Photosensitive resin composition and display device

Abstract

The invention discloses a light-sensitive resin composition. The light-sensitive resin composition comprises a plurality of color conversion particles (A), alkali-soluble resin (B), an ethylene unsaturated compound (C), a photoinitiator (D), an organic solvent (E) and a plurality of scattering particles (F). The average particle size of the color conversion particles (A) is greater than 0.4 [mu] m and less than 7 [mu] m. The average particle diameter of the scattering particles (F) is greater than 50 nm and less than 600 nm. The content of the color conversion particles (A) is 60-90% by weight based on 100% by weight of the total weight of solids in the light-sensitive resin composition.

Description

Technical Field

[0001] The invention relates to a resin composition and an electronic device, in particular to a photosensitive resin composition and a display device. Background Art

[0002] Display devices have been widely used in daily life, including various portable or non-portable electronic products, workplace equipment, smart home appliances, transportation, or public use, etc., to provide relevant information and / or interactive modes to enhance the convenience and fun of users in life and work. Color filters are one of the means to make color liquid crystal display devices full-color and thus increase their added value. Color filters use filtering to produce three primary colors of red (R), green (G), and blue (B), and then mix the three primary colors in different ratios to present various colors. Photosensitive resin compositions are the main raw materials for color filters.

[0003] Quantum dots are a color conversion material with high light absorption-luminescence efficiency, high color purity and saturation, and they have the function of converting blue light into other colors. However, quantum dots currently still have disadvantages such as poor material and luminescence stability, poor heat resistance, high sealing to block the atmosphere, short service life, and / or high price. Summary of the invention

[0004] In view of the above problems, the present invention provides a photosensitive resin composition having the function of converting blue light into other color lights and / or overcoming at least one disadvantage of the above quantum dots.

[0005] Some embodiments of the present invention provide a photosensitive resin composition, comprising: a plurality of color conversion particles (A), an alkali-soluble resin (B), an ethylene-unsaturated compound (C), a photoinitiator (D), an organic solvent (E), and a plurality of scattering particles (F). The average particle size of the color conversion particles (A) is greater than 0.4 micrometers and less than 7 micrometers. The average particle size of the scattering particles (F) is greater than 50 nanometers and less than 600 nanometers. The content of the color conversion particles (A) is 60% to 90% by weight, based on the total weight of the solids in the photosensitive resin composition being 100% by weight.

[0006] Some embodiments of the present invention provide a display device, comprising: a first substrate, a light-emitting element disposed on the first substrate, and a color conversion layer disposed on the light-emitting element. The color conversion layer is formed by a photosensitive resin composition. The photosensitive resin composition comprises: a plurality of color conversion particles (A), an alkali-soluble resin (B), an ethylene-unsaturated compound (C), a photoinitiator (D), an organic solvent (E), and a plurality of scattering particles (F). The average particle size of the color conversion particles (A) is greater than 0.4 microns and less than 7 microns. The average particle size of the scattering particles (F) is greater than 50 nanometers and less than 600 nanometers. Based on the total weight of the solids in the photosensitive resin composition being 100 weight percent, the content of the color conversion particles (A) is 60 weight percent to 90 weight percent.

[0007] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein:

[0009] Figure 1 is a schematic diagram of a display device according to some embodiments of the present invention.

[0010] Wherein, the reference numerals are:

[0011] 101: first substrate

[0012] 103: Light emitting element

[0013] 105: Color conversion layer

[0014] 1051: Second substrate

[0015] 1053: Color conversion photoresist film DETAILED DESCRIPTION

[0016] It will be further understood that when the terms "comprises", "comprising", "includes" and / or "including" are used in this specification, they specifically refer to the existence of the described features, integers, steps, operations, elements, components, and / or groups thereof, but do not exclude the existence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0017] It will be understood that the terms "about", "approximately", and "roughly" herein generally mean within 20% of a given value or range, preferably within 10%, and more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%. The quantities given herein are approximate quantities, that is, in the absence of specific instructions for "about", "approximately", and "roughly", the meanings of "about", "approximately", and "roughly" may still be implied. Further, the numerical values ​​represented in the present invention may include the numerical values ​​and deviation values ​​within the deviation range acceptable to those of ordinary skill in the art. The expression "a~b" used herein to represent a specific numerical range is defined as "≥a and ≤b". The expression "greater than a and less than b" herein is defined as ">a and <b」。

[0018] In some embodiments of the present invention, relative terms such as "lower", "upper", "horizontal", "vertical", "below", "above", "top", "bottom", etc. should be understood as the orientations shown in the paragraph and related drawings. Such relative terms are only for the convenience of explanation and do not mean that the device described therein must be manufactured or operated in a specific orientation. It is understood that if the device in the attached drawing is turned upside down, the components described on the "lower" side will become components on the "upper" side. The embodiments of the present invention can be used in conjunction with the attached drawings. Figure 1 It is also understood that the drawings of the present invention are also considered as part of the specification. It should be understood that the drawings of the present invention are not drawn according to scale, and in fact, the size of the elements may be arbitrarily enlarged or reduced to clearly show the features of the present invention.

