Temperature control method and equipment based on DMF (Dimethyl Formamide) recovery device

Abstract

The embodiment of the invention relates to the field of DMF (Dimethyl Formamide) recovery, and discloses a temperature control method and equipment based on a DMF recovery device. The method comprises the following steps: acquiring actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device; according to the actual pressure, the actual temperature and a preset temperature and pressure compensation model, the temperature after pressure compensation is determined; wherein the temperature and pressure compensation model is used for determining an influence value of pressure change on the temperature according to the actual pressure, the reference pressure and a pressure compensation coefficient, and determining the temperature after pressure compensation according to the influence value and the actual temperature; and controlling the temperature in the tower to be maintained at a set value according to the temperature after pressure compensation. The technical problems of unreasonable temperature target setting and unstable product purity control in the existing rectifying tower control technology can be at least solved.

Description

Technical Field

[0001] The present application relates to the field of information technology, and in particular to a temperature control method and device based on a DMF recovery device. Background Art

[0002] In actual production, the requirement for distillation accuracy is that the material at the top of the tower must meet the design requirements of the product quality, while the composition of the material at the bottom of the tower generally does not affect the quality of the product. Therefore, in order to ensure the needs of the production process, both the bottom temperature and the top temperature are often required to be high.

[0003] N,N-dimethylformamide, referred to as DMF, is a colorless and transparent liquid that is miscible with water, alcohol, ether, ketone, ester and aromatic hydrocarbons. It is relatively stable to water, but decomposes when heated or alkaline. In industry, multi-effect evaporation is used to recover DMF from wastewater to obtain crude DMF, which is then distilled to obtain high-purity refined DMF. Since DMF is easily decomposed by heat, the distillation part adopts a double-tower process, which is a distillation tower and a deacidification tower. The main structure of the distillation tower is the tower body, tower tray, reboiler, condenser, reflux line and automatic control, on-site instruments and accessories, which are combined to complete the distillation process. Since temperature plays a vital role in the distillation process, the existing technology integrates temperature detection and control to improve the accuracy of temperature control.

[0004] However, the inventors found that there are at least the following technical problems in the related art: in the process of temperature detection and control, the impact of environmental changes on temperature is ignored, making the temperature unable to be used as an accurate reference for distillation tower control. Conventional control methods can only set fixed temperature target values ​​and cannot cope with environmental changes, thereby reducing the working efficiency of the DMF recovery distillation tower. In summary, in the related art, the existing distillation tower control technology has technical problems such as unreasonable temperature target setting and unstable product purity control. Summary of the invention

[0005] One purpose of the present application is to provide a temperature control method and equipment based on a DMF recovery device, at least to solve the technical problems of unreasonable temperature target setting and unstable product purity in the existing distillation tower control technology.

[0006] To achieve the above objectives, some embodiments of the present application provide the following aspects: In the first aspect, some embodiments of the present application also provide a temperature control method based on a DMF recovery device, the method comprising: obtaining the actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device; determining the temperature after pressure compensation according to the actual pressure, the actual temperature and a preset temperature-pressure compensation model; wherein the temperature-pressure compensation model is used to determine the impact value of the pressure change on the temperature according to the actual pressure, the reference pressure and the pressure compensation coefficient, and determine the temperature after pressure compensation according to the impact value and the actual temperature; according to the pressure-compensated temperature, the temperature in the control tower is maintained at a set value.

[0007] In a second aspect, some embodiments of the present application further provide an electronic device, comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0008] Compared with the related art, in the scheme provided by the embodiment of the present application, the actual pressure and actual temperature of the preset temperature measuring point in the DMF recovery device are obtained, and the temperature after pressure compensation is determined according to the actual pressure, the actual temperature and the preset temperature pressure compensation model; wherein the temperature pressure compensation model is used to determine the influence value of the pressure change on the temperature according to the actual pressure, the reference pressure and the pressure compensation coefficient, and the temperature after pressure compensation is determined according to the influence value and the actual temperature, and then the temperature in the control tower is maintained at the set value according to the temperature after pressure compensation. It can be seen that the present application can realize accurate monitoring of the operating state of the DMF recovery device by establishing a temperature pressure model compensation model. It can be understood that during the operation in the tower, pressure fluctuations are inevitable, and the pressure fluctuations will directly affect the temperature in the tower. The present application can reduce the error generated by the temperature control system by performing pressure compensation. Since the present application is combined with the pressure compensation coefficient, the temperature in the control tower can be maintained at a more accurate set value while correcting the temperature measurement value in real time, so as to solve the technical problems that the control technology of the distillation tower in the related art has unreasonable temperature target setting and unstable product purity control. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0010] Figure 1 An exemplary flow chart of a temperature control method based on a DMF recovery device according to some embodiments of the present application; Figure 2A comparison diagram of the key temperature points of the second concentration tower before and after the temperature and pressure compensation model is put into use in a temperature control method based on a DMF recovery device according to some embodiments of the present application; Figure 3 A comparison diagram of the effects of key temperature points of a distillation tower before and after the temperature and pressure compensation model is put into use in a temperature control method based on a DMF recovery device according to some embodiments of the present application; Figure 4 An exemplary flow chart of step S101 in a temperature control method based on a DMF recovery device according to some embodiments of the present application; Figure 5 An exemplary flow chart of a method for constructing a temperature and pressure compensation model in a temperature control method based on a DMF recovery device according to some embodiments of the present application; Figure 6 An exemplary flow chart for determining a reference temperature value of a preset temperature measuring point in a device manual according to the standard pressure, the actual temperature and the preset model setting conditions in a temperature control method based on a DMF recovery device according to some embodiments of the present application; Figure 7 This is an exemplary structural diagram of an electronic device provided according to some embodiments of the present application. DETAILED DESCRIPTION

