A crown block device and a control method thereof

Abstract

The application discloses a crown block device and a control method thereof. The device comprises a crown block body, a side shifting device and a grabbing device. At least one buffer platform is arranged on the crown block body. The side shifting device is connected with the crown block body. The grabbing device is connected with the side shifting device. The side shifting device drives the grabbing device to move above the buffer platform. At least one buffer platform for storing wafer boxes is arranged on the crown block body. The wafer box is moved and placed on the buffer platform by the side shifting device. In the process of the movement of the crown block, a wafer box can be carried by the grabbing device. Therefore, the crown block can carry multiple wafer boxes in one trip, the carrying capacity of the crown block is greatly improved, and the production capacity of a chip manufacturing factory is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of overhead crane conveying equipment, in particular to an overhead crane device and a control method thereof. BACKGROUND

[0002] The main part of the overhead crane system is an overhead crane and a track. The track is suspended on the clean factory ceiling keel, and the overhead crane runs on the track. The built-in motor of the overhead crane drives the belt to drive the grabbing device to grab the wafer box and temporarily store it in the abdominal cavity of the overhead crane, and then move to the target machine table through the track throughout the factory. The built-in motor of the overhead crane drives the belt to lift and at the same time drives the grabbing device to put the wafer box on the equipment loading platform. Thus, the function of automatically loading and unloading materials is realized. The overhead crane system replaces the traditional manual conveying, solves the problem of insufficient manpower in the factory, improves the accuracy of conveying and production efficiency, and reduces the loss of products caused by human factors. Therefore, the automatic overhead crane system is favored by high-end manufacturing industries such as chip manufacturing.

[0003] The traditional overhead crane can carry at most one wafer box per trip. In some special manufacturing processes and steps, two or three wafer boxes need to be processed at the same time, that is, multiple overhead cranes need to be used or one overhead crane needs to be used multiple times to meet the equipment requirements. The traditional method is to call multiple overhead cranes at the same time, and the equipment is in a waiting state before the last wafer box enters the equipment, which seriously affects the production and greatly restricts the production capacity of the chip manufacturing factory. SUMMARY

[0004] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide an overhead crane device and a control method thereof, which solves the problem of insufficient carrying capacity of the traditional overhead crane and can carry only one wafer box at a time.

[0005] The technical scheme adopted by the present application to solve the technical problems is: an overhead crane device, characterized in that it comprises an overhead crane main body, a side shifting device and a grabbing device, at least one buffer loading platform is arranged on the overhead crane main body, the side shifting device is connected with the overhead crane main body, the grabbing device is connected with the side shifting device, and the side shifting device drives the grabbing device to move above the buffer loading platform.

[0006] As a further improvement of the present application: the side shifting device comprises a transmission member and a driving member, the driving member is installed on the overhead crane main body, the transmission member is connected with the grabbing device, and the driving member provides an acting force for driving the transmission member to drive the grabbing device to move back and forth in a straight line.

[0007] As a further improvement of the present application: the side shifting device comprises a first layer body, a second layer body, a first layer belt mechanism and a second layer belt mechanism, the first layer body is connected with the headstock body through the first layer belt mechanism, the first layer belt mechanism is connected with a first driving member, the second layer body is connected with the first layer body through the second layer belt mechanism, the second layer belt mechanism is connected with a second driving member, and the second layer body is fixedly connected with the grabbing device.

[0008] As a further improvement of the present application: the first sliding block sliding rail structure is arranged between the first layer body and the headstock body, and the second sliding block sliding rail structure is arranged between the second layer body and the first layer body.

[0009] As a further improvement of the present application: at least one buffer platform is arranged on the left and right sides of the headstock body.

[0010] The present application also provides a control method of the headstock device, if receiving the instruction of carrying at least two wafers to the first machine table, calling the path calculation rule to determine the target headstock, the path calculation rule specifically comprises the following steps:

[0011] The departure distance of the current headstock to each wafer box site is calculated respectively, and the current headstock is a headstock without carrying instruction allocation;

[0012] The wafer box site with the shortest departure distance is taken as the first station destination, and then the Nth station destination and the terminal station destination are determined in turn according to the principle of the shortest transportation distance, and N is a positive integer greater than or equal to 2;

[0013] The last distance from the terminal station destination to the first machine table site is determined;

[0014] The transportation time of the current headstock is calculated, the target headstock corresponding to the shortest transportation time is determined, the first carrying instruction is generated and sent to the target headstock.

[0015] As a further improvement of the present application: if the first instruction of carrying at least two wafer boxes to the first machine table is received first, the path calculation rule is called to determine the target headstock, the first carrying instruction is generated and sent to the target headstock;

[0016] The target headstock receives the second instruction of carrying at least one wafer box to the second machine table during the execution of the first carrying instruction;

[0017] When any one of the following conditions is met, the second instruction is issued to the target headstock, otherwise, the target headstock only executes the first carrying instruction;

[0018] (1) there is no wafer box or second machine table between the terminal station destination and the first machine table position in the first instruction;

[0019] (2) the end station destination in the second instruction and the second machine position have no wafer box or second machine in the first instruction.

