Display panel and display device
Patent Information
- Application Number
- CN202380008911.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-04-28
- Publication Date
- 2024-12-31
AI Technical Summary
Existing LED display panels have poor effects due to the high reflectivity of metal signal lines to ambient light. When reducing the reflectivity, the absorption rate of the black film needs to be increased, resulting in increased power consumption.
Adopt a display panel design that includes a light-absorbing layer, in which the orthographic projection of the light-absorbing layer on the substrate overlaps with the driving layer, and is electrically connected to the conductive pad through the first via hole to reduce the reflection of ambient light by the driving layer and improve auxiliary light absorption The transmittance of the layer reduces the driving current demand on the light-emitting unit.
It effectively reduces the reflectivity of the display panel to ambient light, improves the overall display brightness, reduces power consumption, and avoids the problem of excessive light absorption by the black film.
Smart Images

Figure CN119234321A_ABST
Abstract
Description
Display panel and display device Technical Field
[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art
[0002] With the development of display technology, LED display panels have become the most advantageous new generation display media and have been widely used due to their advantages of pure color, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, large viewing angle and stable and reliable operation.
[0003] Currently, LED display panels typically include a driver backplane and multiple LEDs located on one side of the driver backplane. The driver backplane can send drive signals to each LED, causing the LED to emit corresponding light, thereby allowing the LED display panel to present a corresponding display image.
[0004] However, the driver backplane usually contains multiple metal signal lines, which have a high reflectivity to ambient light. Therefore, current LED display panels are very prone to reflecting ambient light, resulting in poor performance of the LED display panel.
[0005] Summary of the Invention
[0006] The embodiments of the present application provide a display panel and a display device. This can solve the problem of poor performance of LED display panels in the prior art. The technical solution is as follows:
[0007] In one aspect, a display panel is provided, comprising:
[0008] substrate;
[0009] A driving layer located on one side of the substrate, the driving layer having a plurality of conductive pads;
[0010] a light absorbing layer located on a side of the driving layer facing away from the substrate, wherein an orthographic projection of the light absorbing layer on the substrate overlaps with an orthographic projection of the driving layer on the substrate, and the light absorbing layer has a plurality of first via holes corresponding to the plurality of conductive pads, wherein the orthographic projections of the first via holes on the substrate overlap with the orthographic projections of the corresponding conductive pads on the substrate;
[0011] Also, a plurality of light-emitting units are located on a side of the light-absorbing layer away from the substrate, wherein the light-emitting units are electrically connected to at least a portion of the conductive pads through the first via holes.
[0012] Optionally, in the display area of the display panel, the orthographic projection of the light absorbing layer on the substrate covers the orthographic projection of a portion of the driving layer other than the conductive pad on the substrate.
[0013] Optionally, the display panel further includes: a first insulating layer located on a side of the light absorbing layer facing away from the substrate, the first insulating layer having a plurality of second via holes corresponding one-to-one to the plurality of first via holes, the second via holes being connected to the corresponding first via holes;
[0014] Wherein, the light emitting unit is electrically connected to the conductive pad through the second via hole and the first via hole.
[0015] Optionally, a portion of the first insulating layer extends into the first via hole and covers at least a portion of an inner wall of the first via hole;
[0016] The first insulating layer includes at least one of an inorganic insulating layer and an organic insulating layer.
[0017] Optionally, the light absorbing layer includes carbon particles; and the inner wall of the first via hole is completely covered by the first insulating layer.
[0018] Optionally, the first insulating layer includes both an inorganic insulating layer and an organic insulating layer, and the inorganic insulating layer is closer to the light absorbing layer than the organic insulating layer;
[0019] A portion of the inorganic insulating layer extends into the first via hole and covers the inner wall of the first via hole, and / or a portion of the organic insulating layer extends into the first via hole and covers the inner wall of the first via hole.
[0020] Optionally, the first insulating layer includes both an inorganic insulating layer and an organic insulating layer, and the organic insulating layer is closer to the light absorbing layer than the inorganic insulating layer;
[0021] A portion of the inorganic insulating layer extends into the first via hole and covers the inner wall of the first via hole, and / or a portion of the organic insulating layer extends into the first via hole and covers the inner wall of the first via hole.
[0022] Optionally, the light absorbing layer has a thickness ranging from 0.5 micrometers to 5 micrometers.
[0023] Optionally, the optical density OD value of the light absorbing layer is greater than or equal to 4.
[0024] Optionally, the driving layer includes: a first metal layer and a second metal layer stacked together; the display panel further includes: a second insulating layer located between the first metal layer and the second metal layer, the first metal layer being closer to the substrate than the second metal layer;
[0025] The first metal layer includes: a plurality of first drive signal lines; the second metal layer includes: a second drive signal line and the plurality of conductive pads; an extension direction of the first drive signal line intersects with an extension direction of the second drive signal line;
[0026] Among the plurality of conductive pads, a portion of the conductive pads are electrically connected to the second driving signal line, and another portion of the conductive pads are electrically connected to the first driving signal line.
[0027] Optionally, the light-absorbing layer includes: an organic film layer made of an organic material with light-absorbing properties.
[0028] Optionally, an edge area of a side of the substrate facing away from the driving layer includes a binding area, and the display panel further includes a plurality of signal leads located in the binding area, at least some of the plurality of signal leads being electrically connected to the plurality of first driving signal lines;
[0029] In which, the portion of the light absorbing layer covered by the binding area has an auxiliary opening; the display panel has a blank area, which is an area in the binding area that is not covered by the first metal layer and the second metal layer; the orthographic projection of the auxiliary opening on the substrate overlaps with the orthographic projection of the blank area on the substrate.
[0030] Optionally, the orthographic projection of the auxiliary opening on the substrate covers the orthographic projection of the blank area on the substrate; or, the orthographic projection of the blank area on the substrate covers the orthographic projection of the auxiliary opening on the substrate.
[0031] Optionally, the plurality of light-emitting units are arrayed into a plurality of columns, the plurality of first driving signal lines include a plurality of groups of first driving signal lines corresponding to the plurality of columns of light-emitting units, and a group of the first driving signal lines is electrically connected to each light-emitting unit in a corresponding column of light-emitting units;
[0032] The auxiliary openings are distributed at least between two adjacent groups of the first driving signal lines and two adjacent groups of the second driving signal lines.
[0033] Optionally, a group of the first driving signal lines includes a ground line; the second metal layer further includes an auxiliary ground line arranged in parallel with the second driving signal line, the auxiliary ground line is electrically connected to the ground line, and an orthographic projection of the auxiliary ground line on the substrate overlaps with an orthographic projection of the binding area on the substrate;
[0034] Among them, one of the auxiliary grounding lines and the adjacent second driving signal line are distributed between two rows of the light-emitting units, and the auxiliary openings are further distributed between two groups of adjacent first driving signal lines and one of the auxiliary grounding lines and the adjacent second driving signal line.
[0035] Optionally, the display panel further comprises: a plurality of connection traces electrically connected to the plurality of signal leads, a portion of the connection traces being located on a side of the substrate close to the driving layer, and another portion being located on a side surface of the substrate;
[0036] The plurality of connection lines and the plurality of signal leads are formed through the same process.
[0037] Optionally, the light absorbing layer is conductive; the light absorbing layer includes: a metal reflective layer, and a first blackened layer located on a side of the metal reflective layer away from the substrate.
[0038] Optionally, the light absorption layer includes multiple auxiliary signal lines corresponding to the multiple first drive signal lines, a first gap exists between two adjacent auxiliary signal lines, the auxiliary signal lines extend in the same direction as the corresponding first drive signal lines, and are connected in parallel with the corresponding first drive signal lines.
[0039] Optionally, the display panel has a plurality of connecting vias, and the plurality of connecting vias are distributed at least on two sides of the plurality of auxiliary signal lines that are relatively arranged, one end of the auxiliary signal line is electrically connected to the corresponding first drive signal line through at least one of the connecting vias, and the other end of the auxiliary signal line is electrically connected to the corresponding first drive signal line through at least one of the connecting vias.
[0040] Optionally, the light absorption layer includes a plurality of first touch signal lines arranged in parallel, and a second gap is provided between two adjacent first touch signal lines;
[0041] The display panel further includes: a first insulating layer located on a side of the light absorbing layer away from the substrate, and a plurality of second touch signal lines located on a side of the first insulating layer away from the substrate, wherein an extension direction of the second touch signal lines intersects with an extension direction of the first touch signal lines.
[0042] Optionally, at least part of the second touch signal lines are grid-shaped metal signal lines.
[0043] Optionally, the display panel further includes: a virtual signal line located between two adjacent second touch signal lines, at least part of the virtual signal line is a grid-shaped metal signal line, and the virtual signal line is arranged in the same layer and made of the same material as the second drive signal line.
[0044] Optionally, both the second touch signal line and the dummy signal line include: a conductive metal layer and a second blackened layer stacked together, and the conductive metal layer is closer to the substrate than the second blackened layer.
[0045] Optionally, at least one of the second touch signal line and the dummy signal line has a hollow structure, and an orthographic projection of the hollow structure on the substrate covers an orthographic projection of the first via hole on the substrate.
[0046] Optionally, the light absorbing layer further includes an auxiliary metal layer located between the metal reflective layer and the first blackened layer, the conductivity of the auxiliary metal layer is higher than the conductivity of the metal reflective layer, and the reflectivity of the metal reflective layer is higher than the reflectivity of the auxiliary metal layer.
[0047] Optionally, the display panel further includes: a plurality of driving chips, wherein the driving chips are electrically connected to one or more of the light-emitting units;
[0048] The plurality of conductive pads include a first pad group for fixedly connecting to the light emitting unit and a second pad group for fixedly connecting to the driving chip.
[0049] Optionally, the first pad group includes: a first conductive pad and a second conductive pad; the second pad group includes: a third conductive pad, a fourth conductive pad and a fifth conductive pad;
[0050] A portion of the multiple first drive signal lines is electrically connected to the first conductive pad, the second conductive pad is electrically connected to the third conductive pad, another portion of the multiple first drive signal lines is electrically connected to the fourth conductive pad, and the second drive signal line is electrically connected to the fifth conductive pad.
[0051] Optionally, the display panel further includes: an auxiliary light absorption layer located on a side of the plurality of light emitting units away from the substrate, the auxiliary light absorption layer covering both the driving chip and the light emitting units.
