Closed transfer equipment for semiconductor substrates

Abstract

The present invention discloses a closed transfer device for semiconductor carriers, and relates to the technical field of semiconductor transfer devices, wherein the closed transfer device for semiconductor carriers comprises: a first box body, a partition layer is provided inside the box body to divide the interior of the first box body into a first cavity and a second cavity on the left and right sides, a feeding position is provided in the first cavity, a discharge port is provided in the second cavity, a first barrier door is provided on the partition layer, and a second barrier door is provided in the first cavity; a transport mechanism, used for transporting the carrier, capable of entering the first cavity through the second barrier door, and located at the feeding position; a transfer mechanism, provided in the second cavity, capable of entering the first cavity through the first barrier door, taking out the carrier in the transport mechanism, and transferring it to the second cavity; and a transmission mechanism, used for receiving the carrier in the transfer mechanism, and transferring the carrier to a sealed transport line through the discharge port. The technical solution provided by the present invention can solve the problem of poor dust prevention effect during the transfer of semiconductor carriers.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor transfer equipment, and in particular to a closed transfer equipment for a semiconductor carrier. Background Art

[0002] Semiconductor substrate transfer equipment can transfer semiconductor substrates from the previous workstation to the next workstation; the existing semiconductor substrate transfer equipment is mostly open transfer during the transfer process, and the material is taken out from the incoming material equipment by a robotic arm, and then placed on the conveyor line, and transported to the laser processing site by the conveyor line. This method of transfer has the problem of poor dust prevention effect, and the use effect is not good for semiconductor substrates such as FC-BGA with high dust prevention requirements. For FC-BGA semiconductor substrates, dust and other particulate contaminants may cause product defects and affect the performance and reliability of the final product. Summary of the invention

[0003] The main purpose of the present invention is to provide a closed transfer device for semiconductor carriers, aiming to solve the problem of poor dust prevention effect during the transfer of semiconductor carriers.

[0004] To achieve the above-mentioned purpose, the closed transfer device for semiconductor carriers proposed by the present invention is arranged upstream of a sealed transport line, wherein the sealed transport line has a material receiving port, and the closed transfer device for semiconductor carriers comprises:

[0005] A first box body, wherein a partition layer is provided inside the first box body to separate the interior of the first box body into a first cavity and a second cavity on the left and right sides, a feeding position is provided in the first cavity, a discharge port is provided in the second cavity, a first blocking door is provided on the partition layer, and a second blocking door is provided in the first cavity;

[0006] A closed transport mechanism, used for transporting the carrier, can enter the first cavity through the second barrier door and be located at the feeding position. When the transport mechanism is located at the feeding position, the second barrier door is in a closed state;

[0007] a transfer mechanism, disposed in the second cavity, capable of entering the first cavity through the first barrier door, taking out the carrier in the transport mechanism, and transferring it to the second cavity; and

[0008] The transmission mechanism is arranged in the second cavity, and is used for receiving the carrier in the transfer mechanism and conveying the carrier to the sealed transport line through the discharge port.

[0009] In one embodiment, the transmission mechanism includes a first mounting frame, a conveying wheel mounted on the first mounting frame, and a first driving motor driving the conveying wheel to rotate. The first mounting frame has a first base, and the first base is fixed to the bottom of the second cavity.

[0010] In one embodiment, the transfer mechanism includes a multi-axis robotic arm and a material picking suction cup arranged on the multi-axis robotic arm, the multi-axis robotic arm has a second base, the second base is fixed to the bottom of the second cavity, the multi-axis robotic arm can drive the material picking suction cup to enter the first cavity through a first barrier door, and the material picking suction cup can adsorb the carrier.

[0011] In one embodiment, a universal wheel with a self-locking function is installed at the bottom of the first box, and the universal wheel allows a gap between the bottom of the first box and the ground. The bottom of the first cavity is open, and the first cavity is also provided with an inlet and outlet, and the inlet and outlet are located below the second barrier door;

[0012] The transport mechanism includes a second box, a box door provided on the second box, and an AGV trolley for driving the second box to move. A storage rack is provided in the second box, and multiple storage layers are provided on the storage rack. The storage layers are used for placing carriers. The AGV trolley can drive the second box to enter and exit the first cavity through the second barrier door.

[0013] In one embodiment, the first blocking door, the second blocking door, and the box door can reciprocate along the height direction of the first box body so that the first blocking door, the second blocking door, and the box door are opened or closed;

[0014] The closed transfer equipment for the semiconductor carrier also includes a door opening and closing mechanism, which can make the first blocking door, the second blocking door and the box door reciprocate along the height direction of the first box body.

[0015] In one embodiment, the opening and closing door mechanism includes a first opening and closing door assembly, a second opening and closing door assembly, and a third opening and closing door assembly. The first opening and closing door assembly is used to drive the first blocking door to move along the height direction of the first box body, the second opening and closing door assembly is used to drive the second blocking door to move along the height direction of the first box body, and the third opening and closing door assembly is used to drive the box door to move along the height direction of the first box body.

[0016] In one embodiment, the closed transfer device for the semiconductor carrier further comprises a clamping mechanism, wherein the clamping mechanism is disposed in the first cavity and is used to clamp the second box body so that the second box body can remain stable when the box door is opened.

