Circuit board manufacturing method and circuit board
Through 3D printing technology and the melt casting method of conductive materials, the layering and warping problems in circuit board manufacturing are solved, manufacturing efficiency and design flexibility are improved, and manufacturability of complex line channels is realized.
Patent Information
- Application Number
- CN202411368786.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-01-03
AI Technical Summary
In the prior art, there are problems of layering and warping in the circuit board manufacturing process, and traditional methods require multiple alignments and complex process flows, resulting in low manufacturing efficiency and insufficient flexibility in metal circuit layer design.
The board is manufactured using 3D printing technology, with built-in hollow line channels, and solid conductive materials are formed by injection and cooling of liquid conductive materials. Combined with the melting and casting technology of conductive materials, multiple alignments and complex processes in traditional methods are avoided, and the Manufacturing efficiency and design flexibility.
It effectively improves the layering and warping problems in the circuit board, improves manufacturing efficiency, and realizes the manufacturability of complex line channels and the design flexibility of metal line layers.
Smart Images
Figure CN119255512A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor packaging, and in particular to a method for manufacturing a circuit board and a circuit board. Background Art
[0002] In the field of semiconductor packaging, a stacked layout is achieved through a circuit board, which includes a board body and a metal circuit disposed in the board body, wherein the metal circuit has a portion exposed from the lower surface of the board body and a portion exposed from the upper surface of the board body. In the prior art, circuit boards are manufactured using a lamination method, where a layer of dielectric and a layer of metal are used for processing. During the manufacturing process, multiple alignments are required to ensure that the offset is within the tolerance, and the circuit boards manufactured in this way are prone to problems such as delamination and warping. Summary of the invention
[0003] The present invention aims at the above-mentioned problems, overcomes at least one disadvantage, and provides a method for manufacturing a circuit board and a circuit board.
[0004] The technical solution adopted by the present invention is as follows:
[0005] A method for manufacturing a circuit board comprises the following steps:
[0006] Printing a board body on the carrier board using a 3D printing device, wherein the board body has a hollow circuit channel, and the upper surface and / or side surface of the board body has a plurality of openings connected to the circuit channel;
[0007] Injecting a conductive material in a liquid state into a circuit channel in the board body through at least one opening;
[0008] After cooling, the conductive material is in a solid state.
[0009] The board body is printed by a 3D printing device, which is not easy to deform and break. The solid conductive material is made by integral casting, which is also not easy to deform and break. Compared with the existing processing methods, the present application effectively improves the delamination of the metal circuit layer in the circuit board and the stress warping of the circuit board. The present application effectively improves the delamination of the metal circuit layer and the stress warping of the circuit board in the traditional circuit board. In the process of manufacturing multi-layer metal circuits of traditional circuit boards, it is necessary to repeat the exposure, development, electroplating and other processes many times, and it is necessary to align multiple times to ensure that the offset is within the tolerance. The 3D printing method of the present application only needs to be aligned once in the early stage of manufacturing, which effectively improves the manufacturing efficiency. In the traditional manufacturing process, it is necessary to make metal conductive holes between the upper and lower metal circuit layers in the intermediate material, but the laser hole and the mechanical hole have their own manufacturing defects. For example, the laser hole cannot be perforated in a thicker dielectric material, and the shape integrity of the mechanical hole is relatively poor. The present application adopts a 3D printing process to manufacture the board body, which can flexibly shape the conductive structure inside the board body 2, so that the through-hole manufacturing or other complex designs have manufacturability, that is, the present application can manufacture complex circuit channels 21, so that the design flexibility of the metal circuit layer in the circuit board is stronger. .
[0010] In actual use, preferably, the liquid conductive material is injected into the circuit channels in the board body through a plurality of openings.
