Micro-LED display unit and manufacturing method

Abstract

The invention discloses a Micro-LED display unit and a manufacturing method of the Micro-LED display unit. According to the method, the red light-emitting unit, the green light-emitting unit and the blue light-emitting unit are packaged in the Mmicro-LED display unit, and the operation amount of welding installation in mass transfer is reduced. In addition, according to the method, wavelength conversion is carried out on blue light beams emitted by the blue light LED chip through wavelength conversion units such as the quantum dot material layer, and a red light LED chip and a green light LED chip which are low in light emitting efficiency are prevented from being directly used. In order to guarantee the wavelength conversion efficiency, the method adopts a blue light LED chip with a wave band with relatively good wavelength conversion efficiency to be matched with a wavelength conversion unit so as to generate a red light beam and a green light beam; meanwhile, according to the method, a blue light LED chip of another wave band is adopted to serve as blue light output of the whole display unit, so that the whole color gamut is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a Micro-LED display unit and a manufacturing method thereof. Background Art

[0002] As a new generation of display technology, Micro LED has higher brightness, better luminous efficiency, and lower power consumption than the existing Organic Light-Emitting Diode (OLED) technology, and has great application prospects. In view of the fact that the yield and cost issues of the current mass transfer and mass repair technologies still cannot achieve large-scale productization, the industry has proposed the MIP (Micro-LED in Package) technical solution for Micro-LED display to accelerate the industrialization process of Micro-LED display. That is, the Micro-LED chip is pre-packaged in a small display unit in advance, and then the display unit with pre-packaged Micro-LED chips is transferred to the corresponding PCB and glass-based display circuit by using relatively mature technology. This technical solution has the feasibility of high technical maturity and low expected cost. However, due to the low light output efficiency of red light and other reasons, the overall light output efficiency of the LED chip packaged in the display unit is often low. Summary of the invention

[0003] The purpose of this application is to provide a Micro-LED display unit and a manufacturing method, which can improve the above-mentioned problems.

[0004] The embodiment of the present application is implemented as follows:

[0005] In the first aspect, the present application provides a method for manufacturing a Micro-LED display unit, comprising the following steps S1 to S8, wherein S1, S2, etc. are merely step identifiers, and the execution order of the method is not necessarily in ascending order of numbers. For example, step S2 may be executed first and then step S1. This application does not impose any restrictions.

[0006] S1, providing a sapphire substrate, preparing M filter units arranged in an array on the sapphire substrate, where M is a positive integer greater than 2, and each filter unit includes a blue light filter unit and a red and green light filter unit;

[0007] S2, after covering the filter unit with a water and oxygen barrier layer, preparing a wavelength conversion unit on the water and oxygen barrier layer, so that the orthographic projection area of ​​the wavelength conversion unit on the sapphire substrate falls within the coverage range of the red and green filter unit, and the wavelength conversion unit is used to convert the blue light beam into a red light beam and a green light beam;

[0008] S3, a water and oxygen barrier layer is also covered on the wavelength conversion unit;

[0009] S4, filling the gaps between the wavelength conversion units with black glue, and preparing a light-transmitting filling layer on the wavelength conversion unit;

[0010] S5, fixing M light-emitting unit groups on the leveling layer, wherein the light-emitting unit groups include a blue light Micro-LED chip that outputs a first wavelength band and a blue light Micro-LED chip that outputs a second wavelength band, wherein the blue light Micro-LED chip that outputs the first wavelength band falls within the orthographic projection area of ​​the blue light filter unit in the orthographic projection area of ​​the leveling layer, and the blue light Micro-LED chip that outputs the second wavelength band falls within the orthographic projection area of ​​the wavelength conversion unit in the orthographic projection area of ​​the leveling layer;

[0011] S6, continue to use black glue to fill the gaps between each Micro-LED chip;

[0012] S7, cutting each layer structure along the light emitting direction of the light emitting unit group to separate each of the filter units to obtain M initial units;

[0013] S8, preparing signal contact pads connected to each of the Micro-LED chips on the initial unit to obtain M Micro-LED display units.