[0017] In one embodiment, the AGV trolley has a receiving end, and the receiving end is provided with a plurality of avoidance gaps, and the plurality of avoidance gaps expose the bottom of the second box body;

[0018] The clamping mechanism includes two symmetrically arranged third bases, each of which is provided with a pneumatic pan-tilt platform, a limit plate, a rotating downward pressure cylinder and a pushing cylinder. The pneumatic pan-tilt platform is provided with a ball bearing, the limit plate and the rotating downward pressure cylinder are relatively arranged, and the pushing cylinder is arranged between the limit plate and the rotating downward pressure cylinder. The pneumatic pan-tilt platform can contact the bottom of the second box body through the avoidance gap and lift the second box body. The rotating downward pressure cylinder can make the second box body located on the pneumatic pan-tilt platform move toward the limit plate and make the second box body resist the limit plate. The pushing cylinders on the two third bases can approach each other and position and clamp the second box body.

[0019] In one embodiment, the storage layer is arranged horizontally;

[0020] The transfer mechanism takes out the carrier plate on the storage rack from bottom to top.

[0021] In one embodiment, the closed transfer equipment for the semiconductor carrier further includes an air intake mechanism, which includes an air intake pipe, an air intake fan, and a filter module. The air intake pipe is connected to the first cavity. The air intake fan is used to deliver external gas into the air intake pipe. The filter module is used to filter the gas entering the first cavity. The bottom of the first cavity is detachably connected to a plurality of partitions, and the partitions are used to shorten the distance between the bottom of the first cavity and the ground.

[0022] The technical solution of the present invention arranges the transfer mechanism and the transmission mechanism in the first box body, so that when the transfer mechanism takes out the carrier from the transportation mechanism and transfers it to the transmission mechanism, the carrier will not be exposed in the workshop, but will be in the second cavity inside the box body, that is, the transfer process is carried out inside the first box body. At this time, under the protection of the first box body, the influence of external dust on the carrier can be reduced, thereby improving the dustproof effect. At the same time, in conjunction with the closed transportation mechanism, the transportation mechanism can also protect the carrier before the carrier enters the first cavity during transportation, thereby further improving the dustproof effect, thereby solving the problem of poor dustproof effect during transportation of semiconductor carriers in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0024] Figure 1A schematic structural diagram of an embodiment of a closed transfer device for semiconductor carriers provided by the present invention;

[0025] Figure 2 for Figure 1 A schematic diagram of the structure of the transport mechanism, the transfer mechanism, the transmission mechanism, and the clamping mechanism in the closed transfer device for the semiconductor carrier;

[0026] Figure 3 for Figure 2 Schematic diagram of the structure of the transmission mechanism;

[0027] Figure 4 for Figure 2 Schematic diagram of the structure of the intermediate transfer mechanism;

[0028] Figure 5 for Figure 2 Schematic diagram of the structure of the Chinese blessing mechanism;

[0029] Figure 6 for Figure 1 A schematic diagram of the structure of the first box;

[0030] Figure 7 A schematic structural diagram of an embodiment of a door opening and closing mechanism in a closed transfer device for semiconductor carriers provided by the present invention;

[0031] Figure 8 A schematic structural diagram of an embodiment of the cooperation between the protrusion and the plug-in block in the closed transfer device for semiconductor carrier provided by the present invention;

[0032] Fig. 9 for Figure 2 Schematic diagram of the structure of the transport mechanism;

[0033] Fig.10 for Fig. 9 Schematic diagram of the internal structure of the second box;

[0034] Fig.11 for Fig.10 A partial enlarged view of the middle A;

[0035] Fig.12 for Fig. 9 Schematic diagram of the structure of the middle box door;

[0036] Fig.13 for Fig. 9 Schematic diagram of the internal structure of the second box body when the second box body and the box door are matched;

[0037] Fig.14 for Fig.13 A partial enlarged view of point B in the middle;

[0038] Fig.15 for Fig.13A partial enlarged view of point C in the middle;

[0039] Fig.16 A schematic structural diagram of an embodiment of an air intake mechanism in a closed transfer device for a semiconductor carrier provided by the present invention.

[0040] Description of Figure Numbers:

[0041] 100, first box; 110, partition layer; 120, first cavity; 121, inlet and outlet; 130, second cavity; 140, feeding position; 150, discharge port; 160, first blocking door; 170, second blocking door; 180, universal wheel;

[0042] 200, transport mechanism; 210, second box body; 211, third cavity; 212, opening; 213, first notch; 220, box door; 221, edging; 222, second notch; 223, main frame; 224, back plate; 225, plug-in block; 230, AGV trolley; 231, receiving end; 232, avoidance notch; 240, storage rack; 241, storage board; 242, storage slot; 250, guide assembly; 251, first guide member; 252, first inclined plane; 253, second guide member; 254, second inclined plane; 260, receiving member;

[0043] 300, transfer mechanism; 310, multi-axis mechanical arm; 311, slide rail; 312, slide table; 313, third drive motor; 314, first swing arm; 315, fourth drive motor; 316, fifth swing arm; 320, material picking suction cup; 321, material picking part; 330, second base;

[0044] 400, transmission mechanism; 410, first mounting frame; 420, conveying wheel; 430, first driving motor; 440, first base; 450, avoidance space;

[0045] 500, door opening and closing mechanism; 510, first door opening and closing assembly; 520, second door opening and closing assembly; 530, third door opening and closing assembly; 531, protrusion; 532, slot; 533, third notch; 534, magnetic attraction area;

[0046] 600, clamping mechanism; 610, third base; 620, pneumatic pan / tilt; 630, limit plate; 640, rotary downward pressure cylinder; 650, push cylinder; 660, ball bearing;

[0047] 700, air intake mechanism; 710, air intake pipe; 720, air intake fan; 730, filter module.

