A high-precision welding head pressure device for high-performance die bonding machines

Abstract

The present invention relates to the technical field of welding heads of crystal bonders, and discloses a high-precision welding head pressure device for high-performance crystal bonders, including a bottom plate, a fixing frame fixedly connected to the top of the bottom plate, a welding frame fixedly connected to the top of the fixing frame, a motor fixedly connected to the top of the bottom plate, a gear fixedly connected to the output end of the motor, and a leakage hole opened on the lower surface of the fixing frame. After placing a wafer into the interior of the welding frame, the present invention starts the motor to start working, the motor drives the gear to rotate, and the gear drives the extrusion component to start working when rotating, and the welding arm in the extrusion component is used to weld the wafer. At the same time, the extrusion component will squeeze and fix the wafer to avoid poor adhesion of the wafer during welding, resulting in reduced welding quality of the wafer. After the wafer is welded, the extrusion component moves upward and drives the material taking component to move upward at the same time. At this time, the material taking component will push the welded wafer to move upward, which is convenient for taking the welded wafer.

Description

Technical Field

[0001] The invention relates to the technical field of welding heads for crystal bonders, and in particular to a high-precision welding head pressure device for high-performance crystal bonders. Background Art

[0002] The crystal bonding machine is used for ultrasonic welding equipment. The crystal bonding machine is mainly used for the lead cabinet frame pressing plate of various gold wire ultrasonic welding equipment, as well as various nozzles, ejectors, dispensing heads, porcelain nozzles, pass needles, motors, carbon brushes, encoders, transmission belts of various chip mounting equipment, various spare parts of automation equipment, instruments, meters, etc.

[0003] During welding, the solid crystal needs to be placed on the surface of the welding table and then welded using the welding head of the solid crystal machine. The solid crystal needs to be extruded during welding to avoid gaps in the solid crystal during welding, which may cause quality problems in welding. The current extrusion device generally extrude and fix the center of the solid crystal. Excessive force on the center of the solid crystal may easily cause the end of the solid crystal to warp, thereby causing quality problems in the welding of the solid crystal. Summary of the invention

[0004] The object of the present invention is to provide a high-precision welding head pressure device for a high-performance die bonder to solve the problems raised in the above-mentioned background technology.

[0005] To solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a high-precision welding head pressure device for a high-performance crystal bonder, comprising a bottom plate, a fixing frame fixedly connected to the top of the bottom plate, a welding frame fixedly connected to the top of the fixing frame, a motor fixedly connected to the top of the bottom plate, a gear fixedly connected to the output end of the motor, a leakage hole opened on the lower surface of the fixing frame, and further comprising:

[0007] An extrusion component, wherein the extrusion component comprises a meshing wheel, an inner wall of the meshing wheel is rotatably connected to the surface of the welding frame, a support frame is fixedly connected to the top of the support frame, an electric push rod is fixedly connected to the top of the support frame, and a welding arm is fixedly connected to the upper surface of the electric push rod;

[0008] A material taking component, the material taking component comprises a round hole rod, the bottom of the round hole rod is fixedly connected to the bottom of the inner wall of the fixing frame, a sliding hole is opened on the surface of the round hole rod, the inner wall of the round hole rod is slidably connected to a lifting rod, and the top of the lifting rod is fixedly connected to a welding plate;

[0009] A protection component, the protection component comprising a protection frame, a groove ring is fixedly connected to the bottom of the protection frame, and an extension frame is fixedly connected to the surface of the protection frame;

[0010] A cleaning component is arranged inside the welding frame.

[0011] Furthermore, the top of the welding frame is linked to the top of the fixing frame, the surface of the gear is meshed with the surface of the meshing wheel, and the end of the welding arm close to the electric push rod is adapted to the inner wall of the welding frame.

[0012] Further, the extrusion component includes a top plate, the end of the top plate is fixedly connected to the upper surface of the electric push rod, the top of the top plate is fixedly connected to a center rod, the bottom of the top plate is fixedly connected to an elastic rod, the bottom of the elastic rod is fixedly connected to a round frame, a positioning hole is opened on the surface of the round frame, the inner wall of the positioning hole is rotatably connected to a rotating shaft, the top of the inner wall of the round frame is fixedly connected to an elastic rod, and the bottom of the elastic rod is fixedly connected to an extrusion plate;

[0013] A telescopic rod is hinged on the surface of the extrusion plate, one end of the telescopic rod away from the extrusion plate is hinged to the surface of the rotating shaft, an elastic sheet is fixedly connected to the surface of the rotating shaft, and a contact rod is fixedly connected to the bottom of the elastic sheet.

