Packaging substrate testing device and testing method

Abstract

The embodiment of the invention provides a packaging substrate testing device and a testing method, which are used for detecting the reliability between a packaging substrate and a printed board, and the packaging substrate testing device comprises a fixed part, a fixed sealing part and a measuring assembly. The fixing piece comprises a bearing table and a clamping piece, the bearing table is used for bearing the printed board, and the clamping piece is installed on the bearing table to clamp the printed board; the solid sealing piece has a liquid form and a solid form; the measuring assembly comprises a connecting piece and a measuring piece, the measuring piece is connected with one end of the connecting piece, and the other end of the connecting piece is arranged on the packaging substrate; and the liquid-state fixing and sealing piece is poured on the other end of the connecting piece and the packaging substrate and can be solidified into a solid state so as to fixedly connect the connecting piece and the packaging substrate. According to the packaging substrate testing device provided by the embodiment of the invention, the welding interface of the packaging substrate and the printed board can be prevented from being damaged, the separation force value can be conveniently measured, and the welding reliability of the packaging substrate and the printed board can be conveniently judged.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor device testing, and in particular to a packaging substrate testing device and a testing method. Background Art

[0002] With the development of semiconductor technology, the size of circuits is getting smaller and smaller, which enables semiconductors to develop towards miniaturization and precision. In the packaging of semiconductor devices, the packaging substrate is an important component. The packaging substrate is generally used to package electronic components, provide support and protection for electronic components, and provide electrical connections and mechanical support for electronic components. According to the material used to make the packaging substrate, the packaging substrate can be divided into ceramic substrates, plastic substrates, metal substrates, and metal composite substrates. Different types of packaging substrates are suitable for different application scenarios. For example, ceramic substrates have excellent thermal conductivity, electrical insulation and mechanical strength, and are suitable for high-power and high-frequency application scenarios; plastic substrates have low cost and light weight, and are used in low-cost and large-scale production application scenarios; metal substrates have good thermal conductivity and mechanical strength, and are suitable for application scenarios that require good heat dissipation; metal composite substrates combine the advantages of metal and ceramic substrates, and are suitable for application scenarios that require high thermal conductivity and electrical insulation.

[0003] After encapsulating electronic components on the package substrate, it is usually electrically connected to the printed circuit board through solder ball welding, or after welding with solder, it is electrically connected through wire bonding. The welding reliability of the package substrate and the printed circuit board determines the service life of the subsequent package substrate and the entire module of the printed circuit board. Therefore, it is very important to test the welding reliability of the package substrate and the printed circuit board. The welding reliability of the package substrate and the printed circuit board is determined by the separation force value and the welding interface condition.

[0004] In the related art, the packaging substrate and the printed circuit board are pried apart by prying from the bottom of the packaging substrate. However, this easily damages the welding interface between the packaging substrate and the printed circuit board, making it difficult to observe and analyze the welding interface, and it is also difficult to determine the separation force value between the packaging substrate and the printed circuit board, and further difficult to judge the welding reliability between the packaging substrate and the printed circuit board. Summary of the invention

[0005] Based on this, the embodiments of the present application provide a packaging substrate testing device and a testing method that improve the integrity of the welding interface during separation and facilitate the determination of the separation force value.

[0006] A first aspect of an embodiment of the present application provides a packaging substrate testing device for detecting the reliability between a packaging substrate and a printed circuit board, the packaging substrate testing device comprising:

[0007] A fixing member, comprising a bearing platform and a clamping member, wherein the bearing platform is used to bear the printed board, the clamping member is mounted on the bearing platform, and the clamping member is arranged on two opposite sides of the bearing platform to clamp the printed board;

[0008] The sealing member has a liquid form and a solid form;

[0009] A measuring component, comprising a connecting member and a measuring member, wherein one end of the measuring member is fixed, the other end of the measuring member is connected to one end of the connecting member, the other end of the connecting member is arranged on the packaging substrate, and the measuring member is used to provide a tensile force and measure a tensile force value;

[0010] The sealing member in liquid form is cast on the other end of the connecting member and the packaging substrate, and the sealing member in liquid form can be solidified into the solid form to fixedly connect the connecting member and the packaging substrate.

[0011] In some embodiments, the sealing component is made of epoxy resin and a curing agent, the epoxy resin has a liquid form and a solid form, the liquid form of the epoxy resin is poured on the packaging substrate and the connector, and the curing agent can cure the liquid form of the epoxy resin to form a solid form of the epoxy resin.