[0020] As a further improvement of the present application, it further comprises:

[0021] If the target crane receives a second instruction for carrying the second wafer box and the third wafer box to the second machine during the execution of the first instruction, the second instruction is sent to the target crane if any of the following conditions is met, otherwise the target crane only executes the first instruction.

[0022] (1) the second wafer box and the first machine position have no third wafer box or second machine in the second instruction; (2) the third wafer box and the second machine position have no first wafer box or second wafer box or first machine.

[0023] As a further improvement of the present application, it further comprises:

[0024] If the target crane receives a second instruction for carrying the second wafer box and the third wafer box to the second machine during the execution of the first instruction, the second instruction is sent to the target crane if any of the following conditions is met, otherwise the target crane only executes the first instruction.

[0025] The departure distance of the current crane to the first wafer box location is calculated, the current crane is a crane without a carrying instruction, and the last distance from the first wafer box location to the first machine is calculated.

[0026] The transportation time of the current crane is calculated, the target crane corresponding to the shortest transportation time is determined, the first carrying instruction is generated and sent to the target crane.

[0027] If the target crane receives a second instruction for carrying the second wafer box and the third wafer box to the second machine during the execution of the first instruction, the second instruction is sent to the target crane if any of the following conditions is met, otherwise the target crane only executes the first instruction.

[0028] If the target crane receives a second instruction for carrying the second wafer box and the third wafer box to the second machine during the execution of the first instruction, the second instruction is sent to the target crane if any of the following conditions is met, otherwise the target crane only executes the first instruction.

[0029] (1) the first wafer box location and the first machine position have no second wafer box or third wafer box or second machine in the second instruction;

[0030] (2) the end station destination in the second instruction and the second machine position have no wafer box or second machine in the first instruction.

[0031] As a further improvement of the present application, it further comprises:

[0032] If the target crane receives a second instruction for carrying the second wafer box and the third wafer box to the second machine during the execution of the first instruction, the second instruction is sent to the target crane if any of the following conditions is met, otherwise the target crane only executes the first instruction.

[0033] When there is no second wafer box or second machine between the first wafer box and the first machine position, a second instruction is sent to the target overhead crane;

[0034] When the target overhead crane executes the first instruction and the second instruction, and receives a third instruction of carrying a third wafer box to a third machine, and one of the following three scenarios exists, the third instruction is directly sent to the target overhead crane, otherwise the target overhead crane only executes the first instruction and the second instruction;

[0035] (1) There is no wafer box in the third instruction between the first wafer box and the first machine; (2)

[0036] There is no wafer box in the third instruction between the second wafer box and the second machine; (3) There is no wafer box in the first instruction and the second instruction between the third wafer box and the third machine.

[0037] Compared with the prior art, the beneficial effects of the present application are:

[0038] The present application sets at least one buffer platform on the overhead crane body to temporarily store the wafer box, sets a side shifting device on the overhead crane body to drive the grabbing device to move above the buffer platform, and releases the wafer box grabbed by the grabbing device onto the buffer platform. The grabbing device retains the function of grabbing one wafer box during the operation of the overhead crane, realizes the function of carrying multiple wafer boxes by a single overhead crane, and greatly improves the carrying capacity of the overhead crane.

[0039] The overhead crane provided by the present application can carry two or more wafer boxes at the same time, improves the carrying capacity of the overhead crane, and solves the problem of insufficient carrying capacity of the traditional overhead crane. For some special manufacturing processes and steps that require the processing of two or three wafer boxes at the same time, it has great benefit improvement, improves the upper limit of the production capacity of the factory chip, and has great economic value. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 It is a structure schematic diagram of an overhead crane device of an embodiment of the present application.

[0041] Figure 2 It is a structure schematic diagram of a side shifting device of an embodiment of the present application.

[0042] Figure 3 It is a structure schematic diagram of the cooperation of the side shifting device and the grabbing device to grab the wafer box on the buffer platform of an embodiment of the present application.

[0043] Figure 4 It is a schematic diagram of the overhead crane grabbing three wafer boxes to the first machine.

[0044] Figure 5 It is a logic flow chart of the overhead crane grabbing three wafer boxes to the first machine.

[0045] Figure 6 A schematic diagram for the crane to grab the first and second wafer boxes to the first machine, and the third wafer box to the second machine.

[0046] Figure 7 A logic flow diagram for the crane to grab the first and second wafer boxes to the first machine, and the third wafer box to the second machine.

[0047] Figure 8 A schematic diagram for the crane to grab the first wafer box to the first machine, and the second and third wafer boxes to the second machine.

