Temperature compensation auxiliary heating film and processing method thereof

Abstract

The present invention discloses a method for processing a temperature-compensating auxiliary heating film, comprising the following steps: Step 1: Processing a polyimide film into a set shape having a wiring main body and an auxiliary heating sheet; Step 2: Coating a layer of cured film on the polyimide film; Step 3: Laying a conductive metal foil on the wiring main body and one of the auxiliary heating sheets; Step 4: Etching the conductive metal foil to form a heating circuit on the auxiliary heating sheet and a power supply circuit on the wiring main body; Step 5: Coating a layer of cured film on the etched conductive metal foil; Step 6: Determining whether all auxiliary heating sheets are processed with heating circuits: If so, executing Step 7; If not, executing Step 2; Step 7: After heating the polyimide film to a set temperature range, bending the auxiliary heating sheet so that the angle between the auxiliary heating sheet and the wiring main body is 60°-110°. The present invention also discloses a temperature-compensating auxiliary heating film that can perform temperature compensation on each hot well separately.

Description

Technical Field

[0001] The present invention belongs to the technical field of in vitro diagnosis, and specifically relates to a temperature compensation auxiliary heating film used for improving temperature uniformity in a PCR fluorescence quantitative analyzer and a processing method thereof. Background Art

[0002] During the PCR process, the temperature uniformity between the variable temperature metal hot wells directly affects the accuracy of the measurement. In the existing technology, there are mainly the following ways to improve the temperature uniformity between the hot wells: (1) edge insulation; (2) connecting the hot wells with ribs to improve the heat conduction between the hot wells; (3) installing a temperature compensation heating film. The edge insulation and increased heat conduction methods still cannot completely isolate the heat exchange between the variable temperature metal and the surrounding air, resulting in a lower temperature in the edge area of ​​the variable temperature metal. Although installing a temperature compensation heating film can improve the temperature uniformity of each hot well to a certain extent, the heat dissipated by each hot well of the variable temperature metal is uneven, and the heat required to be compensated is also different due to the different temperature differences between each hot well and the outside world at different temperature points. The existing method of using a heating film to compensate for heat loss can only achieve rough temperature compensation, but cannot perform precise temperature compensation for each hot well. The existing temperature compensation heating film generally uses a semiconductor cooler, and the cooling or heating power on the surface of the semiconductor cooler has a certain degree of unevenness. In view of this, it is necessary to design a temperature compensation auxiliary heating film that can independently compensate for the temperature of each hot well.

[0003] The most widely used circuit board on the market today is primarily a PCB. PCBs are generally categorized by the number of layers: single-sided, double-sided, and multi-layer. In a single-sided board, the electronic components and other components are concentrated on one side of the PCB, while the wiring is concentrated on the other side. This type of board offers simple manufacturing processes and low costs, but it cannot be used in overly complex products. When single-layer wiring is insufficient for electronic products, a double-sided board can be used. This means that both sides of the board have copper cladding and wiring, and vias can be used to connect the wiring between the two sides, creating the required network connections. A multi-layer board is a board constructed with three or more layers of conductive coating laminated with insulating material between them. Multi-layer boards offer high capacity, compact size, and a wide range of functions, but they are also more expensive.

[0004] The manufacturing process for circuit boards primarily relies on etching, which uses chemical reagents to remove unused copper or aluminum from the circuit board surface, polluting the environment. Furthermore, even flexible circuit boards made using existing methods tend to be stiff and lack flexibility. This is particularly true for electronic tags in products, where identification requires repeated use of the circuitry containing the tag. Therefore, stiff circuit boards are prone to bending and even damage. Summary of the Invention

[0005] In view of this, an object of the present invention is to provide a temperature compensation auxiliary heating film and a processing method thereof, which can meet the production and processing requirements of the temperature compensation auxiliary heating film.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] The present invention first proposes a method for processing a temperature-compensating auxiliary heating film. The temperature-compensating auxiliary heating film includes a wiring body, auxiliary heating sheets are spaced apart on one side or two opposite sides of the wiring body, and heating circuits are provided on the auxiliary heating sheets. The wiring body is provided with power supply circuits corresponding to the heating circuits on each of the auxiliary heating sheets.

