Horizontal copper deposition device for circuit board and use method thereof

Abstract

The present invention discloses a horizontal copper deposition device for a circuit board and a method for using the same, wherein the horizontal copper deposition device for a circuit board comprises: a cylinder; a conveying assembly for pulling the circuit board forward and moving horizontally; a waterway assembly comprising two water knives, the two water knives are arranged oppositely and located on the upper and lower sides of the circuit board and are provided with a plurality of densely arranged water outlets on the opposite sides, one end of each of the two water knives is connected to a water inlet pipe, a water pump is driven to pump copper deposition liquid to the water inlet pipe, and the liquid is sprayed toward one side of the circuit board through the water outlet holes; two anti-blocking components arranged one by one with the water knives, comprising a filter assembly for blocking particles from entering the water knives, and an ultrasonic vibrator placed in the water knives to reduce the particle aggregation in the water knives. By integrating anti-blocking components such as the filter assembly and the ultrasonic vibrator, the water knife blockage problem is effectively solved, the stability and production efficiency of the copper deposition process are improved, and at the same time, the maintenance cost is reduced and the utilization rate of the copper deposition liquid is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB copper deposition equipment, and in particular to a horizontal copper deposition device for a circuit board, and a method for using the horizontal copper deposition device for a circuit board. Background Art

[0002] In the electronics manufacturing industry, circuit boards are one of the core components of electronic devices. The manufacturing process of circuit boards includes multiple steps, among which the copper deposition process is a very critical link. This process uses a chemical substitution reaction to deposit a thin copper film on the uncoated substrate and a layer of copper on the hole wall to achieve circuit conduction of different layers and serve as a conductive lead for subsequent copper electroplating. Traditional copper deposition processes mostly use vertical copper deposition methods. In recent years, horizontal copper deposition methods have been widely favored due to their higher efficiency and better uniformity.

[0003] In some horizontal copper deposition processes, the circuit board is continuously treated with copper deposition solution to achieve uniform copper deposition. In order to ensure the quality of copper deposition, it is usually necessary to set a water jet component in the copper deposition cylinder, that is, to use water flow to impact the surface of the circuit board to ensure that the copper deposition solution can be evenly covered on the circuit board. However, there are some shortcomings of traditional water jet components:

[0004] 1. Water jet blockage problem: During the copper deposition process, the copper deposition solution contains a certain amount of solid particles or suspended matter. These impurities are easy to gather in the tiny water outlet holes of the water jet after long-term circulation, causing the water jet to be blocked. Once the water jet is blocked, it will not only affect the normal spraying of the copper deposition solution, but also reduce the copper deposition efficiency, and even cause uneven copper deposition on the circuit board, seriously affecting product quality.

[0005] 2. High maintenance cost: In order to solve the problem of water jet clogging, it is usually necessary to clean or replace the water jet regularly, which not only consumes a lot of manpower and material resources, but may also cause the production line to stop and affect production progress.

[0006] There are some tentative solutions to the above problems on the market, such as improving the water jet structure and using filtering devices, but most of these methods have certain limitations and cannot fundamentally solve the problem of water jet clogging. Therefore, developing a horizontal copper deposition device that can effectively avoid water jet clogging and increase the service life of the water jet has become a technical problem that urgently needs to be solved. Summary of the invention

[0007] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a horizontal copper deposition device for a circuit board, which effectively solves the water jet clogging problem by integrating anti-clogging components such as a filter assembly, an ultrasonic generator and an ultrasonic vibrating rod, improves the stability and production efficiency of the copper deposition process, and reduces maintenance costs and improves the utilization rate of the copper deposition solution.

[0008] The present invention also provides a method for using the horizontal copper deposition device for the above-mentioned circuit board.

[0009] A horizontal copper deposition device for a circuit board according to the present invention comprises:

[0010] The cylinder body stores copper plating solution to immerse the circuit board;

[0011] A conveying assembly, connected to the cylinder body and used to pull the circuit board forward and move horizontally;

[0012] A water circuit assembly is arranged on the cylinder body, and the water circuit assembly includes a driving water pump, a water inlet pipe and two water cutters. The two water cutters are arranged opposite to each other and are located on the upper and lower sides of the circuit board. The side walls of the two water cutters opposite to each other are each provided with a plurality of densely arranged water outlet holes. One end of the two water cutters is connected to the water inlet pipe. The driving water pump is used to pump copper plating solution to the water inlet pipe and spray it toward one side of the circuit board through the water outlet holes.

