Layout etching compensation method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention discloses a layout etching compensation method and device, electronic equipment and a storage medium. According to the scheme, the etched chip layout can be obtained, multiple pieces of feature information and feature parameters associated with the target position are obtained for the to-be-compensated target position in the chip layout, two pieces of feature information are selected from the multiple pieces of feature information in sequence, and the two-dimensional tables between the two pieces of feature information and the first compensation value are established to obtain multiple two-dimensional tables; and sequentially determining a second compensation value corresponding to each two-dimensional table from the plurality of two-dimensional tables according to the feature parameters, calculating a target compensation value according to the plurality of second compensation values and the influence factors of the plurality of pieces of feature information on the target compensation value, and compensating the target position according to the target compensation value. According to the embodiment of the invention, the compensation values corresponding to every two pieces of feature information are obtained from the multiple pieces of feature information, and the target compensation value is calculated by combining the influence factors of the multiple pieces of feature information on the target compensation value, so that the accuracy of etching deviation compensation is improved.

Description

Technical Field

[0001] The present application relates to the field of chip manufacturing technology, and in particular to a method, device, electronic device and storage medium for etching compensation of a layout. Background Art

[0002] Etch bias is the size change of the pattern (such as line width and spacing) caused by the etching process in integrated circuit manufacturing. Ideally, the chip size after etching needs to be consistent with the design size. The process of etching bias compensation is to collect the measurement data of the key dimensions of different line widths and spacing patterns on the chip after photolithography and etching, and establish an etching bias rule table based on the measurement data of the key dimensions. Finally, run the bias compensation program on the design layout based on the etching bias rule table.

[0003] In the actual etching compensation process, the etching deviation rule table is widely used to design the layout for etching deviation compensation. With the continuous evolution of chip manufacturing process nodes, more and more factors need to be considered for single-layer pattern etching deviation compensation. In addition to considering the line width and spacing size of the compensated pattern, it is also necessary to consider the length of the compensated pattern, the length of the adjacent edge of the compensated pattern side length, the adjacent edge spacing of the compensated pattern side length, etc. Based on the existing etching deviation rule two-dimensional table, the rows and columns of the table can only perform etching compensation processes for two considerations of the pattern at one time, such as considering the line width / spacing, line width / length, line width / adjacent edge length, etc. of the pattern. However, in the etching process of complex patterning process, the etching deviation of a certain layer will be affected by the different factors listed above. Therefore, according to the traditional method, only one etching deviation rule table is established and etching deviation compensation is performed, which cannot accurately compensate for the etching deviation of a single layer. In this case, even if the etching deviation compensation is completed, the pattern etched on the wafer after the process is completed may still deviate significantly from the target pattern. Summary of the invention

[0004] The present application provides a method, device, electronic device and storage medium for etching compensation of a layout, which can consider the influence of multiple feature information on etching compensation, thereby solving the problem in the prior art that a single two-dimensional etching deviation rule table cannot adapt to the influence of multiple factors, and improving the accuracy of etching deviation compensation.

[0005] The present application provides a method for etching compensation of a layout, comprising: Acquire the chip layout after etching, and acquire multiple feature information and feature parameters associated with the target position to be compensated in the chip layout; Selecting two pieces of feature information from the plurality of feature information in sequence, and establishing a two-dimensional table between the two pieces of feature information and the first compensation value, so as to obtain a plurality of two-dimensional tables; Determine in sequence from the plurality of two-dimensional tables a second compensation value corresponding to each two-dimensional table according to the characteristic parameter; A target compensation value is calculated according to the multiple second compensation values ​​and the multiple characteristic information's influence factors on the target compensation value, and the target position is compensated according to the target compensation value.

[0006] Optionally, the plurality of feature information includes at least one of a spacing, a line width, a length, an adjacent edge spacing, an adjacent edge line width, and an adjacent edge length of the current edge.

[0007] Optionally, establishing a two-dimensional table between the two feature information and the first compensation value includes: Acquire a plurality of first measurement values ​​of the two characteristic information in different test chip layouts, and a plurality of second measurement values ​​after etching the test chip; Calculate a plurality of deviation values ​​according to the first measurement value and the second measurement value, and use the plurality of deviation values ​​as a plurality of first compensation values ​​corresponding to the two feature information; A two-dimensional table is established according to the multiple first compensation values ​​corresponding to the two feature information.

