Package structure

Abstract

A package structure is provided that may include a housing and a power component disposed inside the housing. The shell can comprise a top cover and a bottom shell, and the top cover and the bottom shell are in butt joint to form the shell. A first heat exchange medium channel can be formed in the top cover, a second heat exchange medium channel can be formed in the bottom shell, and the first heat exchange medium channel and the second heat exchange medium channel are used for being communicated with an external heat dissipation circulation system. The power assembly can comprise a first circuit board and a second circuit board, the first circuit board and the second circuit board can be oppositely arranged, the first circuit board can be arranged on the top cover, and the second circuit board can be arranged on the bottom shell; the first circuit board can be provided with at least one first heating device, and the first heating device can abut against the inner wall of the top cover. The second circuit board can be provided with at least one second heating device, and the second heating device can abut against the inner wall of the bottom shell. When the structure is adopted, the high power density and the high heat dissipation efficiency can be achieved.

Description

Package structure

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on April 28, 2022, with application number 202221014984.5 and application name “Packaging Structure”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of electrical equipment, and in particular to a packaging structure. Background Art

[0004] The development trend of packaging structures, such as power modules, is towards increasing power. Conventional heat dissipation methods are unable to meet these requirements, leading to the widespread use of water cooling. High-power water-cooled power modules typically use a die-cast housing, with water channels typically built into the housing or a dedicated heat sink. Heat-generating components such as insulated gate bipolar transistors (IGBTs), magnetic devices, and metal-oxide-semiconductor field-effect transistors (MOSFETs) are bonded to the water channel walls to dissipate heat. These water-cooled power modules can only accommodate a single circuit board and have low power density.

[0005] Summary of the Invention

[0006] The present application provides a packaging structure to solve the problem of low power density of existing packaging structures.

[0007] The present application provides a packaging structure that may include a shell and a power component. The shell may have a first accommodation space inside, and the power component may be arranged in the first accommodation space. The shell may include a top cover and a bottom shell, and the top cover and the bottom shell are connected to form the shell; the top cover may have a first heat exchange medium channel inside, and the bottom shell may have a second heat exchange medium channel inside, and the first heat exchange medium channel and the second heat exchange medium channel are respectively used to communicate with an external heat dissipation circulation system. The power component may include a first circuit board and a second circuit board, and the first circuit board and the second circuit board may be arranged facing each other, the first circuit board may be arranged on the top cover, and the second circuit board may be arranged on the bottom shell; at least one first heating device may be arranged on the first circuit board, and the first heating device may abut against the inner wall of the top cover; at least one second heating device may be arranged on the second circuit board, and the second heating device may abut against the inner wall of the bottom shell.

[0008] The technical solution provided by this application is that a first circuit board and a second circuit board are arranged inside the housing, which can improve the power density of the packaging structure. The first circuit board and the second circuit board are arranged opposite each other and are respectively arranged on the top cover and the bottom shell, which can make more full use of the internal space of the housing and is also more convenient for circuit board assembly. The top cover and the bottom shell are respectively provided with a first heat exchange medium channel and a second heat exchange medium channel, which have a large heat dissipation area and high heat dissipation efficiency. They can effectively dissipate heat from the first heating device on the first circuit board and the second heating device on the second circuit board, thereby improving the operating reliability of the devices.

[0009] In one specific embodiment, a first guide assembly can be provided between the first circuit board and the second circuit board. The first guide assembly can include a guide pin and a guide cylinder. The guide pin can be provided on the first circuit board, and the guide cylinder can be provided on the second circuit board. The guide pin and the guide cylinder can be pluggably connected. This provides preliminary guidance for the docking of the top cover and the bottom shell, allowing the top cover and the bottom shell to dock accurately.

[0010] In one specific embodiment, a second guide assembly can be provided between the first and second circuit boards. The second guide assembly can include a first signal connection terminal and a second signal connection terminal. The first signal connection terminal can be provided on the first circuit board, and the second signal connection terminal can be provided on the second circuit board. The first and second signal connection terminals can be pluggably connected. This allows for precise guidance of the top cover and bottom shell during docking, allowing for more accurate docking of the top cover and bottom shell.

[0011] In a specific embodiment, a third heating device may be provided in the housing, and the third heating device may abut against one or both of the bottom shell and the top cover. The third heating device may be a relatively tall device, and the arrangement of devices inside the housing has high flexibility.