[0011] When a conductive material in a liquid state is injected into the circuit channel in the board body through at least one opening, part of the heat of the liquid conductive material is transferred to the board body after entering the circuit channel, which easily causes the conductive material to cool down and solidify, thereby affecting the subsequent flow of the conductive material in a liquid state, resulting in the conductive material failing to fill the circuit channel. In view of the above problem, when the conductive material is filled into the circuit channel, the board body is heated, preferably, so that the temperature of the board body is greater than or equal to the melting point of the conductive material and lower than the melting point of the board body.
[0012] In one embodiment of the present invention, when the conductive material in liquid state is injected into the circuit channel in the board body through the opening, the board body is vibrated to accelerate the discharge of air in the circuit channel.
[0013] In one embodiment of the present invention, the conductive material filling the circuit trenches may be cooled by natural cooling or by blowing air onto the surface of the board.
[0014] In one embodiment of the present invention, the following steps are also included:
[0015] After the conductive material is in a solid state, the carrier is removed, and the surface of the plate is ground and flattened, so that the conductive material is exposed at the lower surface of the plate and the openings on the surface of the plate.
[0016] In one embodiment of the present invention, the circuit channel has a first area adjacent to or connected to the carrier, the circuit channel has a second area at the opening, the conductive material forms a first pad in the first area, and the conductive material forms a second pad in the second area.
[0017] In one embodiment of the present invention, the melting point of the plate is greater than the melting point of the conductive material.
[0018] The melting point of the plate body is greater than the melting point of the conductive material, so that the plate body is prevented from melting or the circuit channel is deformed when the liquid conductive material is injected into the circuit channel.
[0019] In one embodiment of the present invention, the plate is made of ceramic or synthetic glass.
[0020] In one embodiment of the present invention, the conductive material is metal.
[0021] In one embodiment of the present invention, the conductive material includes at least one of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.
[0022] In one embodiment of the present invention, before injecting the liquid conductive material into the circuit channel in the board body through at least one opening, the method further includes removing burrs in the circuit channel to make the inner wall of the circuit channel smooth.
[0023] In actual application, ultrasonic, dry ice, laser and other cleaning methods can be used to clean the circuit channels.
[0024] The line channel can be cleaned by a dry ice cleaning machine. The working principle of the dry ice cleaning machine is based on the physical properties of dry ice. Dry ice particles are sprayed into the line channel through the opening by high-pressure air. The dry ice particles are solid and can gradually remove the burrs through continuous collision. In addition, dry ice can directly change from solid to gas. This process is called sublimation. When the dry ice particles come into contact with the burrs, they will quickly sublimate to form gaseous carbon dioxide. The sublimation of dry ice is accompanied by the expansion of volume, thereby generating high pressure. The release of this high pressure can instantly knock the burrs off the inner wall surface of the line channel and carry them away with the airflow to achieve a cleaning effect.
[0025] Ultrasonic waves can be used to clean the circuit channels, and burrs can be cleaned by "cavitation". Ultrasonic cavitation refers to the dynamic process of growth and collapse of micro-gas-core cavitation bubbles in liquids that vibrate under the action of sound waves and occur when the sound pressure reaches a certain value. Cavitation generally includes three stages: the formation, growth and violent collapse of cavitation bubbles. When a plate filled with liquid is connected to ultrasound, tens of thousands of tiny bubbles, namely cavitation bubbles, are generated due to the vibration of the liquid. These bubbles grow in the negative pressure zone formed by the longitudinal propagation of ultrasound, and quickly close in the positive pressure zone, thereby being compressed and stretched under alternating positive and negative pressures. At the moment when the bubble is compressed until it collapses, a huge instantaneous pressure will be generated, which can generally be as high as tens of megapascals to hundreds of megapascals. When cleaning by the principle of ultrasound, a specific operation method is as follows:
[0026] Injecting liquid through the opening to fill the entire line channel with the liquid, wherein the liquid includes water or cleaning liquid;
[0027] The ultrasonic generator is brought into contact with the carrier board or the board body, and the ultrasonic generator is started, and the burrs can be removed from the inner wall of the circuit channel through the cavitation effect;
[0028] Pressurized water is injected through the openings to discharge the liquid in the line channel and the fallen burrs out of the line channel through other openings;
[0029] The circuit channel is dried by heating the plate body, or by introducing dry gas or heated dry gas into the circuit channel through the opening.
