An automatic deburring device

Abstract

The present invention discloses an automatic deburring device in the technical field of deburring, including a forming mold. A plurality of forming cavities are provided inside the forming mold, and a packaging groove is provided on the surface of the forming mold. A plurality of pouring ports are provided on the inner wall surface of the packaging groove; during the injection molding of the semiconductor in the present invention, when the first cutting knife moves into the pouring port, the burrs formed outside the pouring port can be removed, avoiding burrs at the position of the pouring port after the semiconductor is formed. During the process of taking out the semiconductor, the burrs will rub against the forming cavity, which will affect the accuracy of the forming cavity during a long-term production process. And the second cutting knife is used to move into the cutting groove to cut off the residual colloid in the packaging groove, avoiding that the colloid remaining in the packaging groove cannot be removed in time after solidification, which will block the movement of the packaging strip during the subsequent installation of the packaging strip, and will rub against the packaging strip and the packaging groove, affecting the fit between the packaging strip and the packaging groove and reducing the service life.

Description

Technical Field

[0001] The present invention relates to the technical field of deburring, and in particular to an automatic deburring device. Background Art

[0002] With the rapid development of semiconductor packaging technology, higher requirements are put forward for packaging production efficiency and equipment utilization rate. The MGP mold packaging injection mold is a device used in most of the packaging and testing industries and is an indispensable part in the back-end process of semiconductor packaging. However, due to the frequent use of the mold, the mold cavity operates at a high load for a long time, resulting in relatively fast wear and short life of the cavity, so it needs to be replaced frequently, which increases the use cost, affects the production efficiency, and the quality cannot be well controlled. Therefore, improving the production efficiency of equipment and saving costs are the goals pursued by each enterprise. Therefore, researching and developing an optimized gate burr device can better improve the production efficiency and at the same time reduce the equipment use cost, which has become an urgent need for all semiconductor manufacturing enterprises.

[0003] In the prior art, during the injection molding of semiconductors, it is necessary to inject molten liquid into the molding cavity in the mold, and then it is necessary to use a cavity strip to encapsulate the cavity. After the product in the mold solidifies and forms, there will be excess burrs at the position of the product cavity opening. During the long-term injection molding production process, the burrs will cause wear of the cavity strip, thus affecting the accuracy of producing semiconductors after using the cavity strip to encapsulate the mold, increasing the use cost and scrap rate. Summary of the Invention

[0004] The purpose of the present invention is to provide an automatic deburring device to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: An automatic deburring device includes a molding mold. A plurality of molding cavities are opened inside the molding mold. A packaging groove is opened on the surface of the molding mold. A plurality of pouring ports are opened on the inner wall surface of the packaging groove. The pouring ports are communicated with the molding cavities. A packaging strip is arranged in the packaging groove. A first cutting mechanism is arranged on the surface of the packaging strip. The first cutting mechanism is used to cut the burrs formed inside the plurality of pouring ports. A second cutting mechanism is arranged on the surface of the packaging strip. The second cutting mechanism is used to cut the burrs remaining inside the packaging groove. A discharging mechanism is arranged in the packaging groove. The discharging mechanism is used to remove and discharge the debris cleaned inside the packaging groove after the production is completed. A positioning mechanism is arranged on the surface of the discharging mechanism. The positioning mechanism is used to position the packaging strip when the packaging strip moves into the packaging groove. A plurality of limiting mechanisms are arranged on the surface of the molding mold. The limiting mechanisms are used to limit the packaging strip after the packaging strip moves into the packaging groove.

[0006] As a further solution of the present invention, the first cutting mechanism includes a plurality of first cutters, and the plurality of first cutters are fixedly connected to the surface of the packaging strip on one side close to the pouring port.

[0007] As a further solution of the present invention, the second cutting mechanism includes a second cutter, which is fixedly connected to the surface of the packaging strip on one side close to the pouring gate. The second cutter is located in the middle of multiple first cutters, and a cutting groove is opened at the bottom of the inner wall of the packaging groove.