[0048] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0051] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0052] Semiconductor substrate transfer equipment can transfer semiconductor substrates from the previous workstation to the next workstation; the existing semiconductor substrate transfer equipment is mostly open transfer during the transfer process, and the material is taken out from the incoming material equipment by a robotic arm, and then placed on the conveyor line, and transported to the laser processing site by the conveyor line. This method of transfer has the problem of poor dust prevention effect, and the use effect is not good for semiconductor substrates such as FC-BGA with high dust prevention requirements. For FC-BGA semiconductor substrates, dust and other particulate contaminants may cause product defects and affect the performance and reliability of the final product.

[0053] The present invention provides a closed transfer device for semiconductor carriers, which is arranged upstream of a sealed transport line, wherein the sealed transport line has a material receiving port.

[0054] See Figure Reference Figure 1 , Figure 2 , Figure 6In one embodiment of the present invention, the closed transfer equipment of the semiconductor carrier includes: a first box 100, a closed transportation mechanism 200, a transfer mechanism 300, and a transmission mechanism 400.

[0055] The first box 100 is provided with a partition layer 110 to separate the interior of the first box 100 into a first cavity 120 and a second cavity 130. The first cavity 120 is provided with a feeding position 140, and the second cavity 130 is provided with a discharge port 150. The partition layer 110 is provided with a first blocking door 160, and the first cavity 120 is provided with a second blocking door 170. The transport mechanism 200 is used to transport the carrier, and the transport mechanism 200 can enter the second cavity 120 through the second blocking door 170. The first cavity 120 is provided with a transport mechanism 200 and is located at the feeding position 140. When the transport mechanism 200 is located at the feeding position 140, the second blocking door 170 is in a closed state. The transfer mechanism 300 is provided in the second cavity 130 and can enter the first cavity 120 through the first blocking door 160, take out the carrier in the transport mechanism 200, and transfer it to the second cavity 130. The transmission mechanism 400 is provided in the second cavity 130 and is used to receive the carrier in the transfer mechanism 300 and transfer the carrier to the second cavity 130. The board is transported to the sealed transport line through the discharge port 150. By arranging the transfer mechanism 300 and the transmission mechanism 400 in the first box 100, when the transfer mechanism 300 takes out the carrier board from the transportation mechanism 200 and transfers it to the transmission mechanism 400, the carrier board will not be exposed in the workshop, but will be in the second cavity 130 inside the box, that is, the transfer process is carried out inside the first box 100. At this time, under the protection of the first box 100, the influence of external dust on the carrier board can be reduced, thereby improving the dustproof effect. At the same time, in conjunction with the closed transportation mechanism 200, the carrier board can be protected by the transportation mechanism 200 before entering the first cavity 120, thereby further improving the dustproof effect. That is to say, the transfer equipment in this embodiment can make the process from transportation to transfer of the carrier board be carried out in a closed state, so that the dustproof effect of the semiconductor carrier board is effectively improved during transportation, thereby solving the problem of poor dustproof effect during transportation of semiconductor carrier boards in the prior art.

[0056] It should be noted that when the transfer mechanism 300 takes the carrier out of the transportation mechanism 200, the transportation mechanism 200 is in the first cavity 120. At this time, the transportation mechanism 200 is also inside the first box body 100, and when the transfer mechanism 300 is taking the carrier, the second barrier door 170 is in a closed state. Under the action of the second barrier door 170, the first cavity 120 can be further blocked from the outside of the first box body 100.

[0057] Furthermore, there is no limitation on the specific structure of the sealed transport line mentioned above, as long as the carrier can be sealed and transported in a sealed state.

[0058] In one embodiment, reference Figure 3 The transmission mechanism 400 includes a first mounting frame 410, a conveying wheel 420 mounted on the first mounting frame 410, and a first driving motor 430 that drives the conveying wheel 420 to rotate. The first mounting frame 410 has a first base 440, and the first base 440 is fixedly arranged at the bottom of the second cavity 130. Further, the conveying wheels 420 are arranged in multiple numbers and arranged side by side. The first mounting frame 410 is configured as an approximately U-shaped structure. The first driving motor 430 drives the multiple conveying wheels 420 to rotate through a transmission component, wherein the transmission component can be a belt transmission component or a helical gear transmission component. Specifically, after the transfer mechanism 300 places the carrier on the conveying wheel 420, the first driving motor 430 drives the multiple conveying wheels 420 to rotate synchronously through the transmission component, and the conveying wheel 420 can drive the carrier to move during the rotation process. Further, the multiple conveying wheels 420 are distributed in three rows and arranged side by side, that is, an avoidance space 450 is provided between two rows of conveying wheels 420. Further, the transmission assembly is configured as a helical gear transmission assembly (not shown), wherein the helical gear transmission assembly includes a first helical gear mounted on the conveying wheel 420, a first transmission rod, a second transmission rod, and a second helical gear mounted on the second mounting rod, wherein the first helical gear and the second helical gear are meshed, the first transmission rod and the second transmission rod are transmission connected, and the first transmission rod is transmission connected to the first drive motor 430.

