Wafer picker

Abstract

The present invention discloses a wafer picker, which relates to the field of wafer processing technology and solves the problems that the existing wafer picker can usually only pick up one wafer at a time, has low wafer picking efficiency, and is difficult to self-correct before picking up, resulting in inaccurate wafer picking. The wafer picker includes a mounting plate, a support frame is fixed on one side of the mounting plate, a rotating drum is rotatably connected to the front inner wall of the support frame, a fixed drum is fixed on the rear inner wall of the support frame, the rotating drum is rotatably connected to the outer side of the fixed drum, a limiting sleeve is fixed on the side wall of the rotating drum, a movable sleeve is slidably connected in the limiting sleeve, and an automatic material picking mechanism is fixed to the outer end of the movable sleeve; in the present invention, the rotating drum and four limiting sleeves can rotate as a whole, which is convenient for using four automatic material picking mechanisms in turn to pick up materials, and is convenient for taking four wafers at a time, so as to improve wafer picking efficiency. Before picking up the wafer, a clamping block can be used to clamp and correct the wafer to ensure accurate wafer suction.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, in particular to a wafer fetcher. Background Art

[0002] A wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a silicon wafer. The raw material of the wafer is silicon. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon. The wafer manufacturer then melts this polysilicon, plants seed crystals in the melt, and slowly pulls them out to form cylindrical single-crystal silicon ingots. The silicon ingots then go through processes such as segmentation, tumbling, and slicing. After packaging, they become the basic raw material for making integrated circuits - silicon wafers. During the wafer processing process, a wafer remover is generally required to complete the wafer picking and transportation operations.

[0003] After massive searches, it was found that the typical wafer picker in the prior art is as disclosed in publication number CN116598227A, a wafer picking device, which includes a Z-axis moving platform, a picking shovel, a coaxial laser sensor, a vacuum suction cup, a Y-axis moving platform and a PLC system; the picking shovel is installed on the Z-axis moving platform; the coaxial laser sensor is installed at the end of the picking shovel; the Y-axis moving platform is used to drive the Z-axis moving platform to move along the Y-axis direction; the vacuum suction cup is installed at the end of the picking shovel and is located on the side of the Y-axis direction of the coaxial laser sensor; the PLC system is communicatively connected with the Z-axis moving platform, the Y-axis moving platform, the coaxial laser sensor and the vacuum suction cup, the PLC system receives and stores the data of the Y-axis position and Z-axis height of each wafer determined by the coaxial laser sensor, and the PLC system determines the picking position of each wafer based on the Y-axis position, Z-axis height and the position of the vacuum suction cup on the picking shovel, and the picking position is used to pick up the corresponding wafer from the wafer box in the cleaning liquid.

[0004] After extensive searching, it was found that a typical wafer loader in the prior art is disclosed in publication number CN114242642A, which is a dust-free wafer loader device comprising a base, on which a robotic arm is provided. The robotic arm can move up and down and horizontally. The robotic arm is provided with a plurality of grippers and a drive mechanism. The drive mechanism can drive the grippers to move to clamp the wafer. The robotic arm is also provided with an air blowing device for blowing up the wafers in the wafer box. After the wafer is blown with air by the air blowing device, the edge of the wafer is lifted by the grippers, which can reduce contact with the front of the wafer, thereby reducing contamination and scratches.

