Digital construction method and device of current-carrying connection structure simulation model, computer equipment, computer readable storage medium and computer program product

Abstract

The invention relates to a digital construction method and device of a current-carrying connection structure simulation model, computer equipment, a storage medium and a computer program product. Relates to the technical field of power equipment. The method comprises the steps that a fan-shaped ring is constructed to serve as an equivalent body of a spiral spring in the current-carrying connection structure, a first conducting rod and a second conducting rod are constructed, and the equivalent body is located between the first conducting rod and the second conducting rod; respectively constructing contact areas between the equivalent body and the first conducting rod and between the equivalent body and the second conducting rod to form a spiral spring contact finger equivalent model; the contact area is used for simulating contact resistance; and forming a current-carrying connection structure simulation model based on the constructed multiple spiral spring contact finger equivalent models. By adopting the method, the constructed current-carrying connection structure simulation model can meet the calculation efficiency and the calculation precision at the same time.

Description

Technical Field

[0001] The present application relates to the technical field of power equipment, and in particular to a method, device, computer equipment, computer-readable storage medium and computer program product for digitally constructing a current-carrying connection structure simulation model. Background Art

[0002] With the development of power systems, the equipment in power systems has become more diverse. During the regular maintenance of equipment, it is found that the internal thermal performance of the equipment is an important indicator affecting its operation, and the thermal failure of the equipment is usually caused by severe temperature rise due to local contact degradation, which gradually causes the decomposition of the insulating medium. Therefore, it is necessary to monitor the internal status information of the equipment in real time.

[0003] At present, the way to realize digital monitoring of the internal status information of the equipment is through the combination of external monitoring data and simulation, which mainly includes establishing a proportional current-carrying connection model and directly calculating the spiral spring contact fingers of the contact structure equivalent to a circular ring. However, the process of establishing the proportional current-carrying connection model is too complicated, and the established model is too fine, which will lead to low calculation efficiency; directly calculating the spiral spring contact fingers of the contact structure equivalent to a circular ring makes the model too simple and ignores the necessary structure, resulting in low calculation accuracy. Therefore, there is currently a problem that the model used in the process of obtaining equipment thermal faults cannot meet both calculation efficiency and calculation accuracy. Summary of the invention

[0004] Based on this, it is necessary to provide a digital construction method, device, computer equipment, computer-readable storage medium and computer program product for a current-carrying connection structure simulation model to address the technical problem that the model used in the above-mentioned process of obtaining equipment thermal faults cannot meet both calculation efficiency and calculation accuracy.

[0005] In a first aspect, the present application provides a method for digitally constructing a current-carrying connection structure simulation model, the method comprising:

[0006] Constructing a sector ring as an equivalent body of a spiral spring in a current-carrying connection structure, and constructing a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0007] A contact area is constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a coil spring contact finger; the contact area is used to simulate contact resistance;

[0008] Based on the constructed equivalent models of multiple coil spring contact fingers, a current-carrying connection structure simulation model is composed.

[0009] In one embodiment, the width of the equivalent body is smaller than a preset multiple of the pitch of the coil spring, the inner diameter of the equivalent body is the inner diameter of the ring corresponding to the annular area formed by the first conductive rod and the second conductive rod, and the outer diameter of the equivalent body is the outer diameter corresponding to the annular area minus the spring wire diameter of the coil spring.

[0010] In one embodiment, the length and width of the contact area are both greater than half of the spring wire pitch of the coil spring and less than the spring wire pitch; the number of the coil spring equivalent models is determined based on the total number of the pitches of the coil spring.

[0011] In one of the embodiments, after forming a current-carrying connection structure simulation model based on the constructed multiple coil spring contact finger equivalent models, it includes: obtaining a first conductivity parameter of a material constituting the equivalent body; based on the first conductivity parameter, obtaining a second conductivity parameter of a material constituting a contact area; obtaining the heat generation power of different parts of the device to be monitored according to the first conductivity parameter and the second conductivity parameter, and then obtaining thermal fault information of the device according to the heat generation power.

[0012] In one embodiment, the obtaining of the first conductivity parameter of the material constituting the equivalent body includes: obtaining a first resistance value of the equivalent body and obtaining a second resistance value of a coil spring model corresponding to the equivalent body; comparing the first resistance value and the second resistance value, adjusting the conductivity value of the equivalent body, and when the first resistance value and the second resistance value are equal, using the conductivity value of the equivalent body as the first conductivity parameter of the material constituting the equivalent body.