[0019] In the present invention, "C1-C 20 Alkyl" and "unsubstituted C1-C 20 "C1-C 20 Alkyl / Unsubstituted C1-C 20 "Alkyl" refers to a straight or branched aliphatic hydrocarbon monovalent group having 1 to 20 carbon atoms in the main carbon chain and having no hydrogen atoms substituted. 20 "Alkyl" refers to C1-C 20 At least one hydrogen atom on the alkyl group is replaced by a hydroxyl group, an oxygen group, or a substituted or unsubstituted C1-C 20 Unsubstituted C1-C 20 Non-limiting examples of alkyl groups include, but are not limited to, methyl, ethyl, propyl, isobutyl, sec-butyl, tert-butyl, pentyl, isopentyl, hexyl, dodecyl, dodecyl, pentadecyl, or eicosyl. 20 "Alkylene" refers to a C1-C 20 An alkyl group is a divalent group having the same structure.

[0020] In the present invention, "C5-C 20 Cycloalkyl" and "unsubstituted C5-C 20 "Cycloalkyl" can be used interchangeably. 20 Cycloalkyl / unsubstituted C5-C 20 "Cycloalkyl" refers to a cyclic aliphatic hydrocarbon monovalent group having 5 to 20 carbon atoms in which none of the hydrogen atoms is substituted. 20 "Cycloalkyl" refers to C5-C 20 At least one hydrogen atom on the cycloalkyl group is replaced by a hydroxyl group, an oxygen group, or a substituted or unsubstituted C1-C 20 Unsubstituted C5-C 20 Non-limiting examples of cycloalkyl groups include, but are not limited to, cyclohexyl, bicycloheptyl, bicyclooctyl, or tricyclodecyl.

[0021] In the present invention, "C1-C 20 Alkyl Acrylic Acid C1-C 20 "Alkyl" means having the structure A monovalent group.

[0022] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as those commonly understood by those skilled in the art. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present application, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the present invention. The following will omit descriptions that may unnecessarily confuse the known functions and structures of the present invention.

[0023] One aspect of the present invention is a photosensitive resin composition, comprising: a plurality of color conversion particles (A), an alkali-soluble resin (B), an ethylene-unsaturated compound (C), a photoinitiator (D), an organic solvent (E), and a plurality of scattering particles (F). The average particle size of the color conversion particles (A) is greater than 0.4 μm and less than 7 μm. The average particle size of the scattering particles (F) is greater than 50 nanometers and less than 600 nanometers. The content of the color conversion particles (A) is 60% to 90% by weight, based on the total weight of the solids in the photosensitive resin composition being 100% by weight.

[0024] Color conversion particles (A)

[0025] The color conversion particles (A) of the present invention may absorb incident light having a first wavelength and emit emission light having a second wavelength, wherein the first wavelength is shorter than the second wavelength. In some embodiments, the color conversion particles (A) may include a luminescent material that absorbs incident light having a wavelength peak of 440nm to 460nm and emits emission light having a wavelength peak longer than 440nm to 460nm. In some embodiments, the color conversion particles (A) may include a luminescent material that absorbs incident light having a wavelength peak of 440nm to 460nm and emits emission light having a wavelength peak of 550nm to 560nm or 630nm to 640nm. Examples of the luminescent material may include, but are not limited to, cerium-doped yttrium aluminum garnet particles, fluoride red powder (KSF) particles, or a combination thereof, but the present invention is not limited thereto.

[0026] The average particle size of the color conversion particles (A) affects the light absorption and color conversion efficiency. Specifically, if the photosensitive resin composition includes color conversion particles (A) with an average particle size of less than 0.4 microns, the photosensitive resin composition cannot form a color conversion layer that can effectively absorb light and convert colors. If the photosensitive resin composition includes color conversion particles (A) with an average particle size of greater than 7 microns, the color conversion layer formed by the photosensitive resin composition will have insufficient light output due to the light shielding effect of the color conversion particles (A). In some embodiments, the average particle size of the color conversion particles (A) may be greater than or equal to 0.5 microns and less than or equal to 6.5 microns, greater than or equal to 0.6 microns and less than or equal to 6 microns, greater than or equal to 0.7 microns and less than or equal to 5.5 microns, or greater than or equal to 0.8 microns and less than or equal to 5 microns.

[0027] Alkali soluble resin (B)

[0028] The alkali-soluble resin (B) of the present invention is a resin soluble in an alkaline solvent. In some embodiments, the alkali-soluble resin (B) may include an acidic group. In some embodiments, the alkali-soluble resin (B) may include a carboxyl group. In some embodiments, the alkali-soluble resin (B) may be an acrylate copolymer, but the present invention is not limited thereto.

