Pressurized curing apparatus and method

By using a pressure-curing device and method, the problem of insufficient bonding strength between wave-shifting optical fiber and micro-hole fixing plate was solved, achieving seamless bonding and efficient curing, thus ensuring the stability and detection efficiency of the ICMOS system.

CN119270432BActive Publication Date: 2026-03-10CHINA BUILDING MATERIALS ACADEMY CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-01
Publication Date
2026-03-10

AI Technical Summary

Technical Problem

In traditional curing processes, the bonding strength between the wave-shifting optical fiber and the microporous fixing plate is insufficient, resulting in problems such as air bubbles and insufficient penetration of the curing adhesive, which affects the coupling efficiency of the ICMOS system.

Method used

A pressure-curing device and method are used to inject curing adhesive into the microporous fixing plate by applying positive pressure. Combined with ultraviolet irradiation, the adhesive is fully filled and air bubbles are eliminated, so as to achieve a tight bond between the wave-shifting optical fiber and the microporous plate.

Benefits of technology

This significantly improved the bonding strength between the micro-perforated plate and the wave-shifting fiber, eliminated air bubbles, ensured the stability and detection efficiency of the ICMOS system, and met the long-term requirements for on-orbit operation.

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Abstract

The present application relates to a kind of pressurized curing device and method, the pressurized curing device includes hollow first cylindrical structure and second cylindrical structure connected with each other, the second cylindrical structure is located in the first cylindrical structure, the bottom of the second cylindrical structure is provided with through hole and is formed with the clamping groove with the bottom of the first cylindrical structure, the clamping groove is clamped with microporous fixed plate, and the microporous fixed plate has multiple micropores.The present application carries out the curing process between wave shift optical fiber and microporous plate by the way of applying positive pressure, to improve the curing structure strength of microporous fixed plate.
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Description

Technical Field

[0001] This invention belongs to the field of microporous fixed plate wave-shifting fiber curing technology, specifically relating to a pressure-increasing curing device and method. Background Technology

[0002] The Space High Energy Cosmic Radiation Detection Facility (SHCEF) aims to achieve indirect observation of dark matter and direct measurement of cosmic rays. With its advanced characteristics of five-sided sensitivity, large vertical depth, and a fully absorptive three-dimensional calorimeter, the facility has become a leading international tool for dark matter detection. The ICMOS (fiber-cone coupled CMOS with photomultiplier tube or image intensifier) ​​system plays a crucial role in signal readout within the SHCEF, consisting of four main parts: an image intensifier, a pre-stage optical conetrometer, a post-stage optical conetrometer, and a CMOS camera. In this system, the pre-stage optical conetrometer is coupled to the wave-shifting fiber and the cathode of the image intensifier, requiring independent signal transmission to reduce crosstalk and ensure signal clarity. To guarantee the energy resolution and dynamic range of the calorimeter, the light transmission non-uniformity of the pre-stage optical conetrometer must meet high standards. Furthermore, considering the potential impact of cosmic rays on optical performance during on-orbit operation, the optical performance of both the pre- and post-stage optical cones, including crosstalk, transmittance, and light transmission uniformity, requires rigorous testing and control. To ensure that the optical performance of the space-based high-energy cosmic radiation detector does not significantly degrade during its 10-year on-orbit operation, strict control over the optical performance of the front and rear stage optical cones is crucial. This will guarantee the detector's detection efficiency and accuracy, thereby providing reliable data support for the detection of dark matter and the study of cosmic rays.

[0003] Waveshifting fibers play a crucial role in high-energy physics experiments. They absorb light signals emitted by crystal scintillators, convert their wavelengths, and guide them to the outside of the calorimeter. This process is achieved through a waveshifting fiber (WLSF), which is ultimately read out by an ICMOS system, completing the photoelectric conversion of the signal. The image intensifier plays a central role in this process, not only performing photoelectric conversion on the photons output from the wavelength-shifting fiber but also enhancing the light signal through acceleration and multiplication mechanisms, exciting fluorescence output. This function is essential for delaying photon transmission, ensuring signal integrity and accuracy. To ensure seamless connection between the waveshifting fiber and the microporous mounting plate, a method of inserting a curing adhesive into the microporous mounting plate is used to achieve a gapless, tight structure. In traditional curing processes, a single-component photosensitive adhesive is used to insert the waveshifting fiber into the microporous plate using the capillary effect principle. However, this method suffers from problems such as air bubbles and insufficient curing strength within the curing adhesive. Furthermore, due to the relatively small capillary force, it is difficult to introduce high-viscosity curing adhesive into the micropores, thus failing to meet the requirements for using high-viscosity curing adhesive. These problems severely affect the coupling efficiency of the ICMOS system. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a pressure-increasing curing device and method. The technical problem to be solved is to improve the curing strength of the microporous fixing plate by applying positive pressure to perform the curing process between the wave-shifting optical fiber and the microporous plate.