[0014] It can be understood that the present application provides a method for manufacturing a Micro-LED display unit, which encapsulates the red, green and blue light-emitting units in a Micro-LED display unit, reducing the amount of welding and installation operations in mass transfer. In addition, the present method uses a wavelength conversion unit such as a quantum dot material layer to convert the wavelength of the blue light beam emitted by the blue light LED chip, avoiding the direct use of red light LED chips and green light LED chips with low light output efficiency. In order to ensure the wavelength conversion efficiency, the present method uses a blue light LED chip with a better wavelength conversion efficiency in combination with a wavelength conversion unit to generate a red light beam and a green light beam; at the same time, the present method uses a blue light LED chip of another band as the blue light output of the entire display unit to improve the overall color gamut.

[0015] In an optional embodiment of the present application, the light-emitting unit group includes a first blue light Micro-LED chip, a second blue light Micro-LED chip and a third blue light Micro-LED chip, wherein the first blue light Micro-LED chip is used to emit a blue light beam of a first band, and the second blue light Micro-LED chip and the third blue light Micro-LED chip are used to emit a blue light beam of a second band.

[0016] It can be understood that the wavelength conversion unit in the present application is a conversion layer filled with quantum dot material. In order to ensure the wavelength conversion efficiency, the second blue light Micro-LED chip with a second band having a central wavelength of 450nm can be used as the light source for green light conversion; the third blue light Micro-LED chip with a second band having a central wavelength of 450nm can be used as the light source for red light conversion; in order to improve the overall color gamut, the first blue light Micro-LED chip with a first band different from the second band, such as the first band with a central wavelength of 460nm, can be used as the blue light source.

[0017] In an optional embodiment of the present application, the positive electrodes of the first blue light Micro-LED chip and the second blue light Micro-LED chip are arranged on a first straight line; the negative electrodes of the first blue light Micro-LED chip and the second blue light Micro-LED chip are arranged on a second straight line; the positive electrode of the third blue light Micro-LED chip is arranged on the second straight line, and the negative electrode of the third blue light Micro-LED chip is arranged on the first straight line.

[0018] It is understandable that in conventional display unit packaging, three LED chips are often arranged in sequence so that the positive electrodes of the three LED chips are all located on the same straight line, and the negative electrodes of the three LED chips are also located on the same straight line. However, when the signal contact pad of the display unit is subsequently prepared, the electrode routing of a certain LED chip often has to be edge-routed, and the edge routing often reduces the width of the metal wire, and the resistance effect is obvious when the current passes through, resulting in serious heating of the display unit. In this method, the edge LED chips are arranged in reverse, which can avoid edge routing of the edge chips and solve the heating problem of the display unit.

[0019] In an optional embodiment of the present application, the red and green filter unit includes at least one of the following:

[0020] Red light filter and green light filter;

[0021] A first long-wave pass filter and a second long-wave pass filter, wherein the cut-off wavelength of the first long-wave pass filter is equal to the minimum value of the green light band, and the cut-off wavelength of the second long-wave pass filter is also equal to the minimum value of the green light band;

[0022] A cholesteric liquid crystal component, the cholesteric liquid crystal component includes a lower electrode, a cholesteric liquid crystal layer and an upper electrode stacked in sequence, the cholesteric liquid crystal layer forms a first form of cholesteric grating when driven by a first electric field, which can transmit a red light band and reflect light beams in other bands, and forms a second form of cholesteric grating when driven by a second electric field, which is used to transmit a green light band and reflect light beams in other bands.

[0023] In an optional embodiment of the present application, the wavelength conversion unit includes at least one of the following:

[0024] A first wavelength conversion block containing green light quantum dot material and a second wavelength conversion block containing red light quantum dot material;

[0025] The third wavelength conversion block contains red light quantum dot material and green light quantum dot material.

