Electronic device

Abstract

The invention discloses an electronic device. The electronic equipment comprises a shell, a heat source and a plurality of heat reflecting films, wherein the shell is provided with an accommodating cavity; the heat source is arranged in the accommodating cavity; the multiple heat reflecting films are arranged on the two opposite sides of the heat source respectively and used for reflecting heat emitted by the heat source to the portion, away from the heat source, of the containing cavity. The heat emitted by the heat source is reflected through the plurality of heat reflecting films arranged on the two sides of the heat source, and the heat emitted by the heat source can be dissipated to other positions of the electronic equipment, so that the overall heat dissipation of the electronic equipment is more uniform, and the overall heat dissipation efficiency of the electronic equipment is improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] Mobile terminals are one of the electronic devices commonly used by users. During the use of mobile terminals, the mobile terminals inevitably emit heat. Since different heat sources in the mobile terminal emit different amounts of heat, the temperature difference at different locations of the mobile terminal is large. Therefore, how to dissipate the heat emitted by the heat source to other locations of the mobile terminal to improve the overall heat dissipation efficiency of the mobile terminal has become a technical problem to be solved. Summary of the invention

[0003] The invention provides an electronic device.

[0004] The electronic device of the embodiment of the present invention includes a shell, a heat source and multiple heat reflecting films, the shell is provided with a containing cavity; the heat source is arranged in the containing cavity; the multiple heat reflecting films are respectively arranged on two opposite sides of the heat source, and are used to reflect the heat emitted by the heat source to a part of the containing cavity away from the heat source.

[0005] The electronic device of the embodiment of the present invention reflects the heat emitted by the heat source by means of multiple heat reflection films arranged on both sides of the heat source, and can dissipate the heat emitted by the heat source to other positions of the electronic device, so that the overall heat dissipation of the electronic device is more uniform, thereby improving the overall heat dissipation efficiency of the electronic device.

[0006] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0008] Figure 1 is a schematic diagram of an electronic device in an unfolded state according to an embodiment of the present invention;

[0009] Figure 2 is a schematic diagram of an electronic device in a partially folded state according to an embodiment of the present invention;

[0010] Figure 3 is a schematic cross-sectional view of an electronic device at position AA according to an embodiment of the present invention;

[0011] Figure 4 is a schematic cross-sectional view of an electronic device at position AA according to another embodiment of the present invention;

[0012] Figure 5is a schematic cross-sectional view of an electronic device at position AA according to another embodiment of the present invention;

[0013] Figure 6 is a cross-sectional schematic diagram of an electronic device at position AA according to yet another embodiment of the present invention;

[0014] Figure 7 is a cross-sectional schematic diagram of an electronic device at position AA according to yet another embodiment of the present invention;

[0015] Figure 8 is a cross-sectional schematic diagram of an electronic device at position AA according to yet another embodiment of the present invention;

[0016] Fig. 9 is a cross-sectional schematic diagram of an electronic device at position AA according to yet another embodiment of the present invention;

[0017] Fig.10 is a cross-sectional schematic diagram of an electronic device at position AA according to yet another embodiment of the present invention;

[0018] Fig.11 is a cross-sectional schematic diagram of an electronic device at position AA according to yet another embodiment of the present invention;

[0019] Fig.12 FIG. 2 is a schematic cross-sectional view of an electronic device taken along line AA according to yet another embodiment of the present invention.

[0020] Description of main component symbols:

[0021] Electronic device 100, first part 110, second part 120, folding screen mobile phone 1001, housing 10, accommodating cavity 11, middle frame 12, back cover 13, first shell 101, second shell 102, connecting structure 14, hinge 141, display screen 20, heat source 30, main board 31, battery 32, display driver chip 33, small board 34, heat reflection film 40, first film 401, second film 402, third film 403, fourth film 404, first uniform heat plate 51, second uniform heat plate 52, first heat dissipation plate 61, second heat dissipation plate 62 DETAILED DESCRIPTION

[0022] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0026] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0027] See also Figure 1 and Figure 2 The embodiment of the present invention discloses an electronic device 100, which includes a housing 10, a display screen 20 and a heat source 30, and can interact with a user to realize multiple functions such as communication and entertainment. The electronic device 100 can be a mobile terminal device such as a mobile phone, a tablet computer, a notebook, a car computer, etc. Specifically, the housing 10 and the display screen 20 are installed together, and the heat source 30 is arranged in the housing 10, and is wrapped and shielded by the housing 10 and the display screen 20, so the heat source 30 is Figure 1 and Figure 2 Not shown.

