Printed circuit board thermal simulation method and system, storage medium and computer

Abstract

The invention relates to a thermal simulation method and system for a printed circuit board, a storage medium and a computer. The method comprises the following steps: constructing an engineering simulation model of the printed circuit board based on a computer aided design method; constructing a plurality of simulation working condition models; sequentially performing thermal simulation calculation on the engineering simulation model under the plurality of simulation working condition models to obtain a thermal simulation result; generating thermal simulation correction parameter data according to the thermal simulation result; correcting the engineering simulation model according to the thermal simulation correction parameter data; according to the invention, the production and design of the printed circuit board are assisted through the engineering model; the defect that the design and verification period is too long due to the fact that samples are directly produced for thermal analysis in the design process of the circuit board is overcome, and therefore the thermal analysis period of the printed circuit board is shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board design, and in particular to a printed circuit board thermal simulation method, system, storage medium and computer. Background Art

[0002] When designing a printed circuit board, it is necessary to consider the heat distribution of the circuit board during actual application, so as to reasonably arrange electronic components on the circuit board. In the prior art, the design of the circuit board is usually combined with the heat generation of components in a specific circuit to perform a heat analysis of the circuit board. Although this method of analyzing the heat distribution of the circuit board by using heat-generating components is feasible, the analysis steps are cumbersome, resulting in a relatively long analysis cycle, which reduces the efficiency of circuit board design. Summary of the invention

[0003] In order to solve the technical problems in the prior art such as long thermal analysis cycle of printed circuit boards, the present invention provides a printed circuit board thermal simulation method, system, storage medium and computer.

[0004] The technical solution of the present invention to solve the above technical problems is as follows:

[0005] A printed circuit board thermal simulation method comprises the following steps:

[0006] S1. Construct an engineering simulation model of a printed circuit board based on computer-aided design methods;

[0007] S2. Construct multiple simulation working condition models;

[0008] S3, performing thermal simulation calculations on the engineering simulation model in turn under a plurality of simulation working condition models to obtain thermal simulation results;

[0009] S4, generating thermal simulation correction parameter data according to the thermal simulation results;

[0010] S5. Correcting the engineering simulation model according to the thermal simulation correction parameter data.

[0011] The beneficial effects of the present invention are as follows: engineering modeling and thermal simulation of the printed circuit board are performed by computer-aided design methods to obtain the thermal distribution, and then the engineering model is improved according to the thermal distribution, and finally the production and design of the printed circuit board are assisted by the engineering model; the disadvantage of excessive design and verification cycle caused by directly producing samples for thermal analysis during the design process of the circuit board is avoided, thereby reducing the thermal analysis cycle of the printed circuit board.

[0012] Based on the above technical solution, the present invention can also be improved as follows.

[0013] Furthermore, an engineering simulation model of a printed circuit board is constructed based on a computer-aided design method, specifically:

[0014] Based on a computer-aided design method, the engineering simulation model is constructed according to the structural data, material parameters, component parameters and component distribution parameters of the printed circuit board.

[0015] Further, multiple simulation working condition models are constructed, which specifically include the following steps:

[0016] S201, calculating the parameters of the printed circuit board when it is working at maximum power to obtain limit simulation parameter data;

[0017] S202, constructing the extreme operating condition model according to the extreme simulation parameter data;

[0018] S203, calculating the parameters of the printed circuit board when it works at rated power to obtain normal simulation parameter data;

[0019] S204. Construct the normal operating condition model according to the normal simulation parameter data; wherein the extreme operating condition model and the normal operating condition model are both the simulation operating condition models.

[0020] Further, the engineering simulation model is subjected to thermal simulation calculations in turn under a plurality of simulation working condition models to obtain thermal simulation results, which specifically includes the following steps:

[0021] S301, using finite element analysis software to perform static load thermal analysis on the engineering simulation model under the extreme working condition model to obtain thermal power density simulation data of the printed circuit board;

[0022] S302, marking the analysis position of the printed circuit board according to the thermal power density simulation data;

[0023] S303, using finite element analysis software to perform dynamic load thermal analysis on the engineering simulation model under the normal operating condition model to obtain transient temperature simulation data at the analysis position;

[0024] S304: Generate the thermal simulation result according to the transient temperature simulation data.

[0025] Further, generating the thermal simulation result according to the transient temperature simulation data specifically includes the following steps:

[0026] Generating a plan view of the printed circuit board according to the engineering simulation model in the finite element analysis software;

[0027] In the finite element analysis software, a thermal map is generated using the transient temperature simulation data and the plane diagram; wherein the thermal simulation result is the thermal map.