[0029] In some embodiments, the alkali-soluble resin (B) may be a polymer resin comprising one or more repeating units represented by the following formula I:

[0030]

[0031] Among them, R 1 Represents hydrogen, C1-C 20 Alkyl, substituted or unsubstituted C5-C 20 Cycloalkyl, or C1-C 20 Alkyl Acrylic Acid C1-C 20 Alkyl, and R2 Represents hydrogen or C1-C 20 In some embodiments, R 1 represents hydrogen, butane, Wherein * represents the connection position with other parts in Formula I. In some embodiments, R 2 represents hydrogen or methyl.

[0033] In some embodiments, the alkali-soluble resin (B) may be a polymer resin further comprising a repeating unit represented by the following Formula II:

[0034]

[0035] Among them, R 3 and R 4 Each independently represents hydrogen or C1-C 20 In some embodiments, R 3 and R 4 can be the same or different from each other. In some embodiments, R 3 and R 4 They may all be methyl groups.

[0036] In some embodiments, the weight average molecular weight of the alkali-soluble resin (B) is 6,000 to 40,000, 7,000 to 30,000, 8,000 to 20,000, or 9,000 to 15,000.

[0037] In some embodiments, the alkali-soluble resin (B) may be a polymer resin including a polymer represented by the following Formula III:

[0038]

[0039] The ratio of a:b:c:d is 3:3:8:6.

[0040] In some embodiments, based on 100 wt % of the total weight of solids in the photosensitive resin composition, the content of the alkali-soluble resin (B) is 0.5 wt % to 10 wt %, 0.6 wt % to 9 wt %, or 0.7 wt % to 8 wt %.

[0041] Ethylenically unsaturated compounds (C)

[0042] The ethylene unsaturated compound (C) of the present invention includes one or more polymerizable compounds having ethylene unsaturated double bonds. In some embodiments, the ethylene unsaturated compound (C) may include a polymerizable compound having one to three ethylene unsaturated double bonds. Examples of polymerizable compounds having one ethylene unsaturated double bond may include, but are not limited to, nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, and N-vinyl pyrrolidone. Examples of polymerizable compounds having two ethylene unsaturated double bonds may include, but are not limited to, dipentaerythritol polyacrylate, 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl) ether of bisphenol A, and 3-methylpentanediol di(meth)acrylate. Examples of the polymerizable compound having three ethylenically unsaturated double bonds may include, but are not limited to, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tripentaerythritol octa(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, and the like. Tetraethanol ester, pentaerythritol nona(meth)acrylate, tris(2-(meth)acryloyloxyethyl)isocyanate, ethylene glycol-modified pentaerythritol tetra(meth)acrylate, ethylene glycol-modified dipentaerythritol hexa(meth)acrylate, propylene glycol-modified pentaerythritol tetra(meth)acrylate, propylene glycol-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified pentaerythritol tetra(meth)acrylate, and caprolactone-modified dipentaerythritol hexa(meth)acrylate.

[0043] In some embodiments, based on 100 wt % of the total weight of solids in the photosensitive resin composition, the content of the ethylenically unsaturated compound (C) is 1 wt % to 30 wt %, 1.5 wt % to 29 wt %, or 2 wt % to 28 wt %.

[0044] Photoinitiator (D)

[0045] The photoinitiator (D) of the present invention may be any one or more compounds that can generate active free radicals and / or acids by the action of light, thereby starting the photopolymerization reaction. The photoinitiator (D) of the present invention may include any compound that can effectively harden the photosensitive resin composition of the present invention after the lithography process. The photoinitiator (D) of the present invention may use one or more combinations of various commercially available photoinitiators, including but not limited to. In some embodiments, examples of the photoinitiator (D) of the present invention may include but are not limited to O-acyloxime compounds, thioxanthone compounds, alkyl phenyl ketone compounds, biimidazole compounds, triazine compounds, acyl phosphine oxides (acyl phosphine oxide), benzoin compounds, diphenyl ketone compounds, quinone compounds, 10-butyl-2-chloroacridone, benzyl, methyl phenylformate, acetophenone (acetophenone), cyclopentadiene titanium (titanocene) compounds, acyl phosphine oxide compounds, biimidazole compounds, and any combination thereof. The O-acyl oxime compound may include 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime) (product name: OXE-01; BASF Corporation) and other commercial products, but the present invention is not limited thereto. Thioxanthone compounds may include commercial products such as 2,4-diethylthioxanthone (2,4-Diethyl-9H-thioxanthen-9-one) (trade name KAYACURE-DETX, manufactured by Nippon Kayaku Co., Ltd.), but the present invention is not limited thereto. ). In some embodiments, the photoinitiator (D) of the present invention may be used in combination with one or more photoinitiator aids commonly used in the relevant field. Examples of photoinitiator aids may include amine compounds and carboxylic acid compounds.