[0059] In one embodiment, reference Figure 4The transfer mechanism 300 includes a multi-axis robot arm 310 and a material picking suction cup 320 arranged on the multi-axis robot arm 310, the multi-axis robot arm 310 has a second base 330, the second base 330 is fixedly arranged at the bottom of the second cavity 130, the multi-axis robot arm 310 can drive the material picking suction cup 320 to enter the first cavity 120 through the first barrier door 160, and the material picking suction cup 320 can adsorb the carrier. Further, the multi-axis robot arm 310 includes a slide rail 311, a slide table 312, a third drive motor 313, a first swing arm 314, a fourth drive motor 315, and a fifth swing arm 316, wherein the slide rail is fixedly arranged on the second base 330, the slide rail is arranged along the height direction of the first box body, the slide table is slidably arranged on the slide rail, and can slide up and down along the slide rail, wherein a belt module for driving the slide table to move is arranged on the slide rail, the first swing arm is rotatably installed on the slide table, and the third drive motor 315 is rotatably installed on the slide table. The motor is also installed on the slide, wherein the third drive motor can drive the first swing arm to rotate, the second swing arm is rotatably arranged on the first swing arm, the fourth drive motor is installed on the first swing arm, and can drive the second swing arm to rotate, wherein the material picking suction cup 320 is installed on the second swing arm, and the second swing arm is provided with a fifth drive motor, and the fifth drive motor can drive the material picking suction cup 320 to rotate. It should be noted that the first swing arm, the second swing arm and the material picking suction cup 320 are arranged in parallel and stacked. Further, the material picking suction cup 320 includes two material picking parts 321 arranged at intervals. When the material picking suction cup 320 picks up the carrier and places the carrier on the conveying wheel 420, the two material picking parts arranged at intervals can be respectively located in the two avoidance spaces 450 in the three rows of conveying wheels 420. Further, when the transfer mechanism 300 adopts the above method and cooperates with the above-mentioned transmission mechanism 400, it can facilitate the transfer of the carrier and improve the transfer efficiency.

[0060] In one embodiment, reference Figure 6, a universal wheel 180 with a self-locking function is installed at the bottom of the first box 100, and the universal wheel 180 allows a gap between the bottom of the first box 100 and the ground. The bottom of the first cavity 120 is open, and the first cavity 120 is also provided with an inlet and outlet 121, and the inlet and outlet 121 is located below the second blocking door 170. Further, in this embodiment, the first box 100 can be moved under the action of the universal wheel 180. Since the transfer mechanism 300 and the transmission mechanism 400 are fixedly arranged at the bottom of the second cavity 130, the first box 100 is in When moving, it can drive the transfer mechanism 300 and the transmission mechanism 400 to move together. It should be noted that under this structure, the transfer equipment of the present application can be placed in a relatively open place for assembly in the early stage of assembly in the workshop. After the assembly is completed, it is moved to the designated position, which is convenient for the assembly of the transfer equipment. At the same time, during the use of the transfer equipment, when the production line of the semiconductor carrier needs to be upgraded and the transfer equipment needs to be moved, there is no need to disassemble the transfer mechanism 300 and the transmission mechanism 400. At this time, you only need to push the first box body 100 to move it, which is very convenient. Furthermore, the present embodiment emphasizes that the bottom of the first cavity 120 is an opening, and the first cavity 120 is also provided with an inlet and outlet 121. That is to say, when the first box body 100 is located in the workshop, the AGV trolley 230 can move on the floor of the workshop and can enter the first cavity 120 through the inlet and outlet 121, which can facilitate the movement of the AGV trolley 230. At the same time, the AGV trolley 230 has better stability when moving on the floor of the workshop, compared with the stability of the AGV trolley 230 when moving on the inner bottom of the first cavity 120.

[0061] Further, in one embodiment, referring to Fig. 9 , Fig.10 The closed transport mechanism 200 includes a second box body 210, a box door 220 arranged on the second box body 210, and an AGV cart 230 driving the second box body 210 to move. A storage rack 240 is arranged in the second box body 210, and multiple storage layers are arranged on the storage rack 240. The storage layers are used for placing carriers. The AGV cart 230 can drive the second box body 210 to enter and exit the first cavity 120 through the second barrier door 170.

[0062] Further, refer to Fig.10The second box 210 has a third cavity 211, wherein the third cavity 211 is the interior of the second box 210, and the third cavity 211 is used for placing the carrier; the door 220 is connected to the second box 210, and can cover at least part of the second box 210, so that the third cavity 211 is in a closed state, wherein when the door 220 is closed, the third cavity 211 in the second box 210 can be in a closed state, further, the door 220 covers at least part of the second box 210, that is, there is a part of overlap between the door 220 and the second box 210, so that the path of the gas passing through the connection between the door 220 and the second box 210 to enter and exit the third cavity 211 can be increased, thereby increasing the difficulty of the gas passing through the connection to enter and exit the third cavity 211, and further, by opening the door 220, the carrier can enter and exit the third cavity 211.

[0063] The AGV trolley 230 is used to transfer the second box 210, and transfer the second box 210 from the previous process to the next process. Specifically, the AGV trolley 230 can transfer the second box 210 from the waiting position to the loading position. After arriving at the loading position, the box door 220 is opened to place the carrier in the third cavity 211. After the carrier is placed, the AGV trolley 230 continues to drive the second box 210 to move and transfer it from the loading position to the feeding position 140 in the first cavity 120. After arriving at the feeding position 140, the box door 220 is opened. At this time, the transfer mechanism 300 can take out the carrier in the third cavity 211. After the carrier in the third cavity 211 is taken out, the AGV trolley 230 drives the second box 210, moves the third cavity 211 out of the feeding position 140, and transfers it to the loading position or the waiting position.

