Electroplating mold and electroplating device

Abstract

The electroplating mold comprises a spraying mold, the spraying mold comprises a spraying mold body, a plurality of mounting grooves are transversely formed in the periphery of the spraying mold body, a plurality of separation strips are arranged on the inner side of the spraying mold body in the circumferential direction, a spraying groove is formed between every two adjacent separation strips, and the spraying grooves correspond to the mounting grooves one to one; a plurality of first electroplating holes are formed in the bottom of the spray plating tank, the first electroplating holes penetrate through the corresponding mounting grooves, masks matched with the mounting grooves are mounted on the inner sides of the mounting grooves, and a plurality of second electroplating holes matched with the first electroplating holes are formed in the inner sides of the masks. Through the arrangement of the reinforcing coating, the strength of the mask can be effectively improved, and the mask can be effectively prevented from being deformed during installation, so that the plating area precision and the plating area batch stability of electroplating are improved, meanwhile, the stability of the mask can be greatly improved, the aging and corrosion speed of the mask can be effectively slowed down, and the service life of the mask is greatly prolonged; therefore, the replacement frequency is reduced, and the labor intensity is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of lead frame electroplating equipment, and in particular to an electroplating mold and an electroplating device. Background Art

[0002] Lead frame is a semiconductor packaging component, generally a metal sheet or a thin strip. As the chip carrier of the integrated circuit, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It acts as a bridge to connect with external wires. Lead frames are required in most semiconductor integrated blocks and are important basic materials in the electronic information industry. In order to ensure the chip loading and bonding performance in the packaging process and to form good diffusion welding between the chip and the welding wire and the lead frame, special surface treatment is required in the chip loading and bonding area (on the lead pins and islands) of the lead frame, which is lead frame electroplating.

[0003] At present, in the field of lead frame electroplating, there are overall full electroplating and selective area electroplating. Selective area electroplating is to electroplate only the functional area on the lead frame. The selective electroplating of the lead frame is generally carried out in a disc-type electroplating mold. The lead frame is tightly wound on the electroplating mold, and then the anode nozzle sprays the plating liquid to electroplate the functional area on the lead frame through the electroplating area of ​​the electroplating mold.

[0004] Traditional electroplating spray molds are used in conjunction with masks. The working environment of the spray mold is generally alkaline, with a temperature of about 60°C. Since the material of the mask is usually silicone, in actual use, the mask is squeezed and easily deformed when installed on the spray mold, affecting the position and size of the plating area, resulting in low batch stability of the plating area and affecting the electroplating accuracy of the plating area; at the same time, after a period of use, the mask is prone to corrosion and aging. In actual use, the mask needs to be replaced every two days on average, and the service life is short. When there are a large number of masks on an electroplating spray mold, the removal and replacement of the mask is more complicated and troublesome, which consumes a lot of time and affects production efficiency, and also leads to high labor intensity;

[0005] On the other hand, traditional spray molds usually open corresponding electroplating holes on the mold body and the mask. During spraying, the non-functional area on the lead frame is covered by the mask, and the peripheral functional area is electroplated. The electroplating area is usually annular. Traditional electroplating molds mostly spray through a group of electroplating holes, allowing the plating liquid to spray out from one or two holes to spray the annular area so that it gradually fills the electroplating area. This spraying method usually requires a large pressure for the plating liquid and takes a long time to spray. In some places, uneven spraying or thin spraying may occur, resulting in spraying failure and affecting the performance of the lead frame.

[0006] Based on this, an electroplating mold and an electroplating device are proposed, which provide a new solution to solve the above technical problems. Summary of the invention

[0007] Based on this, it is necessary to provide an electroplating mold and an electroplating device to address the problems raised in the above background technology.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] The electroplating mold specifically includes a spraying mold, and the spraying mold includes a spraying mold body, a plurality of mounting grooves are horizontally opened on the outer periphery of the spraying mold body, a plurality of dividing strips are circumferentially arranged on the inner side of the spraying mold body, and a spraying groove is formed between two adjacent dividing strips, and the spraying grooves correspond to the mounting grooves one by one, and a plurality of first electroplating holes are opened at the bottom of the spraying groove, and the first electroplating holes pass through the corresponding mounting grooves, and a matching mask is installed on the inner side of the mounting groove, and a plurality of second electroplating holes matched with the first electroplating holes are opened on the inner side of the mask, and a plurality of mold pins are arranged on both sides of the outer periphery of the spraying mold body and on both sides of the plurality of masks.