[0012] In a specific embodiment, the first circuit board can have a first avoidance notch, and the third heating device can pass through the first avoidance notch to abut the inner wall of the top cover. The second circuit board can have a second avoidance notch, and the third heating device can pass through the second avoidance notch to abut the inner wall of the bottom shell. In this way, the third heating device can be arranged relatively densely with the first and second circuit boards without having to avoid the entire first and second circuit boards, which increases the flexibility of device layout and reduces space occupation.

[0013] In one specific embodiment, the outer wall of the bottom shell can be provided with an adapter for connecting to an external heat dissipation circulation system. The adapter can be connected to the first heat exchange medium channel and the second heat exchange medium channel, respectively. Located outside the shell, the adapter can achieve water and electricity isolation, improving the reliability of the packaging structure.

[0014] In a specific embodiment, a first transfer channel, a second transfer channel, and a third transfer channel may be provided inside the adapter. The first end of the first transfer channel is used to communicate with an external heat dissipation circulation system, and the second end of the first transfer channel can be communicated with the first end of the first heat exchange medium channel. The first end of the second transfer channel can be communicated with the second end of the first heat exchange medium channel, and the second end of the second transfer channel can be communicated with the first end of the second heat exchange medium channel. The first end of the third transfer channel can be communicated with the second end of the second heat exchange medium channel, and the second end of the third transfer channel is used to communicate with the external heat dissipation circulation system. In this way, the first heat exchange medium channel and the second heat exchange medium channel can be connected to the external heat dissipation circulation system, and the first heat exchange medium channel and the second heat exchange medium channel are connected in series.

[0015] In a specific embodiment, a fourth transfer channel, a fifth transfer channel, a sixth transfer channel, and a seventh transfer channel may be provided inside the adapter. The first end of the fourth transfer channel may be in communication with the first end of the first heat exchange medium channel, and the second end of the fourth transfer channel may be in communication with the first end of the second heat exchange medium channel. The first end of the fifth transfer channel may be in communication with the second end of the first heat exchange medium channel, and the second end of the fifth transfer channel may be in communication with the second end of the second heat exchange medium channel. The first end of the sixth transfer channel is used to communicate with an external heat dissipation circulation system, and the second end of the sixth transfer channel may be in communication with the fourth transfer channel. The first end of the seventh transfer channel is used to communicate with an external heat dissipation circulation system, and the second end of the seventh transfer channel may be in communication with the fifth transfer channel. In this way, the first heat exchange medium channel and the second heat exchange medium channel can be connected to the external heat dissipation circulation system, and the first heat exchange medium channel and the second heat exchange medium channel are connected in parallel.

[0016] In a specific embodiment, the adapter and the bottom shell can be integrally formed, so that the adapter and the second heat exchange medium channel can be directly connected, which has higher reliability.

[0017] In a specific embodiment, a sealing ring may be provided at the connection between the adapter and the first heat exchange medium channel, thereby enhancing the airtightness of the connection.

[0018] In a specific embodiment, the first heat exchange medium channel may be U-shaped, and / or the second heat exchange medium channel may be U-shaped, so as to have a larger heat dissipation area.

[0019] In one specific embodiment, the bottom housing includes a bottom wall and a plurality of first side walls. The plurality of first side walls may be arranged on the bottom wall along its circumference and sequentially connected. The second heat exchange medium channel may be provided on the bottom wall. This allows heat dissipation from components on the back side of the second circuit board.

[0020] In one specific embodiment, the second heat exchange medium channel can extend from the bottom wall to the first side wall. This can dissipate heat from components on the back of the second circuit board as well as components near the first side wall of the bottom housing, providing a larger heat dissipation area and improving heat dissipation efficiency.