[0014] Furthermore, the top plate is arranged above the welding arm, the bottom of the elastic rod extends to the bottom of the round frame, the elastic sheet is arranged at the outer end of the round frame, the contact rod is arranged below the extrusion plate, and the top of the telescopic rod is inclined toward the end away from the extrusion plate.

[0015] Furthermore, the material taking component includes a connecting plate, the connecting plate is rotatably connected to the surface of the center rod, one end of the connecting plate away from the center rod is fixedly connected to a rectangular frame, the bottom of the rectangular frame is fixedly connected to a telescopic plate, and one end of the telescopic plate away from the rectangular frame is fixedly connected to a linkage plate;

[0016] One end of the linkage plate away from the telescopic plate is fixedly connected to the surface of the lifting rod, and a limiting hole is provided on the surface of the fixing frame.

[0017] Furthermore, the surface of the linkage plate is slidably connected to the inner wall of the sliding hole, the welding plate is arranged inside the welding frame, the inner wall of the welding frame is provided with a circular groove, and the linkage plate extends from one end of the lifting rod to the outer end of the fixing frame.

[0018] Furthermore, the protective component comprises a round rod, the round rod is fixedly connected to the inner wall of the telescopic plate, a tripod is fixedly connected to the surface of the round rod, and a limiting frame is fixedly connected to the center of the tripod;

[0019] The bottom of the limiting frame is fixedly connected with an elastic telescopic frame, and the bottom of the elastic telescopic frame is fixedly connected with the top of the extension frame.

[0020] Furthermore, the end of the round rod passes through the telescopic plate and extends to the outer end of the telescopic plate, the bottom of the limit frame is arranged below the tripod, and the inner wall of the groove ring contacts the surface of the welding frame.

[0021] Further, the cleaning component comprises a rotating ring, the rotating ring is rotatably connected to the inner wall of the annular groove, and the inner wall of the rotating ring is fixedly connected to an inner ring;

[0022] The inner wall of the inner ring is fixedly connected with a cylindrical rod, the inner wall of the inner ring is fixedly connected with a right-angle plate, the right-angle plate contacts the inner wall of the welding frame, and the bottom of the right-angle plate contacts the bottom of the inner wall of the welding frame.

[0023] The present invention has the following beneficial effects:

[0024] After the wafer is placed inside the welding frame, the motor is started to work, the motor drives the gear to rotate, and the gear drives the extrusion component to start working when rotating, and the wafer is welded by using the welding arm in the extrusion component. At the same time, the extrusion component will squeeze and fix the wafer to avoid poor adhesion of the wafer during welding, resulting in reduced welding quality of the wafer. After the wafer welding is completed, the extrusion component moves upward and drives the material taking component to move upward at the same time. At this time, the material taking component will push the welded wafer to move upward, which is convenient for taking the welded wafer. When the extrusion component moves downward, it pushes the protective component to contact with the top of the welding frame to avoid sparks generated during welding from flying everywhere. When the extrusion component rotates, it pushes the cleaning component to rotate inside the welding frame, and the cleaning component is used to clean the inner wall of the welding frame to avoid impurities generated during welding from accumulating inside the welding frame.

[0025] The gear of the present invention drives the support frame to rotate through the meshing wheel, and when the electric push rod moves downward, it pushes the welding arm to enter the interior of the welding frame and align with the wafer. When the support frame rotates, the electric push rod drives the welding arm to rotate inside the welding frame, so that the welding arm can perform circumferential welding on the wafer, thereby improving the welding efficiency of the wafer. When the electric push rod moves downward, it pushes the circular frame to move downward through the elastic rod, and the circular frame pushes the extrusion plate to extrude and fix the wafer through the elastic rod, thereby improving the fit of the wafer during welding. When the extrusion plate is forced to move upward, the extrusion plate pushes the rotating shaft to rotate through the telescopic rod, and the rotating shaft pushes the elastic sheet to shrink toward the center when rotating. When the elastic sheet shrinks, it pushes the contact rod to extrude and fix the end of the wafer, thereby avoiding the situation where the end of the wafer is warped during welding.