[0005] The objective of this invention and the technical problem it solves are achieved by the following technical solution. A pressure-curing device according to this invention includes a hollow first cylindrical structure and a second cylindrical structure connected to each other. The second cylindrical structure is disposed within the first cylindrical structure. A through hole is formed at the bottom of the second cylindrical structure, and a slot is formed with the bottom of the first cylindrical structure. A microporous fixing plate is fixed in the slot, and the microporous fixing plate has a plurality of micropores.

[0006] Preferably, in the aforementioned pressure-curing device, the microporous fixing plate is matched with the fiber diameter of the pre-stage optical cone.

[0007] Preferably, in the aforementioned pressure-curing device, the second cylindrical structure is provided with an annular outer edge, and the second cylindrical structure is connected to the first cylindrical structure through the annular outer edge.

[0008] Preferably, in the aforementioned pressure-curing device, one end of the annular outer edge has an injection hole, and the injection hole is filled with curing adhesive.

[0009] Preferably, in the aforementioned pressure-curing device, a first rubber ring is provided on the injection hole, and a first sealing cap is provided on the first rubber ring, wherein the cured adhesive and the first sealing cap do not contact each other.

[0010] Preferably, in the aforementioned pressurization and curing device, the outer wall of the first cylindrical structure has air inlets at both ends.

[0011] Preferably, in the aforementioned pressure-curing device, the bottom of the second cylindrical structure has a through hole and forms a groove with the bottom of the first cylindrical structure, and a micro-hole fixing plate is fixed on the groove.

[0012] Preferably, in the aforementioned pressure-curing device, the microporous fixing plate is covered with a second sealing cover, and a second sealing ring is provided between the microporous fixing plate and the second sealing cover.

[0013] Preferably, in the aforementioned pressure-curing device, wave-shifting optical fibers are inserted one-to-one into each of the micropores of the micropore fixing plate.

[0014] The objective of this invention and the technical problem it solves can also be achieved using the following technical solutions. A pressure-curing method according to this invention includes the following steps:

[0015] Inject the curing adhesive, seal it, and then purge with nitrogen until the curing adhesive overflows to the top of the microporous fixing plate. Then, under a fixed pressure, irradiate the microporous fixing plate with ultraviolet light from bottom to top. After curing, remove the microporous fixing plate.

[0016] Preferably, in the aforementioned pressure curing method, the liquid level of the curing adhesive is flush with the upper end of the microporous fixing plate.

[0017] Preferably, in the aforementioned pressure curing method, the curing adhesive tightly fills each gap between the wave-shifting optical fiber and the plurality of micropores.

[0018] By employing the above technical solutions, the microporous fixing plate curing device and method proposed in this invention have at least the following beneficial effects:

[0019] The pressure-curing device and method provided by the present invention can significantly improve the bonding strength and curing quality between the microporous fixing plate and the wave-shifting optical fiber;

[0020] The pressure-curing device and method provided by this invention, through fine optimization of the curing device structure and improvement of the curing process, aims to eliminate air bubbles generated during the curing process and ensure that the wave-shifted optical fiber can maintain a high-strength structure and be uniformly inserted into the micropores.

[0021] The pressure-increasing curing device and method provided by the present invention effectively eliminate all air bubbles in the cured adhesive during the curing process by applying precise pressure control, thereby improving the strength of the cured adhesive between the wave-shifting optical fiber and the micropores.

[0022] The pressure-curing apparatus and method provided by this invention apply positive pressure to cure the wave-shifting optical fiber and the microporous plate. This design aims to eliminate air bubbles in the curing adhesive and improve the curing strength. This pressure-curing method is unaffected by the curing viscosity and can use curing adhesives with any viscosity parameters to meet the needs of different microporous fixing plates.