[0028] Further, generating thermal simulation correction parameter data according to the thermal simulation result specifically includes the following steps:

[0029] Calculating the heating coefficient of each point on the printed circuit board according to the thermal map;

[0030] The simulation correction parameter data is calculated according to the heating coefficient of each point of the printed circuit board.

[0031] Further, the heating coefficient of each point of the printed circuit board is calculated according to the thermal map, which specifically includes the following steps:

[0032] Build computer vision recognition models;

[0033] Using the computer vision recognition model to identify the grayscale value of each point on the thermal map;

[0034] The heating coefficient of each point is calculated according to the gray value of each point on the thermal map.

[0035] In order to solve the above technical problems, the present invention also provides a printed circuit board thermal simulation system, and its specific technical solution is as follows:

[0036] A printed circuit board thermal simulation system, comprising:

[0037] A model building module is used to build an engineering simulation model of a printed circuit board based on a computer-aided design method; and to build multiple simulation working condition models;

[0038] A simulation execution module performs thermal simulation calculations on the engineering simulation model in turn under a plurality of simulation working condition models to obtain thermal simulation results;

[0039] A result calculation module, generating thermal simulation correction parameter data according to the thermal simulation result;

[0040] A model correction module corrects the engineering simulation model according to the thermal simulation correction parameter data.

[0041] In order to solve the above technical problems, the present invention also provides a storage medium, and its specific technical solution is as follows:

[0042] A storage medium storing a computer program or a computer instruction, wherein when the computer program or the computer instruction is executed by a processor of a computer, the steps of the printed circuit board thermal simulation method as claimed in any one of claims 1 to 7 are implemented.

[0043] In order to solve the above technical problems, the present invention further provides a computer, and its specific technical solution is as follows:

[0044] A computer comprises a memory and one or more processors, wherein the memory stores executable codes, and when one or more of the processors execute the executable codes, the steps of the printed circuit board thermal simulation method as claimed in any one of claims 1 to 7 are implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A flowchart of a printed circuit board thermal simulation method according to an embodiment of the present invention;

[0046] Figure 2 It is a thermal map generated in the finite element analysis software in an embodiment of the present invention;

[0047] Figure 3 Schematic diagram of the structure of a printed circuit board thermal simulation system in an embodiment of the present invention. DETAILED DESCRIPTION

[0048] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0049] Example 1

[0050] like Figure 1 As shown, this embodiment provides a printed circuit board thermal simulation method, comprising the following steps:

[0051] S1. Construct an engineering simulation model of a printed circuit board based on computer-aided design methods;

[0052] The engineering simulation model of printed circuit board is constructed based on computer-aided design method, specifically:

[0053] Based on a computer-aided design method, the engineering simulation model is constructed according to the structural data, material parameters, component parameters and component distribution parameters of the printed circuit board.

[0054] S2. Construct multiple simulation working condition models;

[0055] Constructing multiple simulation condition models includes the following steps:

[0056] S201. Calculate the parameters of the printed circuit board when it is working at maximum power to obtain extreme simulation parameter data; wherein the parameters of the printed circuit board when it is working at maximum power include the parameters of all electrical components on the entire printed circuit board when they are working at maximum power.

[0057] S202, constructing the extreme operating condition model according to the extreme simulation parameter data;

[0058] S203, calculating the parameters of the printed circuit board when working at rated power to obtain normal simulation parameter data; wherein the parameters of the printed circuit board at rated power include the parameters of all electrical components on the entire printed circuit board when working at rated power.

[0059] S204, constructing the normal operating condition model according to the normal simulation parameter data; the extreme operating condition model and the normal operating condition model are both the simulation operating condition models.

[0060] S3, performing thermal simulation calculations on the engineering simulation model in turn under a plurality of simulation working condition models to obtain thermal simulation results;

[0061] The engineering simulation model is sequentially subjected to thermal simulation calculations under a plurality of simulation working condition models to obtain thermal simulation results, specifically comprising the following steps:

[0062] S301, using finite element analysis software to perform static load thermal analysis on the engineering simulation model under the extreme working condition model to obtain thermal power density simulation data of the printed circuit board;

[0063] S302, marking the analysis position of the printed circuit board according to the thermal power density simulation data;

[0064] S303, using finite element analysis software to perform dynamic load thermal analysis on the engineering simulation model under the normal operating condition model to obtain transient temperature simulation data at the analysis position;

[0065] S304: Generate the thermal simulation result according to the transient temperature simulation data.

[0066] Generating the thermal simulation result according to the transient temperature simulation data specifically includes the following steps:

[0067] Generating a plan view of the printed circuit board according to the engineering simulation model in the finite element analysis software;

[0068] In the finite element analysis software, a thermal map is generated using the transient temperature simulation data and the plane diagram; Figure 2 As shown, the thermal simulation result is the thermal diagram.