[0026] The top plate of the present invention moves upward and pushes the rectangular frame upward through the connecting plate. When the rectangular frame moves upward, the telescopic plate pushes the linkage plate upward. When the linkage plate moves upward, the lifting rod pushes the welding plate upward, so that the welding plate can push the wafer upward to unload the welded wafer, and the telescopic plate can shrink when moving downward to avoid affecting the electric push rod to work on the welding arm.

[0027] When the telescopic plate of the present invention moves downward, the tripod is pushed downward by the round rod. When the tripod moves downward, the limit frame pushes the elastic telescopic frame downward. When the elastic telescopic frame moves downward, it pushes the protective frame to move. The groove ring at the bottom of the protective frame can contact the surface of the welding frame. The protective frame is used to protect the welding arm to prevent sparks generated by the welding arm during welding from flying everywhere.

[0028] After the welding arm of the present invention enters the inner wall of the welding frame, it will contact the inner wall of the inner ring. At this time, the welding arm will contact the surface of the cylindrical rod when rotating. The cylindrical rod will drive the rotating ring to rotate inside the circular ring groove as the welding arm rotates. When rotating, the inner ring pushes the right-angle plate to clean the inner wall of the welding frame. The waste after cleaning will be discharged through the leakage hole to avoid the waste from accumulating inside the welding frame.

[0029] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 It is a schematic diagram of the structure of the present invention;

[0033] Figure 3 It is a schematic diagram of the overall structure of the extruded component of the present invention;

[0034] Figure 4 This is a schematic diagram of the cross-sectional structure of the circular frame of the present invention;

[0035] Figure 5 This is a schematic diagram of the overall structure of the material taking component of the present invention;

[0036] Figure 6 For the present invention Figure 5 A magnified schematic diagram of part A in FIG.

[0037] Figure 7 This is a schematic diagram of the overall structure of the protective component of the present invention;

[0038] Figure 8 It is a schematic diagram of the overall structure of the cleaning component of the present invention.

[0039] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0040] In the figure: 1, bottom plate; 2, welding frame; 3, gear; 4, motor; 5, fixed frame; 6, leak hole; 7, extrusion component; 8, material taking component; 9, protection component; 10, cleaning component; 20, meshing wheel; 21, support frame; 22, electric push rod; 23, elastic rod; 24, center rod; 25, top plate; 26, welding arm; 27, round frame; 28, elastic rod; 29, telescopic rod; 30, extrusion plate; 31, contact rod; 32, elastic sheet; 33, Positioning hole; 34, rotating shaft; 40, connecting plate; 41, rectangular frame; 42, telescopic plate; 43, circular ring groove; 44, welding plate; 45, sliding hole; 46, lifting rod; 47, circular hole rod; 48, limiting hole; 49, linkage plate; 50, tripod; 51, extension frame; 52, groove ring; 53, elastic telescopic frame; 54, protective frame; 55, limiting frame; 56, round rod; 60, rotating ring; 61, cylindrical rod; 63, inner ring; 64, right-angle plate. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] See also Figure 1-Figure 8 As shown, the present invention is a high-precision welding head pressure device for a high-performance crystal bonding machine, comprising a bottom plate 1, a fixing frame 5 is fixedly connected to the top of the bottom plate 1, a welding frame 2 is fixedly connected to the top of the fixing frame 5, a motor 4 is fixedly connected to the top of the bottom plate 1, a gear 3 is fixedly connected to the output end of the motor 4, a leak hole 6 is opened on the lower surface of the fixing frame 5, and further comprising:

[0043] Extrusion component 7, the extrusion component 7 includes a meshing wheel 20, the inner wall of the meshing wheel 20 is rotatably connected to the surface of the welding frame 2, the top of the meshing wheel 20 is fixedly connected to a support frame 21, the top of the support frame 21 is fixedly connected to an electric push rod 22, and the upper surface of the electric push rod 22 is fixedly connected to a welding arm 26;

[0044] The material taking component 8 includes a round hole rod 47, the bottom of the round hole rod 47 is fixedly connected to the bottom of the inner wall of the fixing frame 5, a sliding hole 45 is opened on the surface of the round hole rod 47, a lifting rod 46 is slidably connected to the inner wall of the round hole rod 47, and a welding plate 44 is fixedly connected to the top of the lifting rod 46;

