Multilayer capacitor

Abstract

There is provided a multilayer capacitor including a capacitor body having first to sixth surfaces, and having first and second internal electrodes alternately stacked, the first internal electrode and the second internal electrode have a dielectric layer therebetween and each have an end exposed through a respective one of the third surface and the fourth surface. The first conductive layer and the second conductive layer respectively include a first connection portion disposed on the third surface of the capacitor body and connected to the first internal electrode and a second connection portion disposed on the fourth surface of the capacitor body and connected to the second internal electrode, and first and second tape portions extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body, respectively. The first and second reinforcement layers each contain a carbon material and an impact absorbing adhesive and are disposed on the first and second belt portions, respectively.

Description

[0001] This application is a divisional application of the invention patent application with application date of April 14, 2020, application number 202010289038.0, and invention name “Multilayer Capacitor”. Technical Field

[0002] The present disclosure relates to a multilayer capacitor. Background Art

[0003] Generally, a multilayer capacitor has external electrodes connected to internal electrodes, which are arranged parallel to each other. The external electrodes are used to protect the capacitor body from external physical impact or to protect the capacitor body from moisture.

[0004] Due to the use of multilayer capacitors in automobiles, multilayer capacitors with special specifications (such as, multilayer capacitors for high capacitance) are required to have higher reliability in terms of bending strength caused by events such as thermal shock or physical shock, and therefore, there is a need to develop multilayer capacitors with new structures having high reliability. Summary of the invention

[0005] An aspect of the present disclosure provides a multilayer capacitor having excellent bending strength and capable of improving moisture resistance, chemical resistance, and conductivity.

[0006] According to one aspect of the present disclosure, a multilayer capacitor includes a capacitor body having a first surface and a second surface opposite to each other, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a length direction, and a fifth surface and a sixth surface connected to the first surface and the second surface and connected to the third surface and the fourth surface and opposite to each other, and the capacitor body has a first inner electrode and a second inner electrode alternately stacked, a dielectric layer is interposed between the first inner electrode and the second inner electrode, and the first inner electrode and the second inner electrode each have one end exposed through a corresponding one of the third surface and the fourth surface. A first conductive layer includes a first connection portion disposed on the third surface of the capacitor body and connected to the first inner electrode, and a first band portion extending from the first connection portion to a corresponding portion of the first surface, a corresponding portion of the second surface, a corresponding portion of the fifth surface, and a corresponding portion of the sixth surface of the capacitor body, and a second conductive layer includes a second connection portion disposed on the fourth surface of the capacitor body and connected to the second inner electrode, and a second band portion extending from the second connection portion to a corresponding portion of the first surface, a corresponding portion of the second surface, a corresponding portion of the fifth surface, and a corresponding portion of the sixth surface of the capacitor body. The first reinforcement layer and the second reinforcement layer each contain a carbon material and a shock absorbing adhesive and are disposed on the first belt portion and the second belt portion, respectively.

[0007] In an embodiment of the present disclosure, the multilayer capacitor may further include a first conductive resin layer and a second conductive resin layer respectively arranged on the first conductive layer and the second conductive layer, the first reinforcement layer may be arranged between the first conductive layer and the first conductive resin layer, and the second reinforcement layer may be arranged between the second conductive layer and the second conductive resin layer.

[0008] In an embodiment of the present disclosure, the length of the first reinforcement layer in the length direction may be longer than the length of the first belt portion in the length direction, and the length of the second reinforcement layer in the length direction may be longer than the length of the second belt portion in the length direction.

[0009] In an embodiment of the present disclosure, the first reinforcement layer and the second reinforcement layer may also be disposed on the first connection portion and the second connection portion, respectively.

[0010] In an embodiment of the present disclosure, the first plating layer and the second plating layer may be respectively arranged on the first conductive layer and the second conductive layer, wherein the first reinforcement layer may be arranged between the first conductive layer and the first plating layer, and the second reinforcement layer may be arranged between the second conductive layer and the second plating layer.