[0026] In an optional embodiment of the present application, the above method further includes at least one of the following:

[0027] The coverage area of ​​the first wavelength conversion block is smaller than the coverage area of ​​the green light filter, and the coverage area of ​​the second wavelength conversion block is smaller than the coverage area of ​​the red light filter;

[0028] The coverage area of ​​the first wavelength conversion block is smaller than the coverage area of ​​the second long-wave pass filter, and the coverage area of ​​the second wavelength conversion block is smaller than the coverage area of ​​the second long-wave pass filter;

[0029] The sum of the coverage areas of the third wavelength conversion blocks is smaller than the coverage area of ​​the cholesteric liquid crystal components.

[0030] In an optional embodiment of the present application, the S8 further includes the following steps:

[0031] S81, coating the sapphire substrate with an insulating material to wrap each of the initial units;

[0032] S82, punching holes in the insulating material layer formed by the insulating material to expose the electrodes of the LED chip, and preparing signal contact pads connected to the electrodes on the surface of the insulating material layer to obtain M Micro-LED display units.

[0033] In an optional embodiment of the present application, the surface of the insulating material layer in the M icro-LED display unit is a rectangular surface; a first signal contact pad is arranged at the first corner of the rectangular surface, a second signal contact pad is arranged at the second corner of the rectangular surface, a third signal contact pad is arranged at the third corner of the rectangular surface, and a fourth signal contact pad is arranged at the fourth corner of the rectangular surface; the negative electrodes of each LED chip are connected in series in sequence through a straight line circuit to form a series circuit segment, and the first signal contact pad closest to the beginning or end of the series circuit segment is selected to be connected to the series circuit segment; the other signal contact pads are respectively connected to the positive electrodes of the LED chips closest to them.

[0034] In an optional embodiment of the present application, before step S2, the following steps are further included: S9, preparing M groups of liquid crystal driving touch pad groups on the sapphire substrate, each of the liquid crystal driving touch pad groups including an upper touch pad connected to the upper electrode and a lower touch pad connected to the lower electrode;

[0035] After step S8, the following steps are also included: S10, punching holes in the insulating material layer, the filling layer, and the black glue to expose the upper contact pad and the lower contact pad, and preparing an upper driving contact pad connected to the upper contact pad and a lower driving contact pad connected to the lower contact pad on the surface of the insulating material layer.

[0036] In a second aspect, the present application discloses a Micro-LED display unit, which is prepared by the method described in any one of the first aspects.

[0037] Beneficial effects:

[0038] The present application discloses a Micro-LED display unit and a manufacturing method. The method encapsulates the red, green and blue light-emitting units in a Micro-LED display unit, reducing the amount of welding and installation operations in mass transfer. In addition, the method uses a wavelength conversion unit such as a quantum dot material layer to convert the wavelength of the blue light beam emitted by the blue light LED chip, avoiding the direct use of red light LED chips and green light LED chips with low light output efficiency. In order to ensure the wavelength conversion efficiency, the method uses a blue light LED chip with a better wavelength conversion efficiency in combination with a wavelength conversion unit to generate a red light beam and a green light beam; at the same time, the method uses a blue light LED chip of another band as the blue light output of the entire display unit to improve the overall color gamut.

[0039] In order to make the above-mentioned objects, features and advantages of the present application more obvious and understandable, optional embodiments are specifically listed below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0041] Figures 1 to 10 The figure shows a schematic flow chart of a first method for manufacturing a Micro-LED display unit provided in the present application;

[0042] Fig.11 Shown is a schematic diagram of the steps of edge routing during the display unit preparation process;

[0043] Figures 12 to 15 Shown is a schematic diagram of the different steps of the second Micro-LED display unit manufacturing method provided in this application. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0045] The present application provides a first method for manufacturing a Micro-LED display unit, including the following steps S1 to S8, wherein S1, S2, etc. are merely step identifiers, and the execution order of the method is not necessarily in ascending order of numbers, for example, step S2 may be executed first and then step S1, and the present application does not impose any limitation thereto.