[0013] In one embodiment, obtaining the second conductivity parameter of the material constituting the contact area based on the first conductivity parameter includes: obtaining a first total resistance value of the equivalent body and a second total resistance value of a coil spring model corresponding to the equivalent body; comparing the first total resistance value with the second total resistance value, adjusting the conductivity value of the contact area, and when the first total resistance value and the second total resistance value are equal, using the conductivity value of the contact area as the second conductivity parameter of the material constituting the contact area.

[0014] In a second aspect, the present application also provides a digital construction device for a current-carrying connection structure simulation model, the device comprising:

[0015] A sector ring construction module, used to construct a sector ring as an equivalent body of a spiral spring in a current-carrying connection structure, and to construct a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0016] An equivalent model forming module, used to construct contact areas between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a coil spring contact finger; the contact areas are used to simulate contact resistance;

[0017] The simulation model composition module is used to compose a current-carrying connection structure simulation model based on a plurality of constructed helical spring contact finger equivalent models.

[0018] In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0019] Constructing a sector ring as an equivalent body of a spiral spring in a current-carrying connection structure, and constructing a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0020] A contact area is constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a coil spring contact finger; the contact area is used to simulate contact resistance;

[0021] Based on the constructed equivalent models of multiple coil spring contact fingers, a current-carrying connection structure simulation model is composed.

[0022] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, the following steps are implemented:

[0023] Constructing a sector ring as an equivalent body of a spiral spring in a current-carrying connection structure, and constructing a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0024] A contact area is constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a coil spring contact finger; the contact area is used to simulate contact resistance;

[0025] Based on the constructed equivalent models of multiple coil spring contact fingers, a current-carrying connection structure simulation model is composed.

[0026] In a fifth aspect, the present application further provides a computer program product, including a computer program, which implements the following steps when executed by a processor:

[0027] Constructing a sector ring as an equivalent body of a spiral spring in a current-carrying connection structure, and constructing a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod;

[0028] A contact area is constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a coil spring contact finger; the contact area is used to simulate contact resistance;

[0029] Based on the constructed equivalent models of multiple coil spring contact fingers, a current-carrying connection structure simulation model is composed.

[0030] The digital construction method, device and computer equipment of the current-carrying connection structure simulation model have the following beneficial effects in the process of digital construction of the current-carrying connection structure simulation model: first, a fan-shaped ring is constructed as the equivalent body of the spiral spring in the current-carrying connection structure, and a first conductive rod and a second conductive rod are constructed, and the equivalent body is located between the first conductive rod and the second conductive rod; then, a contact area is constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of the spiral spring contact finger; the contact area is used to simulate the contact resistance; finally, based on the constructed multiple spiral spring contact finger equivalent models, a current-carrying connection structure simulation model is formed. The above process can more realistically reflect the contact resistance between the contacts by constructing a fan-shaped ring as the equivalent body of the spiral spring in the current-carrying connection structure and introducing the contact area in the equivalent model, thereby improving the accuracy of the simulation results; the performance of different current-carrying connection structures can be evaluated by combining multiple models, and finally the constructed current-carrying connection structure simulation model satisfies both the calculation efficiency and the calculation accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A schematic diagram of a flow chart of a method for digitally constructing a current-carrying connection structure simulation model in one embodiment;

[0033] Figure 2 A schematic diagram of a flow chart of steps for obtaining thermal fault information of a device in an embodiment;

[0034] Figure 3 A detailed flow chart of a method for digitally constructing a current-carrying connection structure simulation model in one embodiment;

[0035] Figure 4 A schematic diagram of constructing a coil spring equivalent model in one embodiment;

[0036] Figure 5 is a cross-sectional schematic diagram of an equivalent model in one embodiment;

[0037] Figure 6 A structural block diagram of a digital construction device for a current-carrying connection structure simulation model in one embodiment;

[0038] Figure 7 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0040] In one embodiment, Figure 1 As shown, a method for digitally constructing a current-carrying connection structure simulation model is provided. This embodiment uses the method applied to a terminal as an example. It can be understood that the method can also be applied to a server, and can also be applied to a system including a terminal and a server, and is implemented through the interaction between the terminal and the server. In this embodiment, the method includes the following steps S102 to S106. Among them:

[0041] Step S102 , constructing a sector ring as an equivalent body of the coil spring in the current-carrying connection structure, and constructing a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod.