[0046] In some embodiments, based on the total weight of solids in the photosensitive resin composition being 100 weight %, the content of the photoinitiator (D) is 0.01 weight % to 3 weight %, 0.03 weight % to 2 weight %, or 0.05 weight % to 1 weight %.

[0047] Organic solvents (E)

[0048] In the photosensitive resin composition of the present invention, the purpose of the organic solvent (E) is mainly to maintain the solubility of the photosensitive resin composition so as to obtain a better coating effect in the future application. Therefore, as long as the above effect can be achieved, there is no specific restriction on the use of the organic solvent (E). Examples of the organic solvent (E) may include, but are not limited to, ester solvents, ether solvents, ketone solvents, alcohol solvents, alcohol ether solvents, hydrocarbon solvents, pinene solvents, or any combination thereof. Ester solvents may include, but are not limited to, ethyl acetate (EAC), n-butyl acetate (BAC), propylene glycol monomethyl ether acetate, or any combination thereof. Examples of ether solvents may include, but are not limited to, ether. Examples of ketone solvents may include, but are not limited to, acetone, butanone, or any combination thereof. Examples of alcohol solvents may include, but are not limited to, methanol, ethanol, n-butanol, or any combination thereof. Alcohol ether solvents refer to solvents whose solvent molecules have both alcohol and ether functional groups, and examples thereof may include, but are not limited to, ethylene glycol monoethyl ether. Examples of hydrocarbon solvents may include, but are not limited to, toluene, xylene, or any combination thereof. Pinene solvents are cyclic compounds obtained by distillation of rosin-based natural resins, and examples thereof may include, but are not limited to, turpentine, dipentene, pine oil, or any combination thereof. In some embodiments, the solvent may be an ester solvent. In some embodiments, the solvent may include propylene glycol monomethyl ether acetate. In some embodiments, the organic solvent (E) may be 30 to 60 parts by weight, 30 to 55 parts by weight, 35 to 60 parts by weight, or 35 to 55 parts by weight, based on 100 parts by weight of the total weight of the solids in the optically active resin composition.

[0049] Scattering particles (F)

[0050] The scattering particles (F) of the present invention can scatter light from a light source, thereby obtaining excellent optical properties. In some embodiments, the scattering particles (F) of the present invention may include optically inactive inorganic particles. In some embodiments, examples of inorganic particles may include metal oxide particles. Metal oxide particles may be used as high refractive index particles. The metal oxide particles may include an oxide of at least one element selected from the group consisting of titanium (Ti), zirconium (Zr), tin (Sn), antimony (Sb), copper (Cu), iron (Fe), manganese (Mn), lead (Pb), cadmium (Cd), chromium (Cr), mercury (Hg), zinc (Zn), aluminum (Al) and magnesium (Mg) as a main component. The "main component" in the present invention refers to the component with the largest content (mass %) among the components constituting the metal oxide particles. In some embodiments, the metal oxide particles may include titanium dioxide, tin oxide, indium oxide, zinc oxide, zirconium oxide, or any combination thereof as a main component. In some embodiments, the metal oxide particles may include titanium dioxide, tin oxide, indium oxide, zirconium oxide, or any combination thereof as a main component. In some embodiments, the metal oxide particles may include titanium dioxide, zirconium oxide, or any combination thereof as a main component. In some embodiments, the metal oxide particles may further include other elements.

[0051] In some embodiments, the inorganic microparticles may include titanium dioxide particles that may be used as titanium white pigment, but the present invention is not limited thereto. In some embodiments, the inorganic microparticles may include, but are not limited to, silicon oxide particles, aluminum oxide particles, zirconium oxide particles, or any combination thereof.

[0052] The average particle size of the scattering particles (F) affects the visual effect of the emitted light. Specifically, if the photosensitive resin composition includes scattering particles (F) having an average particle size of less than 50 nanometers, the photosensitive resin composition cannot form a color conversion layer that can provide sufficient scattering effect, and the viewing angle brightness of the display device including the color conversion layer is not significantly improved. If the photosensitive resin composition includes scattering particles (F) having an average particle size greater than 600 nanometers, the color conversion layer formed by the photosensitive resin composition will cause a large loss of the positive viewing angle brightness of the display device due to the light shielding effect of the scattering particles (F). In addition, if the average particle size of the scattering particles (F) is too large, the sedimentation of the scattering particles (F) in the photosensitive resin composition is significant, which will make the photosensitive resin composition not industrially applicable. In some embodiments, the average particle size of the scattering particles (F) may be greater than or equal to 100 nanometers and less than or equal to 500 nanometers, greater than or equal to 100 nanometers and less than or equal to 400 nanometers, or greater than or equal to 100 nanometers and less than or equal to 300 nanometers.