[0028] The electronic device 100 may include a first part 110 and a second part 120, and the first part 110 can rotate relative to the second part 120. The first part 110 includes a heat source 30, at least a portion of a display screen 20 and at least a portion of a housing 10, and the second part 120 includes at least a portion of the display screen 20 and at least a portion of the housing 10 display screen 20. The portion of the display screen 20 arranged in the first part 110 can rotate relative to the second part 120, so that the display screen 20 can be bent and the electronic device 100 can be folded. The electronic device 100 of the embodiment of the present application can be a mobile terminal device such as a folding screen mobile phone 1001, a folding screen tablet computer, a folding screen notebook, etc. In the following description, the folding screen mobile phone 1001 will be described as the electronic device 100, but this cannot be regarded as a limitation of the embodiment of the present invention.

[0029] See also Figure 3 , Figure 3 1 is a schematic cross-sectional view of an electronic device 100 according to an embodiment of the present invention. The electronic device 100 according to an embodiment of the present invention comprises a housing 10, a heat source 30 and a plurality of heat reflecting films 40, wherein the housing 10 is provided with a receiving cavity 11, the heat source 30 is arranged in the receiving cavity 11, and the plurality of heat reflecting films 40 are respectively arranged on opposite sides of the heat source 30, for reflecting the heat emitted by the heat source 30 to a portion of the receiving cavity 11 away from the heat source 30.

[0030] The electronic device 100 of the embodiment of the present invention reflects the heat emitted by the heat source 30 by means of multiple heat reflection films 40 arranged on both sides of the heat source 30, and can dissipate the heat emitted by the heat source 30 to other positions of the electronic device 100, so that the overall heat dissipation of the electronic device 100 is more uniform, thereby improving the overall heat dissipation efficiency of the electronic device 100.

[0031] Specifically, the multiple heat-reflecting films 40 can all be optical reflective films, and the electromagnetic waves directed to the surface of the heat-reflecting film 40 are reflected in multiple different directions to achieve the conduction and evacuation of heat. It can be understood that all objects with a temperature higher than absolute zero are radiating heat to the outside. During the heat exchange process in which the heat radiation emitted by the object is absorbed by other objects, its own temperature drops. Heat exists in the form of thermal radiation during the process of dissipation and transfer. Thermal radiation is an electromagnetic wave with a wavelength in the range of 0.1 to 100 μm. The heat emitted by objects of different temperatures is concentrated in different bands. The heat source 30 of the embodiment of the present application includes power modules such as a main board 31, a battery 32, a display driver chip 33, and a small board 34, and the heat emitted is mainly concentrated in the 0.7 to 100 μm band.

[0032] In the electronic device in the related art, a heat sink is provided between the shell and the heat source, and between the heat source and the display screen. The heat is dissipated by conducting heat through the graphite sheets or metal films evenly arranged in the internal structure. The heat sink is disconnected or non-contactly connected between the first shell and the second shell and at the bend of the display screen, which makes it difficult for the heat to be transferred laterally between the first shell and the second shell. Since the heat generated by the motherboard in the heat source is significantly higher than that of other power modules, and the heat is difficult to be transferred laterally between the first shell and the second shell, it is very easy for the temperature difference between the two parts of the electronic device to be too large, and the temperature of the local area is too high, which affects the performance and service life of the motherboard, and then affects the function realization and service life of the electronic device, resulting in a poor user experience.

[0033] Please refer again Figure 3 , Figure 3 The arrow in the figure indicates the path of the heat radiation wave reflected by the heat reflective film 40 inside the electronic device 100 and transmitted from the heat source 30 to other parts of the electronic device 100. The reflection form of the heat radiation wave by the heat reflective film 40 is mainly diffuse reflection. In diffuse reflection, there can be countless emission directions of electromagnetic waves, and heat transfer through diffuse reflection is not easily affected by the disconnection of the heat reflective film 40. The shell 10 includes a middle frame 12 and a back cover 13. The middle frame 12 is fixedly connected to the display screen 20. The back cover 13 covers the side surface of the middle frame 12 opposite to the accommodating cavity 11. The accommodating cavity 11 is inside the electronic device 100, and the boundary is framed by the middle frame 12 and the display screen 20 to form a closed cavity. The heat reflective film 40 is arranged on the side surface of the middle frame 12 and the display screen 20 facing the accommodating cavity 11. The principle of the microcavity effect is used to evenly reflect heat in the accommodating cavity 11, thereby improving the heat dissipation performance of the electronic device 100.