[0008] Optionally, determining the second compensation value corresponding to each two-dimensional table in sequence from the multiple two-dimensional tables according to the characteristic parameter includes: In each of the two-dimensional tables, determining a first interval corresponding to the first characteristic parameter and a second interval corresponding to the second characteristic parameter; A second compensation value corresponding to the two-dimensional table is determined according to the first interval and the second interval.

[0009] Optionally, the number of the multiple two-dimensional tables is greater than or equal to the number of the multiple feature information.

[0010] Optionally, the target compensation value is calculated according to the following fitting function:

[0011] Among them, Bias A is the target compensation value of the target position A, ∑ is the summation symbol, N takes the value of 1 or i. When N=1, it means that the target compensation value of the target position A is the sum of multiple second compensation values. When N=i, it means that the target compensation value of the target position A is the average value of multiple second compensation values. F i (x i ,y i ) is the influence factor of multiple feature information on the target compensation value, T i (x i ,y i ) is a second compensation value corresponding to multiple feature information.

[0012] Optionally, compensating the target position according to the target compensation value includes: Determine the target direction and moving distance according to the target compensation value; The target position in the chip layout is moved according to the target direction and the moving distance.

[0013] The present application also provides an etching compensation device for a layout, comprising: An acquisition module, used for acquiring a chip layout after etching, and acquiring a plurality of feature information and feature parameters associated with a target position to be compensated in the chip layout; An establishing module, used for selecting two pieces of characteristic information from the plurality of characteristic information in sequence, establishing a two-dimensional table between the two pieces of characteristic information and a first compensation value, so as to obtain a plurality of two-dimensional tables; A determination module, configured to determine, in turn from the plurality of two-dimensional tables, a second compensation value corresponding to each two-dimensional table according to the characteristic parameter; The calculation module is used to calculate the target compensation value according to the influence factors of the multiple second compensation values ​​and the multiple characteristic information on the target compensation value, and compensate the target position according to the target compensation value.

[0014] The present application also provides an electronic device, characterized in that the electronic device includes a memory and a processor, the memory stores a computer program, and the processor executes the steps in any one of the etching compensation methods for the layout provided in the present application by calling the computer program stored in the memory.

[0015] The present application also provides a storage medium, characterized in that the storage medium stores a computer program, and the computer program is suitable for being loaded by a processor to execute the steps in any one of the etching compensation methods for the layout provided in the present application.

[0016] The etching compensation method of the layout provided by the present application can obtain the chip layout after etching, obtain multiple feature information and feature parameters associated with the target position to be compensated in the chip layout, select two feature information from the multiple feature information in turn, establish a two-dimensional table between the two feature information and the first compensation value to obtain multiple two-dimensional tables, determine the second compensation value corresponding to each two-dimensional table in turn from the multiple two-dimensional tables according to the feature parameters, calculate the target compensation value according to the multiple second compensation values ​​and the multiple feature information on the target compensation value, and compensate the target position according to the target compensation value. The embodiment of the present application obtains the compensation value corresponding to each two feature information from multiple feature information, and then calculates the target compensation value in combination with the multiple feature information on the target compensation value. The problem that the single two-dimensional etching deviation rule table in the prior art cannot adapt to the influence of multiple factors is improved, and the accuracy of etching deviation compensation is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution in the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 It is a flow chart of a method for etching compensation of a layout provided in an embodiment of the present application; Figure 2 It is another schematic flow chart of the etching compensation method of the layout provided in the embodiment of the present application; Figure 3 It is a schematic diagram of characteristic parameters in the chip layout provided in the embodiment of the present application; Figure 4 It is a structural schematic diagram of an etching compensation device for a layout provided in an embodiment of the present application; Figure 5 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0019] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0020] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0021] It should be understood that, although the various steps in the flowchart in the embodiment of the present application are displayed in sequence according to the indication of the arrows, these steps are not necessarily performed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and it can be performed in other orders. Moreover, at least a portion of the steps in the figure may include a plurality of sub-steps or a plurality of stages, and these sub-steps or stages are not necessarily performed at the same time, but can be performed at different times, and their execution order is not necessarily performed in sequence, but can be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0022] It should be noted that, in this article, step codes such as 101, 102, etc. are used for the purpose of expressing the corresponding content more clearly and concisely, and do not constitute a substantial limitation on the sequence. When implementing the step, those skilled in the art may execute 102 first and then 101, etc., but these should all be within the scope of protection of this application.