[0069] S4, generating thermal simulation correction parameter data according to the thermal simulation results;

[0070] Generating thermal simulation correction parameter data according to the thermal simulation results specifically includes the following steps:

[0071] Calculating the heating coefficient of each point on the printed circuit board according to the thermal map;

[0072] The simulation correction parameter data is calculated according to the heating coefficient of each point of the printed circuit board.

[0073] In some embodiments, calculating the heating coefficient of each point of the printed circuit board according to the thermal map specifically includes the following steps:

[0074] Build computer vision recognition models;

[0075] Using the computer vision recognition model to identify the grayscale value of each point on the thermal map;

[0076] The heating coefficient of each point is calculated according to the gray value of each point on the thermal map.

[0077] Calculating the heating coefficient of each point according to the gray value of each point on the thermal map specifically includes the following steps:

[0078] Establishing a rectangular coordinate system with a vertex of an angle of the heat map as a point of the rectangular coordinate system;

[0079] By inputting a plurality of coordinate values ​​on a preset rectangular coordinate system and the heat map into the computer vision recognition model, the grayscale values ​​at the plurality of coordinate values ​​can be obtained.

[0080] The coordinate values ​​of the electronic components corresponding to the coordinate values ​​are obtained according to the design parameters of the printed circuit board, so that the heating coefficient of the electronic components at the corresponding coordinate values ​​can be obtained, and the temperature value of the electronic components at the electronic components can be calculated according to the heating coefficient; it is possible to judge whether the placement of the electronic components is reasonable according to their heating coefficient; for example, when the temperature value of the electronic components at the target coordinate values ​​is higher than the rated operating temperature value of the electronic components, it is determined that the placement of the electronic components is unreasonable and needs to be adjusted. This embodiment uses computer vision to identify the grayscale value of the thermal map and the coordinate position corresponding to the grayscale value to calculate the thermal value or heating coefficient of the electronic components at the corresponding coordinate position. Compared with the traditional thermal simulation method of the circuit board, the present invention can reduce the tediousness and labor intensity of manually matching the points on the thermal map with the electronic components, reduce the thermal simulation analysis time of the circuit board, and improve the thermal simulation efficiency of the circuit board.

[0081] S5. Correcting the engineering simulation model according to the thermal simulation correction parameter data.

[0082] The embodiment of the present invention uses a computer-aided design method to perform engineering modeling and thermal simulation on a printed circuit board to obtain a thermal distribution, and then improves the engineering model according to the thermal distribution, and finally assists the production and design of the printed circuit board through the engineering model; avoids the disadvantage of a long design and verification cycle caused by directly producing samples for thermal analysis during the design process of the circuit board, thereby reducing the thermal analysis cycle of the printed circuit board.

[0083] like Figure 3 As shown, in some embodiments, a printed circuit board thermal simulation system is also provided, comprising:

[0084] A model building module is used to build an engineering simulation model of a printed circuit board based on a computer-aided design method; and to build multiple simulation working condition models;

[0085] A simulation execution module performs thermal simulation calculations on the engineering simulation model in turn under a plurality of simulation working condition models to obtain thermal simulation results;

[0086] A result calculation module, generating thermal simulation correction parameter data according to the thermal simulation result;

[0087] A model correction module corrects the engineering simulation model according to the thermal simulation correction parameter data.

[0088] The model construction module, simulation execution module, result calculation module and model correction module may all be computer program modules with corresponding functions, may all be computers with corresponding functions, or may all be hardware modules or hardware devices with corresponding functions.

[0089] Example 2

[0090] Based on Example 1, this embodiment provides a storage medium, which stores a computer program or computer instructions. When the computer program or the computer instructions are executed by a processor of a computer, the steps of the above-mentioned printed circuit board thermal simulation method are implemented.

[0091] The storage medium may be an internal storage unit of any device with data processing capability described in any of the foregoing embodiments, such as a hard disk or a memory. The storage medium may also be an external storage device of any device with data processing capability, such as a plug-in hard disk, a smart memory card, an SD card, a flash memory card, etc. equipped on the device. Furthermore, the storage medium may also include both an internal storage unit and an external storage device of any device with data processing capability. The computer-readable storage medium is used to store the computer program and other programs and data required by any device with data processing capability, and may also be used to temporarily store data that has been output or is to be output.

[0092] Example 3

[0093] Based on Example 1, this embodiment provides a computer, including a memory and one or more processors, wherein the memory stores executable code, and when one or more of the processors execute the executable code, the steps of the printed circuit board thermal simulation method in Example 1 are implemented.