[0046] S1, providing a sapphire substrate 10, preparing M filter units arranged in an array on the sapphire substrate 10, M is a positive integer greater than 2, each filter unit includes a blue light filter 101, a red light filter 103 and a green light filter 102, such as Figure 1 shown.

[0047] The above-mentioned blue light filter 101 is used to transmit the blue light band light beam and reflect or absorb the light beams of other bands; the above-mentioned green light filter 102 is used to transmit the green light band light beam and reflect or absorb the light beams of other bands; the above-mentioned red light filter 103 is used to transmit the red light band light beam and reflect or absorb the light beams of other bands.

[0048] S2, such as Figure 2 As shown, after each filter unit is covered with a water and oxygen barrier layer 20 , a first wavelength conversion block 111 containing a green light quantum dot material and a second wavelength conversion block 112 containing a red light quantum dot material are prepared on the water and oxygen barrier layer 20 .

[0049] The water and oxygen barrier layer 20 is mainly made of at least one of the following materials: SiO2, Al2O3, TiO2, etc., to block water and oxygen.

[0050] In the embodiment of the present application, the first wavelength conversion block 111 is used to convert a blue light beam into a green light beam. The orthographic projection area of ​​the first wavelength conversion block 111 on the sapphire substrate 10 falls within the coverage range of the green light filter 102, so that the green light beam converted by the quantum dot material can be fully filtered by the green light filter 102, and output purer green light; the second wavelength conversion block 112 is used to convert a blue light beam into a red light beam. The orthographic projection area of ​​the second wavelength conversion block 112 on the sapphire substrate 10 falls within the coverage range of the red light filter 103, so that the red light beam converted by the quantum dot material can be fully filtered by the red light filter 103, and output purer red light.

[0051] S3, the water and oxygen barrier layer 20 is also covered on the wavelength conversion unit.

[0052] S4, fill the gap between the first wavelength conversion block 111 and the second wavelength conversion block 112 with black glue 30, and prepare a light-transmitting filling layer 300 on the first wavelength conversion block 111 and the second wavelength conversion block 112, such as Figure 3 shown.

[0053] In the embodiment of the present application, after step S2 and before step S4, a light-transmitting material layer 113 covering the blue light filter 101 may be prepared on the water and oxygen barrier layer 20, so that the light-transmitting material layer 113 is flush with the first wavelength conversion block 111 and the second wavelength conversion block 112. Figure 3 shown.

[0054] The material of the filling layer 300 can be acrylic resin, polyimide, poly(p-phenylene benzobisoxazole), silica gel, etc., and its purpose is to keep the thickness of each wavelength conversion block uniform.

[0055] The above-mentioned black plastic 30 can play a good role in preventing cross-talk of light, and avoid the cross-talk of red light, green light and blue light after conversion by quantum dots.

[0056] S5, M light-emitting unit groups are fixed on the leveling layer 300, and the light-emitting unit groups include a first blue light Micro-LED chip 121 that outputs a first wavelength band, a second blue light Micro-LED chip 122 that outputs a second wavelength band, and a third blue light Micro-LED chip 123; wherein the first blue light Micro-LED chip 121 falls within the orthographic projection area of ​​the blue light filter unit in the orthographic projection area of ​​the leveling layer 300, the second blue light Micro-LED chip 122 falls within the orthographic projection area of ​​the first wavelength conversion block 111 in the orthographic projection area of ​​the leveling layer 300, and the third blue light Micro-LED chip 123 falls within the orthographic projection area of ​​the second wavelength conversion block 112 in the orthographic projection area of ​​the leveling layer 300, as shown in FIG. Figure 4 shown.

[0057] The number of the above-mentioned light-emitting unit groups is consistent with the number of filter units, that is, each light-emitting unit group corresponds to only a single filter unit. A groove can be provided on the filling layer 300 to clamp each LED chip of the light-emitting unit group into the groove; or each LED chip can be bonded to the filling layer 300 using a light-transmitting adhesive.

