Method and system for packaging components arranged on a substrate

Abstract

A method (100) of at least partially encapsulating at least one component (2) arranged on a substrate (4) is disclosed. The method (100) comprises the step of dispensing (110) at least one drop of polymer (8) on and / or around the component (2) by spraying using a nozzle (340) to obtain the dispensed polymer (8). The method (100) further comprises at least partially curing (130) the dispensed polymer (8) by exposing the dispensed polymer (8) to a light source (330) to obtain a cured polymer (8). The method (100) further includes protecting (120) the nozzle (340) while at least partially curing (130) the dispensed polymer (8), and repeating (170) the steps of dispensing (110), at least partially curing (130), and protecting (120), thereby at least partially encapsulating the component (2).

Description

Technical Field

[0001] The present invention relates to a method and a system for at least partially encapsulating a component arranged on a substrate. Furthermore, the present disclosure relates to a hearing device comprising a substrate having at least one partially encapsulated component obtained according to the method. Background Art

[0002] Electronic devices such as hearing devices often include components that are sensitive to environmental factors, such as moisture, heat, cold, dust, sand, etc. Such components need to be protected from these environmental factors.

[0003] Electronic devices such as hearing devices also often include components that emit magnetic, electric or electromagnetic fields. Such components need to be shielded to protect other sensitive components and devices from the electric, magnetic or electromagnetic fields emitted by such components, which may otherwise interfere with sensitive components and devices. Such components may also need to be shielded and protected from environmental interference.

[0004] In the past few years, different methods have been developed to provide such protection and / or such shielding. However, such methods have some disadvantages in terms of reliability and controllability, for example. As an example, the top corners of a component may be difficult to cover with a protective material.

[0005] Therefore, there is a need for an improved method and an improved system for at least partially encapsulating components arranged on a substrate to provide such improved protection of such components, e.g. in a hearing device, against environmental factors and / or to provide such improved shielding of such components, e.g. in a hearing device, to protect other sensitive components and / or the components themselves from interfering influences of emissions. Summary of the invention

[0006] According to a first aspect, a method for at least partially encapsulating at least one component arranged on a substrate is disclosed. The method includes the step of dispensing at least one first drop of polymer by spraying on the component and / or around the component using a nozzle to obtain the dispensed polymer. The method also includes the step of at least partially curing the dispensed polymer by exposing the dispensed polymer to a light source to obtain a cured polymer. The method also includes the step of protecting the nozzle while at least partially curing the dispensed polymer. The method further includes repeating the steps of dispensing, protecting and at least partially curing, thereby at least partially encapsulating the at least one component.

[0007] The step of dispensing at least one first drop of polymer on and / or around the component may include dispensing one drop of polymer on or around the component. The step of dispensing at least one first drop of polymer on and / or around the component may include dispensing several drops of polymer on or around the component, such as two or three or more drops of polymer. The step of dispensing at least one first drop of polymer on and / or around the component may include dispensing up to 10,000 drops of polymer on or around the component. The dispensing step may include dispensing all the droplets to be dispensed on the substrate.

[0008] The step of dispensing at least one first drop of polymer on and / or around the component to obtain the dispensed polymer by spraying with a nozzle allows controlled and reliable dispensing of the polymer on the desired area, wherein the risk of applying the polymer on the components and substrate areas that are not intended to be covered / encapsulated by the polymer is minimized. It further allows dispensing the polymer around the component, i.e. on the substrate area around the component, for example between adjacent / neighboring components, and thereby provides effective protection to prevent adjacent / neighboring components from shorting each other. The step of dispensing at least one first drop of polymer on and / or around the component to obtain the dispensed polymer by spraying with a nozzle also allows the polymer to be dispensed under at least one component due to the spraying, for example into the free space between the component and the substrate. Dispensing the polymer under at least one component can provide protection under the component, which is crucial for obtaining dirt and / or corrosion protection of at least one component, i.e. ensuring that there are no openings in the dispensed polymer covering the component, through which moisture and solid particles can reach the component and / or conductive material (added on top of the dispensed and / or at least partially cured polymer to provide shielding) can contact the terminals of the component through the opening. It is necessary to prevent the conductive material from coming into contact with the terminals of the component, as this may result in corrosion between the conductive material and the component, which is caused by a material thermodynamic mismatch between the conductive material and the respective materials of the component terminals. Dispensing the polymer under the at least one component may further provide that when the at least one component is arranged / mounted on the substrate, a processing step of bottom filling the at least one component may be skipped. The nozzle may be connected to a pump so that the polymer may be supplied from the pump to the nozzle. The dispensing step may include ejecting at least one first drop of polymer at a first frequency. The first frequency may be in the range of 1 Hz to 1000 Hz.

[0009] The step of dispensing may include spraying at least one first drop of polymer at a first interval. The step of dispensing by spraying may include periodically dispensing at least one drop of polymer during a first time period and not dispensing any polymer during a second time period, i.e., dispensing is interrupted during the second time period. The first time period may be in the range of 0.001 seconds to 10 seconds. The second time period may be in the range of 0.001 seconds to 10 seconds.

[0010] The step of at least partially curing the allocated polymer by exposing the allocated polymer to a light source allows a cured polymer to be obtained. Thus, the step of at least partially curing the allocated polymer allows preventing the cured polymer from moving, flowing or spreading on and / or around the component, or at least allows slowing down the movement, flow or diffusion of the cured polymer on and / or around the component. The step of at least partially curing the allocated polymer can be performed after the step of distributing at least one drop of polymer on and / or around the component. At least partially curing the allocated polymer by exposing the allocated polymer to a light source causes at least a change in the physical properties of the allocated polymer, such as a change in the viscosity of the allocated polymer. The step of at least partially curing the allocated polymer may include partially curing the allocated polymer. The partial curing of the allocated polymer may include curing the allocated polymer until the viscosity of at least a portion of the allocated polymer changes. For example, the partial curing of the allocated polymer may include curing the allocated polymer until the surface of the allocated polymer hardens. The step of at least partially curing the allocated polymer may include fully curing the allocated polymer. Completely curing the dispensed polymer may include curing the dispensed polymer until the entire dispensed polymer changes viscosity. For example, completely curing the dispensed polymer may include curing the dispensed polymer until the entire dispensed polymer hardens.

[0011] The light source may be configured so that the light source can emit light during the step of at least partially curing the allocated polymer. In other words, during the step of distributing at least one drop of polymer onto the component and / or around the component, the light source may not emit light. For example, the step of at least partially curing the allocated polymer may include exposing the allocated polymer to the light source to obtain the at least partially cured polymer, wherein the light source may be turned on and off at a second interval. The second interval may cause the light source to be periodically turned on in a third time period and turned off in a fourth time period. The light source may be configured so that the light source can emit light at a second frequency. The light source may be activated / turned on and deactivated / turned off alternately at a second frequency. The second frequency may be the same as the first frequency. The second frequency may be different from the first frequency. The second frequency may be in the range of 1 Hz to 1000 Hz. The second frequency may be configured so that during the step of at least partially curing the allocated polymer to expose the allocated polymer to the light source (i.e., obtaining a cured polymer), the light source is turned on. The second frequency may be configured so that during the step of distributing at least one first drop of polymer to obtain the allocated polymer by spraying on the component and / or around the component using a nozzle, the light source is turned off. The third time period may be in the range of 0.001 seconds to 10 seconds. The fourth time period may be in the range of 0.001 seconds to 10 seconds.