[0011] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0012] First embodiment The first embodiment of the present application relates to a temperature control method based on a DMF recovery device. Figure 1 As shown, the method may include the following steps: Figure 1 As shown: Step S101, obtaining the actual pressure and actual temperature of a preset temperature measuring point in the DMF recovery device; Step S102, determining the temperature after pressure compensation according to the actual pressure, the actual temperature and a preset temperature-pressure compensation model; wherein the temperature-pressure compensation model is used to determine the influence value of the pressure change on the temperature according to the actual pressure, the reference pressure and the pressure compensation coefficient, and determine the temperature after pressure compensation according to the influence value and the actual temperature; Step S103, controlling the temperature in the tower to maintain at a set value according to the pressure-compensated temperature.

[0013] The following is a detailed description of each of the above steps.

[0014] For step S101 and step S102, specifically, in some examples, a preset number of temperature measuring points can be set at the top and bottom of each concentration tower in the DMF recovery device, and the top and bottom of the distillation tower, so as to use the temperature-pressure compensation model based on the temperature measuring points to implement temperature-pressure compensation control. Exemplarily, the number of the temperature measuring points can be, but is not limited to, 8, 10, etc., and this embodiment does not specifically limit this.

[0015] Exemplarily, a temperature sensor and a pressure sensor may be provided in the tower, and the controller of the DMF recovery device may read the real-time data of the pressure sensor and the temperature sensor in the tower through the OPC communication protocol, thereby obtaining the actual pressure and the actual temperature. Then, the controller may calculate the pressure-compensated temperature using the function provided by the temperature-pressure compensation model using the actual pressure and the actual temperature obtained by these measurements. That is, in some examples, the pressure-compensated temperature may be the final temperature value calculated by the controller for adjusting the temperature control.

[0016] Exemplarily, the pressure compensation coefficient Kp corresponding to the DMF recovery device can be determined by the historical data of the DMF recovery device and the Aspen full process simulation. The process may include: collecting the historical data of the DMF recovery device under different operating conditions, including key parameters such as temperature and pressure, analyzing these data, finding the relationship between temperature and pressure, using chemical process simulation software such as Aspen Plus, according to the collected data and the physical and chemical principles of the chemical process, simulating the operation process of the device, adjusting the value of the pressure compensation coefficient Kp by comparing the simulation results with the actual data, until the simulation results match the actual data, thereby determining the optimal pressure compensation coefficient Kp value. Once the pressure compensation coefficient Kp is determined, it can be used in the pressure compensation control formula to calculate the temperature after pressure compensation. The formula helps the controller to calculate the temperature value taking into account the pressure effect according to the actual measured temperature and pressure, as well as the reference pressure, so as to more accurately control the temperature in the tower. In this way, it can be ensured that the temperature control of the DMF recovery device is more accurate, adapts to pressure changes, and improves the operating efficiency and safety of the entire device.

[0017] Regarding step S103, specifically, in some examples, the pressure-compensated temperature can be used as a feedback signal and input into a distributed control system (DCS) to adjust the temperature control to ensure that the temperature in the tower is maintained at a set value, thereby improving the accuracy of temperature control and the operating efficiency of the device.

[0018] Optionally, in some embodiments, the temperature-pressure compensation model specifically determines the pressure-compensated temperature through the following function:

[0019] Among them, the represents the temperature after pressure compensation, the represents the actual temperature, the represents the pressure compensation coefficient, the represents the actual pressure, the represents the reference pressure, Represents the impact value.