[0064] When the AGV trolley 230 transports the second box body 210, the box door 220 covers at least part of the second box body 210. By covering at least part of the second box body 210 with the box door 220, on the one hand, the third cavity 211 can be in a closed state, and on the other hand, the sealing performance of the third cavity 211 can be improved. At this time, when the second box body 210 is moving, it is difficult for external gas, dust and floating objects to enter the third cavity 211, thereby reducing the influence of dust and floating objects on the carrier.

[0065] Furthermore, in this embodiment, by adopting a closed third cavity 211 to transport the carrier, the transportation equipment of the present application can be used in a workshop with a lower dustproof level requirement, thereby reducing the construction cost of the dust-free workshop compared to building a workshop with a high dustproof level requirement.

[0066] In one embodiment, reference Fig. 9 , Fig.10The third cavity 211 is a prism structure. Furthermore, in the present embodiment, the third cavity 211 is a quadrangular prism structure. However, the present design is not limited thereto. In some embodiments, the shape of the third cavity 211 can be set according to the shape of the carrier. For example, when the carrier is a pentagonal structure, the third cavity 211 can be a pentagonal prism structure. Furthermore, the semiconductor carrier closed transport equipment also includes a rack 240, which is arranged in the third cavity 211 for placing the carrier, and the rack 240 has a plurality of storage layers, and the plurality of storage layers are stacked. Further, the storage layers are arranged horizontally, and the box door 220 can be moved from bottom to top and opened, or moved from top to bottom and closed. The box door 220 is arranged in this way mainly considering that the horizontal space of many workshops is limited, but the vertical space is usually not well utilized. The box door 220 is opened up and down to reduce the horizontal space occupation of the workshop, so that the equipment can be used in a workshop with a smaller horizontal space. In some embodiments, the box door 220 is opened up and down, and a sealing strip (not shown) can be arranged around the box door 220 to ensure good sealing performance. Further, in conjunction with the above-mentioned box door 220 at least partially covering the second box 210, the sealing effect of the third cavity 211 can be better improved. At the same time, the box door 220 is opened up and down, which can also reduce the risk of collision between people and objects when passing through the second box 210.

[0067] In one embodiment, a guide assembly 250 is provided between the box door 220 and the second box body 210 (see Fig.11 , Fig.12 ), the guide assembly 250 can make the box door 220 have a tendency to move closer to the moving area of ​​the second box body 210 or away from the second box body 210 when the box door 220 is about to be closed or just opened. It can be understood that when the box door 220 moves up and down for most of the time, there is a certain distance between the box door 220 and the second box body 210. Under the effect of this distance, the friction between the box door 220 and the second box body 210 can be reduced, thereby reducing the vibration between the second box body 210 and the box door 220. At the same time, in some embodiments, when a sealing strip (not shown) is provided on the box door 220 or the second box body 210, the friction of the sealing strip can be reduced under the effect of this gap, the loss of the sealing strip can be reduced, and the service life of the sealing strip can be increased, thereby improving the sealing effect of the third cavity 211.

[0068] In one embodiment, reference Fig.10 , Fig.11 The second box body 210 has a rectangular opening 212, and the carrier enters the third cavity 211 through the opening 212. A first notch 213 is provided at the top of the opening 212. Fig.12The box door 220 has a rectangular ring-shaped edging 221, which can cover at least a portion of the second box body 210. A second notch 222 is provided at the bottom of the edging 221. It should be emphasized that when the edging 221 covers at least a portion of the second box body 210, it is necessary to completely cover the first notch 213 so that the first notch 213 is not exposed. Specifically, the box door 220 also includes a main frame 223 and a back plate 224, wherein the edging 221 Connect the main frame 223 or the back plate 224. When the edging 221 is connected to the main frame 223, the edging 221 is fixed on the main frame 223. When the edging 221 is connected to the back plate 224, the edging 221 is fixed on the back plate 224. Specifically, when the box door 220 makes the third cavity 211 in a closed state, the main frame 223 of the box door 220 can be against the opening 212 of the second box body 210, and the edging 221 can cover at least part of the second box body 210.

[0069] Furthermore, the guide assembly 250 includes a first guide member 251 (see FIG. 251 ) disposed on both side walls and the bottom wall of the second box body 210 near the opening 212. Fig.11 ) and a second guide member 253 (see Fig.12 ), it can be understood that the first guide members 251 are configured as three, and the three first guide members 251 are respectively arranged on the two inner side walls and the bottom wall of the second box body 210, and are arranged near the opening 212. At the same time, the second guide members 253 are also configured as three (see Fig.12 ), and the second guide member 253 is arranged in a one-to-one correspondence with the first guide member 251. When the box door 220 is opened or closed, the second guide member 253 can slide along the first guide member 251 to move the box door 220 closer to the second box body 210 or away from the second box body 210. Specifically, the first guide member 251 has a first inclined surface 252, and the second guide member 253 has a second inclined surface 254. When the box door 220 is about to be closed or just opened, the second inclined surface 254 can move relative to the first inclined surface 252, so that the second guide member 253 can slide along the first guide member 251 to move the box door 220 closer to or away from the second box body 210. Further, referring to Fig.14 , Fig.15 When the box door 220 is opened, the second guide member 253 arranged on the box door 220 can move upward from the first notch 213. In this way, when the box door 220 moves in the up and down directions, the distance between the box door 220 and the second box body 210 is small, which can further reduce the possibility of dust and floating objects entering the third cavity 211.

