Chip material identifying and tracing system and method

Abstract

The invention relates to the technical field of material tracing, in particular to a chip material identifying and tracing system and method.The chip material identifying and tracing system comprises an information acquisition module, an identification code module, a database module, a tracing module and a monitoring module; and the database module stores the identity data and the identification code of the chip material, and when the chip material needs to be traced, the traceability module obtains the identity information of the chip material by scanning the identification code, so that rapid traceability of the chip material is realized, the traceability efficiency of the chip material is improved, and the traceability efficiency of the chip material is improved. Therefore, the problem that the cause of the quality problem cannot be quickly traced after the quality problem occurs is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of material tracing, and in particular to a chip material identification and tracing system and method. Background Art

[0002] No matter how strict the quality control is in the chip testing process, there is still the possibility of chip defects in probability theory. In order to deal with potential quality issues of customers and trace the production history of chips leaving the factory, the chip production process should be recorded as detailed as possible.

[0003] At present, chips are generally produced in batches, and product traceability can only be based on the batch level. It is rare to trace a single product, and it is impossible to conduct detailed traceability of factors such as personnel, machines, materials, process methods, and testing methods involved in the entire production process cycle of a single product.

[0004] When quality problems occur, the causes cannot be traced back quickly, resulting in reduced chip traceability efficiency. Summary of the invention

[0005] The purpose of the present invention is to provide a chip material identification and tracing system and method, aiming to solve the problem that the cause of a quality problem cannot be quickly traced after it occurs.

[0006] To achieve the above-mentioned object, in a first aspect, the present invention provides a chip material identification and tracing system, comprising an information collection module, an identification code module, a database module, a tracing module and a monitoring module, wherein the information collection module, the identification code module, the database module, the tracing module and the monitoring module are connected in sequence;

[0007] The information collection module is used to collect chip material identity data;

[0008] The identification code module generates an identification code based on the chip material identity data;

[0009] The database module is used to store and back up the chip material identity data and the identification code to obtain backup data;

[0010] The tracing module identifies and marks the chip material based on the backup data;

[0011] The monitoring module is used to monitor and record the working data of the tracing module.

[0012] The information collection module includes a chip material code collection unit, a chip material purchase information collection unit, a chip material detection data collection unit and a collection unit. The chip material code collection unit, the chip material purchase information collection unit and the chip material detection data collection unit are respectively connected to the collection unit;

[0013] The chip material code collection unit is used to collect the chip material code;

[0014] The chip material procurement information collection unit is used to collect procurement information of chip materials;

[0015] The chip material detection data acquisition unit is used to collect monitoring data of chip materials;

[0016] The collection unit is used to collect the code, the purchase information and the monitoring data to obtain chip material identity data.

[0017] Wherein, the identification code module comprises an input unit, a data processing unit and an identification code generating unit, and the input unit, the data processing unit and the identification code generating unit are connected in sequence;

[0018] The input unit is used to input the chip material identity data;

[0019] The data processing unit is used to sort and convert the chip material identity data to obtain conversion data;

[0020] The identification code generating unit generates an identification code based on the conversion data.

[0021] Wherein, the database module comprises an integration unit, a date marking unit and a data storage unit, and the integration unit, the date marking unit and the data storage unit are connected in sequence;

[0022] The integration unit generates backup data based on the identification code and the chip material identity data;

[0023] The date marking unit is used to mark the date of the backup data;

[0024] The data storage unit is used to store the backup data marked with a date.

[0025] Wherein, the traceability module includes a scanning unit, a data judgment unit and a chip material marking unit, and the scanning unit, the data judgment unit and the chip material marking unit are connected in sequence;

[0026] The scanning unit is used to scan the identification code to obtain the chip material identity data;

[0027] The data judgment unit performs chip material verification on the chip material identity data based on the backup data;

[0028] The chip material marking unit performs entry and exit marking on the chip material identity data, and returns the marking data to the database module for backup.

[0029] Wherein, the monitoring module includes an operation data recording unit, a video acquisition unit and a data backup unit, and the operation data recording unit and the video acquisition unit are respectively connected to the data backup unit;

[0030] The operation data recording unit is used to record the operation data of the tracing module;

[0031] The video acquisition unit is used to record the operation video of the tracing module;

[0032] The data backup unit is used to back up the operation data and the operation video.

[0033] In a second aspect, a chip material identification and tracing method is provided, which is used in the chip material identification and tracing system described in the first aspect, and comprises the following steps:

[0034] The information collection module collects chip material identity data;

[0035] The identification code module generates an identification code based on the chip material identity data;

[0036] The database module stores and backs up the chip material identity data and the identification code to obtain backup data;

[0037] The tracing module identifies and traces the chip material based on the backup data.