[0042] Among them, the fan-shaped ring can usually be used to provide a stable mechanical connection. In the current-carrying connection structure, the fan-shaped ring can simulate the shape and function of the coil spring and effectively conduct current; the current-carrying connection structure is an integral structure for electrical connection, which can be used to ensure smooth conduction of current; the coil spring is a mechanical element with good elasticity and compressibility, and is usually used to provide crimping force in the current-carrying connection structure to ensure good electrical contact; the equivalent body is a model used to simplify complex structures, which can represent the electrical and mechanical properties of the actual structure; the first conductive rod and the second conductive rod are important components of the current-carrying connection structure, and are usually used to conduct current.

[0043] Specifically, the sector ring usually has a curved structure, and materials with good conductivity and elasticity, such as copper and aluminum alloy, should be selected to ensure that the sector ring has sufficient conductivity; accordingly, the first conductive rod and the second conductive rod are both used for current transmission, so metals with high conductivity, such as copper or nickel, can be selected to reduce losses when current passes through.

[0044] Step S104, constructing contact areas between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form a spiral spring contact finger equivalent model; the contact areas are used to simulate contact resistance.

[0045] Optionally, the contact area is a contact surface between the equivalent body and the conductive rod; the contact resistance refers to the resistance generated when current passes through the two contact surfaces.

[0046] Specifically, in the simulation model of the current-carrying connection structure, the quality of the contact area directly affects the efficiency and stability of the current passing through; the contact resistance affects the flow of current, and excessive contact resistance may cause heat generation and reduce efficiency.

[0047] Step S106, composing a current-carrying connection structure simulation model based on the constructed multiple coil spring contact finger equivalent models.

[0048] Among them, the equivalent model is a simplified model built according to the characteristics of the actual component, which is used to replace the complex physical structure in the simulation; the simulation model is a model used to simulate the behavior of the real system.

[0049] In the digital construction method of the current-carrying connection structure simulation model, a fan-shaped ring is first constructed as the equivalent body of the coil spring in the current-carrying connection structure, and a first conductive rod and a second conductive rod are constructed, and the equivalent body is located between the first conductive rod and the second conductive rod; then, a contact area is constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of the coil spring contact finger; the contact area is used to simulate the contact resistance; finally, based on the constructed multiple equivalent models of the coil spring contact finger, a simulation model of the current-carrying connection structure is formed. The above process can more realistically reflect the contact resistance between the contacts by constructing a fan-shaped ring as the equivalent body of the coil spring in the current-carrying connection structure and introducing the contact area in the equivalent model, thereby improving the accuracy of the simulation results; the performance of different current-carrying connection structures can be evaluated by combining multiple models, and finally the constructed simulation model of the current-carrying connection structure satisfies both the calculation efficiency and the calculation accuracy.

[0050] In an exemplary embodiment, the width of the equivalent body is smaller than a preset multiple of the pitch of the coil spring, the inner diameter of the equivalent body is the inner diameter of the ring corresponding to the annular area formed by the first conductive rod and the second conductive rod, and the outer diameter of the equivalent body is the outer diameter corresponding to the annular area minus the spring wire diameter of the coil spring.

[0051] Among them, the pitch represents the center distance between adjacent spiral coils. The setting of the pitch affects the stiffness and elastic deformation ability of the spring. Therefore, when designing the equivalent body, it is necessary to consider the relationship between the width of the fan ring and the pitch; the preset multiple is a design parameter, which can be used to define that the width of the equivalent body should be less than 1.5 times the pitch of the spiral spring, ensuring the effectiveness of the equivalent model in simulating the actual spiral spring behavior, and avoiding the negative impact of excessive structural volume on electrical contact performance.

[0052] Specifically, the width refers to the distance between the two sides of the sector ring. The width directly affects the current conduction efficiency and mechanical elasticity. Therefore, the width requirement is to ensure a reasonable ratio between the sector ring and the spiral spring in the design, which can better simulate the actual contact performance.

