High-power test switching device

Abstract

The invention relates to a high-power test switching device which mainly comprises a micro-electro-mechanical switcher and a signal output switcher, and the micro-electro-mechanical switcher is provided with a test signal input end, first to fourth output ends and first to fourth glass substrate channel switches. The signal output switcher is provided with a first receiving end, a second receiving end, a third receiving end, a fourth receiving end and a test signal output end, and a first signal amplifier, a second signal amplifier, a third signal amplifier, a first signal filter, a second signal filter and a third signal filter are respectively arranged between the first output end, the second output end, the third output end and the first receiving end. Therefore, the service life is prolonged, and the signal accuracy is improved.

Description

Technical Field

[0001] The present invention relates to a high-power test switching device with a longer service life and more accurate signals. Background Art

[0002] With the advancement of various technologies, the sophistication of various industries will increase. For example, the sophistication of the signal transmission industry will continue to improve with the advancement of the times. Relatively speaking, the requirements for testing organizations for various types of signals and power supplies will also increase accordingly.

[0003] Generally, high-power switch testing requires high power handling, low distortion, frequency selection, and signal amplification functions to accurately measure the harmonics in the switch. In order to meet the high power conditions, mechanical switches are often used to achieve low distortion. However, mechanical switches have poor frequency and power adjustment effects, and because mechanical switches use a reed mechanism to perform switching actions, they are prone to elastic fatigue, resulting in a shorter service life and a larger overall volume.

[0004] Therefore, how to solve the above conventional problems and deficiencies is the direction that the applicant of the present invention and related manufacturers engaged in this industry are eager to study and improve. Summary of the invention

[0005] In view of the above-mentioned deficiencies, the creator of the present invention has collected relevant information, conducted multiple evaluations and considerations, and used his many years of experience in this industry to continuously trial and modify, and finally designed an invention patent for a high-power test switching device with a longer service life and more accurate signals.

[0006] The main purpose of the present invention is to replace the traditional mechanical switch by using a micro-electromechanical switch with filtering and amplification effects to improve the service life and signal accuracy.

[0007] To achieve the above-mentioned purpose, the main structure of the present invention includes: a micro-electromechanical switch, a test signal input terminal provided on the micro-electromechanical switch, a first output terminal provided on the micro-electromechanical switch and informationally connected to the test signal input terminal, a first glass substrate channel switch provided between the first output terminal and the test signal input terminal, a second output terminal provided on the micro-electromechanical switch and informationally connected to the test signal input terminal, a second glass substrate channel switch provided between the second output terminal and the test signal input terminal, a third output terminal provided on the micro-electromechanical switch and informationally connected to the test signal input terminal, a third glass substrate channel switch provided between the third output terminal and the test signal input terminal, a fourth output terminal provided on the micro-electromechanical switch and informationally connected to the test signal input terminal, a signal output switch provided at one side of the micro-electromechanical switch, a first receiving terminal provided on the signal output switch and informationally connected to the first output terminal, end, at least one first signal amplifier disposed between the first receiving end and the first output end, at least one first signal filter disposed between the first output end and the first signal amplifier, a second receiving end disposed on the signal output switch and informationally connected to the second output end, at least one second signal amplifier disposed between the second receiving end and the second output end, at least one second signal filter disposed between the second output end and the second signal amplifier, a third receiving end disposed on the signal output switch and informationally connected to the third output end, at least one third signal amplifier disposed between the third receiving end and the third output end, at least one third signal filter disposed between the third output end and the third signal amplifier, a fourth receiving end disposed on the signal output switch, and a test signal output end disposed on the signal output switch, wherein the test signal output end is informationally connected to the first receiving end, the second receiving end, the third receiving end, and the fourth receiving end.

[0008] Through the above structure, the user can input the signal from the test signal input terminal into the micro-electromechanical switch, and select whether to output the signal from the first output terminal, the second output terminal, or the third output terminal to the corresponding first receiving terminal, the second receiving terminal, or the third receiving terminal according to the needs. Because the first glass substrate channel switch, the second glass substrate channel switch, and the third glass substrate channel switch are used to select the opening and connection conditions when controlling the switch, the service life can be better. Because the signal passing through can be filtered by the first signal filter, the second signal filter, and the third signal filter, and then amplified by the first signal amplifier, the second signal amplifier, or the third signal amplifier, the accuracy of the signal can be improved.

[0009] By using the above method, the test signal output terminal on the signal output switch is used to transmit the signal to the test equipment, so as to achieve the effect of increasing the service life and improving the signal accuracy through the micro-electromechanical switch.