[0011] In an embodiment of the present disclosure, the first plating layer may include a first nickel (Ni) plating layer disposed on the first conductive layer and a first tin (Sn) plating layer disposed on the first nickel plating layer, and the second plating layer may include a second nickel (Ni) plating layer disposed on the second conductive layer and a second tin (Sn) plating layer disposed on the second nickel plating layer.

[0012] In an embodiment of the present disclosure, the carbon material of the first reinforcement layer and the second reinforcement layer may include one or more of graphene, carbon nanotubes, and carbon black.

[0013] In an embodiment of the present disclosure, the impact-absorbing adhesive of the first reinforcement layer and the second reinforcement layer may include an epoxy-based adhesive or an acrylic-based adhesive.

[0014] According to another aspect of the present disclosure, a multilayer capacitor includes: a capacitor body including first and second inner electrodes alternately stacked, with a dielectric layer interposed between the first and second inner electrodes; and first and second outer electrodes disposed on an outer surface of the capacitor body and connected to the first and second inner electrodes, respectively. Each of the first and second outer electrodes has a multilayer structure including a plurality of conductive layers stacked on the outer surface of the capacitor body, and including a reinforcing layer containing a carbon material and disposed between two of the plurality of conductive layers.

[0015] According to another aspect of the present disclosure, a multilayer capacitor includes: a capacitor body including first and second inner electrodes alternately stacked, a dielectric layer interposed between the first and second inner electrodes; first and second outer electrodes disposed on an outer surface of the capacitor body and connected to the first and second inner electrodes, respectively; first and second reinforcement layers disposed on different corresponding portions of the outer surface of the capacitor body to be spaced apart from each other, and each including a carbon material and an impact absorbing adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a schematic perspective view of a multilayer capacitor according to an embodiment of the present disclosure; FIG. 2A to FIG. 2B They are shown respectively Figure 1 A plan view of a first inner electrode and a second inner electrode of a multilayer capacitor; Figure 3 It is along Figure 1 A cross-sectional view taken along line II'; Figure 4 is a cross-sectional view showing another embodiment of a reinforcement layer; Figure 5 is a cross-sectional view showing another embodiment of a reinforcement layer; Figure 6 is a cross-sectional view showing another embodiment of a reinforcement layer; Figure 7 is a cross-sectional view showing another embodiment of the multilayer capacitor of the present disclosure and showing that a conductive resin layer is included in an external electrode; Figure 8 is a cross-sectional view showing another embodiment of a reinforcement layer; Fig. 9 is a cross-sectional view showing another embodiment of a reinforcement layer; and Fig.10 is a cross-sectional view showing another embodiment of a reinforcement layer. DETAILED DESCRIPTION

[0017] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0018] This disclosure may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein.

[0019] Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0020] In the drawings, the shapes and sizes of elements may be exaggerated for clarity.

[0021] Furthermore, in the drawings, elements having the same functions within the same scope of the inventive concept will be denoted by the same reference numerals.

[0022] Throughout the specification, when a component is referred to as “including” or “comprising”, unless explicitly stated otherwise, it means that it may also include other components, and does not necessarily exclude other components.

[0023] Hereinafter, when the direction of the capacitor body 110 is defined to clearly explain the embodiments in the present disclosure, X, Y, and Z shown in the drawings respectively represent the length direction, the width direction, and the thickness direction of the capacitor body 110. In addition, in the present embodiment, the Z direction may be conceptually the same as the stacking direction in which the dielectric layers are stacked and laminated.

[0024] Figure 1 is a schematic perspective view of a multilayer capacitor according to an embodiment of the present disclosure, FIG. 2A to FIG. 2B It is shown separately Figure 1 a plan view of a first inner electrode and a second inner electrode of a multilayer capacitor, and Figure 3 It is along Figure 1 A cross-sectional view taken along line II'.