[0008] The processing method comprises the following steps:

[0009] Step 1: Processing the polyimide film into a set shape having a wiring body and an auxiliary heat sheet;

[0010] Step 2: coating a layer of curing film on the polyimide film;

[0011] Step 3: Place the conductive metal foil on the wiring body and one of the auxiliary heat sheets;

[0012] Step 4: Etching the conductive metal foil to form a heating circuit on the auxiliary heating plate and a power supply circuit on the wiring body;

[0013] Step 5: Coating a layer of curing film on the etched conductive metal foil;

[0014] Step 6: Determine whether all auxiliary heating plates are processed with heating circuits: if so, proceed to step 7; if not, proceed to step 2;

[0015] Step 7: After heating the polyimide film to a set temperature range, bend the auxiliary heating sheet so that the angle between the auxiliary heating sheet and the wiring body is 60°-110°.

[0016] Furthermore, positioning plates are provided on both sides of the auxiliary heating plate, and a positioning area for positioning the heat well is formed between two adjacent positioning plates; in the step 1, the polyimide film is processed into a set shape having a wiring body, an auxiliary heating plate and a positioning plate.

[0017] Furthermore, in the step three, the metal conductive foil is laid on the wiring body and the auxiliary heat sheet by calendering.

[0018] Furthermore, in step seven, the heating temperature of the polyimide film is in the range of 250-300°C.

[0019] Furthermore, the heating temperature of the polyimide film was 280°C.

[0020] Furthermore, in step seven, the angle between the bent auxiliary heating plate and the wiring body is 90°.

[0021] Furthermore, the conductive metal foil is copper foil, silver foil or gold foil.

[0022] Furthermore, the heating circuit is a ring circuit.

[0023] Furthermore, the curing film is a PES hot melt film.

[0024] The present invention also provides a temperature compensation auxiliary heating film, which is obtained by using the temperature compensation auxiliary heating film processing method described above.

[0025] The beneficial effects of the present invention are:

[0026] The temperature compensation auxiliary heating film processing method of the present invention is to first process the polyimide film into a set shape including a wiring body and an auxiliary heating sheet, and then process the power supply circuit and the heating circuit respectively between the wiring body and the auxiliary heating sheet; in the process of processing the power supply circuit and the heating circuit, the curing film can be used to bond and fix the conductive metal foil on the one hand, and on the other hand, it can also isolate the power supply circuits corresponding to different auxiliary heating sheets, so that the power supply circuits of different auxiliary heating sheets are independent of each other; after the heating circuits are processed on all the auxiliary heating sheets, the polyimide film is finally heated to a set temperature and then the auxiliary heating sheet is bent, so that there is a set angle between the auxiliary heating sheet and the wiring body, so that the auxiliary heating sheet can be fitted with the outer wall of the heat well when in use. The temperature compensation auxiliary heating film processing method of the present invention is provided with multiple layers of power supply circuits on the wiring body, which can increase the structural rigidity of the wiring body; only one layer of heating circuit is provided on the auxiliary heating sheet, so that the auxiliary heating sheet has sufficient flexibility to fit with the outer surface of the heat well.

[0027] In this way, in the temperature compensation auxiliary heating film processed, the heating circuit and power supply circuit in each auxiliary heating sheet are independently set. In this way, the heating power of each heating circuit can be controlled separately, so that different heating powers can be used for different hot wells for temperature compensation, thereby improving the temperature uniformity of the hot well. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to make the purpose, technical solutions and beneficial effects of the present invention more clear, the present invention provides the following drawings for illustration:

[0029] Figure 1 Schematic diagram of the structure of an embodiment of a PCR fluorescence quantitative analyzer;

[0030] Figure 2 This is a schematic diagram of the structure of the PCR fluorescence quantitative analyzer after the shell is hidden;

[0031] Figure 3 It is a structural schematic diagram of the temperature control device;

[0032] Figure 4 This is an exploded view of the temperature control device;

[0033] Figure 5 This is a schematic diagram of the structure of the temperature compensation auxiliary heating film;

[0034] Figure 6 This is a schematic diagram of the structure after the temperature-changing metal and the temperature compensation auxiliary heating film are assembled;

[0035] Figure 7 A schematic diagram of the coordination relationship between one set of thermal wells and the temperature compensation auxiliary heating film;

[0036] Figure 8 This is a flow chart of an embodiment of a method for processing a temperature compensation auxiliary heating film according to the present invention;

[0037] Figure 9 The figure is a flow chart of a method for controlling the temperature of variable-temperature metal in a temperature control device.