[0048] Figure 9 A logic flow diagram for the crane to grab the first wafer box to the first machine, and the second and third wafer boxes to the second machine.

[0049] Figure 10 A schematic diagram for the crane to grab three wafer boxes to three different machines.

[0050] Figure 11 A logic flow diagram for the crane to grab three wafer boxes to three different machines.

[0051] Reference signs:

[0052] 10, crane, 101, buffer platform, 20, grabbing device, 201, grabbing mechanism, 202, hoisting mechanism, 203, paw, 204, hoisting belt, 30, side shifting device, 301, first layer main body, 302, second layer main body, 303, first layer belt mechanism, 304, second layer belt mechanism, 305, first layer sliding block, 306, first layer sliding rail, 307, second layer sliding block, 308, second layer sliding rail,

[0053] 401, first wafer box, 402, second wafer box, 403, third wafer box, 501, first machine, 502, second machine, 503, third machine. DETAILED DESCRIPTION

[0054] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described below in connection with specific embodiments and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0055] In order to solve the technical problems in the prior art, the present application will be further described in connection with the drawings and embodiments:

[0056] As Figures 1 to 3As shown, the embodiment of the application discloses a crown block device, which comprises a crown block body, a side shifting device 30 and a grabbing device 20, at least one buffer platform 101 is arranged on the crown block body, the side shifting device 30 is connected with the crown block body, and the grabbing device 20 is connected with the side shifting device 30; the side shifting device 30 drives the grabbing device 20 to move above the buffer platform 101.

[0057] The crown block device provided by the embodiment has at least one buffer platform 101 for temporarily storing wafer boxes, and the grabbing device 20 in the abdominal cavity of the crown block body can grab the wafer boxes, so that the disadvantage that the traditional crown block 10 can carry at most one wafer box in one trip is eliminated. The grabbing device 20 is arranged below the side shifting device 30, the side shifting device 30 is connected with the crown block body 10, when two or three wafer boxes need to be processed at the same time, the grabbing device 20 grabs one wafer box or two wafer boxes and then is retracted into the abdominal cavity of the crown block 10, then the side shifting device 30 drives the grabbing device 20 to move above the buffer platform 101, the grabbing device 20 releases the wafer box on the buffer platform 101, and the grabbing device 20 still grabs one wafer box and transports the wafer box to a destination together with the crown block 10, so that the carrying capacity of the crown block 10 is greatly improved, and a plurality of wafer boxes can be carried in one trip.

[0058] Preferably, the buffer platforms 101 can be arranged on the left and right sides of the crown block body (with the advancing direction of the crown block 10 as the front end), the buffer platforms 101 are connected with the crown block body 10, and the buffer platforms 101 on the left and right sides of the crown block body can store wafer boxes.

[0059] Further, it needs to be understood that one buffer platform 101 can be arranged on the left side and the right side of the crown block body, of course, two or more buffer platforms 101 can also be arranged on the left side and the right side of the crown block 10, and the number of the buffer platforms 101 can be adjusted according to actual needs.

[0060] Further, the single buffer platform 101 is not limited to storing one wafer box, that is, the wafer boxes arranged on the buffer platform 101 can be arranged in a stacking mode, for example, at least one wafer box is arranged along the transverse moving direction of the grabbing device 20, or at least one wafer box is arranged along the vertical moving direction of the grabbing device 20, or at least one wafer box is arranged along the transverse and vertical moving directions of the grabbing device 20, respectively, and the wafer boxes are arranged in a matrix distribution. Correspondingly, a fence structure can be added to the periphery of the buffer platform 101 to prevent the stacked wafer boxes from falling off the buffer platform 101.

[0061] The buffer platform 101 can be integrally formed with the crown block body or detachably mounted on the crown block body, and the buffer platform 101 can be replaced according to the size of different wafer boxes.

[0062] In some embodiments, the lateral displacement device 30 includes a transmission component and a drive component. The drive component is mounted on the crane body and connected to the transmission component. The transmission component is connected to the gripping device 20. The drive component provides a force that drives the transmission component to move the gripping device 20 in a linear reciprocating motion. The direction of the linear displacement is perpendicular to the travel direction of the crane 10.

[0063] The driving component can be a rodless cylinder, and the transmission component can be a transmission part outside the rodless cylinder or a fixed part connected to the transmission part. The gripping device 20 is connected to the rodless cylinder through the transmission component. The stroke of the rodless cylinder is specifically set according to the buffer platform 101 set on the crane body. If buffer platforms 101 are set on both the left and right sides of the crane body, the stroke of the moving part of the rodless cylinder is greater than the distance between the buffer platforms 101 on both sides, so as to ensure that the gripping device 20 is driven to move above the buffer platforms 101 on both sides.