[0025] Reference Figure 1 , Figure 2A , Figure 2B and Figure 3 , the multilayer capacitor 100 according to the present embodiment includes a capacitor body 110 , first and second external electrodes 130 and 140 , and first and second reinforcement layers 133 and 143 .

[0026] The capacitor body 110 is formed by stacking a plurality of dielectric layers 111 in the Z direction and then sintering the plurality of dielectric layers 111 , and boundaries between adjacent dielectric layers 111 of the capacitor body 110 may be integrated such that it may be difficult to confirm the boundaries without using a scanning electron microscope (SEM).

[0027] In this case, the capacitor body 110 may have a substantially hexahedral shape, but the present disclosure is not limited thereto. In addition, the shape and size of the capacitor body 110 and the number of stacked layers of the dielectric layer 111 are not limited to those shown in the drawings of this embodiment.

[0028] In the present embodiment, for ease of explanation, two surfaces of the capacitor body 110 opposite to each other in the Z direction are defined as a first surface 1 and a second surface 2, two surfaces connected to the first surface 1 and the second surface 2 and opposite to each other in the X direction are defined as a third surface 3 and a fourth surface 4, and two surfaces connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposite to each other in the Y direction are defined as a fifth surface 5 and a sixth surface 6. In addition, in the present embodiment, the mounting surface of the multilayer capacitor 100 may be the first surface 1 of the capacitor body 110.

[0029] Each dielectric layer 111 may include a ceramic material having a high dielectric constant, for example, barium titanate (BaTiO 3 )-based ceramic powder, strontium titanate (SrTiO 3 )-based ceramic powder, etc. However, the present disclosure is not limited thereto as long as sufficient capacitance can be obtained therewith.

[0030] In addition, ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added to the dielectric layer 111 together with the ceramic powder.

[0031] As the ceramic additive, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), etc. can be used.

[0032] The capacitor body 110 may include an active area, an upper cover 112 and a lower cover 113, the active area serving as a portion that contributes to the formation of the capacitance of the capacitor, and the upper cover 112 and the lower cover 113 formed above and below the active area as an upper edge portion and a lower edge portion, respectively. For example, the upper cover 112 and the lower cover 113 may be formed above the uppermost inner electrode and below the lowermost inner electrode of the first inner electrode 121 and the second inner electrode 122 in the capacitor body 110, respectively.

[0033] The upper cover 112 and the lower cover 113 may have the same material and configuration as the dielectric layer 111 except that the inner electrodes are not included.

[0034] The upper and lower covers 112 and 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on upper and lower surfaces of the active area in the Z direction, respectively, and may prevent the first and second internal electrodes 121 and 122 from being damaged due to physical or chemical stress.

[0035] The first internal electrodes 121 and the second internal electrodes 122 are alternately arranged in the Z direction, the dielectric layer 111 is interposed between the first internal electrodes 121 and the second internal electrodes 122, and each serves as an electrode applying different polarities. One end of the first internal electrode 121 and one end of the second internal electrode 122 may be exposed through the third surface 3 and the fourth surface 4 of the capacitor body 110, respectively.

[0036] In this case, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed therebetween.

[0037] Ends of the first and second internal electrodes 121 and 122 respectively exposed through the third and fourth surfaces of the capacitor body 110 may be respectively connected to first and second external electrodes 130 and 140 respectively disposed on the third and fourth surfaces 3 and 4 of the capacitor body 110 described below for electrical connection.

[0038] According to the above configuration, when a predetermined voltage is applied to the first and second external electrodes 130 and 140 , charges are accumulated between the first and second internal electrodes 121 and 122 .

[0039] In this case, the capacitance of the multilayer capacitor 100 is proportional to an overlapping area in which the first and second internal electrodes 121 and 122 overlap each other in the Z direction in the active region.

[0040] In addition, the material used to form the first and second internal electrodes 121 and 122 is not particularly limited, and the internal electrodes can be formed by using a conductive paste made of, for example, a precious metal material (such as platinum (Pt), palladium (Pd), an alloy of palladium silver (Pd-Ag), etc.) and one or more materials of nickel (Ni) and copper (Cu).