[0052] On the other hand, a display device is provided, comprising: a driving component, and the display panel as described above;
[0053] The driving component is electrically connected to the driving layer, and the driving component is used to provide a driving signal to the light-emitting unit through the driving layer.
[0054] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:
[0055] A display panel includes: a substrate, a driving layer, a light absorbing layer, and a plurality of light emitting units. The orthographic projection of the light absorbing layer on the substrate overlaps with the orthographic projection of the driving layer on the substrate. In this way, the light absorbing layer can absorb ambient light directed toward the display panel, so that the degree of reflection of the ambient light directed toward the display panel by the driving layer is low, thereby ensuring that the reflectivity of the display panel to ambient light is low. In addition, by providing a light absorbing layer in the display panel, the reflectivity of the display panel to ambient light can be reduced. Therefore, the transmittance of the auxiliary light absorbing layer located on the side of the plurality of light emitting units away from the substrate can be appropriately increased, so that the light absorption rate of the auxiliary light absorbing layer is low, thereby making the degree of absorption of the light emitted by the light emitting unit by the auxiliary light absorbing layer low. In this way, the overall display brightness of the display panel can be made higher without requiring the display panel to provide a large driving current to the light emitting unit, thereby effectively reducing the power consumption of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS
[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0057] FIG1 is a top view of a display panel provided in an embodiment of the present application;
[0058] FIG2 is a schematic diagram of the film layer structure of the display panel at AA′ shown in FIG1 ;
[0059] FIG3 is a schematic diagram of a film structure of a display panel provided in an embodiment of the present application;
[0060] FIG4 is a schematic diagram of a film structure of a driving backplane in a display panel provided by an embodiment of the present application;
[0061] FIG5 is a schematic diagram of a film structure of a driving backplane in another display panel provided by an embodiment of the present application;
[0062] FIG6 is a schematic diagram of a film structure of a driving backplane in another display panel provided in an embodiment of the present application;
[0063] FIG7 is a schematic diagram of a film structure of a driving backplane in another display panel provided in an embodiment of the present application;
[0064] FIG8 is a partial top view of a driving backplane in a display panel provided by an embodiment of the present application;
[0065] FIG9 is a partial top view of a display panel provided in an embodiment of the present application;
[0066] FIG10 is a schematic diagram of the back of a display panel provided in an embodiment of the present application;
[0067] FIG11 is a schematic side view of the display panel shown in FIG10 ;
[0068] FIG12 is a partial top view of a display panel provided in another embodiment of the present application;
[0069] FIG13 is a partial top view of another display panel provided in another embodiment of the present application;
[0070] FIG14 is a partial top view of the display panel shown in FIG13 with the light absorbing layer removed;
[0071] FIG15 is a schematic diagram of a film structure of a light absorbing layer provided in an embodiment of the present application;
[0072] FIG16 is a partial top view of a display panel provided in yet another embodiment of the present application;
[0073] FIG17 is a schematic diagram of the film layer structure of the display panel at position BB′ shown in FIG16 ;
[0074] FIG18 is a partial top view of another display panel provided in yet another embodiment of the present application;
[0075] FIG19 is a schematic diagram of the film structure of the display panel shown in FIG18;
[0076] FIG20 is a top view of a plurality of second touch signal lines provided in an embodiment of the present application;
[0077] FIG21 is a schematic diagram of a film structure of a second touch signal line or a dummy signal line provided in an embodiment of the present application;
[0078] FIG22 is a partially enlarged view of a second touch signal line and a dummy signal line provided in an embodiment of the present application. DETAILED DESCRIPTION
[0079] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.
[0080] In the related art, a black film is typically installed in an LED display panel to reduce its reflectivity to ambient light. For example, the black film can be located on the side of the LEDs facing away from the driver backplane. This absorbs some of the ambient light directed toward the LED display panel, minimizing reflection from the metal signal lines in the driver backplane.
[0081] However, to reduce the reflectivity of the LED display panel to ambient light, the black film must have a high light absorption rate. However, when the black film has a high light absorption rate, its transmittance is low. For example, the transmittance of the black film is typically less than 30%, resulting in a high absorption rate of light emitted from the LED. Therefore, the driver backplane needs to supply a higher current to the LED to ensure a high overall display brightness, which in turn results in higher power consumption of the LED display panel.
[0082] Please refer to Figures 1 and 2. Figure 1 is a top view of a display panel provided in an embodiment of the present application, and Figure 2 is a schematic diagram of the film layer structure of the display panel at AA' shown in Figure 1. Here, the display panel 000 may include: a substrate 100, a driving layer 200, a light absorbing layer 300, and a plurality of light-emitting units 400.
[0083] The driving layer 200 in the display panel 000 may be located on one side of the substrate 100 , and the driving layer 200 may have a plurality of conductive pads S. Here, the driving layer 200 may include a metal signal line with a high reflectivity.
[0084] The light absorbing layer 300 in the display panel 000 can be located on the side of the driving layer 200 facing away from the substrate 100. The orthographic projection of the light absorbing layer 300 on the substrate 100 overlaps with the orthographic projection of the driving layer 200 on the substrate 100. In this way, the light absorbing layer 300 can absorb ambient light directed toward the display panel 000, so that the degree of reflection of the ambient light directed toward the display panel 000 by the driving layer 200 is low, thereby ensuring that the reflectivity of the display panel 000 to ambient light is low. Furthermore, the light absorbing layer 300 in the display panel 000 can have multiple first vias V1 corresponding to multiple conductive pads S, and the orthographic projection of each first via V1 on the substrate 100 can overlap with the orthographic projection of the corresponding conductive pad S on the substrate 100. For example, the orthographic projection of each first via V1 on the substrate 100 can be located within the orthographic projection of the corresponding conductive pad S on the substrate 100. In this way, it can be ensured that the light absorbing layer 300 does not block the conductive pad S, so that the conductive pad S can be electrically connected to the light emitting unit 400 later.
[0085] For example, in the display area of the display panel 000, the orthographic projection of the light absorbing layer 300 in the display panel 000 on the substrate 100 can cover the orthographic projection of the portion of the driving layer 200 other than the conductive pad S on the substrate 100. That is, in the display area of the display panel 000, the portion of the driving layer 200 other than the conductive pad S will be blocked by the light absorbing layer 300. It should be noted that the display area of the display panel 000 refers to: the area on the front of the display panel 000 that can display the picture. Usually, the front of the display panel 000 also includes a non-display area distributed around the display area. In a possible embodiment, the light absorbing layer 300 in the display panel 000 can be distributed in the non-display area of the display panel 000,
[0086] Since the conductive pads S in the driving layer 200 need to be connected to the light-emitting unit 400, the conductive pads S can be blocked by the light-emitting unit 400. However, the portion of the driving layer 200 other than the conductive pads S is a metal portion with a high reflectivity and will not be blocked by the light-emitting unit 400. Therefore, when the light-absorbing layer 300 covers the portion of the driving layer 200 other than the conductive pads S, the overall reflectivity of the display panel 000 can be further reduced.
[0087] The multiple light-emitting units 400 in the display panel 000 can all be located on the side of the light-absorbing layer 300 facing away from the substrate 100. Here, the light-emitting unit 400 can be electrically connected to at least part of the conductive pad S through the first via V1, so that the driving layer 300 in the display panel 000 can drive the light-emitting unit 400 to emit light through the conductive pad S. It should be noted that the portion of the display panel 000 located below the multiple light-emitting units 400 is the driving backplane in the display panel 000, that is, the driving backplane can include the substrate 100, and the driving layer 200 and the light-absorbing layer 300 located on one side of the substrate 100. The multiple light-emitting units 400 in the display panel 000 can all be arranged on the driving backplane. Here, below the multiple light-emitting units 400 refers to the side opposite to the light emitting direction of the multiple light-emitting units 400.
[0088] In one possible implementation, the light-emitting unit 400 in the display panel 000 may be an LED. In another possible implementation, the light-emitting unit 400 in the display panel 000 may include not only an LED but also a driver chip electrically connected to the LED. Here, the driver chip can control the light emission of the LED and the brightness of the LED. The following embodiments are all schematically described using the example of a light-emitting unit 400 including both an LED and a driver chip.
[0089] As shown in Figure 3, Figure 3 is a simplified diagram of the film layer structure of a display panel provided in an embodiment of the present application. The light-emitting unit 400 in the display panel 000 may include: an LED 401 and a driver chip 402. Here, both the LED 401 and the driver chip 402 need to be electrically connected to the drive layer 300 in the display panel 000 through a conductive pad S. It should be noted that the LED 401 can be a regular-sized LED, a mini light-emitting diode (English: mini Light-Emitting Diode, abbreviated as: mini-LED), or a micro LED.
[0090] Since the color of the outer surface of the LED 401 is quite different from the color of the outer surface of the driver chip 402, an auxiliary light absorbing layer 500 needs to be provided in the display panel 000. Here, the auxiliary light absorbing layer 500 can be located on the side of the plurality of light-emitting units 400 facing away from the substrate 100, and the auxiliary light absorbing layer 500 simultaneously covers the LED 401 and the driver chip 402 in each light-emitting unit 400. It should be noted that the auxiliary light absorbing layer 500 is also commonly referred to as a black film. When the auxiliary light absorbing layer 500 simultaneously covers the LED 401 and the driver chip 402, the outer surface of the LED 401 and the outer surface of the driver chip 402 can both appear black, thereby effectively eliminating the color difference between the outer surfaces of the LED 401 and the driver chip 402. Of course, in other possible implementations, it is also possible not to provide a separate auxiliary light absorbing layer 500, but to perform a blackening treatment on the outer surfaces of the LED 401 and the driver chip 402 to eliminate the color difference between the two. This embodiment of the present application is not limited to this.
[0091] In the embodiment of the present application, the light absorption layer 300 provided in the display panel 000 can reduce the reflectivity of the display panel 000 to ambient light. Therefore, the transmittance of the auxiliary light absorption layer 500 located on the side of the plurality of light-emitting units 400 facing away from the substrate 100 can be appropriately increased, resulting in a lower light absorption rate of the auxiliary light absorption layer 500. This, in turn, reduces the degree to which light emitted by the light-emitting units 400 is absorbed by the auxiliary light absorption layer 500. This allows the overall display brightness of the display panel 000 to be higher without requiring the display panel 000 to provide a large drive current to the light-emitting units 400, thereby effectively reducing the power consumption of the display panel.