[0005] After a massive search, it was found that the typical wafer picker in the prior art is such as the authorization number CN112420578B, a pick-and-place device for automatic wafer unloading, including a frame, a double-speed chain conveyor line, a carrier positioning mechanism, a pick-and-place robot arm, a cover plate placement table and a wafer placement table are provided on the frame, the double-speed chain conveyor line is provided with a blocking cylinder, the pick-and-place robot arm and the cover plate placement table are both located on one side of the double-speed chain conveyor line, and the shaft end of the pick-and-place robot arm is provided with a pick-and-place mechanism, and the wafer placement table is located at one end of the double-speed chain conveyor line; the pick-and-place mechanism includes a mounting frame installed on the working axis of the pick-and-place robot arm, a Bernoulli suction cup driven by a wafer-taking cylinder is installed on the mounting frame, a nozzle mounting plate is also installed at the bottom of the mounting frame, and a number of cover plate suction nozzles are installed at the bottom of the nozzle mounting plate. Compared with the traditional manual wafer unloading method, the present invention not only greatly improves the wafer unloading efficiency, but also effectively avoids the occurrence of accidental scratches on the wafer during the wafer unloading process, ensuring that the quality and qualified rate of the wafer are not affected during the wafer unloading process.

[0006] After extensive searching, it was found that a typical wafer picker in the prior art is authorized by CN106783706B, which is a control system and method for wafer picking. The control system includes: a wafer picking device, including a fixing member, a wafer unloading robot mounted on the fixing member, a rotating connecting rod and a lifting slider connected to the wafer unloading robot; a detection device for detecting whether the wafer unloading robot has reached a preset reference position; a first drive device that drives the rotating connecting rod to rotate and drive the wafer unloading robot to rotate; a second drive device that drives the lifting slider to slide and drive the wafer unloading robot to rise and fall; a control device electrically connected to the detection device, the first drive device, and the second drive device; when the wafer unloading robot reaches the preset reference position, it sends a control signal to the first drive device and the second drive device respectively, driving the wafer unloading robot to reach multiple preset workstations in sequence for wafer picking. Through this control system, the downward pulling force of the water film on the wafer is reduced during the wafer picking process, and the wafer will not be broken during the picking process, thereby improving the success rate of finished wafer picking.

[0007] To sum up, the existing wafer picker can usually only pick up one wafer at a time. When processing the wafer, the wafer needs to be picked up back and forth many times, resulting in low wafer picking efficiency. This will reduce the processing efficiency of the wafer, thereby reducing the practicality of the wafer picker. It is difficult to self-straighten the wafer before picking up the wafer, resulting in inaccurate wafer picking operation. In response to the above problems, the existing equipment needs to be improved. Summary of the Invention

[0008] The purpose of the present invention is to provide a wafer picker to solve the problem raised in the above background technology that the existing wafer picker can usually only pick up one wafer at a time, and the wafer needs to be picked up back and forth many times when processing the wafer, resulting in low wafer picking efficiency. This will reduce the processing efficiency of the wafer, thereby reducing the practicality of the wafer picker. It is difficult to self-straighten the wafer before picking up the wafer, resulting in the problem of inaccurate wafer picking operation.

[0009] In order to achieve the above-mentioned object of the invention, the present invention adopts the following technical solutions:

[0010] A wafer picker provided by the present invention comprises a mounting plate, a support frame is fixed to one side of the mounting plate, a rotating drum is rotatably connected to the front inner wall of the support frame, a fixed drum is fixed to the rear inner wall of the support frame, the rotating drum is rotatably connected to the outer side of the fixed drum, a limiting sleeve is fixed to the side wall of the rotating drum, a movable sleeve is slidably connected to the inner side of the limiting sleeve, and an automatic material picking mechanism is fixed to the outer end of the movable sleeve;

[0011] Wherein, the automatic material taking mechanism includes:

[0012] A support plate, wherein the outer end surface of the support plate is slidably connected to a slider, and the outer side of the support plate is connected to the movable plate via an electric telescopic column, and the outer end surface of the movable plate is fixed with an electric suction cup;

[0013] The second oil groove is provided inside the slider, and a second piston is slidably connected in the second oil groove, and a clamping block is fixed on the outer end of the second piston.

[0014] As a preferred solution of the present invention, a first motor is fixed to the front side of the support frame, and the output end of the first motor is connected to the rotating drum.

[0015] By adopting the above technical solution, the drum can rotate, making it convenient to use the four automatic material taking mechanisms in turn.