[0020] Specifically, in some examples, the It can represent the actual temperature measured at the top of the No. 1 enrichment tower, which is the temperature value measured by the temperature sensor in real time; It can represent the actual pressure measured at the top of the No. 1 concentration tower, which is the pressure value measured by the pressure sensor in real time. is a preset pressure value used to compare with the actual pressure to calculate the effect of pressure changes on temperature. In the formula, Represents the difference between the actual pressure and the reference pressure. Exemplarily, the No. 1 concentration tower in the DMF recovery device can be the starting point of the entire recovery process, and the performance and control accuracy of the No. 1 concentration tower have a direct impact on the subsequent recovery and purification steps. Therefore, by accurately controlling the temperature and pressure of the No. 1 concentration tower, the entire recovery process can be ensured to operate efficiently and safely.

[0021] Specifically, in some examples, the pressure compensation coefficient is a proportionality factor that indicates the effect of a unit change in pressure on temperature. That is, if the pressure changes by one unit, the temperature will change by one unit accordingly. In some examples, the pressure compensation coefficient can be determined according to actual process conditions and equipment characteristics, and the embodiments of the present application do not specifically limit this.

[0022] Optionally, in some embodiments, the method for determining the pressure compensation coefficient may include: Obtaining the standard pressure and actual temperature of a preset temperature measuring point in the DMF recovery device; wherein the standard pressure and the actual temperature are data under standard conditions provided in the equipment manual of the DMF recovery device; A pressure compensation coefficient is determined according to the standard pressure and the actual temperature.

[0023] Specifically, in some examples, standard data can be obtained, that is, the standard pressure and actual temperature of the preset temperature measuring point can be obtained from the equipment manual of the DMF recovery device. These data represent the pressure and temperature values ​​under standard conditions, such as usually the design or optimal operating conditions. Then in actual operation, measure or record the actual temperature of the preset temperature measuring point in the DMF recovery device. This can be obtained by real-time monitoring by a temperature sensor. The standard pressure and actual temperature are then used to determine the pressure compensation coefficient. This coefficient can be used to adjust the output of the model to reflect the effect of actual pressure changes on temperature. The calculation of the pressure compensation coefficient may include the following steps: based on physical laws or empirical formulas, determine the theoretical effect of pressure changes on temperature; compare the difference between actual temperature and standard temperature to determine the actual effect of pressure changes on temperature under actual conditions; combine theoretical effects and actual effects to calculate the pressure compensation coefficient that can adjust the model output under standard conditions to actual conditions.

[0024] Further, in some examples, the calculated pressure compensation coefficient is applied to the temperature pressure compensation model to adjust the model output so that it more accurately reflects the temperature change under the actual pressure condition. Optionally, the effect of the pressure compensation coefficient can be verified in actual applications, such as the coefficient can be further adjusted to meet specific accuracy requirements. By this method, it can be ensured that the DMF recovery device can perform effective temperature control under different pressure conditions, thereby improving the safety and efficiency of operation.

[0025] In addition, in some examples, the advanced process control system (APC) controller can monitor the data of the system operation status in real time and make corrections and adjustments. It can perform a series of feedback correction measures to correct any deviations and ensure the effective implementation of the control strategy. Using this control method, the APC controller can accurately control the top temperature of each concentration tower, the top temperature of the distillation tower, the side line extraction temperature and the liquid level of the distillation tower to ensure that each tower operates stably under the best conditions. This not only significantly reduces energy consumption and improves product yield, but also ensures the safety and reliability of operation.

[0026] It is not difficult to find that, compared with the related art, in the scheme provided by the embodiment of the present application, by obtaining the actual pressure and actual temperature of the preset temperature measuring point in the DMF recovery device, and according to the actual pressure, the actual temperature and the preset temperature pressure compensation model, the temperature after pressure compensation is determined; wherein, the temperature pressure compensation model is used to determine the influence value of the pressure change on the temperature according to the actual pressure, the reference pressure and the pressure compensation coefficient, and according to the influence value and the actual temperature, the temperature after pressure compensation is determined, and then according to the temperature after pressure compensation, the temperature in the control tower is maintained at the set value. It can be seen that the present application can realize accurate monitoring of the operating state of the DMF recovery device by establishing a temperature pressure model compensation model. It can be understood that during the operation in the tower, pressure fluctuations are inevitable, and the pressure fluctuations will directly affect the temperature in the tower. The present application can reduce the error generated by the temperature control system by performing pressure compensation. Since the present application is combined with the pressure compensation coefficient, the temperature in the control tower can be maintained at a more accurate set value while correcting the temperature measurement value in real time, so that the technical problems of unreasonable temperature target setting and unstable product purity control in the control technology of the distillation tower in the related art can be solved.

