Plating barrel structure of rotary centrifugal electroplating machine for electronic products
By designing multiple water permeability mechanisms and anode titanium baskets in the rotary centrifugal electroplating machine of electronic products, the problems of electroplating uniformity and quality of products with small volume are solved, and the uniformity of high water permeability and rotary centrifugal electroplating are achieved. High efficiency.
Patent Information
- Application Number
- CN202411217620.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-01-03
AI Technical Summary
The prior art is difficult to ensure the uniformity of plating and plating quality of electronic products such as chips during the electroplating process, especially because the water permeability of the electroplating barrel and the conductive system setting affect the electroplating efficiency and effect.
A drum plating structure of an electronic product rotary centrifugal electroplating machine is designed, and the upper cover and the lower cover are tightened by corrosion-resistant screws. Multiple water permeability mechanisms and anode titanium basket are set up, combining titanium rings and copper alloys or aluminum alloy materials. , high water permeability and uniform electroplating are achieved through water permeable mesh and pressurized mesh plates, and rotational centrifugal force and current conduction are used to ensure the uniformity of the plating layer.
It realizes the uniformity and high efficiency of the electroplating parts of electronic products, improves the plating quality, ensures the consistent electroplating effect at different locations, and is suitable for products of different specifications.
Smart Images
Figure CN119243303A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of electroplating, in particular to a plating barrel structure of a rotary centrifugal electroplating machine for electronic products. Background Art
[0002] At present, some electronic products including chips, which are small in size, can generally be electroplated by centrifugal electroplating. The current centrifugal electroplating process generally adds plating solution into a rotatable plating tank, places a plating barrel in the plating tank, and puts the chip waiting to be electroplated into the plating barrel for electroplating. The plating solution enters the plating barrel. The water permeability of the plating barrel will affect the electroplating efficiency, and the setting of the conductive system will also affect the electroplating effect.
[0003] The patent with the authorization announcement number CN 216998631 U discloses an electroplating device capable of improving the uniformity of copper plating on PCB boards, including an electroplating barrel and an improvement mechanism, wherein titanium basket rods are symmetrically arranged inside the electroplating barrel, and a PCB board body is arranged between the two titanium basket rods, and the improvement mechanism includes two upper anode baffles, which are symmetrically fixedly connected to the inner cavity of the electroplating barrel, and lower anode baffles are arranged below the two upper anode baffles, and the two lower anode baffles are fixedly connected to the inner cavity of the electroplating barrel. The invention utilizes the arrangement of the upper anode baffle and the lower anode baffle to block the migration of some copper ions to the plated metal during the electrolysis process, thereby reducing the thickness of the metal deposited on the surface of the plated metal. The difference between the two ends and the inner layer of the plate is reduced, the uniformity of copper plating is improved, and the working quality of PCB electroplating is improved. However, the uniformity of electroplating for small electronic products such as chips is not good, and the electroplating quality is not easy to guarantee. Summary of the invention
[0004] In view of the deficiencies in the prior art, the present invention provides a plating barrel structure of a rotary centrifugal electroplating machine for electronic products. The plating barrel structure can ensure uniform electroplating of electronic product electroplated parts, high electroplating efficiency and good electroplating quality.
[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a plating barrel structure of a rotary centrifugal electroplating machine for electronic products, comprising an upper cover and a lower cover, the upper cover and the lower cover are fastened together by corrosion-resistant screws, an upper cover water-permeable plate is arranged on the upper cover, a water-permeable ring body is arranged in the central axial direction of the lower cover, a first water-permeable hole is arranged on the wall of the water-permeable ring body, a first water-permeable hole is arranged at the first water-permeable hole, a first water-permeable net is arranged at the first water-permeable hole, a lower cover water-permeable plate is arranged at the bottom of the lower cover, a second water-permeable hole and a second water-permeable net covering the second water-permeable hole are arranged on the lower cover water-permeable plate, a third water-permeable net is arranged on the inner side of the upper cover water-permeable plate, the third water-permeable net covers the entire inner space of the upper cover, the middle part of the lower cover is recessed inward to form a recessed part, a rotating shaft and an anode titanium basket are arranged in the recessed part, and the anode titanium basket is connected to the anode current.
[0006] Preferably, a gear plate is provided at the bottom of the lower cover portion, and the gear plate is coaxial with the lower cover portion and the rotating shaft.
[0007] Preferably, a circle of titanium ring is provided on the lower cover portion, the bottom of the titanium ring is inlaid with copper alloy or aluminum alloy material, the impedance of the copper alloy or aluminum alloy material is lower than the impedance of the titanium ring, and the titanium ring is connected to the cathode current.
[0008] Preferably, a cathode connector is provided on the upper cover portion, and the cathode current reaches the titanium ring through the cathode connector, and the titanium ring is electrically connected to the anode titanium basket circuit.
[0009] Preferably, the titanium ring is coaxial with the anode titanium basket.
[0010] Preferably, a water-permeable ring pressing net block for pressing the first water-permeable net onto the water-permeable ring body is provided on the water-permeable ring body.