[0038] 10-housing; 11-top hole; 12-heat cover device; 13-temperature control device; 14-photoelectric module; 15-control module; 16-power module;

[0039] 50-heat cover bracket; 51-bracket bottom plate; 59-heat well cover plate; 70-heat well through hole;

[0040] 71-base plate; 72-temperature-variable metal; 73-heat well; 74-temperature compensation component; 75-temperature control element; 76-first heat-conducting layer; 77-second heat-conducting layer; 78-heat dissipation cover; 79-heat dissipation channel; 80-heat dissipation fan; 81-heat sink; 82-temperature compensation auxiliary heating film; 83-wiring body; 84-auxiliary heating plate; 85-power supply interface; 86-positioning plate; 87-positioning area; 88-fitting plane; 89-connection port; 90-optical fiber; 91-positioning plate; 92-temperature compensation control board. DETAILED DESCRIPTION

[0041] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0042] like Figure 1-2As shown, the PCR fluorescence quantitative analyzer of this embodiment includes a housing 1, with a top hole 11 defined on the top surface of the housing 1. Housing 1 houses a thermal cover assembly 12, a temperature control device 13, a photoelectric module 14, a control module 15, and a power module 16. The thermal cover assembly includes a thermal cover module, which together with the temperature control device 13 constitute the temperature control system of this embodiment. The thermal cover module comprises a thermal cover assembly and a thermal cover support 50. The thermal cover support 50 includes a support base 51, on which a heat well cover 59 is provided. The temperature control device 13 is disposed below the heat well cover 59. The heat well cover 59 is provided with a heat well through hole 70. The temperature control device 13 is provided with a heat well 73 corresponding to the heat well through hole 70. The reagent tube 2 is placed into the heat well 73 through the heat well through hole 70. In this embodiment, the photoelectric module 14 and the control module 15 are both located on the same side of the temperature control device 13, and are mounted below the support base 51 in the space not occupied by the temperature control device 13. The power module 16 is mounted on both ends of the bracket base plate 51 .

[0043] The temperature control device 13 is arranged below the heat well cover plate 59. Figure 3-4 As shown, the temperature control device 13 of this embodiment includes a base plate 71, a positioning plate 91 mounted above the base plate 71, and a variable temperature metal 72 mounted on the positioning plate 91. A temperature control assembly for controlling the temperature increase or decrease of the variable temperature metal 72 is located between the base plate 71 and the variable temperature metal 72. A heat dissipation assembly for dissipating heat is located below the base plate 71. A heat well 73 is located on the variable temperature metal 72, and a heat well cover 59 is provided with a heat well through hole 70 corresponding to each heat well 73. Thus, a reagent tube can be placed into the corresponding heat well 73 through the heat well through hole 70. In this embodiment, the temperature control assembly includes a temperature control element 75 mounted between the base plate 71 and the variable temperature metal 72. A first heat conductive layer 76 is located between the temperature control element 75 and the base plate 71, and a second heat conductive layer 77 is located between the temperature control element 75 and the variable temperature metal 72. Specifically, in this embodiment, the temperature control element 75 is a TEC, which can achieve the technical purpose of rapidly heating or cooling the variable temperature metal 72. The first and second heat-conducting layers 76 and 77 are made of graphene, which effectively improves heat conduction efficiency. In this embodiment, the heat dissipation assembly includes a heat dissipation cover 78 disposed below the base plate 71. A heat dissipation channel 79 is formed between the heat dissipation cover 78 and the base plate 71. A heat dissipation fan 80 is mounted on the heat dissipation cover 78. The bottom surface of the base plate 71 is provided with heat dissipation fins 81 located within the heat dissipation channel 79. Activating the heat dissipation fan 80 increases the airflow velocity within the heat dissipation channel 79, allowing heat dissipation to be rapidly achieved through the heat dissipation fins 81.