[0027] It is worth emphasizing that, for details, see Figure 2 and Figure 3 As shown, Figure 2 This is a comparison chart of the key temperature points of the second concentration tower before and after the temperature and pressure compensation model is put into use. Figure 3 This is a comparison diagram of the effects of key temperature points of the distillation tower before and after the temperature and pressure compensation model is put into use. It can be seen that the present application can effectively solve the technical problem of unreasonable temperature target setting in the control technology of the distillation tower in the related art.

[0028] Second embodiment The second embodiment of the present application relates to a temperature control method based on a DMF recovery device. The second embodiment is an improvement on the first embodiment, and the specific improvement is: in the second embodiment of the present application, a specific implementation method for obtaining the actual pressure and actual temperature of a preset temperature measurement point in the DMF recovery device is provided.

[0029] Optionally, in some embodiments, the step of obtaining the actual pressure and actual temperature of a preset temperature measuring point in the DMF recovery device, that is, step S101, may include the following steps: Figure 4 As shown: Step S1011, determining the operating parameters of the tower in the DMF recovery device and the preset model input method; Step S1012, determining the actual pressure and actual temperature of the preset temperature measurement point according to the operating parameters, the preset model input method and the soft measurement model.

[0030] Optionally, in some embodiments, the operating parameters include any combination of the following: kettle liquid temperature, tower top temperature, tower top pressure, the tower top temperature is a set temperature, and the tower top pressure is a set pressure; the preset model input method includes: based on at least one of the operating parameters of the tower in the DMF recovery device, predicting the actual temperature and actual pressure of a preset temperature measuring point in the tower.

[0031] Specifically, in some examples, the operating parameters may include kettle liquid temperature, tower top temperature and tower top pressure. It can be understood that these parameters are the basic conditions for the normal and stable operation of the tower, and directly affect product quality and energy consumption. Specifically, the kettle liquid temperature is related to the temperature control in the concentration process; the tower top temperature can be used as the set temperature, which is a key parameter for the operation of the distillation tower and affects product quality and energy consumption; the tower top pressure can be used as the set pressure, which is the basic condition for the normal and stable operation of the tower. Once a fluctuation occurs, it will affect the change of the parameters of the entire tower and even the entire system.

[0032] Specifically, in some examples, the preset model input method is used to characterize how to input the operating parameters into the soft measurement model. Exemplarily, through the preset model input method, the actual temperature and actual pressure of the preset temperature measuring point in the tower can be predicted according to the operating parameters (kettle liquid temperature, tower top temperature, tower top pressure) of the tower in the DMF recovery device. These operating parameters can be used as input variables of the soft measurement model to predict or estimate the actual temperature and actual pressure of the preset temperature measuring point through the calculation of the model.

[0033] Exemplarily, the soft measurement model can be obtained by establishing a relationship between input parameters and output results. Optionally, in some embodiments, the soft measurement model includes: a neural network soft measurement model, a fuzzy reasoning soft measurement model, a least squares support vector machine model, a Kalman filter model, a generalized regression neural network model, an integrated learning model, a support vector regression model, and at least one of a partial least squares model.

[0034] Specifically, in some examples, the soft measurement model in the DMF recovery device can predict the actual temperature and actual pressure of the preset temperature measurement point by collecting the kettle liquid temperature, tower top temperature and tower top pressure through process parameters (such as temperature and pressure sensor readings). Exemplarily, the relationship between the input parameters and the output results can be established through mathematical methods, such as the least squares method, to obtain the soft measurement model.

[0035] It is not difficult to find that, compared with the related art, the embodiment of the present application can predict the actual temperature and actual pressure of the preset temperature measuring point of the tower in the DMF recovery device by determining the operating parameters of the tower (kettle liquid temperature, tower top temperature, tower top pressure) and the preset model input method, and combining the soft measurement model. Doing so can help relevant personnel to more accurately monitor and control the operation of the tower, thereby achieving the purpose of further optimizing the performance of the DMF recovery device.

[0036] Third embodiment The third embodiment of the present application relates to a temperature control method based on a DMF recovery device. The third embodiment is an improvement on the first embodiment, and the specific improvement is: in the third embodiment of the present application, another method for determining the influence value is provided.

[0037] Specifically, in some embodiments, the impact value can be determined by the following formula:

[0038] Among them, the represents the coefficient of thermal expansion, represents a constant term, which is used to characterize other factors affecting temperature.