[0045] The protective component 9 includes a protective frame 54, and the bottom of the protective frame 54 is fixedly connected with a groove ring 52. After the wafer is placed inside the welding frame 2, the present invention starts the motor 4 to start working, and the motor 4 drives the gear 3 to rotate. When the gear 3 rotates, it drives the extrusion component 7 to start working, and the welding arm 26 in the extrusion component 7 is used to weld the wafer. At the same time, the extrusion component 7 will squeeze and fix the wafer to avoid poor adhesion of the wafer during welding, resulting in reduced welding quality of the wafer. After the wafer welding is completed, the extrusion component 7 moves upward and drives the material taking component 8 to move upward. At this time, the material taking component 8 will push the welded wafer to move upward, which is convenient for taking the welded wafer. When the extrusion component 7 moves downward, it pushes the protective component 9 to contact with the top of the welding frame 2 to avoid sparks generated during welding from flying around. When the extrusion component 7 rotates, it pushes the cleaning component 10 to rotate inside the welding frame 2, and the cleaning component 10 is used to clean the inner wall of the welding frame 2 to avoid impurities generated during welding from accumulating inside the welding frame 2. The surface of the protective frame 54 is fixedly connected with an extension frame 51;

[0046] A cleaning component 10 is arranged inside the welding frame 2 .

[0047] The top of the welding frame 2 is linked to the top of the fixing frame 5 , the surface of the gear 3 is meshed with the surface of the meshing wheel 20 , and one end of the welding arm 26 close to the electric push rod 22 is matched with the inner wall of the welding frame 2 .

[0048] The extrusion component 7 includes a top plate 25, the end of the top plate 25 is fixedly connected to the upper surface of the electric push rod 22, the top of the top plate 25 is fixedly connected to the center rod 24, the bottom of the top plate 25 is fixedly connected to the elastic rod 23, the bottom of the elastic rod 23 is fixedly connected to the round frame 27, the surface of the round frame 27 is provided with a positioning hole 33, the inner wall of the positioning hole 33 is rotatably connected to the rotating shaft 34, the gear 3 of the present invention drives the support frame 21 to rotate through the meshing wheel 20, and the electric push rod 22 pushes the welding arm 26 to enter the interior of the welding frame 2 and align with the wafer when it moves downward, and the welding arm 26 is driven to rotate inside the welding frame 2 through the electric push rod 22 when the support frame 21 rotates, so that the welding arm 26 can perform rounding on the wafer. Circumferential welding improves the welding efficiency of the wafer. When the electric push rod 22 moves downward, the circular frame 27 is pushed downward by the elastic rod 23. The circular frame 27 pushes the extrusion plate 30 to extrude and fix the wafer through the elastic rod 28 to improve the fit of the wafer during welding. When the extrusion plate 30 is forced to move upward, the extrusion plate 30 pushes the rotating shaft 34 to rotate through the telescopic rod 29. The rotating shaft 34 pushes the elastic sheet 32 ​​to shrink toward the center when rotating. The elastic sheet 32 ​​pushes the contact rod 31 to extrude and fix the end of the wafer when shrinking to avoid the end of the wafer from warping during welding. The top of the inner wall of the circular frame 27 is fixedly connected with the elastic rod 28, and the bottom of the elastic rod 28 is fixedly connected with the extrusion plate 30;

[0049] A telescopic rod 29 is hinged on the surface of the extrusion plate 30 , and one end of the telescopic rod 29 away from the extrusion plate 30 is hinged to the surface of the shaft 34 . An elastic sheet 32 ​​is fixedly connected to the surface of the shaft 34 , and a contact rod 31 is fixedly connected to the bottom of the elastic sheet 32 ​​.

[0050] The top plate 25 is arranged above the welding arm 26, the bottom of the elastic rod 28 extends to the bottom of the circular frame 27, the elastic sheet 32 ​​is arranged at the outer end of the circular frame 27, the contact rod 31 is arranged below the extrusion plate 30, and the top of the telescopic rod 29 is inclined toward the end away from the extrusion plate 30.

