitive pad 251 for a baseline relative to the internal configuration and external environment of storage device 245. At block 620, storage device 245 may periodically monitor the sensor every threshold value or time period Tp. Tp may be configured and specified in any appropriate time unit. For example, Tp may be specified in milliseconds. At block 625, if there is a change in the sensor value, storage device 245 may record the value and send an interrupt to the main controller at block 630 to send data. For example, capacitive sensor chip 250 may record the sensor value and send an interrupt to controller 246. At block 625, if there is no change in the sensor value, process 600 may return to block 620. At block 635, storage device 245 may periodically recalibrate the sensor for new environmental changes. Process 600 may return to block 620. Process 600 may end at block 640.

[0063] Figure 7 A workflow process 700 is shown for providing a multi-channel capacitive sensor for detecting gesture-based commands in a data storage device according to one or more embodiments. The workflow process 700 may be implemented by a storage system or storage device, such as Figures 1 to 5D The storage system 140 or storage device 145, 245, 345, 445, 545 in FIG. 700 may be partially or completely executed by a controller of the storage device and / or a multi-channel capacitive sensor. Figure 2 The storage device 245 in the embodiment of the present invention explains the process 700. Figures 1 to 6 Certain details related to process 700 are explained in greater detail. Depending on the implementation, process 700 may include fewer or additional blocks, and the blocks may be performed in a different order than shown.

[0064] At block 705 , the storage device 245 may provide non-volatile memory. For example, the non-volatile memory may store data of the storage device 245 .

[0065] At block 710, the storage device 245 may provide a plurality of metal sheets configured to form one or more heat sinks of the storage device 245 and to form a plurality of capacitor pads 251 of a capacitive sensor configured to detect a user gesture. For example, the capacitive sensor may be configured to detect a user gesture, and the capacitive sensor may include a plurality of capacitor pads 251 formed by a plurality of metal sheets forming one or more heat sinks of the storage device 245. In some embodiments, the capacitive sensor is a multi-channel capacitive sensor. In certain embodiments, the plurality of capacitor pads 251 may be embedded in or placed below the cover of the storage device 245. For example, the cover may be made of plastic or another non-conductive material. In other embodiments, the plurality of capacitor pads 251 form a metal cover of the storage device 245. The storage device 245 may be one or more of the following: an external solid-state drive (SSD), a universal serial bus (USB) flash drive, a secure digital (SD) card, or a micro secure digital (uSD) card. In an example, the plurality of capacitor pads 251 are arranged in rows. In another example, the plurality of capacitor pads 251 are arranged in a matrix.

[0066] At block 715, the storage device 245 may detect a gesture of a user near the plurality of capacitive pads 251 using a capacitive sensor. In some embodiments, the gesture is associated with a command to perform an operation related to Fast Identity Online (FIDO) authentication. In certain embodiments, the gesture is associated with a command to perform an operation related to Bluetooth-based authentication. In certain embodiments, the gesture is associated with a command to perform a full file copy of data from the storage device 245 to the host. In another embodiment, the gesture is associated with a command to perform a full backup of data from the host to the storage device 245. Examples of gestures may include swiping from left to right, swiping from right to left, swiping from top to bottom, swiping from bottom to top, and the like.

[0067] At block 720 , the storage device 245 may execute a command associated with the storage device 245 based on the detected gesture.

[0068] In some embodiments, storage device 245 includes one or more additional metal layers or metal materials in addition to plurality of capacitive pads 251 within storage device 245. Storage device 245 may be further configured to perform calibration to determine initial capacitance values ​​of plurality of capacitive pads 251 in response to storage device 245 being coupled to a host.

[0069] Figure 8It is a diagram of a computing device 1000 according to one or more embodiments. The computing device 1000 can execute instructions that can make the computing device 1000 perform any one or more methodologies (e.g., operations, methods, functions, etc.) discussed herein. The computing device 1000 can be a mobile phone, a smart phone, a netbook computer, a rack server, a router computer, a server computer, a personal computer, a mainframe computer, a laptop computer, a tablet computer, a desktop computer, etc., in which a group of instructions for making the machine perform any one or more methodologies discussed herein can be executed. In an alternative embodiment, the machine can be connected (e.g., networked) to other machines in a LAN, an intranet, an extranet, or the Internet. The machine can operate with the ability of a server machine in a client-server network environment. The machine can be a personal computer (PC), a set-top box (STB), a server, a network router, a switch or a bridge, or any machine that can execute a group of instructions (sequential or other), and these instructions specify the actions to be taken by the machine. Further, while a single machine is illustrated, the term "machine" shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the functions, operations, methods, algorithms, etc. described herein.