[0064] like Figure 2 As shown, the driving component can be a motor (not shown in the figure), and the transmission component is a belt. In a specific example, the lateral movement device 30 includes a first-layer main body 301, a second-layer main body 302, a first-layer belt mechanism 303, and a second-layer belt mechanism 304. The first-layer main body 301 is connected to the crane body through the first-layer belt mechanism 303. The first-layer belt mechanism 303 is powered to rotate through the first driving component. The second-layer main body 302 is connected to the first-layer main body 301 through the second-layer belt mechanism 304. The second-layer belt mechanism 304 is powered to rotate through the second driving component. The second-layer main body 302 is fixedly connected to the gripping device 20.

[0065] The first-layer belt mechanism 303 and the second-layer belt mechanism 304 have basic structures such as pulleys and belts, and the connection between the first driving component and the second driving component, which is a motor and a pulley, are all prior art, and will not be described in detail here. The pulleys of the first driving component and the first-layer belt mechanism 303 are fixedly installed on the crane body, and the pulleys of the second driving component and the second-layer belt mechanism 304 are fixedly installed on the first-layer body 301.

[0066] Furthermore, the middle position of the second layer main body 302 and the middle position of the second belt of the second layer belt mechanism 304 are fixedly connected, and the middle position of the first layer main body 301 is fixedly connected to the middle position of the first belt of the first layer belt mechanism 303.

[0067] The gripping device 20 includes a winch mechanism 202, a winch belt 204, and a gripping mechanism 201. The structure and connection of the winch mechanism 202 and the winch belt 204 are existing technologies. The gripping mechanism 201 is fixedly connected to the winch belt 204. The gripping mechanism 201 is equipped with a gripper 203 and a drive source (not shown in the figure). The gripper 203 grips and releases the wafer cassette. The gripping mechanism 201 can adopt an existing structure, which will not be described in detail in this application.

[0068] As shown in Figure 1 and Figure 2 , the side shifting device 30 can drive the grabbing device 20 to move left and right, and the moving direction is perpendicular to the running direction of the crane 10. Specifically, the first layer belt mechanism 303 and the second layer belt mechanism 304 drive the grabbing device 20 to move left and right. In addition, the side shifting device 30 is connected with the grabbing device 20 through the hoisting mechanism 202, and the hoisting belt 204 can be vertically lifted through the built-in motor of the crane 10, so that the grabbing device 20 of the crane 10 can be vertically lifted to the position of the wafer box to grab the wafer box. Generally, after the grabbing device 20 of the crane 10 grabs the wafer box, it will retract into the abdominal cavity of the crane 10, and continue to grab the wafer box, and then transport it to the destination. On this basis, the crane 10 of the present application can place the wafer box on the buffer platform 101 located on the left and right sides of the crane 10 through the side shifting device 30. Therefore, when the buffer platform 101 on the left and right sides of the crane 10 is placed with wafer boxes, the grabbing device 20 of the crane 10 can still grab the wafer box, so that at least three wafer boxes can be transported at the same time, and the carrying capacity of the crane 10 is greatly improved.

[0069] Further, the side shifting device 30 is also provided with a sliding block sliding rail structure. Specifically, the first layer main body 301 and the crane main body are provided with a first sliding block sliding rail structure, and the second layer main body 302 and the first layer main body 301 are provided with a second sliding block sliding rail structure, so as to improve the stability and reliability of the grabbing device 20 during the back and forth process between the buffer platform 101 and the abdominal cavity of the crane main body.

[0070] In a specific example, the first layer main body 301 is provided with a first layer sliding block 305, and the crane main body is provided with a first layer sliding rail 306 corresponding to the first layer sliding block 305. The first layer main body 301 is connected with the first layer sliding rail 306 of the crane main body through the first layer sliding block 305. Alternatively, the first layer sliding block 305 is arranged on the crane main body, and the first layer sliding rail 306 is arranged on the first layer main body 301. The installation positions of the first layer sliding block 305 and the first layer sliding rail 306 are not limited, and the length direction of the first layer sliding rail 306 is perpendicular to the running direction of the crane 10.

[0071] Similarly, a second-layer slider 307 is provided on the second-layer main body 302, and correspondingly, a second-layer slide rail 308 is provided on the crane body. The second-layer main body 302 is connected to the second-layer slide rail 308 of the crane body through the second-layer slider 307. Alternatively, the second-layer slider 307 can be provided on the crane body, and the second-layer slide rail 308 can be provided on the second-layer main body 302. The installation positions of the second-layer slider 307 and the second-layer slide rail 308 are not restricted. The length direction of the second-layer slide rail 308 is perpendicular to the travel direction of the crane 10, and the length direction of the second-layer slide rail 308 is consistent with the transmission direction of the second-layer belt mechanism 304. It only needs to have the function of enabling the gripping device 20 to run smoothly under the drive of the second-layer belt mechanism 304.