[0013] Two anti-clogging components are arranged one-to-one corresponding to the water jets, and the anti-clogging components include a filter assembly, an ultrasonic generator and an ultrasonic vibration rod. The filter assembly is connected to one end of the water jet facing the water inlet pipe to prevent particles from entering the water jet; the ultrasonic vibration rod is placed in the water jet, and the ultrasonic generator is connected to one end of the water jet away from the water inlet pipe. The ultrasonic generator is connected to and drives the ultrasonic vibration rod to operate to reduce the aggregation of particles in the water jet.

[0014] The horizontal copper deposition device for a circuit board according to the present invention has at least the following beneficial effects:

[0015] 1. Reduce water jet clogging: By setting a filter component at the inlet of the water jet, larger particles in the copper precipitation solution can be effectively intercepted to prevent them from entering the water jet, thereby greatly reducing the possibility of water jet clogging.

[0016] 2. Particle dispersion: The high-frequency vibration generated by the ultrasonic generator can disperse the particles in the water jet, reduce their aggregation, and thus reduce the deposition of particles inside the water jet, especially near the water outlet, further preventing the water jet from clogging.

[0017] 3. Extend the maintenance cycle: Since the water jet blockage phenomenon is effectively controlled, the maintenance frequency caused by blockage is reduced, thereby extending the maintenance cycle of the equipment and reducing the maintenance cost.

[0018] 4. Improve copper deposition efficiency: Reduced water jet blockage means that the copper deposition solution can be sprayed onto the surface of the circuit board more stably and evenly. In addition, the high-frequency vibration treatment of the copper deposition solution in the water jet can improve the uniformity of the copper deposition solution, thereby improving the copper deposition quality of the circuit board.

[0019] According to some embodiments of the present invention, a horizontal copper deposition device for a circuit board is described, wherein the water jet includes a cylindrical mounting portion and a square injection portion, a support frame is provided on the inner side wall of the cylinder body, the support frame is provided with an arc-shaped fixing groove, an upper end of the arc-shaped fixing groove is provided with an opening, one end of the cylindrical mounting portion is connected to the inner side wall of the cylinder body and is connected to the water inlet pipe, and the outer peripheral wall of the other end is elastically clamped with the arc-shaped fixing groove through the opening, and the water outlet is provided on the square injection portion and is connected to the interior of the cylindrical mounting portion.

[0020] According to some embodiments of the present invention, a horizontal copper deposition device for a circuit board further includes a buffer assembly, and the ultrasonic generator is installed at one end of the cylindrical mounting portion away from the water inlet pipe and is connected to the cylindrical mounting portion through the buffer assembly.

[0021] According to a horizontal copper deposition device for a circuit board described in some embodiments of the present invention, the buffer component includes a flexible connecting ring and an elastic mounting ring, the ultrasonic generator is provided with a connecting flange, the connecting flange is mounted on the flexible connecting ring, the inner side of the elastic mounting ring surrounds the flexible connecting ring and is mounted and fixed to the flexible connecting ring, and the outer side of the elastic mounting ring is pressed and fixed to the inner circumferential wall of the cylindrical mounting portion.

[0022] According to a horizontal copper plating device for a circuit board described in some embodiments of the present invention, the support frame is provided with a water receiving groove connected to the arc-shaped fixing groove, and the end of the cylindrical mounting portion facing away from the water inlet pipe is placed in the water receiving groove to receive the copper plating solution leaked from the connection between the ultrasonic generator and the cylindrical mounting portion.

[0023] According to a horizontal copper deposition device for a circuit board described in some embodiments of the present invention, the filter assembly includes a plurality of filter tubes which are sequentially socketed and have increasing mesh sizes to grade and filter particles. An installation groove is provided at one end of the water jet facing the water inlet pipe, and the outermost filter tube is plugged and fixed to the installation groove.

[0024] According to a horizontal copper deposition device for a circuit board described in some embodiments of the present invention, the filter tube includes a fixing portion and a filtering portion, the fixing portion is used to plug and fix the filter tube, the filtering portion is square, and the mesh holes of the filter tube are arranged on the wall surface of the filtering portion through the thickness direction of the filtering portion.