[0010] Through the above technology, the problem of short service life of conventional switches can be overcome, thereby achieving the practical progress of the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 A three-dimensional perspective view of a preferred embodiment of the present invention;

[0012] Figure 2 A schematic diagram of a structural block diagram of a preferred embodiment of the present invention;

[0013] Figure 3 A schematic diagram of a glass channel switch according to a preferred embodiment of the present invention;

[0014] Figure 4 A schematic diagram of signal transmission of a preferred embodiment of the present invention;

[0015] Figure 5 A three-dimensional perspective view of another preferred embodiment of the present invention;

[0016] Figure 6 A structural block diagram of another preferred embodiment of the present invention;

[0017] Figure 7 A three-dimensional perspective view of another preferred embodiment of the present invention;

[0018] Figure 8 FIG. 2 is a structural block diagram of another preferred embodiment of the present invention. DETAILED DESCRIPTION

[0019] In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are illustrated in detail with reference to the preferred embodiment of the present invention, and its features and functions are as follows for a complete understanding.

[0020] See also Figures 1 to 4 , which is a stereoscopic perspective view of a preferred embodiment of the present invention and a schematic diagram of signal transmission, from which it can be clearly seen that the present invention includes:

[0021] A micro-electromechanical switch 1, the micro-electromechanical switch 1 of this embodiment is a switch of model MM5130;

[0022] A test signal input terminal A provided on the MEMS switch 1;

[0023] A first output terminal 11 provided on the MEMS switch 1 and connected to the test signal input terminal A;

[0024] a first glass substrate channel switch 111 disposed between the first output terminal 11 and the test signal input terminal A;

[0025] A second output terminal 12 provided on the MEMS switch 1 and connected to the test signal input terminal A;

[0026] a second glass substrate channel switch 121 disposed between the second output terminal 12 and the test signal input terminal A;

[0027] A third output terminal 13 provided on the MEMS switch 1 and connected to the test signal input terminal A;

[0028] a third glass substrate channel switch 131 disposed between the third output terminal 13 and the test signal input terminal A;

[0029] A fourth output terminal 14 provided on the MEMS switch 1 and connected to the test signal input terminal A;

[0030] a fourth glass substrate channel switch 141 disposed between the fourth output terminal 14 and the test signal input terminal A;

[0031] A signal output switch 2 disposed at one side of the MEMS switch 1;

[0032] A first receiving terminal 21 disposed on the signal output switch 2 and informationally connected to the first output terminal 11;

[0033] At least one first signal amplifier 31 disposed between the first receiving end 21 and the first output end 11;

[0034] at least one first signal filter 41 disposed between the first signal amplifier 31 and the first output terminal 11;

[0035] A second receiving terminal 22 disposed on the signal output switch 2 and informationally connected to the second output terminal 12;

[0036] at least one second signal amplifier 32 disposed between the second receiving end 22 and the second output end 12;

[0037] at least one second signal filter 42 disposed between the second signal amplifier 32 and the second output terminal 12;

[0038] A third receiving terminal 23 provided on the signal output switch 2 and informationally connected to the third output terminal 13;

[0039] At least one third signal amplifier 33 disposed between the third receiving terminal 23 and the first output terminal 11. In this embodiment, the first signal amplifier 31, the second signal amplifier 32, and the third signal amplifier 33 are all exemplified by radio frequency (RF) amplifiers;

[0040] At least one third signal filter 43 disposed between the third signal amplifier 33 and the third output terminal 13. In this embodiment, the first signal filter 41, the second signal filter 42, and the third signal filter 43 are all high pass filters (HPF) as examples;

[0041] a fourth receiving terminal 24 disposed on the signal output switch 2; and

[0042] A test signal output terminal B is provided on the signal output switch 2 and is informationally connected to the first receiving terminal 21 , the second receiving terminal 22 , the third receiving terminal 23 , and the fourth receiving terminal 24 .

[0043] Through the above description, the structure of this technology can be understood, and according to the corresponding coordination of this structure, it can have the advantages of extending the service life and improving the signal accuracy. The detailed explanation will be described below.

[0044] The user can input the signal from the test signal input terminal A of the MEMS switch 1, and this embodiment takes the radio frequency signal (RF) as an example, and sets the first signal filter 41 to pass the frequency of 1320HMz, the second signal filter 42 to pass the frequency of 3100HMz, and the third signal filter 43 to pass the frequency of 9700HMz. In this way, the user can choose to output through the first output terminal 11, the second output terminal 12, or the third output terminal 13 according to the needs, and the fourth output terminal 14 can be reserved for the integration of the external circuit, and only connected externally when needed.