[0030] In addition to dry ice and ultrasonic cleaning, laser cleaning can also be used. Laser can clean burrs on the surface or shallow layer of the circuit channel.
[0031] As shown in the figure, in addition to the above cleaning methods, burrs can also be removed by spraying metal sand into the line channel. High-pressure gas drives the metal sand to move in the line channel. The metal sand continuously collides with the inner wall of the line channel, which can knock down the burrs and finally make the inner wall of the line channel smooth. After the cleaning is completed, the burrs and metal sand in the line channel are blown out by passing dry gas into the line channel. In the dry ice cleaning method, dry ice is vaporized into carbon dioxide, while the cleaning method of spraying metal sand will have some metal sand still remain in the line channel. In order to prevent the residual metal sand from affecting the performance of the conductive material, it is preferred that the material of the metal sand is the same as that of the conductive material, so that when the conductive material in a liquid state is injected into the line channel in the plate body, the residual metal sand can be melted to become part of the conductive material. In actual operation, as shown in the figure, the sandblasting gun can be pressed against one opening, the suction gun can be pressed against another opening, and the other openings can be blocked. The sandblasting gun is used to spray high-pressure gas and metal sand into the opening, and the suction gun is used to recover the metal sand and the burrs cleaned.
[0032] In actual use, the solids recovered by the suction gun include metal sand and burrs. Metal sand is expensive and needs to be recycled. Since the melting point of metal sand is lower than that of burrs, it can be separated by solid-liquid separation after heating. It is also possible to prepare a separation liquid with a density between metal sand and burrs, and quickly separate the metal sand and burrs by putting them into the separation liquid, where the metal sand with a density greater than the separation liquid sinks to the bottom, and the metal sand with a density greater than the separation liquid floats.
[0033] In one embodiment of the present invention, the circuit channel has a plurality of horizontally or obliquely arranged diversion sections, and at least two of the diversion sections have different heights.
[0034] In one embodiment of the present invention, the conductive material in liquid state is injected into the circuit channel by liquid injection, vacuum pressurization or capillary principle.
[0035] The present application also discloses a circuit board, which is manufactured by the circuit board manufacturing method described above.
[0036] The beneficial effects of the present invention are as follows: the board body is printed by a 3D printing device and is not easy to deform or break; the solid conductive material is obtained by integral melting and casting and is also not easy to deform or break. Compared with the existing processing methods, the present application effectively improves the delamination and warping problems in the circuit board; the traditional circuit board manufacturing process requires multiple alignments to ensure that the offset is within the tolerance, while the 3D printing method of the present application only requires one alignment at the beginning of manufacturing, which effectively improves the manufacturing efficiency; in the traditional production process, laser holes are not suitable for punching holes in thicker dielectric materials, and the shape of mechanical holes is not as complete as laser holes, while 3D printing can flexibly shape any structure, making via manufacturing or other complex designs manufacturable, and the present application can manufacture complex circuit channels. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] Figure 1 This is a schematic diagram after the board is 3D printed on the carrier board;
[0038] Figure 2 It is a schematic diagram after the conductive material is injected into the circuit channel of the board;
[0039] Figure 3 yes Figure 2 Schematic diagram after removing the carrier board;
[0040] Figure 4 It is a schematic diagram of cleaning the line channel by spraying metal sand;
[0041] Figure 5 is a schematic diagram of a board body 3D printed on the carrier board when the first area is not connected to the carrier board;
[0042] Figure 6 yes Figure 5 Schematic diagram of the circuit channel after the conductive material is injected;
[0043] Figure 7 yes Figure 6 Schematic diagram after removing the carrier board;
[0044] Figure 8 yes Figure 7 A schematic diagram showing that the first pad is exposed after the board is polished;
[0045] Fig. 9 is a schematic diagram showing that the side surface of the circuit channel has an opening;
[0046] Fig.10 yes Fig. 9 Schematic diagram after injecting conductive material and then removing the carrier;
[0047] Fig.11 It is a schematic diagram of the cooperation between the vibration mechanism and the plate body.