[0044] The temperature control device of this embodiment further includes a temperature compensation component 74 for performing temperature compensation on each heat well 73. The temperature compensation component 74 of this embodiment includes a temperature compensation auxiliary thermal film 82. Figure 5As shown, the temperature compensation auxiliary heating film 82 includes a wiring body 83, and auxiliary heating sheets 84 are provided on one side or on two opposite sides of the wiring body 83. A heating circuit (not shown in the figure) is provided on the auxiliary heating sheet 84. A power supply circuit (not shown in the figure) is provided on the wiring body 83 in a one-to-one correspondence with the heating circuit on each auxiliary heating sheet 84. The wiring body 83 of this embodiment is provided with a power supply interface 85. The auxiliary heating sheets 84 are provided in a one-to-one correspondence with the heat well 73, and the auxiliary heating sheets 84 are attached to the outer wall of the corresponding heat well 73. On both sides of the auxiliary heating sheet 84 of this embodiment, there are respectively provided positioning sheets 86 provided on the wiring body 83, and a positioning area 87 for positioning the heat well 73 is formed between two adjacent positioning sheets 86. In this way, the auxiliary heating sheet 84 can be conveniently positioned with respect to the corresponding heat well 73. In a preferred embodiment of this embodiment, the auxiliary heating sheet 84 is perpendicular to the wiring body 83, and a bonding plane 88 is provided on the outer wall of the heat well 73, and the auxiliary heating sheet 84 is attached to the bonding plane 88. Specifically, the temperature compensation assembly 74 also includes a temperature compensation control board 92. A power supply interface 85 is provided on the wiring body 83. The temperature compensation control board 92 is connected to the temperature compensation auxiliary heating film 82 via the power supply interface 85 and controls the temperature compensation power of each power supply circuit. Specifically, the temperature compensation control board 92 of this embodiment is mounted on the side wall of the heat dissipation channel 79.

[0045] The heat wells 73 are provided as at least one group, each group including one or two rows of heat wells 73 arranged in a linear array, and the temperature compensation auxiliary thermal film 82 is provided in a one-to-one correspondence with each group of heat wells 73. Figure 6 As shown, in this embodiment, the heat wells 73 are set to 6 groups, and the temperature-variable metal can also be set in a one-to-one correspondence with each group of heat wells 73, that is, the temperature-variable metal 72 is set to 6 pieces, and the heat wells 73 belonging to the same group are set on the corresponding piece of temperature-variable metal 72. Figure 7 As shown, each group of heat wells 73 includes two rows of heat wells 73 arranged in a linear array. When the temperature compensation auxiliary heating film 82 is installed, the wiring body 83 is placed between the two rows of heat wells 73. Auxiliary heating sheets 84 are respectively provided on both sides of the wiring body 83, and the auxiliary heating sheets 84 are attached to the corresponding heat wells 73. Of course, in some other embodiments, the temperature variable metal 72 can also be provided as a single piece, and all heat wells 73 are provided on the single piece of temperature variable metal 72; of course, the temperature variable metal 72 can also be provided as two or more pieces, and each piece of temperature variable metal 72 is provided with at least one group of heat wells 73. This will not be repeated here.

[0046] In this embodiment, each hot well is provided with two connection ports 89, each of which is connected to two optical fibers 90. Specifically, the optoelectronic module 14 is provided with an excitation fiber interface and a receiving fiber interface corresponding to each hot well 73, and the two optical fibers are connected to the corresponding excitation fiber interface and receiving fiber interface, respectively.

[0047] The specific implementation of the method for processing the temperature compensation auxiliary heating film in this embodiment is described in detail below.

[0048] like Figure 8 As shown, a method for processing a temperature compensation auxiliary heating film in this embodiment includes the following steps:

[0049] Step 1: Processing the polyimide film into a predetermined shape having a wiring body 83 , an auxiliary heat plate 84 and a positioning plate 86 .

[0050] Step 2: Coating a layer of curing film on the polyimide film for pasting the conductive metal foil. In a preferred embodiment of this embodiment, the curing film is a PES hot-melt film.