[0053] More often, the inner diameter refers to the circular diameter inside the equivalent body, specifically, it is related to the annular area formed by the first conductive rod and the second conductive rod; correspondingly, the outer diameter refers to the circular diameter outside the equivalent body, which is the size of the outer edge of the annular area; the spring wire diameter is the thickness of the helical spring wire. When obtaining the outer diameter of the equivalent body, it is necessary to use the outer diameter minus the spring wire diameter to ensure the fit between the equivalent body and the helical spring.

[0054] In this embodiment, by designing the width of the fan-shaped ring to be smaller than the preset multiple of the pitch of the spiral spring, its effectiveness as an equivalent body is ensured, and the current conduction performance and contact characteristics are also taken into consideration, so that the performance of the entire current-carrying connection structure remains good, and a certain degree of flexibility is reserved in the design to adapt to different operating conditions; by defining the inner diameter and outer diameter when designing the equivalent body, the compatibility of the equivalent body with the first conductive rod and the second conductive rod is ensured, wherein the inner diameter needs to be large enough to accommodate the conductive rod without interfering with the current flow; and the outer diameter needs to be subtracted from the spring wire diameter to ensure the stability of the structure and the normal function of the spring, thereby ultimately achieving efficient electrical connection.

[0055] In an exemplary embodiment, the length and width of the contact area are both greater than half of the spring wire pitch of the coil spring and less than the spring wire pitch; the number of coil spring equivalent models is determined based on the total number of pitches of the coil spring.

[0056] Among them, the length of the contact area refers to the extension distance of the contact area on the contact surface; the width of the contact area refers to the measured length of the contact area in the horizontal direction; and the length of the contact area must be greater than half of the spring wire pitch and less than the spring wire pitch to ensure sufficient contact surface, and the width of the contact area needs to be greater than half of the spring wire pitch and less than the spring wire pitch to ensure good contact without forming too large a gap; the spring wire pitch refers to the distance between two adjacent turns of the coil spring; the total number refers to the basis for determining the number of equivalent models by measuring the pitch of the coil spring, which represents the total number of spring coils considered in the design. As the number of spring coils increases, the number of equivalent models will also increase.

[0057] Exemplarily, assuming that the total number of spring pitches is D, the number of spring contact finger equivalent models constructed around the conductor circumference is D / 1.5; if it is not divided exactly, the length of the equivalent model body of the last spring contact finger is the remainder, and the number of contact areas of the first conductive rod and the second conductive rod is reduced by 1 each.

[0058] In this embodiment, good conduction of current is ensured by limiting the length and width of the contact area, and the number of equivalent models is calculated by determining the pitch of the coil spring, so that higher efficiency can be achieved in electrical and mechanical design.

[0059] Further, in one embodiment, if Figure 2 As shown, after forming a current-carrying connection structure simulation model based on the constructed multiple helical spring contact finger equivalent models, it includes:

[0060] Step S201, obtaining a first conductivity parameter of a material constituting an equivalent body; step S202, based on the first conductivity parameter, obtaining a second conductivity parameter of a material constituting a contact area; step S203, obtaining the heating power of different parts of the device to be monitored according to the first conductivity parameter and the second conductivity parameter, and then obtaining thermal fault information of the device according to the heating power.

[0061] Among them, the first conductivity parameter refers to the conductivity value of the equivalent bulk material, which determines the material's ability to conduct current. The higher the conductivity, the better the conductivity of the material; the second conductivity parameter refers to the conductivity of the contact area material, which affects the current flow efficiency and conduction capacity; heat generation power refers to the heat generated by the equipment during operation, which is usually proportional to the material's conductivity and the current passing through; thermal fault information refers to the potential fault state or risk inferred based on the heat generation power calculation results.

[0062] In this embodiment, by obtaining the first conductivity parameter and the second conductivity parameter of the material, the performance of different parts of the monitored equipment is analyzed, and then the heating power of the monitored equipment is calculated, and the thermal fault information of the equipment is further derived, which helps to accurately evaluate the performance of the electrical equipment.

[0063] Furthermore, in one embodiment, obtaining a first conductivity parameter of a material constituting an equivalent body includes: obtaining a first resistance value of the equivalent body, and obtaining a second resistance value of a coil spring model corresponding to the equivalent body; comparing the first resistance value and the second resistance value, adjusting the conductivity value of the equivalent body, and when the first resistance value and the second resistance value are equal, using the conductivity value of the equivalent body as the first conductivity parameter of the material constituting the equivalent body.