[0038] A chip material identification and tracing system of the present invention includes an information collection module, an identification code module, a database module, a tracing module and a monitoring module, wherein the information collection module is used to collect chip material identity data; the identification code module generates an identification code based on the chip material identity data; the database module is used to store and back up the chip material identity data and the identification code to obtain backup data; the tracing module identifies and traces the chip material based on the backup data; and the monitoring module is used to monitor and record the working data of the tracing module. When the chip material is put into storage, an identification code is generated by the chip material identity data collected from the chip material, and the chip material identity data and the identification code are stored by the database module. When the chip material needs to be traced, the tracing module obtains the identity information of the chip material by scanning the identification code, thereby realizing rapid tracing of the chip material and improving the efficiency of tracing the chip material, thereby solving the problem that the cause of the quality problem cannot be quickly traced after the quality problem occurs. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0040] Figure 1 It is a schematic diagram of a chip material identification and tracing system provided by the present invention.

[0041] Figure 2 It is a schematic diagram of the information collection module.

[0042] Figure 3 is a schematic diagram of the identification code module.

[0043] Figure 4 It is a schematic diagram of the database module.

[0044] Figure 5 It is a schematic diagram of the traceability module.

[0045] Figure 6 is a schematic diagram of the monitoring module.

[0046] Figure 7 It is a schematic diagram of a data judgment unit.

[0047] Figure 8 It is a schematic diagram of a chip material marking unit.

[0048] Fig. 9The present invention provides a flow chart of a chip material identification and tracing method.

[0049] 1-information acquisition module, 2-identification code module, 3-database module, 4-traceability module, 5-monitoring module, 11-chip material coding acquisition unit, 12-chip material procurement information acquisition unit, 13-chip material detection data acquisition unit, 14-collection unit, 21-input unit, 22-data processing unit, 23-identification code generation unit, 31-integration unit, 32-date marking unit, 33-data storage unit, 41-scanning unit, 42-data judgment unit, 43-chip material marking unit, 51-operation data recording unit, 52-video acquisition unit, 53-data backup unit, 421-identification subunit, 422-query subunit, 423-result output subunit, 431-operator recording subunit, 432-chip material in and out recording subunit, 433-data storage subunit. DETAILED DESCRIPTION

[0050] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0051] See also Figures 1 to 8 In a first aspect, the present invention provides a chip material identification and tracing system, comprising an information collection module 1, an identification code module 2, a database module 3, a tracing module 4 and a monitoring module 5, wherein the information collection module 1, the identification code module 2, the database module 3, the tracing module 4 and the monitoring module 5 are connected in sequence;

[0052] The information collection module 1 is used to collect chip material identity data;

[0053] The identification code module 2 generates an identification code based on the chip material identity data;

[0054] The database module 3 is used to store and back up the chip material identity data and the identification code to obtain backup data;

[0055] The tracing module 4 identifies and marks the chip material based on the backup data;

[0056] The monitoring module 5 is used to monitor and record the working data of the tracing module 4 .

[0057] In this embodiment, the information collection module 1 is used to collect chip material identity data; the identification code module 2 generates an identification code based on the chip material identity data; the database module 3 is used to store and back up the chip material identity data and the identification code to obtain backup data; the traceability module 4 identifies and marks the chip material based on the backup data; and the monitoring module 5 is used to monitor and record the working data of the traceability module 4. When the chip material is put into storage, an identification code is generated by the chip material identity data collected from the chip material, and the chip material identity data and the identification code are stored by the database module 3. When the chip material needs to be traced, the traceability module 4 obtains the identity information of the chip material by scanning the identification code, so as to realize the rapid traceability of the chip material and improve the traceability efficiency of the chip material, thereby solving the problem that the cause of the quality problem cannot be quickly traced after the quality problem occurs.

[0058] Further, the information collection module 1 includes a chip material code collection unit 11, a chip material procurement information collection unit 12, a chip material detection data collection unit 13 and a collection unit 14. The chip material code collection unit 11, the chip material procurement information collection unit 12 and the chip material detection data collection unit 13 are respectively connected to the collection unit 14;

[0059] The chip material code collection unit 11 is used to collect the chip material code;

[0060] The chip material procurement information collection unit 12 is used to collect procurement information of chip materials;

[0061] The chip material detection data collection unit 13 is used to collect monitoring data of chip materials;

[0062] The collecting unit 14 is used to collect the code, the purchasing information and the monitoring data to obtain chip material identity data.