[0023] The pressure-increasing curing device and method provided by this invention can improve the curing structure strength of the microporous fixing plate and maintain the stability of the ICMOS system connection during the 10-year on-orbit operation of the front and rear stage optical cones, thereby ensuring the overall detection efficiency and accuracy of the calorimeter. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the microporous fixing plate of the present invention;

[0025] Figure 2 This is one of the structural schematic diagrams of the pressure-curing device of the present invention;

[0026] Figure 3 This is a second schematic diagram of the pressure-curing device of the present invention.

[0027] 1-Microhole fixing plate, 2-First sealing cover, 3-First rubber ring, 4-Injection hole, 5-Air inlet, 6-Wave-shifting optical fiber, 7-Second sealing cover, 8-Second sealing ring; 9-Threaded hole; 10-Slot; 11-Microhole; 12-First cylinder; 13-Second cylinder; 14-Annular outer edge; 15-Curing adhesive. Detailed Implementation

[0028] To further illustrate the technical means and effects adopted by the present invention to achieve its intended purpose, the following detailed description, in conjunction with the accompanying drawings and preferred embodiments, provides a detailed explanation of the specific implementation methods, features, and effects of a pressure-curing apparatus and method proposed according to the present invention. In the following description, different "embodiments" or "embodiments" do not necessarily refer to the same embodiment. Furthermore, specific features or characteristics in one or more embodiments can be combined in any suitable form.

[0029] It should be noted that all directional indicators (such as up, down, left, right, etc.) in this invention are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicator will also change accordingly. The connection can be a direct connection or an indirect connection.

[0030] like Figures 1-3 As shown, some embodiments of the present invention provide a pressure-curing device for achieving precise coupling between a wave-shifting optical fiber and a micro-hole fixing plate. The device includes a hollow first cylindrical structure 12 and a second cylindrical structure 13 connected to each other. The second cylindrical structure 13 is disposed in the first cylindrical structure 12. A through hole is opened at the bottom of the second cylindrical structure 13, and a slot 10 is formed with the bottom of the first cylindrical structure 12. A micro-hole fixing plate 1 is fixed on the slot 10. The micro-hole fixing plate 1 has a plurality of micro-holes 11. Figure 1 The structure of the micro-hole fixing plate 1 of the present invention includes two cylindrical structures of different diameters connected together. Wave-shifting optical fibers 6 with diameters close to those of a plurality of micro-holes 11 are inserted into them. The diameter of the micro-hole fixing plate 1 is highly matched with that of the optical fiber of the pre-stage optical cone, ensuring seamless connection between the two. The first cylindrical structure 12 and the second cylindrical structure 13 can be made of acrylic, polycarbonate (PC), or MS board, which are materials with high transparency and high strength.