[0048] The reference numerals in the figures are:
[0049] 1. Carrier board; 2. Board body; 21. Circuit channel; 211. Opening; 212. First area; 213. Second area; 214. Diversion section; 22. Upper surface; 23. Lower surface; 24. Side surface; 3. Conductive material; 31. First pad; 32. Second pad; 33. Third pad; 41. Metal sand; 42. Sandblasting gun; 43. Suction gun; 5. Vibration mechanism. DETAILED DESCRIPTION
[0050] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0051] In the description of this application, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0052] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0053] The present invention is described in detail below in conjunction with the accompanying drawings.
[0054] This embodiment discloses a method for manufacturing a circuit board, comprising the following steps:
[0055] like Figure 1 As shown, a board body 2 is printed on a carrier board 1 using a 3D printing device, the board body 2 has a hollow circuit channel 21, and the upper surface 22 of the board body 2 has a plurality of openings 211 connected to the circuit channel 21;
[0056] like Figure 2 As shown, the conductive material 3 in liquid state is injected into the circuit channel 21 in the board body 2 through at least one opening 211, so that the conductive material 3 fills all the circuit channels 21 in the board body 2;
[0057] Cooling and solidifying the conductive material 3 so that the conductive material 3 and the board body 2 in the circuit channel 21 form an integrated structure;
[0058] like Figure 3 As shown, after the conductive material 3 is in a solid state, the carrier 1 is removed, and the upper and lower surfaces of the plate body 2 are polished and flattened, so that the conductive material 3 is exposed at the opening 211 on the upper surface of the plate body 2 and the lower surface 23 of the plate body 2 .
[0059] The board body 2 is printed by a 3D printing device and is not easy to deform or break. The solid conductive material 3 is made by integral melting and casting and is also not easy to deform or break. Compared with the existing processing methods, this application effectively improves the delamination of metal circuit layers and stress warping of circuit boards in traditional circuit boards. In the process of manufacturing multi-layer metal circuits on traditional circuit boards, it is necessary to repeat the processes of exposure, development, electroplating, etc., and multiple alignments are required to ensure that the offset is within the tolerance. The 3D printing method of this application only requires one alignment at the beginning of manufacturing, which effectively improves manufacturing efficiency.
[0060] In the traditional manufacturing process, it is necessary to make metal conductive holes between the upper and lower metal circuit layers in the intermediate material, but laser holes and mechanical holes have their own manufacturing defects. For example, laser holes cannot be punched in thicker dielectric materials, and the shape integrity of mechanical holes is relatively poor. The present application adopts 3D printing technology to manufacture the board body, which can flexibly shape the conductive structure inside the board body 2, making the through-hole manufacturing or other complex designs manufacturable, that is, the present application can manufacture complex circuit channels 21, so that the design flexibility of the metal circuit layer in the circuit board is stronger.
[0061] In actual use, preferably, the conductive material 3 in a liquid state is injected into the circuit channels 21 in the board body 2 through the plurality of openings 211 .
[0062] In this embodiment, the melting point of the plate body 2 is greater than the melting point of the conductive material 3. The melting point of the plate body 2 is greater than the melting point of the conductive material 3, so that the liquid conductive material 3 can be prevented from melting the plate body 2 or causing deformation of the line channel in the plate body 2 when injected into the line channel 21. The material of the plate body 2 is a non-conductive material, which can be a variety of materials, as long as the product design requirements are met. In this embodiment, the material of the plate body 2 is ceramic or synthetic glass. The conductive material 3 can be metal or non-metal. Preferably, the conductive material 3 is metal, which can be one or more combinations of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.