[0023] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0024] An embodiment of the present application provides an etching compensation method for a layout. The executor of the etching compensation method for a layout may be an etching compensation device for a layout provided in the embodiment of the present application, or a server integrating the etching compensation device for the layout, wherein the etching compensation device for the layout may be implemented in hardware or software.

[0025] like Figure 1 As shown, Figure 1 1 is a schematic diagram of a first process flow of an etching compensation method for a layout provided in an embodiment of the present application. The specific process flow of the etching compensation method for the layout may be as follows: 101. Obtain a chip layout after etching, and obtain a plurality of feature information and feature parameters associated with a target position to be compensated in the chip layout.

[0026] In one embodiment, the target position to be compensated in the above chip layout can be a certain edge of the layout image, and the multiple feature information can include at least one of the spacing, line width, length, adjacent edge spacing, adjacent edge line width and adjacent edge length of the current edge. The role of these feature information is to provide basic data for the subsequent construction of an accurate etching deviation rule correction two-dimensional table. In addition to the above feature information, it can also include information such as the shape of the layout image (such as a rectangle, circle, polygon, etc.), the angle of the layout image, the curvature of the layout image, etc. These feature information are for more accurate analysis and etching compensation.

[0027] Furthermore, for the measurement of the above-mentioned characteristic parameters, professional measuring equipment and software can be used. For example, in the field of semiconductor manufacturing, optical microscopes, electron microscopes and other equipment can be used to measure characteristic parameters such as the size and shape of the graphics. In order to ensure the accuracy and completeness of the acquired characteristic information, the present embodiment can also perform multiple verifications and comparisons on the measured characteristic parameters. For example, different measuring equipment or methods can be used to measure the same characteristic information, and then the measurement results can be compared to eliminate the influence of measurement errors.

[0028] In one embodiment, after obtaining the chip layout after etching, pre-processing measures can be taken to improve the accuracy of subsequent characteristic parameter measurement. For example, the layout can be image enhanced to improve the clarity and contrast of the image, which is more conducive to the extraction and measurement of characteristic information. In addition, the layout can also be calibrated to ensure the accuracy of the measurement equipment and software.

[0029] 102. Select two pieces of feature information from the plurality of feature information in sequence, and establish a two-dimensional table between the two pieces of feature information and the first compensation value to obtain a plurality of two-dimensional tables.

[0030] In one embodiment, the above-mentioned multiple two-dimensional tables are two-dimensional tables for correcting etching deviation rules using multiple characteristic information (spacing, line width, length, adjacent edge spacing, adjacent edge line width, adjacent edge length, etc.) of the target position to be compensated as variables and performing etching compensation. For example, the two-dimensional table of spacing and line width is used to provide the first compensation value corresponding to different graphic spacings and different line widths, and the two-dimensional table of spacing and edge length is used to provide the first compensation value corresponding to different graphic spacings and graphic edge lengths. By analogy, any other factors that affect etching deviation can be combined into a two-dimensional table in pairs, thereby obtaining multiple two-dimensional tables. Among them, the above-mentioned first compensation value can be obtained by measuring the corresponding parameters before and after etching the test chip layout.

[0031] It should be noted that the number of the above-mentioned multiple two-dimensional tables is greater than or equal to the number of the multiple feature information. For example, when 3 feature information are obtained, 3 two-dimensional tables can be obtained by combining them in pairs in different arrangements. When 4 feature information are obtained, at least 4 two-dimensional tables can be obtained by combining them in pairs in different arrangements, and at most 6 two-dimensional tables can be obtained.

[0032] 103. Determine, in turn, from a plurality of two-dimensional tables a second compensation value corresponding to each two-dimensional table according to the characteristic parameter.