[0041] In this case, the conductive paste may be printed by a screen printing method, a gravure printing method, or the like, but the present disclosure is not limited thereto.

[0042] The first external electrode 130 and the second external electrode 140 are provided with voltages having different polarities, may be arranged on opposite ends of the capacitor body 110 that are opposite to each other in the X direction, and may be respectively connected to exposed portions of the first internal electrode 121 and the second internal electrode 122 to be electrically connected to the first internal electrode 121 and the second internal electrode 122. Each of the first external electrode 130 and the second external electrode 140 may have a multilayer structure including a plurality of conductive layers stacked on an outer surface (e.g., an outer surface in the X direction) of the capacitor body 110. Each of the first external electrode 130 and the second external electrode 140 may further include a reinforcement layer including a carbon material and disposed between two of the plurality of conductive layers.

[0043] In this case, the first external electrode 130 and the second external electrode 140 are each formed on a corresponding surface of the capacitor body 110, and the first external electrode 130 includes a first conductive layer 131 contacting and connected to the first internal electrode 121, and the second external electrode 140 includes a second conductive layer 141 contacting and connected to the second internal electrode 122.

[0044] The first conductive layer 131 may include a first connection portion 131 a and a first band portion 131 b .

[0045] The first connection portion 131a is a portion that is disposed on the third surface 3 of the capacitor body 110 and contacts and is connected to the exposed portion of the first internal electrode 121, and the first band portion 131b is a portion that extends from the first connection portion 131a to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the capacitor body 110.

[0046] The second conductive layer 141 may include a second connection portion 141 a and a second band portion 141 b .

[0047] The second connection portion 141a is a portion that is arranged on the fourth surface 4 of the capacitor body 110 and contacts and is connected to the exposed portion of the second internal electrode 122, and the second band portion 141b is a portion that extends from the second connection portion 141a to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the capacitor body 110.

[0048] The first conductive layer 131 and the second conductive layer 141 may include at least one of copper (Cu) and silver (Ag), and may further include glass, epoxy resin, or the like.

[0049] The first reinforcing layer 133 is provided on the first belt portion 131 b , and contains a carbon material and a shock absorbing binder.

[0050] The second reinforcing layer 143 is provided on the second belt portion 141 b , and contains a carbon material and a shock absorbing binder.

[0051] In this case, the carbon material may include one or more of graphene, carbon nanotube, and carbon black.

[0052] In addition, the impact-absorbing binder may include an epoxy-based binder or an acrylic-based binder.

[0053] In addition, the first reinforcement layer 133 and the second reinforcement layer 143 may further include metal powder.

[0054] In this case, the metal powder may be one or more of Cu, Ag, Au, Ni, and Sn.

[0055] As such, similar to an embodiment in which the external electrode includes a conductive resin layer to be described later, when the first reinforcement layer and the second reinforcement layer contain metal powder, the bending strength and conductivity of the external electrode may be further improved.

[0056] In addition, the multilayer capacitor 100 of the present embodiment may further include a first plating layer 132 and a second plating layer 142 disposed on the first conductive layer 131 of the first external electrode 130 and the second conductive layer 141 of the second external electrode 140 , respectively.

[0057] In this case, the first and second plating layers 132 and 142 may include respective first and second nickel (Ni) plating layers disposed on the first and second conductive layers 131 and 141 , respectively, and respective first and second tin (Sn) plating layers disposed on the first and second nickel plating layers, respectively.

[0058] In addition, the first plating layer 132 may include a first plating connection portion 132a contacting the first connection portion 131a and a first plating band portion 132b contacting the first band portion 131b, and the second plating layer 142 may include a second plating connection portion 142a contacting the second connection portion 141a and a second plating band portion 142b contacting the second band portion 141b.