[0070] In one embodiment, reference Fig.10 , Fig.13The storage rack 240 includes storage plates 241 disposed on two opposite side walls of the third cavity 211, and a plurality of storage slots 242 are stacked on the two storage plates 241, wherein a certain gap exists between two storage slots 242 (see Fig.13 ), and the storage slots 242 on the two storage plates 241 are arranged one by one, and the storage slots 242 arranged in pairs form a storage layer; further, a plurality of receiving members 260 (see Fig.10 ), a plurality of receiving members 260 are located between the two storage plates 241 and are stacked. Specifically, the receiving member is arranged in the middle position between the two storage plates 241. The receiving member and the storage slot 242 are arranged one by one, wherein the receiving member is fixed in the second box body 210, and the receiving member is configured as a round tube. It should be noted that when the carrier plate is placed in the two storage slots 242 on the rack 240, the middle position of the carrier plate contacts the receiving member.

[0071] In this embodiment, the AGV trolley 230 can receive the second box 210 and drive the second box 210 to move along a preset track. Specifically, the second box 210 is placed on the AGV trolley 230, and the AGV trolley 230 moves along a preset route track to transfer the second box 210 from the previous process to the next process. In some embodiments, the AGV trolley 230 can be set to multiple units, and multiple route tracks are laid out in the workshop. Since the box door 220 is opened in the up and down direction, when the AGV trolley 230 drives the second box 210 to move, there is no need to worry about the problem that other box doors 220 will occupy horizontal space when they are opened. In this way, when laying out multiple route tracks for the AGV trolley 230 to move, the distance between the two route tracks can be relatively close, so that the workshop with limited horizontal space can obtain the maximum space utilization. It can be understood that setting more second boxes 210 and AGV trolleys 230 can improve transportation capacity.

[0072] In one embodiment, the first blocking door 160, the second blocking door 170, and the box door 220 can reciprocate along the height direction of the first box body 100, so that the first blocking door 160, the second blocking door 170, and the box door 220 are opened or closed;

[0073] The closed transfer device for semiconductor carriers further comprises a door opening and closing mechanism 500 (see Figure 7 ), the door opening and closing mechanism 500 can make the first blocking door 160, the second blocking door 170 and the box door 220 reciprocate along the height direction of the first box body 100.

[0074] In one embodiment, the switch door mechanism 500 includes a first switch door assembly 510, a second switch door assembly 520, and a third switch door assembly 530. The first switch door assembly 510 is used to drive the first barrier door 160 to move along the height direction of the first box body 100. Furthermore, the first switch door assembly 510 can adopt the following structure (not shown). The first switch door assembly 510 includes a rope, a winding shaft, and a second driving motor. One end of the rope is connected to the first barrier door 160, and the other end is connected to the winding shaft. The rope can move along the height direction of the first box body 100. The second driving motor drives the winding shaft to rotate, and the winding shaft can wind the rope to move the first barrier door 160 along the height direction of the first box body 100.

[0075] The second switch door assembly 520 is used to drive the second blocking door 170 to move along the height direction of the first box body 100. Furthermore, the second switch door assembly 520 can adopt the following structure (not shown), the second switch assembly includes a rack fixed to the first box body 100 and a third drive motor installed on the second blocking door 170, the rack is arranged along the height direction of the first box body 100, and a gear is installed at the output end of the third drive motor, and the gear is meshed with the rack box. The third drive motor drives the gear to rotate so that the gear moves along the rack, thereby enabling the second blocking door 170 to move along the height direction of the first box body 100.

[0076] Furthermore, in one embodiment, the switch door assemblies used to open and close the first barrier door 160 and the second barrier door 170 can be interchangeable, that is, the second barrier door 170 can be opened or closed by the second switch door assembly 520, and the first barrier door 160 can be opened or closed by the first switch door assembly 510.

[0077] The third door opening and closing assembly 530 is used to drive the box door 220 to move along the height direction of the first box body 100. Further, the third door closing assembly can adopt the following structure (not shown in the figure). The third door opening and closing assembly 530 includes a guide rail fixedly provided on the first box body 100, a driving slider provided on the guide rail, and a mechanical gripper provided on the driving slider and having a visual function. The guide rail is arranged along the height direction of the first box body 100. The box door 220 is fixedly provided with a grasped portion, and the grasped portion cooperates with the mechanical gripper. The mechanical gripper can grasp the grasped portion, and the driving slider drives The mechanical gripper moves along the guide rail, and the mechanical gripper can drive the box door 220 to move along the height direction of the first box body 100. Further, in this embodiment, the mechanical gripper with a visual function obtains the position of the grasping part through the visual function provided thereon. At this time, the mechanical gripper moves to the grasping part according to the position information fed back by the visual function, and clamps the grasping part. Further, in order to ensure that the mechanical gripper can accurately clamp the grasping part, a trigger switch is provided on the mechanical gripper. When the mechanical gripper accurately clamps the grasping part, the trigger switch is triggered. In this way, it can be determined that the mechanical gripper accurately clamps the grasping part.

[0078] Furthermore, in one embodiment, the third switch door assembly 530 may also adopt the following structure, wherein the third switch door assembly 530 comprises a guide rail (not shown) fixedly arranged on the first box body 100, a driving slider (not shown) arranged on the guide rail, and a protrusion 531 (not shown) arranged on the driving slider. Figure 8 ), wherein a slot 532 is provided on the protrusion 531, and an insert block 225 is provided on the box door 220 corresponding to the slot 532. When the transport mechanism 200 is located at the feeding position 140, the insert block 225 on the box door 220 can enter the slot 532 of the protrusion 531, and the driving slider drives the protrusion 531 to rise, thereby opening the box door 220. Further, in this embodiment, in order to improve the stability of the box door 220 during the opening process, the slot 532 and the insert block 225 are magnetically connected, that is, when the insert block 225 enters the slot 532, the two can be magnetically attracted, so that the box door 220 and the protrusion 531 can have a relatively stable connection.