[0033] In one embodiment, the above-mentioned multiple two-dimensional tables respectively represent the first compensation values ​​corresponding to the influence of the variables x and y in the table, and then the multiple characteristic parameters associated with the target position to be compensated in the chip layout can be brought into the two-dimensional table to find the second compensation value output by each two-dimensional table. Specifically, for each two-dimensional table, the corresponding rows and columns can be found according to the characteristic parameters of the target position. For example, in the line width / spacing two-dimensional table, the corresponding row is found according to the line width value of the target position, and the corresponding column is found according to the spacing value. The value at the intersection of the two is the second compensation value corresponding to the two-dimensional table. The same method is applicable to other two-dimensional tables, such as line width / side length two-dimensional tables, side length / adjacent side spacing two-dimensional tables, and so on. For example, for the target position A, in the variable combinations x1 / y1, x2 / y2, x3 / y3, x4 / y4, ..., x n / y n The second compensation values ​​in the two-dimensional table formed in the above example can be expressed as T A (x1,y1),T A (x2,y2),T A (x3,y3),T A (x4,y4),...,T A (x n ,y n ).

[0034] In one embodiment, the variables x and y in the two-dimensional table may be arranged in a range interval manner, and if the characteristic parameter is at the boundary of a range in the two-dimensional table, the second compensation value may be determined according to a specific rule. For example, a more accurate second compensation value may be determined by taking an average value, interpolation, or the like.

[0035] Furthermore, different two-dimensional tables may have different weights or priorities, which need to be considered when determining the final second compensation value. For example, some feature information may have a greater impact on the etching deviation, and the weight of the corresponding two-dimensional table may be set higher.

[0036] 104. Calculate a target compensation value according to the multiple second compensation values ​​and the multiple characteristic information's influence factors on the target compensation value, and compensate the target position according to the target compensation value.

[0037] Since the same graphic has different second compensation values ​​under the influence of different feature information, the target compensation value that needs to be calculated can be calculated by constructing a fitting function, which can combine the above-mentioned multiple second compensation values ​​and multiple feature information to comprehensively calculate the influencing factors of the target compensation value. Among them, the above-mentioned influencing factors represent the degree of influence of different feature information on the target compensation value of the actual etching deviation under actual complex conditions. Finally, the target position to be compensated in the chip layout can be compensated based on the above-mentioned target compensation value.

[0038] In this embodiment, the various feature information and corresponding size parameters of the target position in the layout are automatically measured and calculated based on the etched chip layout, and then the corresponding two-dimensional table is matched to obtain different compensation values ​​of the target position under different size parameters, and then the actual comprehensive compensation correction value of the target position is obtained by combining the influencing factors of the various feature information input in advance, so as to actually move the layout according to the obtained comprehensive compensation correction value.

[0039] As described above, the etching compensation method of the layout proposed in the embodiment of the present application can obtain the chip layout after etching, obtain multiple feature information and feature parameters associated with the target position to be compensated in the chip layout, select two feature information from the multiple feature information in turn, establish a two-dimensional table between the two feature information and the first compensation value to obtain multiple two-dimensional tables, determine the second compensation value corresponding to each two-dimensional table in turn from the multiple two-dimensional tables according to the feature parameters, calculate the target compensation value according to the multiple second compensation values ​​and the multiple feature information on the target compensation value, and compensate the target position according to the target compensation value. The embodiment of the present application obtains the compensation value corresponding to each two feature information from multiple feature information, and then calculates the target compensation value in combination with the multiple feature information on the target compensation value. The problem that a single two-dimensional etching deviation rule table in the prior art cannot adapt to the influence of multiple factors is solved, and the accuracy of etching deviation compensation is improved.

[0040] The method described in the above embodiment will be further described below.

[0041] See also Figure 2 , Figure 2 1 is a second flow chart of the etching compensation method for the layout provided in the embodiment of the present application. The method comprises: 201. Obtain a chip layout after etching, and obtain a plurality of feature information and feature parameters associated with a target position to be compensated in the chip layout.

[0042] For example, to obtain the chip layout after etching, you can refer to Figure 3In this embodiment, etching compensation is performed on the target position BD edge in the layout ABCD. Figure 3 It can be determined that multiple characteristic information associated with the BD edge includes line width W, spacing S, length L, and adjacent edge spacing L_adj. Further, based on the above four characteristic information, it can be known that the length L of the BD is 400nm, the line width W of the BD edge is 700nm, the spacing S of the BD edge is 350nm, and the adjacent edge spacing L_adj of the BD edge is 500nm.