[0008] As a further solution of the present invention, the discharge mechanism includes two discharge ports, which are opened on the front and rear inner wall surfaces of the groove. The discharge ports pass through the forming mold, and a sealing groove is opened at the bottom of the inner wall of the groove. A sealing plate is elastically and slidably connected in the sealing groove.

[0009] As a further solution of the present invention, the positioning mechanism includes two triangular positioning blocks, which are respectively fixedly connected to the side surfaces of the two sealing plates close to each other. Positioning grooves are provided on the two end surfaces of the packaging strip, and the inner side of the positioning groove is a slope.

[0010] As a further solution of the present invention, the limiting mechanism includes a rotating shaft, which is rotatably connected to the surface of the forming mold, and a fan-shaped limiting plate is fixedly connected to the surface of the rotating shaft. The bottom of the limiting plate is an inclined surface, and the surface of the limiting plate is fixedly connected to a toggle rod.

[0011] The top end of the lifting pin is connected with the support of the lifting pin of the lifting pin, and the bottom end of the lifting pin is connected with the support of the lifting pin of the lifting pin.

[0012] As a further solution of the present invention, the bottoms of the plurality of the clamping blocks are conical, and the upper inner walls of the plurality of the clamping slots are inclined surfaces.

[0013] As a further solution of the present invention, a pressure strip is fixedly connected to the surface of the sealing plate, and the pressure strip is located below the second cutter. A clearance groove is provided at the bottom of the inner wall of the cutting groove corresponding to the position of the pressure strip.

[0014] As a further solution of the present invention, a blocking rod is fixedly connected to the surface of the packaging strip, and the blocking rod is used to block the limiting plate.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the process of injection molding of semiconductors, the present invention uses the first cutter to move into the pouring gate to remove the burrs formed on the outside of the pouring gate, thereby avoiding burrs at the pouring gate position after the semiconductor is molded. The burrs will rub the molding cavity during the process of removing the semiconductor, which will affect the accuracy of the molding cavity during a long production process. The second cutter is used to move into the cutting groove to remove the colloid remaining in the packaging groove, thereby avoiding the colloid remaining in the packaging groove from being unable to be removed in time after solidification, which will block the movement of the packaging strip during the subsequent installation, and will rub the packaging strip and the packaging groove, affecting the cooperation between the packaging strip and the packaging groove, and reducing the service life.

[0017] After the packaging strip is taken out, the guide plate is extended again, the rotating ring will first be disengaged from the clamping block and then return to its original position under the action of the torsion spring, and the packaging strip can be lifted cyclically during the working process, thereby improving production efficiency.

[0018] 3. In the process of injection molding semiconductors of the present invention, when the rotating ring moves toward the clamping block, the taper at the end of the clamping block and the inclined surfaces on both sides of the inner wall of the clamping groove can ensure that the clamping block moves into the clamping groove, ensuring the driving effect of the clamping block on the rotating ring, so that the extrusion block can lift the packaging strip, making it easier to remove the packaging strip. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 for Figure 1Schematic diagram of the structure at A in the middle;

[0021] Figure 3 It is a schematic diagram of the overall structure of the present invention after being cut apart;

[0022] Figure 4 Schematic diagram of the structure of the forming mold in the present invention;

[0023] Figure 5 Schematic diagram of the structure of the packaging strip in the present invention;

[0024] Figure 6 for Figure 5 Schematic diagram of the structure at B in the middle;

[0025] Figure 7 It is a structural schematic diagram of the forming die of the present invention after being cut from the cutting position;

[0026] Figure 8 for Figure 7 Schematic diagram of the structure at C in the middle;

[0027] Figure 9 This is a structural diagram of the positional relationship between the limiting plate and the packaging slot in the present invention;

[0028] Figure 10 for Figure 9 Schematic diagram of the structure at D in the middle;

[0029] Figure 11 This is a structural diagram of the connection relationship between the groove, the first chute and the second chute in the present invention;

[0030] Figure 12 for Figure 11 Schematic diagram of the structure at E in the middle;

[0031] Figure 13 It is a schematic diagram of the exploded structure of the rotating ring and the rotating shaft in the present invention.