[0063] In this embodiment, when it is necessary to collect information on chip materials, the chip material coding, procurement information and detection data are collected respectively by the chip material coding collection unit 11, the chip material procurement information collection unit 12 and the chip material detection data collection unit 13, and the collection unit 14 collects the coding, procurement information and monitoring data to obtain chip material identity data.

[0064] Further, the identification code module 2 includes an input unit 21, a data processing unit 22 and an identification code generating unit 23, and the input unit 21, the data processing unit 22 and the identification code generating unit 23 are connected in sequence;

[0065] The input unit 21 is used to input the chip material identity data;

[0066] The data processing unit 22 is used to sort and convert the chip material identity data to obtain conversion data;

[0067] The identification code generating unit 23 generates an identification code based on the conversion data.

[0068] In this embodiment, when generating the identification code of the chip material, the chip material identity data is input through the input unit 21, the data processing unit 22 organizes and converts the chip material identity data to obtain conversion data, and the identification code generation unit 23 generates an identification code based on the conversion data.

[0069] Further, the database module 3 includes an integration unit 31, a date marking unit 32 and a data storage unit 33, and the integration unit 31, the date marking unit 32 and the data storage unit 33 are connected in sequence;

[0070] The integration unit 31 generates backup data based on the identification code and the chip material identity data;

[0071] The date marking unit 32 is used to mark the date of the backup data;

[0072] The data storage unit 33 is used to store the backup data with a date marked.

[0073] In this embodiment, when establishing the database, the integration unit 31 generates backup data based on the identification code and the chip material identity data, the date marking unit 32 marks the date of the backup data, and the data storage unit 33 stores the backup data after date marking.

[0074] Further, the traceability module 4 includes a scanning unit 41, a data judgment unit 42 and a chip material marking unit 43, and the scanning unit 41, the data judgment unit 42 and the chip material marking unit 43 are connected in sequence;

[0075] The scanning unit 41 is used to scan the identification code to obtain the chip material identity data;

[0076] The data judgment unit 42 performs chip material verification on the chip material identity data based on the backup data;

[0077] The chip material marking unit 43 performs entry and exit marking on the chip material identity data, and returns the marking data to the database module 3 for backup.

[0078] In this embodiment, when tracing the chip material, the scanning unit 41 scans the identification code to obtain the chip material identity data, and the data judgment unit 42 performs chip material verification on the chip material identity data based on the backup data; the data judgment unit 42 includes an identification subunit 421, a query subunit 422 and a result output subunit 423, the identification subunit 421 is used to identify the identity data of the chip material to obtain an identification feature, the query subunit 422 queries the corresponding chip material identity data in the database module 3 based on the identification feature, and the result output subunit 423 outputs all information of the chip material based on the query result; The chip material marking unit 43 marks the chip material identity data when it enters and leaves the factory, and returns the marking data to the database module 3 for backup. The chip material marking unit 43 includes an operator recording subunit 431, a chip material entry and exit recording subunit 432 and a data transmission subunit 433. The operator recording subunit 431 is used to record the operator's identity information. The chip material entry and exit recording subunit 432 is used to record the chip material's inbound and outbound data. The data transmission subunit 433 is used to transmit the chip material's inbound and outbound data and the operator's identity information to the database module 3 for storage and backup, so as to achieve detailed records of the material's usage.

[0079] Further, the monitoring module 5 includes an operation data recording unit 51, a video acquisition unit 52 and a data backup unit 53, and the operation data recording unit 51 and the video acquisition unit 52 are respectively connected to the data backup unit 53;

[0080] The operation data recording unit 51 is used to record the operation data of the tracing module 4;

[0081] The video acquisition unit 52 is used to record the operation video of the tracing module 4;

[0082] The data backup unit 53 is used to back up the operation data and the operation video.

[0083] In this embodiment, the operation data recording unit 51 records the operation data of the traceability module 4, the video acquisition unit 52 records the operation video of the traceability module 4, and the data backup unit 53 backs up the operation data and the operation video; by monitoring the traceability module 4, its working failure is prevented from causing abnormal traceability of the chip material, so as to facilitate the administrator's later maintenance.