[0092] In summary, the display panel provided by the embodiment of the present application includes: a substrate, a driving layer, a light absorbing layer and a plurality of light emitting units. The orthographic projection of the light absorbing layer on the substrate overlaps with the orthographic projection of the driving layer on the substrate. In this way, the ambient light directed toward the display panel can be absorbed by the light absorbing layer, so that the degree to which the ambient light directed toward the display panel is reflected by the driving layer is low, thereby ensuring that the reflectivity of the display panel to the ambient light is low. In addition, by providing the light absorbing layer in the display panel, the reflectivity of the display panel to the ambient light can be reduced. Therefore, the transmittance of the auxiliary light absorbing layer located on the side of the plurality of light emitting units away from the substrate can be appropriately increased, so that the absorption rate of the auxiliary light absorbing layer to the light is low, thereby making the degree to which the light emitted by the light emitting unit is absorbed by the auxiliary light absorbing layer low. In this way, the overall display brightness of the display panel can be made higher without requiring the display panel to provide a large driving current to the light emitting unit, thereby effectively reducing the power consumption of the display panel.
[0093] It should be noted that providing the light absorbing layer 400 in the display panel 000 can effectively reduce the reflectivity of the display panel 000, allowing the display panel 000 to use the auxiliary light absorbing layer 500 with higher transmittance. Using the auxiliary light absorbing layer 500 with higher transmittance effectively reduces the power consumption of the display panel 000. For example, please refer to Table 1, which compares the display panel shown in this application with related panels in the related art.
[0094] Table 1
[0095] Among them, in order to better block the metal signal lines in the display panel, the display panel in the related art needs to ensure that the black film has a high absorption rate for light. For example, the transmittance of the black film to light is only about 25%. In the embodiment of the present application, since a light-absorbing layer 300 is separately provided in the display panel 000 to block the metal signal lines in the drive layer 200, there is no need to ensure that the black film (i.e., the auxiliary light-absorbing layer 500) has a high absorption rate for light, so that the transmittance of the auxiliary light-absorbing layer 500 to light is high. For example, the transmittance of the auxiliary light-absorbing layer 500 to light ranges from 34% to 60%. In this way, the transmittance of the auxiliary light-absorbing layer 500 to light in the present application can be ensured to be significantly higher than the transmittance of the black film to light in the related art. In this way, when the display panel shown in the present application and the display panel shown in the related art display images of the same brightness, the power consumption of the display panel of the present application is significantly lower than that of the display panel in the related art.
[0096] Optionally, as shown in FIG4 , FIG4 is a schematic diagram of the film structure of a driving backplane in a display panel provided in an embodiment of the present application. Here, the driving backplane in the display panel 000 refers to the portion of the display panel 000 when the light-emitting unit 400 is not included. The display panel 000 may further include: a first insulating layer 600 located on the side of the light-absorbing layer 300 facing away from the substrate 100. In this way, the light-absorbing layer 300 in the display panel 000 can be protected by the first insulating layer 600 to ensure that the light-absorbing layer 300 is not scratched, thereby reducing its shielding effect on the driving layer 200.
[0097] In the present application, the first insulating layer 600 may have a plurality of second via holes V2 corresponding one-to-one to the plurality of first via holes V1, and each second via hole V2 in the first insulating layer 600 may be connected to a corresponding first via hole V1 in the light absorbing layer 300. In this case, the plurality of light-emitting units 400 in the display panel 000 may be distributed on a side of the first insulating layer 600 facing away from the substrate 100, and the light-emitting units 400 may be electrically connected to the pad S through the second via holes V2 and the first via holes V1.
[0098] Optionally, as shown in FIG4 , at least a portion of the first insulating layer 600 may extend into the first via hole V1, and the portion of the first insulating layer 600 extending into the first via hole V1 may cover at least a portion of the inner wall of the first via hole V1. In this case, the portion of the first insulating layer 600 extending into the first via hole V1 may include a second via hole V2 connected to the first via hole V1, and the orthographic projection of the second via hole V2 on the substrate 100 may be located within the orthographic projection of the corresponding first via hole V1 on the substrate 100. In this way, the portion of the first insulating layer 600 extending into the first via hole V1 can protect at least a portion of the inner wall of the first via hole V1.
[0099] For example, the inner wall of the first via hole V1 of the light absorbing layer 300 can be completely covered by the first insulating layer 600. That is, the portion of the first insulating layer 600 that extends into the first via hole V1 can completely cover the inner wall of the first via hole V1. In this case, the first insulating layer 600 can cover the light absorbing layer 300 at various locations to ensure that the light absorbing layer 300 is not exposed.
[0100] In one possible case, the light absorbing layer 300 in the display panel 000 usually includes carbon particles. The carbon particles can give the light absorbing layer 300 a light absorbing function. Since the display panel 000 needs to be immersed in a gold bath during the preparation process of the display panel 000, the solution in the gold bath (usually an acidic solution or an alkaline solution) may precipitate the carbon particles in the light absorbing layer 300, thereby contaminating the gold bath. Therefore, in order to prevent the gold bath from being contaminated, it is necessary to allow the portion of the first insulating layer 600 that extends into the first via hole V1 to completely cover the inner wall of the first via hole V1 to ensure that the light absorbing layer 300 is not exposed to the outside, and thus it can be ensured that when the display panel 000 is immersed in the gold bath, the solution in the gold bath will not precipitate the carbon particles in the light absorbing layer 300, thereby ensuring that the gold bath will not be contaminated.
[0101] It should be noted that when the light absorbing layer 300 contains carbon particles, the light absorbing layer 300 is usually made of an organic material. In other possible implementations, the light absorbing layer 300 can also be made of an inorganic material (for example, a metal material). When the light absorbing layer 300 is made of an inorganic material, it is also necessary to allow the portion of the first insulating layer 600 that extends into the first via hole V1 to completely cover the inner wall of the first via hole V1 to ensure that the light absorbing layer 300 is not exposed to the outside. This can ensure that when the display panel 000 is immersed in the gold bath, the solution in the gold bath will not corrode the side of the light absorbing layer 300, thereby ensuring that the light absorbing layer 300 has good conductivity.
[0102] It should be noted that the first insulating layer 600 in the display panel 000 can be of various types. For example, the first insulating layer 600 can include at least one of an inorganic insulating layer and an organic insulating layer. Here, when the first insulating layer 600 in the display panel 000 includes both an inorganic insulating layer 601 and an organic insulating layer 602, the second via hole V2 in the first insulating layer 600 can include a first sub-opening V21 and a second sub-opening V22 that are connected, wherein the first sub-opening V21 is located in the inorganic insulating layer 601 and the second sub-opening V22 is located in the organic insulating layer 602. The embodiments of the present application will be schematically described using the following four cases as examples:
[0103] In the first case, as shown in Figure 4, when the first insulating layer 600 in the display panel 000 is a single-layer film structure, and the first insulating layer 600 is an inorganic insulating layer 601, a portion of the inorganic insulating layer 601 can extend into the first via hole V1, and the portion of the inorganic insulating layer 601 extending into the first via hole V1 can completely cover the inner wall of the first via hole V1 to ensure that the light absorbing layer 300 is not exposed.
[0104] It should be noted that the portion of the inorganic insulating layer 601 located outside the first via hole V1 can contact the side of the light absorbing layer 300 facing away from the substrate 100. In this way, the portion of the inorganic insulating layer 601 located outside the first via hole V1 can protect the light absorbing layer 300 from the side of the light absorbing layer 300 facing away from the substrate 100, and the portion of the inorganic insulating layer 601 located inside the first via hole V1 can protect the light absorbing layer 300 from the inner wall of the first via hole V1. Here, because the inorganic insulating layer 601 has good water and oxygen barrier properties, when the inorganic insulating layer 601 wraps and protects the light absorbing layer 300, the protection effect of the light absorbing layer 300 can be effectively improved.
[0105] The second scenario is shown in Figure 5, which is a schematic diagram of the film structure of a driver backplane in another display panel provided in an embodiment of the present application. When the first insulating layer 600 in the display panel 000 is a single-layer film structure, and the first insulating layer 600 is an organic insulating layer 602, the portion of the organic insulating layer 602 that extends into the first via hole V1 can completely cover the inner wall of the first via hole V1, thereby ensuring that the light absorbing layer 300 is not exposed.
[0106] It should be noted that the portion of the organic insulating layer 602 located outside the first via hole V1 can contact the side of the light absorbing layer 300 facing away from the substrate 100. In this way, the portion of the organic insulating layer 602 located outside the first via hole V1 can protect the light absorbing layer 300 from the side of the light absorbing layer 300 facing away from the substrate 100, and the portion of the organic insulating layer 602 located inside the first via hole V1 can protect the light absorbing layer 300 from the inner wall of the first via hole V1. Here, because the organic insulating layer 602 can adhere well to the light absorbing layer 300, the portion of the organic insulating layer 602 that extends into the first via hole V1 can be tightly attached to the inner wall of the first via hole V1.
[0107] Furthermore, because the organic insulating layer 602 has good flatness, when the organic insulating layer 602 is disposed on the side of the light absorbing layer 300 facing away from the substrate 100, the side of the organic insulating layer 602 facing away from the substrate 100 can be ensured to be well flat. Furthermore, in this case, the side of the organic insulating layer 602 facing away from the substrate 100 is the outermost side of the driving backplane. Therefore, when multiple light-emitting units 400 are subsequently formed on the driving backplane, the sides of each light-emitting unit 400 facing away from the substrate 100 can be ensured to be flush, thereby ensuring a good display effect for the display panel 000.
[0108] In the third case, as shown in FIG6 , which is a schematic diagram of the film structure of a driver backplane in another display panel provided in an embodiment of the present application, when the first insulating layer 600 in the display panel 000 has a double-layer film structure, that is, the first insulating layer 600 includes both an inorganic insulating layer 601 and an organic insulating layer 602, and the inorganic insulating layer 601 is closer to the light absorbing layer 300 than the organic insulating layer 602, a portion of the inorganic insulating layer 602 extends into the first via hole V1 and covers the inner wall of the first via hole V1, and / or a portion of the organic insulating layer 602 extends into the first via hole V1 and covers the inner wall of the first via hole V1.