[0059] In the multilayer capacitor, a bending shock can be easily transmitted from the substrate, and a position where a major stress caused by the bending shock acts is a starting surface of a band portion of an external electrode.

[0060] In the prior art, the non-conductive material is formed to be longer than the plating layer in a portion where the strip portion starts, thereby dispersing stress at the starting surface of the strip portion of the external electrode.

[0061] However, in the structure of the related art, the non-conductive material formed on the capacitor body volatilizes or flows during the reflow temperature stage during firing, and therefore, the shape of the non-conductive part formed using the non-conductive material may not be properly maintained, thereby causing problems of reduced impact absorption effect and moisture resistance, chemical resistance and conductivity.

[0062] According to the present embodiment, the first reinforcement layer 133 and the second reinforcement layer 143 contain a carbon material and an impact absorbing adhesive to disperse the stress at the starting surface of the band portion of the outer electrode, prevent volatilization or flow during the reflow temperature, and its shape can be properly maintained. Therefore, the bending strength, moisture resistance, chemical resistance and conductivity of the multilayer capacitor can be improved.

[0063] In addition, if Figure 4 As shown in the figure, the first reinforcement layer 133 and the second reinforcement layer 143 may be respectively provided with extension portions 133a and 143a at their ends, so that the length of the first reinforcement layer 133 in the X direction is formed to be longer than the length of the first belt portion 131b in the X direction, and the second reinforcement layer 143 is formed to be longer than the length of the second belt portion 141b in the X direction.

[0064] Therefore, the extension portion 133a of the first reinforcement layer 133 may protrude longer than the end of the first band portion 131b and cover the end of the first band portion 131b where the reliability is easily affected; the extension portion 143a of the second reinforcement layer 143 may protrude longer than the end of the second band portion 141b and cover the end of the second band portion 141b where the reliability is easily affected. For example, the extension portions 133a and 143a may extend over the ends of the first band portion 131b and the second band portion 141b, respectively, so as to directly contact and extend over a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the main body 110.

[0065] Therefore, excellent properties of moisture resistance, chemical resistance, and electrical conductivity, which are basic properties of carbon materials, can improve the bending strength, moisture resistance, and chemical resistance of a multilayer capacitor, and can also improve the electrical conductivity of an external electrode.

[0066] In addition, if Figure 5 As shown in FIG, the first reinforcement layer 134 and the second reinforcement layer 144 may also be disposed on the first connection portion 131 a of the first conductive layer 131 and the second connection portion 141 a of the second conductive layer 141 , respectively.

[0067] In the first reinforcing layer 134, a portion 134a disposed on the first connecting portion 131a and a portion 134b disposed on the first belt portion 131b may be connected to each other; in the second reinforcing layer 144, a portion 144a disposed on the second connecting portion 141a and a portion 144b disposed on the second belt portion 141b may be connected to each other.

[0068] Optionally, in this case, Figure 6 As shown in the figure, the first reinforcement layer 134' and the second reinforcement layer 144' may be provided with extension portions 134c and 144c at the ends, respectively, so that the length of the first reinforcement layer 134' in the X direction is formed to be longer than the length of the first belt portion 131b in the X direction, and the length of the second reinforcement layer 144' in the X direction is formed to be longer than the length of the second belt portion 141b in the X direction.

[0069] In addition, according to another embodiment of the present disclosure, Figure 7 As shown in FIG. 1 , the first and second external electrodes 130 ′ and 140 ′ may further include first and second conductive resin layers 135 and 145 disposed on the first and second conductive layers 131 and 141 , respectively.

[0070] In addition, the first conductive resin layer 135 may include a first resin layer connection portion 135a in contact with the first connection portion 131a and a first resin layer strip portion 135b overlapping or in contact with the first strip portion 131b, and the second conductive resin layer 145 may include a second resin layer connection portion 145a in contact with the second connection portion 141a and a second resin layer strip portion 145b overlapping or in contact with the second strip portion 141b. Figure 7 As shown in FIG. 1 , the first resin layer strip portion 135 b and the second resin layer strip portion 145 b may be in contact with the first reinforcement layer 133 and the second reinforcement layer 143 , respectively.