[0012] In some embodiments, the ratio of the epoxy resin to the curing agent is between 5:1 and 2:1.

[0013] In some embodiments, the packaging substrate measuring device also includes a mold, the mold includes a shell, the shell is arranged to form a cylindrical structure with openings at both ends, and the opening at one end is arranged to face the packaging substrate, so that the shell and the surface of the packaging substrate are arranged to form a accommodating space, and the accommodating space accommodates the fixed sealing part and at least part of the connecting part.

[0014] In some embodiments, the connecting member includes a nut and a screw, the nut is sleeved on one end of the screw, the nut and one end of the screw are arranged in the accommodating space, the sealing member covers the nut, and the screw protrudes from the sealing member.

[0015] The packaging substrate testing device provided in the embodiment of the present application fixes the printed circuit board through the carrier and the clamping member, and then casts the sealing member on the packaging substrate, which is beneficial to increase the contact area with the packaging substrate, so that the force transmitted by the sealing member to the packaging substrate is more uniform, thereby reducing the probability of damage to the packaging substrate during the separation process from the printed circuit board, and avoiding damage to the welding interface between the packaging substrate and the printed circuit board. In addition, it is convenient to connect the connecting member to the packaging substrate, thereby facilitating the measurement member to apply tension and measure the separation force value.

[0016] A second aspect of an embodiment of the present application provides a packaging substrate testing method, which is applied to any of the packaging substrate testing devices described above, and the packaging substrate testing method includes:

[0017] S10: placing the printed board with the package substrate on the carrier, so that the package substrate is located on the side of the printed board away from the carrier, and using the clamping member to clamp and fix the printed board on opposite sides of the carrier;

[0018] S20: placing the other end of the connector on the packaging substrate, pouring the liquid-shaped solid sealing member on the other end of the connector and the packaging substrate, and then solidifying the liquid-shaped solid sealing member into a solid state;

[0019] S30: Start the measuring device to apply tension to the connector, separate the package substrate and the printed circuit board, use the measuring device to measure and record the tension value during the separation process, observe the welding interface on the package substrate and the printed circuit board after separation, and obtain the welding reliability of the package substrate and the printed circuit board based on the tension value and the welding interface.

[0020] In some embodiments, the step S20 includes a step S21, and the step S21 specifically includes: the sealing member is made of epoxy resin and a curing agent, and the epoxy resin has a liquid state and a solid state;

[0021] The epoxy resin in liquid form and the curing agent are mixed and then poured onto the other end of the connector and the packaging substrate. The curing agent cures the epoxy resin in liquid form into a solid form.

[0022] In some embodiments, the step S21 further includes a step S22, and the step S22 specifically includes: heating after the liquid epoxy resin and the curing agent are poured on the connector and the packaging substrate.

[0023] In some embodiments, the step S20 further includes a step S23, wherein the step S23 specifically includes: the package substrate testing device includes a mold, the mold includes a shell, the shell is surrounded to form a cylindrical structure with two ends opened, the opening at one end of the cylindrical structure is arranged toward the package substrate, and the shell and the surface of the package substrate are surrounded to form a receiving space;

[0024] After the other end of the connecting member is arranged in the accommodation space, a liquid sealing member is poured into the accommodation space, and then the sealing member is solidified into a solid state.

[0025] In some embodiments, the step S23 further includes a step S24, and the step S24 specifically includes: the connecting member includes a nut and a screw, and the nut is sleeved on one end of the screw;

[0026] The nut and one end of the screw are arranged in the accommodation space, and the sealing member in liquid form is poured into the accommodation space so that the height of the sealing member along the thickness direction of the carrier platform is higher than the nut and lower than the other end of the screw.

[0027] The packaging substrate testing method provided in the embodiment of the present application can make the force exerted on the packaging substrate during separation more uniform, thereby effectively avoiding damage to the welding interface between the packaging substrate and the printed circuit board during separation, so as to facilitate observation of the welding interface and thus judge the welding reliability between the packaging substrate and the printed circuit board; and can also measure the separation force value between the packaging substrate and the printed circuit board, so as to further facilitate judging the welding reliability between the packaging substrate and the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of a packaging substrate testing device in the first embodiment of the present application.