[0012] Alternatively, the step of at least partially curing the dispensed polymer may include exposing the dispensed polymer to a light source to obtain the at least partially cured polymer, wherein the light source has a light scheme. The light scheme may be such that: when the nozzle does not dispense at least one first drop of polymer on and / or around the component, it may not have a specific frequency, but instead emits light. For example, the light scheme may emit light when the nozzle is not dispensing and moves from one position to another. For example, the light scheme may emit light when the nozzle moves from a first position corresponding to the position of at least one component to a second position corresponding to the position of another component. The light source may be any light source suitable for at least partially curing the dispensed polymer.

[0013] The step of protecting the nozzle while at least partially curing the dispensed polymer allows protecting polymer residues remaining on and / or in the nozzle from exposure to the light source during the step of at least partially curing the dispensed polymer. Thus, the viscosity of the polymer residues remaining on and / or in the nozzle may not change during the step of at least partially curing the dispensed polymer because the nozzle is protected during the step of at least partially curing the dispensed polymer. In other words, the polymer residues remaining on and / or in the nozzle may not harden during the step of at least partially curing the dispensed polymer because the nozzle is protected during the step of at least partially curing the dispensed polymer. Thus, the step of protecting the nozzle allows providing a uniform distribution of the polymer on and / or around the component, i.e. always dispensing a polymer with the same viscosity.

[0014] Repeating the steps of dispensing, protecting and at least partially curing, thereby at least partially encapsulating the step of at least one component allows obtaining at least partially encapsulated components. Encapsulating at least one component at least partially allows encapsulating at least a portion, part or surface of the component, such as the top surface of the component. Encapsulating at least one component at least partially allows the component to be fully encapsulated, i.e., the entire (visible) surface of the component is fully encapsulated, such as the top surface, one or more side surfaces, one or more top corners of the component and at least one edge portion of the bottom surface of the component. Encapsulating at least one component at least partially allows more components to be at least partially encapsulated, such as at least partially encapsulating two or three components. For example, it allows encapsulating a portion, part or surface of more components, such as the top surface of more components. Encapsulating at least one component at least partially also allows more components to be fully encapsulated, i.e., the entire (visible) surface of all components is fully encapsulated, such as the top surface of the component, the side surface, one or more top corners and at least one edge portion of the bottom surface of more components. The term "encapsulating at least one component" means protecting or enclosing at least one component.

[0015] In general, the method allows improved control of the encapsulation of at least one component to protect at least one component from destructive invisible factors such as solid particles (such as dirt and dust) and moisture, that is, by preventing solid particles and moisture from reaching / damaging / corroding one or more components and / or by protecting at least one component from being short-circuited by adjacent components and / or by protecting the terminals of the component from contacting with conductive materials. This is because the method allows controlled dispersion of polymers, such as controlled drop-by-drop dispersion of polymers. In addition, the method allows the thickness of the polymers to be controlled by controlling the amount of the polymer to be distributed. This in turn allows the use of less polymer material, and therefore allows an economically friendly method. In addition, controlling the thickness of the polymers to be distributed by controlling the amount of the polymers to be distributed further allows uniform and repeatable packaging of the components. The method further allows spatially controlled packaging of at least one component by at least partially curing each of the polymers distributed after each distribution step. This is because the step of at least partially curing the polymers distributed prevents the cured polymers from moving, flowing or diffusing on and / or around the components, or at least slows down the movement, flow or diffusion of the cured polymers on and / or around the components. Thus, the method allows for complete, consistent, reliable and controlled three-dimensional packaging of at least one component. Furthermore, the method can be performed in a manual-free manner, such as in a program-controlled manner.

[0016] The substrate may be any substrate, such as a printed circuit board (PCB) or a PCB assembly (PCBA).The substrate may be any conventional and commercially available substrate.

[0017] The at least one component may include any component including metal leads and / or terminals. The at least one component may be a component of a hearing device. The at least one component may include any electronic component, any magnetic component or any electromagnetic component. Electronic components may emit electric (E) fields, i.e. have electric noise. Magnetic components may emit magnetic (M) fields, i.e. have magnetic noise. Electromagnetic components may emit electromagnetic (EM) fields, i.e. have electromagnetic noise.

[0018] One or more components of the hearing device may include different kinds of components. One or more components of the hearing device may be one kind of component. Components of the hearing device may have different sizes and shapes, such as different heights, different base areas, different volumes, etc.

[0019] In an embodiment, the hearing device is configured to be worn by a user. The hearing device may be arranged at the user's ear, on the user's ear, above the user's ear, in the user's ear, in the user's ear canal, behind the user's ear and / or in the user's auricle, that is, the hearing device is configured to be worn in the user's ear, on the ear, above the ear and / or at the ear. The user may wear two hearing devices, one in each ear. The two hearing devices may be connected, such as wirelessly and / or by wire, such as a binaural hearing aid system.

[0020] The hearing device may be hearable, such as earphones, headphones, earplugs, hearing aids, personal sound amplification products (PSAPs), over-the-counter (OTC) hearing devices, hearing protection devices, universal hearing devices, custom hearing devices, or another head-wearable hearing device. The hearing device may include both prescription devices and over-the-counter devices.

[0021] Hearing devices may be embodied in a variety of housing styles or form factors. Some of these form factors are behind-the-ear (BTE) hearing devices, receiver-in-the-canal (RIC) hearing devices, receiver-in-the-ear (RIE) hearing devices, or microphone-in-the-ear (MaRIE) hearing devices. These devices may include a BTE unit configured to be worn behind the ear of a user and an in-the-ear (ITE) unit configured to be partially or fully inserted into the ear canal of a user. In general, a BTE unit may include at least one input transducer, a power supply, and a processing unit. The term BTE hearing device refers to a hearing device in which a receiver, i.e., an output transducer, is included in the BTE unit and sound is directed to the ITE unit via an acoustic tube connecting the BTE and ITE units, while the terms RIE, RIC, and MaRIE hearing devices refer to hearing devices in which a receiver may be included in an ITE unit, which is coupled to the BTE unit via a connector cable or wire configured to transfer electrical signals between the BTE and ITE units.

[0022] Some of these form factors are in-the-ear (ITE) hearing devices, complete-in-the-canal (CIC) hearing devices, or invisible-in-the-ear (IIC) hearing devices. These hearing devices may include an ITE unit, wherein the ITE unit may include at least one input transducer, a power supply, a processing unit, and an output transducer. These form factors may be custom devices, meaning that the ITE unit may include a housing made of a hard material (such as a hard polymer or metal) or a soft material (such as a rubber-like polymer), molded to have an outer shape that conforms to the shape of a specific user's ear canal.

[0023] Some of these form factors are earplugs, on-ear headphones or over-ear headphones. Those skilled in the art are aware of different kinds of hearing devices and different options for arranging the hearing device in, on, over and / or at the ear of a hearing device wearer. A hearing device (or a pair of hearing devices) may be custom fit, standard fit, open fit and / or occluded fit.

[0024] In an embodiment, the hearing device may include one or more input transducers. The one or more input transducers may include one or more microphones. The one or more input transducers may include one or more vibration sensors configured to detect bone vibrations. The one or more input transducers may be configured to convert the acoustic signal into a first electrical input signal. The first electrical input signal may be an analog signal. The first electrical input signal may be a digital signal. The one or more input transducers may be coupled to one or more analog-to-digital converters configured to convert the analog first input signal into a digital first input signal.

[0025] In an embodiment, the hearing device may comprise one or more antennas configured for wireless communication. The one or more antennas may comprise an electrical antenna. The electrical antenna may be configured for wireless communication at a first frequency. The first frequency may be above 800 MHz, preferably a wavelength between 900 MHz and 6 GHz. The first frequency may be between 902 MHz and 928 MHz. The first frequency may be between 2.4 and 2.5 GHz. The first frequency may be between 5.725 GHz and 5.875 GHz. The one or more antennas may comprise a magnetic antenna. The magnetic antenna may comprise a magnetic core. The magnetic antenna may comprise a coil. The coil may be coiled around the magnetic core. The magnetic antenna may be configured for wireless communication at a second frequency. The second frequency may be below 100 MHz. The second frequency may be between 9 MHz and 15 MHz.