[0053] In some embodiments, the content of the scattering particles (F) is 0.1 wt % to 10 wt %, 0.3 wt % to 8 wt %, or 0.5 wt % to 6 wt %, based on the total weight of the solids in the photosensitive resin composition being 100 wt %. In some embodiments, the weight ratio of the color conversion particles (A) to the scattering particles (F) is 8 to 25:1, 9 to 22:1, or 10 to 20:1.

[0054] Additives (G)

[0055] The photosensitive resin composition of the present invention may optionally contain one or more additives (G). Examples of the additives (G) include, but are not limited to, curing agents, surfactants, adhesion promoters, antioxidants, anti-coagulation agents, leveling agents, fillers, light stabilizers, chain movers, and dispersants (e.g., pigment dispersants).

[0056] In some embodiments, based on the total weight of solids in the photosensitive resin composition being 100 weight %, the content of the additive (G) is 0 weight % to 5 weight %, 0.3 weight % to 4 weight %, 0.5 weight % to 3 weight %, or 0.8 weight % to 2 weight %.

[0057] In some embodiments, the light absorption efficiency of the photosensitive resin composition of the present invention is ≥85%, wherein the light absorption efficiency of the photosensitive resin composition is calculated by the following formula 1:

[0058]

[0059] In some embodiments, the light conversion efficiency of the photosensitive resin composition of the present invention is ≥45%, wherein the light conversion efficiency of the photosensitive resin composition is calculated by the following formula 2:

[0060]

[0061] Another aspect of the present invention is a display device, which includes a first substrate, a light-emitting element disposed on the first substrate, and a color conversion layer disposed on the light-emitting element, wherein the color conversion layer is formed of the above-mentioned photosensitive resin composition. Figure 1 is a schematic diagram of a display device according to some embodiments of the present invention. Figure 1 As shown, the display device of the present invention includes a first substrate 101, a light emitting element 103 disposed on the first substrate 101, and a color conversion layer 105 disposed on the light emitting element 103. In some embodiments, the light emitting element 103 is disposed between the first substrate 101 and the color conversion layer 105.

[0062] The first substrate 101 of the present invention may include a flexible substrate, a rigid substrate, or a combination of the foregoing, but is not limited thereto. In some embodiments, the first substrate 101 may include a light-transmitting substrate or a semi-transmitting substrate. According to some embodiments, the material of the first substrate 101 may include glass, quartz, sapphire, ceramic, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), other suitable materials, or any combination of the foregoing, but the present invention is not limited thereto. In some embodiments, the first substrate 101 may include various elements, material layers, and / or combinations thereof for display devices. Examples of elements may include wires, pads, source electrodes, drain electrodes, common electrodes, and other suitable elements. Examples of material layers may include polysilicon layers, insulating layers, buffer layers, and other suitable layers.

[0063] The light-emitting element 103 of the present invention may include a sub-millimeter light-emitting diode (mini-LED), a micro-light-emitting diode (micro-LED), a quantum dot light-emitting diode (quantum dot LED, QLED / QDLED) or an organic light-emitting diode (organic light-emitting diode, OLED), but the present invention is not limited thereto. In some embodiments, the light-emitting element 103 may include an element pad, and the light-emitting element 103 may be disposed on the first substrate 101 through the element pad. In some embodiments, the element pad may include a metal, other suitable conductive materials, or any combination thereof. Examples of metals may include gold, silver, copper, tin, nickel, other suitable metals, alloys thereof, or any combination thereof.

[0064] The color conversion layer 105 of the present invention is formed by the above-mentioned photosensitive resin composition. Specifically, the color conversion layer 105 of the present invention may include a second substrate 1051 and a color conversion photoresist film 1053 formed on the second substrate 1051. The second substrate 1051 of the present invention may include a flexible substrate, a rigid substrate, or a combination of the foregoing, but is not limited thereto. In some embodiments, the second substrate 1051 may include a light-transmitting substrate or a semi-transmitting substrate. According to some embodiments, the material of the second substrate 1051 may include glass, quartz, sapphire, ceramic, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), other suitable materials, or any combination of the foregoing, but the present invention is not limited thereto.

[0065] The process of forming the color conversion photoresist film 1053 may include applying the above-mentioned photosensitive resin composition to the second substrate 1051 using a blade coater, a slit coater, a spin coater, an inkjet machine, or any combination thereof, and a curing process. The curing process may be performed after the applying process. In some embodiments, the curing process may include a thermal curing process, a photocuring process, or a combination thereof.

[0066] In some embodiments, the process of forming the color conversion photoresist film 1053 may further include a solvent removal process before the curing process and after the application process. The solvent removal process helps to cure the photosensitive resin composition. In some embodiments, the solvent removal process may include a reduced pressure drying process, a heating drying process, and a combination thereof, but the present invention is not limited thereto.

[0067] In some embodiments, the process of forming the color conversion photoresist film 1053 may further include a development process and a baking process after the curing process. The color conversion photoresist film 1053 formed by the development process may include a desired photoresist pattern. The baking process may be performed after the development process to remove the developer used in the development process, but the present invention is not limited thereto. In some embodiments, the baking process may be omitted.