[0029] Figure 2 This is a schematic diagram of a packaging substrate testing device in the second embodiment of the present application.

[0030] Figure 3 Schematic diagram of a packaging substrate testing method in one embodiment of the present application.

[0031] Description of Reference Numerals

[0032] 10. Printed circuit board; 20. Package substrate; 30. Fixing part; 31. Carrying platform; 31a. Threaded hole; 33. Clamping part; 331. Screw; 333. Clamping plate; 333a. Long round hole; 50. Sealing part; 70. Measuring component; 71. Connecting part; 711. Nut; 713. Screw; 73. Measuring part; 90. Mold; 91. Shell; 91a. Accommodating space. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0034] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0035] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0037] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0039] Packaging is an essential process after the production of electronic components (such as integrated circuit chips, etc.) is completed. By packaging the electronic components in the packaging substrate to form an overall structure, the packaging substrate can provide support, protection, heat dissipation and other functions for the electronic components, and the electronic components can be electrically connected to the external circuit through the packaging substrate. After the packaging substrate is packaged with the electronic components, it is usually electrically connected to the printed circuit board so that the electronic components can be electrically connected to the external circuit. The packaging substrate is generally electrically connected to the printed circuit board through solder ball welding, or the packaging substrate and the printed circuit board are welded by solder and then electrically connected by wire bonding. It can be understood that the welding reliability of the packaging substrate and the printed circuit board determines the service life of the subsequent packaging substrate and the entire module of the printed circuit board. Therefore, it is very important to test the welding reliability of the packaging substrate and the printed circuit board, and the welding reliability of the packaging substrate and the printed circuit board is determined by the separation force value and the welding interface condition.

[0040] In the related art, the edge where the package substrate and the printed circuit board are connected is pried up to separate the package substrate and the printed circuit board, so that the welding interface between the package substrate and the printed circuit board can be observed and analyzed to understand the welding reliability between the package substrate and the printed circuit board. However, in the process of prying up the package substrate, since the force on the package substrate and the printed circuit board is uneven and the force area is small, it is easy to damage the package substrate itself and the welding interface between the package substrate and the printed circuit board, and it is difficult to understand the welding reliability of the test package substrate and the printed circuit board; and it is also difficult to determine the separation force value of the package substrate and the printed circuit board by prying. The separation force value of the package substrate and the printed circuit board refers to the minimum force value required to separate the two.

[0041] Based on the above technical problems, an embodiment of the present application provides a packaging substrate testing device for a packaging substrate 20 that can improve the integrity of the welding interface during separation and facilitate determination of the separation force value.

[0042] See also Figure 1Specifically, a package substrate 20 is welded and connected to the printed circuit board 10, and the package substrate testing device includes a fixing member 30, a measuring assembly 70 and a sealing member 50. The fixing member 30 is used to carry and fix the printed circuit board 10, and the measuring assembly 70 is arranged on the package substrate 20, so that the sealing member 50 can be cast on the package substrate 20 and the measuring assembly 70, thereby fixing the package substrate 20 and the measuring assembly 70; the measuring assembly 70 can generate a tensile force and apply a tensile force to the package substrate 20 through the sealing member 50, so as to separate the package substrate 20 from the printed circuit board 10, and can also measure the tensile force value during separation. The sealing member 50 is cast on the package substrate 20, so that the contact area between the sealing member 50 and the package substrate 20 is large, so that the force transmitted by the sealing member 50 to the package substrate 20 is more uniform, so as to reduce the probability of damage to the package substrate 20 during the separation from the printed circuit board 10, and effectively avoid the damage to the welding interface between the package substrate 20 and the printed circuit board 10. It can be understood that, during the separation process of the package substrate 20 and the printed board 10 , the fixing member 30 itself remains fixed so that the printed board 10 can be fixed.

[0043] Please continue to see Figure 1 Furthermore, the fixing member 30 includes a carrier platform 31 and a clamping member 33, and the clamping member 33 is installed on the carrier platform 31. The carrier platform 31 is used to carry the printed board 10 with the package substrate 20, and the clamping members 33 are arranged on opposite sides of the carrier platform 31, so as to clamp the printed board 10 from opposite sides of the printed board 10, so that during the separation process of the printed board 10 and the package substrate 20, the force of the clamping members 33 on the printed board 10 is more balanced, so as to reduce the possibility of the printed board 10 being broken or damaged during the separation process, and make the separation process more stable.