[0043] 202. Select two pieces of feature information from the plurality of feature information in sequence, obtain a plurality of first measurement values ​​of the two pieces of feature information in different test chip layouts, and a plurality of second measurement values ​​after etching the test chip.

[0044] 203. Calculate a plurality of deviation values ​​according to the first measurement value and the second measurement value, and use the plurality of deviation values ​​as a plurality of first compensation values ​​corresponding to the two feature information.

[0045] 204. Establish a two-dimensional table according to the multiple first compensation values ​​corresponding to the two feature information to obtain multiple two-dimensional tables.

[0046] 205. In each two-dimensional table, determine a first interval corresponding to the first characteristic parameter and a second interval corresponding to the second characteristic parameter.

[0047] 206. Determine a second compensation value corresponding to the two-dimensional table according to the first interval and the second interval.

[0048] Specifically, the characteristic information of different test chip layouts before and after etching can be measured, so as to obtain multiple first measurement values ​​before etching and multiple second measurement values ​​after etching for each characteristic information, and the difference between the first measurement value and the second measurement value is calculated as multiple deviation values ​​of the characteristic information under different parameters, that is, the first compensation value. Then, two characteristic information can be selected from the multiple characteristic information, so as to establish a two-dimensional table composed of multiple first compensation values ​​corresponding to the two characteristic information, and each two different characteristic information can construct a corresponding two-dimensional table, such as a line width / spacing table, a line width / length table, a length / edge spacing table, etc.

[0049] For example, the two-dimensional table of etching deviation rules corresponding to line width / spacing can be shown as follows: Table 1: Two-dimensional table of etching deviation rules corresponding to line width / spacing

[0050] In this two-dimensional table, each row is the first compensation value corresponding to a certain line width range, and each column is the first compensation value corresponding to a certain spacing range. Taking the BD edge as an example, the line width W of the BD edge is 700 nm, and the spacing S of the BD edge is 350 nm. The etching deviation compensation value of the BD edge corresponding to W / S is -2 nm.

[0051] The two-dimensional table of etching deviation rules corresponding to line width / length can be shown in the following table: Table 2: Two-dimensional table of etching deviation rules corresponding to line width / length

[0052] In this two-dimensional table, each row is the first compensation value corresponding to a certain line width range, and each column is the first compensation value corresponding to a certain side length range. Taking the BD side as an example, the line width W of the BD side is 700 nm, and the length L of the BD side is 400 nm. Then the etching deviation compensation value of the BD side corresponding to W / L, that is, the second compensation value, is -1 nm.

[0053] The two-dimensional table of etching deviation rules corresponding to length / edge spacing can be shown as follows: Table 3: Two-dimensional table of etching deviation rules corresponding to length / edge spacing

[0054] In this two-dimensional table, each row is the first compensation value corresponding to a certain length range, and each column is the first compensation value corresponding to a certain edge-to-edge spacing range. Taking the BD edge as an example, the length L of the BD is 400 nm, and the edge-to-edge spacing L_adj of the BD edge is 500 nm. The etching deviation compensation value of the BD edge corresponding to L / L_adj, that is, the second compensation value, is -1 nm.

[0055] 207. Calculate a target compensation value according to the multiple second compensation values ​​and the influence factors of the multiple feature information on the target compensation value.

[0056] For the target position BD edge in the above layout ABCD, the second compensation values ​​output in the above line width / spacing table, line width / length table, and length / edge spacing table are -2nm, -1nm, and -1nm respectively. Then, the target compensation value can be calculated according to the following fitting function:

[0057] Among them, Bias A is the target compensation value of the target position A, ∑ is the summation symbol, N takes the value of 1 or i. When N=1, it means that the target compensation value of the target position A is the sum of multiple second compensation values. When N=i, it means that the target compensation value of the target position A is the average value of multiple second compensation values. Fi (x i ,y i ) is the influence factor of multiple feature information on the target compensation value, T i (x i ,y i ) is a second compensation value corresponding to multiple feature information.

[0058] 208. Determine a target direction and a moving distance according to the target compensation value, and move the target position in the chip layout according to the target direction and the moving distance.