[0068] Hereinafter, the present invention will provide several embodiments to more specifically illustrate the advantages of the photosensitive resin composition according to the embodiments of the present invention.

[0069] raw material

[0070] Color conversion particles (A-1): cerium-doped yttrium aluminum garnet having an average particle size of 4.0 μm.

[0071] Color conversion particles (A-2): cerium-doped yttrium aluminum garnet having an average particle size of 2.0 μm.

[0072] Color conversion particles (A-3): cerium-doped yttrium aluminum garnet having an average particle size of 0.8 μm.

[0073] Color conversion particles (A-4): cerium-doped yttrium aluminum garnet having an average particle size of 7.0 μm.

[0074] Color conversion particles (A-5): cerium-doped yttrium aluminum garnet having an average particle size of 0.4 micrometers.

[0075] Color conversion particles (A-6): fluoride red powder (KSF) with an average particle size of 4.3 μm.

[0076] Alkali soluble resin (B):

[0077] A polymer resin represented by the following formula III and having a molecular weight (Mw) of about 10,000:

[0078]

[0079] Among them, the ratio of a:b:c:d is 15:15:40:30.

[0080] Ethylenically unsaturated compound (C): dipentaerythritol polyacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.).

[0081] Photoinitiator (D): 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-(O-benzoyloxime) (product name: OXE-01; manufactured by BASF) and 2,4-diethylthiazole 2,4-Diethyl-9H-thioxanthen-9-one (product name: DETX; manufactured by Nippon Kayaku Co., Ltd.).

[0082] Organic solvent (E): propylene glycol methyl ether acetate (PGMEA; manufactured by Shangren Chemical Co., Ltd.).

[0083] Scattering particles (F-1): titanium dioxide with an average particle size of 257 nanometers.

[0084] Scattering particles (F-2): titanium dioxide with an average particle size of 114 nanometers.

[0085] Scattering particles (F-3): titanium dioxide with an average particle size of 49 nanometers.

[0086] Scattering particles (F-4): titanium dioxide with an average particle size of 620 nanometers.

[0087] Additive (G): Surfactant (Product name: DOWSIL TM SH 3746 Fluid; manufactured by Dow Toray Industries, Inc.)

[0088] Preparation of Photosensitive Resin Compositions of Examples 1 to 9 and Comparative Examples 1 to 6

[0089] Preparation of Titanium White Pigment Dispersions 1 to 4

[0090] 70.0 parts by weight of the scattering particles (F-1), 6.0 parts by weight of the dispersant LPN6919 (manufactured by BYK), and 24.0 parts by weight of the solvent PGMEA were mixed and appropriately dispersed for 12 hours to prepare a titanium white pigment dispersion 1.

[0091] 30.0 parts by weight of scattering particles (F-2), 5.0 parts by weight of dispersant LPN6919 (manufactured by BYK), and 65.0 parts by weight of solvent PGMEA were mixed and appropriately dispersed for 12 hours to prepare a titanium white pigment dispersion 2.

[0092] 30.0 parts by weight of scattering particles (F-3), 5.0 parts by weight of dispersant LPN6919 (manufactured by BYK), and 65.0 parts by weight of solvent PGMEA were mixed and appropriately dispersed for 12 hours to prepare a titanium white pigment dispersion 3.

[0093] 30.0 parts by weight of scattering particles (F-4), 5.0 parts by weight of dispersant LPN6919 (manufactured by BYK), and 65.0 parts by weight of solvent PGMEA were mixed and appropriately dispersed for 6 hours to prepare a titanium white pigment dispersion 4.

[0094] The titanium white pigment dispersions 1 to 4 are mixed with the color conversion particles (A-1) to (A-6), the alkali-soluble resin (B), the ethylene unsaturated compound (C), the photoinitiator (D), the scattering particles (F-1) to (F-4), and the additive (G) in the solid weight percentages shown in the following Tables 1 and 2 to obtain a preliminary mixture. The solid weight percentages of each component in Tables 1 and 2 are based on the total weight of the solids in the photosensitive resin composition of the present invention excluding the organic solvent (E) as 100% by weight, and the weight percentages of each component. In other words, the solid weight percentages of each component in Tables 1 and 2 are based on the total weight of the solids in the photosensitive resin composition of the present invention as 100% by weight, and the weight percentages of each component. Specifically, the weight % of the solid content of each component in Tables 1 and 2 is the weight % of each component based on the total weight of the color conversion particles (A-1) to (A-6), the alkali-soluble resin (B), the ethylene-unsaturated compound (C), the photoinitiator (D), the scattering particles (F-1) to (F-4), and the additive (G) of the photosensitive resin composition in Tables 1 and 2 being 100 weight %. The initial mixture and the organic solvent (E) were mixed in a ratio of 3:7 of the weight ratio of the organic solvent (E) to the solid content in the initial mixture to prepare the photosensitive resin compositions of Examples 1 to 9 and Comparative Examples 1 to 6.