[0026] In an embodiment, the hearing device may include one or more wireless communication units. The one or more wireless communication units may include one or more wireless receivers, one or more wireless transmitters, one or more transmitter-receiver pairs and / or one or more transceivers. At least one of the one or more wireless communication units may be coupled to one or more antennas. The wireless communication unit may be configured to convert a wireless signal received by at least one of the one or more antennas into a second electrical input signal. The hearing device may be configured for wired / wireless audio communication, for example, enabling a user to listen to media, such as music or radio, and / or enabling a user to conduct a telephone conversation.

[0027] In an embodiment, the wireless signal may originate from one or more external sources and / or external devices, such as a spouse's microphone device, a wireless audio transmitter, a smart computer, and / or a distributed microphone array associated with a wireless transmitter. The wireless input signal may originate from another hearing device, for example, as part of a binaural hearing system, and / or from one or more accessory devices, such as a smartphone and / or a smartwatch.

[0028] In an embodiment, the hearing device may include a processing unit. The processing unit may be configured to process the first electrical input signal and / or the second electrical input signal. The processing may include compensating for the user's hearing loss, i.e. applying a frequency-dependent gain to the input signal according to the user's frequency-dependent hearing impairment. The processing may include performing feedback cancellation, beamforming, tinnitus reduction / shielding, noise reduction, noise cancellation, speech recognition, bass adjustment, treble adjustment and / or processing of user input. The processing unit may be a processor, an integrated circuit, an application, a functional module, etc. The processing unit may be implemented in a single signal processing chip or a printed circuit board (PCB). The processing unit may be configured to provide a first electrical output signal based on processing of the first electrical input signal and / or the second electrical input signal. The processing unit may be configured to provide a second electrical output signal. The second electrical output signal may be based on processing of the first electrical input signal and / or the second electrical input signal.

[0029] In an embodiment, the hearing device may include an output transducer. The output transducer may be coupled to a processing unit. The output transducer may be a receiver. Note that in this context, the receiver may be a loudspeaker, and the wireless receiver may be a device configured to process wireless signals. The receiver may be configured to convert the first electrical output signal into an acoustic output signal. The output transducer may be coupled to the processing unit via a magnetic antenna. The output transducer may be included in an ITE unit or earpiece of the hearing device, such as a receiver in the ear (RIE) unit or a microphone and receiver in the ear (MaRIE) unit. One or more of the input transducers may be included in the ITE unit or the earpiece.

[0030] In an embodiment, the wireless communication unit may be configured to convert the second electrical output signal into a wireless output signal. The wireless output signal may include synchronization data. The wireless communication unit may be configured to transmit the wireless output signal via at least one of the one or more antennas.

[0031] In an embodiment, the hearing device may comprise a digital-to-analog converter configured to convert the first electrical output signal, the second electrical output signal and / or the wireless output signal into an analog signal.

[0032] In an embodiment, the hearing device may include a vent. The vent is a physical passage, such as a duct or tube, which is primarily placed to provide pressure balance across a housing placed in the ear, such as an ITE hearing device, an ITE unit of a BTE hearing device, a CIC hearing device, a RIE hearing device, a RIC hearing device, a MaRIE hearing device, or a dome tip / ear mold. The vent may be a pressure vent with a small cross-sectional area, which is preferably acoustically sealed. The vent may be an acoustic vent configured to eliminate obstruction. The vent may be an active vent, which enables the vent to be opened or closed during use of the hearing device. The active vent may include a valve.

[0033] In an embodiment, the hearing device may include a power supply. The power supply may include a battery providing a first voltage. The battery may be a rechargeable battery. The battery may be a replaceable battery. The power supply may include a power management unit. The power management unit may be configured to convert the first voltage to a second voltage. The power supply may include a charging coil. The charging coil may be provided by a magnetic antenna.

[0034] In an embodiment, the hearing device may comprise memory including both volatile and non-volatile forms of memory.

[0035] In some embodiments, the dispensing step includes dispensing at least one first drop of polymer on at least one side of the component and / or around the side. The at least one first drop of polymer can be dispensed on at least one side of the component and / or around at least one side of the component, for example on / around a corner / edge of a side of the component and / or between a corner / edge of a side of the component and a substrate. Thus, the method not only allows for dispensing polymer on and / or around the component, but the method can also allow for dispensing polymer on the side of the component. Therefore, the method can allow for uniform, complete, complete, consistent, reliable and controlled three-dimensional packaging of at least one component on a substrate.

[0036] In some embodiments, the dispensing step includes spraying at least one drop of a first UV curable polymer on and / or around and / or below the component. This can allow the dispensed UV curable polymer to be obtained on and / or around and / or below the component. The UV curable polymer can be any conventional and commercially available UV curable polymer. The polymer can include acrylic (poly) urethane, such as Humiseal UV40 polymer.

[0037] In some embodiments, the step of at least partially curing includes at least partially curing the allocated polymer by exposing the allocated polymer to a UV light source to obtain a cured polymer. In other words, the step of at least partially curing includes at least partially curing the allocated UV curable polymer by exposing the allocated UV curable polymer to a UV light source to obtain a cured polymer. At least partially curing the allocated UV curable polymer by exposing the allocated UV curable polymer to a UV light source can cause a change in at least the physical properties of the allocated UV curable polymer, for example, changing the viscosity of the allocated UV curable polymer. The UV light source can have a wavelength in the range of 100nm to 400nm. The UV light source can provide UVA and / or UVB and / or UVC light / rays.

[0038] In certain embodiments, the step of at least partially curing includes exposing the allocated polymer to a UV light source until the surface of the allocated polymer becomes at least partially cured. In other words, the step of at least partially curing may include exposing the allocated UV curable polymer to a UV light source until the surface of the allocated UV curable polymer becomes at least partially cured. Thereby, the surface of the allocated UV curable polymer may become hardened. Therefore, after the step of at least partially curing, the allocated UV curable polymer may not move, flow or diffuse on and / or around the component. This then can allow the packaging of at least one component to be controlled spatially, and therefore a complete, complete, consistent, reliable and controlled three-dimensional packaging of at least one component can be provided.

[0039] In some embodiments, the dispensing step includes ejecting at least one first drop of polymer at a first frequency in the range of 1 Hz to 1000 Hz. The first frequency may depend on several factors, such as nozzle size, material viscosity of the polymer being dispensed, etc. The step of dispensing at a first frequency in the range of 1 Hz to 1000 Hz may result in the dispensing of 100 to 1000 drops of polymer per second. Therefore, the step of dispensing at a frequency in the range of 1 Hz to 1000 Hz may result in at least partially encapsulating at least one component in a time-efficient manner.

[0040] In some embodiments, the protection step includes protecting the nozzle from light by means of a protection element while at least partially curing the dispensed polymer. Thus, the protection element can protect the nozzle and the polymer residue left in and / or on the nozzle from being exposed to the light source in an improved manner. The protection element may include an opening aligned with the tip / opening of the nozzle, through which the polymer is dispensed. The protection element may further include a protection mechanism that allows the opening of the protection element to be effectively and quickly opened / closed. The protection mechanism may be an electrical and / or automatically controlled protection mechanism. The protection element may include a shutter. The shutter may include one or more movable shutter plates. The protection element may further include a shield that surrounds the nozzle, such as around the side of the nozzle. The opening of the protection element may be included in the shield as an opening in the shield. The opening in the shield may be aligned with the tip / opening of the nozzle, through which the polymer is dispensed. A protection mechanism, such as one or more shutter plates, may be configured to cover an opening in the protection element, such as a shield around the side of the nozzle.