[0032] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0033] Molding mold 1, molding cavity 2, packaging groove 3, pouring gate 4, packaging strip 5, first cutter 6, second cutter 7, cutting groove 8, discharge port 9, sealing groove 10, sealing plate 11, positioning block 12, positioning groove 13, rotating shaft 14, limiting plate 15, toggle lever 16, groove 17, clamping block 18, rotating ring 19, torsion spring 20, clamping groove 21, extrusion block 22, extrusion groove 23, lifting rod 24, first slide groove 25, second slide groove 26, guide plate 27, guide groove 28, pressure strip 29, give way groove 30, blocking rod 31. DETAILED DESCRIPTION

[0034] See also Figures 1 - 13The present invention provides a technical solution: an automatic deburring device, comprising a forming mold 1, wherein the forming mold 1 is provided with a plurality of forming cavities 2, a packaging groove 3 is provided on the surface of the forming mold 1, a plurality of pouring gates 4 are provided on the inner wall surface of the packaging groove 3, the pouring gate 4 is communicated with the forming cavity 2, a packaging strip 5 is provided in the packaging groove 3, a first cutting mechanism is provided on the surface of the packaging strip 5, the first cutting mechanism is used to cut off the burrs formed on the inner sides of the plurality of pouring gates 4, a second cutting mechanism is provided on the surface of the packaging strip 5, the second cutting mechanism is used to cut off the burrs remaining in the packaging groove 3, a discharge mechanism is provided in the packaging groove 3, the discharge mechanism is used to remove and discharge the debris cleaned in the packaging groove 3 after production is completed, a positioning mechanism is provided on the surface of the discharge mechanism, the positioning mechanism is used to position the packaging strip 5 when it moves into the packaging groove 3, a plurality of limiting mechanisms are provided on the surface of the forming mold 1, the limiting mechanism is used to limit the packaging strip 5 after it moves into the packaging groove 3;

[0035] The first cutting mechanism includes a plurality of first cutters 6, and the plurality of first cutters 6 are fixedly connected to the surface of the packaging strip 5 on one side close to the pouring port 4;

[0036] The second cutting mechanism includes a second cutter 7, which is fixedly connected to the surface of the packaging strip 5 on one side close to the pouring port 4. The second cutter 7 is located in the middle of the plurality of first cutters 6. A cutting groove 8 is provided at the bottom of the inner wall of the packaging groove 3.

[0037] The discharge mechanism includes two discharge ports 9, which are provided on the front and rear inner wall surfaces of the groove 8. The discharge ports 9 penetrate the forming mold 1. A sealing groove 10 is provided at the bottom of the inner wall of the groove 8. A sealing plate 11 is elastically and slidably connected to the sealing groove 10.

[0038] The positioning mechanism includes two triangular positioning blocks 12, which are fixedly connected to the surfaces of the two sealing plates 11 on the sides close to each other. Positioning grooves 13 are provided on both ends of the packaging strip 5, and the inner side of the positioning grooves 13 is an inclined surface.

[0039] The limiting mechanism includes a rotating shaft 14, which is rotatably connected to the surface of the forming mold 1. A fan-shaped limiting plate 15 is fixedly connected to the surface of the rotating shaft 14. The bottom of the limiting plate 15 is an inclined surface, and a toggle rod 16 is fixedly connected to the surface of the limiting plate 15.