[0034] The heat source 30 can be arranged in the accommodating cavity 11 and fixedly connected to the middle frame 12 or the display screen 20. An electronic device 100 has at least one heat source 30. Taking the folding screen mobile phone 1001 as an example, the electronic device 100 also includes a first part 110 and a second part 120, the second part 120 can be bent relative to the second part 120, the display screen 20 and the shell 10 are distributed in the first part 110 and the second part 120, wherein the shell 10 is disconnected at the bent part of the folding screen mobile phone 1001, and the display screen 20 can be continuously distributed in the first part 110 and the second part 120. In the case where there are multiple heat sources 30, they can be arranged in both the first part 110 and the second part 120, or only in the first part 110 or only in the second part 120. Of course, the multiple heat sources 30 are dispersedly arranged in the first part 110 and the second part 120, which is conducive to uniform heat dissipation.

[0035] Please refer to Figure 3 In some embodiments, a plurality of heat reflective films 40 are arranged along the depth direction of the accommodating cavity 11 .

[0036] In this way, by arranging the heat reflective film 40 along the depth direction of the accommodating cavity 11 , the heat reflective film 40 can obtain a larger surface area compared with other arrangements, thereby ensuring that the heat is dissipated more evenly in the accommodating cavity 11 .

[0037] Specifically, taking the folding screen mobile phone 1001 as an electronic device 100, the width of the accommodating cavity 11 can be 4-7mm, the length can be 70-90mm, or 140mm-160mm, and the depth can be 140mm-160mm. Obviously, the heat reflective film 40 is arranged on the surface of the shell 10 with an area of ​​140mm by 140mm along the depth direction of the accommodating cavity 11, and a larger total area of ​​the heat reflective film 40 can be obtained compared to other directions. It can be understood that the total area of ​​multiple heat reflective films 40 in the same electronic device 100 is large, and the heat dissipation efficiency is higher.

[0038] Please refer to Figure 3 In some embodiments, the roughness of the surface of the heat reflective film 40 facing the center of the accommodating cavity 11 is greater than 0.01 mm.

[0039] In this way, the roughness of the surface of the heat reflection film 40 is relatively large, which is beneficial to improving the reflectivity.

[0040] Specifically, the surface of the heat reflective film 40 facing the center of the accommodating cavity 11 can be roughened, and the surface of the heat reflective film 40 after treatment can have a spherical or hemispherical microstructure, or a grating structure. The roughness of the surface of the heat reflective film 40 is greater than 0.01 mm, so that the thermal radiation electromagnetic wave is diffusely reflected on the surface of the heat reflective film 40. It can be understood that the roughness represents the roughness of the surface. The rougher the surface, the stronger the scattering of light, that is, the reflection of electromagnetic waves in different directions. At the same time, the greater the difference between the roughness and the wavelength, the greater the probability of diffuse reflection than mirror reflection. Therefore, increasing the surface roughness of the heat reflective film 40 to a certain extent can improve the reflectivity.

[0041] Please refer to Figure 3 In some embodiments, the thickness of the heat reflective film 40 is less than or equal to 0.05 mm.

[0042] In this way, the heat reflective film 40 can be prevented from increasing the overall volume of the electronic device 100 too much, and the overall lightness and thinness of the electronic device 100 can be maintained, thereby obtaining a good user experience.

[0043] Specifically, the heat reflective film 40 can be made of nanomaterials through surface deposition technology. In one example, the heat reflective film 40 is made of nano-scale silicon oxide material. The nanomaterial can be stacked on the surface of the middle frame 12 by evaporation coating, ion plating, vacuum sputtering coating and other process methods to form the heat reflective film 40. The stacking process of the heat reflective film 40 can form different surface structures, for example, a uniformly distributed spherical microstructure with a radius of 0.01 mm is formed on the surface, thereby adjusting the reflection of light in a specific wavelength band.

[0044] In some embodiments, the reflectivity of the heat reflective film 40 to infrared light is greater than 90%.