[0044] See also Figure 1 and Figure 2Specifically, threaded holes 31a are respectively provided on opposite sides of the carrier 31, and the clamping member 33 includes a screw 331 and a clamping plate 333. The screw 331 includes a screw head and a screw body. An oblong hole 333a is provided on the clamping plate 333. The screw body passes through the oblong hole 333a and is threadedly engaged with the threaded hole 31a, so that the screw head clamps the clamping plate 333. The oblong hole 333a is provided so that the clamping plate 333 can move relative to the carrier 31 along the direction in which the threaded holes 31a are arranged relative to each other, so that the distance between the two clamping plates 333 along the direction in which the threaded holes 31a are arranged relative to each other can be adjusted, thereby being able to adapt to printed circuit boards 10 of different sizes. The screw body passes through the hole on the clamping plate 333 and penetrates into the threaded hole 31a, and is threadedly engaged with the threaded hole 31a. The clamping plate 333 is provided between the screw head 331 and the carrier 31 along the thickness direction of the carrier 31, and is clamped by the screw head. Loosen the screw 331 so that the clamping plate 333 can be lifted, place the printed board 10 between the carrier 31 and the clamping plate 333, and tighten the screw 331 so that the clamping plate 333 clamps the printed board 10, thereby fixing the printed board 10. The cooperation between the screw 331 and the threaded hole 31a facilitates the disassembly and installation of the printed board 10, which is conducive to improving the efficiency of testing using the packaging substrate testing device.

[0045] The measuring assembly 70 includes a measuring member 73 and a connecting member 71, one end of the measuring member 73 is fixed, and the other end is connected to one end of the connecting member 71, and the other end of the connecting member 71 is arranged on the package substrate 20. The measuring member 73 is fixed so as to provide a tensile force to pull the connecting member 71 and thus separate the package substrate 20 from the printed circuit board 10, and the measuring member 73 can measure the tensile force provided by itself to obtain the separation force value when separating the package substrate 20 from the printed circuit board 10. The specific form of the measuring member 73 is not limited, for example, the measuring member 73 can be a tensile testing machine, which can provide tensile force and measure the tensile force during the test process through a force sensor to obtain the separation force value.

[0046] The sealing member 50 has a liquid form and a solid form. The other end of the connecting member 71 is disposed on the packaging substrate 20. The sealing member 50 in a liquid form is poured on the other end of the connecting member 71 and the packaging substrate 20 to be bonded to the connecting member 71 and the packaging substrate 20 respectively. The sealing member 50 in a liquid form is solidified into a solid form to fixedly connect the packaging substrate 20 and the printed board 10, so that the tensile force generated by the measuring member 73 can be transmitted to the sealing member 50 through the connecting member 71, and then transmitted to the packaging substrate 20 through the sealing member 50, so that the tensile force can act on the packaging substrate 20 to separate the packaging substrate 20 from the printed board 10. It can be understood that the connection strength of the fixed connection achieved by the sealing member 50 is greater than the connection strength of the connection between the packaging substrate 20 and the printed board 10, so that the packaging substrate 20 and the printed board 10 can be separated.

[0047] In some specific embodiments of the present application, the sealing member 50 is made of epoxy resin and curing agent. The epoxy resin is in liquid form and solid form. The liquid epoxy resin is poured on the packaging substrate 20 and the connector 71. The curing agent is mixed with the epoxy resin to cure the epoxy resin into a solid form and then fix the packaging substrate 20 and the connector 71. Epoxy resin refers to a general term for a class of polymers containing two or more epoxy groups in the molecule. The epoxy group is chemically active. The curing agent reacts with the epoxy group to make the liquid epoxy resin cure and cross-link to generate a network structure and then cure to a solid epoxy resin, thereby achieving. Epoxy resin has good bonding properties to a variety of materials such as aluminum, iron, copper, glass, wood, phenolic plastics, etc., so it is conducive to adapting to packaging substrates 20 and connectors 71 made of different materials to improve the applicability of packaging substrate testing devices. Specifically, the epoxy resin is an acrylic modified epoxy resin, which has better adhesion, thereby improving the connection strength between the connector 71 and the package substrate 20, and reducing the probability of the connector 71 and the package substrate 20 being separated after the epoxy resin is cured. In addition, the acrylic modified epoxy resin also has the advantages of good heat resistance and high chemical stability, which is conducive to improving the applicability of the acrylic modified epoxy resin.