[0039] Optionally, in some embodiments, the factors used to characterize other factors affecting temperature are specifically density. Correspondingly, the method for constructing the temperature and pressure compensation model may include the following steps: Figure 5 As shown: Step S201, constructing a temperature and pressure compensation model training set according to preset process parameters of the DMF recovery device; the preset process parameters include: recovery temperature, tower bottom temperature, tower top and tower bottom pressures, feed rate, bottom liquid volume, and bottom bottom liquid discharge rate; the training set includes several process parameters, each of which includes a reference temperature, a reference pressure, and a reference density; Step S202: Substitute the reference temperature, reference pressure, and reference density in the training set into the initial temperature and pressure compensation model to train and obtain the temperature and pressure compensation model.

[0040] Specifically, in some examples, the preset process parameters include recovery temperature, tower bottom temperature, tower top and tower bottom pressure, feed rate, bottom liquid volume, and bottom bottom liquid discharge volume. These parameters are key variables in the operation of the DMF recovery unit, and they directly affect the performance and efficiency of the unit. Specifically, in some examples, each process parameter includes reference temperature, reference pressure, and reference density, which are key inputs for model training. These reference values ​​represent standard or expected values ​​under specific process conditions and are used for comparison and correction with actual values.

[0041] Specifically, in some examples, the reference temperature, reference pressure, and reference density in the training set can be substituted into the initial temperature and pressure compensation model, and the model parameters can be adjusted through the training process so that it can accurately predict or correct the actual temperature and pressure. Exemplarily, the temperature and pressure compensation model can be trained through a machine learning algorithm, such as a BP neural network. After the training is completed, the temperature and pressure compensation model can predict the actual temperature and actual pressure of the preset temperature measurement point based on the input actual process parameters (including the actual temperature and the actual pressure). Since the prediction process takes into account other factors that affect the temperature, such as density, a more accurate compensation result can be provided.

[0042] It can be seen that this embodiment constructs a temperature and pressure compensation model by collecting and organizing the key process parameters of the DMF recovery device, uses these parameters to construct a training set, and trains and optimizes the model through the training set, ultimately achieving accurate prediction and compensation of the actual temperature and pressure, which helps to improve the operating accuracy and efficiency of the DMF recovery device.

[0043] Further optionally, in some embodiments, after substituting the reference temperature, reference pressure, and reference density in the training set into the initial temperature and pressure compensation model to train the temperature and pressure compensation model, the method may further include: According to the preset model setting conditions, the trained temperature and pressure compensation model is corrected until the trained temperature and pressure compensation model meets the preset accuracy test conditions, and the corrected temperature and pressure compensation model is output to obtain the final temperature and pressure compensation model; Among them, the preset model setting conditions include: the process parameters include reference density, and the process parameters include: standard temperature, standard pressure, and standard density; the preset accuracy test conditions include: the trained temperature and pressure compensation model outputs the compensation temperature at the standard temperature.

[0044] Specifically, in some examples, the trained temperature and pressure compensation model can be corrected according to preset model setting conditions, which include reference density in process parameters, as well as standard temperature, standard pressure, and standard density.

[0045] Specifically, in some examples, preset accuracy test conditions are set, for example, the trained temperature and pressure compensation model outputs the compensation temperature at the standard temperature to verify the accuracy of the model. The model is continuously corrected until the preset accuracy test conditions are met, and then the corrected temperature and pressure compensation model is output as the final temperature and pressure compensation model. This process ensures that the model can accurately predict the density changes under different temperature and pressure conditions, thereby effectively compensating the operating parameters in the DMF recovery device. In this way, the operating accuracy and efficiency of the device can be improved, and product quality and production safety can be ensured.

[0046] It is not difficult to find that in the embodiments of the present application, another method for determining the influence value is provided, which helps to improve the operating accuracy and efficiency of the DMF recovery device by taking into account the thermal expansion coefficient and the constant term used to characterize other factors affecting the temperature.

[0047] Fourth embodiment The fourth embodiment of the present application relates to a temperature control method based on a DMF recovery device. The fourth embodiment is an improvement on the third embodiment, and the specific improvement is that the fourth embodiment of the present application provides a specific implementation method for determining the reference temperature value of a preset temperature measurement point in the equipment manual.

[0048] Optionally, in some embodiments, the method further comprises: determining a reference temperature value of a preset temperature measurement point in a device manual according to the standard pressure, the actual temperature and the preset model setting conditions.