[0070] The example computing device 1000 includes a processing device 1002 (e.g., a processor, a controller, a central processing unit (CPU), etc.), a main memory 1004 (e.g., a read-only memory (ROM), a flash memory, a dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM)), a network access interface 1008, a direct access interface 1009, an output device 1010, an input device 1012, and a data storage device 1018, which communicate with each other via a bus 1030.

[0071] The processing device 1002 represents one or more general-purpose processing devices, such as a microprocessor, a central processing unit, etc. More specifically, the processing device 1002 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that implements other instruction sets or a processor that implements a combination of instruction sets. The processing device 1002 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. The processing device 1002 is configured to execute the storage module instructions 1035 for performing the operations and steps discussed herein.

[0072] The computing device 1000 may include a network access interface 1008 (eg, a network interface card, a Wi-Fi interface, etc.) that can communicate with a network (eg, Figure 1The computing device 1000 may also include a direct access interface 1009 (e.g., a USB interface, a serial advanced technology attachment (eSATA) interface, a Thunderbolt interface, etc.). The computing device 1000 may also include an output device 1010 (e.g., a liquid crystal display (LCD) or a cathode ray tube (CRT)) and an input device 1012 (e.g., a mouse, a keyboard, etc.). In one embodiment, the output device 1010 and the input device 1012 may be combined into a single component or device (e.g., an LCD touch screen).

[0073] The data storage device 1018 may include a computer-readable storage medium 1028 on which is stored one or more sets of instructions (e.g., storage module instructions 1035) embodying any one or more of the methodologies or functionality described herein. The storage module instructions 1035 may also reside completely or at least partially within the main memory 1004 and / or within the processing device 1002 during execution by the computing device 1000. The main memory 1004 and the processing device 1002 may also constitute computer-readable media. Instructions may also be transmitted or received via the network access interface 1008 and / or the direct access interface 1009.

[0074] Although the computer-readable storage medium 1028 is shown as a single medium in the example embodiment, the term "computer-readable storage medium" should be taken to include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) that store one or more sets of instructions. The term "computer-readable storage medium" should also be taken to include any medium that can store, encode, or carry a set of instructions for execution by a machine and cause the machine to perform any one or more of the methodologies of the present disclosure. The term "computer-readable storage medium" should therefore be taken to include, but is not limited to, solid-state memories, optical media, and magnetic media.

[0075] General Notes

[0076] Those skilled in the art will appreciate that in some embodiments, other types of data storage systems may be implemented while remaining within the scope of the present disclosure. In addition, the actual steps taken in the processes described herein may differ from those described or shown in the accompanying drawings. Depending on the embodiment, some of the above steps may be removed and other steps may be added.

[0077] Although certain embodiments have been described, these embodiments are presented only as examples and are not intended to limit the scope of protection. In fact, the novel methods and systems described herein can be embodied in various other forms. In addition, various omissions, substitutions and changes can be made to the form of the methods and systems described herein. The attached claims and their equivalents are intended to cover these forms or modifications that fall within the scope of protection and essence. For example, the various components shown in the figures can be implemented as software and / or firmware on a processor, ASIC / FPGA or dedicated hardware. Moreover, the features and attributes of the specific embodiments disclosed above can be combined in different ways to form additional embodiments, all of which fall within the scope of the present disclosure. Although the present disclosure provides certain preferred embodiments and applications, other embodiments that are obvious to those of ordinary skill in the art, including embodiments that do not provide all the features and advantages described herein, are also within the scope of the present disclosure. Therefore, the scope of the present disclosure is intended to be limited only by reference to the attached claims.

[0078] The words "example" or "exemplary" are used herein to indicate use as an example, instance or illustration. Any aspect or design described herein as "example" or "exemplary" is not necessarily to be interpreted as being more preferred or advantageous than other aspects or designs. On the contrary, the use of the words "example" or "exemplary" is intended to present concepts in a specific way. As used in this application, the term "or" is intended to represent an inclusive "or" rather than an exclusive "or". That is, unless otherwise specified or clearly indicated from the context, "X includes A or B" is intended to represent any natural arrangement. That is, if X includes A; then X includes B; or X includes A and B, then "X includes A or B" is satisfied under any of the aforementioned examples. In addition, the articles "one" ("a" and "an") used in this application and the appended claims should generally be understood to mean "one or more", unless otherwise specified or clearly indicated from the context as a singular form. In addition, unless so described, the use of the terms "embodiment" or "one embodiment" or "implementation" or "one embodiment" throughout is not intended to represent the same embodiment or implementation. In addition, the terms “first,” “second,” “third,” “fourth,” etc. used herein refer to labels for distinguishing different elements and may not necessarily have sequential meanings according to their numerical indices.