[0051] The material taking component 8 includes a connecting plate 40, which is rotatably connected to the surface of the center rod 24. The end of the connecting plate 40 away from the center rod 24 is fixedly connected to a rectangular frame 41, and the bottom of the rectangular frame 41 is fixedly connected to a telescopic plate 42. The top plate 25 of the present invention moves upward and pushes the rectangular frame 41 upward through the connecting plate 40. When the rectangular frame 41 moves upward, the telescopic plate 42 pushes the linkage plate 49 upward. When the linkage plate 49 moves upward, the lifting rod 46 pushes the welding plate 44 upward, so that the welding plate 44 can push the wafer to move upward, so as to unload the wafer after welding. The telescopic plate 42 can shrink when moving downward to avoid affecting the electric push rod 22 to work on the welding arm 26. The end of the telescopic plate 42 away from the rectangular frame 41 is fixedly connected to the linkage plate 49.

[0052] One end of the linkage plate 49 away from the telescopic plate 42 is fixedly connected to the surface of the lifting rod 46 , and a limiting hole 48 is provided on the surface of the fixing frame 5 .

[0053] The surface of the linkage plate 49 is slidably connected to the inner wall of the sliding hole 45 . The welding plate 44 is arranged inside the welding frame 2 . The inner wall of the welding frame 2 is provided with a circular groove 43 . The end of the linkage plate 49 away from the lifting rod 46 extends to the outer end of the fixing frame 5 .

[0054] The protection component 9 includes a round rod 56, the round rod 56 is fixedly connected to the inner wall of the telescopic plate 42, a tripod 50 is fixedly connected to the surface of the round rod 56, and a limiting frame 55 is fixedly connected to the center of the tripod 50;

[0055] The bottom of the limiting frame 55 is fixedly connected with an elastic telescopic frame 53. When the telescopic plate 42 of the present invention moves downward, the tripod 50 is pushed downward by the round rod 56. When the tripod 50 moves downward, the elastic telescopic frame 53 is pushed downward by the limiting frame 55. When the elastic telescopic frame 53 moves downward, it pushes the protective frame 54 to move. The groove ring 52 at the bottom of the protective frame 54 can contact the surface of the welding frame 2. The protective frame 54 is used to protect the welding arm 26 to prevent sparks generated by the welding arm 26 from splashing during welding. The bottom of the elastic telescopic frame 53 is fixedly connected to the top of the extension frame 51.

[0056] The end of the round rod 56 passes through the telescopic plate 42 and extends to the outer end of the telescopic plate 42 . The bottom of the limiting frame 55 is arranged below the tripod 50 . The inner wall of the groove ring 52 contacts the surface of the welding frame 2 .

[0057] The cleaning component 10 includes a rotating ring 60, which is rotatably connected to the inner wall of the annular groove 43, and an inner ring 63 is fixedly connected to the inner wall of the rotating ring 60;

[0058] The inner wall of the inner ring 63 is fixedly connected with a cylindrical rod 61. After the welding arm 26 of the present invention enters the inner wall of the welding frame 2, it will contact the inner wall of the inner ring 63. At this time, the welding arm 26 will contact the surface of the cylindrical rod 61 when rotating. The cylindrical rod 61 will drive the rotating ring 60 to rotate inside the circular groove 43 as the welding arm 26 rotates. When rotating, the inner ring 63 pushes the right-angle plate 64 to clean the inner wall of the welding frame 2. The waste after cleaning will be discharged through the leak hole 6 to avoid waste accumulation inside the welding frame 2. The inner wall of the inner ring 63 is fixedly connected with a right-angle plate 64. The right-angle plate 64 contacts the inner wall of the welding frame 2, and the bottom of the right-angle plate 64 contacts the bottom of the inner wall of the welding frame 2.