[0016] As a preferred solution of the present invention, an annular groove is provided on the outer side of the fixing cylinder, and a second motor is fixed in the fixing cylinder. The bottom of the second motor is connected to the rotating shaft, and the rotating shaft is located in the annular groove.

[0017] By adopting the above technical solution, the rotating shaft can rotate under the action of the second motor, thereby conveniently driving other components to rotate.

[0018] As a preferred solution of the present invention, arc-shaped grooves are symmetrically provided on the two inner walls of the annular groove, and the arc-shaped grooves are arranged horizontally with the rotating shaft.

[0019] By adopting the above technical solution, the arc-shaped groove reserves a certain space for the rotation of the component.

[0020] As a preferred solution of the present invention, four limiting sleeves are provided, and the four limiting sleeves are evenly distributed circumferentially on the rotating drum. Each of the limiting sleeves is rotatably connected to a first screw rod, and a ferrule is fixed to the inner end of the first screw rod, and one of the ferrules on the first screw rod is engaged and connected to the outer side of the rotating shaft.

[0021] By adopting the above technical solution, after the ferrule is clamped to the outer side of the rotating shaft, it can rotate with the rotation of the rotating shaft, thereby driving the corresponding first screw to rotate.

[0022] As a preferred solution of the present invention, the outer side of the first screw rod is threadedly connected to a movable sleeve, and the movable sleeve and the limiting sleeve form a telescopic structure.

[0023] By adopting the above technical solution, the rotation of the first screw rod can drive the movable sleeve to move upward and downward.

[0024] As a preferred solution of the present invention, a third motor is fixed on the support plate, and the output end of the third motor is connected to the gear disc. A groove is opened in the support plate, and the gear disc is rotatably connected in the groove. The outer end surface of the gear disc is meshed with a circular gear.

[0025] By adopting the above technical solution, the rotation of the toothed disc can drive all the circular gears to rotate.

[0026] As a preferred solution of the present invention, a second screw is fixed to the outer end face of the circular gear, a sliding groove is provided on the outer end face of the support plate, the second screw is rotatably connected in the sliding groove, and a slider is threadedly connected to the outer side of the second screw.

[0027] By adopting the above technical solution, the rotation of the second screw rod can drive the sliders to slide, and all the sliders move closer to or away from each other.

[0028] As a preferred solution of the present invention, a first piston is fixed on the inner end surface of the movable plate, a first oil groove is opened in the support plate, the first piston is slidably connected in the first oil groove, and the first oil groove is connected to the second oil groove through a connecting hose, a heavy ball is fixed on the connecting hose, and the heavy ball is movably connected in the slide groove.

[0029] By adopting the above technical solution, the heavy ball plays a role of pulling and straightening the connecting hose.

[0030] As a preferred solution of the present invention, the sliders are evenly distributed on the support plate in the circumferential direction, and a pressure sensor is fixed to the inner end surface of the clamping block.

[0031] By adopting the above technical solution, when the wafer is clamped and straightened by the clamping blocks, if the pressure sensors on all the clamping blocks detect pressure, it means that the straightening is completed.

[0032] Compared with the existing technology, one or more of the above technical solutions have the following beneficial effects:

[0033] 1. The wafer picker can achieve high wafer picking efficiency through the coordinated use of the rotating drum, limiting sleeve, picking mechanism and clamping block. The rotating drum and the four limiting sleeves can rotate as a whole, which is convenient for taking the materials by the four automatic picking mechanisms in turn, and convenient for taking four wafers at a time, so as to improve the wafer picking efficiency. Before taking the wafer, the clamping block can be used to clamp and straighten the wafer to ensure accurate wafer pickup.