[0079] The methods and processes described herein may be embodied in software code modules executed by one or more general and / or special computers / processors, and partially or completely automated via them. The term "module" may refer to logic embodied in hardware and / or firmware, or may refer to a collection of software instructions written in a programming language such as, for example, C or C++ that may have entry and exit points. A software module may be compiled and linked into an executable program, installed in a dynamic link library, or may be written in an interpreted programming language such as, for example, BASIC, Perl, or Python. It should be understood that a software module may be called from other modules or from itself, and / or may be called in response to a detected event or interrupt. Software instructions may be embedded in firmware, such as an erasable programmable read-only memory (EPROM). Software instructions may be stored on any type of computer-readable medium (e.g., a non-transient computer-readable medium) or other computer storage device or a collection of storage devices. "Module" may also refer to one or more devices, components, systems, or subsystems that can conceptually implement related functionality. It should also be understood that hardware modules may be composed of connected logical units such as gates and flip-flops, and / or may be composed of programmable units such as programmable gate arrays, application specific integrated circuits, and / or processors. The modules described herein are preferably implemented as software modules, but may be represented in hardware and / or firmware. Furthermore, while in some embodiments, modules may be compiled separately, in other embodiments, modules may represent a subset of the instructions of a separately compiled program and may not have interfaces that may be used by other logical program units.

Claims

1. A data storage device, comprising: Non-volatile memory; a plurality of metal sheets configured to form one or more heat sinks for the data storage device and to form a plurality of capacitive pads of a capacitive sensor configured to detect user gestures; and A controller, the controller being configured to: detecting a user's gesture near the plurality of capacitive pads using the capacitive sensor; and A command associated with the data storage device is executed based on the detected gesture.

2. The data storage device of claim 1, wherein the capacitive sensor is a multi-channel capacitive sensor. 3 . The data storage device of claim 1 , wherein the plurality of capacitor pads are embedded in a cover of the data storage device or are placed under the cover.

4. The data storage device of claim 3, wherein the cover is made of plastic or another non-conductive material.

5. The data storage device of claim 1, wherein the plurality of capacitor pads form a metal cover for the data storage device.

6. The data storage device of claim 1, wherein the gesture is associated with a command to perform an operation related to Fast Identity Online (FIDO) authentication.

7. The data storage device of claim 1, wherein the gesture is associated with a command to perform an operation related to Bluetooth-based authentication.

8. The data storage device of claim 1, wherein the gesture is associated with a command to perform a full file copy of data from the data storage device to a host computer.

9. The data storage device of claim 1, wherein the gesture is associated with a command to perform a full backup of data from a host to the data storage device.

10. The data storage device of claim 1, wherein the data storage device comprises one or more additional metal layers or metal materials within the data storage device in addition to the plurality of capacitor pads. 11 . The data storage device of claim 10 , wherein the controller or the capacitive sensor is further configured to perform a calibration to determine initial capacitance values ​​of the plurality of capacitive pads in response to the data storage device being coupled to a host.

12. The data storage device of claim 1, wherein the data storage device is one or more of: an external solid-state drive (SSD), a universal serial bus (USB) flash drive, a secure digital (SD) card, or a micro secure digital (uSD) card.

13. The data storage device of claim 1, wherein the plurality of capacitor pads are arranged in a row.

14. The data storage device of claim 1, wherein the plurality of capacitor pads are arranged in a matrix.

15. A method for processing a data request in a data storage device, the method comprising: Providing non-volatile memory; providing a plurality of metal sheets configured to form one or more heat sinks for the data storage device and to form a plurality of capacitive pads of a capacitive sensor configured to detect user gestures; detecting a user's gesture near the plurality of capacitive pads using the capacitive sensor; as well as A command associated with the data storage device is executed based on the detected gesture. The method of claim 15 , wherein the capacitive sensor is a multi-channel capacitive sensor.

17. The method of claim 15, wherein the plurality of capacitor pads are embedded in or positioned under a cover of the data storage device.

18. The method of claim 17, wherein the cover is made of plastic or another non-conductive material.

19. The method of claim 15, wherein the plurality of capacitor pads form a metal cover for the data storage device.

20. A data storage device, the data storage device comprising: Non-volatile memory; a plurality of metal sheets configured to form one or more heat sinks for the data storage device and to form a plurality of capacitive pads of a capacitive sensor configured to detect user gestures; and A controller device, the controller device being configured to: detecting a user's gesture near the plurality of capacitive pads using the capacitive sensor; and A command associated with the data storage device is executed based on the detected gesture.

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