[0064] Among them, the first resistance value refers to the resistance measurement value of the equivalent body, which is used to evaluate the degree of obstruction of the equivalent body when current passes through. The larger the resistance value, the higher the loss when current passes through. The second resistance value is the resistance value of the coil spring model corresponding to the equivalent body. The first resistance value and the second resistance value are analyzed and compared to determine their differences and their impact on conductivity, and the first conductivity parameter is further adjusted. When the first resistance value and the second resistance value are adjusted to the same, the conductivity value of the equivalent body is the first conductivity parameter.

[0065] In this embodiment, by comparing and adjusting the first resistance value and the second resistance value, the conductive properties of the material can be optimized, which is helpful for material design so that the material used achieves a balance in electrical and mechanical properties, and can be applied to electronic components, sensors, and other engineering materials that require comprehensive consideration of electrical and mechanical properties.

[0066] In one embodiment, based on the first conductivity parameter, obtaining a second conductivity parameter of a material constituting the contact region comprises:

[0067] Obtain a first total resistance value of the equivalent body and a second total resistance value of the coil spring model corresponding to the equivalent body; compare the first total resistance value and the second total resistance value, adjust the conductivity value of the contact area, and when the first total resistance value and the second total resistance value are equal, use the conductivity value of the contact area as the second conductivity parameter of the material constituting the contact area.

[0068] Among them, the first total resistance value is the total resistance value of the equivalent body, which is usually calculated by measuring current and voltage; the second total resistance value is the resistance value calculated by the coil spring model corresponding to the equivalent body; when the first total resistance value and the second total resistance value are equal, the obtained contact area conductivity is regarded as the second conductivity parameter of the material constituting the contact area.

[0069] In this embodiment, the resistance values ​​of the equivalent body and the coil spring model are obtained by measurement and calculation; by comparing the first total resistance value and the second total resistance value, it can be determined whether the electrical conductivity of the material matches; and in order to achieve consistency between the first total resistance value and the second total resistance value, the conductivity of the contact area needs to be adjusted. When the two are equal, the conductivity value of the contact area is regarded as a new material property, namely, the second conductivity parameter. The above process helps to optimize engineering design and improve the application effect of materials in practical applications.

[0070] The present application provides a method for digitally constructing a simulation model of a current-carrying connection structure. In order to better understand the process of the digital construction method of the simulation model of the current-carrying connection structure, combined with Figure 3 As shown, the specific process of a digital construction method of a current-carrying connection structure simulation model of the present application is described in detail below, including the following steps:

[0071] Step S302, establishing a current-carrying connection structure simulation model.

[0072] Among them, the schematic diagram of constructing the equivalent model of the coil spring is as follows Figure 4 As shown, it includes an equivalent body, a contact area, a conductive rod 1 (a first conductive rod) and a conductive rod 2 (a second conductive rod); and a cross-sectional schematic diagram of the equivalent model is shown in Figure 5 As shown, it includes an equivalent body, a contact area and a conductive rod wall.

[0073] Step S304: Equivalent the coil spring to a contact area and an equivalent body.

[0074] Specifically, the equivalent body is a fan-shaped ring, whose inner diameter is equal to the inner diameter of the ring where the coil spring is located, the outer diameter is equal to the diameter of the conductive rod 2 minus the spring wire diameter of the coil spring, and the width is equal to 1.5 spring pitches; 4 contact areas are attached to each equivalent body for simulating contact resistance; the length and width of the contact area are between 0.5 and 1 spring wire pitches.

[0075] Exemplarily, assuming that the total number of spring pitches is D, the number of spring contact finger equivalent models constructed around the circumference of the conductor is D / 1.5; if it is not divided exactly, the length of the equivalent model body of the last spring contact finger is the remainder, and the number of contact areas of the conductive rod 1 and the conductive rod 2 is reduced by 1 each.

[0076] Step S306, obtaining a first conductivity parameter and a second conductivity parameter.

[0077] Among them, the specific process of obtaining the first conductivity parameter of the equivalent body material is as follows: take a coil spring model with a pitch number corresponding to the length of the equivalent model, apply the inlet and outlet of current at the contact points of the conductive rod 1 and the conductive rod 2 respectively (regardless of which side), and calculate the resistance value r (the second resistance value); apply the inlet and outlet of current at the interface between the contact area on the side of the conductive rod 1 and the conductive rod 2 and the equivalent body respectively (regardless of which side), and calculate the equivalent resistance value R (the first resistance value); modify the conductivity of the material used for the equivalent body so that the value of the equivalent resistance value R is equal to r, then the conductivity value of the material is the conductivity value used for loss calculation.