[0041] In some embodiments, the method further comprises, when at least partially solidifying the allocated polymer, and / or after distributing at least one first drop of polymer, and / or when / during / simultaneously distributing at least one first drop of polymer, loading the polymer into the nozzle for at least one second drop of polymer. Thus, loading the polymer into the nozzle can provide polymer material for at least the second drop of polymer, i.e. for the next dispensing step and / or the next dispensing, protecting and at least partially solidifying step cycle. Therefore, loading the polymer into the nozzle can allow repeating steps, and therefore can allow at least partially encapsulating the components. Loading the polymer into the nozzle can also allow a more time-efficient method to be provided, because the nozzle is loaded during the step of at least partially solidifying the allocated polymer, i.e. during the interruption time of the dispensing step. The nozzle can be connected to the first container. The first container can be a pump, such as a stroke or piezoelectric pump. The first container can be a syringe. The first container can be connected to the second container. The second container can also be a pump, such as a stroke or piezoelectric pump. The second container can be a cartridge. The polymer material can be loaded into the second container. The first container can be arranged downstream of the second container so that the polymer material can flow from the second container into the first container. The nozzle may be arranged downstream of the first container so that the polymer material can flow from the first container into the nozzle for the next dispensing step.

[0042] The step of loading the polymer into the nozzle may be performed simultaneously with the step of protecting the nozzle. The step of loading the polymer into the nozzle may be performed before the step of protecting the nozzle. The step of loading the polymer into the nozzle may be performed after the step of protecting the nozzle.

[0043] The step of loading the polymer into the nozzle may be performed before the step of dispensing a drop of polymer (such as the first drop of polymer or the second drop of polymer). The step of loading the polymer into the nozzle may be performed after the step of dispensing a drop of polymer (such as the first drop of polymer or the second drop of polymer). The step of loading the polymer into the nozzle may be performed simultaneously with the step of dispensing a drop of polymer (such as the first drop of polymer or the second drop of polymer).

[0044] The step of loading the polymer into the nozzle may be performed simultaneously with the step of at least partially curing. The step of loading the polymer into the nozzle may be performed before the step of at least partially curing. The step of loading the polymer into the nozzle may be performed after the step of at least partially curing.

[0045] In certain embodiments, the method further includes after the steps of repeating the allocation, at least partially curing and protecting steps, when at least one component is at least partially encapsulated, completely curing the at least partially encapsulated components. Thereby, the partially encapsulated components can be completely cured at one time. This in turn can allow even more improved methods by providing a more controlled, more reliable, more consistent and more uniform encapsulation of the components. This is due to the complete curing of the at least partially encapsulated components preventing or at least slowing down the over-curing of those allocated and cured polymer drops allocated earlier in the method, because all the allocated and cured polymer drops can be completely cured at one time. In addition, the complete curing of the at least partially encapsulated components can allow even more time-effective methods. The complete curing of the at least partially encapsulated components can be performed using the same light source for at least partially curing the allocated polymer. Complete curing of at least partially encapsulated components can be performed using another light source that is different from the light source used to at least partially cure the dispensed polymer. For example, the substrate with at least partially encapsulated components can be moved to another station of the system with another light source (for at least partially encapsulating components arranged on the substrate), which makes it possible to start at least partially encapsulating one or more components on another substrate at the first station while completely curing the substrate with at least partially encapsulated components.

[0046] The system (for at least partially encapsulating components arranged on a substrate) may further include a conveyor belt. The conveyor belt may be configured to transport the substrate to another station, such as a station for fully curing the at least partially encapsulated components. The system may further include another light source. The other light source may be configured to fully cure the at least partially encapsulated components. The other light source may be a light source of the same type as the light source for at least partially curing the allocated polymer. The other light source may have a different type from the light source for at least partially curing the allocated polymer. For example, the other light source may be arranged at another station. The other light source may be arranged perpendicular to the surface of the substrate, i.e., parallel to the normal of the surface of the substrate. The other light source may be arranged at a certain angle relative to the surface of the substrate. Relative to the surface of the substrate, the angle may be in the range of 0 to 180 degrees, preferably in the range of 30 to 150 degrees.

[0047] One or more components may be electronic components that emit electric (E) fields, i.e., have electric noise. One or more components may be magnetic components that emit magnetic (M) fields, i.e., have magnetic noise. One or more components may be electromagnetic components that emit electromagnetic (EM) fields, i.e., have electromagnetic noise. Further examples of one or more (noisy / emitting) components may be power components, such as buck converters or switch-mode power supplies, which include chokes, coils, or capacitors to periodically store energy, resulting in high magnetic and / or electrical noise. Buck converters and switch-mode power supplies can both radiate magnetic and electric fields, thereby generating electromagnetic fields. Such components may need to be shielded to protect other sensitive components and devices from the electric, magnetic, or electromagnetic fields emitted from such components, otherwise such components may interfere with sensitive components and devices. Such components may also need to be shielded from other components and devices that emit electric, magnetic, and / or electromagnetic fields.

[0048] Components in hearing devices that are sensitive to electrical, magnetic and / or electromagnetic noise may be magnetic or electromagnetic coils for providing wireless communication with other electronic devices and / or for transmitting or receiving radio frequency signals. In hearing devices, there may be a magnetic induction (MI) coil and / or there may be a remote coil. These coils should be electromagnetically (EM) shielded from electromagnetic noise components in the hearing device.

[0049] In some embodiments, the method further includes applying a conductive material to the at least partially encapsulated component after repeating the steps of dispensing, protecting and at least partially curing to form a magnetic and / or electrical and / or electromagnetic shield. The conductive material can be applied to form a magnetic and / or electrical and / or electromagnetic shield around one or more components with magnetic and / or electrical and / or electromagnetic noise. The conductive material can be sprayed on top of the dispensed and / or at least partially cured polymer, or can be applied to the top of the dispensed and / or at least partially cured polymer using the same / similar method as the applied polymer, i.e., by (repeatedly) dispensing, protecting and at least partially curing at least one drop of conductive material (step). The substrate can be configured to ground such shielding (i.e., conductive material coverage) of one or more components with magnetic and / or electrical and / or electromagnetic noise.

[0050] According to a second aspect, a system for at least partially encapsulating at least one component arranged on a substrate is disclosed. The system includes a nozzle configured to dispense at least one first drop of polymer by spraying on and / or around the component to obtain the dispensed polymer. The nozzle is arranged above the substrate. The system further includes a light source configured to at least partially cure the dispensed polymer. The light source is arranged above the substrate. The system further includes a protective element configured to protect the nozzle. The protective element is arranged at the nozzle.

[0051] The system may be configured to at least partially encapsulate at least one component arranged on a substrate according to the first aspect.The second aspect may generally present the same or corresponding advantages as the first aspect.

[0052] The nozzle may be connected to a first container. The first container may be a pump, such as a stroke pump or a piezoelectric pump. The first container may be the same or similar to the first container defined with respect to the first aspect. The first container may be connected to a second container. The second container may be the same or similar to the second container defined with respect to the first aspect. The nozzle may be arranged perpendicular to the surface of the substrate comprising one or more components, i.e. parallel to the normal of the surface of the substrate comprising one or more components. The nozzle may be arranged at a certain angle relative to the surface of the substrate comprising one or more components. Wherein the normal of the substrate is 90 degrees relative to the surface of the substrate comprising one or more components, the angle of the nozzle may be in the range of 30 to 150 degrees relative to the surface of the substrate comprising one or more components.