[0072] The first layer main body 301 can move left and right relative to the crane body (perpendicular to the travel direction of the crane 10) along the first layer slide rail 306 under the drive of the first layer belt mechanism 303. The second layer main body 302 can move left and right relative to the first layer main body 301 (perpendicular to the travel direction of the crane 10) along the second layer slide rail 308 under the drive of the second layer belt mechanism 304. Since the second layer main body 302 is fixed to the upper end of the hoisting mechanism 202 of the gripping device 20, and the lower end of the belt of the hoisting mechanism 202 is connected to the main body of the gripping mechanism 201, the gripping mechanism 201 can move left and right relative to the crane body under the drive of the side shifting device 30. The gripping mechanism 201 can move up and down relative to the crane body under the drive of the side shifting mechanism and the hoisting mechanism 202.

[0073] like Figure 1 The diagram shows the lateral shifting device 30 moving the gripping device 20 above the buffer platform 101. The buffer platform 101 is located on the left and right sides of the crane body, which are hollow structures. During the gripping process, the gripper 203 of the gripping device 20 descends to grip the wafer cassette. The lateral shifting device 30 is internally located within the cavity of the crane body. When the wafer cassette needs to be stored on the buffer platform 101, the lateral shifting device 30 and the gripping device 20 can move from the cavity of the crane body to the left and right sides of the crane body.

[0074] Furthermore, if the abdominal cavity of the crane body is large enough, the buffer platform 101 can also be set in the abdominal cavity of the crane body, and the lateral movement device 30 can also be built into the abdominal cavity.

[0075] This embodiment also provides a control method for the overhead crane device. Based on the storage conditions of the buffer platforms 101 on the left and right sides of the overhead crane body, combined handling instructions are generated according to actual handling needs to improve handling efficiency. The actual handling scenarios can be divided into the following three scenarios: the first scenario is handling three boxes of wafers to the same machine; the second scenario is handling two boxes of wafers to the same machine and the third box of wafers to another machine; the third scenario is handling three boxes of wafers to three different machines.

[0076] In some embodiments, if the instruction of carrying at least two wafers to the first machine 501 is received, the path calculation rule is called to determine the target crane 10, and the path calculation rule specifically includes the following steps:

[0077] The departure distances of the current crane 10 to each wafer box location are calculated respectively, and the current crane 10 is a crane 10 that has not been assigned a carrying instruction;

[0078] The wafer box location with the shortest departure distance is taken as the first station destination, and then the Nth station destination and the terminal station destination are determined in turn according to the principle of the shortest transportation distance, and N is a positive integer greater than or equal to 2;

[0079] The last distance from the terminal station destination to the position of the first machine 501 is determined;

[0080] The first running path is generated according to the first station destination, the Nth station destination, the terminal station destination, and the position of the first machine 501;

[0081] The transportation time of the current crane 10 corresponding to the first running path is calculated, and the target crane 10 corresponding to the shortest transportation time is determined from the current crane 10;

[0082] The first carrying instruction is generated and sent to the target crane 10, and the first carrying instruction includes the first running path.

[0083] The determination of the Nth station destination and the terminal station destination in turn according to the principle of the shortest transportation distance specifically includes: calculating the transfer distance of the first station destination to other wafer boxes, determining the wafer box location with the shortest transfer distance as the second station destination, then calculating the transfer distance of the second station destination to other wafer boxes, taking the wafer box location with the shortest transfer distance as the third station destination, and so on, until the last wafer box location is determined as the terminal station destination.

[0084] For example, as shown in Figure 4 , the crane 10 control system receives the carrying instruction of the first scenario: carrying three wafer boxes to the same machine, and the logical flow is as shown in Figure 5 . The crane 10 control system will form a combined carrying instruction from these carrying instructions and intelligently plan the path.

[0085] Specifically, the crane 10 control system will calculate the distances of the current crane 10 to the three wafer box locations respectively, and select the nearest first wafer box 401 location as the first station destination, then calculate the distances of the first station destination to the other two wafer boxes respectively, select the nearest second wafer box 402 location as the second station, and the last third wafer box 403 as the third station, combine the distance from the third station to the wafer box equipment first machine 501, select the crane 10 with the shortest time through calculation, and give the crane 10 this combined instruction.

[0086] After receiving the combined carrying instruction, the overhead crane 10 goes to the first station destination to grab the first wafer box 401, the second station destination to grab the second wafer box 402, and the third station destination to grab the third wafer box 403, and places the first wafer box 401 and the second wafer box 402 taken from the first station destination and the second station destination on the buffer platform 101, and retracts the wafer box grabbing device 20 taken from the third station destination into the abdominal cavity of the overhead crane 10. After reaching the first machine table 501, the third wafer box 403 taken from the third station destination is placed on the target first machine table 501 first, and then the first wafer box 401 and the second wafer box 402 stored on the buffer platform 101 are placed in turn. At this time, the carrying task of carrying three wafer boxes to the equipment is completed.