[0109] For example, in FIG6 , both the inorganic insulating layer 601 and the organic insulating layer 602 have portions extending into the first via hole V1. Furthermore, the portion of the inorganic insulating layer 601 extending into the first via hole V1 can completely cover the inner wall of the first via hole V1, and the portion of the organic insulating layer 603 extending into the first via hole V1 can completely cover the portion of the inorganic insulating layer 601 facing away from the interior of the first via hole V1. This ensures that the light absorbing layer 300 is not exposed.
[0110] It should be noted that the portion of the inorganic insulating layer 601 located outside the first via hole V1 can contact the side of the light absorbing layer 300 facing away from the substrate 100, and the portion of the organic insulating layer 602 located outside the first via hole V1 can contact the side of the inorganic insulating layer 601 facing away from the substrate 100. In this way, the portions of the inorganic insulating layer 601 and the organic insulating layer 602 located outside the first via hole V1 can protect the light absorbing layer 300 from the side of the light absorbing layer 300 facing away from the substrate 100, and the portions of the inorganic insulating layer 601 and the organic insulating layer 602 located inside the first via hole V1 can protect the light absorbing layer 300 from the inner wall of the first via hole V1.
[0111] Furthermore, because the organic insulating layer 602 has good flatness, when the organic insulating layer 602 is located on the side of the inorganic insulating layer 601 facing away from the substrate 100, the side of the organic insulating layer 602 facing away from the substrate 100 can be ensured to have good flatness. Furthermore, in this case, the side of the organic insulating layer 602 facing away from the substrate 100 is the outermost side of the driving backplane. Therefore, when multiple light-emitting units 400 are subsequently formed on the driving backplane, the sides of each light-emitting unit 400 facing away from the substrate 100 can be ensured to be flush, thereby ensuring a good display effect for the display panel 000.
[0112] In the fourth case, as shown in Figure 7, which is a schematic diagram of the film structure of a driving backplane in another display panel provided in an embodiment of the present application, when the first insulating layer 600 in the display panel 000 is a double-layer film structure, that is, the first insulating layer 600 includes both an inorganic insulating layer 601 and an organic insulating layer 602, and the organic insulating layer 602 is closer to the light absorbing layer 300 than the inorganic insulating layer 601, a portion of the organic insulating layer 602 extends into the first via hole V1 and covers the inner wall of the first via hole V1, and / or a portion of the inorganic insulating layer 602 extends into the first via hole V1 and covers the inner wall of the first via hole V1.
[0113] For example, in FIG7 , both the organic insulating layer 602 and the inorganic insulating layer 601 have portions extending into the first via hole V1. Furthermore, the portion of the organic insulating layer 602 extending into the first via hole V1 can completely cover the inner wall of the first via hole V1, and the portion of the inorganic insulating layer 601 extending into the first via hole V1 can completely cover the portion of the organic insulating layer 602 facing away from the interior of the first via hole V1. This ensures that the light absorbing layer 300 is not exposed.
[0114] It should be noted that the portion of the organic insulating layer 602 located outside the first via hole V1 can contact the side of the light absorbing layer 300 facing away from the substrate 100, and the portion of the inorganic insulating layer 601 located outside the first via hole V1 can contact the side of the organic insulating layer 602 facing away from the substrate 100. In this way, the portions of the organic insulating layer 602 and the inorganic insulating layer 601 located outside the first via hole V1 can protect the light absorbing layer 300 from the side of the light absorbing layer 300 facing away from the substrate 100, and the portions of the organic insulating layer 602 and the inorganic insulating layer 601 located inside the first via hole V1 can protect the light absorbing layer 300 from the inner wall of the first via hole V1.
[0115] Here, because the organic insulating layer 602 can adhere well to the light absorbing layer 300, the portion of the organic insulating layer 602 that extends into the first via hole V1 can be tightly attached to the inner wall of the first via hole V1. Furthermore, because the inorganic insulating layer 601 has good water and oxygen barrier properties, when the inorganic insulating layer 601 covers the organic insulating layer 602, water and oxygen in the external environment can be prevented from corroding the internal structures of the display panel 000. This further enhances the protection of the light absorbing layer 300.
[0116] The following examples compare the reflectivity of the driver backplanes in the second to fourth cases with the reflectivity of driver backplanes in the related art. Please refer to Table 2, which is a comparison table of the driver backplanes in this application and those in the related art.
[0117] Table 2
[0118] Among them, according to Table 2, when the light absorbing layer 300 is set in the driving backplane, the light absorbing layer 300 can better shield the metal signal lines in the driving layer 200, so that the degree of reflection of the metal signal lines in the driving layer 200 by the light emitting to the driving backplane is lower.
[0119] Optionally, the thickness of the light absorbing layer 300 in the above embodiment may be in the range of 0.5 micrometers to 5 micrometers. Here, the thicker the light absorbing layer 300 is, the greater the light absorption rate of the light absorbing layer 300 is.
[0120] In the embodiment of the present application, the optical density (OD) value of the light absorbing layer 300 in the above embodiment is greater than or equal to 4. Here, the OD value of the light absorbing layer 300 is used to measure the degree of light absorption by the light absorbing layer 300. Specifically, the greater the OD value of the light absorbing layer 300, the greater the light absorption rate of the light absorbing layer 300.
[0121] 4 to 7 , the driving layer 200 in the display panel 000 may include a stacked first metal layer 201 and a second metal layer 202 , wherein the first metal layer 201 is closer to the substrate 100 than the second metal layer 202 .
[0122] The first metal layer 201 may include: a plurality of first drive signal lines (not labeled in the figure). The second metal layer 202 may include: a second drive signal line (not labeled in the figure) and a plurality of conductive pads S. Here, the extension direction of the first drive signal line may intersect the extension direction of the second drive signal line. For example, the extension direction of the first drive signal line is perpendicular to the extension direction of the second drive signal line.
[0123] Among the plurality of conductive pads S in the second driving layer 202 , a portion of the conductive pads S needs to be electrically connected to the second driving signal line, and another portion of the conductive pads S needs to be electrically connected to the first driving signal line.
[0124] In the embodiment of the present application, the display panel 000 may further include a second insulating layer 700 located between the first metal layer 201 and the second metal layer 202. The insulating layer 700 may be stacked to separate the first metal layer 201 and the second metal layer 202 to ensure that a first drive signal line in the first metal layer 201 and a second drive signal line in the second metal layer 202 are not short-circuited at the intersection.
[0125] For example, the second insulating layer 700 may have a third via hole V3 , so that a portion of the structure in the second metal layer 202 may be electrically connected to a portion of the structure in the first metal layer 201 through the third via hole V3 .
[0126] Optionally, the second insulating layer 700 in the display panel 000 may include: a first inorganic protective layer 701, an organic planarizing layer 702, and a second inorganic protective layer 703 stacked in a direction perpendicular to and away from the substrate 100. Here, the first inorganic protective layer 701 may cover the first metal layer 201 and have a third sub-opening; the organic planarizing layer 702 may be located on a side of the first inorganic protective layer 701 facing away from the substrate 100 and may have a fourth sub-opening connected to the third sub-opening; the second inorganic insulating layer 703 may be located on a side of the organic planarizing layer 702 facing away from the substrate 100, with a portion of the second inorganic insulating layer 703 extending into the third and fourth sub-openings and capable of covering the inner walls of the third and fourth sub-openings, and the portion of the second inorganic insulating layer 703 extending into the third and fourth sub-openings having a fifth sub-opening. To this end, the third sub-opening, the fourth sub-opening, and the fifth sub-opening that are interconnected can constitute the third via hole V3 of the second insulating layer 700 .
[0127] It should be noted that the first inorganic protective layer 701 can isolate water and oxygen in the external environment, so that water and oxygen in the external environment will not corrode the first metal layer 201 from the side of the first metal layer 201 away from the substrate 100, thereby effectively reducing the probability of the first metal layer 201 being oxidized and corroded.
[0128] The organic planarization layer 702 can play a planarization role to ensure that subsequent film structures can be stably formed.
[0129] For the second inorganic protective layer 703, and since the subsequent second metal layer 202 needs to be arranged on the side of the second inorganic protective layer 703 away from the substrate 100, the second inorganic protective layer 703 can ensure that water and oxygen in the external environment will not corrode the second metal layer 202 from the side of the second metal layer 202 close to the substrate 100, thereby effectively reducing the probability of the second metal layer 202 being oxidized and corroded.
[0130] Optionally, the display panel 000 may further include: a third inorganic protective layer 705 located on the side of the first metal layer 201 close to the substrate 100, and a fourth inorganic protective layer 706 located on the side of the second metal layer 202 facing away from the substrate 100. The third inorganic protective layer 705 ensures that water and oxygen in the external environment will not corrode the first metal layer 201 from the side close to the substrate 100, thereby further reducing the probability of oxidative corrosion of the first metal layer 201. The fourth inorganic protective layer 706 ensures that water and oxygen in the external environment will not corrode the second metal layer 202 from the side facing away from the substrate 100, thereby further reducing the probability of oxidative corrosion of the second metal layer 202.
[0131] It should be noted that the fourth inorganic protective layer 706 may have a fourth via hole V4 connected to the second via hole V2, so that the light emitting unit 400 can pass through the second via hole V2 and the fourth via hole V4 in sequence and then be electrically connected to the conductive pad S in the second metal layer 202.
[0132] Alternatively, please refer to Figures 8 and 9. Figure 8 is a partial top view of a driving backplane in a display panel provided in an embodiment of the present application, and Figure 9 is a partial top view of a display panel provided in an embodiment of the present application. The light-emitting units 400 in the display panel 000 can be arranged in an array into multiple rows and columns. The multiple first drive signal lines 2011 in the first metal layer 201 can include multiple groups of first drive signal lines 2011 corresponding to the multiple columns of light-emitting units 400, and each group of first drive signal lines 2011 can be electrically connected to a corresponding column of light-emitting units 400. The multiple second drive signal lines 2021 in the second metal layer 202 can correspond to the multiple rows of light-emitting units 400, and each second drive signal line 2021 can be electrically connected to a corresponding row of light-emitting units 400. The orthographic projection of a column of light-emitting units 400 on the substrate 100 can overlap with the orthographic projection of a corresponding group of first drive signal lines 2011 on the substrate 100, and a row of light-emitting units 400 can be distributed between two adjacent second drive signal lines 2021.
[0133] For example, a group of first drive signal lines 2011 corresponding to a column of light-emitting units 400 in the display panel 000 may include: an anode drive signal line L1, a data signal line L2 and a ground line L3, and a second drive signal line 2021 corresponding to a row of light-emitting units 400 may be a power signal line.