[0079] In one embodiment, reference Figure 2The closed transfer device for the semiconductor carrier also includes a clamping mechanism 600, which is arranged in the first cavity 120. The clamping mechanism 600 is used to clamp the second box body 210 so that the second box body 210 can remain stable during the opening of the box door 220. That is to say, before the box door 220 is opened, the second box body 210 can be clamped by the clamping mechanism 600. At this time, when the third switch door assembly 530 opens the box door 220, the second box body 210 can remain stable, which can reduce the vibration of the second box body 210, thereby reducing the friction between the carrier and the second box body 210 caused by the vibration of the second box body 210, reducing the dust generated by the friction, and further improving the dustproof effect.

[0080] Further, in one embodiment, referring to Fig. 9 , Fig.10 The AGV trolley 230 has a receiving end 231, and the receiving end 231 is provided with a plurality of avoidance gaps 232, and the plurality of avoidance gaps 232 allow the bottom of the second box body 210 to be exposed. Figure 5The clamping mechanism 600 includes two symmetrically arranged third bases 610, each of which is provided with a pneumatic pan-tilt platform 620, a limit plate 630, a rotary downward pressure cylinder 640 and a push cylinder 650. The pneumatic pan-tilt platform 620 is provided with a ball 660, the limit plate 630 and the rotary downward pressure cylinder 640 are arranged relatively to each other, and the push cylinder 650 is arranged between the limit plate 630 and the rotary downward pressure cylinder 640. The pneumatic pan-tilt platform 620 can contact the bottom of the second box body 210 through the avoidance gap 232 and lift the second box body 210. The rotary downward pressure cylinder 640 can make the second box body 210 located on the pneumatic pan-tilt platform 620 move toward the limit plate and make the second box body 210 resist against the limit plate. The push cylinders 650 on the two third bases 610 can approach each other and position and clamp the second box body 210. It should be noted that the lifting height of the pneumatic platform 620 can be adjusted, that is, the pneumatic platform 620 can lift the second box body 210 to a preset height, at which time the box door 220 is located at a preset position. In this way, when the third switch door assembly 530 includes a protrusion 531 with a slot 532, the box door 220 can be located at a preset position under the action of the pneumatic platform 620, so that the plug 225 on the box door 220 is level with the slot 532. Further, in some embodiments, the slot 532 has a third notch 533 for the plug 225 to enter and exit from bottom to top, or from top to bottom. At this time, when the box door 220 moves from bottom to top under the action of the platform, the plug on the door 220 225 can enter the slot 532 through the third notch 533 and be level with the slot 532, wherein the magnetic area 534 of the plug block 225 and the slot 532 is set away from the third notch 533. When the plug block 225 and the slot 532 are level, the push cylinders 650 on the two third bases 610 work synchronously to drive the box body and the box door 220 to move, so that the plug block 225 leaves the third notch 533 and makes the plug block 225 magnetically connected with the slot 532. Then the driving slider drives the protrusion 531 to rise, and the protrusion 531 drives the protrusion to rise, thereby opening the box door 220. When the driving slider drives the protrusion 531 to rise to the preset position, the box door 220 is fully opened. Furthermore, in this embodiment, the rotating downward-pressing cylinder 640 can play a role in rough positioning of the box body. Specifically, when in use, the pneumatic platform first lifts the box body to move it away from the receiving end 231, and then the rotating downward-pressing cylinder 640 moves the box body toward the limit plate 630 by a preset distance, corresponding to the third notch 533 of the slot 532, and then the pneumatic platform drives the box door 220 to be lifted to a preset height.

[0081] In one embodiment, the storage layer is arranged horizontally; the transfer mechanism 300 takes out the carrier on the rack 240 from bottom to top. It should be noted that the transfer mechanism 300 takes out materials from bottom to top, and can take out the carrier located at the bottom layer in the transportation mechanism 200 first, and finally take out the carrier on the top layer. The advantage of this method is that the trace dust generated in the process of taking materials can fall downward instead of floating upward, which can avoid a small amount of dust floating on the upper carrier that has not been taken, and further improve the dust prevention effect of the carrier during the transfer process.

[0082] In one embodiment, reference Fig.16 The closed transfer device for the semiconductor carrier also includes an air intake mechanism 700, which includes an air intake pipe 710, an air intake fan 720, and a filter module 730. The air intake pipe 710 is connected to the first cavity 120, and the air intake fan 720 is used to send external gas into the air intake pipe 710. The filter module 730 is used to filter the gas entering the first cavity 120. The bottom of the first cavity 120 is detachably connected with multiple partitions, and the partitions are used to shorten the distance between the bottom of the first cavity 120 and the ground. Furthermore, in this embodiment, the air intake mechanism 700 can continuously replenish the filtered gas in the first cavity 120 for a certain period of time, which can prevent dust from accumulating in the first cavity 120, and further improve the dustproof effect in the first cavity 120. Since the AGV trolley 230 enters and exits the first cavity 120 many times, a small amount of dust will remain in the first cavity 120 during use. Under the action of the flowing gas, the small amount of dust can be taken away by the flowing gas and discharged outward through the bottom of the first cavity 120. At the same time, in this embodiment, the bottom of the first cavity 120 is detachably connected with multiple baffles, and the action of the multiple baffles can shorten the distance between the bottom of the first cavity 120 and the ground. At this time, when the intake volume entering the first cavity 120 is greater than the exhaust volume in the first cavity 120, the first cavity 120 can be in a state of slight positive pressure, thereby reducing the possibility of dust entering the first cavity 120. It should be emphasized that when the air intake mechanism 700 is working, the first blocking door 160 and the second blocking door 170 are both in a closed state, so as to prevent the gas in the first cavity 120 from entering the second cavity 130 through the first blocking door 160.