[0045] In this way, the overall heat dissipation efficiency of the electronic device 100 can be improved by reflecting infrared light through the heat reflection film 40 .

[0046] Specifically, as mentioned above, the heat radiation electromagnetic waves emitted by the heat source 30 are concentrated in the 0.7-100 μm band, and the electromagnetic waves of 0.7-100 μm are infrared light. The reflectivity of the heat reflection film 40 to infrared light is greater than 90%. The heat radiation electromagnetic waves emitted by the heat source 30 can be specifically reflected. Optionally, the heat reflection film 40 can have a lower reflectivity to visible light. The heat reflection film 40 can be made of a material with a high reflectivity to infrared light, for example, the heat reflection film 40 can be made of materials such as silicon dioxide, magnesium fluoride, titanium dioxide, etc.

[0047] Please refer to Figure 2 and Figure 3In some embodiments, the shell 10 includes a first shell 101, a second shell 102 and a connecting structure 14, the first shell 101 is rotatably arranged relative to the second shell 102 through the connecting structure 14, the heat source 30 is arranged in the first shell 101, and the first shell 101 and the second shell 102 are both provided with a heat reflecting film 40.

[0048] In this way, the heat of the first shell 101 can be transferred to the second shell 102 through the heat reflection film 40, so that the electronic device 100 can dissipate heat evenly, reducing the probability of performance degradation of the electronic device 100 due to excessive local temperature.

[0049] Specifically, the connection structure 14 may be a hinge 141, which is disposed between the first shell 101 and the second shell 102. The first shell 101 may be disposed at the first portion 110 of the electronic device 100, and the second shell 102 may be disposed at the second portion 120, and the first portion 110 and the second portion 120 are rotatably connected via the hinge 141. The hinge 141 drives the first shell 101 to rotate relative to the second shell 102, driving the electronic device 100 to unfold or fold, and the above-mentioned "unfold" and "fold" can be understood as a change in length in at least one direction, such as an increase in length in one direction for "unfolding", and a decrease in length in one direction for "folding".

[0050] Please refer to Figure 3 In some embodiments, the heat reflective film 40 includes a first film 401 and a second film 402 , the first film 401 is disposed in the first shell 101 , the second film 402 is disposed in the second shell 102 , and the first film 401 and the second film 402 are separated and disposed at the connection structure 14 .

[0051] In this way, by arranging the heat reflection films 40 at intervals, it is possible to prevent the heat reflection films 40 from being damaged due to the rotation and bending of the electronic device 100 .

[0052] Specifically, Figure 3 The electronic device 100 is shown in a flat state, the first shell 101 is flush with the second shell 102, and a distance is provided between the first film 401 and the second film 402. In some embodiments, when the electronic device 100 is in a barrier state, the first shell 101 and the second shell 102 may be in contact in a surface form.

[0053] Please refer again Figure 2 , Figure 2The electronic device 100 is shown in a bent state, and the plane where the first shell 101 is located is inclined relative to the plane where the second shell 102 is located. When the first shell 101 rotates 180 degrees relative to the second shell 102, the first shell 101 and the second shell 102 can be relatively parallel, and the display screen 20 is completely folded. During the rotation of the first shell 101, the first film 401 remains stationary relative to the first shell 101, rotates relative to the second film 402, and the distance between the first film 401 and the second film 402 increases in at least one direction.

[0054] Please refer to Figure 3 In some embodiments, the electronic device 100 includes a first heat spreader 51 stacked with the first film 401 , the first heat spreader 51 is disposed in the first shell 101 , and the heat source 30 is thermally conductively connected to the first heat spreader 51 .

[0055] In this way, the heat dissipation efficiency can be improved and the heat conduction can be made uniform.

[0056] Specifically, the "thermal conductive connection" may be a contact connection, and the first heat spreader 51 may be attached to the surface of the heat source 30. The first heat spreader 51, which is opposite to the contact surface with the heat source 30, may be fixedly connected to the first shell 101, which faces the center of the accommodating cavity 11, and is disposed between the heat source 30 and the middle frame 12. The first heat spreader 51 may be in a sheet shape, and the thickness may be 0.07 to 0.5 mm.

[0057] Please refer to Figure 4 In some embodiments, the first film 401 is disposed between the first uniform heat plate 51 and the first shell 101 , and the heat source 30 is disposed on the first uniform heat plate 51 .