[0051] Step 3: Lay the conductive metal foil on the wiring body 83 and one of the auxiliary heating sheets 84 without a heating circuit. In this embodiment, the conductive metal foil is laid on the wiring body 83 and the auxiliary heating sheet 84 by rolling.

[0052] Step 4: Etching the conductive metal foil to form a heating circuit on the auxiliary heating plate 84 and a power supply circuit on the wiring body 83 .

[0053] Step 5: Coating a layer of curing film on the etched conductive metal foil.

[0054] Step 6: Determine whether all auxiliary heating plates 84 are processed with heating circuits: If yes, go to step 7; if not, go to step 2;

[0055] Step 7: After heating all the polyimide films with heating circuits on the auxiliary heating sheets 84 to a set temperature range, bend the auxiliary heating sheets 84 so that the angle between the auxiliary heating sheets and the wiring body is 60°-110°. In this embodiment, the heating temperature range of the polyimide film is 250-300°C, and preferably, the heating temperature of the polyimide film is 280°C. In a preferred embodiment of this embodiment, the angle between the bent auxiliary heating sheets and the wiring body is 90°, that is, the bent auxiliary heating sheets are perpendicular to the wiring body.

[0056] In this embodiment, the conductive metal foil is copper foil, silver foil or gold foil; and the heating circuit is a ring circuit.

[0057] The following describes in detail the specific implementation of the method for controlling the temperature of the variable temperature metal in the temperature control device after adopting the temperature compensation auxiliary heating film 82.

[0058] like Figure 9 As shown, the temperature control method of the variable temperature metal in the temperature control device of this embodiment includes the following steps:

[0059] Step 1: Set M temperature compensation points in order from low to high, j = 1; the difference between two adjacent temperature compensation values ​​is 20-60° C. In this embodiment, the difference between two adjacent temperature compensation values ​​is 30° C.

[0060] Step 2: Use the temperature control component to control the temperature of the variable temperature metal to the temperature compensation point T j , and maintain the set temperature for the time.

[0061] Step 3: Use a thermometer to detect the temperature of each hot well and determine the temperature T of each hot well 73 ji and temperature compensation point T j Is the difference between the two values ​​within the set threshold range? If so, no temperature compensation is performed. If not, the auxiliary heat sheet 84 is used to perform temperature compensation on the corresponding hot well 73, so that the temperature of the corresponding hot well 73 is within the set time and the temperature compensation point T j The difference between them is within the set threshold range.

[0062] Record the temperature compensation point T of the heating circuit corresponding to each thermal well 73 j Temperature compensation power value P_T at ji .

[0063] Step 4: Determine whether the number of iterations j is equal to M: If so, stop the iteration and obtain the temperature compensation power value of each thermal well 73 at each temperature compensation point; if not, j=j+1 and loop through step 2.

[0064] Specifically, in this embodiment, in order to verify that each hot well 73 is at the temperature compensation point T j Temperature compensation power value P_T at ji To determine the reliability, when the number of iterations j is equal to M, temperature compensation verification is performed. The temperature compensation verification method includes the following steps:

[0065] 41) Use the temperature control component to control the temperature of the variable temperature metal to the temperature compensation point T m , m=1;

[0066] 42) Compensate power value P_T according to temperature mi Perform temperature compensation on each thermal well;

[0067] 42) Determine the temperature value T′ of each hot well 73 within the set time range after temperature compensation. mi The corresponding temperature compensation point T m Is the difference between the two values ​​within the set threshold range?

[0068] If yes, determine whether m is equal to M: If yes, determine whether the current temperature compensation verification times r is equal to the set maximum temperature compensation verification times R: If yes, the temperature compensation verification is completed and step 5 is executed; if not, execute step 41), r=r+1;

[0069] If not, proceed to step 2.

[0070] That is, in the continuous R temperature compensation verification, if the temperature of each hot well 73 at each temperature compensation point can be within the set threshold range, it means that each hot well is within the set threshold range at the temperature compensation point T j Temperature compensation power value P_T at ji The reliability is higher, and then proceed to step 5.