[0094] The memory may be an internal storage unit of any device with data processing capability described in any of the aforementioned embodiments, such as a hard disk or a memory. The memory may also be an external storage device of any device with data processing capability, such as a plug-in hard disk, a smart memory card, an SD card, a flash memory card, etc. equipped on the device. Furthermore, the memory may include both an internal storage unit and an external storage device of any device with data processing capability. The memory is used to store the computer program and other programs and data required by any device with data processing capability, and may also be used to temporarily store data that has been output or is to be output.

[0095] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the concept and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A printed circuit board thermal simulation method, characterized in that: The steps include: S1. Construct an engineering simulation model of a printed circuit board based on computer-aided design methods; S2. Construct multiple simulation working condition models; S3, performing thermal simulation calculations on the engineering simulation model in turn under a plurality of simulation working condition models to obtain thermal simulation results; S4, generating thermal simulation correction parameter data according to the thermal simulation results; S5. Correcting the engineering simulation model according to the thermal simulation correction parameter data.

2. The printed circuit board thermal simulation method according to claim 1, characterized in that: The engineering simulation model of printed circuit board is constructed based on computer-aided design method, specifically: Based on a computer-aided design method, the engineering simulation model is constructed according to the structural data, material parameters, component parameters and component distribution parameters of the printed circuit board.

3. The printed circuit board thermal simulation method according to claim 2, characterized in that: Constructing multiple simulation condition models includes the following steps: S201, calculating the parameters of the printed circuit board when it is working at maximum power to obtain limit simulation parameter data; S202, constructing the extreme operating condition model according to the extreme simulation parameter data; S203, calculating the parameters of the printed circuit board when it works at rated power to obtain normal simulation parameter data; S204, constructing the normal operating condition model according to the normal simulation parameter data; Among them, the extreme operating condition model and the normal operating condition model are both the simulation operating condition models.

4. The printed circuit board thermal simulation method according to claim 3, characterized in that: The engineering simulation model is sequentially subjected to thermal simulation calculations under a plurality of simulation working condition models to obtain thermal simulation results, specifically comprising the following steps: S301, using finite element analysis software to perform static load thermal analysis on the engineering simulation model under the extreme working condition model to obtain thermal power density simulation data of the printed circuit board; S302, marking the analysis position of the printed circuit board according to the thermal power density simulation data; S303, using finite element analysis software to perform dynamic load thermal analysis on the engineering simulation model under the normal operating condition model to obtain transient temperature simulation data at the analysis position; S304: Generate the thermal simulation result according to the transient temperature simulation data.

5. The printed circuit board thermal simulation method according to claim 4, characterized in that: Generating the thermal simulation result according to the transient temperature simulation data specifically includes the following steps: Generating a plan view of the printed circuit board according to the engineering simulation model in the finite element analysis software; In the finite element analysis software, a thermal map is generated using the transient temperature simulation data and the plane diagram; wherein the thermal simulation result is the thermal map.

6. The printed circuit board thermal simulation method according to claim 5, characterized in that: Generating thermal simulation correction parameter data according to the thermal simulation results specifically includes the following steps: Calculating the heating coefficient of each point on the printed circuit board according to the thermal map; The simulation correction parameter data is calculated according to the heating coefficient of each point of the printed circuit board.

7. The printed circuit board thermal simulation method according to claim 6, characterized in that: Calculating the heating coefficient of each point of the printed circuit board according to the thermal map specifically includes the following steps: Build computer vision recognition models; Using the computer vision recognition model to identify the grayscale value of each point on the thermal map; The heating coefficient of each point is calculated according to the gray value of each point on the thermal map.

8. A printed circuit board thermal simulation system, characterized in that: include: A model building module, used for building an engineering simulation model of a printed circuit board based on a computer-aided design method; Construct multiple simulation working condition models; A simulation execution module performs thermal simulation calculations on the engineering simulation model in turn under a plurality of simulation working condition models to obtain thermal simulation results; A result calculation module, generating thermal simulation correction parameter data according to the thermal simulation result; A model correction module corrects the engineering simulation model according to the thermal simulation correction parameter data.

9. A storage medium, characterized in that: The storage medium stores a computer program or a computer instruction, and when the computer program or the computer instruction is executed by a processor of a computer, the steps of the printed circuit board thermal simulation method according to any one of claims 1 to 7 are implemented.

10. A computer, characterized in that: It comprises a memory and one or more processors, wherein the memory stores executable codes, and when one or more processors execute the executable codes, the steps of the printed circuit board thermal simulation method according to any one of claims 1 to 7 are implemented.

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