[0058] In this way, the heat transfer path can be shortened by connecting the first heat plate 51 to the heat source 30, and the heat can be dissipated to the second shell 102 through the first film 401, thereby improving the heat dissipation efficiency. In addition, the heat reflective film 40 can fill the groove on the bottom surface of the shell 10, making the surface of the shell 10 flat.

[0059] Specifically, grooves of different depths may be provided on the housing 10 so that the middle frame 12 can cooperate with different heat sources 30 and different devices in the heat source 30. The first film 401 is provided between the first uniform heat plate 51 and the first housing 101, and may be deposited on a surface of the first housing 101 facing the first uniform heat plate 51 by vacuum sputtering, stacked to form different thicknesses, and filled into grooves of different depths to make the surface of the housing 10 smooth.

[0060] Please refer to Figure 5 In some embodiments, the electronic device 100 includes a second heat spreader 52 stacked with the second film 402 , and the second heat spreader 52 is disposed in the second shell 102 .

[0061] In this way, the heat generated by the heat source 30 can be conducted away through the second heat dissipating plate 52 , so that the heat dissipation of the entire electronic device 100 is more uniform.

[0062] Specifically, the battery 32 and the small plate 34 in the heat source 30 can be arranged in the accommodating cavity 11 of the second shell 102 and fixedly connected to the middle frame 12 of the second shell 102. The number of batteries 32 can be one, two or more. The battery 32 can be arranged in the second shell 102, or in the first shell 101, or in both the first shell 101 and the second shell 102. The second membrane 402 and the second uniform heat plate 52 are stacked and arranged in the middle position between the battery 32 or the small plate 34 and the second shell 102. From the center of the accommodating cavity 11 to the rear shell direction, the heat source 30, the second membrane 402, the second uniform heat plate 52, and the second shell 102 can be arranged in sequence. The first uniform heat plate 51 and the second uniform heat plate 52 can be made of materials with good thermal conductivity and light weight. For example, the first uniform heat plate 51 and the second uniform heat plate 52 are made of graphite.

[0063] Please refer to Figure 6 In some embodiments, the second film 402 is disposed between the second shell 102 and the second heat spreader 52. As described above, the heat transfer path can be shortened and the heat dissipation efficiency can be improved.

[0064] Specifically, in the direction from the center of the accommodating cavity 11 to the rear shell, the second part 120 of the electronic device 100 may be provided with a heat source 30, a second uniform heat plate 52, a second film 402, a middle frame 12 and a rear shell in sequence. The second uniform heat plate 52 may be continuous in the second shell 102, covering the entire surface of the second shell 102 facing the accommodating cavity 11, or may be provided at intervals, and only arranged at the connection between the heat source 30 and the second shell 102.

[0065] It should be noted that the second film 402 is arranged between the second shell 102 and the second uniform heat plate 52, and the second uniform heat plate 52 will block a certain amount of heat radiation from being incident on and emitting from the surface of the second film 402. Similarly, the first film 401 is arranged between the first uniform heat plate 51 and the first shell 101, and the first uniform heat plate 51 will also have a certain negative effect on the reflection of heat on the surface of the first film 401. However, since the first uniform heat plate 51 and the second uniform heat plate 52 are thermally conductively connected to the heat source 30, the heat transfer path can be shortened and the heat dissipation efficiency can be improved. Therefore, the implementation method in which the heat reflective film 40 is arranged between the first uniform heat plate 51 or the second uniform heat plate 52 and the heat source 30 and the implementation method in which the heat reflective film 40 is arranged between the shell 10 and the first uniform heat plate 51 and the second uniform heat plate 52 can both achieve the effect of uniform heat dissipation, and the overall heat dissipation efficiency is not much different.

[0066] Please refer again Figure 3In some embodiments, the electronic device 100 includes a display screen 20, and the heat reflective film 40 includes a third film 403 and a fourth film 404, and the third film 403 and the fourth film 404 are both stacked with the display screen 20, the third film 403 is opposite to the first film 401, and the fourth film 404 is opposite to the second film 402.

[0067] In this way, the heat radiation waves can be reflected multiple times between the housing 10 and the display screen 20, and the heat is evenly dispersed in the accommodating cavity 11, thereby evenly dissipating the heat.