[0034] 2. The wafer picker can achieve the purpose of clamping and straightening through the mutual use of the set rotating shaft, first screw rod, ferrule, movable sleeve, material picking mechanism, support plate, gear plate, circular gear, second screw rod, slider, clamp block and pressure sensor. When the wafer is transported under the automatic material picking mechanism by the conveyor belt, after the wafer reaches the bottom of the automatic material picking mechanism, the rotating shaft rotates to drive the corresponding ferrule to rotate, the corresponding first screw rod rotates, the corresponding movable sleeve and support plate move downward, and then the gear plate rotates to drive all the circular gears to rotate, all the second screw rods rotate, and all the sliders approach each other. The wafer can be clamped and straightened when used in combination with the clamp blocks. When the pressure sensors on all the clamp blocks detect pressure, it means that the straightening is completed, and the second screw rod reverses to facilitate the automatic removal of the clamp blocks.

[0035] 3. The wafer picker can achieve the purpose of removing the clamp while taking the material through the mutual cooperation of the movable plate, electric suction cup, first piston, first oil tank, second piston and clamp block. In the process of the movable plate and electric suction cup moving downward to absorb the wafer, the first piston moves downward, hydraulic oil is stored in the first oil tank, and the second piston moves upward to facilitate the vertical removal of the clamp block.

[0036] 4. The wafer remover can achieve the purpose of self-locking through the mutual use of the rotating drum, annular groove, rotating shaft, arc groove, limit sleeve and ferrule. When the four limit sleeves rotate together with the rotating drum, the four ferrules slide in the annular groove. The annular groove has the effect of limiting and locking the ferrule, and the ferrule cannot rotate. When the ferrule is stuck to the outside of the rotating shaft, the ferrule can rotate with the rotating shaft. The arc groove reserves rotation space for the ferrule, and the other three ferrules are still locked. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0038] Furthermore, the terms "installed," "disposed," "provided with," "connected," "connected," and "socketed" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0039] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0040] Figure 2 It is a schematic diagram of the front cross-sectional structure of the present invention;

[0041] Figure 3 It is a left side cross-sectional structural schematic diagram of the present invention;

[0042] Figure 4 It is a structural schematic diagram of the automatic material taking mechanism of the present invention;

[0043] Figure 5 It is a schematic diagram of the connection structure of the fixed cylinder, annular groove, rotating shaft and arc groove of the present invention;

[0044] Figure 6 The present invention Figure 1 A in the middle is an enlarged structural diagram;

[0045] Figure 7 The present invention Figure 2 The enlarged structural diagram at B in the middle;

[0046] Figure 8 The present invention Figure 3 Enlarged structural diagram at point C in the middle.

[0047] In the figure: 1. Mounting plate; 2. Support frame; 3. First motor; 4. Rotating drum; 5. Fixed drum; 6. Annular groove; 7. Second motor; 8. Rotating shaft; 9. Arc groove; 10. Limit sleeve; 11. First screw rod; 12. Card sleeve; 13. Movable sleeve; 14. Automatic material picking mechanism; 1401. Support plate; 1402. Third motor; 1403. Toothed disc; 1404. Groove; 1405. Circular gear; 1406. Second screw rod; 1407. Slide; 1408. Slider; 1409. Electric telescopic column; 1410. Moving plate; 1411. Electric suction cup; 1412. First piston; 1413. First oil tank; 1414. Connecting hose; 1415. Heavy ball; 1416. Second oil tank; 1417. Second piston; 1418. Clamp; 1419. Pressure sensor. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0049] See also Figures 1-8 A wafer picker includes a mounting plate 1, a support frame 2 is fixed to one side of the mounting plate 1, a rotating drum 4 is rotatably connected to the front inner wall of the support frame 2, a fixed drum 5 is fixed to the rear inner wall of the support frame 2, the rotating drum 4 is rotatably connected to the outer side of the fixed drum 5, a limiting sleeve 10 is fixed to the side wall of the rotating drum 4, a movable sleeve 13 is slidably connected inside the limiting sleeve 10, and an automatic material picking mechanism 14 is fixed to the outer end of the movable sleeve 13;

[0050] Among them, the automatic material picking mechanism 14 includes a support plate 1401, the outer end surface of the support plate 1401 is slidably connected to a slider 1408, and the outer side of the support plate 1401 is connected to the movable plate 1410 through an electric telescopic column 1409, and the outer end surface of the movable plate 1410 is fixed with an electric suction cup 1411; a second oil groove 1416, the second oil groove 1416 is opened inside the slider 1408, and a second piston 1417 is slidably connected in the second oil groove 1416, and a clamping block 1418 is fixed to the outer end of the second piston 1417.