[0031] Figure 2The structure of the pressure-curing device of the present invention includes an annular outer edge 14 on the second cylindrical structure 13. The second cylindrical structure 13 is connected to the first cylindrical structure 12 through the annular outer edge 14, forming a channel for the injection hole and the air inlet. The cavity between the second cylindrical structure 13 and the first cylindrical structure 12 through the annular outer edge 14 forms a channel for filling with curing adhesive, and the annular outer edge 14 enables the splicing of the cylindrical structures. One end of the annular outer edge 14 has an injection hole 4, which is filled with curing adhesive 15. The curing adhesive 15 can be a UV-curing adhesive, which is a photosensitive adhesive that can rapidly cure under ultraviolet or visible light irradiation, and is colorless and transparent. This selection helps to fix the wave-shifting optical fiber within the microporous plate, increasing strength and service life. The UV-curable adhesive comprises, by weight percentage (wt%): 34-39% monofunctional reactive diluent (specifically N-vinylpyrrolidone), 14-15% polyfunctional reactive diluent (specifically trimethylolpropane triacrylate), 1-6% photoinitiator (specifically benzophenone), 42-43% photosensitive resin (specifically acrylic epoxy resin), and 1-2% photosensitive synergist (specifically triethylamine). The reactive diluent participates in the formation of a cross-linked three-dimensional structure, enhancing the adhesive's bonding performance. Excessive diluent addition results in a shorter curing time, leading to decreased bond strength. The photoinitiator absorbs UV light and initiates polymerization; the reactive diluent determines the viscosity of the cured adhesive and participates in the curing reaction, affecting the performance of the cured film. The photosensitive resin shortens the curing time, enables rapid bonding, and possesses good mechanical properties, chemical stability, and weather resistance. A first rubber ring 3 is provided on the injection hole 4, and a first sealing cap 2 is provided on the first rubber ring 3. By designing an injection hole 4 at one end of the annular outer edge 14 and applying a first sealing cap 2 and a first rubber ring 3, its airtightness can be improved. For ease of tooling, the outer walls of the first cylindrical structure 12 have air inlets 5 at both ends; the bottom of the second cylindrical structure 13 has a through hole and forms a groove 10 with the bottom of the first cylindrical structure 12, and a micro-hole fixing plate 1 is fixed on the groove 10. This arrangement facilitates the application of positive gas pressure, increases the driving force of the curing adhesive, and tightly fills the gap between the wave-shifting optical fiber and the micro-hole. A second sealing cap 7 is provided on the micro-hole fixing plate 1, and a second sealing ring 8 is provided between the micro-hole fixing plate 1 and the second sealing cap 7; the second sealing cap 7 has four threaded holes 9 around its perimeter, and screws that cooperate with it are provided on the threaded holes 9. The micro-hole fixing plate 1 is fixed in the groove 10, and the micro-hole fixing plate 1 is fixed by the sealing cap 7. Its lower end is further sealed by the rubber ring 8 to achieve a high-efficiency sealing effect. The sealing cap 7 is fixed by tightening screws through the four threaded holes 9. Wave-shifting optical fibers 6 are inserted one by one into each of the micro-holes 11 of the micro-hole fixing plate 1.The wave-shifting fiber is responsible for absorbing the optical signal, and then the image intensifier performs photoelectric conversion on the optical signal output from the wave-shifting fiber. Therefore, the wave-shifting fiber needs to be inserted into a micro-perforation fixing plate with a diameter matching the wave-shifting fiber to ensure accurate transmission of the optical signal. By inserting the wave-shifting fiber 6 into the micro-perforation fixing plate 1 one by one, the signal light is transmitted to the front-end optical cone structure through the wave-shifting fiber 6.

[0032] The tight bonding between the wave-shifting optical fiber and the micro-hole fixing plate is the key to ensuring high curing strength. However, traditional methods rely on the capillary force effect of the curing adhesive to achieve a tight bond between the optical fiber and the micro-hole 11. This often faces challenges due to the small gaps and insufficient penetration of the curing adhesive. Specifically, the curing adhesive fails to fully fill the gaps and may leave air bubbles, which weakens the curing strength.

[0033] Therefore, some embodiments of the present invention provide a pressure-curing method that abandons the traditional bottom-up capillary force injection method and instead adopts a more efficient and controllable injection and pressure combination technology, such as... Figure 3 As shown, it includes:

[0034] First, place the sealing ring 8 into the slot 10 of the microporous fixing plate 1. Then, place the microporous fixing plate 1 inside the slot 10. Place the second sealing cap 7 on the upper end of the microporous fixing plate 1 and screw on the four threaded holes 9 around the second sealing cap 7 to further improve the stability and airtightness of the microporous fixing plate. Select a curing adhesive with a viscosity of 500-800 cp. If the viscosity is less than 500 cp, the curing adhesive viscosity is too low, which will result in insufficient curing strength of the wave-shifted optical fiber; if the viscosity is greater than 800 cp, the viscosity is too high, and the air pressure is insufficient to allow the curing adhesive to enter the micropores. To eliminate air bubbles in the cured adhesive 15 before application, it needs to be degassed by rotating and revolving. The adhesive is then precisely dispensed through the dispensing hole 4 of the pressurized curing device using a dispensing machine, with a dispensing volume range of 20-30 ml. If the volume is less than 20 ml, it will not fully penetrate the micropores, resulting in insufficient curing strength of the wave-shifted optical fiber. If the volume is greater than 30 ml, the cured adhesive will enter the air inlet, making it difficult to insert the air tube and affecting the gas supply at the air inlet. The cured adhesive 15 is ensured to initially fill the micropore fixing plate area until its level is flush with the top of the micropore fixing plate 1. Dispensing is then stopped, and the first rubber ring 3 is placed in the dispensing hole 4, and the first sealing cap 2 is applied for sealing. Subsequently, gas is introduced into both sides of the aforementioned pressurized curing device. The gas connectors are tightened at the air inlets 5 at both ends of the curing device, and then a gas pipe is connected to introduce N2 in the range of 0.2 to 0.5 NL / min to apply gas pressure. If the gas flow rate is less than 0.2 NL / min, it is too small to allow the curing adhesive to enter the microporous plate; if the gas flow rate is greater than 0.5 NL / min, it is too large, causing the curing adhesive to enter the surface of the microporous plate too quickly, resulting in the curing adhesive covering the entire surface of the microporous plate, which will affect the smooth removal of the microporous plate later. Until the curing adhesive 15 overflows from the upper surface of the microporous fixing plate 1, in order to prevent the curing adhesive 15 from contacting and sticking to the sealing cap 7 at the upper end of the microporous fixing plate 1, making it difficult to remove the microporous fixing plate later, it is necessary to keep the curing adhesive 15 and the sealing cap 7 from contacting each other during operation, and then tighten the gas valve to control the gas pressure at this time. This innovative step significantly enhances the driving force of the curing adhesive 15, enabling it to overcome the resistance of the tiny gaps and fully penetrate and tightly fill every gap between the wave-shifting optical fiber 6 and the micropore 11. During this process, the positive pressure not only promotes the full diffusion of the curing adhesive 15, but also effectively removes air bubbles. Through continuous pressure, any potentially present tiny air bubbles are expelled one by one, thus avoiding the adverse effects of air bubbles on the curing quality. Afterwards, a UV lamp is used to irradiate the acrylic plate at the bottom of the curing device from bottom to top, irradiating it every 5-20 seconds. Longer intervals result in prolonged heat dissipation from the UV lamp, which can damage the waveshifting optical fiber and affect light transmission.Irradiation lasts 10-20 minutes. Longer irradiation times result in heat dissipation from the UV lamp, which can damage the wave-shifting fiber and affect light transmission. This process aims to cure the adhesive 15. Next, unscrew the screws, remove the sealing cap, cut off the lower part of the micro-hole fixing plate 1, and then polish it. The polishing time is set to 2.5-3 hours. Because the wave-shifting fiber, made of plastic, is softer than the micro-hole fixing plate, polishing for more than 3 hours will cause more wear on the fiber than on the micro-hole plate surface, resulting in pits. Polishing for less than 2.5 hours will result in a rough surface. Finally, the micro-hole fixing plate 1 can be easily removed, completing the curing process between the wave-shifting fiber 6 and the micro-hole fixing plate 1. Ultimately, a seamless bond is achieved between the wave-shifting fiber 6 and the micro-hole 11, without any air bubbles.

[0035] The present invention will be further described below with reference to specific embodiments, but this should not be construed as a limitation on the scope of protection of the present invention. Some non-essential improvements and adjustments made by those skilled in the art based on the above description of the present invention still fall within the scope of protection of the present invention.

[0036] The wavelength-shifting optical fiber 6 involved in Examples 1-8 and Comparative Examples 1-2 is a wavelength-shifting plastic optical fiber.

[0037] Example 1

[0038] The proportions (wt%) of each component of the curing adhesive are shown in Table 1. The curing adhesive with a viscosity of 450 cp was injected into the dispensing port of the pressure curing device using a dispensing machine. N2 at a rate of 0.3 NL / min was introduced through the air inlets at both ends of the pressure curing device until the curing adhesive overflowed to the upper surface of the microporous fixing plate 1. Then, under a fixed air flow rate, the microporous fixing plate 1 was irradiated from bottom to top for 12 minutes using a UV lamp with a light power of 3W and a wavelength of 395nm. The irradiation was repeated every 5 seconds. After curing, the microporous fixing plate 1 was removed. No bubbles were observed. The curing strength was tested to be 8 MPa. The light transmittance of the wave-shifted optical fiber 6 at a wavelength of 532nm was tested to be 79%.