[0087] In some embodiments, if a first instruction for carrying at least two wafer boxes to the first machine table 501 is received, a path calculation rule is called to determine the target overhead crane 10, generate a first carrying instruction, and send it to the target overhead crane 10.

[0088] Specifically, according to the first instruction, the position of the first machine table 501, the location of the first wafer box 401, the location of the second wafer box 402, …, and the location of the nth wafer box are obtained, the departure distance of the current overhead crane 10 to each wafer box location is calculated respectively, and the wafer box location with the shortest departure distance is taken as the first station destination. Then, the Nth station destination and the terminal station destination are determined in turn according to the shortest transportation distance principle, N is a positive integer greater than or equal to 2, and the determination of the Nth station destination and the terminal station destination is as described above. The last distance from the terminal station destination to the position of the first machine table 501 is determined, and a first running path is generated according to the first station destination, the Nth station destination, the terminal station destination, and the position of the first machine table 501. In this way, the current overhead crane 10 is taken as the starting point of the first running path, and the next destination is determined in turn to generate a unique first running path for each current overhead crane 10. The number of first running paths is equal to the number of current overhead cranes 10.

[0089] Finally, the first transportation time of the first running path corresponding to the current overhead crane 10 is calculated, and the target overhead crane 10 corresponding to the shortest first transportation time is determined from the current overhead crane 10. A first carrying instruction is generated and sent to the target overhead crane 10, and the first carrying instruction contains the first running path.

[0090] That is, the overhead crane 10 system first receives the first instruction, and then determines the target overhead crane 10 according to the first scenario, and generates a first carrying instruction to the target overhead crane 10.

[0091] When the target crane 10 issues a second instruction to move at least one wafer cassette to the second machine 502 during the execution of the first transport instruction, the second instruction will be issued to the target crane 10 if any of the following conditions are met; otherwise, the target crane 10 will only execute the first transport instruction.

[0092] (1) There is no wafer box or second machine 502 in the second instruction between the destination of the terminal station in the first instruction and the position of the first machine 501; (2) There is no wafer box or second machine 502 in the first instruction between the destination of the terminal station in the second instruction and the position of the second machine 502.

[0093] Furthermore, before assigning the second instruction to the target crane 10, starting from the target crane 10, when the second instruction has multiple wafer boxes that need to be moved simultaneously, the path calculation rules are then invoked to determine the destination of the Nth station and the final station in sequence based on the principle of the shortest transportation distance. If the second instruction has only one wafer box that needs to be moved, the location of that wafer box is the final station destination.

[0094] For example, the handling instructions for the second scenario are to move two boxes of wafers to the first machine 501 and the third box of wafers to the second machine 502. This scenario has two cases: the first case is that the overhead crane 10 first receives the first instruction to move two boxes of wafers to the first machine 501, and then receives the second instruction to move the third box of wafers to the second machine 502.

[0095] like Figure 6 and Figure 7 As shown, for the first scenario: After the crane 10 control system receives the first transport task of moving two wafer boxes to the first machine 501, the crane 10 control system will calculate the distance from the current crane 10 to the locations of the first and second wafer boxes 402, and select the first wafer box 401, which is closest to the crane 10, as the first destination. Then, it will calculate the distance from the first destination to the second wafer box 402, select the second wafer box 402 as the second station, and calculate the distance from the second station to the first machine 501 of the unloading equipment. Based on the calculations, the crane 10 with the shortest time will be selected. The system will issue a first transport instruction to the crane 10. When there is a second instruction to transport the third wafer to the second machine 502 in the running path of the crane 10, and one of the following two scenarios exists, the crane 10 control system will issue the second instruction to transport the third wafer to the second machine 502 to the crane 10: (1) There is no third wafer box 403 or second machine 502 in the instruction between the second wafer box 402 and the first machine 501; (2) There is no first wafer box 401 or second wafer box 402 or first machine 501 between the third wafer box 403 and the second machine 502.

[0096] In some embodiments, if the first instruction of carrying at least one FOUP to the first machine 501 is received first and the second instruction of carrying at least two FOUPs to the second machine 502 is received later, the following steps are included:

[0097] After receiving the first instruction, the path calculation rule is called to determine the target crane 10 and the destination of the terminal station, generate the first carrying instruction and send it to the target crane 10. For details, see the processing of the first instruction described above, which will not be described here.

[0098] When the target crane 10 receives the second instruction of carrying at least two FOUPs to the second machine 502 during the execution of the first carrying instruction, the second instruction is issued to the target crane 10 if any of the following conditions is met; otherwise, the target crane 10 only executes the first carrying instruction.

[0099] (1) There is no FOUP in the second instruction between the destination of the terminal station and the position of the first machine 501 or the second machine 502; (2) There is no FOUP in the first instruction between the destination of the terminal station and the second machine 502 or the first machine 501.