[0025] According to some embodiments of the present invention, a horizontal copper plating device for a circuit board is described, the conveying component includes a first roller pair and a second roller pair, the first roller pair is horizontally arranged in the cylinder body and immersed in the copper plating solution, the second roller pair is horizontally spaced apart from the first roller pair and is located outside the cylinder body, the second roller pair is connected to the negative pole, and the first roller pair is connected to the positive pole, and the circuit board enters the copper plating solution through the second roller pair and the first roller pair in turn to conduct the copper plating circuit.

[0026] According to a horizontal copper plating device for a circuit board described in some embodiments of the present invention, the water jet is provided with a first temperature sensor, the first temperature sensor is used to detect the temperature of the copper plating solution in the water jet, the cylinder body is provided with a second temperature sensor, the second temperature sensor is used to detect the temperature of the copper plating solution in the cylinder body, and the ultrasonic generator is provided with a control device, the control device communicates with the first temperature sensor and the second temperature sensor respectively, and is used to adjust the output power of the ultrasonic generator.

[0027] According to the use method described in the present invention, it is applied to a horizontal copper deposition device for a circuit board described in the present invention, and the use method includes the following steps: initially adding copper deposition solution: adding copper deposition solution into the cylinder body to immerse the conveying component; conveying the circuit board: after the initial addition of copper deposition solution, the conveying component horizontally conveys the circuit board into the cylinder body; replenishing copper deposition solution: after the initial addition of copper deposition solution, driving the water pump to pump the copper deposition solution to the water outlet of the water knife for spraying; running the ultrasonic generator: during the process of replenishing the copper deposition solution, the ultrasonic generator is operated at high frequency to remove particles from the water outlet of the water knife.

[0028] The method of use according to the present invention has at least the following beneficial effects: through the process of initially adding copper plating solution and replenishing copper plating solution, an adequate supply of copper plating solution is ensured, so that the circuit board can continuously receive copper plating treatment, thereby improving the copper plating efficiency; and, in combination with the anti-clogging component, while conveying the circuit board, it is ensured that the copper plating solution can be sprayed evenly onto the circuit board, avoiding the problem of uneven copper plating caused by water jet blockage, enhancing the uniformity of copper plating, and thus improving the quality of copper plating; in addition, by operating the ultrasonic generator at high frequency, the particles in the water outlet of the water jet are effectively removed, the risk of water jet blockage is reduced, the maintenance frequency and maintenance cost are reduced, the service life of the equipment is extended, and the continuity and stability of the copper plating process are ensured as a whole, which is conducive to maintaining the best working state of the copper plating solution, thereby ensuring the quality of copper plating.

[0029] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0031] Figure 1 This is a schematic diagram of the overall structure of a horizontal copper deposition device for a circuit board according to an embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the internal structure of a horizontal copper deposition device for a circuit board according to an embodiment of the present invention;

[0033] Figure 3 A schematic diagram of a conveying component, a water channel component and an anti-clogging component of a horizontal copper deposition device for a circuit board according to an embodiment of the present invention;

[0034] Figure 4 It is a cross-sectional schematic diagram of a water jet connection structure of a horizontal copper deposition device for a circuit board according to an embodiment of the present invention;

[0035] Figure 5 It is an exploded schematic diagram of a water jet connection structure of a horizontal copper deposition device for a circuit board according to an embodiment of the present invention;

[0036] Figure 6 The present invention is a flowchart of a method for using a horizontal copper deposition device for a circuit board according to an embodiment of the present invention.

[0037] Description of Figure Numbers:

[0038] Cylinder body 100; support frame 110; arc-shaped fixing groove 1101; opening 11011; water receiving groove 1102;

[0039] Conveying assembly 200; first roller pair 210; second roller pair 220; power shaft 230; gear pair 240;

[0040] Water channel assembly 300; water inlet pipe 310; water jet 320; water outlet hole 3201; cylindrical mounting portion 321; mounting groove 3211; square injection portion 322;

[0041] Anti-clogging component 400; filter assembly 410; fixing portion 4101; filter portion 4102; first filter tube 411; second filter tube 412; third filter tube 413; ultrasonic generator 420; connecting flange 421; ultrasonic vibration rod 430;

[0042] Buffer assembly 500; soft connecting ring 510; elastic mounting ring 520;

[0043] Circuit board 600. DETAILED DESCRIPTION

[0044] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0045] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0046] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0047] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0048] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0049] In the electronics manufacturing industry, circuit boards are one of the core components of electronic devices. The manufacturing process of circuit boards includes multiple steps, among which the copper deposition process is a very critical link. This process uses a chemical substitution reaction to deposit a thin copper film on the uncoated substrate and a layer of copper on the hole wall to achieve circuit conduction of different layers and serve as a conductive lead for subsequent copper electroplating. Traditional copper deposition processes mostly use vertical copper deposition methods. In recent years, horizontal copper deposition methods have been widely favored due to their higher efficiency and better uniformity.