[0059] Since the same graphic has different second compensation values ​​under the influence of different feature information, the target compensation value that needs to be calculated can be calculated by constructing a fitting function, which can combine the above-mentioned multiple second compensation values ​​and multiple feature information to comprehensively calculate the influencing factors of the target compensation value. Among them, the above-mentioned influencing factors represent the degree of influence of different feature information on the target compensation value of the actual etching deviation under actual complex conditions. Finally, the target position to be compensated in the chip layout can be compensated based on the above-mentioned target compensation value.

[0060] As described above, the etching compensation method of the layout proposed in the embodiment of the present application can obtain the chip layout after etching, obtain multiple feature information and feature parameters associated with the target position to be compensated in the chip layout, select two feature information from the multiple feature information in turn, obtain multiple first measurement values ​​of the two feature information in different test chip layouts, and multiple second measurement values ​​after etching the test chip, calculate multiple deviation values ​​according to the first measurement values ​​and the second measurement values, and use the multiple deviation values ​​as multiple first compensation values ​​corresponding to the two feature information, establish a two-dimensional table according to the multiple first compensation values ​​corresponding to the two feature information to obtain multiple two-dimensional tables, in each two-dimensional table, determine the first interval corresponding to the first feature parameter and the second interval corresponding to the second feature parameter, determine the second compensation value corresponding to the two-dimensional table according to the first interval and the second interval, calculate the target compensation value according to the multiple second compensation values ​​and the multiple feature information on the target compensation value The influence factor, determine the target direction and moving distance according to the target compensation value, and move the target position in the chip layout according to the target direction and moving distance. The embodiment of the present application obtains the compensation value corresponding to every two feature information from multiple feature information, and then calculates the target compensation value based on the influence factor of multiple feature information on the target compensation value, thereby solving the problem in the prior art that a single two-dimensional etching deviation rule table cannot adapt to the influence of multiple factors, and improving the accuracy of etching deviation compensation.

[0061] In order to implement the above method, an embodiment of the present application further provides an etching compensation device for a layout, and the etching compensation device for a layout can be specifically integrated into a terminal device such as a mobile phone, a tablet computer, and the like.

[0062] For example, Figure 4 FIG. 1 is a schematic diagram of a structure of an etching compensation device for a layout provided in an embodiment of the present application. The etching compensation device for the layout may include: An acquisition module 301 is used to acquire a chip layout after etching, and acquire a plurality of feature information and feature parameters associated with a target position to be compensated in the chip layout; An establishing module 302 is used to select two pieces of feature information from the plurality of feature information in sequence, and establish a two-dimensional table between the two pieces of feature information and a first compensation value, so as to obtain a plurality of two-dimensional tables; A determination module 303, configured to determine, in sequence from the plurality of two-dimensional tables, a second compensation value corresponding to each two-dimensional table according to the characteristic parameter; The calculation module 304 is used to calculate the target compensation value according to the multiple second compensation values ​​and the influence factors of the multiple feature information on the target compensation value, and compensate the target position according to the target compensation value.

[0063] As can be seen from the above, the etching compensation device of the layout proposed in the embodiment of the present application can obtain the chip layout after etching, obtain multiple feature information and feature parameters associated with the target position to be compensated in the chip layout, select two feature information from the multiple feature information in turn, establish a two-dimensional table between the two feature information and the first compensation value to obtain multiple two-dimensional tables, determine the second compensation value corresponding to each two-dimensional table in turn from the multiple two-dimensional tables according to the feature parameters, calculate the target compensation value according to the multiple second compensation values ​​and the multiple feature information on the target compensation value, and compensate the target position according to the target compensation value. The embodiment of the present application obtains the compensation value corresponding to each two feature information from multiple feature information, and then calculates the target compensation value in combination with the multiple feature information on the target compensation value. The problem that a single two-dimensional etching deviation rule table in the prior art cannot adapt to the influence of multiple factors is solved, and the accuracy of etching deviation compensation is improved.

[0064] All of the above technical solutions can be arbitrarily combined to form optional embodiments of the present application, which will not be described in detail here.

[0065] A person of ordinary skill in the art will appreciate that all or part of the steps in the various methods of the above embodiments may be completed by instructions, or by controlling related hardware through instructions. The instructions may be stored in a computer-readable storage medium and loaded and executed by a processor.