[0100] It should be noted that after the target crane 10 receives the second instruction of carrying at least two FOUPs to the second machine 502 during the execution of the first carrying instruction, the path calculation rule is called to determine the destination of the terminal station of the second instruction, which will not be described here.

[0101] In a specific example, there is one FOUP in the first instruction and two FOUPs in the second instruction: when only the first FOUP 401 needs to be carried in the first instruction, the departure distance from the current crane 10 to the location of the first FOUP 401 is calculated, the current crane 10 is a crane 10 that has not been assigned a carrying instruction, and the last distance from the location of the first FOUP 401 to the first machine 501 is calculated; The transportation time of the current crane 10 is calculated to determine the target crane 10 corresponding to the shortest transportation time, generate the first carrying instruction and send it to the target crane 10.

[0102] During the execution of the first carrying instruction by the target crane 10, the second instruction of carrying the second FOUP 402 and the third FOUP 403 to the second machine 502 is received, and the path calculation rule is called to determine the destination of the terminal station of the second instruction.

[0103] When any of the following conditions is met, the second instruction is issued to the target crane 10, otherwise the target crane 10 only executes the first carrying instruction.

[0104] (1) There is no second FOUP 402 or third FOUP 403 in the second instruction between the location of the first FOUP 401 and the position of the first machine 501 or the second machine 502;

[0105] (2) There is no first wafer box 401 or first machine 501 between the destination of the terminal station in the second instruction and the position of the second machine 502.

[0106] For example, in the second scenario, the crane 10 first receives the first instruction to move the first box of wafers to the first machine 501, and then receives the second instruction to move the two boxes of wafers to the second machine 502.

[0107] like Figure 8 and Figure 9 As shown, for the second case: When the crane 10 control system receives the first transport task of transporting the first box of wafers to the first machine 501, the crane 10 control system will calculate the distance from the current crane 10 to the location of the first box of wafers, and the distance from the first wafer box 401 to the first machine 501. The crane 10 with the shortest time is selected by calculation, and the first transport instruction is issued to the crane 10. When there is an instruction to transport two boxes of wafers to the second machine 502 in the running path of the crane 10, and one of the following two scenarios exists, the crane 10 control system will issue the second transport instruction to the crane 10 to transport the second and third wafer boxes to the second machine 502: (1) There is no second wafer box 402 or third wafer box 403 or second machine 502 between the positions of the first wafer box 401 and the first machine 501; (2) There is no first wafer box 401 or first machine 501 between the positions of the third wafer box 403 and the second machine 502.

[0108] In some implementations, such as Figure 10 and Figure 11 As shown, in the third scenario, three boxes of wafers are moved to three different machines.

[0109] When the crane 10 control system issues an instruction to the crane 10 to move the first wafer cassette 401 to the first machine 501, and after receiving the first instruction, if there is a second instruction on the crane 10's moving path, namely, to move the second wafer cassette 402 to the second machine 502, the crane 10 control system will directly issue the second instruction to the crane 10.

[0110] If a third instruction exists on the transport path of the overhead crane 10, namely, the instruction to transport the third wafer box 403 to the third machine 503, and one of the following three scenarios exists, the control system of the overhead crane 10 will directly issue the third instruction to the overhead crane 10: (1) there are no other wafer boxes mentioned in the instruction between the first wafer box 401 and the first machine 501; (2) there are no other wafer boxes mentioned in the instruction between the second wafer box 402 and the second machine 502; (3) there are no other wafer boxes mentioned in the instruction between the third wafer box 403 and the third machine 503. At this time, the overhead crane 10 will have instructions to transport three wafer boxes to three different machines, and these instructions can be executed smoothly.

[0111] The main function of the present application:

[0112] 1、The present application increases at least one buffer station on the main body of the crane to store wafer boxes, and through the side shift device to drive the grabbing movement to move and place the wafer box on the buffer station, and at the same time, the abdominal cavity of the crane can also carry a box of wafers through the grabbing device during the travel process, so that the crane can transport at least two wafer boxes at the same time in a single trip, greatly improving the carrying capacity of the crane, solving the problem of insufficient carrying capacity of the traditional crane. For some special manufacturing processes and steps that require two or three wafer boxes to be processed at the same time, it has great benefit improvement, improves the upper limit of the factory chip production capacity, and has great economic value.

[0113] 2、The crane of the present application can carry two or more wafer boxes at the same time, improving the carrying capacity of the crane, solving the problem of insufficient carrying capacity of the traditional crane. For some special manufacturing processes and steps that require two or three wafer boxes to be processed at the same time, it has great benefit improvement, improves the upper limit of the factory chip production capacity, and has great economic value.

[0114] In summary, after reading the present application file, the ordinary skilled person in the art can make other various corresponding transformation schemes according to the technical scheme and technical concept of the present application without creative mental labor, which all belong to the scope protected by the present application.