[0063] The circuit channel 21 produced by 3D printing will have burrs, which will affect the injection of the conductive material 3 and the working performance of the product. In one embodiment, before the conductive material 3 in a liquid state is injected into the circuit channel 21 in the board body 2 through at least one opening 211, the following steps are also included: removing the burrs in the circuit channel 21 to make the inner wall of the circuit channel 21 smooth.
[0064] In actual use, at least one cleaning method such as ultrasonic wave, dry ice, laser, etc. can be used to clean the circuit channel 21 to remove the burrs in the circuit channel 21.
[0065] The line channel 21 can be cleaned by a dry ice cleaning machine. The working principle of the dry ice cleaning machine is based on the physical properties of dry ice. Dry ice particles are sprayed into the line channel 21 through the opening 211 by high-pressure air. The dry ice particles are solid and can gradually remove the burrs through continuous collision. In addition, the dry ice can directly change from solid to gas. This process is called sublimation. When the dry ice particles come into contact with the burrs, they will quickly sublimate to form gaseous carbon dioxide. The sublimation of dry ice is accompanied by the expansion of volume, thereby generating high pressure. The release of this high pressure can instantly knock the burrs off the inner wall surface of the line channel 21 and carry them away with the airflow to achieve a cleaning effect.
[0066] The circuit channel 21 can be cleaned by ultrasound, and the burrs can be cleaned by the "cavitation" effect. Ultrasonic cavitation refers to the dynamic process of growth and collapse of micro-gas core cavitation bubbles existing in the liquid when they vibrate under the action of sound waves and when the sound pressure reaches a certain value. Cavitation generally includes three stages: the formation, growth and violent collapse of cavitation bubbles. When the plate filled with liquid is connected to ultrasound, tens of thousands of tiny bubbles, namely cavitation bubbles, are generated due to the vibration of the liquid. These bubbles grow in the negative pressure zone formed by the longitudinal propagation of ultrasound, and quickly close in the positive pressure zone, thereby being compressed and stretched under alternating positive and negative pressures. At the moment when the bubble is compressed until it collapses, a huge instantaneous pressure will be generated, which can generally be as high as tens of megapascals to hundreds of megapascals. When cleaning is performed by the principle of ultrasound, a specific operation method is as follows:
[0067] Injecting liquid into the circuit channel 21 through the opening 211 so that the liquid fills the entire circuit channel 21, wherein the liquid includes water or cleaning liquid;
[0068] The ultrasonic generator is brought into contact with the carrier board 1 or the board body 2, and the ultrasonic generator is started, so that the burrs can be removed from the inner wall of the circuit channel 21 through the cavitation effect;
[0069] Pressurized water is injected through one opening 211 to discharge the liquid in the circuit channel 21 and the dropped burrs out of the circuit channel 21 through the other openings 211;
[0070] The circuit channel 21 is dried by heating the plate body 2 and introducing dry gas or heated dry gas into the circuit channel 21 through the opening 211 .
[0071] In addition to dry ice and ultrasonic cleaning, laser cleaning can also be used. The laser can clean the burrs on the surface or shallow layer of the circuit channel 21.
[0072] like Figure 4As shown, in addition to the above-mentioned cleaning method, burrs can also be removed by spraying metal sand 41 into the circuit channel 21. The high-pressure gas drives the metal sand 41 to move in the circuit channel 21. The metal sand 41 continuously collides with the inner wall of the circuit channel 21, so that the burrs can be knocked off, and finally the inner wall of the circuit channel 21 is made smooth. After the cleaning is completed, the burrs and metal sand 41 in the circuit channel 21 are blown out by passing dry gas into the circuit channel 21. In the dry ice cleaning method, dry ice is vaporized into carbon dioxide, while in the cleaning method of spraying metal sand 41, some metal sand 41 will still remain in the circuit channel 21. In order to prevent the residual metal sand 41 from affecting the performance of the conductive material 3, preferably, the material of the metal sand 41 is the same as that of the conductive material 3, so that when the conductive material 3 in a liquid state is injected into the circuit channel 21 in the plate body 2, the residual metal sand 41 can be melted to become a part of the conductive material 3. In actual operation, as Figure 4 As shown, the sandblasting gun 42 can be pressed against one opening 211, and the suction gun 43 can be pressed against another opening 211, and the other openings 211 are blocked. The sandblasting gun 42 is used to spray high-pressure gas and metal sand 41 into the opening 211, and the suction gun is used to recover the metal sand 41 and the cleaned burrs.