[0058] It can be understood that the wavelength conversion unit in the present application is a conversion layer filled with quantum dot material. In order to ensure the wavelength conversion efficiency, the second blue light Micro-LED chip 122 with a second band having a central wavelength of 450nm can be used as the light source for green light conversion; the third blue light Micro-LED chip 123 with a second band having a central wavelength of 450nm can be used as the light source for red light conversion; in order to improve the overall color gamut, the first blue light Micro-LED chip 121 with a first band different from the second band, such as the first band with a central wavelength of 460nm, can be used as the blue light source.

[0059] S6, continue to use black glue 30 to fill the gaps between each Micro-LED chip, such as Figure 5 As shown, this prevents the side leakage of the blue light Micro-LED chip and improves the light output efficiency of the display unit.

[0060] S7, cutting each layer structure along the light emitting direction of the light emitting unit group to separate each filter unit to obtain M initial units. Figure 6 Shown is a single initial unit obtained by cutting.

[0061] S8, preparing signal contact pads connected to each Micro-LED chip on the initial unit to obtain M Micro-LED display units.

[0062] It can be understood that the present application provides a method for manufacturing a Micro-LED display unit, which encapsulates red, green and blue light-emitting units in one Micro-LED display unit, reducing the amount of welding and installation operations in mass transfer. In addition, the present method uses a wavelength conversion unit such as a quantum dot material layer to convert the wavelength of the blue light beam emitted by the blue light LED chip, avoiding the direct use of red light LED chips and green light LED chips with low light output efficiency. In order to ensure the wavelength conversion efficiency, the present method uses a blue light LED chip with a better wavelength conversion efficiency in combination with a wavelength conversion unit to generate a red light beam and a green light beam; at the same time, the present method uses a blue light LED chip of another band as the blue light output of the entire display unit to improve the overall color gamut.

[0063] In the embodiment of the present application, the first long-wave pass filter can be replaced by the red light filter 103. The first long-wave pass filter can transmit the red light and green light beams, and reflect or absorb the blue light beam with a wavelength smaller than the green light wavelength. After the blue light beam is converted into a green light beam by the first wavelength conversion block 111, it is filtered by the first long-wave pass filter, so that the blue light beam that is not converted by the quantum dot material is absorbed or reflected, and a purer red light is output.

[0064] In the embodiment of the present application, a second long-wave pass filter can be provided in place of the green light filter 102. The second long-wave pass filter can transmit the red light and green light beams, and reflect or absorb the blue light beam having a wavelength smaller than that of the green light. After the blue light beam is converted into a green light beam by the second wavelength conversion block 112, it is filtered by the second long-wave pass filter, so that the blue light beam that is not converted by the quantum dot material is absorbed or reflected, and a purer green light is output.

[0065] In an optional embodiment of the present application, step S8 includes the following steps S81 to S82.

[0066] S81, using insulating material coated on a sapphire substrate to wrap each initial unit, such as Figure 7 As shown, the insulating material forms an insulating material layer 40 .

[0067] S82, punching holes in the insulating material layer 40 formed of the insulating material to expose the six electrodes of the three LED chips, such as Figure 8 As shown; and prepare signal contact pads for connecting electrodes on the surface of the insulating material layer 40 to obtain individual Micro-LED display units, such as Fig. 9 One of the display units is shown.

[0068] In an optional embodiment of the present application, Figure 8 As shown, the first positive electrode 511 of the first blue light Micro-LED chip 121 and the second positive electrode 521 of the second blue light Micro-LED chip 122 are arranged on the first straight line L1; the first negative electrode 521 of the first blue light Micro-LED chip 121 and the second negative electrode 522 of the second blue light Micro-LED chip 122 are arranged on the second straight line L2; the third positive electrode 531 of the third blue light Micro-LED chip 123 is arranged on the second straight line L2, and the third negative electrode 523 of the third blue light Micro-LED chip 123 is arranged on the first straight line L1.