[0095] Table 1

[0096]

[0097] Table 2

[0098]

[0099]

[0100] Preparation of Color Conversion Layers of Examples 1 to 9 and Comparative Examples 1 to 6

[0101] The photosensitive resin compositions of Examples 1 to 9 and Comparative Examples 1 to 6 were applied to a 5 cm x 5 cm glass substrate using a spin coater. The glass substrate on which the photosensitive resin composition was applied was then dried under reduced pressure and heated on a 90°C hot plate for 60 seconds to volatilize the organic solvent in the photosensitive resin composition. The photosensitive resin composition was irradiated at 30 mJ / cm2 through a negative shield. 2 The photosensitive resin composition was exposed to energy rays of 500 nm to form a 5 cm x 5 cm square cured film. The cured film was subjected to a development process and then a baking process was performed at a baking temperature of 180° C. for 20 minutes to obtain a color conversion photoresist film with a thickness of 10 μm and a micron-level fine pattern. Finally, the color conversion layers of Examples 1 to 9 and Comparative Examples 1 to 6 including the color conversion photoresist film and a glass substrate were obtained.

[0102] Evaluation of the color conversion layers of Examples 1 to 9 and Comparative Examples 1 to 6

[0103] The color conversion layers of Examples 1 to 9 and Comparative Examples 1 to 6 are bonded to a mini-LED light source emitting light with a wavelength of 460 nm to obtain display devices of Examples 1 to 9 and Comparative Examples 1 to 6. The display devices of Examples 1 to 9 and Comparative Examples 1 to 6 are placed horizontally on a stage with a luminance meter (PR788) directly above, and the spectrum of the light from the mini-LED light source after passing through the color conversion layers of Examples 1 to 9 and Comparative Examples 1 to 6 is measured. Based on the obtained spectrum, the integral area of ​​the light with a wavelength of 415nm to 485nm emitted by the light source, the integral area of ​​the light with a wavelength of 415nm to 485nm after passing through the color conversion layer, and the integral area of ​​the light with a wavelength of 485nm to 685nm after passing through the color conversion layer are calculated. The light absorption efficiency and light conversion efficiency of the color conversion layers of Examples 1 to 9 and Comparative Examples 1 to 6 are calculated respectively using the following formulas 1 and 2. Here, "light absorption efficiency" is the absorption ratio of the color conversion layers of Examples 1 to 9 and Comparative Examples 1 to 6 to the light with a wavelength of 460nm emitted by the mini-LED light source. Here, the "light conversion efficiency" refers to the ratio of the light with a wavelength of 460nm emitted by the mini-LED light source absorbed by the color conversion layer of Examples 1 to 9 and Comparative Examples 1 to 6 to the emission light with a wavelength of 485nm to 685nm.

[0104]

[0105] If the light absorption efficiency obtained according to the above formula is ≥85%, it is judged as O; if the light absorption efficiency is <85%, it is judged as X. If the light conversion efficiency is ≥45%, it is judged as O; if the light conversion efficiency is <45%, it is judged as X.

[0106] The results of the integrated area of ​​light with a wavelength of 415nm to 485nm emitted by the light source, the integrated area of ​​light with a wavelength of 415nm to 485nm after passing through the color conversion layer, the integrated area of ​​light with a wavelength of 485nm to 685nm after passing through the color conversion layer, the light absorption efficiency, and the light conversion efficiency measured for the display devices of Examples 1 to 9 and Comparative Examples 1 to 6 are listed in the following Tables 3 and 4.

[0107] Table 3

[0108]

[0109]

[0110] Table 4

[0111]

[0112] According to the contents of Tables 3 and 4 above, it can be seen that the color conversion layer formed by the photosensitive resin composition of Comparative Example 1 containing more than 90% by weight of color conversion particles (A-1) has low light conversion efficiency and low light output rate converted into emission light with a wavelength of 485nm to 685nm. The color conversion layer formed by the photosensitive resin composition of Comparative Example 2 containing less than 60% by weight of color conversion particles (A-1) cannot effectively absorb and convert light. The color conversion layer formed by the photosensitive resin composition of Comparative Example 6 including color conversion particles (A-5) with an average particle size of 0.4 microns cannot effectively absorb and convert light. The color conversion layer formed by the photosensitive resin composition of Comparative Example 5 including color conversion particles (A-4) with an average particle size of 7 microns has low light conversion efficiency.

[0113] Furthermore, according to the contents of Table 3 and Table 4 above, it can be seen that the color conversion layer formed by the photosensitive resin composition of Comparative Example 3 including scattering particles (F-3) with an average particle size of less than 50 nanometers cannot effectively absorb and convert light. The color conversion layer formed by the photosensitive resin composition of Comparative Example 4 including scattering particles (F-4) with an average particle size of more than 600 nanometers has low light conversion efficiency, and the light output rate converted into emitted light with a wavelength of 485nm to 685nm is low.