Claims

1. A crown block device, characterized by The crane main body is provided with at least one buffer platform, the side shifting device is connected with the crane main body, the grabbing device is connected with the side shifting device, the side shifting device drives the grabbing device to move above the buffer platform, the side shifting device comprises a first layer main body, a second layer main body, a first layer belt mechanism and a second layer belt mechanism, the first layer main body is connected with the crane main body through the first layer belt mechanism, the first layer belt mechanism is connected with a first driving member, the second layer main body is connected with the first layer main body through the second layer belt mechanism, the second layer belt mechanism is connected with a second driving member, the second layer main body is fixedly connected with the grabbing device, a first sliding block sliding rail structure is arranged between the first layer main body and the crane main body, and a second sliding block sliding rail structure is arranged between the second layer main body and the first layer main body.

2. An overhead travelling crane as claimed in claim 1, wherein, The side shifting device comprises a transmission member and a driving member, the driving member is installed on the crane main body, the transmission member is connected with the grabbing device, and the driving member provides an acting force for driving the transmission member to drive the grabbing device to perform linear reciprocating motion.

3. The crown block device of claim 1, wherein, At least one buffer platform is arranged on the left side and the right side of the crane main body.

4. A control method of a crown block device, based on any one of claims 1 to 3, characterized in that, If the instruction of carrying at least two wafers to the first machine table is received, a target crane is determined by calling a path calculation rule, and the path calculation rule specifically comprises the following steps: The departure distance of the current crane to each wafer box location is calculated respectively, and the current crane is a crane without allocation of the carrying instruction; The wafer box location with the shortest departure distance is taken as the first station destination, and then the Nth station destination and the terminal station destination are determined in turn according to the principle of the shortest transportation distance, N is a positive integer greater than or equal to 2; The last distance from the terminal station destination to the first machine table location is determined; The transportation time of the current crane is calculated, the target crane corresponding to the shortest transportation time is determined, the first carrying instruction is generated and sent to the target crane.

5. The control method of a crown block device according to claim 4, wherein If the first instruction of carrying at least two wafer boxes to the first machine table is received first, a target crane is determined by calling a path calculation rule, and the first carrying instruction is generated and sent to the target crane; The second instruction of carrying at least one wafer box to the second machine table is received during the execution of the first carrying instruction by the target crane; When any one of the following conditions is met, the second instruction is issued to the target crane, otherwise, the target crane only executes the first carrying instruction; (1) there is no wafer box or second machine table between the terminal station destination in the first instruction and the first machine table location; (2) there is no wafer box or first machine table between the terminal station destination in the second instruction and the second machine table location.

6. The control method of a crown block device according to claim 4, wherein Further comprising: If the first instruction of carrying the first wafer box and the second wafer box to the first machine table is received first, a target crane is determined by calling a path calculation rule, and the first carrying instruction is generated and sent to the target crane; The second instruction of carrying the third wafer box to the second machine table is received during the execution of the first carrying instruction by the target crane; When any one of the following conditions is met, the second instruction is issued to the target crane, otherwise, the target crane only executes the first carrying instruction; (1) there is no second wafer box or second machine in the third wafer box and the first machine position in the second instruction; (2) there is no first wafer box or second wafer box or first machine between the third wafer box and the second machine position.

7. The control method of a crown block device according to claim 4, wherein Further comprising: If the first instruction of carrying the first wafer box to the first machine is received first; Calculate the departure distance of the current crane to the first wafer box location, the current crane is a crane that has not been allocated a carrying instruction, and calculate the last distance from the first wafer box location to the first machine; Calculate the transportation time of the current crane, determine the target crane corresponding to the shortest transportation time, generate the first carrying instruction and send it to the target crane; During the execution of the first carrying instruction by the target crane, the second instruction of carrying the second wafer box and the third wafer box to the second machine is received, and the end station destination of the second instruction is determined by calling the path calculation rule; When any one of the following conditions is met, the second instruction is issued to the target crane, otherwise the target crane only executes the first carrying instruction; (1) there is no second wafer box or third wafer box or second machine between the first wafer box location and the first machine position in the second instruction; (2) there is no first wafer box or first machine between the end station destination of the second instruction and the second machine position.

8. The control method of a crown block device according to claim 4, wherein Further comprising: If the target crane executes the first instruction of carrying the first wafer box to the first machine, the second instruction of carrying the second wafer box to the second machine is received; When there is no second wafer box or second machine between the first wafer box and the first machine position, the second instruction is sent to the target crane; When the target crane executes the first instruction and the second instruction, and also receives the third instruction of carrying the third wafer box to the third machine, and one of the following three scenarios exists, the third instruction is directly issued to the target crane, otherwise the target crane only executes the first instruction and the second instruction; (1) there is no wafer box in the third instruction between the first wafer box and the first machine; (2) there is no wafer box in the third instruction between the second wafer box and the second machine; (3) there is no wafer box in the first instruction and the second instruction between the third wafer box and the third machine.

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