[0053] The light source can be arranged adjacent to the nozzle. The light source can be arranged closely to the nozzle. The light source can be arranged perpendicular to the surface of the substrate, i.e. parallel to the normal of the surface of the substrate including one or more components. The light source can be arranged at a certain angle relative to the surface of the substrate including one or more components. Wherein the normal of the substrate is 90 degrees to the surface of the substrate including one or more components, and the angle of the light source can be in the range of 0 to 180 degrees, preferably 30 to 150 degrees relative to the surface of the substrate including one or more components. The light source can be an immovable light source, i.e. a fixed light source, or it can be a movable light source. The light source can be an independently movable light source, or the light source can be attached to the nozzle and / or configured to move with the nozzle. The advantage of having a movable light source is that a more uniform (at least partially) curing can be provided because the angle and / or distance at which the light / rays from the light source are applied to the allocated polymer can be optimized.

[0054] The protective element may be arranged in front of the nozzle. The protective element may be arranged around the nozzle, such as partially around the nozzle. The protective element may be arranged in close proximity to the nozzle. The protective element may be arranged between the nozzle and the light source.

[0055] The system may further include a controller. The controller may be configured to move the substrate vertically. In other words, the controller may be configured to move the substrate along the normal of the surface of the substrate including the one or more components before the dispensing step, i.e. closer to the nozzle. The controller may be configured to move the substrate in a direction opposite to the normal of the surface of the substrate including the one or more components, i.e. away from the nozzle before the at least partial curing step. The controller may be configured to move the substrate horizontally. In other words, the controller may be configured to move the substrate in a direction perpendicular to the normal of the surface of the substrate including the one or more components. The controller may move the substrate in a direction perpendicular to the normal of the surface of the substrate to align another component arranged in the substrate with the nozzle before encapsulating another component arranged on the substrate.

[0056] The controller may be configured to move the nozzle vertically. In other words, the controller may be configured to move the nozzle along the normal to the surface of the substrate comprising one or more components before the dispensing step, i.e., closer to the substrate. The controller may be configured to move the nozzle in a direction opposite to the normal to the surface of the substrate comprising one or more components, i.e., away from the substrate before the step of at least partial curing. The controller may be configured to move the nozzle horizontally. In other words, the controller may be configured to move the nozzle in a direction perpendicular to the normal to the surface of the substrate comprising one or more components. The controller may be configured to move the nozzle horizontally before and after dispensing a drop of polymer. The controller may be configured to move the nozzle horizontally between dispensing a first drop and a second drop of polymer. The controller may change the angle of the nozzle relative to the surface of the substrate comprising one or more components. The angle of the light source may be changed in the range of 30 degrees to 150 degrees relative to the surface of the substrate comprising one or more components.

[0057] The controller may be configured to move the light source vertically. In other words, the controller may be configured to move the light source along the normal to the surface of the substrate comprising one or more components, i.e. closer to the substrate before the at least partial curing step. The controller may be configured to move the light source in a direction opposite to the normal to the surface of the substrate comprising one or more components, i.e. away from the substrate after the at least partial curing step. In other words, the controller may be configured to move the light source in a direction perpendicular to the normal to the surface of the substrate comprising one or more components. The controller may be configured to change the angle of the light source. The controller may change the angle of the light source relative to the surface of the substrate comprising one or more components. The angle of the light source may be changed in the range of 0 to 180 degrees relative to the surface of the substrate comprising one or more components, preferably in the range of 30 to 120 degrees.

[0058] In some embodiments, the protection element is a shutter. Thus, the shutter can protect the nozzle and polymer residues left in and / or on the nozzle from exposure to the light source in an improved manner, i.e. by means of a faster opening / closing protection mechanism and in a more efficient manner, wherein the shutter speed can be up to 1 / 1000, i.e. the shutter can be opened and closed at a rate of up to 1 / 1000.

[0059] According to a third aspect, a hearing device is disclosed. The hearing device comprises a substrate having at least one partially encapsulated component. The at least one partially encapsulated component is encapsulated according to the method of the first aspect. The third aspect may generally present the same or corresponding advantages as the first and second aspects. Furthermore, the third aspect allows providing an improved hearing device by providing an improved encapsulation of components of the hearing device that are sensitive to environmental factors (such as moisture, heat, cold, dust, sand, emitted electric fields, emitted magnetic fields, emitted electromagnetic fields, etc.) and / or providing an improved encapsulation of components of the hearing device that emit electric, magnetic or electromagnetic fields.

[0060] The present invention relates to different aspects, including methods, systems and hearing devices described above and below, as well as corresponding method steps and system parts, which each produce one or more of the benefits and advantages described in conjunction with the first-mentioned aspect, and each have one or more embodiments corresponding to the embodiments described with respect to the first-mentioned aspect and / or disclosed in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] The above and other features and advantages will become apparent to those skilled in the art by describing the following detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0062] Figure 1 A method 100 of at least partially encapsulating at least one component 2 arranged on a substrate 4 is schematically illustrated.

[0063] Figure 2 A system 300 for at least partially encapsulating at least one component 2 arranged on a substrate 4 during a dispensing step 110 is schematically shown.

[0064] Figure 3 Schematically shows a method for at least partially encapsulating a substrate 4 (such as Figure 2 A system 300 of at least one component 2 on a substrate 220 (shown).

[0065] Figure 4a An exemplary cross-sectional view of a substrate 4 comprising a plurality of components 2 is schematically shown.

[0066] Figure 4b Schematically shows that after packaging component 2, Figure 4a An exemplary cross-sectional view of a substrate 4 of a plurality of components 2 is shown.

[0067] Figure 5a An exemplary top view of a substrate 4 comprising a plurality of components 2 prior to packaging the components is schematically shown.

[0068] Figure 5b to Figure 5cSchematically shows the process of packaging a component 2 including a plurality of components 2 ( Figure 5a An exemplary top view of a substrate 4 is shown).

[0069] Figure 5d Schematically shows that after packaging component 2, multiple components 2 ( Figure 5a An exemplary top view of a substrate 4 is shown).

[0070] Figure 6 An example of a hearing device 20 is schematically shown.

[0071] Figure 7 and Figure 8 An example of a block diagram of an embodiment of a hearing device 200 is schematically shown.

[0072] Fig. 9 An example of a method of dispensing 110 , protecting 120 and at least partially curing 130 , thereby at least partially encapsulating at least one component 2 is schematically shown.

[0073] Fig.10 Another example of a method of dispensing 110 , protecting 120 and at least partially curing 130 , thereby at least partially encapsulating at least one component 2 , is schematically illustrated.

[0074] Reference numerals list

[0075] 2 Components

[0076] 4 substrate

[0077] 6. Surface of substrate

[0078] 8 Polymer

[0079] 14 Conductive materials

[0080] 16 Ground Ring or Ground Plane

[0081] 20 Hearing devices

[0082] 22 input transducers / microphones

[0083] 24 processing units

[0084] 26 output transducer / receiver

[0085] 28 Wireless Communication Unit

[0086] 30 Antenna

[0087] 200 Hearing Devices

[0088] 202 first transducer, such as a microphone

[0089] 204 processing units

[0090] 206 Acoustic Output Transducer

[0091] 208 wireless communication unit (RF)

[0092] 210 Power Management Unit

[0093] 212 Power Supply

[0094] 214 Wireless Communication Unit (MI)

[0095] 216 Magnetic Antenna

[0096] 218 Electric antenna

[0097] 100 Methods

[0098] 110 Allocation

[0099] 120 Protection

[0100] 130 Partially cured

[0101] 140 Loading

[0102] 150 Fully cured

[0103] 160 Apply

[0104] 170 Repeat

[0105] 300 Systems

[0106] 330 Light Source

[0107] 340 Nozzle

[0108] 350 Protection components

[0109] 351 Shield

[0110] 352 Shutter Plate

[0111] 360 First Container

[0112] 370 Second Container DETAILED DESCRIPTION

[0113] Various embodiments are described below with reference to the accompanying drawings. Similar reference numerals refer to similar elements throughout. Therefore, similar elements will not be described in detail for the description of each figure. It should also be noted that these figures are intended only to facilitate the description of the embodiments. They are not intended to serve as an exhaustive description of the claimed invention or as a limitation on the scope of the claimed invention. In addition, the illustrated embodiments do not need to have all the aspects or advantages shown. The aspects or advantages described in conjunction with a particular embodiment are not necessarily limited to that embodiment, and may be practiced in any other embodiment, even if not shown as such, or if not so explicitly described.