[0010] Preferably, the mask surface is provided with a reinforcement coating.

[0011] Preferably, the reinforcement coating is a carbon coating.

[0012] Preferably, the two side walls of the dividing strip are inclined, a support platform is provided on the inner side of the first electroplating hole, both ends of the support platform are connected to the spray mold body, and the support platform separates the two sides of the corresponding first electroplating hole to form a pair of first liquid inlet holes.

[0013] Preferably, a mask is provided inside the second electroplating hole, both ends and both sides of the mask are connected to the mask, and the mask separates the second electroplating holes and forms second liquid inlet holes at four end corners thereof.

[0014] Preferably, the mask sheet and the support platform correspond to each other one by one and fit each other, and the first liquid inlet holes on both sides of the support platform correspond to and overlap with a pair of second liquid inlet holes on both sides of the mask sheet.

[0015] Preferably, a clamping portion adapted to the mounting groove is provided at the bottom of the mask, and the mask is clamped to the inner side of the corresponding mounting groove through the clamping portion.

[0016] Preferably, positioning holes are opened inside both sides of the installation groove, and positioning columns adapted to the positioning holes are provided on both sides of the bottom of the mask. When the mask is installed inside the installation groove, the positioning columns are inserted into the positioning holes and extend out of the spraying groove.

[0017] A plating device comprises the plating mold described in any one of the above items, wherein material guide wheels are provided below both sides of the spraying mold, a lead frame copper belt is wound around the material guide wheel and the outer side of the spraying mold, a plurality of belt drive wheels are provided on the top of the spraying mold, a transmission belt is connected to the outer side of the top of the lead frame copper belt, an anode nozzle is provided on the top of the inner side of the spraying mold, and mold support wheels are provided on both sides of the bottom of the spraying mold, and the mold support wheels are rollingly connected to the spraying mold.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present invention can effectively improve the strength of the mask by strengthening the setting of the coating, and can effectively prevent it from being deformed during installation, thereby improving the electroplating area accuracy and batch stability of the plating area, and at the same time can greatly improve the stability of the mask, effectively slow down its aging and corrosion rate, greatly improve its service life, thereby reducing the replacement frequency and reducing the intensity of manual labor.

[0020] 2. The present invention provides the first liquid inlet hole and the second liquid inlet hole, so that during spraying, the electroplating liquid can be sprayed out from multiple second liquid inlet holes at the same time to fill the plating area, thereby improving the uniformity of the spraying, improving the spraying effect, greatly improving the spraying efficiency, and at the same time improving the precision of the spraying.

[0021] 3. The present invention supports the mask by a support platform, which can improve the service life of the mask and improve the fit between the mask and the lead frame to be sprayed, thereby effectively preventing leakage of the plating solution during spraying, which is beneficial to improving the spraying and electroplating effect of the plating solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the scheme of the present invention, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 It is a schematic diagram of the axial structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the main structure of the present invention;

[0025] Figure 3 It is a structural schematic diagram of the spray mold body, mold pins and mounting grooves of the present invention;

[0026] Figure 4 It is a schematic structural diagram of the spraying tank, the first liquid inlet hole and the support platform of the present invention;

[0027] Figure 5 It is a schematic diagram of the structure of the separator strip of the present invention;

[0028] Figure 6 It is a schematic structural diagram of the spray mold body and the mask of the present invention;

[0029] Figure 7 This is a schematic diagram of the structure of the reinforcing coating and the second liquid inlet hole of the present invention;

[0030] Figure 8 It is a schematic structural diagram of the clamping part and the mask of the present invention;

[0031] Fig. 9 It is a schematic structural diagram of the electroplating device of the present invention.