[0040] After the molding is completed, the mold 5 will be put into the mold 2, and the mold 5 will be put into the mold 2. After the molding is completed, the mold 5 will be put into the mold 2. After the molding is completed, the mold 5 will be put into the mold 2. After the molding is completed, the mold 5 will be put into the mold 2. After the molding is completed, the mold 5 will be put into the mold 2. After the molding is completed, the mold 5 will be put into the mold 2. After the molding is completed, the mold 5 will be put into the mold 2. After the molding is completed, the mold 5 will be put into the mold 2. The sealing strip 5 is then moved to the side of the molding die 1 and the sealing strip 5 is moved to the side of the molding die 1. The sealing strip 5 is then moved to the side of the molding die 1 and the sealing strip 5 is moved to the side of the molding die 1. The sealing strip 5 is then moved to the side of the molding die 1 and the sealing strip 5 is moved to the side of the molding die 1. The sealing strip 5 is then moved to the side of the molding die 1 and the sealing strip 5 is moved to the side of the molding die 1. Then, the burrs and debris removed from the packaging groove 3 are cleaned into the cutting groove 8, and then the sealing plate 11 is pulled upward to expose the discharge port 9. The burrs and debris in the cutting groove 8 can then be cleaned out of the cutting groove 8 through the discharge port 9. The discharge port 9 is located on the side of the cutting groove 8, and can remove the burrs and debris in the packaging groove 3 and the cutting groove 8. The debris at the corners can also be cleaned and moved to the discharge port 9 position without any residue, thereby ensuring the subsequent use of the packaging strip 5, reducing the friction on the packaging strip 5, and improving the accuracy of the packaging strip 5.

[0041] During the injection molding production of semiconductors, after the encapsulation strip 5 moves into the encapsulation groove 3, it is not easy to take out. As a further solution of the present invention, a groove 17 is provided on the inner wall surface of the encapsulation groove 3 corresponding to the position of the rotating shaft 14. The rotating shaft 14 penetrates through the molding die 1 and extends into the groove 17. A plurality of equally-angled arranged clamping blocks 18 are fixedly connected to the surface of the rotating shaft 14. A rotating ring 19 is provided on the surface of the rotating shaft 14. The rotating ring 19 is located in the groove 17 and below the clamping blocks 18. A torsion spring 20 is connected between the inner surface of the rotating ring 19 and the bottom of the inner wall of the groove 17. A plurality of clamping grooves 21 are provided on the inner surface of the rotating ring 19. A fan-shaped extrusion block 22 is fixedly connected to the surface of the rotating ring 19. An extrusion groove 23 is provided on the side surface of the encapsulation strip 5. The upper end of the extrusion groove 23 is an inclined surface. A lifting rod 24 is slidably connected to the surface of the rotating ring 19. A first sliding groove 25 is provided on the inner wall surface of the groove 17. The lifting rod 24 slides in the first sliding groove 25. A second sliding groove 26 is provided on the inner wall surface of the first sliding groove 25. The second sliding groove 26 communicates with the encapsulation groove 3. A guiding plate 27 is elastically slidably connected in the second sliding groove 26. The side of the guiding plate 27 close to the encapsulation strip 5 is an inclined surface. A guiding groove 28 is provided on the surface of the guiding plate 27. The lifting rod 24 slides in the guiding groove 28;

[0042] During the injection molding production of semiconductors, when the encapsulation strip 5 is moved into the encapsulation groove 3, the encapsulation strip 5 will squeeze the guiding plate 27. The guiding plate 27 will move into the second sliding groove 26. The lifting rod 24 will move upward under the action of the guiding groove 28. The lifting rod 24 will drive the rotating ring 19 to move upward together. Then when the limiting block completely squeezes the encapsulation strip 5 down, the clamping block 18 will move into the clamping groove 21. Subsequently, when the encapsulation strip 5 needs to be taken out, the rotating shaft 14 will drive the rotating ring 19 and the extrusion block 22 to rotate through the clamping block 18. The extrusion block 22 will move into the extrusion groove 23. Subsequently, the extrusion block 22 will lift the encapsulation strip 5 upward by acting on the inclined surface on the upper side of the extrusion groove 23, so that the encapsulation strip 5 can be removed from the encapsulation groove 3, improving the taking-out efficiency and not damaging the encapsulation strip 5, ensuring the use of the encapsulation strip 5. Subsequently, after the encapsulation strip is taken out, the guiding plate 27 extends out again. The rotating ring 19 will first disengage from the clamping block 18 and then return to its original position under the action of the torsion spring 20, and can lift the encapsulation strip cyclically during the working process, improving the production efficiency.