[0114] The same reference numerals are used throughout for the same or corresponding parts.

[0115] Figure 1 A method 100 for at least partially encapsulating at least one component 2 arranged on a substrate 4 is schematically shown. Figure 2 . The method 100 comprises the step of dispensing 110 at least one drop of polymer 8 by jetting on and / or around and / or under the component 2. The at least one drop of polymer 8 may be at least one first drop of polymer 8 or a second drop of polymer 8 or a third drop of polymer 8, and so on. The at least one drop of polymer 8 may be up to 10,000 drops of polymer 8. The dispensing 110 step is performed using a nozzle 340 to obtain the dispensed polymer 8. The method further comprises the step of at least partially curing 130 the dispensed polymer 8 by exposing the dispensed polymer 8 to a light source 330 to obtain a cured polymer 8. The method 100 further comprises the step of protecting 120 the nozzle 340 while at least partially curing 130 the dispensed polymer 8. The method further comprises the step of repeating 170 the steps of dispensing 110, protecting 120 and at least partially curing 130, thereby at least partially encapsulating the component 2. The method 100 may further include the steps of loading 140 the polymer 8 into the nozzle 340 for a next drop of polymer, such as at least one next drop of polymer, while at least partially curing 130 the dispensed polymer 8, and / or after dispensing a first drop of polymer 8, and / or between dispensing 110 a first drop of polymer and a next drop of polymer 8. The at least one next drop of polymer 8 may be at least a second drop of polymer 8 or a third drop of polymer 8 or a fourth drop of polymer 8, etc. Thus, the steps of repeating 170 may include the steps of dispensing 110, protecting 120, at least partially curing 130, and loading 140, thereby at least partially encapsulating the component 2.

[0116] The step of at least partially curing 130 the dispensed polymer 8 may include the step of activating / turning on and subsequently deactivating / turning off a light source 330 configured to at least partially cure 130 the dispensed polymer 8 to obtain at least partially cured polymer 8, while protecting the nozzle 340 from the light source 330 by a protective element 350.

[0117] The step of protecting 120 the nozzle 340 while at least partially curing 130 the dispensed polymer 8 may include the step of activating the protection element 350 to enter a protection state / mode / position configured to: protect 120 the nozzle 340 from the light source 330 before the light source 330 configured to at least partially cure 130 the dispensed polymer 8 to obtain the cured polymer 8 is activated / turned on. The step of protecting 120 the nozzle 340 while at least partially curing 130 the dispensed polymer 8 may further include the step of activating the protection element 350 to enter a non-protection state / mode / position after the light source 330 configured to at least partially cure 130 the dispensed polymer 8 to obtain the cured polymer 8 is deactivated / turned off, which non-protection state / mode / position does not protect 120 the nozzle 340 from the light source.

[0118] Figure 1 1 , the method 100 may further include, when at least one component is at least partially encapsulated, a step of fully curing 150 the at least partially encapsulated component 2 after repeating 170 the steps of dispensing 110, protecting 120 and at least partially curing 130. The method 100 may further include a step of applying 160 a conductive material on the at least partially encapsulated component 2 after repeating 170 the steps of dispensing 110, protecting 120 and at least partially curing 130. The step of applying 160 the conductive material on the at least partially encapsulated component 2 may include spraying the conductive material on top of the dispensed and / or at least partially cured polymer. The step of applying 160 the conductive material on the at least partially encapsulated component 2 may include (repeating the steps) dispensing, protecting and at least partially curing the at least one drop of conductive material by using the same or similar methods and / or systems as (repeating the steps) dispensing, protecting and at least partially curing the at least one drop of polymer.

[0119] By encapsulating the component 2 with the polymer 8 , solid particles (such as dirt and dust) and moisture are prevented from reaching / damaging / corroding the component 2 .

[0120] The step of applying 160 an electrically conductive material on the at least partially encapsulated component 2 may form a shield around one or more components, such as a shield preventing electrical and / or magnetic and / or electromagnetic noise from one or more components from reaching other components within the hearing device that are sensitive to such noise. Figure 1The method 100 shown may be used as described below. Figure 2 and Figure 3 The system 300 shown is implemented.

[0121] Figure 2 A system 300 for at least partially encapsulating at least one component 2 arranged on a substrate 4 is schematically shown. Figure 2 The illustrated system 300 includes a nozzle 340. The nozzle 340 is configured to dispense 110 at least one drop of polymer 8 onto and / or around the component 2 by jetting. The nozzle 340 is disposed above the substrate 4. The system 300 further includes a light source 330. The light source 330 is configured to at least partially cure 130 the dispensed polymer 8. The light source 330 is disposed above the substrate 4. The system 300 further includes a protective element 350. The protective element 350 is configured to protect 120 the nozzle 340. The protective element 350 is disposed at the nozzle 340. In the illustrated embodiment, the protective element 350 includes a shield 351 and a protective cover 352 surrounding the sides of the nozzle 340. Figure 3 Four movable shutter plates 352 are shown. The shutter plates are configured to cover openings in shield 351, wherein the openings in the shield are aligned with the tip / opening of the nozzle through which the polymer is dispensed. Shield 351 can be a UV-impermeable shield and / or shutter plates 352 can be UV-impermeable shutter plates.

[0122] Figure 2 The system 300 is schematically shown during a step of dispensing 110 at least one drop of polymer 8 by jetting onto a component 2. The step of dispensing 110 may include jetting at least one drop of UV curable polymer 8 onto and / or around the component 2. The polymer 8 may include acrylic (poly)urethane, such as Humiseal UV40 polymer. Figure 2 The protection element 350 is shown in a non-protecting state, such as open.

[0123] The system 300 may further include a first container 360. The nozzle 340 may be connected to the first container 360. The first container 360 may be a pump, such as a stroke or piezoelectric pump. The first container 360 may be a syringe. The first container 360 may be connected to a second container 370. The second container 370 may also be a pump, such as a stroke or piezoelectric pump. The second container 370 may be a cartridge. The polymer material may be loaded into the second container 370. The first container 360 may be arranged downstream of the second container 370 so that the polymer material may flow / pumped from the second container 360 into the first container 360. The nozzle 340 may be arranged downstream of the first container 360 so that the polymer material may flow / pumped from the first container 360 into the nozzle 340 for the next dispensing step

[0124] The system 300 may further include a controller. The controller may be configured to move the nozzle 340 in a direction opposite to the normal to the surface 6 of the substrate 4 including the component 2. The controller may be configured to move the nozzle 340 along Figure 2 The controller may be configured to move the nozzle 340 in the Z direction shown, i.e., closer to the substrate 4. The controller may be configured to change the angle of the nozzle 340 relative to the surface 6 of the substrate 4 including the component 2. The controller may be configured to change the angle of the nozzle 340 relative to the surface 6 of the substrate 4 including the component 2 between 30 degrees and 150 degrees. The controller may move the nozzle 340 closer to the substrate 4 and / or change the angle of the nozzle 340 before the step of dispensing 110. Alternatively, the controller may be configured to move the substrate 4 in a direction along the normal to the surface 6 of the substrate 4 including the component 2. The controller may be configured to move the substrate 4 along Figure 2 The Z direction shown moves the substrate 4, ie closer to the nozzle 340. The controller may move the substrate 4 closer to the nozzle 340 before the step of dispensing 110.