[0021] In one specific embodiment, the top cover may have a second storage space within it, a third circuit board may be disposed within the second storage space, and at least one fourth heating element may be disposed on the third circuit board. The top cover may have a second sidewall facing the bottom shell, the first heat exchange medium channel may be disposed within the second sidewall, and the fourth heating element may abut against the second sidewall. The first heating element may abut against the second sidewall. In this way, the entire package structure can have three circuit boards, and the package structure can have a higher power density. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG1 is a schematic diagram of an exploded structure of a packaging structure provided in an embodiment of the present application;

[0023] FIG2 is a schematic diagram of a partial structure of a packaging structure provided in an embodiment of the present application;

[0024] FIG3 is a schematic diagram of a partial structure of a packaging structure provided in an embodiment of the present application;

[0025] FIG4 is a schematic diagram of a partial cross-sectional structure of a top cover of a packaging structure provided in an embodiment of the present application;

[0026] FIG5 is a schematic diagram of a partial cross-sectional structure of a bottom shell of a packaging structure provided in an embodiment of the present application;

[0027] FIG6 is a schematic diagram of a circuit board assembly of a packaging structure provided in an embodiment of the present application;

[0028] FIG7 is a schematic diagram of the external connection of the packaging structure provided in an embodiment of the present application;

[0029] FIG8 is a schematic diagram of a circuit board assembly of a packaging structure provided in an embodiment of the present application;

[0030] FIG9 is a schematic structural diagram of an adapter of a packaging structure provided in an embodiment of the present application;

[0031] FIG10 is a partial enlarged view of FIG9;

[0032] FIG11 is a schematic diagram of the heat exchange medium circulation of the packaging structure provided in an embodiment of the present application;

[0033] FIG12 is a schematic diagram of heat exchange medium circulation in a packaging structure provided by another embodiment of the present application;

[0034] FIG13 is a schematic diagram of a partial cross-sectional structure of a housing of a packaging structure provided in an embodiment of the present application;

[0035] FIG14 is a schematic diagram of the distribution of the second heat exchange medium channels of the packaging structure provided in an embodiment of the present application;

[0036] FIG15 is a schematic diagram showing the distribution of the second heat exchange medium channels of the packaging structure provided by another embodiment of the present application;

[0037] FIG16 is a schematic diagram showing the distribution of the first heat exchange medium channel of the packaging structure provided in an embodiment of the present application.

[0038] Reference numerals: 100 - top cover; 200 - bottom shell; 300 - first circuit board; 400 - second circuit board; 500 - third heating element; 600 - adapter; 700 - sealing ring; 101 - first heat exchange medium channel; 102 - third circuit board; 103 - second side wall; 104 - fourth heating element; 201 - second heat exchange medium channel; 202 - bottom wall; 203 - first side wall; 301 - first heating element; 302 - guide pin; 303 - first power connection terminal; 304 - first avoidance notch; 401 - second heating element; 402 - guide cylinder; 403 - second power connection terminal; 404 - second avoidance notch; 405 - external connection terminal; 601 - first transfer channel; 602 - second transfer channel; 603 - third transfer channel; 604 - fourth transfer channel; 605 - fifth transfer channel; 606 - sixth transfer channel; 607 - seventh transfer channel. DETAILED DESCRIPTION

[0039] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0040] For ease of understanding, the application scenarios of the packaging structure involved in this application are first explained. The packaging structure provided in the embodiments of this application is suitable for electrical equipment and can be used as a power module. It can be applied to the field of vehicle-mounted equipment, such as a power module for vehicle-mounted charging equipment, for realizing functions such as car charging.

[0041] Taking power modules as an example, existing high-power water-cooled power modules typically use a die-cast housing. The water channel is typically built into the housing or a dedicated heat sink. Heat-generating components, such as insulated gate bipolar transistors (IGBTs), magnetic devices, and metal-oxide-semiconductor field-effect transistors (MOSFETs), adhere to the water channel walls to dissipate heat. This type of water-cooled power module can only accommodate a single circuit board, resulting in low power density.

[0042] Based on this, an embodiment of the present application provides a packaging structure to improve the power density of the packaging structure.

[0043] First, refer to Figures 1, 2 and 3. Figure 1 shows an exploded structural schematic diagram of the packaging structure provided in an embodiment of the present application, Figure 2 shows a partial structural schematic diagram of the packaging structure provided in an embodiment of the present application, and Figure 3 shows a partial structural schematic diagram of the packaging structure provided in an embodiment of the present application. As shown in Figures 1, 2 and 3, the packaging structure provided in an embodiment of the present application may include a shell and a power component. There is a first accommodating space inside the shell. The shell may include a top cover 100 and a bottom shell 200, and the top cover 100 and the bottom shell 200 are docked to form a shell with a first accommodating space inside. There may be a first heat exchange medium channel inside the top cover 100, and there may be a second heat exchange medium channel inside the bottom shell 200. The first heat exchange medium channel and the second heat exchange medium channel may be connected to an external heat dissipation circulation system respectively. The external heat dissipation circulation system may use water as the heat exchange medium.