[0134] The light-emitting unit 400 in the display panel 000 may include a driver chip 402 and at least one LED 401. In this case, the plurality of pads S distributed within the second metal layer 202 of the display panel 000 may include a first pad group S10 for fixedly connecting to the LED 401 in the light-emitting unit 400, and a second pad group S20 for fixedly connecting to the driver chip 402 in the light-emitting unit 400. Optionally, the orthographic projection of the first pad group S10 on the substrate 100 may be located within the orthographic projection of the anode drive signal line L1 on the substrate 100; and the orthographic projection of the second pad group S20 on the substrate 100 may be located within the orthographic projection of the ground line L3 on the substrate 100.
[0135] Here, the first pad group S10 may include a first conductive pad S1 and a second conductive pad S2, and the second pad group S20 may include a third conductive pad S3, a fourth conductive pad S4, and a fifth conductive pad S5.
[0136] Part of the first drive signal lines 2011 in the group of first drive signal lines 2011 electrically connected to the light-emitting unit 400 is used to electrically connect to the first conductive pad S1 in the first pad group S10. For example, the second metal layer 202 may further include a first transfer electrode 2022. The anode drive signal line L1 in the group of first drive signal lines 2011 may be electrically connected to the first conductive pad S1 via the first transfer electrode 2022.
[0137] The second conductive pad S2 in the first pad group S10 is electrically connected to the third conductive pad S3 in the second pad group S20. For example, the second metal layer 2022 may further include a second connecting electrode 2023. The first conductive pad S1 may be electrically connected to the third conductive pad S3 via the second connecting electrode 2023.
[0138] Another portion of the first drive signal lines 2011 in the group of first drive signal lines 2011 electrically connected to the light-emitting unit 400 is electrically connected to the fourth conductive pad S4 in the second pad group S20. For example, the second metal layer 2022 may further include a third transfer electrode 2024. The data signal line L2 in the group of first drive signal lines 2011 may be electrically connected to one fourth conductive pad S4 via one third transfer electrode 2024; and the ground line L3 in the group of first drive signal lines 2011 may be electrically connected to another fourth conductive pad S4 via another third transfer electrode 2024.
[0139] The second driving signal line 2021 electrically connected to the light emitting unit 400 is used to electrically connect to the fifth conductive pad S5 in the second pad group S20. For example, the second metal layer 2022 may further include a fourth transfer electrode 2025. The second driving signal line 2021 may be electrically connected to the fifth conductive pad S5 via the fourth transfer electrode 2025.
[0140] For example, the number of LEDs 401 in the light-emitting unit 400 can be three, and the three LEDs 401 can be distributed as: a red LED 401a for emitting red light, a green LED 401b for emitting green light, and a blue LED 401c for emitting blue light. In this case, the number of first solder pad groups S10 is also three, and these three first solder pad groups S10 can be electrically connected to the red LED 401a, the green LED 401b, and the blue LED 401c, respectively.
[0141] Here, the red LED 401a, the green LED 401b and the blue LED 401c in the light emitting unit 400 each have two solder pins, which are respectively a positive solder pin and a negative solder pin.
[0142] The positive electrode solder leg of the red LED 401a can be connected to the first conductive solder pad S1 in the corresponding first solder pad group S10, so that the positive electrode solder leg of the red LED 401a can be connected to the corresponding anode drive signal line L1 through the first conductive solder pad S1. The negative electrode solder leg of the red LED 401a can be soldered to the second conductive solder pad S2 in the corresponding first solder pad group S10.
[0143] The positive electrode solder leg of the green LED 401b can be soldered to the first conductive solder pad S1 in the corresponding first solder pad group S10, so that the positive electrode solder leg of the green LED 401b can be connected to the corresponding anode drive signal line L1 through the first conductive solder pad S1. The negative electrode solder leg of the green LED 401b can be soldered to the second conductive solder pad S2 in the corresponding first solder pad group S10.
[0144] The positive electrode solder leg of the blue LED 401c can be soldered to the first conductive solder pad S1 in the corresponding first solder pad group S10, so that the positive electrode solder leg of the blue LED 401c can be connected to the corresponding anode drive signal line L1 through the first conductive solder pad S1. The negative electrode solder leg of the blue LED 401c can be soldered to the second conductive solder pad S2 in the corresponding first solder pad group S10.
[0145] The driver chip 402 in the light emitting unit 400 has six solder pins, which are: a power signal input solder pin, a data signal input solder pin, a ground solder pin, and three signal output solder pins corresponding to the three LEDs.
[0146] The three signal output pins of the driver chip 402 can be respectively soldered to the three third conductive pads S3 in the second pad group S20. Since the three third conductive pads S3 are electrically connected to the three second conductive pads S2 in the three first pad groups S10, the three signal output pins of the driver chip 402 can be respectively electrically connected to the three LED cathode pins.
[0147] The power signal input pin of the driver chip 402 can be soldered to a fifth conductive pad S5 in the second pad group S20, so that the power signal input pin can be connected to the power signal line (ie, the second driving signal line 2021) through the fifth conductive pad S5.
[0148] The data signal input pin of the driver chip 402 can be soldered to a fourth conductive pad S4 in the second pad group S20 , so that the data signal input pin can be connected to the data signal line L2 through the fourth conductive pad S4 .
[0149] The grounding pin of the driver chip 402 may be soldered to another fourth conductive pad S4 in the second pad group S20 , so that the grounding pin may be connected to the ground line L3 through the fourth conductive pad S4 .
[0150] In this case, when the display panel 000 needs to control the light-emitting unit 400 to emit light, a power drive signal can be applied to the power signal line electrically connected to this light-emitting unit 400 within the display panel 000, and a data drive signal can be applied to the data signal line L2 electrically connected to this light-emitting unit 400. In this way, after the driver chip 402 in the light-emitting unit 400 receives the power drive signal via the power signal input solder pin, the driver chip 402 can enter an operating state. Furthermore, after the driver chip 402 receives the data signal via the data signal input solder pin, the driver chip 402 can generate three cathode signals corresponding to the three LEDs based on the data signal. These three cathode signals can be transmitted to the three LED negative pins via three signal output solder pins, respectively. Since the positive electrode soldering of the LED is always connected to the anode signal applied by the anode drive signal line L1, after the LED receives the anode signal and the cathode signal, respectively, the LED can emit light of the corresponding intensity.
[0151] It should be noted that to simplify the wiring structure within display panel 000, at least two of the anode pins of red LED 401a, green LED 401b, and blue LED 401c can be connected to the same anode drive signal line L1. Since the luminous characteristics of red LED 401a differ significantly from those of green LED 401b and blue LED 401c, respectively, while the luminous characteristics of green LED 401b differ slightly from those of blue LED 401c, the anode pins of green LED 401b and blue LED 401c can be connected to the same anode drive signal line L1, while the anode pin of red LED 401a can be connected to a different anode drive signal line L1. In this case, the first conductive pad S1 soldered to the anode leg of the green LED 401b and the first conductive pad S1 soldered to the anode leg of the blue LED 401c can be integrally formed. That is, the anode leg of the green LED 401b and the anode leg of the blue LED 401c can be soldered to the same first conductive pad S1, while the anode leg of the red LED 401a can be soldered to a different first conductive pad S1.
[0152] Regarding the light absorbing layer 300 in the above embodiment, the light absorbing layer 300 can be made of either organic materials or conductive metal materials. To this end, the present application will use the following two optional implementation methods as examples for schematic illustration:
[0153] In a first optional implementation, the light absorbing layer 300 in the display panel 000 includes: an organic film layer made of an organic material with light absorption properties. For example, this organic material can be a black matrix (English: Black Matrix, abbreviated as: BM) material. That is, the light absorbing layer 300 can be made of BM material. Since the BM material has good light absorption, when the light absorbing layer 300 is made of BM material, the light absorbing layer 300 has a high degree of absorption of the ambient light incident on the display panel 000, and the light absorbing layer 300 can effectively reduce the reflectivity of the display panel 000 to the ambient light. For example, the BM material may include: an organic resin material, and a plurality of carbon particles dispersed in the organic resin material. Here, by adjusting the concentration of the carbon particles filled in the organic resin material, the degree of absorption of light by the BM material can be adjusted.
[0154] It should be noted that the display panel 000 in this application can be used as a spliced display unit in a spliced screen. In this way, after splicing multiple display panels 000, a larger spliced display screen can be obtained. However, when the display panel 000 is used as a spliced display unit, the width of the frame of the display panel 000 needs to be narrow. To this end, in this application, the driver component needs to be bound to the display panel 000 through back binding.
[0155] For example, as shown in Figure 10, Figure 10 is a schematic diagram of the back of the display panel provided in an embodiment of the present application. The edge drive of the side of the substrate 100 in the display panel 000 facing away from the driving layer 200 may include: a binding area F. The display panel 000 may also include: a plurality of signal leads D1 located in the binding area F. Here, at least part of the plurality of signal leads D1 can be electrically connected to the plurality of first driving signal lines 2011. For example, a part of the plurality of signal leads D1 is used to electrically connect to the plurality of first driving signal lines 2011 in the first metal layer 201, and another part of the plurality of signal leads D1 is used to electrically connect to the plurality of second driving signal lines 2021 in the second metal layer 202. It should be noted that the plurality of signal leads D1 in the binding area F are used to bind and connect with the driving component, so that the driving component can be bound to the display panel 000. In this way, the driver component can send a driving signal to the first driving signal line 2011 and the second driving signal line 2021 through the signal lead D1, so that the corresponding light-emitting unit 400 can be illuminated. Here, the driver component is attached to the back of the display panel 000. Therefore, the driver component does not occupy the space on the front of the display panel 000, so that the screen-to-body ratio of the front of the display panel 000 is high, thereby ensuring that the width of the border of the display panel 000 is narrow.
[0156] The horizontally arranged second drive signal lines 2021 can be converted to vertically arranged signal lines on the left and right sides of the display panel 000. In this way, the portion of the signal leads D1 arranged in the middle of the plurality of signal leads D1 can be electrically connected to the plurality of first drive signal lines 2011, and the portion of the signal leads D1 arranged on both sides of the plurality of signal leads D1 can be electrically connected to the second drive signal lines 2021 converted to the vertical arrangement.