[0071] The first conductive resin layer 135 and the second conductive resin layer 145 may include a resin and a plurality of metal particles dispersed in the resin.

[0072] In this case, the conductive resin may include an epoxy-based adhesive or an acrylic-based adhesive.

[0073] In addition, the metal particles may include one or more of Cu, Ag, and Sn.

[0074] After being mounted on a substrate, the first conductive resin layer 135 and the second conductive resin layer 145 may serve to increase the bending strength of the multilayer capacitor by absorbing external impact.

[0075] according to Figure 7In the structure, since the elasticity of the outer electrodes 130' and 140' including the conductive resin layer is improved, the durability of the bending strength can be further improved, and the conductivity can be maintained at an appropriate level. In the case where there is no conductive resin layer, the bending strength, moisture resistance and chemical resistance of the multilayer capacitor can be improved by the reinforcement layer.

[0076] The first reinforcement layer 133 may be disposed between the first band portion 131b of the first conductive layer 131 and the first resin layer band portion 135b of the first conductive resin layer 135 , and the second reinforcement layer 143 may be disposed between the second band portion 141b of the second conductive layer 141 and the second resin layer band portion 145b of the second conductive resin layer 145 .

[0077] In addition, if Figure 8 As shown in the figure, the first reinforcement layer 133 and the second reinforcement layer 143 may be provided with extension portions 133a and 143a at their ends, respectively, so that the length of the first reinforcement layer 133 in the X direction is formed to be longer than the length of the first belt portion 131b in the X direction, and the length of the second reinforcement layer 143 in the X direction is formed to be longer than the length of the second belt portion 141b in the X direction.

[0078] In addition, if Fig. 9 As shown in FIG. 1 , the first reinforcement layer 134 and the second reinforcement layer 144 may be further disposed on the first connection portion 131 a of the first conductive layer 131 and the second connection portion 141 a of the second conductive layer 141 , respectively.

[0079] Therefore, the first reinforcement layer 134 can be arranged between the first connection portion 131a of the first conductive layer 131 and the first resin layer connection portion 135a of the first conductive resin layer 135, and the second reinforcement layer 144 can be arranged between the second connection portion 141a of the second conductive layer 141 and the second resin layer connection portion 145a of the second conductive resin layer 145.

[0080] In the first reinforcing layer 134, a portion 134a disposed on the first connecting portion 131a and a portion 134b disposed on the first belt portion 131b may be connected to each other; in the second reinforcing layer 144, a portion 144a disposed on the second connecting portion 141a and a portion 144b disposed on the second belt portion 141b may be connected to each other.

[0081] In this case, if Fig.10 As shown in the figure, the first reinforcement layer 134' and the second reinforcement layer 144' may be provided with extension portions 134c and 144c at the ends, respectively, so that the length of the first reinforcement layer 134' in the X direction is formed to be longer than the length of the first belt portion 131b in the X direction, and the length of the second reinforcement layer 144' in the X direction is formed to be longer than the length of the second belt portion 141b in the X direction.

[0082] Table 1 below shows the bending deformation test results of the structure according to the embodiment of the present disclosure.

[0083] Here, the comparative example presents a structure in which there is no reinforcement layer, and Example 1 shows a structure having Figure 8 Example 2 shows a multilayer capacitor having a structure of Fig.10 Example 3 shows a multilayer capacitor having a structure of Figure 6 Multilayer capacitor with a structure.

[0084] In this case, the number of multilayer capacitors for each sample was 100, and the multilayer capacitor was manufactured so that the length in the X direction was 3.2 mm, the length in the Y direction was 2.5 mm, and the length in the Z direction was 2.5 mm.

[0085] The multilayer capacitor was mounted on a PCB, and the substrate was bent by approximately 6 mm to observe whether cracks occurred in the multilayer capacitor, as shown in Table 1.