[0044] The power assembly is disposed within the first accommodation space. The power assembly may include a first circuit board 300 and a second circuit board 400. The first circuit board 300 and the second circuit board 400 may be disposed opposite each other. Specifically, the front of the first circuit board 300 and the front of the second circuit board 400 may be disposed opposite each other. The back of the first circuit board 300 faces the top cover 100. The first circuit board 300 may be secured to the top cover 100 using screws or other fasteners. The back of the first circuit board 300 refers to the side opposite the front of the first circuit board 300. The back of the second circuit board 400 faces the bottom case 200. The second circuit board 400 may be secured to the bottom case 200 using screws or other fasteners. The back of the second circuit board 400 refers to the side opposite the front of the second circuit board 400. In specific applications, components taller on the front of the first circuit board 300 and taller on the front of the second circuit board 400 may be staggered. This reduces the distance between the first circuit board 300 and the second circuit board 400, minimizing the space occupied by the first circuit board 300 and the second circuit board 400, thereby reducing the volume of the housing.

[0045] Figure 4 shows a partial cross-sectional view of the top cover of a package structure provided in an embodiment of the present application, and Figure 5 shows a partial cross-sectional view of the bottom case of a package structure provided in an embodiment of the present application. As shown in Figures 4 and 5 , a first heating element 301 may be provided on the first circuit board 300, abutting the inner wall of the top cover 100. Specifically, the first heating element 301 may be arranged on the back side of the first circuit board 300. In practice, if a gap exists between the first heating element 301 and the inner wall of the top cover 100 due to component tolerances, assembly tolerances, or other factors, the gap may be filled with thermally conductive gel. In practice, there may be at least one first heating element 301, and the first heating element 301 may be of at least one type. For example, the first heating element 301 may include, but is not limited to, an IGBT, a magnetic device, a MOSFET, a diode, and the like. A second heating element 401 may be provided on the second circuit board 400, abutting the inner wall of the bottom case 200. Specifically, the second heating element 401 may be arranged on the back side of the second circuit board 400. Similarly, if there is a gap between the second heating element 401 and the inner wall of the bottom case 200, it can be filled with thermally conductive gel. The number of the second heating element 401 can be at least one, and the type of the second heating element 401 can be at least one.

[0046] The packaging structure provided by the embodiment of the present application has a first circuit board 300 and a second circuit board 400 arranged inside the shell, which can improve the power density of the packaging structure. The top cover 100 and the bottom shell 200 are connected to form a shell, and the structure is relatively simple. The first circuit board 300 and the second circuit board 400 are arranged opposite to each other and are respectively arranged on the top cover 100 and the bottom shell 200, which can make full use of the internal space of the shell and is also convenient for circuit board assembly. The top cover 100 and the bottom shell 200 are respectively provided with a first heat exchange medium channel and a second heat exchange medium channel, which have a large heat dissipation area and a high heat dissipation efficiency. The first heating device 301 on the first circuit board 300 and the second heating device 401 on the second circuit board 400 can be effectively cooled, thereby improving the working reliability of the device.

[0047] Referring again to Figures 1, 2 and 3, as a possible embodiment, a third heating device 500 is provided in the housing, and the third heating device 500 can abut against the bottom shell 200 and the top cover 100 at the same time, or can abut against one of the bottom shell 200 and the top cover 100. Exemplarily, the third heating device 500 can be a device with a relatively high height, such as a magnetic device, and the two ends of the third heating device 500 in the height direction abut against the bottom shell 200 and the top cover 100 respectively to achieve heat dissipation. Specifically, one end of the third heating device 500 can be fixedly connected to the bottom shell 200 and abut against the inner wall of the bottom shell 200, and the other end of the magnetic device abuts against the inner wall of the top cover 100. It is understandable that the third heating device 500 can also be fixedly connected to the top cover 100 at one end and abut against the inner wall of the top cover 100, and the other end abuts against the inner wall of the bottom shell 200.

[0048] In a specific implementation, the first circuit board 300 may have a first avoidance notch 304, through which one end of the third heating device 500 may pass to abut against the inner wall of the top cover 100. The second circuit board 400 may have a second avoidance notch 404, through which the third heating device 500 may pass to abut against the inner wall of the bottom case 200. In this way, the third heating device 500 can be arranged relatively densely with the first and second circuit boards 300, 400, without having to avoid the entire first and second circuit boards 300, 400. This provides greater device layout flexibility and minimizes space usage.