[0073] In actual use, the solids recovered by the suction gun include metal sand 41 and burrs. The metal sand has high cost and needs to be recycled. Since the melting point of the metal sand 41 is lower than that of the burrs, it can be separated by solid-liquid separation after heating. It is also possible to modulate a separation liquid with a density between the metal sand 41 and the burrs, and quickly separate the metal sand 41 and the burrs by putting them into the separation liquid, wherein the metal sand 41 and the burrs with a density greater than the separation liquid sink to the bottom, and the metal sand with a density greater than the separation liquid floats.
[0074] like Figure 1 and 2 As shown, in this embodiment, the circuit channel 21 has a first area 212 in contact with the carrier 1, the circuit channel 21 has a second area 213 at the opening 211, the conductive material 3 forms a first pad 31 in the first area 212, and the conductive material 3 forms a second pad 32 in the second area 213. Figure 5 and Figure 6 As shown, in other embodiments, the first region 212 of the circuit channel 21 may not be in direct contact with the carrier 1, but may be adjacent to the carrier 1. This structure allows the first region 212 of the circuit channel 21 to be removed after the carrier 1 is removed. Figure 7 As shown, the second pad 32 is not exposed, but the first area 212 can be exposed by grinding the lower surface 23 of the plate body 2. Figure 8 Although this processing method increases the thickness of the lower surface 23 of the plate body 2 that needs to be ground, it is relatively Figure 1In terms of the structure, the lower surface 23 of the plate body 2 and the carrier board 1 can have a larger contact area, so that the plate body 2 and the carrier board 1 can be combined more reliably, which is convenient for the operation of subsequent processes.
[0075] When the liquid conductive material 3 is injected into the circuit channel 21 in the board body 2 through at least one opening 211, part of the heat of the liquid conductive material 3 is transferred to the board body after entering the circuit channel 21, which easily causes the conductive material to cool down and solidify, thereby affecting the subsequent flow of the liquid conductive material 3, and ultimately causing the conductive material to fail to fill the circuit channel 21. To address the above problem, when the conductive material 3 is injected into the circuit channel 21, the board body 2 may be heated, preferably, so that the temperature of the board body 2 is greater than or equal to the melting point of the conductive material 3 and lower than the melting point of the board body 2.
[0076] In actual use, the conductive material 3 filling the circuit channel 21 can be cooled by natural cooling or by blowing air onto the surface of the board body 2 for air cooling.
[0077] like Fig. 9 and Fig.10 As shown, in another embodiment, in addition to the upper surface 22 of the board body, the side surface of the board body also has an opening 211 connected to the circuit channel 21. After such a configuration, the conductive material 3 can be exposed on the side surface 24 of the board body 2, so that the lateral electrical connection of the board body 2 can be achieved. Specifically, Fig.10 As shown, a third pad 33 is formed on the opening 211 of the side surface of the board body 2, and other components can be electrically connected through the third pad 33. In another embodiment, the upper surface 22 of the board body 2 does not have the opening 211, and the side surface 24 of the board body 2 has an opening 211 connected to the circuit channel 21.
[0078] like Figure 1 As shown, in one embodiment, the circuit channel 21 has a plurality of horizontally or obliquely arranged diversion sections 214, and at least two diversion sections 214 have different heights. The present application can realize reliable manufacturing of complex circuit channels 21 by 3D printing.