[0114] It can be seen from Tables 1 to 4 above that the average particle size of the color conversion particles (A), the average particle size of the scattering particles (F), and the content of the color conversion particles (A) in the photosensitive resin composition will affect the optical properties of the formed color conversion layer, and the color conversion layer formed by the photosensitive resin composition having the average particle size of the color conversion particles (A), the average particle size of the scattering particles (F), and the content of the color conversion particles (A) defined in the present invention can have better light absorption efficiency and light conversion efficiency.

[0115] The features of several embodiments of the present invention are summarized above so that those with ordinary knowledge in the art to which the present invention belongs can more easily understand the concepts of the embodiments of the present invention. Those with ordinary knowledge in the art to which the present invention belongs should understand that they can design or modify other processes and structures based on the embodiments of the present invention to achieve the same purposes and / or advantages as the embodiments introduced herein. Those with ordinary knowledge in the art to which the present invention belongs should also understand that such equivalent processes and structures do not deviate from the spirit and scope of the present invention, and they can make various changes, substitutions and replacements without violating the spirit and scope of the present invention.

[0116] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field may make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims of the present invention.

Claims

1. A photosensitive resin composition, characterized in that Include: A plurality of color conversion particles, wherein the average particle size of the plurality of color conversion particles is greater than 0.4 micrometers and less than 7 micrometers; An alkali soluble resin; Ethylenically unsaturated compounds; A photoinitiator; an organic solvent; and A plurality of scattering particles, wherein the average particle size of the plurality of scattering particles is greater than 50 nanometers and less than 600 nanometers, Wherein, the total weight of the solids in the photosensitive resin composition is 100 weight %, and the content of the plurality of color conversion particles is 60 weight % to 90 weight %.

2. The photosensitive resin composition according to claim 1, characterized in that The plurality of color conversion particles include a luminescent material that absorbs incident light with a peak value of 440-460 nm and emits emission light with a peak value longer than 440-460 nm.

3. The photosensitive resin composition according to claim 2, characterized in that: The plurality of color conversion particles are luminescent materials that emit light with a peak value of 550 nm to 560 nm or 630 nm to 640 nm.

4. The photosensitive resin composition according to claim 1, characterized in that: The light absorption efficiency of the photosensitive resin composition is ≥85%, and the light absorption efficiency is calculated by the following formula 1:

5. The photosensitive resin composition according to claim 1, characterized in that: The light conversion efficiency of the photosensitive resin composition is ≥45%, and the light conversion efficiency is calculated by the following formula 2:

6. The photosensitive resin composition according to claim 1, characterized in that: The average particle size of the plurality of scattering particles is greater than or equal to 100 nanometers and less than or equal to 500 nanometers; and / or the content of the plurality of scattering particles is 0.5 wt % to 10 wt % based on the total weight of the solids in the photosensitive resin composition being 100 wt %.

7. The photosensitive resin composition according to claim 1, characterized in that: The weight ratio of the plurality of color conversion particles to the plurality of scattering particles is 8-25:

1.

8. The photosensitive resin composition according to claim 1, characterized in that: The scattering particles include metal oxide particles, and the metal oxide particles include oxides of at least one element selected from the group consisting of titanium, zirconium, tin, antimony, copper, iron, manganese, lead, cadmium, chromium, mercury, zinc, aluminum and magnesium.

9. The photosensitive resin composition according to claim 1, characterized in that: The color conversion particles are selected from cerium-doped yttrium aluminum garnet or fluoride red powder.

10. The photosensitive resin composition according to claim 1, characterized in that: Based on the total weight of the solids in the photosensitive resin composition being 100 weight %, the content of the alkali-soluble resin is 0.5 weight % to 10 weight %; and / or the content of the ethylene-unsaturated compound is 1 weight % to 30 weight %; and / or the content of the photoinitiator is 0.1 weight % to 3 weight %.

11. The photosensitive resin composition according to claim 1, characterized in that: The photosensitive resin composition further comprises an additive, and the content of the additive is 0% to 5% by weight, based on the total weight of the solids in the photosensitive resin composition being 100% by weight.

12. A display device, characterized in that: Include: a first substrate; a light emitting element disposed on the first substrate; and A color conversion layer is disposed on the light emitting element, wherein the color conversion layer is formed from the photosensitive resin composition according to any one of claims 1 to 11.

13. The display device according to claim 12, characterized in that The color conversion layer contains: a second substrate; and a color conversion photoresist film formed on the second substrate, The process of forming the color conversion photoresist film includes an application process of applying the photosensitive resin composition on the second substrate by using a blade coater, a slit coater, a spin coater, an inkjet machine or any combination thereof and a curing process.

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