[0157] For example, please refer to Figure 11, which is a side view of the display panel shown in Figure 10. The display panel 000 may further include: a plurality of connecting traces D2 electrically connected to the plurality of signal leads D1. A portion of the connecting traces D2 is located on a side of the substrate 100 close to the drive layer 200, and this portion of the connecting traces D2 can be electrically connected to the first drive signal line 2011 and the second drive signal line 2021. Another portion of the connecting traces D2 is located on a side of the substrate 100, and the end of this portion of the connecting traces D2 facing the back of the display panel 000 can be electrically connected to the corresponding signal lead D1.
[0158] The multiple connecting traces D2 and the multiple signal leads D1 are formed using the same process. For example, a laser etching process can be used to simultaneously form the multiple connecting traces D2 and the multiple signal leads D1. For example, after the driver backplane is prepared, a conductive layer can be sputtered in the edge area of the front side of the driver backplane, the side of the driver backplane, and the bonding area of the back side of the driver backplane. Then, a laser etching process can be performed on the conductive layer to simultaneously form the multiple connecting traces D2 and the multiple signal leads D1.
[0159] It should be noted that during the laser etching process to form the multiple signal leads D1 located within the binding region F, the binding region F needs to be irradiated with laser light. During this process, the laser light may pass through the substrate 100 and irradiate the portion of the light absorbing layer 300 covered by the binding region F. If this portion of the light absorbing layer 300 is not shielded by the metal signal lines in the driving layer 200, the light absorbing layer 300 is prone to bubbling, resulting in a low flatness of the light absorbing layer 300. To reduce the bubbling problem of the light absorbing layer 300, it is necessary to remove the portion of the light absorbing layer 300 of the display panel 000 that is exposed to the laser light.
[0160] For example, as shown in Figures 8 and 12, Figure 12 is a partial top view of a display panel provided by another embodiment of the present application. After the light absorbing layer 300 in the display panel shown in Figure 12 is removed, its structure can refer to the panel shown in Figure 8. The portion of the light absorbing layer 300 of the display panel 000 covered by the binding region F has an auxiliary opening V0. In the present application, the display panel 000 may have a blank area. The blank area of the display panel 000 refers to the area within the binding region F that is not covered by the first metal layer 201 and the second metal layer 202. Here, the orthographic projection of the auxiliary opening V0 on the substrate 100 overlaps with the orthographic projection of the blank area on the substrate 100. After providing the auxiliary opening V0 in the light absorbing layer 300, during the process of forming the plurality of signal leads D1 located within the binding region F using a laser etching process, the laser light passing through the substrate 100 can assist in transmitting through the opening V0, thereby reducing the probability of the laser light directly irradiating the light absorbing layer 300, thereby reducing the probability of blistering in the light absorbing layer 300.
[0161] It should be noted that the orthographic projection of the auxiliary opening V0 of the light absorbing layer 300 on the substrate 100 needs to be within the orthographic projection of the blank area on the substrate 100. In this case, it can be ensured that the orthographic projection of the auxiliary opening V0 set in the light absorbing layer 300 on the substrate 100 does not overlap with the orthographic projection of the first metal layer 201 on the substrate 100, and does not overlap with the orthographic projection of the second metal layer 202 on the substrate 100. In this way, even if the light absorbing layer 300 is processed with holes, it can be ensured that the light absorbing layer 300 can still effectively block the first metal layer 201 and the second metal layer 202, thereby ensuring that the reflectivity of the display panel 000 to ambient light is low. In addition, during the process of using a laser etching process to form the multiple signal leads D1 located in the binding area F, the portion of the light absorbing layer 300 covered by the driving layer 200 will not be irradiated by the laser, and the undesirable phenomenon of bubbles will not occur in this portion of the light absorbing layer 300. Therefore, it is not necessary to excavate this portion of the light absorbing layer 300.
[0162] For example, the orthographic projection of the blank area on the substrate 100 completely overlaps with the orthographic projection of the auxiliary opening V0 on the substrate 100. In this case, all areas of the light absorbing layer 300 covered by the binding area F that are not covered by the driving layer 202 are removed. This ensures that the light absorbing layer 300 does not experience bubbling.
[0163] In another possible implementation, the orthographic projection of the blank area on the substrate 100 may be located within the orthographic projection of the auxiliary opening V0 of the light absorbing layer 300 on the substrate 100. This embodiment of the present application does not limit this.
[0164] Because the distance between two adjacent drive signal lines 2011 in a group of first drive signal lines 2011 is relatively small—for example, the distance between the anode drive signal line L1 and the data signal line L2 in a group of first drive signal lines 2011 is only approximately 15 microns—during the laser etching process to form the plurality of signal leads D1 within the binding region F, even if the laser light still penetrates the substrate 100 and may pass through the region between two adjacent drive signal lines 2011 in the group of first drive signal lines 2011 before irradiating the light absorbing layer 300, the laser light energy passing through the region between the two adjacent drive signal lines 2011 is relatively small due to the relatively small distance between the two adjacent drive signal lines 2011. Consequently, even if the laser light irradiates the light absorbing layer 300, it will not cause blistering in the light absorbing layer. Therefore, this portion of the light absorbing layer 300 does not need to be excavated. Furthermore, since this portion of the light absorbing layer 300 is relatively small, not excavating this portion of the light absorbing layer 300 can effectively reduce the processing difficulty of the light absorbing layer 300.
[0165] For example, as shown in FIG12 , the auxiliary openings V0 in the light absorbing layer 000 can be distributed between at least two adjacent groups of first drive signal lines 2011 and two adjacent second drive signal lines 2012. It should be noted that, as shown in FIG8 , since the second drive signal lines 2012 need to be connected to the conductive pads in the second pad group S20 via the fourth transfer electrodes 2025, and in order to minimize the technical capacitance generated between the fourth transfer electrodes 2025 and the first drive signal lines 2011, it is necessary to minimize the overlap area between the fourth transfer electrodes 2025 and the first drive signal lines 2011. Therefore, the longitudinally arranged portion of the fourth transfer electrodes 2025 does not overlap with the first drive signal lines 2011, and this portion of the fourth transfer electrodes 2025 can be arranged on one side of a group of first drive signal lines 2011. Thus, between two adjacent groups of first drive signal lines 2011 and two adjacent second drive signal lines 2012, there are two interconnected sub-apertures. One of the sub-apertures is wider than the other. The two sub-apertures with the larger widths have two groups of first drive signal lines 2011 on either side. The sub-aperture with the smaller width has the fourth transfer electrode 2025 on one side and a group of first drive signal lines 2011 on the other side.
[0166] Optionally, as shown in Figures 13 and 14, Figure 13 is a partial top view of another display panel provided by another embodiment of the present application, and Figure 14 is a partial top view of the display panel shown in Figure 13 with the light absorbing layer removed. The second metal layer 202 in the display panel 000 may further include: an auxiliary ground line 2026 arranged parallel to the second drive signal line 2011. Here, the auxiliary ground line 2026 can be electrically connected to the ground line 2021 in the first metal layer 201, and the orthographic projection of the auxiliary ground line 2026 on the substrate 100 can be located within the orthographic projection of the binding area F on the substrate 100.
[0167] In particular, an auxiliary grounding line 2026 and an adjacent second driving signal line 2021 are both distributed between two rows of light-emitting units 500. In addition to being distributed between two groups of adjacent first driving signal lines 2011 and two adjacent second driving signal lines 2012, the auxiliary openings V0 in the light-absorbing layer 300 can also be distributed between two groups of adjacent first driving signal lines 2011, an auxiliary grounding line 2026, and an adjacent second driving signal line 2021. This further reduces the probability of bubbling defects in the light-absorbing layer 300.
[0168] It should be noted that, during the laser etching process to form the plurality of signal leads D1 in the binding region F, the laser will not irradiate the area outside the binding region F. Therefore, the portion of the light absorbing layer 300 not covered by the binding region F may not be provided with auxiliary openings V0.
[0169] In a second optional implementation, the light absorbing layer 300 in the display panel 000 is conductive, that is, the light absorbing layer 300 is made of a metal material.
[0170] For example, please refer to Figure 15, which is a schematic diagram of the film structure of a light absorbing layer provided in an embodiment of the present application. The light absorbing layer 300 in the display panel 000 may include: a metal reflective layer 301, and a first blackened layer 302 located on the side of the metal reflective layer 301 facing away from the substrate 100. Here, the metal reflective layer 301 is closer to the substrate 100 than the first blackened layer 302.
[0171] The metal reflective layer 301 in the light-absorbing layer 300 can be made of a metal material with a high light reflectivity. For example, the metal reflective layer 301 can include a molybdenum-niobium alloy. Thus, during the laser etching process to form the plurality of signal leads D1 within the binding region F, laser light transmitted through the substrate 100 will illuminate the metal reflective layer 301 in the light-absorbing layer 300, allowing the metal reflective layer 301 to reflect the laser light. This effectively prevents the undesirable phenomenon of blistering caused by the light-absorbing layer 300 absorbing laser energy.
[0172] The first blackened layer 302 in the light-absorbing layer 300 can be made of a metal oxide material with a high light absorption rate. For example, the material of the first blackened layer 302 can include molybdenum niobium oxynitride. In this way, most of the ambient light incident on the display panel 000 is absorbed by the first blackened layer 302, resulting in a low reflectivity of the display panel 000 to ambient light.
[0173] In the present application, when the light absorbing layer 300 includes a metal film layer made of a metal material with light absorption properties, the light absorbing layer 300 can also serve as a conductive structure in the display panel 000. Since the conductivity of the metal reflective layer 301 and the first blackened layer 302 in the light absorbing layer 300 is relatively low. Therefore, in order to ensure that the light absorbing layer 300 can better serve as a conductive structure in the display panel 000, it is necessary to improve the conductivity of the light absorbing layer 300. For example, the light absorbing layer 300 may also include: an auxiliary metal layer 303 located between the metal reflective layer 301 and the first blackened layer 302. Here, the conductivity of the auxiliary metal layer 303 is higher than the conductivity of the metal reflective layer 301, and the reflectivity of the metal reflective layer 301 is higher than the reflectivity of the auxiliary metal layer 303. In this way, the metal reflective layer 301 with the highest reflectivity is set on the side closest to the substrate 100, which can better reflect the laser; the first black light layer 302 with the highest absorbance is set on the side farthest from the substrate 100, which can better absorb the ambient light; the auxiliary metal layer 303 with the highest conductivity is set between the metal reflective layer 301 and the first black layer 302, which can ensure that the overall conductivity of the light absorbing layer 300 is high, and thus ensure that the light absorbing layer 300 can better serve as a conductive structure in the display panel 000.