[0043] During the injection molding production of semiconductors, when the clamping block 18 is docked with the clamping groove 21, it cannot be accurately docked. As a further solution of the present invention, the bottoms of the plurality of clamping blocks 18 are conical, and the upper inner walls of the plurality of clamping grooves 21 are inclined surfaces;

[0044] During the injection molding production of semiconductors, when the rotating ring 19 moves towards the clamping block 18, the taper at the end of the clamping block 18 and the inclined surfaces on both sides of the inner wall of the clamping groove 21 can ensure that the clamping block 18 moves into the clamping groove 21, ensuring the driving effect of the clamping block 18 on the rotating ring 19, so that the extrusion block 22 can lift the encapsulation strip 5, facilitating the removal of the encapsulation strip 5.

[0045] During the injection molding production of semiconductors, after the sealing plate 11 has been used for a long time, a gap will be generated between the bottom of the sealing plate 11 and the bottom of the cutting groove 8. As a further solution of the present invention, a pressure strip 29 is fixedly connected to the surface of the sealing plate 11. The pressure strip 29 is located below the second cutting knife 7, and a relief groove 30 is provided at the bottom of the inner wall of the cutting groove 8 corresponding to the position of the pressure strip 29;

[0046] During the injection molding production of semiconductors, after the encapsulation strip 5 moves to the encapsulation groove 3, both ends of the encapsulation strip 5 will be in contact with the sealing plate 11, and the bottom of the second cutting knife 7 will press the pressure strip 29 into the relief groove 30, preventing the sealing plate 11 from moving during use and ensuring the sealing of the discharge port 9 by the sealing plate 11.

[0047] During the injection molding production of semiconductors, there is no limit to the rotation angle of the limiting plate 15 when it rotates the rotating rod. When the limiting plate 15 rotates to limit the encapsulation strip 5, accurate limiting cannot be achieved. As a further solution of the present invention, a blocking rod 31 is fixedly connected to the surface of the encapsulation strip 5, and the blocking rod 31 is used to block the limiting plate 15;

[0048] During the injection molding production of semiconductors, when the limiting plate 15 rotates towards the side close to the encapsulation strip 5, the end of the limiting plate 15 will be blocked by the blocking rod 31, enabling the part of the limiting plate 15 above the surface of the encapsulation strip 5 to be the same, ensuring the same extrusion effect on the encapsulation strip 5 when the limiting plate 15 rotates.