[0069] In an optional embodiment of the present application, the surface of the insulating material layer 40 in the Micro-LED display unit is a rectangular surface; Fig. 9As shown, a first signal contact pad 61 is arranged at the first corner of the rectangular surface, a second signal contact pad 62 is arranged at the second corner of the rectangular surface, a third signal contact pad 63 is arranged at the third corner of the rectangular surface, and a fourth signal contact pad 64 is arranged at the fourth corner of the rectangular surface; the negative electrodes of each LED chip are connected in series in sequence through a straight line circuit to form a series circuit segment, and the first signal contact pad 61 closest to the beginning or end of the series circuit segment is selected to be connected to the series circuit segment; the other signal contact pads are respectively connected to the positive electrodes of the nearest LED chips.

[0070] It is understandable that in conventional display unit packaging, three LED chips are often arranged in sequence so that the positive electrodes of the three LED chips are all located on the same straight line, and the negative electrodes of the three LED chips are also located on the same straight line. However, when the signal contact pad of the display unit is subsequently prepared, the electrode routing of a certain LED chip often has to be edge-routed, such as Fig.11 As shown, edge routing often reduces the width of the metal wire, and the resistance effect is obvious when current passes through, resulting in serious heating of the display unit. In this method, the edge LED chips are arranged in reverse, which can avoid edge routing of the edge chips and solve the heating problem of the display unit.

[0071] In an optional embodiment of the present application, after the above step S82, the positive and negative electrodes and wiring of the LED chip can be encapsulated by insulating materials, and only four signal contact pads are exposed for subsequent installation. Fig.10 shown.

[0072] The present application also provides a second method for manufacturing a Micro-LED display unit. Compared with the first method for manufacturing a Micro-LED display unit, the difference between the second method and the first method lies in the improvement of steps S1 and S2.

[0073] In step S1 of the present method, each filter unit prepared only includes a blue light filter 101 and a cholesteric liquid crystal component 70. Fig.12 As shown, since a single cholesteric liquid crystal component 70 is used to replace the red light filter 103 and the green light filter 102, the number of manufacturing steps is reduced. Fig.12 As shown, the cholesteric liquid crystal component 70 includes a lower electrode 71, a cholesteric liquid crystal layer 72 and an upper electrode 73 stacked in sequence. The cholesteric liquid crystal layer 72 forms a first-form cholesteric grating when driven by a first electric field, which can transmit the red light band and reflect light beams in other bands. When driven by a second electric field, it forms a second-form cholesteric grating for transmitting the green light band and reflecting light beams in other bands.

[0074] In an optional embodiment of the present application, before step S2, the following steps are further included: S9, preparing M groups of liquid crystal driving touch pad groups on the sapphire substrate 10, each liquid crystal driving touch pad group including an upper touch pad 81 connected to the upper electrode 73 and a lower touch pad 82 connected to the lower electrode 71, such as Fig.12 shown.

[0075] In step S2 of the present method, after the blue light filter 101 and the cholesteric liquid crystal component 70 are covered with the water-oxygen barrier layer 20, only the third wavelength conversion block 114 containing the red light quantum dot material and the green light quantum dot material is prepared on the water-oxygen barrier layer 20. Fig.13 As shown, the preparation steps are reduced by using a single third wavelength conversion block 114 to replace the first wavelength conversion block 111 and the second wavelength conversion block 112. The sum of the coverage areas of the third wavelength conversion block 114 is smaller than the coverage area of ​​the cholesteric liquid crystal component 70, so that the red light beam and the green light beam converted by the quantum dot material can fully pass through the cholesteric liquid crystal component 70 for selective row filtering, preventing the unconverted blue light beam from passing through the filter.

[0076] In an optional embodiment of the present application, the water and oxygen barrier layer 20 covers the cholesteric liquid crystal component 70, but the upper contact pad 81 and the lower contact pad 82 may be exposed. Fig.13 shown.