[0174] It should be noted that the light absorbing layer 300 can be used as different conductive structures in the display panel 000 to achieve different functions. The embodiment of the present application will be schematically described using the following two possible situations:
[0175] The first possible scenario is shown in FIG16 , which is a partial top view of a display panel provided by another embodiment of the present application. After removing the light absorbing layer 300 from the display panel shown in FIG16 , its structure can refer to the panel shown in FIG8 . The light absorbing layer 300 in the display panel 000 can be divided into a plurality of auxiliary signal lines 310 corresponding to the plurality of first drive signal lines 2011 in the first electrode layer 201 . Each auxiliary signal line 310 can extend parallel to the direction of extension of the corresponding first drive signal line 2012 and can be connected in parallel with the corresponding first drive signal line 2012. A first gap d1 is provided between two adjacent auxiliary signal lines 310. This ensures that the two adjacent auxiliary signal lines 310 do not short-circuit. In this case, by arranging an auxiliary signal line 310 in parallel with each first drive signal line 2012, the resistance of the first drive signal line 2012 can be effectively reduced, ensuring that the potential at each location in the signal transmitted by the first drive signal line 2012 is substantially consistent.
[0176] For example, the auxiliary signal line 310 can correspond to the anode drive signal line L1 and the ground line L3 in the plurality of first drive signal lines 2011. In this way, the anode drive signal line L1 can be connected in parallel to the corresponding auxiliary signal line 310, and the ground line L3 can also be connected in parallel to the corresponding auxiliary signal line 310. Because both the anode drive signal line L1 and the auxiliary signal line 310 transmit signals with a fixed potential, when both the anode drive signal line L1 and the auxiliary signal line 310 are connected in parallel to the corresponding auxiliary signal line 310, it can be ensured that the potentials of the signals transmitted on the anode drive signal line L1 and the auxiliary signal line 310 are substantially consistent at various locations, thereby ensuring that the driving layer 200 has a better driving effect on the light-emitting unit 400.
[0177] It should be noted that since a fourth inorganic protective layer 706 is distributed between the light absorbing layer 300 and the second metal layer 202, the conductive light absorbing layer 300 can be insulated from the second metal layer 202 by the fourth inorganic protective layer 706, so that there will be no short circuit between the auxiliary signal line 310 in the light absorbing layer 300 and the second driving signal line 2021 in the second metal layer 202.
[0178] In the embodiment of the present application, please refer to FIG17 , which is a schematic diagram of the film layer structure of the display panel at position BB' shown in FIG16 . The display panel 000 may have multiple connection vias V. Here, the connection vias V may sequentially penetrate the fourth inorganic protective layer 706 and the second insulating layer 700 in the display panel 000, allowing the conductive light absorbing layer 300 to pass through the connection vias V and connect to the first metal layer 201.
[0179] For example, the plurality of connection vias V are distributed at least on two opposite sides of the plurality of auxiliary signal lines 310. One end of each auxiliary signal line 310 can be electrically connected to the corresponding first drive signal line 2011 through at least one connection via V, and the other end of each auxiliary signal line 310 can also be electrically connected to the corresponding first drive signal line 2011 through at least one connection via V. In this way, both ends of each auxiliary signal line 310 can be arranged in parallel with the corresponding first drive signal line 2011.
[0180] In other possible implementations, connecting vias V are distributed on both sides of each light-emitting unit 400 in the extension direction of the first drive signal line 310, thereby increasing the parallel position of the auxiliary signal line 310 and the first drive signal line 2011, further reducing the resistance of the first drive signal line 2012.
[0181] In this case, because the orthographic projection of the first pad group S10 on the substrate 100 is located within the orthographic projection of a first drive signal line 2011 on the substrate, and in the extension direction of the second drive signal line, the width of the first pad group S10 is approximately equal to the width of the first drive signal line 2011. Therefore, after providing the first openings V1 corresponding to the respective conductive pads in the first pad group S10 in the light absorbing layer 300, these first openings V1 may disconnect the auxiliary signal line 310 corresponding to the first drive signal line 2011. However, when connecting vias V are distributed on both sides of each light-emitting unit 400, even if the first openings V1 disconnect the auxiliary signal line 310, each segment of the auxiliary signal line 310 can still be connected in parallel to the first drive signal line 2011.
[0182] A second possible scenario is shown in Figures 18 and 19. Figure 18 is a partial top view of another display panel provided by another embodiment of the present application, and Figure 19 is a schematic diagram of the film layer structure of the display panel shown in Figure 18. After removing the light absorbing layer 300 from the display panel shown in Figure 18, its structure can refer to the panel shown in Figure 8. The light absorbing layer 300 in the display panel 000 can be divided into: a plurality of first touch signal lines 320 arranged in parallel, with a second gap d2 between two adjacent first touch signal lines 320. This ensures that the two adjacent first touch signal lines 320 will not short-circuit.
[0183] The display panel 000 may also include: a first insulating layer 600 located on the side of the light absorbing layer 300 facing away from the substrate 100, and a plurality of second touch signal lines 801 located on the side of the first insulating layer 600 facing away from the substrate 100. In order to more clearly see the structure of the plurality of second touch signal lines 801 in the display panel 000, please refer to Figure 20, which is a top view of a plurality of second touch signal lines provided in an embodiment of the present application. Here, the plurality of second touch signal lines 801 can be arranged in parallel, and the extension direction of the second touch signal lines 801 can intersect with the extension direction of the first touch signal lines 320. For example, the extension direction of the second touch signal lines 801 can be perpendicular to the extension direction of the first touch signal lines 320.
[0184] Among them, one of the first touch signal line 320 and the second touch signal line 801 can be used as a touch driving signal line, and the other can be used as a touch sensing signal line. The cooperation between the touch driving signal line and the touch sensing signal line can enable the display panel 000 to have a touch function.
[0185] It should be noted that the extension direction of the first touch signal line 320 can be parallel to the extension direction of the first drive signal line 2011, and the extension direction of the second touch signal line 801 can be parallel to the extension direction of the second drive signal line 2021. Here, the orthographic projection of one first touch signal line 320 on the substrate 100 can cover the orthographic projection of at least one column of light-emitting units 400 on the substrate 100. For example, as shown in FIG. 19 , the orthographic projection of one first touch signal line 320 on the substrate 100 covers the orthographic projections of two adjacent columns of light-emitting units 400 on the substrate 100.
[0186] Optionally, as shown in FIG20 , at least a portion of the second touch signal line 801 in the display panel 000 may be a grid-like metal signal line. That is, at least a portion of the second touch signal line 801 may be provided with a plurality of grid holes arranged in an array. For example, each portion of the second touch signal line 801 may be provided with a grid hole arranged in an array. In this case, the second touch signal line 600 is made of a metal material, which can ensure that the second touch signal line 801 has good guidance properties. Furthermore, when each portion of the second touch signal line 801 is provided with a grid hole arranged in an array, the area of the orthographic projection of the second touch signal line 801 on the substrate 100 can be effectively reduced. Thus, even if the second touch signal line 801 is made of a metal material and faces away from the substrate 100 relative to the light absorbing layer 300, the reflectivity of the second touch signal line 801 to ambient light can be ensured to be low, thereby preventing a significant increase in the reflectivity of the display panel 000 to ambient light.
[0187] Optionally, the display panel 000 may further include: a virtual signal line 802 located between two adjacent second touch signal lines 801. Here, the extension direction of the virtual signal line 802 may be parallel to the extension direction of the second touch signal line 801, and at least a portion of the virtual signal line 802 is a grid-shaped metal signal line. That is, at least a portion of the virtual signal line 802 is provided with a grid-shaped arrangement in an array. For example, each portion of the virtual signal line 802 is provided with grid holes arranged in an array. It should be noted that the distribution density of the grid holes in the virtual signal line 802 may be equal to the distribution density of the grid holes in the second touch signal line 801. In this way, by providing the virtual signal line 802 between two adjacent second touch signal lines 801, it can be ensured that the reflectivity of the ambient light at each position on the front of the display panel 000 is equal, so as to ensure that the effect presented on the front of the display panel 000 is better when no picture is displayed. It should be noted that, when the distance between two adjacent second touch signal lines 801 is small, it is not necessary to provide the dummy signal line 802 between the two adjacent second touch signal lines 801 .
[0188] In this application, the dummy signal line 802 is provided in the same layer and made of the same material as the second driving signal line 801. That is, the dummy signal line 802 and the second driving signal line 801 are formed through the same communication process. This effectively reduces the difficulty of manufacturing the display panel 000.
[0189] Optionally, as shown in FIG21 , FIG21 is a schematic diagram of a film layer structure of a second touch signal line or a virtual signal line provided in an embodiment of the present application. At least one of the second touch signal line 801 and the virtual signal line 802 may include: a stacked conductive metal layer 810 and a second blackening layer 820. The conductive metal layer 810 is closer to the substrate 100 than the second blackening layer 820. It should be noted that since the second touch signal line 801 and the virtual signal line 802 are formed simultaneously through a single process, both the second touch signal line 801 and the virtual signal line 802 may include: a stacked conductive metal layer 810 and a second blackening layer 820. In this way, the second blackening layer 820 can absorb ambient light directed toward the display panel 000, thereby further reducing the reflectivity of the second touch signal line 801 and the virtual signal line 802 to ambient light.
[0190] In an embodiment of the present application, as shown in Figure 22, which is a partially enlarged view of a second touch signal line and a dummy signal line provided in an embodiment of the present application, at least one of the second touch signal line 801 and the dummy signal line 802 may have a hollow structure K. The orthographic projection of the hollow structure K on the substrate 100 may overlap the orthographic projection of the first via V1 on the substrate 100. In this way, the light-emitting unit 400 can sequentially pass through the hollow structure K and the first via V1 to electrically connect to the conductive pad S.