[0011] Preferably, an upper cover mesh pressing plate for pressing the third water-permeable mesh onto the upper cover water-permeable plate is provided on the upper cover water-permeable plate.
[0012] Preferably, a lower cover mesh pressing plate for pressing the second water permeable mesh onto the lower cover water permeable plate is provided on the lower cover water permeable plate.
[0013] The plating barrel structure of the electronic product rotary centrifugal electroplating machine provided by the present invention has the following beneficial effects: the plating barrel structure has good water permeability, can make the electronic product electroplating parts electroplated uniformly, with high electroplating efficiency and good electroplating quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a structural schematic diagram of the plating barrel structure of the rotary centrifugal electroplating machine for electronic products of the present invention;
[0015] Figure 2 It is a perspective structural schematic diagram of the plating barrel structure of the rotary centrifugal electroplating machine for electronic products of the present invention;
[0016] Figure 3 It is a perspective structural schematic diagram of the plating barrel structure of the rotary centrifugal electroplating machine for electronic products in an embodiment of the present invention;
[0017] Figure 4 The plating barrel structure of the rotary centrifugal electroplating machine for electronic products of the present invention includes a schematic structural diagram of an upper cover portion;
[0018] Figure 5 The plating barrel structure of the rotary centrifugal electroplating machine for electronic products of the present invention includes a schematic structural diagram of a lower cover portion;
[0019] Figure 6 It is a structural schematic diagram of a titanium ring in a plating barrel structure of a rotary centrifugal electroplating machine for electronic products of the present invention. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0021] See also Figure 1 and Figure 6 The present invention provides a technical solution: a plating barrel structure of a rotary centrifugal electroplating machine for electronic products, comprising an upper cover 1 and a lower cover 2, wherein the upper cover 1 and the lower cover 2 are fastened together by corrosion-resistant screws, an upper cover water-permeable plate 4 is provided on the upper cover 2, a water-permeable through hole 3 is provided on the upper cover water-permeable plate 4, a water-permeable ring body 5 is provided in the central axial direction of the lower cover 2, a first water-permeable hole 6 is provided on the wall of the water-permeable ring body 5, and a first water-permeable net 7 is provided at the first water-permeable hole 6, The bottom of the lower cover 2 is provided with a lower cover water-permeable plate 8, on which a second water-permeable hole 9 and a second water-permeable net 10 covering the second water-permeable hole 9 are provided, and a third water-permeable net 11 is provided inside the upper cover water-permeable plate 4, and the third water-permeable net 11 covers the entire inner space of the upper cover 1, and the middle of the lower cover 2 is recessed inward to form a recessed portion 12, and a rotating shaft 14 and an anode titanium basket 15 are provided in the recessed portion 12, and the anode titanium basket 15 is connected to the anode current. An electroplating space is formed between the upper cover water-permeable plate 4, the lower cover water-permeable plate 8 and the water-permeable ring body 5, and the electroplating solution in the electroplating liquid tank enters the electroplating space through the water-permeable through hole 3, the first water-permeable hole 6, and the second water-permeable hole 9.
[0022] Preferably, a gear plate 16 is provided at the bottom of the lower cover 2, and the gear plate 16 is coaxial with the lower cover 2 and the rotating shaft 14. The motor in the electroplating equipment drives the rotating shaft 14 and the gear plate 16 to rotate, thereby driving the plating barrel structure to rotate.
[0023] Preferably, a circle of titanium rings 17 is provided on the lower cover portion 2, and a conductive column 13 is provided on the titanium ring 17. The bottom of the titanium ring 17 is inlaid with a copper alloy or aluminum alloy material 18. The impedance of the copper alloy or aluminum alloy material 18 is lower than the impedance of the titanium ring 17. Part of the current can be introduced into the inlaid copper alloy or aluminum alloy material 18 to eliminate the tip discharge generated by the product during electroplating and sticking to the inner wall of the titanium ring, thereby ensuring uniform electroplating of the product. The titanium ring 17 is connected to the cathode current.
[0024] Preferably, a cathode connector 19 is provided on the upper cover 2 , and the cathode current reaches the titanium ring 17 via the cathode connector 19 and the conductive column 13 , and the titanium ring 17 is electrically connected to the anode titanium basket 15 .
[0025] Preferably, the titanium ring 17 is coaxial with the anode titanium basket 15. In this way, the distance from each point on the titanium ring 17 to the center of the anode titanium basket 15 is equal, so that the movement efficiency of the electroplating ions is high and the movement time is close, so that the electroplating effects of electronic products at different positions in the same time period are basically the same, and the electroplating of electronic products at different positions in the plating barrel is uniform and of consistent quality.
[0026] Preferably, the permeable ring body 5 is provided with a permeable ring pressing mesh block 20 for pressing the first permeable mesh 7 onto the permeable ring body 5. By removing the permeable ring pressing mesh block 20, the first permeable mesh 7 of different specifications can be replaced to adapt to the electroplating of products of different specifications and sizes.