[0051] The above working principle: first, use external bolts to install the mounting plate 1 on the transfer equipment, and a conveyor belt is set under the automatic material picking mechanism 14 to convey the wafer. When the wafer reaches the bottom of the rotating drum 4 and below the electric suction cup 1411 on the automatic material picking mechanism 14, the rotating shaft 8 rotates to drive the corresponding ferrule 12 to rotate, and the corresponding first screw rod 11 rotates, thereby driving the corresponding movable sleeve 13 and the support plate 1401 to move downward, and then the gear plate 1403 rotates, all the circular gears 1405 and the second screw rod 1406 rotate, all the sliders 1408 approach each other, and all the clamping blocks 1418 approach each other to clamp and straighten the wafer. After the wafer is straightened , the second screw rod 1406 is reversed to horizontally withdraw the slider 1408 and the clamp 1418, and then the movable plate 1410 and the electric suction cup 1411 move downward. The electric suction cup 1411 will suck the wafer after contacting it, and when the movable plate 1410 moves downward, the first piston 1412 moves downward and the second piston 1417 moves upward to vertically withdraw the clamp 1418. The rotating drum 4 and the four limiting sleeves 10 can rotate as a whole, which is convenient for the use of the four automatic material taking mechanisms 14 in turn. The four ferrules 12 slide in the annular groove 6. When one of the ferrules 12 is stuck on the outside of the rotating shaft 8, the other three ferrules 12 are limited by the annular groove 6 and cannot rotate.

[0052] Specific reference Figure 1 and Figure 3 A first motor 3 is fixed to the front side of the support frame 2, and the output end of the first motor 3 is connected to the rotating drum 4. The rotating drum 4 can rotate under the action of the first motor 3, thereby driving the four limiting sleeves 10 to rotate. An automatic material picking mechanism 14 is fixed on each limiting sleeve 10, and the automatic material picking mechanism 14 can rotate together with the limiting sleeve 10, so that the four automatic material picking mechanisms 14 can take turns to pick up materials in an orderly manner.

[0053] In the wafer fetcher of the present invention, the rotating drum 4, four limiting sleeves 10 and four automatic material fetching mechanisms 14 can rotate as a whole, and the device can fetch four wafers at a time.

[0054] Specific reference Figure 2 、 Figure 3 、 Figure 5 、 Figure 7 and Figure 8 An annular groove 6 is provided on the outside of the fixed cylinder 5, and a second motor 7 is fixed inside the fixed cylinder 5. The bottom of the second motor 7 is connected to the rotating shaft 8, and the rotating shaft 8 is located in the annular groove 6. The rotating shaft 8 can rotate under the action of the second motor 7.

[0055] In the wafer picker of the present invention, the second motor 7 can drive the rotating shaft 8 to rotate.

[0056] Specific reference Figure 2 、 Figure 3 、 Figure 5 、 Figure 7 and Figure 8 Arc grooves 9 are symmetrically provided on the two inner walls of the annular groove 6 , and the arc grooves 9 are arranged horizontally with the rotating shaft 8 .

[0057] In the wafer remover of the present invention, the arcuate groove 9 reserves a rotation space for the components located in the annular groove 6 .