[0083] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A closed transfer device for semiconductor carriers, characterized in that: Located upstream of a sealed transport line, wherein the sealed transport line has a material receiving port, the closed transfer device for the semiconductor carrier comprises: A first box body, wherein a partition layer is provided inside the first box body to separate the interior of the first box body into a first cavity and a second cavity on the left and right sides, a feeding position is provided in the first cavity, a discharge port is provided in the second cavity, a first blocking door is provided on the partition layer, and a second blocking door is provided in the first cavity; A closed transport mechanism, used for transporting the carrier, can enter the first cavity through the second barrier door and be located at the feeding position. When the transport mechanism is located at the feeding position, the second barrier door is in a closed state; a transfer mechanism, disposed in the second cavity, capable of entering the first cavity through the first barrier door, taking out the carrier in the transport mechanism, and transferring it to the second cavity; and A transmission mechanism, disposed in the second cavity, for receiving the carrier in the transfer mechanism and conveying the carrier to the sealed transport line through the discharge port; The transmission mechanism includes a first mounting frame, a conveying wheel mounted on the first mounting frame, and a first driving motor driving the conveying wheel to rotate, the first mounting frame has a first base, and the first base is fixedly arranged at the bottom of the second cavity; The transfer mechanism includes a multi-axis mechanical arm and a material-taking suction cup provided on the multi-axis mechanical arm, wherein the multi-axis mechanical arm has a second base, and the second base is fixedly provided on the bottom of the second cavity, and the multi-axis mechanical arm can drive the material-taking suction cup to enter the first cavity through the first blocking door, and the material-taking suction cup can adsorb the carrier; A universal wheel with a self-locking function is installed at the bottom of the first box, and the universal wheel allows a gap between the bottom of the first box and the ground. The bottom of the first cavity is an opening, and the first cavity is also provided with an inlet and outlet, and the inlet and outlet are located below the second barrier door; The transport mechanism includes a second box, a box door provided on the second box, and an AGV trolley for driving the second box to move. A storage rack is provided in the second box, and multiple storage layers are provided on the storage rack. The storage layers are used for placing carriers. The AGV trolley can drive the second box to enter and exit the first cavity through the second barrier door.

2. The closed transfer device for semiconductor carriers according to claim 1, characterized in that: The first blocking door, the second blocking door, and the box door can reciprocate along the height direction of the first box body so that the first blocking door, the second blocking door, and the box door are opened or closed; The closed transfer equipment for the semiconductor carrier also includes a door opening and closing mechanism, which can make the first blocking door, the second blocking door and the box door reciprocate along the height direction of the first box body.

3. The closed transfer device for semiconductor carriers according to claim 2, characterized in that: The opening and closing door mechanism includes a first opening and closing door assembly, a second opening and closing door assembly, and a third opening and closing door assembly. The first opening and closing door assembly is used to drive the first blocking door to move along the height direction of the first box body, the second opening and closing door assembly is used to drive the second blocking door to move along the height direction of the first box body, and the third opening and closing door assembly is used to drive the box door to move along the height direction of the first box body.

4. The closed transfer device for semiconductor carriers according to claim 1, characterized in that: The closed transfer device for the semiconductor carrier also includes a clamping mechanism, which is arranged in the first cavity and is used to clamp the second box body so that the second box body can remain stable during the opening of the box door.

5. The closed transfer device for semiconductor carriers according to claim 4, characterized in that: The AGV trolley has a receiving end, and the receiving end is provided with a plurality of avoidance gaps, and the plurality of avoidance gaps expose the bottom of the second box body; The clamping mechanism includes two symmetrically arranged third bases, each of which is provided with a pneumatic pan-tilt platform, a limit plate, a rotating downward pressure cylinder and a pushing cylinder. The pneumatic pan-tilt platform is provided with a ball bearing, the limit plate and the rotating downward pressure cylinder are relatively arranged, and the pushing cylinder is arranged between the limit plate and the rotating downward pressure cylinder. The pneumatic pan-tilt platform can contact the bottom of the second box body through the avoidance gap and lift the second box body. The rotating downward pressure cylinder can make the second box body located on the pneumatic pan-tilt platform move toward the limit plate and make the second box body resist the limit plate. The pushing cylinders on the two third bases can approach each other and position and clamp the second box body.

6. The closed transfer device for semiconductor carriers according to claim 1, characterized in that: The storage layer is arranged horizontally; The transfer mechanism takes out the carrier plate on the storage rack from bottom to top.

7. The closed transfer device for semiconductor carriers according to claim 1, characterized in that: The closed transfer equipment for the semiconductor carrier also includes an air intake mechanism, which includes an air intake pipe, an air intake fan, and a filter module. The air intake pipe is connected to the first cavity. The air intake fan is used to deliver external gas into the air intake pipe. The filter module is used to filter the gas entering the first cavity. The bottom of the first cavity is detachably connected to multiple partitions, and the partitions are used to shorten the distance between the bottom of the first cavity and the ground.

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