[0027] Preferably, the upper cover water-permeable plate 4 is provided with an upper cover mesh pressing plate 21 for pressing the third water-permeable mesh 11 onto the upper cover water-permeable plate 4. By removing the upper cover mesh pressing plate 21, the third water-permeable mesh 11 of different specifications can be replaced to adapt to the electroplating of products of different specifications and sizes.
[0028] Preferably, the lower cover water-permeable plate 8 is provided with a lower cover mesh pressing plate 22 for pressing the second water-permeable mesh 10 onto the lower cover water-permeable plate 8. By removing the lower cover mesh pressing plate 22, second water-permeable meshes 10 of different specifications can be replaced to adapt to the electroplating of products of different specifications and sizes, thereby expanding the product application range of the plating barrel structure.
[0029] When the plating barrel structure of the electronic product rotary centrifugal electroplating machine of the present invention is working, firstly, the heating device is turned on to heat the electroplating liquid in the electroplating liquid tank, and the electroplating liquid is heated to the temperature required for electroplating. The upper cover 1 and the lower cover 2 are placed in the electroplating liquid, the titanium ring 17 and the anode titanium basket 15 are energized, and then the electronic product to be electroplated, such as a chip, is placed in the electroplating space of the upper cover 1 and the lower cover 2, and the motor in the electroplating equipment is started to drive the rotating shaft 14 and the plating barrel structure to rotate and generate centrifugal force, and the electroplating ions in the electroplating liquid are electroplated on the electronic product, and the electronic product, such as the chip, is electroplated in the electroplating space under the action of the rotating centrifugal force. The first permeable net 7, the second permeable net 10 and the third permeable net 11 surround the electroplating space, so that the electroplated electronic product, such as the chip, will not leak out through the permeable holes.
[0030] The plating barrel structure of the electronic product rotary centrifugal electroplating machine of the present invention is provided with multiple water-permeable mechanisms, the plating liquid in the plating liquid tank enters the electroplating space through the multiple water-permeable holes, the plating liquid inside and outside the plating barrel is exchanged, the plating barrel has a large hollow area, high water permeability, and high electroplating efficiency.
[0031] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A plating barrel structure of a rotary centrifugal electroplating machine for electronic products, comprising an upper cover and a lower cover, wherein the upper cover and the lower cover are fastened together by corrosion-resistant screws, characterized in that: The upper cover portion is provided with an upper cover water-permeable plate, a water-permeable ring body is provided in the central axial direction of the lower cover portion, a first water-permeable hole is provided on the wall of the water-permeable ring body, a first water-permeable hole is provided at the first water-permeable hole, a first water-permeable net is provided at the bottom of the lower cover portion, a lower cover water-permeable plate is provided at the bottom of the lower cover portion, a second water-permeable hole and a second water-permeable net covering the second water-permeable hole are provided on the lower cover water-permeable plate, a third water-permeable net is provided on the inner side of the upper cover water-permeable plate, the third water-permeable net covers the entire inner space of the upper cover portion, the middle part of the lower cover portion is recessed inwardly to form a recessed portion, a rotating shaft and an anode titanium basket are provided in the recessed portion, and the anode titanium basket is connected to the anode current.
2. The plating barrel structure of the rotary centrifugal electroplating machine for electronic products according to claim 1, characterized in that: A gear plate is arranged at the bottom of the lower cover portion, and the gear plate is coaxial with the lower cover portion and the rotating shaft.
3. The plating barrel structure of the rotary centrifugal electroplating machine for electronic products according to claim 2, characterized in that: A circle of titanium ring is arranged on the lower cover, and the bottom of the titanium ring is inlaid with copper alloy or aluminum alloy material. The impedance of the copper alloy or aluminum alloy material is lower than the impedance of the titanium ring. The titanium ring is connected to the cathode current.
4. The plating barrel structure of the rotary centrifugal electroplating machine for electronic products according to claim 3, characterized in that: The upper cover is provided with a cathode connector, and the cathode current reaches the titanium ring through the cathode connector, and the titanium ring is connected to the anode titanium basket circuit.
5. The plating barrel structure of the rotary centrifugal electroplating machine for electronic products according to claim 1, characterized in that: The titanium ring is coaxial with the anode titanium basket.
6. The plating barrel structure of the rotary centrifugal electroplating machine for electronic products according to claim 5, characterized in that: The water-permeable ring body is provided with a water-permeable ring pressing net block for pressing the first water-permeable net onto the water-permeable ring body.
7. The plating barrel structure of the rotary centrifugal electroplating machine for electronic products according to claim 1, characterized in that: The upper cover water-permeable plate is provided with an upper cover mesh pressing plate for pressing the third water-permeable mesh onto the upper cover water-permeable plate.
8. The plating barrel structure of the rotary centrifugal electroplating machine for electronic products according to claim 1, characterized in that: The lower cover water-permeable plate is provided with a lower cover mesh pressing plate for pressing the second water-permeable mesh onto the lower cover water-permeable plate.