[0058] Specific reference Figure 1 、 Figure 2 、 Figure 3 、 Figure 7 and Figure 8 There are four limiting sleeves 10, and the four limiting sleeves 10 are evenly distributed on the rotating drum 4 in the circumferential direction. Each limiting sleeve 10 is rotatably connected to the first screw rod 11, and a clamping sleeve 12 is fixed to the inner end of the first screw rod 11. The clamping sleeve 12 on one of the first screw rods 11 is engaged and connected to the outer side of the rotating shaft 8. When the clamping sleeve 12 is engaged and connected to the rotating shaft 8, the clamping sleeve 12 can rotate with the rotation of the rotating shaft 8, thereby driving the corresponding first screw rod 11 to rotate.

[0059] In a wafer remover of the present invention, when the rotating drum 4 rotates relative to the fixed drum 5, four ferrules 12 slide in the arc groove 9, and the arc groove 9 plays a role of limiting and locking the ferrules 12, and the ferrules 12 cannot rotate. When the ferrules 12 reach the bottom of the arc groove 9, the ferrules 12 are stuck on the outside of the rotating shaft 8. After that, the rotation of the rotating shaft 8 can drive the ferrules 12 and the corresponding first screw rod 11 to rotate, and the arc groove 9 reserves rotation space for the ferrules 12.

[0060] Specific reference Figure 2 、 Figure 3 、 Figure 7 and Figure 8 The outer side of the first screw rod 11 is threadedly connected to a movable sleeve 13, and the movable sleeve 13 and the limiting sleeve 10 form a telescopic structure. When the first screw rod 11 rotates, the movable sleeve 13 can move downward and then upward under the limiting action of the first screw rod 11 and the limiting sleeve 10, thereby facilitating the material removal operation.

[0061] In the wafer picker of the present invention, the rotation of the first screw rod 11 can drive the corresponding movable sleeve 13 and the automatic material picking mechanism 14 to move upward and downward, so as to facilitate smooth material picking.

[0062] Specific reference Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 6 A third motor 1402 is fixed on the support plate 1401, and the output end of the third motor 1402 is connected to the gear disc 1403. A groove 1404 is provided in the support plate 1401, and the gear disc 1403 is rotatably connected in the groove 1404. The outer end surface of the gear disc 1403 is meshed with a circular gear 1405. The gear disc 1403 can rotate under the action of the third motor 1402, thereby driving all the circular gears 1405 to rotate.

[0063] In this embodiment, a second screw rod 1406 is fixed to the outer end face of the circular gear 1405, and a slide groove 1407 is provided on the outer end face of the support plate 1401. The second screw rod 1406 is rotatably connected in the slide groove 1407, and the outer side of the second screw rod 1406 is threadedly connected to a slider 1408. The rotation of the circular gear 1405 drives the second screw rod 1406 to rotate. At this time, the slider 1408 can slide under the limiting action of the second screw rod 1406 and the slide groove 1407. All sliders 1408 approach or move away from each other, which is convenient for clamping and straightening the wafer or evacuating.

[0064] In this embodiment, a first piston 1412 is fixed to the inner end surface of the movable plate 1410, a first oil groove 1413 is opened in the support plate 1401, the first piston 1412 is slidably connected in the first oil groove 1413, and the first oil groove 1413 is connected to the second oil groove 1416 through a connecting hose 1414, a heavy ball 1415 is fixed on the connecting hose 1414, and the heavy ball 1415 is movably connected in the slide groove 1407, and the movable plate 1410 and the electric suction cup 1411 move downward under the extension of the electric telescopic column 1409 When the hydraulic oil is released, the first piston 1412 moves downward together with the movable plate 1410, and the first oil groove 1413 stores hydraulic oil. The second piston 1417 can slide upward under the action of the oil pressure, thereby driving the clamping block 1418 to move upward, making it convenient to remove the clamping block 1418 upward. The connecting hose 1414 connects the first oil groove 1413 and the second oil groove 1416, and the heavy ball 1415 pulls the connecting hose 1414, so that the connecting hose 1414 always remains in a straight state to prevent the connecting hose 1414 from folding.