[0039] Example 2

[0040] The proportions (wt%) of each component of the curing adhesive are shown in Table 1. The curing adhesive with a viscosity of 600cp is injected into the dispensing port of the pressure curing device using a dispensing machine. After sealing, N2 at a rate of 0.3NL / min is introduced through the air inlets at both ends of the pressure curing device until the curing adhesive overflows to the upper surface of the microporous fixing plate 1. Then, under a fixed air flow rate, the microporous fixing plate 1 is irradiated from bottom to top with an ultraviolet lamp for 10 minutes, with irradiation every 5 seconds for 5 seconds each time. After curing, the microporous fixing plate 1 is taken out. No bubbles are observed, and its curing strength is tested to be 9MPa. The light transmittance of the wave-shifted optical fiber 6 at a wavelength of 532nm is tested to be 80%.

[0041] Example 3

[0042] The proportions (wt%) of each component of the curing adhesive are shown in Table 1. The curing adhesive with a viscosity of 700 cp was injected into the dispensing port of the pressurized curing device using a dispensing machine. After sealing, N2 at a rate of 0.3 NL / min was introduced through the air inlets at both ends of the pressurized curing device until the curing adhesive overflowed to the upper surface of the microporous fixing plate 1. Then, under a fixed airflow rate, the microporous fixing plate 1 was irradiated from bottom to top for 9 minutes using a 3W UV lamp with a wavelength of 395nm, with irradiation every 5 seconds. After curing, the microporous fixing plate 1 was removed. No bubbles were observed, and its curing strength was measured to be 10 MPa. The light transmittance of the wave-shifted optical fiber 6 at a wavelength of 532nm was measured to be 78%.

[0043] Comparative Example 1

[0044] The proportions (wt%) of each component of the curing adhesive are shown in Table 1. The curing adhesive with a viscosity of 900cp is injected into the dispensing port of the pressure curing device using a dispensing machine. After sealing, N2 at a rate of 0.3NL / min is introduced into the air inlets at both ends of the pressure curing device through the air pipe. The N2 is insufficient to push the curing adhesive into the micropores 11 of the micropore fixing plate 1, and the wave-shifted optical fiber 6 fails to cure.

[0045] The composition and performance parameters of the UV-curable adhesives of Examples 1-3 and Comparative Example 1 are summarized in Tables 1 and 2. The curing strength was measured according to GB / T 7124-2008.

[0046] Table 1

[0047] Composition of UV-curable adhesive Example 1 Example 2 Example 3 Comparative Example 1 N-Vinylpyrrolidone (wt%) 39 37 35 33 Benzophenone (wt%) 1 3 5 7 Trimethylolpropane triacrylate (wt%) 15 15 15 15 Acrylic epoxy resin (wt%) 43 43 43 43 Triethylamine (wt%) 2 2 2 2 Total (wt%) 100 100 100 100

[0048] Table 2

[0049]

[0050]

[0051] As shown in Tables 1 and 2, gradually decreasing the mass percentage of the reactive diluent (N-vinylpyrrolidone) increases the viscosity of the cured adhesive and the mass percentage of the photoinitiator (benzophenone), enhancing the polymerization effect and necessitating a reduction in the irradiation time. When the viscosity of the cured adhesive is too low, the curing strength of the wave-shifting fiber is insufficient. As the viscosity gradually increases, the curing strength increases. However, when the viscosity is too high, the air pressure is insufficient to push the cured adhesive into the interior of the micropores 11, resulting in incomplete curing of the wave-shifting fiber. Changes in the viscosity of the cured adhesive have little effect on the transmittance of the wave-shifting fiber 6.

[0052] Example 4

[0053] The proportions (wt%) of each component of the curing adhesive are shown in Table 3. The curing adhesive with a viscosity of 600cp was injected into the dispensing port of the pressure curing device using a dispensing machine. N2 with a flow rate of 0.1NL / min was introduced through the air inlets at both ends of the pressure curing device until the curing adhesive overflowed to the upper surface of the microporous fixing plate. Then, under a fixed air flow rate, the microporous fixing plate was irradiated from bottom to top for 10 minutes using a UV lamp with a light power of 3W and a wavelength of 395nm. The irradiation was repeated every 5 seconds. After curing, the microporous fixing plate 1 was removed. However, it was found that the curing adhesive did not completely enter the interior of the micropores 11 and some bubbles were generated. The curing strength was tested to be 6MPa. The light transmittance of the wave-shifted optical fiber 6 at a wavelength of 532nm was 50%.