[0125] Figure 3 Schematically shows the steps during the step of at least partially curing 130 the dispensed polymer 8 Figure 2 The system 300 shown in FIG. Figure 3 The dispensed polymer 8 is shown being exposed to a light source 330. The light source 330 may be a movable or non-movable light source. Figure 3 The protective element 350 is further shown in a protective state, for example closed. The controller may be configured to move the nozzle 340 in a direction opposite to the normal to the surface 6 of the substrate 4 including the component 2. The controller may be configured to move the nozzle 340 along the direction opposite to the normal to the surface 6 of the substrate 4 including the component 2 before the step of at least partially curing 130. Figure 2 The controller may be configured to move the nozzle 340 in the Z direction shown, i.e. away from the substrate 4. Alternatively, the controller may be configured to move the substrate 4 in a direction opposite to the normal to the surface 6 of the substrate 4 comprising the component 2. The controller may be configured to move the nozzle 340 along the Z direction before the step of at least partially curing 130. Figure 2 The controller may be configured to move the substrate 4 in the Z direction shown, i.e. away from the nozzle 340. The controller may be configured to move the light source 330 in the direction along the X, Y and / or Z direction towards the dispensed material before or during the step of at least partially curing 130 the dispensed polymer 8. The controller may be configured to change the angle of the light source 330 between 0 and 180 degrees, preferably between 30 and 100 degrees, relative to the surface 6 of the substrate 4 including the component 2. The controller may be configured to change the angle of the light source 330 before or during the step of at least partially curing 130 the dispensed polymer 8.

[0126] The controller can follow Figure 2 and Figure 3The substrate 4 is moved in the X and / or Y direction as shown to align another component 2 arranged on the substrate 4 with the nozzle 340 before packaging another component 2 arranged on the substrate 4. The substrate 4 can be arranged on a conveyor belt that is moved on the conveyor belt before packaging another component 2 arranged on the substrate 4. Figure 2 and Figure 3 Before packaging another component 2 arranged on the substrate 4, the controller may Figure 2 and Figure 3 The controller can move the nozzle 340 in the X and / or Y direction as shown. Before packaging another component 2 arranged on the substrate 4, the controller can make the light source 330 move together with the nozzle 340 in the X and / or Y direction. Figure 2 and Figure 3 Movement in the X and / or Y directions as shown.

[0127] Figure 4a Schematically shows an exemplary cross-sectional view of a substrate 4 including a plurality of components 2. The substrate 4 may be any substrate such as a PCB or a PCBA. The substrate 4 may be a substrate of a hearing device 20, 200, see Figure 6 , Figure 7 and Figure 8 Component 2 may include any electronic component, any magnetic component or any electromagnetic component. Component 2 may be component 2 of a hearing device 20, 200. Component 2 may be arranged or placed on and / or attached to a surface 6 of a substrate 4. Component 2 may be different components or the same component. Electronic components may have different sizes and shapes, such as different heights, different base areas, different volumes, etc. The substrate 4 may further include a ground ring or ground plane 16.

[0128] Figure 4b Schematically shows the components 2 after encapsulation with polymer 8, including Figure 4a An exemplary cross-sectional view of a substrate 4 of a plurality of components 2 is shown. Figure 4b 8. It is shown that the component 2 is completely encapsulated by a layer of dispensed polymer 8, and the component may additionally, such as on top of the layer of dispensed and at least partially cured polymer 8, be encapsulated by a layer of conductive material 14. The conductive material 14 may be connected to a ground ring or ground plane 16. By encapsulating the component 2 with the polymer 8, the conductive material 14 is prevented from reaching / damaging / corroding the component 2. By encapsulating the component 2 with the conductive material 14, noise from the component 2 may be shielded from reaching other components within the hearing device, such as other components on the substrate 4, such as an antenna within the hearing device. Alternatively, the component 2 may be partially encapsulated.

[0129] Figure 5a to Figure 5d An example of a substrate 4 comprising a plurality of components 2 and a method of at least partially encapsulating at least one component 2 arranged on the substrate 4 is schematically shown. Figure 5a to Figure 5d , the substrate 4 is seen from above in a top view. Figure 5a Schematically shows an exemplary top view of a substrate 4 before packaging components. The substrate 4 may be a substrate of a hearing device 20, 200, see Figure 6 , Figure 7 and Figure 8 . Figure 5b to Figure 5c Schematically shows the process of packaging component 2 Figure 5a An exemplary top view of the substrate 4 is shown. Figure 5b The component 2 is shown at least partially encapsulated. Figure 5b It is further shown that the area surrounding the component 2 is at least partially encapsulated. Figure 5c Some of the components 2 are shown fully encapsulated. Figure 5d All components 2 are shown fully encapsulated.

[0130] Figure 6 An example of a hearing device 20 such as a hearing aid is schematically shown. The hearing device 20 comprises an input transducer, i.e. a microphone 22, for receiving an acoustic signal and converting it into a first electrical input signal. The first electrical input signal is provided to a processing unit 24 for processing the first electrical output signal and providing a second electrical output signal. The second electrical output signal may compensate for the hearing loss of a user of the hearing device 20. An output transducer, i.e. a receiver 26, is connected to the output of the processing unit 24 for converting the second electrical output signal into an acoustic output signal, e.g. an acoustic output signal modified to compensate for the hearing impairment of the user. The processing unit 24 may comprise elements such as an amplifier, a compressor, a noise reduction system, etc. The hearing device 20 may further comprise a wireless communication unit 28 for wireless data communication, interconnected with an antenna 30 for transmitting and receiving electromagnetic fields. The wireless communication unit 28, such as a radio or a transceiver, is connected to the processing unit 24 and the antenna 30 for communicating with an electronic device, an external device or another hearing device (such as another hearing aid located in / on / at the other ear of the user, typically in a binaural hearing system). The hearing device 20 may comprise two or more antennas.

[0131] The hearing device 20 may be a behind-the-ear hearing device and may be arranged as a behind-the-ear unit. The hearing device 20 may be an in-the-ear hearing device and may be arranged as an in-the-ear unit. Alternatively, parts of the hearing device 20 may be arranged in the behind-the-ear unit, while other parts such as the receiver 26 may be arranged in the in-the-ear unit.

[0132] Figure 7 and Figure 8 Schematically shows an example of a block diagram of an embodiment of a hearing device 200. Figure 7In the present invention, the hearing device 200 comprises a first input transducer, i.e. a microphone 202, for generating one or more first electrical input signals based on a received acoustic signal. The one or more first electrical input signals are provided to a processing unit 204 for processing one or more first electrical output signals. An output transducer, i.e. a receiver 206, is connected to the output of the processing unit 204 for converting the output, i.e. a second electrical output signal of the processing unit, into an acoustic output signal, wherein the acoustic output signal can be modified to compensate for the hearing loss of the user.

[0133] The processing unit 204 may comprise elements such as an amplifier, a compressor and / or a noise reduction system etc. The processing unit 204 may be implemented in a signal processing chip. The hearing device may further have a filter function such as a compensation filter for optimizing the acoustic output signal.

[0134] The hearing device further comprises a wireless communication unit 214 interconnected with a magnetic antenna 216, such as a magnetic induction coil. The wireless communication unit 214 and the magnetic antenna 216 may be configured for wireless data communication using the emission and reception of a magnetic field. The wireless communication unit may be implemented as a wireless communication chip, such as a magnetic induction control chip. The magnetic antenna may be configured for communication with another electronic device, in some embodiments, it is configured for communication with another hearing device, such as another hearing device located at / on / in the other ear of the user, typically in a binaural hearing device system. The magnetic antenna may be configured for wireless power transfer, such as inductive charging, i.e. receiving power from another electronic device, such as a charging device.