[0049] FIG6 shows a schematic diagram of the circuit board assembly of the packaging structure provided by an embodiment of the present application. As shown in FIG6 , as a possible embodiment, a first guide assembly can be provided between the first circuit board 300 and the second circuit board 400. The first guide assembly can include a guide pin 302 and a guide cylinder 402. The guide pin 302 can be provided on the first circuit board 300, specifically on the front of the first circuit board 300. The guide cylinder 402 can be provided on the second circuit board 400, specifically on the front of the second circuit board 400. During assembly, the first circuit board 300 can be fixed to the top cover 100, and the second circuit board 400 can be fixed to the bottom shell 200, and then the top cover 100 and the bottom shell 200 are docked. At this time, the guide pin 302 is plugged into the guide cylinder 402 to provide preliminary guidance for the docking of the top cover 100 and the bottom shell 200, so that the top cover 100 and the bottom shell 200 can be accurately docked.

[0050] As a possible embodiment, a second guide component may be further provided between the first circuit board 300 and the second circuit board 400. The second guide component may include a first signal connection terminal and a second signal connection terminal. The first signal connection terminal may be provided on the first circuit board 300, specifically on the front side of the first circuit board 300. The second signal connection terminal may be provided on the second circuit board 400, specifically on the front side of the second circuit board 400. During assembly, the first signal connection terminal and the second signal connection terminal are plugged in and connected to each other, which can achieve precise guidance of the docking of the top cover 100 and the bottom shell 200, so that the top cover 100 and the bottom shell 200 can be docked more accurately. At the same time, after the first signal connection terminal and the second signal connection terminal are plugged in and matched, the signal connection between the first circuit board 300 and the second circuit board 400 can be achieved.

[0051] Figure 7 shows a schematic diagram of the external connection of the packaging structure provided by an embodiment of the present application. As shown in Figure 7, in a specific implementation, a third signal connection terminal may be provided on the first circuit board or the second circuit board. Exemplarily, the third signal connection terminal may be provided on the second circuit board and located on the front of the second circuit board. In a specific implementation, an external socket may be provided on the bottom shell corresponding to the third signal connection terminal, and the second circuit board and the first circuit board may communicate with the outside world through the third signal connection terminal. Specifically, the third signal connection terminal can serve as a connection terminal of a plug-in connector, and the plug-in connector includes a third signal connection terminal and an external connection terminal 405. The third signal connection terminal and the external connection terminal 405 are plugged in and connected to realize communication between the second circuit board and the first circuit board and the outside world.

[0052] FIG8 is a schematic diagram showing the circuit board assembly of the packaging structure provided in an embodiment of the present application. As shown in FIG8 , in a specific implementation, a power connection assembly may be provided between the first circuit board 300 and the second circuit board 400. The power connection assembly may include a first power connection terminal 303 and a second power connection terminal 403. The first power connection terminal 303 may be provided on the first circuit board 300, specifically on the front of the first circuit board 300. The second power connection terminal 403 may be provided on the second circuit board 400, specifically on the front of the second circuit board 400. During specific assembly, after the first power connection terminal 303 and the second power connection terminal 403 are plugged in and matched, the power connection between the first circuit board 300 and the second circuit board 400 can be achieved. Specifically, the power connection assembly may be a pin-paddle type connector, which can absorb a certain assembly tolerance. Similarly, a third power connection terminal can be provided on the first circuit board 300 or the second circuit board 400. For example, the third power connection terminal can be provided on the second circuit board 400 and located on the front of the second circuit board 400. The bottom shell 200 also has an external socket corresponding to the third power connection terminal. The second circuit board 400 and the first circuit board 300 can achieve power connection with the outside world through the third power connection terminal.

[0053] FIG9 is a schematic diagram of the structure of the adapter of the packaging structure provided by an embodiment of the present application, and FIG10 is a partial enlarged view of FIG9. As shown in FIG9 and FIG10, as a possible embodiment, the outer wall of the bottom shell 200 can be provided with an adapter 600, which is connected to the external heat dissipation circulation system and is respectively connected to the first heat exchange medium channel and the second heat exchange medium channel. The adapter 600 is located outside the shell to achieve water and electricity isolation. If the heat exchange medium leaks, it will only occur outside the shell, which can improve the reliability of the packaging structure.