[0068] The third film 403 is disposed in the first part 110 of the electronic device 100, and may be attached to a side surface of the display screen 20 facing the accommodating cavity 11, or may be embedded in the internal structure of the display screen 20. The fourth film 404 is disposed in the second part 120 of the electronic device 100, and is disposed on the same side surface of the display screen 20 as the third film 403. Generally speaking, this side surface of the display screen 20 does not have a display function.

[0069] The first film 401, the second film 402, the third film 403 and the fourth film 404 may indicate heat reflective films 40 arranged at different positions, and should not be regarded as limiting the number of the plurality of heat reflective films 40 of the present application. The first film 401 may be a single heat reflective film 40, or may include a plurality of heat reflective films 40, and similarly, the number of the second film 402, the third film 403 and the fourth film 404 may be multiple.

[0070] It should be noted that the multiple heat reflective films 40 of the embodiment of the present application include at least two disposed on opposite sides of the heat source 30 so that the heat radiation waves can be evenly dispersed in the entire accommodating cavity 11 of the electronic device 100 without being concentrated on one side of the electronic device 100.

[0071] Please refer to Figure 7 In some embodiments, the third film 403 and the fourth film 404 are separated and arranged at the connection structure 14, so as to avoid bending and damage of the heat reflection film 40.

[0072] Specifically, the display screen 20 is continuously arranged at the first part 110 and the second part 120 of the electronic device 100, and can be bent with the rotation of the first part 110 at the connection structure 14, and the display screen 20 part at the connection structure 14 has a large internal stress. The display screen 20 can be made of a flexible material, with a high bending fatigue coefficient, so that it can withstand a large stress during multiple bending processes without being easily damaged. As mentioned above, the third film 403 and the fourth film 404 can be made of silicon oxide material, which is easy to break when bending. The third film 403 and the fourth film 404 are separated by a distance at one end at the connection structure 14. When the electronic device 100 is bent, the distance between the third film 403 and the fourth film 404 becomes larger in at least one direction, and the movement state of the third film 403 relative to the first shell 101 can be stationary, not bending with the folding of the electronic device 100, and similarly, the fourth film 404 of the electronic device 100 can remain stationary relative to the second shell 102 without bending.

[0073] Please refer to Figure 8 In some embodiments, the electronic device 100 further includes a first heat sink 61 and a second heat sink 62, both of which are thermally conductively connected to the display screen 20, the first heat sink 61 is stacked and connected to the third film 403, and the second heat sink 62 is stacked and connected to the fourth film 404.

[0074] In this way, the heat dissipation performance of the electronic device 100 can be improved.

[0075] Specifically, the first heat sink 61 and the second heat sink 62 can be a film or sheet made of a metal material with good thermal conductivity. For example, copper foil is used as the first heat sink 61 and the second heat sink 62. The display screen 20 is also provided with a display driver chip 33 and a light-emitting device (not shown) to generate heat during operation. The first heat sink 61 and the second heat sink 62 can be closely fitted with the display screen 20 and the display driver chip 33 to conduct heat. The third film 403 can be arranged between the heat source 30 and the first heat sink 61, close to the first heat sink 61, and has no contact connection with the heat source 30. The fourth film 404 can be arranged between the display driver chip 33 and the second heat sink 62.

[0076] Please refer again Figure 8 In some embodiments, the third film 403 is disposed between the first heat sink 61 and the display screen 20. In some embodiments, the fourth film 404 is disposed between the second heat sink 62 and the display screen 20.

[0077] In this way, the heat conducted through the first heat sink 61 and the second heat sink 62 is reflected by the third film 403 and the fourth film 404 , thereby promoting the dispersion and transfer of heat.

[0078] Specifically, similar to the way that the first uniform heat plate 51 and the second uniform heat plate 52 block the reflection of the first film 401 and the second film 402 without affecting the overall heat dissipation effect, the third film 403 is arranged between the first heat dissipation plate 61 and the display screen 20, and the fourth film 404 is arranged between the second heat dissipation plate 62 and the display screen 20. The reflection of the heat radiation wave by the heat reflective film 40 will be partially blocked, but not completely hindered, and the overall heat dissipation of the electronic device 100 is still uniform.

[0079] In some embodiments, the heat source 30 includes a main board 31 .