[0077] In an optional embodiment of the present application, after step S82, the following steps are further included: S10, punching holes in the insulating material layer 40, the filling layer 300, and the black glue 30 to expose the upper contact pad 81 and the lower contact pad 82, such as Fig.14 Subsequently, an upper drive contact pad 91 connected to the upper contact pad 81 and a lower drive contact pad 92 connected to the lower contact pad 82 are prepared on the surface of the insulating material layer 40, as shown in FIG. Fig.15 shown.

[0078] In a second aspect, the present application discloses a Micro-LED display unit, which is prepared by the method described in any one of the first aspects.

[0079] The expressions "first", "second", "the first" or "the second" used in various embodiments of the present disclosure may modify various components regardless of order and / or importance, but these expressions do not limit the corresponding components. The above expressions are only configured for the purpose of distinguishing an element from other elements. For example, a first user device and a second user device represent different user devices, although both are user devices. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present disclosure.

[0080] When one element (e.g., a first element) is referred to as being "(operably or communicatively) coupled" or "(operably or communicatively) coupled to" or "connected to" another element (e.g., a second element), it is understood that the one element is directly connected to the other element or the one element is indirectly connected to the other element via yet another element (e.g., a third element). Conversely, it is understood that when an element (e.g., a first element) is referred to as being "directly connected" or "directly coupled" to another element (the second element), no element (e.g., a third element) is interposed between the two.

[0081] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0082] The above description is only an optional embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above invention concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

[0083] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0084] The above description is only an optional embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above invention concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

[0085] The above description is only an optional embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing a Micro-LED display unit, characterized in that: include: S1, providing a sapphire substrate, preparing M filter units arranged in an array on the sapphire substrate, where M is a positive integer greater than 2, and each filter unit includes a blue light filter unit and a red and green light filter unit; S2, after covering the filter unit with a water and oxygen barrier layer, preparing a wavelength conversion unit on the water and oxygen barrier layer, so that the orthographic projection area of ​​the wavelength conversion unit on the sapphire substrate falls within the coverage range of the red and green filter unit, and the wavelength conversion unit is used to convert the blue light beam into a red light beam and a green light beam; S3, a water and oxygen barrier layer is also covered on the wavelength conversion unit; S4, filling the gaps between the wavelength conversion units with black glue, and preparing a light-transmitting filling layer on the wavelength conversion unit; S5, fixing M light-emitting unit groups on the leveling layer, wherein the light-emitting unit groups include a blue light Micro-LED chip that outputs a first wavelength band and a blue light Micro-LED chip that outputs a second wavelength band, wherein the blue light Micro-LED chip that outputs the first wavelength band falls within the orthographic projection area of ​​the blue light filter unit in the orthographic projection area of ​​the leveling layer, and the blue light Micro-LED chip that outputs the second wavelength band falls within the orthographic projection area of ​​the wavelength conversion unit in the orthographic projection area of ​​the leveling layer; S6, continues to use black glue to fill the gaps between each Micro-LED chip; S7, cutting each layer structure along the light emitting direction of the light emitting unit group to separate each of the filter units to obtain M initial units; S8, preparing signal contact pads connected to each of the Micro-LED chips on the initial unit to obtain M Micro-LED display units.

2. The method for manufacturing a Micro-LED display unit according to claim 1, characterized in that: The light-emitting unit group includes a first blue light Micro-LED chip, a second blue light Micro-LED chip and a third blue light Micro-LED chip, wherein the first blue light Micro-LED chip is used to emit a blue light beam of a first band, and the second blue light Micro-LED chip and the third blue light Micro-LED chip are used to emit a blue light beam of a second band.