[0050] In some horizontal copper deposition processes, the circuit board is continuously treated with copper deposition solution to achieve uniform copper deposition. In order to ensure the quality of copper deposition, it is usually necessary to set a water jet component in the copper deposition cylinder, that is, to use water flow to impact the surface of the circuit board to ensure that the copper deposition solution can be evenly covered on the circuit board. However, there are some shortcomings of traditional water jet components:

[0051] 1. Water jet blockage problem: During the copper deposition process, the copper deposition solution contains a certain amount of solid particles or suspended matter. These impurities are easy to gather in the tiny water outlet holes of the water jet after long-term circulation, causing the water jet to be blocked. Once the water jet is blocked, it will not only affect the normal spraying of the copper deposition solution, but also reduce the copper deposition efficiency, and even cause uneven copper deposition on the circuit board, seriously affecting product quality.

[0052] 2. High maintenance cost: In order to solve the problem of water jet clogging, it is usually necessary to clean or replace the water jet regularly, which not only consumes a lot of manpower and material resources, but may also cause the production line to stop and affect production progress.

[0053] There are some tentative solutions to the above problems on the market, such as improving the water jet structure and using filtering devices, but most of these methods have certain limitations and cannot fundamentally solve the problem of water jet clogging. Therefore, developing a horizontal copper deposition device that can effectively avoid water jet clogging and increase the service life of the water jet has become a technical problem that urgently needs to be solved.

[0054] For this reason, Figures 1 to 5As shown, a horizontal copper plating device for a circuit board proposed by the present invention includes a cylinder body 100, a conveying assembly 200 connected to the cylinder body 100, and a water channel assembly 300 arranged in the cylinder body 100, wherein the cylinder body 100 stores copper plating solution to immerse the circuit board 600, the conveying assembly 200 is connected to the cylinder body 100 and is used to pull the circuit board 600 forward horizontally, and the water channel assembly 300 is used to drive the copper plating solution to circulate and replenish the copper plating solution into the cylinder body 100. Specifically, the water circuit assembly 300 includes a driving water pump (not shown in the figure), a water inlet pipe 310 and two water knives 320, the two water knives 320 are arranged oppositely and located on the upper and lower sides of the circuit board 600, wherein the side walls of the two water knives 320 on the opposite side are provided with a plurality of densely arranged water outlet holes 3201, and one end of the two water knives 320 is connected to the water inlet pipe 310, and the driving water pump is used to pump the copper plating solution to the water inlet pipe 310, and spray it toward one side of the circuit board 600 through the water outlet holes 3201. Further, the water knives 320 are correspondingly arranged with anti-blocking components 400, and the anti-blocking components 400 can prevent the water knives 320 from being blocked. Specifically, the anti-blocking component 400 includes a filter assembly 410, an ultrasonic generator 420 and an ultrasonic vibration rod 430, and the filter assembly 410 is connected to one end of the water knife 320 facing the water inlet pipe 310 to prevent particles from entering the water knife 320. Furthermore, the ultrasonic vibration rod 430 is placed in the water jet 320, and the ultrasonic generator 420 is connected to the end of the water jet 320 away from the water inlet pipe 310. The ultrasonic generator 420 is connected to and drives the ultrasonic vibration rod 430 to operate, so as to reduce the aggregation of particles in the water jet 320. It should be noted that by setting the filter assembly 410 at the inlet of the water jet 320, the larger particles in the copper precipitation solution can be effectively intercepted to prevent them from entering the water jet 320, thereby greatly reducing the possibility of clogging of the water jet 320. Moreover, the high-frequency vibration generated by the ultrasonic generator 420 can disperse the particles in the water jet 320, reduce its aggregation, and further reduce the deposition of particles in the water jet 320, especially near the water outlet 3201, further preventing the clogging of the water jet 320. Furthermore, since the clogging phenomenon of the water jet 320 is effectively controlled, the maintenance frequency caused by clogging is reduced, thereby extending the maintenance cycle of the equipment and reducing the maintenance cost. It is easy to understand that the reduced clogging of the water jet 320 means that the copper plating solution can be sprayed onto the surface of the circuit board 600 more stably and evenly, and the high-frequency vibration treatment of the copper plating solution in the water jet 320 can improve the uniformity of the copper plating solution, thereby improving the copper plating quality of the circuit board 600.