[0032] The markings in the figure are as follows:

[0033] 100, spraying mold; 200, mold support wheel; 300, material guide wheel; 400, lead frame copper belt; 500, anode nozzle; 600, belt drive wheel; 700, transmission belt; 101, spray mold body; 102, mask; 103, mold pin; 104, mounting groove; 105, partition bar; 106, spraying tank; 107, first liquid inlet hole; 108, support platform; 109, second liquid inlet hole; 110, reinforcement coating; 111, clamping part; 112, mask. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0035] Please refer to Figure 1-8 A plating mold provided by the present invention includes a spraying mold 100, and the spraying mold 100 includes a spraying mold body 101. A plurality of mounting grooves 104 are horizontally opened on the outer periphery of the spraying mold body 101, and a plurality of dividing strips 105 are circumferentially arranged on the inner side of the spraying mold body 101. A spraying groove 106 is formed between two adjacent dividing strips 105. The spraying grooves 106 correspond to the mounting grooves 104 one by one. A plurality of first electroplating holes are opened at the bottom of the spraying groove 106. The first electroplating holes pass through the corresponding mounting grooves 104. A mask 102 matching the mounting groove 104 is installed on the inner side of the mounting groove 104. A plurality of second electroplating holes matching the first electroplating holes are opened on the inner side of the mask 102. A plurality of mold pins 103 are arranged on both sides of the outer periphery of the spraying mold body 101 and on both sides of the plurality of masks 102.

[0036] Please refer to Figure 7 A reinforcing coating 110 is provided on the surface of the mask 102. In the present embodiment, the reinforcing coating 110 is a carbon coating. By increasing the strength of the mask 102, it can effectively prevent the mask from deforming during installation, thereby improving the accuracy of the electroplating area and the batch stability of the plating area. At the same time, it can greatly improve the stability of the mask 102, effectively slow down its aging and corrosion rate, and greatly increase its service life, thereby reducing the replacement frequency and reducing the labor intensity.

[0037] Please refer to Figure 4-8 The two side walls of the dividing strip 105 are inclined. The inclined setting of the side walls of the dividing strip 105 can increase its opening area, which is more conducive to the electroplating liquid entering the spraying tank 106. A support platform 108 is provided on the inner side of the first electroplating hole. The two ends of the support platform 108 are connected to the spray mold body 101. The support platform 108 separates the two sides of the corresponding first electroplating hole to form a pair of first liquid inlet holes 107. The first liquid inlet holes 107 are symmetrically arranged on both sides of the support platform 108. A mask 112 is provided on the inner side of the second electroplating hole. The two ends and two sides of the mask 112 are connected to the mask 102. The mask 112 separates the second electroplating hole and forms a second liquid inlet hole 109 at its four end corners. The mask 112 corresponds to the support platform 108 one by one and fits each other. The support platform 108 The first liquid inlet holes 107 on both sides respectively correspond to and overlap with a pair of second liquid inlet holes 109 on both sides of the mask 112. Specifically, when each first liquid inlet hole 107 corresponds to two second liquid inlet holes 109 for electroplating, the plating liquid enters from the first liquid inlet hole 107, passes through four second liquid inlet holes 109 and enters the annular plating area. The entry method is to enter from the four end corners of the annular plating area at the same time, and the annular plating area can be quickly filled, thereby improving the electroplating efficiency and uniformity. The mask 112 is supported by the support platform 108, which can improve the service life of the mask 102 and improve the fit between the mask 112 and the lead frame to be sprayed, thereby effectively preventing the leakage of the plating liquid during spraying, which is beneficial to improving the spraying and plating effect of the plating liquid.

[0038] Please refer to Figure 1-8 A clamping portion 111 adapted to the mounting groove 104 is provided at the bottom of the mask 102, and the mask 102 is clamped to the inner side of the corresponding mounting groove 104 through the clamping portion 111. Positioning holes are provided inside the two sides of the mounting groove 104, and positioning posts adapted to the positioning holes are provided on both sides of the bottom of the mask 102. The material of the mask 102 is silicone. When the mask 102 is installed on the inner side of the mounting groove 104, the positioning posts are inserted into the inner side of the positioning holes and extend out of the spraying groove 106. The setting of the positioning holes and the positioning posts can improve the stability of the mask 102 installed on the inner side of the mounting groove 104, and at the same time facilitate the installation of the mask 102.