[0049] Specifically, in some examples, the standard pressure of the preset temperature measuring point can be obtained from the equipment manual of the DMF recovery device. This is under standard conditions, such as the pressure value of the design or optimal operating conditions. At the same time, obtain or measure the actual temperature of the preset temperature measuring point in the DMF recovery device. Then, determine the model setting conditions, which may include but are not limited to: the measurement range and accuracy of temperature and pressure, the response time of temperature and pressure, the control strategy of temperature and pressure, and the abnormal handling mechanism of temperature and pressure. Then, according to the standard pressure and actual temperature, and the preset model setting conditions, determine the reference temperature value of the preset temperature measuring point in the equipment manual. It can be understood that the reference temperature value is the basis for the model to be used for temperature compensation.

[0050] For example, the reference temperature value can be determined in the following ways: using a physical model or empirical formula, combining the standard pressure and the actual temperature, to calculate the theoretical temperature under the standard pressure; comparing the difference between the actual temperature and the theoretical temperature to determine the required compensation amount; adjusting the theoretical temperature according to the preset model setting conditions to obtain the reference temperature value. The determined reference temperature value is then applied to the temperature and pressure compensation model to perform temperature compensation calculations.

[0051] Optionally, in some embodiments, determining the reference temperature value of the preset temperature measurement point in the equipment manual according to the standard pressure, the actual temperature and the preset model setting condition may further include the following steps: Figure 6 As shown: Step S301, calculating the standard temperature change value corresponding to adjacent pressures and temperatures in the DMF recovery device according to the actual temperature, the standard pressure and the standard temperature value in the equipment manual; Step S302, calculating a standard density change value corresponding to the standard temperature change value according to the standard temperature, standard pressure, and standard density; Step S303: determining a reference temperature value of a preset temperature measurement point in a device manual according to the standard temperature, the standard density change value and the standard temperature change value.

[0052] Specifically, in some examples, the actual temperature, standard pressure, and standard temperature values ​​in the equipment manual are used to calculate the standard temperature change values ​​corresponding to adjacent pressures and temperatures in the DMF recovery device. This can be done by the following formula:

[0053] in, is a function used to calculate the actual temperature , Standard pressure and standard temperature values To calculate the standard temperature change value .

[0054] For example, the actual temperature , Indicates actual pressure; standard temperature change value .

[0055] The actual temperature Substituting in, we get:

[0056] Taking into account the characteristics of the gas state in the DMF recovery device, this embodiment can introduce a coefficient determined by the characteristics of the DMF recovery device for correction, and the standard temperature change value is The formula can be:

[0057] Specifically, in some examples, the standard temperature, standard pressure, and standard density are used to calculate the standard density change value corresponding to the standard temperature change value. This can be done by the following formula:

[0058] in, is a function that is used to calculate the temperature according to the standard , Standard pressure and standard density To calculate the standard density change value .

[0059] For example,

[0060] Among them, the represents the molar mass, represents the molar gas constant, is a function representing the standard temperature and standard pressure The relationship between the temperature and the temperature after the change. It is used to reflect how the temperature changes to a certain temperature under given standard temperature and standard pressure conditions, such as . It is also a function, representing the standard temperature and standard pressure The relationship between the pressure and the pressure after the change. It is used to reflect how the pressure changes to a certain pressure under given standard temperature and standard pressure conditions, such as .

[0061] Specifically, in some examples, the reference temperature value of the preset temperature measurement point in the equipment manual is determined based on the standard temperature, the standard density change value and the standard temperature change value. This can be done by the following formula:

[0062] in, is a function that is used to calculate the temperature according to the standard , Standard density change value and standard temperature change value To determine the reference temperature value corresponding to the nth pressure value Where n is a positive integer, and this process needs to be repeated for each pressure value to determine the reference temperature values ​​of all preset temperature measurement points.

[0063] For example,

[0064] In the above example, The function can be a linear combination of functions, is a coefficient determined by the characteristics of the DMF recovery device.

[0065] It can be understood that, through the above process, it can be ensured that the DMF recovery device can be effectively temperature controlled under different pressure and temperature conditions, thereby improving the safety and efficiency of operation. Since the method takes into account the influence of density change on temperature, temperature compensation is made more accurate.

[0066] Optionally, in some embodiments, the calculating the standard density change value corresponding to the standard temperature change value according to the standard temperature, standard pressure and standard density may further include the following steps: Determine the maximum and minimum values ​​of the standard density in the equipment manual, and the corresponding maximum and minimum values ​​of the standard temperature; According to the standard temperature, standard pressure, and the maximum and minimum values ​​of the standard density, a standard density change value corresponding to the standard temperature change value under the standard pressure condition is calculated.