[0059] When in use, after placing the wafer into the interior of the welding frame 2, the motor 4 is started to work, the motor 4 drives the gear 3 to rotate, and the gear 3 drives the extrusion component 7 to start working when rotating, and the wafer is welded by using the welding arm 26 in the extrusion component 7. At the same time, the extrusion component 7 will squeeze and fix the wafer to avoid poor adhesion of the wafer during welding, resulting in reduced welding quality of the wafer. After the wafer welding is completed, the extrusion component 7 moves upward and drives the material taking component 8 to move upward. At this time, the material taking component 8 will push the welded wafer to move upward, which is convenient for taking the welded wafer. When the extrusion component 7 moves downward, it pushes the protective component 9 to contact with the top of the welding frame 2 to avoid sparks generated during welding from flying everywhere. When the extrusion component 7 rotates The cleaning component 10 is pushed to rotate inside the welding frame 2, and the cleaning component 10 is used to clean the inner wall of the welding frame 2 to prevent impurities generated during welding from accumulating inside the welding frame 2. The gear 3 drives the support frame 21 to rotate through the meshing wheel 20. When the electric push rod 22 moves downward, it pushes the welding arm 26 to enter the interior of the welding frame 2 and align with the wafer. When the support frame 21 rotates, the welding arm 26 is driven to rotate inside the welding frame 2 through the electric push rod 22, so that the welding arm 26 can perform circumferential welding on the wafer, thereby improving the welding efficiency of the wafer. When the electric push rod 22 moves downward, it pushes the circular frame 27 to move downward through the elastic rod 23. The circular frame 27 pushes the extrusion plate 30 to extrude and fix the wafer through the elastic rod 28, thereby improving the fit of the wafer during welding. When the extrusion plate 30 is forced to move upward, the extrusion plate 30 pushes the rotating shaft 34 to rotate through the telescopic rod 29. When the rotating shaft 34 rotates, it pushes the elastic sheet 32 ​​to shrink toward the center. When the elastic sheet 32 ​​shrinks, it pushes the contact rod 31 to squeeze and fix the end of the wafer to avoid the wafer from tilting up at the end during welding. The top plate 25 moves upward and pushes the rectangular frame 41 upward through the connecting plate 40. When the rectangular frame 41 moves upward, it pushes the linkage plate 49 upward through the telescopic plate 42. When the linkage plate 49 moves upward, it pushes the welding plate 44 upward through the lifting rod 46, so that the welding plate 44 can push the wafer to move upward, so as to unload the welded wafer. When the telescopic plate 42 moves downward, it can shrink to avoid affecting the electric push rod 22. When the welding arm 26 is working, the telescopic plate 42 pushes the tripod 50 downward through the round rod 56 when it moves downward, and the tripod 50 pushes the elastic telescopic frame 53 downward through the limit frame 55 when it moves downward, and the elastic telescopic frame 53 pushes the protective frame 54 to move when it moves downward, and the groove ring 52 at the bottom of the protective frame 54 can contact the surface of the welding frame 2, and the protective frame 54 is used to protect the welding arm 26 to prevent the sparks generated by the welding arm 26 from flying around during welding. After the welding arm 26 enters the inner wall of the welding frame 2, it will contact the inner wall of the inner ring 63. At this time, the welding arm 26 will contact the surface of the cylindrical rod 61 when it rotates, and the cylindrical rod 61 will drive the rotating ring 60 to rotate inside the circular groove 43 as the welding arm 26 rotates.When the inner ring 63 rotates, it pushes the right-angle plate 64 to clean the inner wall of the welding frame 2. The cleaned waste will be discharged through the leak hole 6 to prevent the waste from accumulating inside the welding frame 2.

[0060] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A high-precision welding head pressure device for a high-performance crystal bonding machine, comprising a bottom plate (1), a fixing frame (5) fixedly connected to the top of the bottom plate (1), a welding frame (2) fixedly connected to the top of the fixing frame (5), a motor (4) fixedly connected to the top of the bottom plate (1), a gear (3) fixedly connected to the output end of the motor (4), a leak hole (6) opened on the lower surface of the fixing frame (5), characterized in that: Also includes: An extrusion component (7), the extrusion component (7) comprising a meshing wheel (20), the inner wall of the meshing wheel (20) being rotatably connected to the surface of the welding frame (2), the top of the meshing wheel (20) being fixedly connected to a support frame (21), the top of the support frame (21) being fixedly connected to an electric push rod (22), and the upper surface of the electric push rod (22) being fixedly connected to a welding arm (26); A material taking component (8), the material taking component (8) comprising a round hole rod (47), the bottom of the round hole rod (47) being fixedly connected to the bottom of the inner wall of the fixing frame (5), a sliding hole (45) being provided on the surface of the round hole rod (47), a lifting rod (46) being slidably connected to the inner wall of the round hole rod (47), and a welding plate (44) being fixedly connected to the top of the lifting rod (46); A protection component (9), the protection component (9) comprising a protection frame (54), a groove ring (52) being fixedly connected to the bottom of the protection frame (54), and an extension frame (51) being fixedly connected to the surface of the protection frame (54); A cleaning component (10) is arranged inside the welding frame (2).