[0080] Specifically, the motherboard 31 is the main circuit board of the electronic device 100, which has complex functions such as encoding, signal reception and release, storage and control, and is the component with the highest power consumption in the electronic device 100. It can be understood that when the electronic device 100 is working, the heat emitted by the motherboard 31 is significantly higher than that of other heat sources 30. In the folding screen mobile phone 1001, the motherboard 31 is arranged in the first part 110, so that the heat of the first part 110 is more easily concentrated. The first film 401 and the second film 402 can be respectively arranged on the opposite sides of the motherboard 31, reflecting the heat emitted by the motherboard 31 to the third film 403 and the fourth film 404 in the second part 120, so as to achieve uniform heat dissipation.

[0081] In the following description, several embodiments of the present invention are shown in conjunction with the accompanying drawings:

[0082] Optional, such as Figure 3 In the illustrated embodiment, the first film 401 is disposed between the shell 10 and the first uniform heat plate 51, the second film 402 is disposed between the shell 10 and the second uniform heat plate 52, the third film 403 is disposed between the first heat dissipation plate 61 and the display screen 20, and the fourth film 404 is disposed between the second heat dissipation plate 62 and the display screen 20.

[0083] Optional, such as Figure 4 In the illustrated embodiment, the first film 401 is disposed between the heat source 30 and the first uniform heat plate 51, the second film 402 is disposed between the housing 10 and the second uniform heat plate 52, the third film 403 is disposed between the first heat dissipation plate 61 and the display screen 20, and the fourth film 404 is disposed between the second heat dissipation plate 62 and the display screen 20.

[0084] Optional, such as Figure 5 In the illustrated embodiment, the first film 401 is disposed between the housing 10 and the first uniform heat plate 51, the second film 402 is disposed between the heat source 30 and the second uniform heat plate 52, the third film 403 is disposed between the first heat dissipation plate 61 and the display screen 20, and the fourth film 404 is disposed between the second heat dissipation plate 62 and the display screen 20.

[0085] Optional, such as Figure 6In the illustrated embodiment, the first film 401 is disposed between the shell 10 and the first uniform heat plate 51, the second film 402 is disposed between the shell 10 and the second uniform heat plate 52, the third film 403 is disposed on a side surface of the first heat dissipation plate 61 facing the accommodating cavity 11, and the fourth film 404 is disposed between the second heat dissipation plate 62 and the display screen 20.

[0086] Optional, such as Figure 7 In the illustrated embodiment, the first film 401 is disposed between the heat source 30 and the first uniform heat plate 51, the second film 402 is disposed between the shell 10 and the second uniform heat plate 52, the third film 403 is disposed between the first heat dissipation plate 61 and the display screen 20, and the fourth film 404 is disposed on a side surface of the second heat dissipation plate 62 facing the accommodating cavity 11.

[0087] Optional, such as Figure 8 In the illustrated embodiment, the first film 401 is disposed between the heat source 30 and the first uniform heat plate 51, the second film 402 is disposed between the heat source 30 and the second uniform heat plate 52, the third film 403 is disposed between the first heat dissipation plate 61 and the display screen 20, and the fourth film 404 is disposed between the second heat dissipation plate 62 and the display screen 20.

[0088] Optional, such as Fig. 9 In the illustrated embodiment, the first film 401 is disposed between the heat source 30 and the first uniform heat plate 51, the second film 402 is disposed between the shell 10 and the second uniform heat plate 52, the third film 403 is disposed on a side surface of the first heat dissipation plate 61 facing the accommodating cavity 11, and the fourth film 404 is disposed between the second heat dissipation plate 62 and the display screen 20.

[0089] Optional, such as Fig.10 In the illustrated embodiment, the first film 401 is disposed between the shell 10 and the first uniform heat plate 51, the second film 402 is disposed between the heat source 30 and the second uniform heat plate 52, the third film 403 is disposed between the first heat dissipation plate 61 and the display screen 20, and the fourth film 404 is disposed on a side surface of the second heat dissipation plate 62 facing the accommodating cavity 11.

[0090] Optional, such as Fig.11 In the illustrated embodiment, the first film 401 is disposed between the shell 10 and the first uniform heat plate 51, the second film 402 is disposed between the heat source 30 and the second uniform heat plate 52, the third film 403 is disposed on a side surface of the first heat dissipation plate 61 facing the accommodating cavity 11, and the fourth film 404 is disposed between the second heat dissipation plate 62 and the display screen 20.