[0065] At the same time, in this embodiment, the sliders 1408 are evenly distributed on the support plate 1401 in the circumferential direction, and the inner end face of the clamping block 1418 is fixed with a pressure sensor 1419. Each slider 1408 is correspondingly provided with a clamping block 1418. The clamping blocks 1418 evenly distributed in the circumferential direction can better clamp and straighten the wafer. In the process of straightening the wafer using the clamping blocks 1418, the pressure sensor 1419 can detect the pressure between the clamping blocks 1418 and the wafer. When the pressure sensors 1419 on all the clamping blocks 1418 detect pressure, it indicates that the straightening operation has been completed, and then the clamping blocks 1418 can be automatically withdrawn.

[0066] A wafer remover of the present invention, after the support plate 1401 is brought to a suitable height, the gear plate 1403 rotates to drive all the circular gears 1405 to rotate, all the second screw rods 1406 rotate, all the sliders 1408 slide and approach each other, all the clamping blocks 1418 approach each other, thereby clamping and straightening the wafer. When the pressure sensors 1419 on all the clamping blocks 1418 detect pressure, it means that the wafer has been clamped and straightened, the second screw rod 1406 automatically reverses, thereby horizontally withdrawing the clamping blocks 1418, and then the electric suction cup 1 411 moves downward along with the movable plate 1410 and contacts the wafer, while the first piston 1412 moves downward, the first oil tank 1413 stores hydraulic oil, the second piston 1417 moves upward, the clamping block 1418 moves upward and withdraws, and after the electric suction cup 1411 sucks the wafer, the drum 4 rotates, and then the next automatic material picking mechanism 14 can be used to continue picking up the material. Each automatic material picking mechanism 14 can suck up one wafer. After completing the picking operation of four wafers using this device, the wafer can be transferred to the next process for processing.

[0067] In summary, the wafer picker achieves the purpose of high wafer picking efficiency, clamping and straightening, removing the clamp while picking up the material, and self-locking, meeting people's usage needs.

[0068] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

[0069] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

[0070] The directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention, and do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the protection content of the present invention.

[0071] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer picker, comprising a mounting plate, characterized in that: A support frame is fixed to one side of the mounting plate, a rotating drum is rotatably connected to the front inner wall of the support frame, a fixed drum is fixed to the rear inner wall of the support frame, the rotating drum is rotatably connected to the outer side of the fixed drum, a limiting sleeve is fixed to the side wall of the rotating drum, a movable sleeve is slidably connected in the limiting sleeve, and an automatic material taking mechanism is fixed to the outer end of the movable sleeve; Wherein, the automatic material taking mechanism includes: A support plate, wherein the outer end surface of the support plate is slidably connected to a slider, and the outer side of the support plate is connected to the movable plate via an electric telescopic column, and the outer end surface of the movable plate is fixed with an electric suction cup; The cam is connected to the gear train of the said first and second gears and is connected with the gear of the said first gear through the guide rail and the control rail.

2. The wafer remover according to claim 1, characterized in that: A first motor is fixed on the front side of the support frame, and an output end of the first motor is connected to the rotating drum.

3. The wafer remover according to claim 1, characterized in that: An annular groove is provided on the outer side of the fixing cylinder, and a second motor is fixed in the fixing cylinder. The bottom of the second motor is connected to the rotating shaft, and the rotating shaft is located in the annular groove.

4. The wafer remover according to claim 3, characterized in that: Arc grooves are symmetrically provided on the two inner walls of the annular groove, and the arc grooves are arranged horizontally with the rotating shaft.

5. The wafer remover according to claim 1, characterized in that: There are four limiting sleeves, and the four limiting sleeves are evenly distributed on the rotating drum. Each limiting sleeve is rotatably connected to a first screw rod, and a clamping sleeve is fixed to the inner end of the first screw rod. One of the clamping sleeves on the first screw rod is engaged and connected to the outer side of the rotating shaft.

6. The wafer remover according to claim 5, characterized in that: The outer side of the first screw rod is threadedly connected to a movable sleeve, and the movable sleeve and the limiting sleeve form a telescopic structure.

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