[0048] In some specific embodiments, the ratio of epoxy resin to curing agent is between 5:1 and 2:1. Within this ratio range, the higher the ratio of curing agent, the faster the epoxy resin cures. Therefore, it is convenient to adjust the ratio of epoxy resin to curing agent according to the specific situation during use to adjust the curing time. It should be noted that the ratio of epoxy resin to curing agent can be 5:1 or 2:1.

[0049] Specifically, the specific type of curing agent is not limited. The curing agent can be a reactive curing agent, such as polyamine, polycarboxylic acid, polythiol and polyphenol, etc. Such curing agents usually contain active hydrogen (active hydrogen refers to hydrogen atoms with high reactivity, and active hydrogen easily reacts chemically with other atoms or molecules), and the active hydrogen reacts with the epoxy groups in the epoxy resin molecules to cure the epoxy resin; the curing agent can also be a catalytic curing agent, such as tertiary amine, imidazole, boron trifluoride complex, etc. Such curing agents usually contain cations or anions, and the cations or anions open the epoxy groups for addition polymerization, thereby curing the epoxy resin. It is understandable that when different curing agents are used, the curing time of the epoxy resin is different.

[0050] In other embodiments, the seal 50 is made of self-curing epoxy resin, which can cross-link and cure under certain conditions without the need for a curing agent, thereby avoiding the pollution of the environment and the harm to the health of personnel caused by the curing agent, and also reducing the number of processes and facilitating use.

[0051] See also Figure 1 and Figure 2 In some embodiments, the package substrate testing device further includes a mold 90, and the mold 90 includes a shell 91. The shell 91 is disposed on the package substrate 20. The shell 91 is surrounded to form a cylindrical structure with two ends opened, and the opening at one end is disposed toward the package substrate 20, so that the shell 91 and the surface of the package substrate 20 are surrounded to form a receiving space 91a, and the receiving space 91a receives at least part of the sealing member 50 and the connecting member 71. The connecting member 71 is disposed in the receiving space 91a, and the sealing member 50 in liquid form is poured into the receiving space 91a. Since the sealing member 50 in liquid form has fluidity, the sealing member 50 in liquid form can flow in the receiving space 91a to uniformly fill the receiving space 91a, thereby making the sealing member 50 and the package substrate 20 uniformly contact each other, which is conducive to making the tensile force applied to the sealing member 50 by the connecting member 71 be uniformly dispersed and applied to the package substrate 20 by the sealing member 50, thereby reducing the probability of damage to the package substrate 20 during the separation process of the package substrate 20 and the printed circuit board 10.

[0052] In some specific embodiments of the present application, the opening toward the packaging substrate 20 formed by the shell 91 is suitable for the shape and size of the surface of the packaging substrate 20, so that the contact area between the sealing component 50 and the packaging substrate 20 is larger, thereby making the pulling force of the sealing component 50 on the packaging substrate 20 more uniform, which is beneficial to reducing the probability of breakage or damage of the packaging substrate 20 during the separation process from the printed circuit board 10.

[0053] See also Figure 1 and Figure 2 Further, the connecting member 71 includes a nut 711 and a screw 713. The nut 711 is sleeved on one end of the screw 713. The nut 711 and one end of the screw 713 are arranged in the accommodation space 91a. The sealing member 50 covers the nut 711, and the screw 713 protrudes from the sealing member 50. The sealing member 50 is cast in the accommodation space 91a and solidified into a solid form. The other end of the screw 713 protrudes from the sealing member 50 to facilitate connection with the measuring member 73. The sealing member 50 is not bonded to the screw 713. After the sealing member 50 is solidified into a solid form, the screw 713 can be screwed out of the nut 711 and taken out of the sealing member 50. Before the packaging substrate 20 and the printed circuit board 10 are separated, the screw 713 is connected with the nut 711 in a cooperative manner. During separation, the screw 713 is connected to the measuring member 73, and the measuring member 73 generates a pulling force, which is then transmitted to the nut 711. Since the nut 711 is bonded to the sealing member 50 and covered by the sealing member 50, the nut 711 transmits the pulling force to the sealing member 50, thereby applying a pulling force to the packaging substrate 20. After separation is completed, the screw 713 can be removed from the nut 711 to facilitate observation of the packaging substrate 20.