[0091] Optional, such as Fig.12In the illustrated embodiment, the first film 401 is disposed between the heat source 30 and the first uniform heat plate 51, the second film 402 is disposed between the heat source 30 and the second uniform heat plate 52, the third film 403 is disposed on a side surface of the first heat dissipation plate 61 facing the accommodating cavity 11, and the fourth film 404 is disposed on a side surface of the second heat dissipation plate 62 facing the accommodating cavity 11.

[0092] The positions where the heat reflective film 40 is arranged on the first film 401, the second film 402, the third film 403, and the fourth film 404 can be divided into the upper side and the lower side. For example, the first film 401 is arranged between the heat source 30 and the first uniform heat plate 51, the second film 402 is arranged between the heat source 30 and the second uniform heat plate 52, the third film 403 is arranged between the first heat dissipation plate 61 and the display screen 20, and the fourth film 404 is arranged between the second heat dissipation plate 62 and the display screen 20, all of which can be the upper side. The first film 401 is arranged between the housing 10 and the first uniform heat plate 51, the second film 402 is arranged between the housing 10 and the second uniform heat plate 52, the third film 403 is arranged on a side surface of the first heat dissipation plate 61 facing the accommodating cavity 11, and the fourth film 404 is arranged on a side surface of the second heat dissipation plate 62 facing the accommodating cavity 11, all of which can be the lower side. The heat reflective film 40 may be selectively disposed on the upper side or the lower side of the first film 401 , the second film 402 , the third film 403 , and the fourth film 404 , and may be combined in a suitable manner in any one or more embodiments or examples.

[0093] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0094] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A housing, wherein the housing is provided with a receiving cavity; a heat source, the heat source being disposed in the accommodating cavity; A plurality of heat reflecting films are respectively arranged on two opposite sides of the heat source, and the plurality of heat reflecting films are used to reflect the heat emitted by the heat source to a portion of the accommodating cavity away from the heat source.

2. The electronic device according to claim 1, characterized in that: The plurality of heat reflective films are arranged along a depth direction of the accommodating cavity.

3. The electronic device according to claim 1, characterized in that: The roughness of a surface of the heat reflective film facing the center of the accommodating cavity is greater than 0.01 mm.

4. The electronic device according to claim 1, characterized in that: The thickness of the heat reflective film is less than or equal to 0.05 mm.

5. The electronic device according to claim 1, characterized in that: The reflectivity of the heat reflective film to infrared light is greater than 90%.

6. The electronic device according to claim 1, characterized in that: The shell includes a first shell, a second shell and a connection structure, the first shell is rotatably arranged relative to the second shell through the connection structure, the heat source is arranged in the first shell, and the first shell and the second shell are both provided with the heat reflection film.

7. The electronic device according to claim 6, characterized in that: The heat reflective film includes a first film and a second film, the first film is disposed on the first shell, the second film is disposed on the second shell, and the first film and the second film are spaced apart at the connection structure.

8. The electronic device according to claim 7, characterized in that: The electronic device includes a first heat spreader stacked with the first film, the first heat spreader is disposed in the first shell, and the heat source is thermally conductively connected to the first heat spreader.

9. The electronic device according to claim 8, characterized in that: The first film is disposed between the first uniform heat plate and the first shell, and the heat source is disposed on the first uniform heat plate.

10. The electronic device according to claim 7, characterized in that: The electronic device includes a second heat spreader stacked with the second film, and the second heat spreader is disposed on the second shell.

11. The electronic device according to claim 10, characterized in that: The second film is disposed between the second shell and the second uniform heat plate.

12. The electronic device according to claim 7, characterized in that: The electronic device includes a display screen, and the heat reflective film includes a third film and a fourth film. The third film and the fourth film are both stacked with the display screen, the third film is opposite to the first film, and the fourth film is opposite to the second film.

13. The electronic device according to claim 12, characterized in that: The third film and the fourth film are spaced apart from each other at the connection structure.

14. The electronic device according to claim 12, characterized in that: The electronic device further comprises a first heat sink and a second heat sink, both of which are thermally conductively connected to the display screen, the first heat sink is laminated and connected to the third film, and the second heat sink is laminated and connected to the fourth film.

15. The electronic device according to claim 14, characterized in that: The third film is disposed between the first heat dissipation plate and the display screen; and / or the fourth film is disposed between the second heat dissipation plate and the display screen.

16. The electronic device according to claim 1, characterized in that: The heat source includes a mainboard.

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