3. The method for manufacturing a Micro-LED display unit according to claim 2, characterized in that: The positive electrodes of the first blue light Micro-LED chip and the second blue light Micro-LED chip are arranged on a first straight line; the negative electrodes of the first blue light Micro-LED chip and the second blue light Micro-LED chip are arranged on a second straight line; the positive electrode of the third blue light Micro-LED chip is arranged on the second straight line, and the negative electrode of the third blue light Micro-LED chip is arranged on the first straight line.

4. The method for manufacturing a Micro-LED display unit according to any one of claims 1 to 3, characterized in that: The red and green filter unit includes at least one of the following: Red light filter and green light filter; A first long-wave pass filter and a second long-wave pass filter, wherein the cut-off wavelength of the first long-wave pass filter is equal to the minimum value of the green light band, and the cut-off wavelength of the second long-wave pass filter is also equal to the minimum value of the green light band; A cholesteric liquid crystal component, the cholesteric liquid crystal component includes a lower electrode, a cholesteric liquid crystal layer and an upper electrode stacked in sequence, the cholesteric liquid crystal layer forms a first form of cholesteric grating when driven by a first electric field, which can transmit a red light band and reflect light beams in other bands, and forms a second form of cholesteric grating when driven by a second electric field, which is used to transmit a green light band and reflect light beams in other bands.

5. The method for manufacturing a Micro-LED display unit according to claim 4, characterized in that: The wavelength conversion unit includes at least one of the following: A first wavelength conversion block containing green light quantum dot material and a second wavelength conversion block containing red light quantum dot material; The third wavelength conversion block contains red light quantum dot material and green light quantum dot material.

6. The method for manufacturing a Micro-LED display unit according to claim 5, characterized in that: Include at least one of the following: The coverage area of ​​the first wavelength conversion block is smaller than the coverage area of ​​the green light filter, and the coverage area of ​​the second wavelength conversion block is smaller than the coverage area of ​​the red light filter; The coverage area of ​​the first wavelength conversion block is smaller than the coverage area of ​​the second long-wave pass filter, and the coverage area of ​​the second wavelength conversion block is smaller than the coverage area of ​​the second long-wave pass filter; The coverage area of ​​the third wavelength conversion block is smaller than the coverage area of ​​the cholesteric liquid crystal component.

7. The method for manufacturing a Micro-LED display unit according to claim 6, characterized in that: The S8 further comprises the following steps: S81, coating the sapphire substrate with an insulating material to wrap each of the initial units; S82, punching holes in the insulating material layer formed by the insulating material to expose the electrodes of the LED chip, and preparing signal contact pads connected to the electrodes on the surface of the insulating material layer to obtain M Micro-LED display units.

8. The method for manufacturing a Micro-LED display unit according to claim 7, characterized in that: The surface of the insulating material layer in the Micro-LED display unit is a rectangular surface; a first signal contact pad is provided at a first corner of the rectangular surface, a second signal contact pad is provided at a second corner of the rectangular surface, a third signal contact pad is provided at a third corner of the rectangular surface, and a fourth signal contact pad is provided at a fourth corner of the rectangular surface; The negative electrodes of each LED chip are connected in series in sequence through a straight line circuit to form a series circuit segment. The first signal contact pad closest to the beginning or end of the series circuit segment is selected to be connected to the series circuit segment; the other signal contact pads are respectively connected to the positive electrodes of the nearest LED chips.

9. The method for manufacturing a Micro-LED display unit according to claim 8, characterized in that: Before step S2, the method further includes the following steps: S9, preparing M groups of liquid crystal driving touch pad groups on the sapphire substrate, each of the liquid crystal driving touch pad groups including an upper touch pad connected to the upper electrode and a lower touch pad connected to the lower electrode; After step S8, the following steps are also included: S10, punching holes in the insulating material layer, the filling layer, and the black glue to expose the upper contact pad and the lower contact pad, and preparing an upper driving contact pad connected to the upper contact pad and a lower driving contact pad connected to the lower contact pad on the surface of the insulating material layer.

10. A Micro-LED display unit, characterized in that: Prepared by the method according to any one of claims 1 to 9.

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