[0054] Specifically, the sealing component 50 covers the nut 711, and along the thickness direction of the supporting platform 31, the thickness of the sealing component 50 is 10 mm-20 mm thicker than the nut 711, so that the sealing component 50 has high strength and can withstand greater force along the thickness direction of the supporting platform 31, which is beneficial to reduce the probability of disconnection between the nut 711 and the sealing component 50 during separation.

[0055] In some embodiments, the measuring member 73 includes a measuring body and a clamping jaw, the clamping jaw is mounted on the measuring body, the clamping jaw is detachably connected to the connecting member 71, and the measuring body is used to provide and measure the tension. The clamping jaw can adjust itself according to different types and sizes of connecting members 71 to abut against the connecting member 71 and then clamp the connecting member 71. The provision of the clamping jaw is conducive to improving the applicability of the measuring member 73.

[0056] The present application also provides a packaging substrate testing method. Figure 3 The packaging substrate testing device in the above embodiment is configured to perform the packaging substrate testing method:

[0057] S10: placing the printed circuit board 10 with the package substrate 20 on the carrier 31 , so that the package substrate 20 is located on the side of the printed circuit board 10 away from the carrier 31 , and using the clamping members 33 to clamp and fix the printed circuit board 10 on opposite sides of the carrier 31 .

[0058] S20: The other end of the connector 71 is disposed on the packaging substrate 20, and the liquid sealing member 50 is poured on the other end of the connector 71 and the packaging substrate 20, and then the liquid sealing member 50 is cured into a solid state.

[0059] S30: Start the measuring component 73 to apply tension to the connecting component 71, pull and separate the packaging substrate 20 and the printed circuit board 10, use the measuring component 73 to measure and record the tension value during the separation process, observe the welding interface on the packaging substrate 20 and the printed circuit board 10 after separation, and obtain the welding reliability of the packaging substrate 20 and the printed circuit board 10 based on the tension value and the welding interface.

[0060] In the above-mentioned packaging substrate testing method, the packaging substrate 20 is welded to the surface of one side of the printed circuit board 10. Therefore, when the printed circuit board 10 is placed on the carrier 31, the packaging substrate 20 and the carrier 31 are respectively located on both sides of the printed circuit board 10 perpendicular to the thickness direction of the carrier 31, so as to avoid the carrier 31 blocking the connection between the packaging substrate 20 and other components, and facilitate the separation of the packaging substrate 20 and the printed circuit board 10. The other end of the connector 71 is set on the packaging substrate 20. It can be understood that the connector 71 can contact the surface of the packaging substrate 20, and can also be set above the packaging substrate 20. It only needs to meet the requirement that when the liquid-shaped solid seal 50 is cast on the connector 71 and the packaging substrate 20 and solidified, an integrated structure can be formed. The liquid-shaped solid seal 50 reacts with the surface of the packaging substrate 20 and the connector 71 to achieve bonding, and after solidification, the packaging substrate 20 and the connector 71 are connected as a whole. The fixed connection between the connector 71 and the package substrate 20 is achieved by the sealing member 50, which is conducive to facilitating the connection between the connector 71 and the package substrate 20, avoiding damage to the package substrate 20 when connecting the package substrate 20 and the connector 71, and affecting the reliability test. After the sealing member 50 is solidified, the measuring member 73 is started, and the measuring member 73 applies a pulling force to the connector 71, and the connector 71 transmits the pulling force to the package substrate 20 through the sealing member 50, thereby separating the package substrate 20 from the printed circuit board 10. It can be understood that in the process of the measuring member 73 generating a pulling force to separate the package substrate 20 from the printed circuit board 10, the support platform 31 is fixed. The sealing member 50 can disperse the pulling force of the connector 71, so that the pulling force applied by the connector 71 is more uniform when it is transmitted to the package substrate 20, so as to avoid the concentrated pulling force causing damage to the package substrate 20 and affecting the reliability test results. When separating the package substrate 20 and the printed circuit board 10, the pulling force value during the separation process is recorded to determine the separation force value, and the welding interfaces of the package substrate 20 and the printed circuit board 10 are observed after separation. The welding reliability of the package substrate 20 and the printed circuit board 10 is judged according to the separation force value and the welding interface.