[0054] Example 5

[0055] The proportions (wt%) of each component of the curing adhesive are shown in Table 3. The curing adhesive with a viscosity of 600cp is injected into the dispensing port of the pressure curing device using a dispensing machine. N2 at a rate of 0.3NL / min is introduced through the air inlets at both ends of the pressure curing device until the curing adhesive overflows to the upper surface of the microporous fixing plate 1. Then, under a fixed air flow rate, the microporous fixing plate 1 is irradiated from bottom to top for 10 minutes using a UV lamp with a light power of 3W and a wavelength of 395nm. The irradiation is repeated every 5 seconds. After curing, the microporous fixing plate 1 is removed. No bubbles are observed. The curing strength is 10MPa. The light transmittance of the wave-shifted optical fiber 6 at a wavelength of 532nm is 79%.

[0056] Comparative Example 2

[0057] The proportions (wt%) of each component of the curing adhesive are shown in Table 3. The curing adhesive with a viscosity of 600cp is injected into the dispensing port of the pressure curing device using a dispensing machine. N2 at a rate of 0.7NL / min is introduced through the air inlets at both ends of the pressure curing device until the curing adhesive overflows to the upper surface of the microporous fixing plate. Then, under a fixed air flow rate, the microporous fixing plate 1 is irradiated from bottom to top for 10 minutes using a UV lamp with a light power of 3W and a wavelength of 395nm. The irradiation is repeated every 5 seconds. After curing, when the microporous fixing plate 1 is removed, most of the curing adhesive has overflowed from the surface, making the removal process very difficult. In addition, the microporous fixing plate contains a large number of air bubbles and a large number of voids at the bottom, which are not filled with curing adhesive. The wave-shifted optical fiber 6 fails to cure.

[0058] The composition and performance parameters of the UV-curable adhesives of Examples 4-5 and Comparative Example 2 are summarized in Tables 3 and 4. The curing strength was measured according to GB / T 7124-2008.

[0059] Table 3

[0060]

[0061] Table 4

[0062]

[0063] As can be seen from the data in Tables 3 and 4, if the air flow rate is too low, the curing adhesive is insufficient to enter the microporous plate; if the air flow rate is too high, the curing adhesive enters the surface of the microporous plate too quickly, resulting in the curing adhesive covering the entire surface of the microporous plate, which affects the smooth removal of the microporous plate later. Therefore, both excessively high and low air flow rates affect the curing strength of the wave-shifting fiber 6, and also directly affect the transmittance of the wave-shifting fiber.

[0064] Example 6

[0065] The proportions (wt%) of each component of the curing adhesive are shown in Table 5. The curing adhesive with a viscosity of 600cp is injected into the dispensing port of the pressure curing device using a dispensing machine. N2 at a rate of 0.3NL / min is introduced through the air inlets at both ends of the pressure curing device until the curing adhesive overflows to the upper surface of the microporous fixing plate 1. Then, under a fixed air flow rate, the microporous fixing plate 1 is irradiated from bottom to top for 8 minutes using a UV lamp with a light power of 3W and a wavelength of 395nm. The irradiation is repeated every 5 seconds. After curing, the microporous fixing plate 1 is removed. No bubbles are observed. The curing strength is 6MPa. The light transmittance of the wave-shifted optical fiber 6 at a wavelength of 532nm is 80%.

[0066] Example 7

[0067] The proportions (wt%) of each component of the curing adhesive are shown in Table 5. The curing adhesive with a viscosity of 600cp is injected into the dispensing port of the pressure curing device using a dispensing machine. N2 at a rate of 0.3NL / min is introduced through the air inlets at both ends of the pressure curing device until the curing adhesive overflows to the upper surface of the microporous fixing plate 1. Then, under a fixed air flow rate, the microporous fixing plate 1 is irradiated from bottom to top for 15 minutes using a UV lamp with a light power of 3W and a wavelength of 395nm. The irradiation is repeated every 5 seconds. After curing, the microporous fixing plate 1 is removed. No bubbles are observed. The curing strength is 8MPa. The light transmittance of the wave-shifted optical fiber 6 at a wavelength of 532nm is 76%.