[0054] FIG11 is a schematic diagram showing the heat exchange medium circulation of the packaging structure provided in an embodiment of the present application. As shown in FIG11 , in a specific implementation, a first transfer channel 601, a second transfer channel 602, and a third transfer channel 603 may be provided inside the adapter. Among them, the first end of the first transfer channel 601 can be connected to an external heat dissipation circulation system, and the second end of the first transfer channel 601 can be connected to the first end of the first heat exchange medium channel. The first end of the second transfer channel 602 can be connected to the second end of the first heat exchange medium channel, and the second end of the second transfer channel 602 can be connected to the first end of the second heat exchange medium channel. The first end of the third transfer channel 603 can be connected to the second end of the second heat exchange medium channel, and the second end of the third transfer channel 603 can be connected to the external heat dissipation circulation system. In this way, the first heat exchange medium channel and the second heat exchange medium channel can be connected to the external heat dissipation circulation system, and the first heat exchange medium channel and the second heat exchange medium channel are connected in series. As shown by the arrows in the figure, the flow path of the heat exchange medium can be: external heat dissipation circulation system connection, first transfer channel 601, first heat exchange medium channel, second transfer channel 602, second heat exchange medium channel, third transfer channel 603, external heat dissipation circulation system connection.

[0055] Figure 12 shows a schematic diagram of the heat exchange medium flow in a packaging structure provided in another embodiment of the present application. As shown in Figure 12, in another specific implementation, a fourth transfer channel 604, a fifth transfer channel 605, a sixth transfer channel 606, and a seventh transfer channel 607 may be provided within the adapter. The first end of the fourth transfer channel 604 may be connected to the first end of the first heat exchange medium channel, and the second end of the fourth transfer channel 604 may be connected to the first end of the second heat exchange medium channel. The first end of the fifth transfer channel 605 may be connected to the second end of the first heat exchange medium channel, and the second end of the fifth transfer channel 605 may be connected to the second end of the second heat exchange medium channel. The first end of the sixth transfer channel 606 may be connected to an external heat dissipation circulation system, and the second end of the sixth transfer channel 606 may be connected to the fourth transfer channel 604. The first end of the seventh transfer channel 607 may be connected to an external heat dissipation circulation system, and the second end of the seventh transfer channel 607 may be connected to the fifth transfer channel 605. In this way, the first heat exchange medium channel and the second heat exchange medium channel can be connected to the external heat dissipation circulation system, and the first heat exchange medium channel and the second heat exchange medium channel are connected in parallel. In actual application, the connection form of the first heat exchange medium channel and the second heat exchange medium channel can be specifically selected according to the layout of the components inside the shell, the heating conditions of the components, etc. As shown by the arrows in the figure, the flow path of the heat exchange medium can be: connected to the external heat dissipation circulation system, the sixth transfer channel 606, the fourth transfer channel 604, the first heat exchange medium channel, the fifth transfer channel 605, the seventh transfer channel 607, and connected to the external heat dissipation circulation system; and connected to the external heat dissipation circulation system, the sixth transfer channel 606, the fourth transfer channel 604, the second heat exchange medium channel, the fifth transfer channel 605, the seventh transfer channel 607, and connected to the external heat dissipation circulation system.

[0056] FIG13 shows a schematic diagram of a partial cross-sectional structure of the shell of the packaging structure provided by an embodiment of the present application. As shown in FIG13 , as a possible embodiment, the adapter 600 can be integrally formed with the bottom shell 200, so that the adapter 600 is directly connected to the second heat exchange medium channel 201. The adapter 600 is docked with the first heat exchange medium channel 101, and a sealing ring 700 can be provided at the connection between the two to enhance the airtightness of the connection. In addition, the provision of the sealing ring 700 can also absorb the assembly tolerance of the top cover 100 and the bottom shell 200 to a certain extent, thereby ensuring precise positioning between the first circuit board and the second circuit board.