[0191] In summary, the display panel provided by the embodiment of the present application includes: a substrate, a driving layer, a light absorbing layer and a plurality of light emitting units. The orthographic projection of the light absorbing layer on the substrate overlaps with the orthographic projection of the driving layer on the substrate. In this way, the ambient light directed toward the display panel can be absorbed by the light absorbing layer, so that the degree to which the ambient light directed toward the display panel is reflected by the driving layer is low, thereby ensuring that the reflectivity of the display panel to the ambient light is low. In addition, by providing the light absorbing layer in the display panel, the reflectivity of the display panel to the ambient light can be reduced. Therefore, the transmittance of the auxiliary light absorbing layer located on the side of the plurality of light emitting units away from the substrate can be appropriately increased, so that the absorption rate of the auxiliary light absorbing layer to the light is low, thereby making the degree to which the light emitted by the light emitting unit is absorbed by the auxiliary light absorbing layer low. In this way, the overall display brightness of the display panel can be made higher without requiring the display panel to provide a large driving current to the light emitting unit, thereby effectively reducing the power consumption of the display panel.
[0192] Embodiments of the present application also provide a display device. This display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. This display device can include a driver component and the display panel described in the above embodiments. The driver component can be electrically connected to a driver layer in the display panel, and is configured to provide a drive signal to the light-emitting unit via the driver layer.
[0193] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.
[0194] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.
[0195] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. A display panel, characterized in that: include: substrate; A driving layer located on one side of the substrate, the driving layer having a plurality of conductive pads; a light absorbing layer located on a side of the driving layer away from the substrate, wherein the orthographic projection of the light absorbing layer on the substrate overlaps with the orthographic projection of the driving layer on the substrate, and the light absorbing layer has a plurality of first via holes corresponding to the plurality of conductive pads, wherein the orthographic projection of the first via holes on the substrate overlaps with the orthographic projection of the corresponding conductive pads on the substrate; And, a plurality of light emitting units are located on a side of the light absorbing layer away from the substrate, wherein the light emitting units are electrically connected to at least a portion of the conductive pads through the first via holes.
2. The display panel according to claim 1, characterized in that: In the display area of the display panel, the orthographic projection of the light absorption layer on the substrate covers the orthographic projection of a portion of the driving layer other than the conductive pad on the substrate.
3. The display panel according to claim 1, characterized in that: The display panel further includes: a first insulating layer located on a side of the light absorbing layer away from the substrate, the first insulating layer having a plurality of second via holes corresponding to the plurality of first via holes one by one, the second via holes being connected to the corresponding first via holes; Wherein, the light emitting unit is electrically connected to the conductive pad through the second via hole and the first via hole.
4. The display panel according to claim 3, characterized in that: A portion of the first insulating layer extends into the first via hole and covers at least a portion of an inner wall of the first via hole; The first insulating layer includes at least one of an inorganic insulating layer and an organic insulating layer.
5. The display panel according to claim 4, characterized in that: The light absorbing layer includes carbon particles; and the inner wall of the first via hole is completely covered by the first insulating layer.
6. The display panel according to claim 4, characterized in that: The first insulating layer includes both an inorganic insulating layer and an organic insulating layer, and the inorganic insulating layer is closer to the light absorbing layer than the organic insulating layer; A portion of the inorganic insulating layer extends into the first via hole and covers an inner wall of the first via hole, and / or a portion of the organic insulating layer extends into the first via hole and covers an inner wall of the first via hole.
7. The display panel according to claim 4, characterized in that: The first insulating layer includes both an inorganic insulating layer and an organic insulating layer, and the organic insulating layer is closer to the light absorbing layer than the inorganic insulating layer; A portion of the inorganic insulating layer extends into the first via hole and covers an inner wall of the first via hole, and / or a portion of the organic insulating layer extends into the first via hole and covers an inner wall of the first via hole.
8. The display panel according to any one of claims 1 to 7, characterized in that: The thickness of the light absorbing layer ranges from 0.5 micrometers to 5 micrometers.
9. The display panel according to any one of claims 1 to 7, characterized in that: The optical density OD value of the light absorbing layer is greater than or equal to 4.
10. The display panel according to any one of claims 1 to 7, characterized in that: The driving layer includes: a first metal layer and a second metal layer stacked in layers; the display panel also includes: a second insulating layer located between the first metal layer and the second metal layer, the first metal layer being closer to the substrate than the second metal layer; Wherein, the first metal layer comprises: a plurality of first drive signal lines, the second metal layer comprises: a second drive signal line and the plurality of conductive pads, and the extension direction of the first drive signal line intersects with the extension direction of the second drive signal line; Among the plurality of conductive pads, a portion of the conductive pads are electrically connected to the second driving signal line, and another portion of the conductive pads are electrically connected to the first driving signal line.
11. The display panel according to claim 10, characterized in that: The light absorbing layer comprises: an organic film layer made of an organic material having light absorbing property.
12. The display panel according to claim 11, characterized in that: The edge area of the substrate facing away from the driving layer includes: a binding area, and the display panel further includes: a plurality of signal leads located in the binding area, at least some of the plurality of signal leads are electrically connected to the plurality of first driving signal lines; Among them, the part of the light absorbing layer covered by the binding area has an auxiliary opening; the display panel has a blank area, and the blank area is the area in the binding area that is not covered by the first metal layer and the second metal layer; the orthographic projection of the auxiliary opening on the substrate overlaps with the orthographic projection of the blank area on the substrate.
13. The display panel according to claim 12, characterized in that: The orthographic projection of the auxiliary opening on the substrate covers the orthographic projection of the blank area on the substrate; or, the orthographic projection of the blank area on the substrate covers the orthographic projection of the auxiliary opening on the substrate.
14. The display panel according to claim 12, characterized in that: The plurality of light emitting units are arranged in a plurality of columns, the plurality of first driving signal lines include a plurality of groups of first driving signal lines corresponding to the plurality of columns of light emitting units, and a group of the first driving signal lines is electrically connected to each light emitting unit in a corresponding column of light emitting units; The auxiliary openings are distributed at least between two adjacent groups of the first driving signal lines and two adjacent groups of the second driving signal lines.
15. The display panel according to claim 14, characterized in that: A group of the first driving signal lines includes: a grounding line; the second metal layer further includes: an auxiliary grounding line arranged in parallel with the second driving signal line, the auxiliary grounding line is electrically connected to the grounding line, and the orthographic projection of the auxiliary grounding line on the substrate overlaps with the orthographic projection of the binding area on the substrate; Among them, one of the auxiliary grounding lines and the adjacent second driving signal line are distributed between two rows of the light-emitting units, and the auxiliary openings are also distributed between two groups of adjacent first driving signal lines and one of the auxiliary grounding lines and the adjacent second driving signal line.
16. The display panel according to any one of claims 11 to 15, characterized in that: The display panel further comprises: a plurality of connection wires electrically connected to the plurality of signal leads, a portion of the connection wires being located on a side of the substrate close to the driving layer, and another portion of the connection wires being located on a side of the substrate; Wherein, the plurality of connecting wires and the plurality of signal leads are formed by a same process.
17. The display panel according to claim 8, characterized in that: The light absorbing layer is conductive; the light absorbing layer comprises: a metal reflective layer, and a first blackened layer located on a side of the metal reflective layer away from the substrate.
18. The display panel according to claim 17, characterized in that: The light absorption layer includes a plurality of auxiliary signal lines corresponding to the plurality of first drive signal lines, a first gap is provided between two adjacent auxiliary signal lines, the auxiliary signal lines extend in the same direction as the corresponding first drive signal lines, and are connected in parallel with the corresponding first drive signal lines.
19. The display panel according to claim 18, characterized in that: The display panel has a plurality of connection vias, and the plurality of connection vias are distributed at least on two sides of the plurality of auxiliary signal lines that are relatively arranged, one end of the auxiliary signal line is electrically connected to the corresponding first drive signal line through at least one of the connection vias, and the other end of the auxiliary signal line is electrically connected to the corresponding first drive signal line through at least one of the connection vias.
20. The display panel according to claim 17, characterized in that: The light absorption layer includes a plurality of first touch signal lines arranged in parallel, and a second gap is provided between two adjacent first touch signal lines; The display panel further includes: a first insulating layer located on a side of the light absorbing layer away from the substrate, and a plurality of second touch signal lines located on a side of the first insulating layer away from the substrate, wherein an extension direction of the second touch signal lines intersects an extension direction of the first touch signal lines.
21. The display panel according to claim 20, characterized in that: At least a portion of the second touch signal lines are grid-shaped metal signal lines.
22. The display panel according to claim 21, characterized in that: The display panel further includes: a virtual signal line located between two adjacent second touch signal lines, at least part of the virtual signal line is a grid-shaped metal signal line, and the virtual signal line is arranged in the same layer and made of the same material as the second drive signal line.
23. The display panel according to claim 22, characterized in that: The second touch signal line and the dummy signal line both include: a conductive metal layer and a second black layer stacked together, and the conductive metal layer is closer to the substrate than the second black layer.
24. The display panel according to claim 22, characterized in that: At least one of the second touch signal line and the dummy signal line has a hollow structure, and an orthographic projection of the hollow structure on the substrate covers an orthographic projection of the first via hole on the substrate.
25. The display panel according to any one of claims 17 to 24, characterized in that: The light absorption layer further includes an auxiliary metal layer located between the metal reflective layer and the first blackened layer. The conductivity of the auxiliary metal layer is higher than that of the metal reflective layer. The reflectivity of the metal reflective layer is higher than that of the auxiliary metal layer.
26. The display panel according to any one of claims 11-15, 17-24, characterized in that: The display panel further comprises: a plurality of driving chips, wherein the driving chips are electrically connected to one or more of the light emitting units; The plurality of conductive pads include: a first pad group for fixedly connecting to the light emitting unit, and a second pad group for fixedly connecting to the driving chip.
27. The display panel according to claim 26, characterized in that: The first pad group includes: a first conductive pad and a second conductive pad; the second pad group includes: a third conductive pad, a fourth conductive pad and a fifth conductive pad; A portion of the plurality of first drive signal lines is electrically connected to the first conductive pad, the second conductive pad is electrically connected to the third conductive pad, another portion of the plurality of first drive signal lines is electrically connected to the fourth conductive pad, and the second drive signal lines are electrically connected to the fourth conductive pad. The signal line is electrically connected to the fifth conductive pad.
28. The display panel according to claim 27, characterized in that: The display panel further includes: an auxiliary light absorption layer located on a side of the plurality of light emitting units away from the substrate, wherein the auxiliary light absorption layer covers both the driving chip and the light emitting units.
29. A display device, characterized in that: include: A driving component, and a display panel as claimed in any one of claims 1 to 28; The driving component is electrically connected to the driving layer, and the driving component is used to provide a driving signal to the light-emitting unit through the driving layer.