[0045] In this embodiment, the first output terminal 11 is selected as an example, so that the user can control the first glass substrate channel switch 111 to be turned on, so that the test signal input terminal A and the first output terminal 11 are connected to each other. Since the present case uses the micro-electromechanical switch 1, the first glass substrate channel switch 111, the second glass substrate channel switch 121, the third glass substrate channel switch 131, and the fourth glass substrate channel switch 141 all use the glass substrate channel combined with the metal alloy to perform the signal switch action. The so-called glass substrate channel is made by combining the glass substrate with the metal alloy, such as Figure 3 As shown, when voltage is injected, the glass substrate channel C will be upward and in a conductive state. This is the existing technical content, so it will not be repeated.

[0046] As described above, at this time, the test signal input terminal A and the first output terminal 11 will be mutually connected, so that the signal is output from the first output terminal 11, and first passes through the first signal filter 41 to allow the 1320HMz frequency signal to pass, and then passes through the first signal amplifier 31 for amplification, and finally allows the first receiving terminal 21 to receive the signal. At this time, the user can also control the first output terminal 11 and the test signal output terminal B to be mutually connected. The signal output switch 2 of this embodiment takes a solid-state mechanism switch as an example, so that the cost saving effect can be achieved. The switching method of the solid-state mechanism switch is a conventional technical content, so it will not be repeated. In this way, the signal can be output through the test signal output terminal B to perform the test action, and because the signal passes through the first signal filter 41 and the first signal amplifier 31 for filtering and amplification, it can be more accurate, and because the input end is a switch using a micro-electromechanical switch 1 in conjunction with a glass substrate channel, it can have a longer service life than the conventional spring switch.

[0047] In contrast, the user can also choose to open the second glass substrate channel switch 121, so that the second output terminal 12 is connected to the test signal input terminal A, so that the signal can enter the second receiving terminal 22 through the second output terminal 12, the second signal filter 42, and the second signal amplifier 32, so that the signal with a frequency of 3100HMz can enter the second receiving terminal 22. Or choose to open the third glass substrate channel switch 131, so that the third output terminal 13 is connected to the test signal input terminal A, so that the signal can enter the third receiving terminal 23 through the third output terminal 13, the third signal filter 43, and the third signal amplifier 33, and the fourth receiving terminal 24 can also be used as an external circuit for integration, and only connected externally when needed. In this way, the user can adjust the use of different frequency lines to perform test actions according to needs to increase the diversity of use effects. And because the micro-electromechanical switch 1 itself can withstand high power, the accuracy of the signal can be increased through filters and amplifiers to avoid distortion.

[0048] Please also refer to Figure 5 and Figure 6 2 is a perspective view and a block diagram of another preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is similar to the above embodiment. Only in this embodiment, the number of the first signal filter 41, the second signal filter 42, and the third signal filter 43 between the MEMS switch 1 and the signal output switch 2 is two as an example, and the number of the first signal amplifier 31, the second signal amplifier 32, and the third signal amplifier 33 is also two as an example to indicate that the number is not limited. No matter which line the user selects to perform the test action, the signal can also be filtered twice and amplified twice to allow the signal to be sorted more accurately.

[0049] In this embodiment, the signal output switch 2 uses a micro-electromechanical switch, so an output glass substrate channel switch 25 is provided between the first receiving end 21 and the test signal output end B, between the second receiving end 22 and the test signal output end B, between the third receiving end 23 and the test signal output end B, and between the fourth receiving end 24 and the test signal output end B. In this way, the first glass substrate channel switch 111, the second glass substrate channel switch 121, the third glass substrate channel switch 131, and the fourth glass substrate channel switch 141 can be used to control the test signal input end A and the first output end 11, the second output end 12, the third output end 13, and the fourth output end 14, respectively, to indicate that the type of the signal output switch 2 is not limited.

[0050] Please also refer to Figure 7 and Figure 8 , which is a perspective view and a block diagram of another preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is similar to the above embodiment. In this embodiment, the MEMS switch 1 is connected to a digital signal auxiliary structure 5, and the digital signal auxiliary structure 5 has a digital signal amplifier 51, a digital signal inverter 52 connected to the digital signal amplifier 51, a plurality of relay switches 53 connected to the digital signal inverter 52, and a power booster 54 connected to each of the relay switches 53. Each relay switch 53 is connected to the MEMS switch 1, so that the user can control it through a digital signal. Since the MEMS switch 1 requires a voltage of 90V to start, if a digital signal is used, the digital signal amplifier 51 must be used to amplify the signal first, and then the digital signal inverter 52 must be used to reverse the signal so that the digital signal can meet the specifications required by the MEMS switch 1.