[0067] Specifically, in some examples, the maximum value of the standard density can be obtained from the equipment manual. and minimum value , and the corresponding maximum value of the standard temperature and minimum value These values ​​are the limits of density and temperature at standard pressure and standard operating conditions given in the equipment manual.

[0068] Optionally, in some embodiments, calculating the standard density change value corresponding to the standard temperature change value under the standard pressure condition according to the standard temperature, the standard pressure, and the maximum and minimum values ​​of the standard density may include:

[0069] in, It is the standard density change value corresponding to the standard temperature change value under standard pressure conditions; It is a standard temperature value in the equipment manual; is the actual measured temperature value.

[0070] Specifically, the maximum value of the standard density obtained in the equipment manual and minimum value Used to define the possible range of density variation under standard conditions. Preset standard temperature value of the temperature measurement point and actual temperature value Used to define the change in temperature under practical conditions. Here, is the nth standard temperature value. Further, the calculated standard density change value and the nth standard density value , determine the standard density value at the actual temperature, refer to the following formula:

[0071] in, is the standard density value at the actual temperature; is the nth standard density value.

[0072] It should be noted that the calculation process is based on the premise that the density changes linearly with temperature. It is understandable that this is reasonable within a certain range, especially under small temperature changes.

[0073] It can be understood that, in the present embodiment, the standard density variation value calculated is based on the difference between the standard temperature and the actual temperature. This difference reflects the density variation caused by temperature variation under standard pressure. The standard density variation value calculated is applied to the temperature and pressure compensation model to adjust the model output so that it is more accurately reflected in the density variation under the actual temperature and pressure conditions. Through this process, it can be ensured that under different temperature and pressure conditions, the operating parameters of the DMF recovery device can be effectively compensated, thereby improving the safety and efficiency of operation. This method takes into account the influence of density variation on temperature, making temperature compensation more accurate.

[0074] It should be noted that this embodiment may also be an improvement based on the first embodiment and / or the second embodiment.

[0075] It is not difficult to find that in the embodiment of the present application, the standard temperature change value corresponding to the adjacent pressure and temperature in the DMF recovery device is calculated according to the actual temperature, the standard pressure and the standard temperature value in the equipment manual; the standard density change value corresponding to the standard temperature change value is calculated according to the standard temperature, standard pressure and standard density; the reference temperature value of the preset temperature measuring point in the equipment manual is determined according to the standard temperature, the standard density change value and the standard temperature change value; a specific implementation method for determining the reference temperature value of the preset temperature measuring point in the equipment manual is provided, which is conducive to making temperature compensation more accurate.

[0076] The step division of the above methods is only for clear description. When implemented, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this application; adding insignificant modifications to the algorithm or process or introducing insignificant designs without changing the core design of the algorithm and process are all within the scope of protection of this application.

[0077] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital processing, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0078] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 7 An exemplary structural diagram of the electronic device is disclosed. Figure 7 As shown, the electronic device includes: one or more processors 1101, a memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common motherboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0079] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Figure 7 The example of connecting through bus is taken in the following.

[0080] The input device 1103 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator rod, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 1104 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0081] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with a user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0082] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0083] The memory 1102 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 1101 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 1102, so as to implement the program instructions / modules corresponding to the method provided by any one or more embodiments in the embodiments of the present application.

[0084] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely arranged relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0085] It should be noted that the computer-readable medium described in this application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0086] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0087] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0088] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware or any combination thereof. For example, an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device may be used to implement the embodiments. In some embodiments, the software program of the present application may be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including related data structures) may be stored in a computer-readable recording medium, such as a RAM memory, a magnetic or optical drive or a floppy disk and the like. In addition, some steps or functions of the present application may be implemented by hardware, for example, as a circuit that cooperates with a processor to perform various steps or functions.

[0089] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, which, when executed by the processor, generate in whole or in part the process or function described in the embodiment of the present application. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from a website site, a computer, a server, or a data center to another website site, a computer, a server, or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrated. The available medium may be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid state disk (SSD)), etc.

[0090] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0091] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0092] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A temperature control method based on a DMF recovery device, characterized in that, The method comprises: Obtain the actual pressure and actual temperature of the preset temperature measuring point in the DMF recovery device; Determine the temperature after pressure compensation according to the actual pressure, the actual temperature and a preset temperature-pressure compensation model; wherein the temperature-pressure compensation model is used to determine the influence value of the pressure change on the temperature according to the actual pressure, the reference pressure and the pressure compensation coefficient, and determine the temperature after pressure compensation according to the influence value and the actual temperature; The temperature in the control tower is maintained at a set value according to the temperature after pressure compensation.