[0066] To this end, an embodiment of the present application provides a computer-readable storage medium, in which a plurality of computer programs are stored, and the computer program can be loaded by a processor to execute the steps in any one of the etching compensation methods for a layout provided in the embodiment of the present application. For example, the computer program can execute the following steps: Acquire the chip layout after etching, and acquire multiple feature information and feature parameters associated with the target position to be compensated in the chip layout; Selecting two pieces of feature information from the plurality of feature information in sequence, and establishing a two-dimensional table between the two pieces of feature information and the first compensation value, so as to obtain a plurality of two-dimensional tables; Determine in sequence from the plurality of two-dimensional tables a second compensation value corresponding to each two-dimensional table according to the characteristic parameter; A target compensation value is calculated according to the multiple second compensation values ​​and the multiple characteristic information's influence factors on the target compensation value, and the target position is compensated according to the target compensation value.

[0067] The specific implementation of the above operations can be found in the previous embodiments, which will not be described in detail here.

[0068] The storage medium may include: a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0069] Since the computer program stored in the storage medium can execute the steps in the etching compensation method for any layout provided in the embodiments of the present application, the beneficial effects that can be achieved by the etching compensation method for any layout provided in the embodiments of the present application can be achieved. Please refer to the previous embodiments for details and will not be repeated here.

[0070] An embodiment of the present application also provides an electronic device, including a memory and a processor, wherein the memory is used to store a computer program, and the processor is used to call and run the computer program from the memory, so that the device equipped with the chip executes the methods in various possible implementation modes as described above.

[0071] For example, the computer device mentioned above may be a terminal device with corresponding functions such as a mobile phone, a tablet computer, a personal computer, a cloud computer, etc. Figure 5 , Figure 5 A schematic diagram of the structure of a computer provided in an embodiment of the present application.

[0072] The computer device 400 may include components such as a memory 401 and a processor 402. Those skilled in the art will appreciate that Figure 5The computer device structure shown in the figure does not constitute a limitation on the computer device, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0073] The memory 401 may be used to store applications and data. The applications stored in the memory 401 include executable codes. The applications may be composed of various functional modules. The processor 402 executes various functional applications and data processing by running the applications stored in the memory 401.

[0074] Processor 402 is the control center of the computer device. It uses various interfaces and lines to connect the various parts of the entire computer device. By running or executing applications stored in memory 401 and calling data stored in memory 401, it executes various functions of the computer device and processes data, thereby monitoring the computer device as a whole.

[0075] In this embodiment, the processor 402 in the computer device will load the executable code corresponding to the process of one or more application programs into the memory 401 according to the following instructions, and the processor 402 will run the application program stored in the memory 401 to execute: Acquire the chip layout after etching, and acquire multiple feature information and feature parameters associated with the target position to be compensated in the chip layout; Selecting two pieces of feature information from the plurality of feature information in sequence, and establishing a two-dimensional table between the two pieces of feature information and the first compensation value, so as to obtain a plurality of two-dimensional tables; Determine in sequence from the plurality of two-dimensional tables a second compensation value corresponding to each two-dimensional table according to the characteristic parameter; A target compensation value is calculated according to the multiple second compensation values ​​and the multiple characteristic information's influence factors on the target compensation value, and the target position is compensated according to the target compensation value.

[0076] It is understood that the above scenarios are only examples and do not constitute a limitation on the application scenarios of the technical solutions provided in the embodiments of the present application. The technical solutions of the present application can also be applied to other scenarios. For example, it is known to those skilled in the art that with the evolution of the system architecture and the emergence of new business scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0077] The steps in the method of the embodiment of the present application can be adjusted in order, combined and deleted according to actual needs. The modules in the device of the embodiment of the present application can be combined, divided and deleted according to actual needs.

[0078] In the present application, the same or similar terminology concepts, technical solutions and / or application scenario descriptions are generally described in detail only the first time they appear. When they appear again later, they are generally not repeated for the sake of brevity. When understanding the technical solutions and other contents of the present application, for the same or similar terminology concepts, technical solutions and / or application scenario descriptions that are not described in detail later, reference can be made to the previous related detailed descriptions.

[0079] In the present application, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0080] The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0081] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on the computer, the process or function according to the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) mode. The computer-readable storage medium can be any available medium that can be accessed by the computer or a data storage device such as a server or data center that includes one or more available media integrated. The available medium can be a magnetic medium (e.g., a floppy disk, a storage disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state storage disk Solid State Disk), etc.