[0061] It is understandable that the specific evaluation criteria for evaluating the welding reliability through separation force value and welding interface are different according to different types of package substrates 20 and printed boards 10. For example, observe whether there are voids at the welding interface between the package substrate 20 and the printed board 10. Voids refer to the part of the solder joint that lacks solder filling. Voids will cause the mechanical strength of the solder joint to decrease, resulting in a decrease in welding reliability. They will also affect the conductive properties of the solder joint and the heat dissipation between the package substrate 20 and the printed board 10, thereby affecting the service life of the printed board 10 and the package substrate 20. For another example, observe the welding interface between the package substrate 20 and the printed board 10 to judge the welding wettability. Wetting wettability refers to the ability of solder to spread on the package substrate 20 and the printed board 10, that is, the bonding ability between the solder and the package substrate 20 and the printed board 10. Low welding wettability will lead to low solder joint strength, thereby reducing welding reliability. Low welding wettability will also increase the possibility of defects such as voids, further reducing the quality of the solder joint, thereby reducing the welding reliability of the package substrate 20 and the printed board 10.

[0062] In some specific embodiments of the present application, in order to fix the printed circuit board 10, step 10 specifically includes step S11:

[0063] S11: The clamping member 33 includes a screw 331 and a clamping plate 333; after placing the printed board 10 with the package substrate 20 on the carrier 31, and making the package substrate 20 located on the side of the printed board 10 away from the carrier 31, loosen the screw 331, lift the clamping plate 333, and then place the printed board 10 between the two threaded holes 31a of the carrier 31, adjust the position of the clamping plate 333 along the relative arrangement direction of the threaded holes 31a, so that the printed board 10 is placed between the clamping plate 333 and the carrier 31 along the thickness direction of the carrier 31, and tighten the screw 331 to clamp and fix the printed board 10. By adjusting the clamping plate 333 to fix the printed board 10, it can adapt to printed boards 10 of different types or sizes, and improve the applicability of the package substrate testing method.

[0064] In some specific embodiments, in order to achieve solidification of the sealing member 50 and fixed connection between the packaging substrate 20 and the connecting member 71 , step S20 specifically includes step S21 .

[0065] S21: The sealing member 50 is made of epoxy resin and curing agent; the epoxy resin in liquid form and the curing agent are mixed and poured onto the other end of the connector 71 and the package substrate 20, and the curing agent cures the epoxy resin in liquid form into a solid form and bonds with the package substrate 20 and the connector 71 respectively, thereby fixing the two. It should be noted that step S21 is a sub-step of step S20.

[0066] Furthermore, in order to speed up the curing, step S21 specifically also includes step S22.

[0067] S22: After the liquid epoxy resin and curing agent are poured on the connector 71 and the package substrate 20, heating is performed. Heating can increase the curing speed, thereby improving the efficiency of executing the package substrate testing method. It should be noted that step S22 is a sub-step of step S21.

[0068] In some embodiments, in order to prevent the sealing member 50 from being cast on the printed circuit board 10, step S20 further includes step S23. Step S23 is a sub-step of step S20.

[0069] S23: The package substrate testing device includes a mold 90; after the other end of the connector 71 is disposed on the package substrate 20, the mold 90 is disposed on the package substrate 20 and is surrounded by the package substrate 20 to form a receiving space 91a. The other end of the connector 71 is disposed in the receiving space 91a, and a liquid-shaped solid seal 50 is poured into the receiving space 91a, and then the liquid-shaped solid seal 50 is solidified into a solid form. The mold 90 can limit the flow of the liquid-shaped solid seal 50, thereby preventing the solid seal 50 from being poured on the printed circuit board 10, thereby affecting the separation of the printed circuit board 10 and the package substrate 20.

[0070] Furthermore, in order to improve the convenience in executing the packaging substrate testing method, step S23 also includes step S24, and step S24 is a sub-step of step S23.

[0071] S24: The connecting member 71 includes a nut 711 and a screw rod 713; the mold 90 is disposed on the packaging substrate 20 and is surrounded by the packaging substrate 20 to form a receiving space 91a, so that the nut 711 and the screw rod 713 cooperate, and the nut 711 and at least part of the screw rod 713 are placed in the receiving space 91a, and a liquid-shaped sealing member 50 is poured into the receiving space 91a, and then the liquid-shaped sealing member 50 is solidified into a solid form.

[0072] It should be noted that step S23 and step S21 are parallel sub-steps of step S20, and the two steps can be executed independently.