[0079] In one embodiment, the liquid conductive material 3 is injected into the circuit channel 21 by vacuum pressurization, and the specific steps are as follows:
[0080] One or more openings 211 are sealed and connected to the vacuum tube, and other openings 211 are blocked, and the circuit channel 211 is evacuated by a vacuum device connected to the vacuum tube;
[0081] The conductive material 3 in liquid state is injected into the circuit channel 21 in the board body 2 through at least one opening 211 by an injection device.
[0082] The liquid conductive material 3 is injected after vacuuming to prevent the generation of bubbles and ensure the performance of the conductive material 3 after solidification.
[0083] In actual use, the liquid conductive material 3 can also be injected into the circuit channel 21 by means of the capillary principle.
[0084] like Fig.11 As shown, in one embodiment, in order to prevent the existence of tiny bubbles in the circuit channel 21, after the conductive material 3 is injected, the vibration mechanism 5 is brought into contact with the plate body 2, and the plate body 2 is vibrated at a high frequency to vibrate out the tiny bubbles.
[0085] like Figure 3 , Figure 7 and Fig.10 As shown, circuit boards are manufactured by methods of different embodiments.
[0086] The above description is only a preferred embodiment of the present invention, and does not limit the patent protection scope of the present invention. Any equivalent structural transformation made by using the contents of the present invention and the drawings, directly or indirectly used in other related technical fields, is also included in the protection scope of the present invention.
Claims
1. A method for manufacturing a circuit board, characterized in that: The following steps are involved: Printing a board body on the carrier board using a 3D printing device, wherein the board body has a hollow circuit channel, and the upper surface and / or side surface of the board body has an opening connected to the circuit channel; Injecting a conductive material in a liquid state into a circuit channel in the board body through at least one opening; Cooling solidifies the conductive material.
2. The method for manufacturing a circuit board according to claim 1, wherein: Before injecting the conductive material in liquid state into the circuit channel in the board body through at least one opening, the method further includes the following steps: removing burrs in the circuit channel to make the inner wall of the circuit channel smooth.
3. The method for manufacturing a circuit board according to claim 2, wherein: The circuit groove can be cleaned by at least one cleaning method such as ultrasonic wave, dry ice, laser, etc. to remove the burrs in the circuit groove.
4. The method for manufacturing a circuit board according to claim 1, wherein: When the conductive material in liquid state is injected into the circuit channel in the board body through at least one opening, the board body is heated so that the temperature of the board body is greater than or equal to the melting point of the conductive material and lower than the melting point of the board body.
5. The method for manufacturing a circuit board according to claim 1, wherein: When the conductive material in liquid state is injected into the circuit channel in the board body through at least one opening, the board body is vibrated to accelerate the discharge of air in the circuit channel.
6. The method for manufacturing a circuit board according to claim 1, wherein: The following steps are also included: After the conductive material is in a solid state, the carrier is removed, and the surface of the plate is ground and flattened, so that the conductive material is exposed at the lower surface of the plate and the openings on the surface of the plate.
7. The method for manufacturing a circuit board according to claim 6, wherein: The circuit channel has a first area adjacent to or connected to the carrier, and has a second area at the opening. The conductive material forms a first pad in the first area, and the conductive material forms a second pad in the second area.
8. The method for manufacturing a circuit board according to claim 1, wherein: The melting point of the plate body is greater than the melting point of the conductive material.
9. The method for manufacturing a circuit board according to claim 8, wherein: The material of the plate body is ceramic or synthetic glass.
10. The method for manufacturing a circuit board according to claim 8, wherein: The conductive material is metal.
11. The method for manufacturing a circuit board according to claim 10, wherein: The conductive material includes at least one of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.
12. The method for manufacturing a circuit board according to claim 1, wherein: The line channel has a plurality of diversion sections arranged horizontally or obliquely, and at least two of the diversion sections have different heights.
13. The method for manufacturing a circuit board according to claim 1, wherein: The conductive material in liquid state is injected into the circuit channel by means of liquid injection, vacuum pressurization or capillary principle.
14. A circuit board, characterized in that: The circuit board is manufactured by the method for manufacturing a circuit board according to any one of claims 1 to 13.