Claims

1. An automatic deburring device, comprising a forming die (1), characterized in that: The molding die (1) has a plurality of molding cavities (2) formed therein, a packaging groove (3) formed on the surface of the molding die (1), a plurality of pouring ports (4) formed on the inner wall surface of the packaging groove (3), the pouring ports (4) being in communication with the molding cavities (2), a packaging strip (5) being provided in the packaging groove (3), a first cutting mechanism being provided on the surface of the packaging strip (5), the first cutting mechanism being used to cut off burrs formed on the inner sides of the plurality of pouring ports (4), a second cutting mechanism being provided on the surface of the packaging strip (5), the second cutting mechanism being used to cut off burrs formed on the inner sides of the plurality of pouring ports (4), The burrs remaining inside the packaging groove (3) are removed. The packaging groove (3) is provided with a discharge mechanism, and the discharge mechanism is used to remove and discharge the debris cleaned inside the packaging groove (3) after the production is completed. The surface of the discharge mechanism is provided with a positioning mechanism, and the positioning mechanism is used to position the packaging strip (5) when the packaging strip (5) moves into the packaging groove (3). The surface of the molding die (1) is provided with a plurality of limiting mechanisms, and the limiting mechanisms are used to limit the packaging strip (5) after the packaging strip (5) moves into the packaging groove (3); The limiting mechanism comprises a rotating shaft (14), the rotating shaft (14) being rotatably connected to the surface of the forming mold (1), a sector-shaped limiting plate (15) being fixedly connected to the surface of the rotating shaft (14), the bottom of the limiting plate (15) being an inclined surface, and a toggle rod (16) being fixedly connected to the surface of the limiting plate (15); The inner wall surface of the packaging groove (3) is provided with a groove (17) corresponding to the position of the rotating shaft (14), the rotating shaft (14) penetrates the forming mold (1) and extends into the groove (17), the surface of the rotating shaft (14) is fixedly connected with a plurality of clamping blocks (18) arranged at equal angles, the surface of the rotating shaft (14) is provided with a rotating ring (19), the rotating ring (19) is located in the groove (17), the rotating ring (19) is located below the clamping block (18), the rotating ring (19) and the bottom of the inner wall of the groove (17) are connected with a torsion spring (20), the inner side surface of the rotating ring (19) is provided with a plurality of clamping grooves (21), the surface of the rotating ring (19) is fixedly connected with a fan-shaped extrusion block (22), the sealing An extrusion groove (23) is provided on the side of the packaging strip (5), and the upper end of the extrusion groove (23) is an inclined surface. The surface of the rotating ring (19) is slidably connected to a lifting rod (24). A first sliding groove (25) is provided on the inner wall surface of the groove (17). The lifting rod (24) slides in the first sliding groove (25). A second sliding groove (26) is provided on the inner wall surface of the first sliding groove (25). The second sliding groove (26) is connected to the packaging slot (3). A guide plate (27) is elastically slidably connected in the second sliding groove (26). The side of the guide plate (27) close to the packaging strip (5) is an inclined surface. A guide groove (28) is provided on the surface of the guide plate (27). The lifting rod (24) slides in the guide groove (28). During the process of injection molding of semiconductors, when the packaging strip (5) is moved into the packaging groove (3), the packaging strip (5) will squeeze the guide plate (27), and the guide plate (27) will move into the second slide groove (26). The lifting rod (24) will move upward under the action of the guide groove (28), and the lifting rod (24) will drive the rotating ring (19) to move upward together. Then, when the limiting plate (15) completely squeezes the packaging strip (5), the clamping block (18) will move into the clamping groove (21). Then, when the packaging strip (5) needs to be taken out, the rotating shaft (14) will drive the rotating ring (19) and the extrusion block (22) to rotate through the clamping block (18), and the extrusion block (22) will move into the extrusion groove (23). Then, the extrusion block (22) will lift the packaging strip (5) upward by acting on the inclined surface on the upper side of the extrusion groove (23).

2. The automatic deburring device according to claim 1, characterized in that: The first cutting mechanism comprises a plurality of first cutters (6), and the plurality of first cutters (6) are all fixedly connected to the surface of one side of the packaging strip (5) close to the pouring port (4).

3. The automatic deburring device according to claim 2, wherein: The second cutting mechanism comprises a second cutter (7), the second cutter (7) being fixedly connected to a surface of the packaging strip (5) on one side close to the pouring port (4), the second cutter (7) being located in the middle of the plurality of first cutters (6), and a cutting groove (8) being provided at the bottom of the inner wall of the packaging groove (3).

4. The automatic deburring device according to claim 3, wherein: The discharge mechanism comprises two discharge ports (9), the two discharge ports (9) being provided on the front and rear inner wall surfaces of the cut groove (8), the discharge ports (9) penetrating the forming die (1), a sealing groove (10) being provided at the bottom of the inner wall of the cut groove (8), and a sealing plate (11) being elastically slidably connected in the sealing groove (10).

5. An automatic deburring device according to claim 4, wherein: The positioning mechanism comprises two triangular positioning blocks (12), the two positioning blocks (12) being fixedly connected to the surfaces of the two sealing plates (11) close to each other, and positioning grooves (13) are provided on both end surfaces of the packaging strip (5), and the inner side of the positioning groove (13) is an inclined surface.

6. An automatic deburring device according to claim 1, characterized in that: The bottoms of the plurality of clamping blocks (18) are conical, and the upper inner walls of the plurality of clamping slots (21) are inclined surfaces.

7. An automatic deburring device according to claim 4, characterized in that: A pressure strip (29) is fixedly connected to the surface of the sealing plate (11), and the pressure strip (29) is located below the second cutter (7). A clearance groove (30) is provided at the bottom of the inner wall of the cutting groove (8) corresponding to the position of the pressure strip (29).

8. An automatic deburring device according to claim 1, characterized in that: A blocking rod (31) is fixedly connected to the surface of the packaging strip (5), and the blocking rod (31) is used to block the limiting plate (15).

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