[0071] Step 5: Set the temperature T of the variable temperature metal and obtain two temperature compensation points T adjacent to the temperature T. k and T k+1 , and satisfy T k <T≤T k+1 ; Get the heating circuit corresponding to each hot well 73 at the temperature compensation point T k and T k+1 Temperature compensation power value P_T ki and P_T (k+1)i After the temperature of the variable metal reaches the temperature T by using the temperature rise and fall components, the temperature compensation power value of each hot well 73 is:

[0072]

[0073] Among them, m k 、n k and p k are coefficients, and:

[0074] m1=T k+1 -T k

[0075]

[0076]

[0077] Where, 1≤k<M, M≥2; 1≤i≤N, N is the number of hot wells;

[0078] Step 6: The temperature compensation power value P_T of the heating circuit corresponding to each hot well 73 calculated in step 5 is calculated. i Temperature compensation is performed for each thermal well.

[0079] The temperature compensation method for variable temperature metals of this embodiment sets a plurality of temperature compensation points and obtains the compensation power value required for each hot well to reach a temperature within a set threshold range of the corresponding temperature compensation point at different temperature compensation points. Thus, in actual use, two temperature compensation points adjacent to the set temperature of the variable temperature metal can be queried, and the power compensation value of each hot well at the two adjacent temperature compensation points can be calculated to obtain the power compensation value of each hot well at the current set temperature of the variable temperature metal. After the variable temperature metal reaches the set temperature, the calculated power compensation value can be used to perform temperature compensation on each hot well, so that the temperature of each hot well reaches the threshold range of the set temperature, thereby improving the temperature uniformity between the hot wells.

[0080] The above embodiments are merely preferred embodiments for the purpose of fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

Claims

1. A method for processing a temperature compensation auxiliary heating film, characterized in that: The temperature compensation auxiliary heating film includes a wiring body, one side or two opposite sides of the wiring body are provided with auxiliary heating sheets, the auxiliary heating sheets are provided with heating circuits, and the wiring body is provided with power supply circuits corresponding to the heating circuits on each of the auxiliary heating sheets. The processing method comprises the following steps: Step 1: Processing the polyimide film into a set shape having a wiring body and an auxiliary heat sheet; Step 2: coating a layer of curing film on the polyimide film; Step 3: Place the conductive metal foil on the wiring body and one of the auxiliary heat sheets; Step 4: Etching the conductive metal foil to form a heating circuit on the auxiliary heating plate and a power supply circuit on the wiring body; Step 5: Coating a layer of curing film on the etched conductive metal foil; Step 6: Determine whether all auxiliary heating plates are processed with heating circuits: if so, proceed to step 7; if not, proceed to step 2; Step 7: After heating the polyimide film to a set temperature range, bend the auxiliary heating sheet so that the angle between the auxiliary heating sheet and the wiring body is 60°-110°.

2. The method for processing a temperature compensation auxiliary heating film according to claim 1, characterized in that: Positioning plates are provided on both sides of the auxiliary heating plate, and a positioning area for positioning the heat well is formed between two adjacent positioning plates; in the step 1, the polyimide film is processed into a set shape having a wiring body, an auxiliary heating plate and a positioning plate.

3. The method for processing a temperature compensation auxiliary heating film according to claim 1, wherein: In the step three, the metal conductive foil is laid on the wiring body and the auxiliary heat sheet by calendering.

4. The method for processing a temperature compensation auxiliary heating film according to claim 1, characterized in that: In the step seven, the heating temperature of the polyimide film is in the range of 250-300°C.

5. The method for processing a temperature compensation auxiliary heating film according to claim 4, characterized in that: The heating temperature of the polyimide film was 280°C.

6. The method for processing a temperature compensation auxiliary heating film according to claim 1, characterized in that: In the step seven, the angle between the bent auxiliary heating plate and the wiring body is 90°.

7. The method for processing a temperature compensation auxiliary heating film according to claim 1, characterized in that: The conductive metal foil is made of copper foil, silver foil or gold foil.

8. The method for processing a temperature compensation auxiliary heating film according to claim 1, characterized in that: The heating circuit is a ring circuit.

9. The method for processing a temperature compensation auxiliary heating film according to claim 1, characterized in that: The curing film is a PES hot melt film.

10. A temperature compensation auxiliary heating film, characterized in that: The temperature compensation auxiliary heating film is obtained by processing the temperature compensation auxiliary heating film according to any one of claims 1 to 5.

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