[0086] The ESR test was evaluated at temperatures between -55°C and 150°C with the rate of change before and after 1000 cycles.

[0087] [Table 1]

[0088] Referring to Table 1, according to the present disclosure, in the cases of Examples 1 to 3, due to the effect of the reinforcement layer, it can be seen that no defects occurred in the bending strength test, while cracks appeared in 10 of the 100 samples of the comparative example, and the ESR change rate was further reduced by 15% or more, thereby greatly improving the reliability of the multilayer capacitor.

[0089] As described above, according to the embodiments of the present disclosure, the bending strength, moisture resistance, chemical resistance, and conductivity of the multilayer capacitor may be improved by the reinforcement layer.

[0090] While example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made thereto without departing from the scope of the invention as defined by the appended claims.

Claims

1. A multilayer capacitor comprising: a capacitor body including first and second surfaces opposite to each other, third and fourth surfaces connected to the first and second surfaces and opposite to each other in a length direction, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and opposite to each other, and including first and second inner electrodes alternately stacked, a dielectric layer interposed between the first and second inner electrodes, and each of the first and second inner electrodes having one end exposed through a corresponding one of the third and fourth surfaces; a first conductive layer and a second conductive layer, the first conductive layer including a first connecting portion disposed on the third surface of the capacitor body and connected to the first inner electrode and a first band portion extending from the first connecting portion to a corresponding portion of the first surface, a corresponding portion of the second surface, a corresponding portion of the fifth surface, and a corresponding portion of the sixth surface of the capacitor body, and the second conductive layer including a second connecting portion disposed on the fourth surface of the capacitor body and connected to the second inner electrode and a second band portion extending from the second connecting portion to a corresponding portion of the first surface, a corresponding portion of the second surface, a corresponding portion of the fifth surface, and a corresponding portion of the sixth surface of the capacitor body; a first conductive resin layer and a second conductive resin layer, respectively provided on the first conductive layer and the second conductive layer, and The first reinforcement layer and the second reinforcement layer both contain carbon material to have conductivity and both contain metal particles. The first reinforcement layer is arranged between the first conductive layer and the first conductive resin layer and on the first band portion of the first conductive layer. The second reinforcement layer is arranged between the second conductive layer and the second conductive resin layer and on the second band portion of the second conductive layer.

2. The multilayer capacitor according to claim 1, wherein The length of the first reinforcing layer in the longitudinal direction is longer than the length of the first belt portion in the longitudinal direction, and the length of the second reinforcing layer in the longitudinal direction is longer than the length of the second belt portion in the longitudinal direction.

3. The multilayer capacitor according to claim 1, wherein The first reinforcement layer and the second reinforcement layer each include an impact absorbing adhesive.

4. The multilayer capacitor according to claim 1, wherein The first reinforcement layer is only disposed on the first band portion of the first conductive layer without extending to the first connecting portion, and the second reinforcement layer is only disposed on the second band portion of the second conductive layer without extending to the second connecting portion.

5. The multilayer capacitor according to claim 1, further comprising a first plating layer and a second plating layer provided on the first conductive resin layer and the second conductive resin layer, respectively, Furthermore, the first reinforcement layer and the second reinforcement layer are also disposed on the first connection portion and the second connection portion, respectively.

6. The multilayer capacitor according to claim 5, wherein The first plating layer includes a first nickel plating layer disposed on the first conductive resin layer and a first tin plating layer disposed on the first nickel plating layer, and the second plating layer includes a second nickel plating layer disposed on the second conductive resin layer and a second tin plating layer disposed on the second nickel plating layer.

7. The multilayer capacitor according to claim 1, wherein The carbon material of the first reinforcement layer and the second reinforcement layer includes one or more of graphene, carbon nanotube, and carbon black.

8. The multilayer capacitor according to claim 3, wherein The impact absorbing adhesive includes an epoxy-based adhesive or an acrylic-based adhesive.

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