[0082] The above is a detailed introduction to the etching compensation method, device, electronic device and storage medium of a layout provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A method for compensating for etching of a layout, characterized in that: include: Acquire the chip layout after etching, and acquire a plurality of characteristic information and characteristic parameters associated with the target position to be compensated in the chip layout; Selecting two pieces of feature information from the plurality of feature information in sequence, and establishing a two-dimensional table between the two pieces of feature information and the first compensation value, so as to obtain a plurality of two-dimensional tables; Determine in sequence from the plurality of two-dimensional tables a second compensation value corresponding to each two-dimensional table according to the characteristic parameter; A target compensation value is calculated according to the multiple second compensation values ​​and the multiple characteristic information's influence factors on the target compensation value, and the target position is compensated according to the target compensation value.

2. The etching compensation method of the layout as claimed in claim 1, characterized in that: The plurality of feature information includes at least one of a spacing, a line width, a length, an adjacent edge spacing, an adjacent edge line width, and an adjacent edge length of a current edge.

3. The etching compensation method of a layout as claimed in claim 1, characterized in that: Establishing a two-dimensional table between the two feature information and the first compensation value includes: Acquire a plurality of first measurement values ​​of the two characteristic information in different test chip layouts, and a plurality of second measurement values ​​after etching the test chip; Calculate a plurality of deviation values ​​according to the first measurement value and the second measurement value, and use the plurality of deviation values ​​as a plurality of first compensation values ​​corresponding to the two feature information; A two-dimensional table is established according to a plurality of first compensation values ​​corresponding to the two characteristic information.

4. The etching compensation method of a layout as claimed in claim 1, characterized in that: Determining in sequence from the plurality of two-dimensional tables a second compensation value corresponding to each two-dimensional table according to the characteristic parameter includes: In each of the two-dimensional tables, determining a first interval corresponding to the first characteristic parameter and a second interval corresponding to the second characteristic parameter; A second compensation value corresponding to the two-dimensional table is determined according to the first interval and the second interval.

5. The etching compensation method of a layout as claimed in claim 1, characterized in that: The number of the two-dimensional tables is greater than or equal to the number of the feature information.

6. The etching compensation method of a layout as claimed in claim 1, characterized in that: The target compensation value is calculated according to the following fitting function: Among them, Bias A is the target compensation value of the target position A, ∑ is the summation symbol, N takes the value of 1 or i. When N=1, it means that the target compensation value of the target position A is the sum of multiple second compensation values. When N=i, it means that the target compensation value of the target position A is the average value of multiple second compensation values. F i (x i ,y i ) is the influence factor of multiple feature information on the target compensation value, T i (x i ,y i ) is a second compensation value corresponding to multiple feature information.

7. The etching compensation method of a layout as claimed in claim 1, characterized in that: Compensating the target position according to the target compensation value includes: Determine the target direction and moving distance according to the target compensation value; The target position in the chip layout is moved according to the target direction and the moving distance.

8. An etching compensation device for a layout, characterized in that: include: An acquisition module, used for acquiring a chip layout after etching, and acquiring a plurality of feature information and feature parameters associated with a target position to be compensated in the chip layout; An establishing module, used for selecting two pieces of characteristic information from the plurality of characteristic information in sequence, establishing a two-dimensional table between the two pieces of characteristic information and a first compensation value, so as to obtain a plurality of two-dimensional tables; A determination module, configured to determine, in turn from the plurality of two-dimensional tables, a second compensation value corresponding to each two-dimensional table according to the characteristic parameter; The calculation module is used to calculate the target compensation value according to the influence factors of the multiple second compensation values ​​and the multiple characteristic information on the target compensation value, and compensate the target position according to the target compensation value.

9. An electronic device, characterized in that: The electronic device includes a memory and a processor, wherein a computer program is stored in the memory, and the processor executes the steps in the etching compensation method of the layout as described in any one of claims 1 to 7 by calling the computer program stored in the memory.

10. A storage medium, characterized in that: The storage medium stores a computer program, and the computer program is suitable for being loaded by a processor to execute the steps in the etching compensation method for a layout as described in any one of claims 1 to 7.

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