[0039] Please refer to Fig. 9, an electroplating device, comprising an electroplating mold of any one of the above items, material guide wheels 300 are provided below both sides of the spraying mold 100, lead frame copper strips 400 are wound around the material guide wheels 300 and the outer side of the spraying mold 100, a plurality of belt drive wheels 600 are provided on the top of the spraying mold 100, and a transmission belt 700 is connected to the plurality of belt drive wheels 600, and the transmission belt 700 is attached to the outer side of the top of the lead frame copper strip 400, an anode nozzle 500 is provided on the inner top of the spraying mold 100, mold supporting wheels 200 are provided on both sides of the bottom of the spraying mold 100, and the mold supporting wheels 200 are rollingly connected to the spraying mold 100. When used specifically, the material guide wheels 300 are used to tension and guide the lead frame copper strip 400, the mold supporting wheels 200 are used to assist the movement of the spraying mold 100, the belt drive wheels 600 are used to drive the transmission belt 700 to move, the transmission belt 700 is used to drive the spraying mold 100 to rotate, and the anode nozzle 500 is used to spray the electroplating solution for electroplating.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific embodiments, or to perform equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. An electroplating mold, characterized in that: The invention comprises a spraying mold (100), wherein the spraying mold (100) comprises a spraying mold body (101), wherein a plurality of mounting grooves (104) are transversely provided on the outer periphery of the spraying mold body (101), wherein a plurality of partition bars (105) are circumferentially provided on the inner side of the spraying mold body (101), wherein a spraying groove (106) is formed between two adjacent partition bars (105), wherein the spraying grooves (106) correspond to the mounting grooves (104) one by one, wherein a plurality of first electroplating holes are provided on the bottom of the spraying grooves (106), wherein the first electroplating holes penetrate the corresponding mounting grooves (104), wherein a mask (102) matching the mounting grooves (104) is installed on the inner side of the mask (102), wherein a plurality of second electroplating holes matching the first electroplating holes are provided on the inner side of the mask (102), and wherein a plurality of mold pins (103) are provided on both sides of the outer periphery of the spraying mold body (101) and on both sides of the plurality of masks (102).

2. The electroplating mold according to claim 1, characterized in that: A strengthening coating (110) is provided on the surface of the mask (102).

3. The electroplating mold according to claim 2, characterized in that: The strengthening coating (110) is a carbon coating.

4. The electroplating mold according to claim 1, characterized in that: The two side walls of the dividing strip (105) are arranged at an inclination, a support platform (108) is provided inside the first electroplating hole, two ends of the support platform (108) are connected to the spray mold body (101), and the support platform (108) separates the two sides of the corresponding first electroplating hole to form a pair of first liquid inlet holes (107).

5. The electroplating mold according to claim 4, characterized in that: A mask (112) is provided inside the second electroplating hole, and both ends and both sides of the mask (112) are connected to the mask (102). The mask (112) separates the second electroplating hole and forms second liquid inlet holes (109) at the four end corners thereof.

6. The electroplating mold according to claim 5, characterized in that: The mask (112) and the support platform (108) correspond one to one and fit each other, and the first liquid inlet holes (107) on both sides of the support platform (108) correspond to and overlap with a pair of second liquid inlet holes (109) on both sides of the mask (112).

7. The electroplating mold according to claim 1, characterized in that: A clamping portion (111) adapted to the mounting groove (104) is provided at the bottom of the mask (102), and the mask (102) is clamped to the inner side of the corresponding mounting groove (104) via the clamping portion (111).

8. The electroplating mold according to claim 1, characterized in that: Positioning holes are provided inside the two sides of the installation groove (104), and positioning posts matching the positioning holes are provided on the two sides of the bottom of the mask (102). When the mask (102) is installed inside the installation groove (104), the positioning posts are inserted into the inside of the positioning holes and extend out of the spraying groove (106).

9. An electroplating device, characterized in that: The electroplating mold comprises the electroplating mold according to any one of claims 1 to 8, wherein material guide wheels (300) are provided below both sides of the spraying mold (100), and a lead frame copper belt (400) is wound around the material guide wheel (300) and the outer side of the spraying mold (100), and a plurality of belt drive wheels (600) are provided on the top of the spraying mold (100), and a transmission belt (700) is connected to the plurality of belt drive wheels (600), and the transmission belt (700) is attached to the outer side of the top of the lead frame copper belt (400), and an anode nozzle (500) is provided on the inner top of the spraying mold (100), and mold support wheels (200) are provided on both sides of the bottom of the spraying mold (100), and the mold support wheels (200) are rollingly connected to the spraying mold (100).

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