[0078] More specifically, the method for obtaining the second conductivity parameter of the contact area material includes: ① Experimental method: Establish a simulation calculation model of the equivalent model of the conductive rod 1, the conductive rod 2 and the coil spring contact finger, and build an experimental simulation model of the real coil spring contact finger; obtain the total resistance value rtotal (second total resistance value) at both ends of the conductive rod 1 and the conductive rod 2 through experimental measurement; simulate and calculate the resistance value Rtotal (first total resistance value) at both ends of the conductive rod 1 and the conductive rod 2, at this time, the conductivity value of the conductive rod 1, the conductive rod 2 and the equivalent body is a fixed value, modify the conductivity value of the contact area, so that rtotal and Rtotal are equal, and obtain the equivalent conductivity value of the contact area. The resistance value at this position obtained is the contact resistance. ② Simulation method: The method for obtaining the total r value is different. Establish a refined simulation calculation model of the real coil spring contact finger, and obtain the total r value through simulation.

[0079] Step S308: thermal calculation for equivalent contact resistance.

[0080] The above-mentioned method for constructing an equivalent model of the coil spring contact finger is used to establish a GIS / GIL simulation calculation model of the head structure, and the equivalent conductivity value calculated above is assigned to the corresponding part to obtain the heating power of the corresponding part, and the overall temperature field distribution is obtained through the heat flow coupling calculation method.

[0081] In the above embodiment, the problem of equivalent modeling of the coil spring contact finger is solved, the contact resistance is fully considered, and the complex surface meshing of the coil spring is avoided while maintaining the calculation accuracy, and the calculation efficiency and accuracy of the temperature field analysis and evaluation are improved; and due to the segmented equivalent modeling, the uneven distribution of resistance on the entire circle of the spring structure when the force is unevenly applied can be considered.

[0082] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0083] Based on the same inventive concept, the embodiment of the present application also provides a digital construction device for a current-carrying connection structure simulation model for realizing the digital construction method of the current-carrying connection structure simulation model involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in the embodiments of the digital construction device for one or more current-carrying connection structure simulation models provided below can refer to the limitations of the digital construction method for the current-carrying connection structure simulation model above, and will not be repeated here.

[0084] In an exemplary embodiment, Figure 6 As shown, a digital construction device for a current-carrying connection structure simulation model is provided, comprising: a fan-shaped ring construction module 601, an equivalent model forming module 602 and a simulation model composition module 603, wherein:

[0085] The sector ring construction module 601 is used to construct a sector ring as an equivalent body of a spiral spring in a current-carrying connection structure, and to construct a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod.

[0086] The equivalent model forming module 602 is used to construct contact areas between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form a spiral spring contact finger equivalent model; the contact area is used to simulate the contact resistance.

[0087] The simulation model composition module 603 is used to compose a current-carrying connection structure simulation model based on the constructed multiple helical spring contact finger equivalent models.

[0088] Furthermore, in one embodiment, the fan-shaped ring construction module 601 is also used to construct an equivalent body whose width is smaller than a preset multiple of the pitch of the coil spring; the inner diameter of the equivalent body is the inner diameter of the ring corresponding to the annular area formed by the first conductive rod and the second conductive rod, and the outer diameter of the equivalent body is the outer diameter corresponding to the annular area minus the spring wire diameter of the coil spring.

[0089] Furthermore, in one embodiment, the equivalent model forming module 602 is also used when the length and width of the contact area are both greater than half of the spring wire pitch of the coil spring and less than the spring wire pitch; the number of coil spring equivalent models is determined based on the total number of pitches of the coil spring.

[0090] Furthermore, in one embodiment, the equivalent model forming module 602 is also used to obtain a first conductivity parameter of a material constituting the equivalent body; based on the first conductivity parameter, obtain a second conductivity parameter of a material constituting the contact area; obtain the heating power of different parts of the device to be monitored according to the first conductivity parameter and the second conductivity parameter, and then obtain thermal fault information of the device according to the heating power.