[0135] The hearing device may further have a wireless communication unit 208, such as a wireless communication circuit, for wireless data communication interconnected with an electrical antenna 218, such as an RF antenna for transmitting and receiving electromagnetic fields. The wireless communication unit may be implemented as a wireless communication chip. The wireless communication unit 208, including a radio or transceiver, is connected to the hearing device processing unit 204 and the electrical antenna 218 for communicating with one or more external devices, such as one or more external electronic devices, including at least one smart phone, at least one tablet computer, at least one hearing accessory device (including at least one spouse microphone, remote control, audio test device, etc.), or in some embodiments, with another hearing device, such as another hearing device located at the other ear, typically in a binaural hearing device system.

[0136] The hearing device 200 further comprises a power source 212 , such as a battery or a rechargeable battery. Furthermore, a power management unit 210 is provided for controlling the power supplied from the battery 212 to the processing unit 204 , the receiver 206 , the one or more microphones 202 , the wireless communication unit (RF) 208 and the wireless communication unit (MI) 214 .

[0137] The processing unit 204, the wireless communication unit (RF) 208, the wireless communication unit (MI) 214 and the power management unit 210 may be implemented as a signal processing chip, a wireless communication chip (RF), a wireless communication chip (MI) and a power management chip, respectively.

[0138] exist Figure 8 In, see Figure 7 The hearing devices shown correspond to hearing devices except for Figure 7 In the embodiment, only one wireless communication unit 214 is interconnected with the magnetic antenna 216, the processing unit 204 and the power management unit 210.

[0139] Fig. 9 An example of a method of dispensing 110, protecting 120 and at least partially curing 130, thereby at least partially encapsulating at least one component 2 is schematically shown. In the example shown, the step of dispensing 110 includes dispensing a drop of polymer, protecting 120 the nozzle, at least partially curing 130 the drop of polymer, and optionally loading 140 the nozzle with a next drop of polymer after dispensing the drop of polymer and before dispensing 110 the next drop of polymer. The steps can be repeated 170 until one or more components 2 are completely or at least partially encapsulated.

[0140] The protective element may be deactivated / turned off / opened shortly before the nozzle begins dispensing. The protective element may be activated / turned on / closed shortly after the nozzle completes dispensing. The light source may be turned on shortly after the protective element is activated / turned on / closed. The light source may be turned off shortly before the protective element is deactivated / turned off / opened. The nozzle may be loaded with the next drop of polymer at any time between dispensing one drop of polymer and the next drop of polymer. Alternatively, the nozzle may be loaded with the next drop of polymer while dispensing one drop of polymer.

[0141] Fig.10 Another example of a method of dispensing 110, protecting 120 and at least partially curing 130, thereby at least partially encapsulating at least one component 2 is schematically shown. In the example shown, the step of dispensing 110 includes dispensing two or more drops of polymer, optionally loading 140 the nozzle with the next drop of polymer between each drop of dispensed polymer, and after dispensing the two or more drops of polymer and optionally before dispensing 110 another two or more drops of polymer, protecting 120 the nozzle and at least partially curing 130 the dispensed drops of polymer. These steps are repeated 170 until the one or more components 2 are completely or at least partially encapsulated.

[0142] The protection element can be deactivated / turned off / opened shortly before the nozzle begins dispensing two or more drops of polymer. The protection element can be activated / turned on / closed shortly after the nozzle completes dispensing two or more drops of polymer. The light source can be turned on shortly after the protection element is activated / turned on / closed. The light source can be turned off shortly before the protection element is deactivated / turned off / opened. The nozzle can load the next drop of polymer at any time between dispensing one drop of polymer and the next drop of polymer in two or more drops of polymer, and / or between dispensing two or more drops of polymer and additional two or more drops of polymer. Alternatively, the nozzle can load the next drop of polymer while dispensing one drop of two or more drops of polymer and / or dispensing two or more drops of polymer.

[0143] Although specific features have been shown and described, it should be understood that they are not intended to limit the claimed invention, and it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the scope of the claimed invention. Accordingly, the description and drawings should be regarded as illustrative rather than restrictive. The claimed invention is intended to cover all alternatives, modifications and equivalents.

Claims

1. A method (100) of at least partially encapsulating at least one component (2) arranged on a substrate (4), the method comprising the following steps: - dispensing (110) at least one first drop of polymer (8) on and / or around the component (2) by spraying using a nozzle (340) to obtain a dispensed polymer (8), - at least partially curing (130) the dispensed polymer (8) by exposing the dispensed polymer (8) to a light source (330) to obtain a cured polymer, - protecting (120) the nozzle (340) while at least partially curing (130) the dispensed polymer (8), and - repeating (170) said steps of dispensing (110), protecting (120) and at least partially curing (130) so as to at least partially encapsulate said at least one component (2).

2. The method (100) according to claim 1, wherein the step of allocating (110) comprises: The at least one first drop of the polymer (8) is dispensed (110) on and / or around at least one side of the component (2).

3. The method (100) according to claim 1 or 2, wherein the step of allocating (110) comprises: The at least one first drop of UV curable polymer (8) is sprayed onto and / or around the component (2).

4. The method (100) according to claim 3, wherein the step of at least partially curing (130) comprises at least partially curing (130) the dispensed polymer (8) by exposing the dispensed polymer (8) to a UV light source (330) to obtain a cured polymer (8).

5. The method (100) of claim 4, wherein the step of at least partially curing (130) comprises: The dispensed polymer is exposed to the UV light source (330) until a surface of the dispensed polymer (8) becomes at least partially cured.

6. The method (100) according to any one of the preceding claims, wherein the step of allocating (110) comprises: The at least one first drop of the polymer (8) is ejected at a first frequency in the range of 1 Hz to 1000 Hz.

7. The method (100) according to any one of the preceding claims, wherein the step of protecting (120) comprises: The nozzle (340) is protected (120) from light by means of a protective element (350) while at least partially curing (130) the dispensed polymer (8).

8. The method (100) according to any one of the preceding claims, further comprising: - while at least partially curing (130) the dispensed polymer (8) and / or after dispensing at least a first drop of polymer (8), loading (140) the polymer (8) into the nozzle (340) for at least a second drop of the polymer.

9. The method (100) according to any one of the preceding claims, further comprising: - When said at least one component is at least partially encapsulated, after said step of repeating (170) said steps of dispensing (110), at least partially curing (130) and protecting (120), completely curing (150) said at least partially encapsulated component (2).

10. The method (100) according to any one of the preceding claims, further comprising: - After said step of repeating (170) said steps of dispensing (110), at least partially curing (130) and protecting (120), applying (160) an electrically conductive material (14) on said at least partially encapsulated component (2) in order to form a magnetic and / or electric and / or electromagnetic shielding.

11. A system (300) for at least partially encapsulating at least one component (2) arranged on a substrate (4), the system (300) comprising: a nozzle (340) configured to dispense (110) at least one first drop of polymer (8) by jetting onto and / or around the component (2) to obtain a dispensed polymer (8), the nozzle (340) being arranged above the substrate (4), and a light source (330) configured to at least partially cure (130) the dispensed polymer (8), the light source (330) being arranged above the substrate (4), and A protection element (350) configured to protect (140) the nozzle (340), the protection element (350) being arranged at the nozzle (340).

12. The system (300) of claim 11, wherein the protection element (350) is a shutter.

13. A hearing device comprising a substrate having at least one partially encapsulated component, wherein the at least one partially encapsulated component is encapsulated according to the method of any one of claims 1 to 10.

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