[0055] Refer to 1 to Figure 3The conveying assembly 200 includes a power shaft 230 and a first roller pair 210, the first roller pair 210 is arranged horizontally in the cylinder 100 and immersed in the copper immersion solution, wherein the diameter of the first roller pair 210 forms a circuit board 600 channel, and the power shaft 230 connects and drives the first roller pair 210 to rotate to convey the circuit board 600 forward. In some embodiments, the power shaft 230 and the first roller pair 210 are connected by a gear pair 240, and the power shaft 230 can drive the first roller pair 210 to rotate when rotating, with a simple structure and stable transmission. In some embodiments, the power shaft 230 and the first roller pair 210 are coupled via a bevel gear set, and the two first rollers in the first roller pair 210 are coupled via a spur gear set. Furthermore, there are multiple groups of first roller pairs 210 arranged in a single row, and the power shaft 230 is provided with multiple bevel gears, which are respectively coupled to the multiple groups of first roller pairs 210. Thus, a single power is used to drive the first roller pair 210 to rotate, and the entire line of circuit boards 600 is transported more smoothly.

[0056] Furthermore, the conveying assembly 200 also includes a second roller pair 220, which is horizontally spaced apart from the first roller pair 210 and located outside the cylinder body 100. The second roller pair 220 is connected to the negative pole, and the first roller pair 210 is connected to the positive pole. The circuit board 600 enters the copper plating solution through the second roller pair 220 and the first roller pair 210 in turn to conduct the copper plating circuit, thereby accelerating the copper plating efficiency of the circuit board 600. It is easy to understand that when the copper plating solution in the cylinder 100 is in a water channel structure that is constantly circulated and extracted out and then drawn back into the cylinder 100, if the copper plating speed of the circuit board 600 is slow, more particulate impurities will fall off and re-enter the water jet 320 after circulation, which will increase the risk of clogging of the water jet 320. By setting a circuit conduction at the input of the circuit board 600, the copper ions can be effectively accelerated to adhere to the circuit board 600, thereby reducing particulate impurities and reducing impurities that re-enter the water jet 320 during circulation, further reducing the possibility of clogging of the water jet 320.

[0057] In some embodiments of the present invention, the water jet 320 can be conveniently installed on the cylinder body 100 and can be quickly and easily assembled and disassembled. Figures 3 to 5The water jet 320 includes a cylindrical mounting portion 321 and a square jetting portion 322. The inner wall of the cylinder body 100 is provided with a support frame 110. The support frame 110 is provided with an arc-shaped fixing groove 1101. The upper end of the arc-shaped fixing groove 1101 is provided with an opening 11011. One end of the cylindrical mounting portion 321 is connected to the inner wall of the cylinder body 100 and communicates with the water inlet pipe 310. The outer peripheral wall of the other end is elastically clamped with the arc-shaped fixing groove 1101 through the opening 11011. The water outlet 3201 is provided in the square jetting portion 322 and communicates with the inside of the cylindrical mounting portion 321. It is easy to understand that the design of the arc-shaped fixing groove 1101 ensures the firm installation of the water jet 320, prevents loosening or displacement caused by vibration and other reasons during the working process, and facilitates the rapid disassembly and assembly of the water jet 320 through the elastic clamping method, simplifies the maintenance process, and reduces the maintenance cost. In addition, the processing of the water outlet holes 3201 arranged on the square injection part 322 is more convenient. The evenly distributed water outlet holes 3201 can ensure that the copper plating solution can be evenly sprayed onto the circuit board 600, thereby improving the copper plating quality. It is easy to understand that the ultrasonic generator 420 will generate vibrations during operation, and the connection with the water jet 320 needs to avoid a rigid connection. In some embodiments of the present invention, the ultrasonic generator 420 is installed at one end of the cylindrical mounting part 321 away from the water inlet pipe 310, and is connected to the cylindrical mounting part 321 through a buffer assembly 500. Specifically, refer to Figure 4 and Figure 5 In some embodiments of the present invention, the buffer assembly 500 includes a soft connection ring 510 and an elastic mounting ring 520, the ultrasonic generator 420 is provided with a connection flange 421, the connection flange 421 is mounted on the soft connection ring 510, the inner side of the elastic mounting ring 520 surrounds the soft connection ring 510 and is fixed to the soft connection ring 510, and the outer side of the elastic mounting ring 520 is pressed and fixed to the inner circumferential wall of the cylindrical mounting portion 321. In addition, a flexible connection between the ultrasonic generator 420 and the water knife 320 is achieved. This design can effectively absorb the vibration generated by the ultrasonic vibration rod 430 during operation, prevent the vibration from being transmitted to other structural parts, and protect the equipment from damage. Furthermore, the ultrasonic generator 420, the connecting flange 421, the ultrasonic vibration rod 430 and the buffer assembly 500 form a module as a whole, and can be conveniently disassembled and maintained through the plug-in cooperation between the elastic mounting ring 520 and the inner wall of the water jet 320. It is convenient to install. When the module is not needed, it can be removed and the end of the water jet 320 away from the water inlet pipe 310 can be sealed with a cover. In addition, during application, there may still be leakage of medicine at the connection between the ultrasonic generator 420 and the water jet 320, especially when the output power of the ultrasonic generator 420 is relatively large. In this regard, refer to Figure 4 and Figure 5In some embodiments of the present invention, the support frame 110 is provided with a water receiving groove 1102 connected to the arc-shaped fixing groove 1101, and one end of the cylindrical mounting portion 321 away from the water inlet pipe 310 is placed in the water receiving groove 1102 to receive the copper precipitation solution leaked from the connection between the ultrasonic generator 420 and the cylindrical mounting portion 321. It should be noted that the water receiving groove 1102 can collect the leaked copper precipitation solution, reduce the loss of the solution, and improve the utilization rate of the solution. In addition, the design of the water receiving groove 1102 allows maintenance personnel to easily clean up the leaked solution, simplifying the maintenance process.