[0051] The signal is then increased to above 90V by the power booster 54, and the relay switch 53 allows voltages above 90V to pass. In this way, digital signals can also be tested according to the present invention to improve convenience in use.

[0052] The above description is only a preferred embodiment of the present invention, which does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the contents of the present invention description and drawings should be included in the patent scope of the present invention and are hereby stated.

[0053] In summary, the high-power test switching device of the present invention can truly achieve its efficacy and purpose when used. Therefore, the present invention is truly an invention with excellent practicality. In order to meet the application requirements for invention patents, an application is filed in accordance with the law. We hope that the present invention will be approved as soon as possible to protect the hard work of the creator. If you have any questions, please feel free to write to us and we will do our best to cooperate. I am really grateful for your help.

[0054] Explanation of symbols

[0055] MEMS switch....1

[0056] Test signal input terminal....A

[0057] First output terminal....11

[0058] First glass substrate channel switch....111

[0059] Second output terminal....12

[0060] Second glass substrate channel switch....121

[0061] The third output terminal....13

[0062] The third glass substrate channel switch....131

[0063] Fourth output terminal....14

[0064] Fourth glass substrate channel switch....141

[0065] Signal output switcher....2

[0066] Test signal output terminal....B

[0067] First receiving end....21

[0068] Second receiving end....22

[0069] The third receiving end....23

[0070] Fourth receiving end ....24 Output glass substrate channel switch ....25 First signal amplifier ....31 Second signal amplifier ....32 Third signal amplifier ....33 First signal filter ....41 Second signal filter ....42 Third signal filter ....43 Digital signal auxiliary structure ....5 Digital signal amplifier ....51 Digital signal inverter ....52 Relay switch ....53

[0071] Power Booster....54 Glass Substrate Channels....C

Claims

1. A high power test switching device, which mainly comprises: a micro-electromechanical switch; A test signal input terminal, the test signal input terminal is arranged on the micro-electromechanical switch; a first output terminal, which is disposed on the micro-electromechanical switch and is informationally connected to the test signal input terminal; a first glass substrate channel switch, which is disposed between the first output terminal and the test signal input terminal to control the mutual connection state; a second output terminal, which is disposed on the micro-electromechanical switch and is informationally connected to the test signal input terminal; a second glass substrate channel switch, which is disposed between the second output terminal and the test signal input terminal to control the mutual connection state; a third output terminal, which is disposed on the micro-electromechanical switch and is informationally connected to the test signal input terminal; a third glass substrate channel switch, which is disposed between the third output terminal and the test signal input terminal to control the mutual connection state; a fourth output terminal, which is disposed on the micro-electromechanical switch and is informationally connected to the test signal input terminal; a signal output switch, which is disposed at one side of the micro-electromechanical switch; a first receiving end, the first receiving end is arranged on the signal output switch and is informationally connected to the first output end; at least one first signal amplifier, the first signal amplifier is arranged between the first receiving end and the first output end; at least one first signal filter, the first signal filter being disposed between the first output terminal and the first signal amplifier; a second receiving end, the second receiving end is arranged on the signal output switch and is informationally connected to the second output end; at least one second signal amplifier, the second signal amplifier is arranged between the second receiving end and the second output end; at least one second signal filter, the second signal filter being disposed between the second output terminal and the second signal amplifier; a third receiving end, the third receiving end is arranged on the signal output switch and is informationally connected to the third output end; at least one third signal amplifier, the third signal amplifier is arranged between the third receiving end and the third output end; at least one third signal filter, the third signal filter being disposed between the third output terminal and the third signal amplifier; a fourth receiving end, the fourth receiving end being disposed on the signal output switch; and A test signal output terminal is provided on the signal output switch and is informationally connected to the first receiving terminal, the second receiving terminal, the third receiving terminal, and the fourth receiving terminal.

2. The high power test switching device according to claim 1, characterized in that: The signal output switch is a mechanical switch or a micro-electromechanical switch.

3. The high power test switching device according to claim 2, characterized in that: The signal output switch is a micro-electromechanical switch, and an output glass substrate channel switch is disposed between the first receiving end and the test signal output end, between the second receiving end and the test signal output end, between the third receiving end and the test signal output end, and between the fourth receiving end and the test signal output end.

4. The high power test switching device according to claim 1, characterized in that: The micro-electromechanical switch is connected to a digital signal auxiliary structure.

5. The high power test switching device according to claim 4, characterized in that: The digital signal auxiliary structure has a digital signal amplifier, a digital signal inverter connected to the digital signal amplifier, a plurality of relay switches connected to the digital signal inverter, and a power booster connected to each of the relay switches.

6. The high power test switching device according to claim 1, characterized in that: The micro-electromechanical switch is a switch of model MM5130.

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