[0057] As a possible embodiment, the first heat exchange medium channel can be U-shaped and have a larger heat dissipation area. The first heat exchange medium channel can also be of other shapes. In specific implementation, the shape of the first heat exchange medium channel can be guided by the distribution of the first heating device on the first circuit board, thereby ensuring that the first heat exchange medium channel passes through the distribution position of the first heating device, and the first heating device can contact the passing area of ​​the first heat exchange medium channel, thereby improving the heat dissipation effect of the first heating device. The shape of the second heat exchange medium channel can be the same as or different from that of the first heat exchange medium channel. For example, the second heat exchange medium channel can be U-shaped or of other shapes. Similarly, the shape of the second heat exchange medium channel can be guided by the distribution of the second heating device on the second circuit board, thereby ensuring the heat dissipation effect of the second heating device.

[0058] Figure 14 shows a schematic diagram of the distribution of the second heat exchange medium channel of the packaging structure provided in an embodiment of the present application, and Figure 15 shows a schematic diagram of the distribution of the second heat exchange medium channel of the packaging structure provided in another embodiment of the present application. As a possible embodiment, the bottom shell may include a bottom wall 202 and a plurality of first side walls 203, and the plurality of first side walls 203 may be arranged on the bottom wall 202 along the circumference of the bottom wall 202, and the plurality of first side walls 203 are connected in sequence, so that the bottom shell can be understood as a groove-like structure. In actual applications, the back side of the second circuit board may face the bottom wall 202 of the bottom shell. In some possible embodiments, the second heat exchange medium channel 201 may be arranged on the bottom wall 202 of the bottom shell, and the heat exchange medium may pass through the bottom wall 202 of the bottom shell, so as to achieve heat dissipation of the components on the back side of the second circuit board. In some other possible embodiments, the second heat exchange medium channel 201 can extend from the bottom wall 202 of the bottom shell to the first side wall 203, that is, the second heat exchange medium channel 201 can be distributed on both the bottom wall 202 and the first side wall 203 of the bottom shell, and the heat exchange medium can pass through the bottom wall 202 and the first side wall 203 of the bottom shell, which can not only dissipate heat for the components on the back of the second circuit board, but also dissipate heat for the components close to the first side wall 203 of the bottom shell, and has a larger heat dissipation area, which can improve heat dissipation efficiency. In specific applications, the second heat exchange medium channel 201 can be distributed on the bottom wall 202 of the bottom shell and multiple first side walls 203. For example, as shown in Figure 14, the second heat exchange medium channel 201 is distributed on the bottom wall 202 of the bottom shell and two facing first side walls 203; or, as shown in Figure 15, the second heat exchange medium channel 201 can be distributed on the bottom wall 202 and one first side wall 203 of the bottom shell. The distribution of the second heat exchange medium channels 201 on the bottom shell can be specifically determined according to the actual layout of the components inside the shell.

[0059] Figure 16 shows a schematic diagram of the distribution of the first heat exchange medium channel of the packaging structure provided by an embodiment of the present application. As shown in Figure 16, as a possible embodiment, the top cover 100 may have a second storage space within it, and a third circuit board 102 may be disposed within the second storage space. The top cover 100 may have a second sidewall 103 facing the bottom shell 200, and the first heat exchange medium channel 101 may be disposed within the second sidewall 103. The back of the third circuit board 102 may face the second sidewall 103. A fourth heating element 104 may be disposed on the third circuit board 102. Specifically, the fourth heating element 104 may be disposed on the back of the third circuit board 102 and abut against the second sidewall 103. There may be at least one fourth heating element 104, and the fourth heating element 104 may be of at least one type. In a specific arrangement, the first heating element may abut against the second sidewall 103, thereby allowing the first and fourth heating elements 104 to share the first heat exchange medium channel 101. The overall packaging structure comprises three circuit boards, which can achieve a higher power density.

[0060] The above is only a specific implementation method of the present application, but the protection scope of the present application is not limited thereto. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in this application should be covered by the protection scope of the present application.

Claims

1. A packaging structure, characterized in that: The power module comprises a housing and a power assembly, wherein the housing has a first accommodation space inside, and the power assembly is arranged in the first accommodation space; The housing includes a top cover and a bottom shell, and the top cover and the bottom shell are connected to form the housing; a first heat exchange medium channel is provided inside the top cover, and a second heat exchange medium channel is provided inside the bottom shell, and the first heat exchange medium channel and the second heat exchange medium channel are respectively used to communicate with an external heat dissipation circulation system; The power component includes a first circuit board and a second circuit board, the first circuit board and the second circuit board are arranged opposite to each other, the first circuit board is arranged on the top cover, and the second circuit board is arranged on the bottom shell; at least one first heating device is arranged on the first circuit board, and the first heating device abuts against the inner wall of the top cover; at least one second heating device is arranged on the second circuit board, and the second heating device abuts against the inner wall of the bottom shell.