[0058] Conventional water jets only use single-tube filtration, which has poor filtration effect. Figure 4 and Figure 5 As shown, the filter assembly 410 includes a plurality of filter tubes which are sequentially connected and have increasing mesh numbers, so as to filter particles in stages. For example, the filter assembly 410 includes a first filter tube 411, a second filter tube 412 and a third filter tube 413 which are sequentially connected, and can filter particles step by step, ensuring that particles of different sizes can be effectively intercepted, thereby improving the filtering efficiency. In addition, a mounting groove 3211 is provided at one end of the water knife 320 facing the water inlet pipe 310, and the outermost filter tube is plugged and fixed with the mounting groove 3211. The installation and replacement of the filter assembly 410 are simple and quick, and are convenient for daily maintenance. Furthermore, the filter tube includes a fixing portion 4101 and a filter portion 4102, and the fixing portion 4101 is used to plug and fix the filter tube, and the filter portion 4102 is square, and the mesh of the filter tube is provided on the wall surface of the filter portion 4102 along the thickness direction of the filter portion 4102. Among them, the fixing part 4101 is a hollow disc or square disc (not shown in the figure), and the plug-in is more convenient; the filter part 4102 is a pyramid, which has a guiding function and is more convenient to plug in. In addition, the mesh holes opened on the plane of the filter tube are more convenient in processing. In some embodiments, the mesh holes are only provided on the outer peripheral wall of the filter part 4102, and the wall surface of the filter tube passing through the center line of the filter tube is a solid structure, so that the copper precipitation solution can expand radially outward from the filter tube after flowing into the filter tube instead of flowing straight in the axial direction of the filter tube along the entry direction, further improving the interception effect of particles in the copper precipitation solution.

[0059] In some embodiments of the present invention, the water jet 320 is provided with a first temperature sensor, the first temperature sensor is used to detect the temperature of the copper-plating solution in the water jet 320, the cylinder 100 is provided with a second temperature sensor, the second temperature sensor is used to detect the temperature of the copper-plating solution in the cylinder 100, and the ultrasonic generator 420 is provided with a control device, the control device communicates with the first temperature sensor and the second temperature sensor respectively, and is used to adjust the output power of the ultrasonic generator 420. In addition, the real-time monitoring of the temperature of the copper-plating solution inside the water jet 320 and the cylinder 100 is realized. This design helps to maintain the optimal conditions of the copper-plating process and improve the copper-plating effect. It should be noted that when the ultrasonic wave passes through the medium, it will cause the medium molecules to vibrate at a high frequency, and this vibration will generate friction and then be converted into heat energy. This heating method can generate local high temperature in a very short time, and the temperature of the copper-plating solution is one of the most important parameters for the copper-plating process. The appropriate temperature can ensure that the chemical reaction in the copper-plating solution reaches the optimal rate, thereby improving the quality and efficiency of the copper-plating. The temperature range of the copper-plating solution is usually set within a certain range to ensure a good copper-plating effect. In some applications, the recommended water temperature range for ultrasonic cleaning is between 50°C and 70°C. This temperature range can maximize cavitation, which is the phenomenon of bubbles bursting in liquids caused by ultrasound, thereby effectively breaking down and removing dirt. In some applications, the appropriate temperature of copper plating solution is usually set between 60°C and 80°C. Keeping the solution within this temperature range can ensure good copper plating results and help improve production efficiency and product quality.