[0068] Example 8

[0069] The proportions (wt%) of each component of the curing adhesive are shown in Table 5. The curing adhesive with a viscosity of 600cp is injected into the dispensing port of the pressure curing device using a dispensing machine. N2 at a rate of 0.3NL / min is introduced through the air inlets at both ends of the pressure curing device until the curing adhesive overflows to the upper surface of the microporous fixing plate 1. Then, under a fixed air flow rate, the microporous fixing plate 1 is irradiated from bottom to top for 22 minutes using a UV lamp with a light power of 3W and a wavelength of 395nm. The irradiation is repeated every 5 seconds for 5 seconds each time. After curing, the microporous fixing plate 1 is removed. No bubbles are observed. The curing strength is tested to be 10MPa. The light transmittance of the wave-shifted optical fiber 6 at a wavelength of 532nm is 60%.

[0070] The composition and performance parameters of the UV-curable adhesives in Examples 6-8 are summarized in Tables 5 and 6. The curing strength was measured according to GB / T 7124-2008.

[0071] Table 5

[0072]

[0073] Table 6

[0074]

[0075] As can be seen from the data in Tables 5 and 6, the longer the irradiation time, the higher the curing strength. However, prolonged exposure to ultraviolet light will generate heat, which can cause the wave-shifted optical fiber to be easily damaged by heat, affecting the transmission of light.

[0076] Numerous specific details are set forth in this specification. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some embodiments, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0077] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not describe the various possible combinations separately.

[0078] Furthermore, various different embodiments of the present invention can be combined in any way, as long as they do not violate the spirit of the present invention, they should also be regarded as the content disclosed by the present invention.

[0079] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A pressurized curing method, characterized by, Includes the following steps: The curing adhesive is injected, sealed, and then nitrogen gas is introduced until the curing adhesive overflows to the top of the microporous fixing plate. The microporous fixing plate is then irradiated with ultraviolet light from bottom to top under a fixed pressure. After curing, the microporous fixing plate is removed. The viscosity of the curing adhesive is 500-800 cp; the ultraviolet irradiation time is 8-22 min; the microporous fixing plate has a plurality of micropores; wave-shifting optical fibers are inserted into each of the plurality of micropores; the curing adhesive tightly fills every gap between the wave-shifting optical fibers and the plurality of micropores; the nitrogen gas flow rate is 0.2~0.5 NL / min; the amount of curing adhesive injected is set to 20-30 ml.

2. The pressurized curing method according to claim 1, wherein The liquid level of the cured adhesive is flush with the upper end of the microporous fixing plate.

3. A pressurized curing device for use in the method of claim 1 or 2, characterized in that The device includes a hollow first cylindrical structure and a second cylindrical structure that are interconnected. The second cylindrical structure is disposed within the first cylindrical structure. A through hole is formed at the bottom of the second cylindrical structure, creating a slot with the bottom of the first cylindrical structure. A micro-hole fixing plate is mounted on the slot. The micro-hole fixing plate has a plurality of micro-holes. The diameter of the micro-hole fixing plate matches that of the optical fiber in the pre-amplifier. Wave-shifting optical fibers are sequentially inserted into each of the plurality of micro-holes in the micro-hole fixing plate. An annular outer edge is provided on the second cylindrical structure, which is connected to the first cylindrical structure via the annular outer edge. A channel for filling with curing adhesive is formed in the cavity between the second cylindrical structure and the first cylindrical structure through the annular outer edge. One end of the annular outer edge has an injection hole, which is filled with cured adhesive; both ends of the outer wall of the first cylindrical structure have air inlets.

4. The pressurized curing apparatus of claim 3, wherein A first rubber ring is provided on the injection hole, and a first sealing cap is provided on the first rubber ring. The cured adhesive and the first sealing cap do not contact each other.

5. The pressurized curing apparatus of claim 3, wherein The bottom of the second cylindrical structure has a through hole and forms a groove with the bottom of the first cylindrical structure, and a micro-hole fixing plate is fixed in the groove.

6. The pressurized curing apparatus of claim 3, wherein The microporous fixing plate is covered with a second sealing cover, and a second sealing ring is provided between the microporous fixing plate and the second sealing cover.

Citation Information

Patent Citations

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