2. The packaging structure according to claim 1, wherein: A first guide assembly is provided between the first circuit board and the second circuit board; The first guide assembly includes a guide pin and a guide cylinder. The guide pin is arranged on the first circuit board, and the guide cylinder is arranged on the second circuit board. The guide pin is plug-connected to the guide cylinder.

3. The packaging structure according to claim 1 or 2, wherein: A second guide assembly is provided between the first circuit board and the second circuit board; The second guide component includes a first signal connection terminal and a second signal connection terminal. The first signal connection terminal is arranged on the first circuit board, and the second signal connection terminal is arranged on the second circuit board. The first signal connection terminal is plug-connected with the second signal connection terminal.

4. The packaging structure according to any one of claims 1 to 3, wherein: A third heating device is provided in the housing, and the third heating device abuts against one or both of the bottom shell and the top cover.

5. The packaging structure according to claim 4, wherein: The first circuit board has a first avoidance notch, and the third heating element passes through the first avoidance notch and abuts against the inner wall of the top cover; The second circuit board has a second avoidance notch, and the third heating element passes through the second avoidance notch and abuts against the inner wall of the bottom shell.

6. The packaging structure according to any one of claims 1 to 5, wherein: An adapter is provided on the outer wall of the bottom shell, and the adapter is used to communicate with the external heat dissipation circulation system. The adapter is respectively communicated with the first heat exchange medium channel and the second heat exchange medium channel.

7. The packaging structure according to claim 6, wherein: The adapter is provided with a first transfer channel, a second transfer channel and a third transfer channel; The first end of the first transfer channel is used to communicate with the external heat dissipation circulation system, and the second end of the first transfer channel is communicated with the first end of the first heat exchange medium channel; The first end of the second transfer channel is in communication with the second end of the first heat exchange medium channel, and the second end of the second transfer channel is in communication with the first end of the second heat exchange medium channel; The first end of the third transfer channel is communicated with the second end of the second heat exchange medium channel, and the second end of the third transfer channel is used to communicate with the external heat dissipation circulation system.

8. The packaging structure according to claim 6, wherein: The adapter is provided with a fourth transfer channel, a fifth transfer channel, a sixth transfer channel and a seventh transfer channel; The first end of the fourth transfer channel is connected to the first end of the first heat exchange medium channel. The second end of the channel is in communication with the first end of the second heat exchange medium channel; The first end of the fifth transfer channel is in communication with the second end of the first heat exchange medium channel, and the second end of the fifth transfer channel is in communication with the second end of the second heat exchange medium channel; The first end of the sixth transfer channel is used to communicate with the external heat dissipation circulation system, and the second end of the sixth transfer channel is communicated with the fourth transfer channel; The first end of the seventh transfer channel is used to communicate with the external heat dissipation circulation system, and the second end of the seventh transfer channel is communicated with the fifth transfer channel.

9. The packaging structure according to claim 6, wherein: The adapter and the bottom shell are integrally formed.

10. The packaging structure according to claim 6 or 9, characterized in that: A sealing ring is provided at the connection between the adapter and the first heat exchange medium channel.

11. The packaging structure according to any one of claims 1 to 10, wherein: The first heat exchange medium channel is U-shaped, and / or the second heat exchange medium channel is U-shaped.

12. The packaging structure according to any one of claims 1 to 11, wherein: The bottom shell includes a bottom wall and a plurality of first side walls, wherein the plurality of first side walls are arranged on the bottom wall along a circumferential direction of the bottom wall, and the plurality of first side walls are connected in sequence; The second heat exchange medium channel is provided on the bottom wall.

13. The packaging structure according to claim 12, wherein: The second heat exchange medium channel extends from the bottom wall to the first side wall.

14. The packaging structure according to any one of claims 1 to 13, wherein: The top cover has a second accommodating space inside, a third circuit board is arranged in the second accommodating space, and at least one fourth heating element is arranged on the third circuit board; The top cover has a second side wall facing the bottom shell, the first heat exchange medium channel is arranged in the second side wall, and the fourth heating element abuts against the second side wall; The first heating element abuts against the second side wall.

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