[0060] In some embodiments, the first temperature sensor detects that the temperature of the copper plating solution in the water jet 320 is T1, and the second temperature detection sensor detects that the temperature of the copper plating solution in the cylinder 100 is T2. It is easy to understand that the heat generated by the ultrasonic generator 420 is Q=P*t, and the heat required for water heating is: Q=m⋅c⋅ΔT.

[0061] In specific applications,

[0062] When T2 < 60°C, the ultrasonic generator 420 is operated at full power.

[0063] When 60≤T2<65°C, and T1>T2, the ultrasonic generator 420 is operated at 80% of the full power; when 60≤T2<65°C, and T1<T2, the ultrasonic generator 420 is operated at the full power.

[0064] When 65≤T2<70°C, and T1>T2, the ultrasonic generator 420 is operated at 60% of the full power; when 65≤T2<70°C, and T1<T2, the ultrasonic generator 420 is operated at the full power.

[0065] When T2≥70°C, the operation of the ultrasonic generator 420 is suspended.

[0066] Refer to Figure 6 , a method of use according to an embodiment of the present invention, applied to a horizontal copper deposition device for a circuit board according to an embodiment of the present invention, comprises the following steps:

[0067] S100, first adding copper immersion solution: adding copper immersion solution into the cylinder 100 to immerse the conveying assembly 200;

[0068] S200, conveying the circuit board 600: after the copper plating solution is initially added, the conveying assembly 200 horizontally conveys the circuit board 600 into the cylinder 100;

[0069] S300, replenishing copper immersion solution: after the copper immersion solution is initially added, the water pump is driven to pump the copper immersion solution to the water outlet 3201 of the water jet 320 for spraying;

[0070] S400 , operating the ultrasonic generator 420 : in the process of replenishing the copper plating solution, the ultrasonic generator 420 is operated at a high frequency to remove particles from the water outlet 3201 of the water jet 320 .

[0071] According to the method of use of the embodiment of the present invention, a horizontal copper plating device for a circuit board applied to the embodiment of the present invention ensures a sufficient supply of copper plating solution through the process of initially adding copper plating solution and replenishing copper plating solution, so that the circuit board 600 can continuously receive copper plating treatment, thereby improving the copper plating efficiency; and, combined with the anti-clogging component 400, while conveying the circuit board 600, it ensures that the copper plating solution can be evenly sprayed onto the circuit board 600, avoiding the problem of uneven copper plating caused by clogging of the water jet 320, enhancing the uniformity of copper plating, and thus improving the quality of copper plating; in addition, by operating the ultrasonic generator 420 at high frequency, the particles in the water outlet 3201 of the water jet 320 are effectively removed, reducing the risk of clogging of the water jet 320, reducing the maintenance frequency and maintenance cost, extending the service life of the equipment, ensuring the continuity and stability of the copper plating process as a whole, and being conducive to maintaining the best working state of the copper plating solution, thereby ensuring the quality of copper plating.

[0072] Other structures and operations of the method of use according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0073] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A horizontal copper deposition device for a circuit board, characterized in that: include: The cylinder body stores copper plating solution to immerse the circuit board; A conveying assembly, connected to the cylinder body and used to pull the circuit board forward and move horizontally; A water circuit assembly is arranged on the cylinder body, and the water circuit assembly includes a driving water pump, a water inlet pipe and two water cutters. The two water cutters are arranged opposite to each other and are located on the upper and lower sides of the circuit board. The side walls of the two water cutters opposite to each other are each provided with a plurality of densely arranged water outlet holes. One end of the two water cutters is connected to the water inlet pipe. The driving water pump is used to pump copper plating solution to the water inlet pipe and spray it toward one side of the circuit board through the water outlet holes. Two anti-clogging components are arranged one by one with the water cutters, the anti-clogging components include a filter assembly, an ultrasonic generator and an ultrasonic vibration rod, the filter assembly is connected to one end of the water cutter facing the water inlet pipe to prevent particles from entering the water cutter; the ultrasonic vibration rod is placed in the water cutter, the ultrasonic generator is connected to one end of the water cutter away from the water inlet pipe, and the ultrasonic generator is connected to and drives the ultrasonic vibration rod to operate to reduce the aggregation of particles in the water cutter; The water jet is provided with a first temperature sensor, and the first temperature sensor is used to detect the temperature of the copper plating solution in the water jet. The cylinder body is provided with a second temperature sensor, and the second temperature sensor is used to detect the temperature of the copper plating solution in the cylinder body. The ultrasonic generator is provided with a control device, and the control device communicates with the first temperature sensor and the second temperature sensor respectively, and is used to adjust the output power of the ultrasonic generator.