2. The high-precision welding head pressure device for a high-performance die bonder according to claim 1, characterized in that: The top of the welding frame (2) is linked to the top of the fixing frame (5), the surface of the gear (3) is meshed with the surface of the meshing wheel (20), and the end of the welding arm (26) close to the electric push rod (22) is adapted to the inner wall of the welding frame (2).

3. The high-precision welding head pressure device for a high-performance die bonder according to claim 2, characterized in that: The extrusion component (7) comprises a top plate (25), the end of the top plate (25) is fixedly connected to the upper surface of the electric push rod (22), the top of the top plate (25) is fixedly connected to a center rod (24), the bottom of the top plate (25) is fixedly connected to an elastic rod (23), the bottom of the elastic rod (23) is fixedly connected to a round frame (27), a positioning hole (33) is opened on the surface of the round frame (27), the inner wall of the positioning hole (33) is rotatably connected to a rotating shaft (34), the top of the inner wall of the round frame (27) is fixedly connected to an elastic rod (28), and the bottom of the elastic rod (28) is fixedly connected to an extrusion plate (30); A telescopic rod (29) is hingedly connected to the surface of the extrusion plate (30); one end of the telescopic rod (29) away from the extrusion plate (30) is hingedly connected to the surface of a rotating shaft (34); an elastic sheet (32) is fixedly connected to the surface of the rotating shaft (34); and a contact rod (31) is fixedly connected to the bottom of the elastic sheet (32).

4. The high-precision welding head pressure device for a high-performance die bonder according to claim 3, characterized in that: The top plate (25) is arranged above the welding arm (26), the bottom of the elastic rod (28) extends to the bottom of the round frame (27), the elastic sheet (32) is arranged at the outer end of the round frame (27), the contact rod (31) is arranged below the extrusion plate (30), and the top of the telescopic rod (29) is inclined toward the end away from the extrusion plate (30).

5. The high-precision welding head pressure device for a high-performance die bonder according to claim 4, characterized in that: The material taking component (8) comprises a connecting plate (40), the connecting plate (40) is rotatably connected to the surface of the center rod (24), one end of the connecting plate (40) away from the center rod (24) is fixedly connected to a rectangular frame (41), the bottom of the rectangular frame (41) is fixedly connected to a telescopic plate (42), and one end of the telescopic plate (42) away from the rectangular frame (41) is fixedly connected to a linkage plate (49); One end of the linkage plate (49) away from the telescopic plate (42) is fixedly connected to the surface of the lifting rod (46), and a limiting hole (48) is provided on the surface of the fixing frame (5).

6. The high-precision welding head pressure device for a high-performance die bonder according to claim 5, characterized in that: The surface of the linkage plate (49) is slidably connected to the inner wall of the sliding hole (45); the welding plate (44) is arranged inside the welding frame (2); the inner wall of the welding frame (2) is provided with a circular groove (43); and the end of the linkage plate (49) away from the lifting rod (46) extends to the outer end of the fixing frame (5).

7. The high-precision welding head pressure device for a high-performance die bonder according to claim 6, characterized in that: The protective component (9) comprises a round rod (56), the round rod (56) is fixedly connected to the inner wall of the telescopic plate (42), a tripod (50) is fixedly connected to the surface of the round rod (56), and a limiting frame (55) is fixedly connected to the center of the tripod (50); The bottom of the limiting frame (55) is fixedly connected to an elastic telescopic frame (53), and the bottom of the elastic telescopic frame (53) is fixedly connected to the top of the extension frame (51).

8. The high-precision welding head pressure device for a high-performance die bonder according to claim 7, characterized in that: The end of the round rod (56) passes through the telescopic plate (42) and extends to the outer end of the telescopic plate (42), the bottom of the limit frame (55) is arranged below the tripod (50), and the inner wall of the groove ring (52) contacts the surface of the welding frame (2).

9. The high-precision welding head pressure device for a high-performance die bonder according to claim 8, characterized in that: The cleaning component (10) comprises a rotating ring (60), the rotating ring (60) is rotatably connected to the inner wall of the annular groove (43), and the inner wall of the rotating ring (60) is fixedly connected to an inner ring (63); The inner wall of the inner ring (63) is fixedly connected to a cylindrical rod (61), and the inner wall of the inner ring (63) is fixedly connected to a right-angle plate (64), the right-angle plate (64) contacts the inner wall of the welding frame (2), and the bottom of the right-angle plate (64) contacts the bottom of the inner wall of the welding frame (2).

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