[0084] See also Fig. 9In a second aspect, a chip material identification and tracing method is provided, which is used in the chip material identification and tracing system described in the first aspect, and comprises the following steps:

[0085] S1 information collection module 1 collects chip material identity data;

[0086] Specifically, when it is necessary to collect information about chip materials, the chip material coding, procurement information and detection data are collected respectively by the chip material coding collection unit 11, the chip material procurement information collection unit 12 and the chip material detection data collection unit 13, and the collection unit 14 collects the coding, procurement information and monitoring data to obtain chip material identity data.

[0087] S2 identification code module 2 generates an identification code based on the chip material identity data;

[0088] Specifically, when generating the identification code of the chip material, the chip material identity data is input through the input unit 21, the data processing unit 22 sorts and converts the chip material identity data to obtain conversion data, and the identification code generation unit 23 generates an identification code based on the conversion data.

[0089] S3 database module 3 stores and backs up the chip material identity data and the identification code to obtain backup data;

[0090] Specifically, the integration unit 31 generates backup data based on the identification code and the chip material identity data, the date marking unit 32 marks the date of the backup data, and the data storage unit 33 stores the backup data after the date marking.

[0091] S4 tracing module 4 identifies and traces the chip material based on the backup data.

[0092] Specifically, when tracing the chip material, the scanning unit 41 scans the identification code to obtain the chip material identity data, the data judgment unit 42 performs chip material verification on the chip material identity data based on the backup data, and the chip material marking unit 43 marks the chip material identity data for entry and exit, and returns the marking data to the database module 3 for backup.

[0093] The above disclosure is only a preferred embodiment of a chip material identification and tracing system and method of the present invention. Of course, this cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiments and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A chip material identification and tracing system, characterized in that: It includes an information collection module, an identification code module, a database module, a tracing module and a monitoring module, wherein the information collection module, the identification code module, the database module, the tracing module and the monitoring module are connected in sequence; The information collection module is used to collect chip material identity data; The identification code module generates an identification code based on the chip material identity data; The database module is used to store and back up the chip material identity data and the identification code to obtain backup data; The tracing module identifies and marks the chip material based on the backup data; The monitoring module is used to monitor and record the working data of the tracing module.

2. The chip material identification and tracing system according to claim 1, characterized in that: The information collection module includes a chip material code collection unit, a chip material procurement information collection unit, a chip material detection data collection unit and a collection unit. The chip material code collection unit, the chip material procurement information collection unit and the chip material detection data collection unit are respectively connected to the collection unit; The chip material code collection unit is used to collect the chip material code; The chip material procurement information collection unit is used to collect procurement information of chip materials; The chip material detection data acquisition unit is used to collect monitoring data of chip materials; The collection unit is used to collect the code, the purchase information and the monitoring data to obtain chip material identity data.

3. The chip material identification and tracing system according to claim 2, characterized in that: The identification code module comprises an input unit, a data processing unit and an identification code generating unit, wherein the input unit, the data processing unit and the identification code generating unit are connected in sequence; The input unit is used to input the chip material identity data; The data processing unit is used to sort and convert the chip material identity data to obtain conversion data; The identification code generating unit generates an identification code based on the conversion data.

4. The chip material identification and tracing system according to claim 3, characterized in that: The database module includes an integration unit, a date marking unit and a data storage unit, and the integration unit, the date marking unit and the data storage unit are connected in sequence; The integration unit generates backup data based on the identification code and the chip material identity data; The date marking unit is used to mark the date of the backup data; The data storage unit is used to store the backup data marked with a date.

5. The chip material identification and tracing system according to claim 4, characterized in that: The traceability module includes a scanning unit, a data judgment unit and a chip material marking unit, and the scanning unit, the data judgment unit and the chip material marking unit are connected in sequence; The scanning unit is used to scan the identification code to obtain the chip material identity data; The data judgment unit performs chip material verification on the chip material identity data based on the backup data; The chip material marking unit performs entry and exit marking on the chip material identity data, and returns the marking data to the database module for backup.

6. The chip material identification and tracing system according to claim 5, characterized in that: The monitoring module includes an operation data recording unit, a video acquisition unit and a data backup unit, wherein the operation data recording unit and the video acquisition unit are respectively connected to the data backup unit; The operation data recording unit is used to record the operation data of the tracing module; The video acquisition unit is used to record the operation video of the tracing module; The data backup unit is used to back up the operation data and the operation video.

7. A chip material identification and tracing method, used in the chip material identification and tracing system according to any one of claims 1 to 6, characterized in that: The following steps are involved: The information collection module collects chip material identity data; The identification code module generates an identification code based on the chip material identity data; The database module stores and backs up the chip material identity data and the identification code to obtain backup data; The tracing module identifies and traces the chip material based on the backup data.

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