2. A horizontal copper deposition device for a circuit board according to claim 1, characterized in that: The water knife includes a cylindrical mounting portion and a square injection portion. The inner side wall of the cylinder body is provided with a support frame, and the support frame is provided with an arc-shaped fixing groove. The upper end of the arc-shaped fixing groove is provided with an opening. One end of the cylindrical mounting portion is connected to the inner side wall of the cylinder body and is connected to the water inlet pipe, and the outer peripheral wall of the other end is elastically clamped with the arc-shaped fixing groove through the opening. The water outlet is provided in the square injection portion and is connected to the interior of the cylindrical mounting portion.

3. A horizontal copper deposition device for a circuit board according to claim 2, characterized in that: It also includes a buffer component. The ultrasonic generator is installed at one end of the cylindrical mounting portion away from the water inlet pipe and is connected to the cylindrical mounting portion through the buffer component.

4. The horizontal copper deposition device for a circuit board according to claim 3, characterized in that: The buffer assembly includes a soft connecting ring and an elastic mounting ring. The ultrasonic generator is provided with a connecting flange, and the connecting flange is mounted on the soft connecting ring. The inner side of the elastic mounting ring surrounds the soft connecting ring and is mounted and fixed to the soft connecting ring. The outer side of the elastic mounting ring is pressed and fixed to the inner circumferential wall of the cylindrical mounting portion.

5. A horizontal copper deposition device for a circuit board according to any one of claims 2 to 4, characterized in that: The support frame is provided with a water receiving groove connected to the arc-shaped fixing groove, and the end of the cylindrical mounting part away from the water inlet pipe is placed in the water receiving groove to receive the copper plating solution leaked from the connection between the ultrasonic generator and the cylindrical mounting part.

6. The horizontal copper deposition device for a circuit board according to claim 1, characterized in that: The filter assembly includes a plurality of filter tubes which are sequentially connected and have increasing mesh sizes to grade and filter particles. An installation groove is provided at one end of the water jet facing the water inlet pipe, and the outermost filter tube is plugged and fixed to the installation groove.

7. The horizontal copper deposition device for a circuit board according to claim 6, characterized in that: The filter tube comprises a fixing part and a filtering part, the fixing part is used for inserting and fixing the filter tube, the filtering part is square-shaped, and the mesh holes of the filter tube are arranged on the wall surface of the filtering part through the thickness direction of the filtering part.

8. The horizontal copper deposition device for a circuit board according to claim 1, characterized in that: The conveying assembly includes a first roller pair and a second roller pair, the first roller pair is horizontally arranged in the cylinder body and immersed in the copper plating solution, the second roller pair is horizontally spaced apart from the first roller pair and is located outside the cylinder body, the second roller pair is connected to the negative electrode, and the first roller pair is connected to the positive electrode, and the circuit board enters the copper plating solution through the second roller pair and the first roller pair in turn to conduct the copper plating circuit.

9. Method of use, characterized in that: A horizontal copper deposition device for a circuit board as claimed in any one of claims 1 to 8, The method of use comprises the following steps: Initial copper precipitation solution: Pour copper precipitation solution into the cylinder until the conveying components are submerged; Conveying circuit boards: After the copper plating solution is initially added, the conveying assembly horizontally conveys the circuit boards into the cylinder; Replenishing copper immersion solution: After the copper immersion solution is added for the first time, the water pump is driven to pump the copper immersion solution to the water outlet of the water jet for spraying; Run the ultrasonic generator: During the process of replenishing the copper plating solution, run the ultrasonic generator at high frequency to remove particles from the water jet outlet.

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