[0073] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0074] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A packaging substrate testing device, used to detect the reliability between the packaging substrate and the printed circuit board, characterized in that: The packaging substrate testing device comprises: A fixing member, comprising a bearing platform and a clamping member, wherein the bearing platform is used to bear the printed board, the clamping member is mounted on the bearing platform, and the clamping member is arranged on two opposite sides of the bearing platform to clamp the printed board; The sealing member has a liquid form and a solid form; A measuring component, comprising a connecting member and a measuring member, wherein one end of the measuring member is fixed, the other end of the measuring member is connected to one end of the connecting member, the other end of the connecting member is arranged on the packaging substrate, and the measuring member is used to provide a tensile force and measure a tensile force value; The sealing member in liquid form is cast on the other end of the connecting member and the packaging substrate, and the sealing member in liquid form can be solidified into the solid form to fixedly connect the connecting member and the packaging substrate.

2. The packaging substrate testing device according to claim 1, characterized in that: The sealing component is made of epoxy resin and curing agent. The epoxy resin has a liquid form and a solid form. The liquid epoxy resin is poured on the packaging substrate and the connector. The curing agent can cure the liquid epoxy resin to form a solid epoxy resin.

3. The packaging substrate testing device according to claim 2, characterized in that: The ratio of the epoxy resin to the curing agent is between 5:1 and 2:

1.

4. The packaging substrate testing device according to claim 1, characterized in that: The packaging substrate measuring device also includes a mold, which includes a shell. The shell is arranged to form a cylindrical structure with openings at both ends, and the opening at one end is arranged to face the packaging substrate, so that the shell and the surface of the packaging substrate are arranged to form a accommodating space, and the accommodating space accommodates the fixed sealing part and at least part of the connecting part.

5. The packaging substrate testing device according to claim 4, characterized in that: The connecting member includes a nut and a screw rod, the nut is sleeved on one end of the screw rod, the nut and one end of the screw rod are arranged in the accommodating space, the sealing member covers the nut, and the screw rod protrudes from the sealing member.

6. A packaging substrate testing method, applied to the packaging substrate testing device according to any one of claims 1 to 5, characterized in that: The test method includes: S10: placing the printed board with the package substrate on the carrier, so that the package substrate is located on the side of the printed board away from the carrier, and using the clamping member to clamp and fix the printed board on opposite sides of the carrier; S20: placing the other end of the connector on the packaging substrate, pouring the liquid-shaped solid sealing member on the other end of the connector and the packaging substrate, and then solidifying the liquid-shaped solid sealing member into a solid state; S30: Start the measuring device to apply tension to the connector, separate the package substrate and the printed circuit board, use the measuring device to measure and record the tension value during the separation process, observe the welding interface on the package substrate and the printed circuit board after separation, and obtain the welding reliability of the package substrate and the printed circuit board based on the tension value and the welding interface.

7. The testing method according to claim 6, characterized in that: The step S20 includes a step S21, and the step S21 specifically includes: the sealing member is made of epoxy resin and a curing agent, and the epoxy resin has a liquid state and a solid state; The epoxy resin in liquid form and the curing agent are mixed and then poured onto the other end of the connector and the packaging substrate. The curing agent cures the epoxy resin in liquid form into a solid form.

8. The testing method according to claim 7, characterized in that: The step S21 further includes a step S22, and the step S22 specifically includes: heating after the liquid epoxy resin and the curing agent are poured on the connector and the packaging substrate.

9. The testing method according to claim 6, characterized in that: The step S20 further includes a step S23, wherein the step S23 specifically includes: the package substrate testing device includes a mold, the mold includes a shell, the shell is surrounded to form a cylindrical structure with two ends opened, the opening at one end of the cylindrical structure is arranged toward the package substrate, and the shell and the surface of the package substrate are surrounded to form a receiving space; After the other end of the connecting member is arranged in the accommodation space, a liquid sealing member is poured into the accommodation space, and then the sealing member is solidified into a solid state.

10. The testing method according to claim 9, characterized in that: The step S23 further includes a step S24, wherein the step S24 specifically includes: the connecting member includes a nut and a screw, and the nut is sleeved on one end of the screw; The nut and one end of the screw are arranged in the accommodation space, and the sealing member in liquid form is poured into the accommodation space so that the height of the sealing member along the thickness direction of the carrier platform is higher than the nut and lower than the other end of the screw.

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