[0091] Furthermore, in one embodiment, the equivalent model forming module 602 is also used to obtain a first resistance value of the equivalent body and a second resistance value of the coil spring model corresponding to the equivalent body; compare the first resistance value and the second resistance value, adjust the conductivity value of the equivalent body, and when the first resistance value and the second resistance value are equal, use the conductivity value of the equivalent body as the first conductivity parameter of the material constituting the equivalent body.

[0092] Furthermore, in one embodiment, the equivalent model forming module 602 is also used to obtain a first total resistance value of the equivalent body and a second total resistance value of the coil spring model corresponding to the equivalent body; compare the first total resistance value and the second total resistance value, adjust the conductivity value of the contact area, and when the first total resistance value and the second total resistance value are equal, use the conductivity value of the contact area as the second conductivity parameter of the material constituting the contact area.

[0093] Each module in the digital construction device of the current-carrying connection structure simulation model can be implemented in whole or in part by software, hardware, or a combination thereof. Each module can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute operations corresponding to each module.

[0094] In an exemplary embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as shown in FIG. Figure 7As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store digital construction data of a current-carrying connection structure simulation model. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a digital construction method for a current-carrying connection structure simulation model is implemented.

[0095] Those skilled in the art will understand that Figure 7 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0096] In an exemplary embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0097] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0098] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0099] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0100] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0101] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for digitally constructing a current-carrying connection structure simulation model, characterized in that: The method comprises: Constructing a sector ring as an equivalent body of a spiral spring in a current-carrying connection structure, and constructing a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod; A contact area is constructed between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a coil spring contact finger; the contact area is used to simulate contact resistance; Based on the constructed equivalent models of multiple coil spring contact fingers, a current-carrying connection structure simulation model is composed.

2. The method according to claim 1, characterized in that The width of the equivalent body is smaller than a preset multiple of the pitch of the coil spring, the inner diameter of the equivalent body is the inner diameter of the ring corresponding to the annular area formed by the first conductive rod and the second conductive rod, and the outer diameter of the equivalent body is the outer diameter corresponding to the annular area minus the spring wire diameter of the coil spring.

3. The method according to claim 2, characterized in that The length and width of the contact area are both greater than half of the spring wire pitch of the coil spring and less than the spring wire pitch; The number of the coil spring equivalent models is determined based on the total number of the pitches of the coil spring.

4. The method according to claim 1, characterized in that: After the current-carrying connection structure simulation model is formed based on the constructed multiple spiral spring contact finger equivalent models, it includes: Acquire a first conductivity parameter of a material constituting the equivalent body; Based on the first conductivity parameter, obtaining a second conductivity parameter of the material constituting the contact area; The heating power of different parts of the device to be monitored is obtained according to the first conductivity parameter and the second conductivity parameter, and then the thermal fault information of the device is obtained according to the heating power.

5. The method according to claim 4, characterized in that The obtaining of a first conductivity parameter of a material constituting the equivalent body comprises: Acquire a first resistance value of the equivalent body, and acquire a second resistance value of a coil spring model corresponding to the equivalent body; The first resistance value and the second resistance value are compared to adjust the conductivity value of the equivalent body. When the first resistance value and the second resistance value are equal, the conductivity value of the equivalent body is used as the first conductivity parameter of the material constituting the equivalent body.

6. The method according to claim 4, characterized in that The step of acquiring a second conductivity parameter of a material constituting the contact region based on the first conductivity parameter comprises: Acquire a first total resistance value of the equivalent body and a second total resistance value of a coil spring model corresponding to the equivalent body; The first total resistance value and the second total resistance value are compared to adjust the conductivity value of the contact area. When the first total resistance value and the second total resistance value are equal, the conductivity value of the contact area is used as the second conductivity parameter of the material constituting the contact area.

7. A digital construction device for a current-carrying connection structure simulation model, characterized in that: The device comprises: A sector ring construction module, used to construct a sector ring as an equivalent body of a spiral spring in a current-carrying connection structure, and to construct a first conductive rod and a second conductive rod, wherein the equivalent body is located between the first conductive rod and the second conductive rod; An equivalent model forming module, used to construct contact areas between the equivalent body and the first conductive rod, and between the equivalent body and the second conductive rod, respectively, to form an equivalent model of a coil spring contact finger; the contact areas are used to simulate contact resistance; The simulation model composition module is used to compose a current-carrying connection structure simulation model based on a plurality of constructed helical spring contact finger equivalent models.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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