2. The method according to claim 1, characterized in that The method of obtaining the actual pressure and actual temperature of a preset temperature measuring point in the DMF recovery device comprises: Determine the operating parameters of the tower in the DMF recovery device and the preset model input mode; Determine the actual pressure and actual temperature of the preset temperature measurement point according to the operating parameters, the preset model input mode and the soft measurement model; The preset model input method includes: predicting the actual temperature and actual pressure of a preset temperature measuring point in the tower according to at least one of the operating parameters of the tower in the DMF recovery device; the operating parameters include any combination of the following: kettle liquid temperature, tower top temperature, tower top pressure, the tower top temperature is the set temperature, and the tower top pressure is the set pressure; The soft measurement model includes at least one of a neural network soft measurement model, a fuzzy reasoning soft measurement model, a least squares support vector machine model, a Kalman filter model, a generalized regression neural network model, an integrated learning model, a support vector regression model, and a partial least squares model.

3. The method according to claim 1, characterized in that The temperature and pressure compensation model specifically determines the temperature after pressure compensation through a first function: ； Among them, the represents the temperature after pressure compensation, the represents the actual temperature, the represents the pressure compensation coefficient, the represents the actual pressure, the represents the reference pressure, Represents the impact value.

4. The method according to claim 3, characterized in that The impact value can be specifically determined by the following formula: ； Among them, the represents the coefficient of thermal expansion, represents a constant term, which is used to characterize other factors affecting temperature.

5. The method according to claim 4, characterized in that The factors used to characterize other factors affecting temperature are specifically density; Correspondingly, the method for constructing the temperature and pressure compensation model includes: According to the preset process parameters of the DMF recovery device, a temperature and pressure compensation model training set is constructed; the preset process parameters include: recovery temperature, tower bottom temperature, tower top and tower bottom pressure, feed amount, bottom liquid amount, and bottom bottom liquid discharge amount; the training set includes several process parameters, each of which includes a reference temperature, a reference pressure, and a reference density; The reference temperature, reference pressure, and reference density in the training set are substituted into the initial temperature and pressure compensation model to train and obtain the temperature and pressure compensation model.

6. The method according to claim 5, characterized in that After substituting the reference temperature, reference pressure, and reference density in the training set into the initial temperature and pressure compensation model to train the temperature and pressure compensation model, the method further includes: According to the preset model setting conditions, the trained temperature and pressure compensation model is corrected until the trained temperature and pressure compensation model meets the preset accuracy test conditions, and the corrected temperature and pressure compensation model is output to obtain the final temperature and pressure compensation model; Wherein, the preset model setting conditions include: The process parameters include reference density, and the process parameters include: standard temperature, standard pressure, and standard density; The preset accuracy test conditions include: the trained temperature and pressure compensation model outputs a compensation temperature at a standard temperature.

7. The method according to claim 6, characterized in that The method further comprises: determining a reference temperature value of a preset temperature measurement point in a device manual according to the standard pressure, the actual temperature and the preset model setting condition; Wherein, determining the reference temperature value of the preset temperature measurement point in the equipment manual according to the standard pressure, the actual temperature and the preset model setting conditions includes: Calculate the standard temperature change value corresponding to adjacent pressures and temperatures in the DMF recovery device according to the actual temperature, the standard pressure and the standard temperature value in the equipment manual; According to the standard temperature, standard pressure and standard density, a standard density change value corresponding to the standard temperature change value is calculated; According to the standard temperature, the standard density change value and the standard temperature change value, a reference temperature value of the preset temperature measurement point in the equipment manual is determined.

8. The method according to claim 7, characterized in that The step of calculating the standard density change value corresponding to the standard temperature change value according to the standard temperature, standard pressure, and standard density includes: Determine the maximum and minimum values ​​of the standard density in the equipment manual, and the corresponding maximum and minimum values ​​of the standard temperature; According to the standard temperature, standard pressure, and the maximum and minimum values ​​of the standard density, a standard density change value corresponding to the standard temperature change value under the standard pressure condition is calculated.

9. The method according to claim 8, characterized in that The step of calculating the standard density change value corresponding to the standard temperature change value under the standard pressure condition according to the standard temperature, the standard pressure, the maximum value and the minimum value of the standard density comprises: ； in, It is the maximum value of standard density in the equipment manual; It is the minimum value of standard density in the equipment manual; is the standard temperature value of the preset temperature measuring point; is the actual temperature value of the preset temperature measurement point.

10. An electronic device, characterized in that: The electronic device comprises: one or more processors; and A memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method as claimed in any one of claims 1 to 9.

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